CN102762029A - Mobile communication equipment, circuit board assembly thereof and connection method of circuit boards - Google Patents
Mobile communication equipment, circuit board assembly thereof and connection method of circuit boards Download PDFInfo
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- CN102762029A CN102762029A CN2012102199862A CN201210219986A CN102762029A CN 102762029 A CN102762029 A CN 102762029A CN 2012102199862 A CN2012102199862 A CN 2012102199862A CN 201210219986 A CN201210219986 A CN 201210219986A CN 102762029 A CN102762029 A CN 102762029A
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- circuit board
- rightness
- electrode
- location hole
- conducting resinl
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Abstract
The embodiment of the invention discloses mobile communication equipment, a circuit board assembly thereof and a connection method of circuit boards. The circuit board assembly comprises a first circuit board, a vertical conductive adhesive and a second circuit board, wherein at least a first electrode is arranged on the edge of the first circuit board; at least a second electrode is arranged on the edge of the second circuit board; the vertical conductive adhesive is conductive in the vertical direction but insulated in the horizontal direction; the upper surface of the vertical conductive adhesive is spliced with the lower surface of the first circuit board; the lower surface of the vertical conductive adhesive is spliced with the upper surface of the second circuit board; and the region, under the first electrodes, of the vertical conductive adhesive and the region, over the second electrodes, of the vertical conductive adhesive are conduction regions so as to electrically connect the first electrodes with the second electrodes. The vertical conductive adhesive can conveniently connect the circuit boards together at low cost and further has practicability.
Description
Technical field
The present invention relates to circuit field, specifically relate to a kind of mobile communication equipment, also relate to the method for attachment of the circuit board combination of this mobile communication equipment circuit board relevant with it.
Background technology
The various products of mode in electron trade that flexible PCB (FPC) and printed circuit board (PCB) (PCB) are used all have number of applications, in practical application, often need both be coupled together through connector or other modes.In the prior art, connected mode commonly used is through BTB connector or ZIF connector flexible PCB and printed circuit board (PCB) to be linked together, perhaps directly with the flexible PCB manual welding to printed circuit board (PCB).
Yet, connect the manufacturing process flow that increases connector body and surface installation technique with regard to needs through the form of various connectors, thereby increased production cost; Mode through manual welding connects then can produce pollution, and can bring the problem of inconvenient maintenance.
Summary of the invention
The technical problem that the present invention mainly solves is: the method for attachment of combination of a kind of mobile communication equipment and circuit board thereof and circuit board is provided, high with the link cost that solves flexible PCB and printed circuit board (PCB), as to keep in repair inconvenience and not environmental protection of welding process problem.
For solving the problems of the technologies described above, the technical scheme that the present invention adopts is: a kind of circuit board combination is provided, comprises: first circuit board, up rightness conducting resinl and second circuit board.The first circuit board edge is provided with at least one first electrode, and the second circuit panel edges is provided with at least one second electrode.The upper surface of up rightness conducting resinl is mutually bonding with the lower surface of first circuit board, and the zone that the up rightness conducting resinl is positioned under first electrode is a conduction region.The upper surface of second circuit board is mutually bonding with the lower surface of up rightness conducting resinl, and the zone that the up rightness conducting resinl is positioned at directly over second electrode is a conduction region, to be electrically connected said first electrode and second electrode.The up rightness conducting resinl insulate in the vertical direction conduction in the horizontal direction.
Wherein, first electrode is the first leakage copper district, and second electrode is the second leakage copper district, and the number that the first leakage Tong Qu and two leaks the copper districts all is no more than ten.
Wherein, first circuit board is provided with first location hole, and second circuit board is provided with second location hole, and the up rightness conducting resinl is provided with the 3rd location hole.First location hole, second location hole and the 3rd location hole are corresponding up and down, position through first location hole, second location hole and the 3rd location hole between first circuit board, second circuit board and the up rightness conducting resinl.
Wherein, The quantity of first location hole, second location hole and the 3rd location hole is two: two first location holes lay respectively at the two ends of first electrode of first circuit board; Two second location holes lay respectively at the two ends of second electrode of second circuit board, and two the 3rd location holes lay respectively at up rightness conducting resinl two ends.
For solving the problems of the technologies described above, another technical scheme that the present invention adopts is: a kind of mobile communication equipment is provided, and this mobile communication equipment is equipped with above-described circuit board combination.
Wherein, mobile communication equipment is a mobile phone.
For solving the problems of the technologies described above, another technical scheme that the present invention adopts is: the method for attachment between a kind of circuit board is provided.Be specifically: first circuit board, second circuit board and up rightness conducting resinl are provided; The first circuit board edge is provided with at least one first electrode, and the second circuit panel edges is provided with at least one second electrode, and the up rightness conducting resinl insulate in the vertical direction conduction in the horizontal direction; Make the upper surface of up rightness conducting resinl mutually bonding with the lower surface of first circuit board, the upper surface of second circuit board is mutually bonding with the lower surface of up rightness conducting resinl; The zone that the up rightness conducting resinl is positioned under first electrode is a conduction region, and the zone that the up rightness conducting resinl is positioned at directly over second electrode is a conduction region, to be electrically connected said first electrode and second electrode.
Wherein, the up rightness conducting resinl is in vertical direction conduction and non-conductive in the horizontal direction, and the number that the copper district is leaked in the first leakage copper district, second all is no more than ten.
Wherein, first circuit board is provided with first location hole, and second circuit board is provided with second location hole, and the up rightness conducting resinl is provided with two the 3rd location holes.Make first location hole, second location hole and the 3rd location hole corresponding up and down, between first location hole, second location hole and the 3rd location hole, insert reference column with fixedly first circuit board, second circuit board and up rightness conducting resinl.
The embodiment of the invention is through the up rightness conducting resinl; Can make things convenient for and cheaply circuit board linked together,, reduced production cost effectively to form a circuit board combination; And avoided adopting problems such as contaminated environment that mode caused such as welding or inconvenient maintenance, have more practicality.
Description of drawings
Fig. 1 is the fit system sketch map of one embodiment of the invention circuit board combination;
Fig. 2 is the vertical view of circuit board combination shown in Figure 1;
Fig. 3 is the cutaway view of circuit board combination shown in Figure 1; And.
Fig. 4 is the schematic flow sheet of the method for attachment between one embodiment of the invention circuit board.
Embodiment
Below in conjunction with accompanying drawing and embodiment, the present invention is made further detailed description.What particularly point out is that following examples only are used to explain the present invention, but scope of the present invention are not limited.
See also Fig. 1 to Fig. 3, first embodiment of the invention comprises first circuit board 10, up rightness conducting resinl 20, second circuit board 30 and reference column 40.Wherein, first circuit board 10 is provided with one to ten first electrode (figure does not show), and second circuit board 30 is provided with one to ten second electrode (figure does not show), and first electrode is corresponding up and down one by one with the position of second electrode.Specifically; One first electrode is arranged on the first circuit board 10; Corresponding with it second electrode is just arranged on second circuit board 30; Both are overlapping in vertical direction, so that the signal of telecommunication in first electrode (or second electrode) can pass to second electrode (or first electrode) through up rightness conducting resinl 20.
It should be noted that first electrode can be positioned at any position of first circuit board 10, second electrode can be positioned at any position of second circuit board 30.Furthermore; The quantity of first electrode and second electrode need not equate yet; But as long as guarantee to have at least one group to be corresponding and operate as normal, for example on first circuit board 10, be provided with 5 first electrode a, b, c, d and e, on second circuit board 30, be provided with 3 second electrode x, y and z; Wherein a is corresponding with x; Do not have corresponding relation between other electrode, in this case, first circuit board 10 and second circuit board 30 can be realized the mutual transmission of the signal of telecommunication through the first electrode a and the second electrode x.Certainly, under the situation of conditions permit, the number of first electrode or second electrode also can be set to more than ten, only otherwise influence signal of telecommunication transmission or do not produce signal interference etc. and get final product, in the scope of present technique field personnel understanding, does not limit.
In the present embodiment, first circuit board 10 and second circuit board 30, being electrically connected through up rightness conducting resinl 20 between first electrode and second electrode realized in other words.Up rightness conducting resinl 20 is between first circuit board 10 and second circuit board 30; That is to say; The upper surface of up rightness conducting resinl 20 is mutually bonding with the lower surface of first circuit board 10, and the lower surface of up rightness conducting resinl 20 is mutually bonding with the upper surface of second circuit board 30.And up rightness conducting resinl 20 has the character that insulate in the horizontal direction in the vertical direction conduction; Therefore; Up rightness conducting resinl 20 is conducting first circuit board 10 and second circuit board 30 in vertical direction; And can not produce the interference between the unlike signal, the situation of phase mutual interference can not appear in the signal transmission between the promptly different electrodes.
Because 20 of up rightness conducting resinls conduct electricity in vertical direction; Set the plane that a straight line vertically runs through up rightness conducting resinl 20 place, its respectively with up rightness conducting resinl 20 two away from face intersect at 2 points, these 2 are " conduction region "; Certainly; Its position can change arbitrarily according to the position of this straight line with size, does not limit at this, at this moment; As long as first electrode and second electrode lay respectively on these two conduction regions of up rightness conducting resinl 20, just can be through up rightness conducting resinl 20 conducting in vertical direction to transmit the signal of telecommunication etc.
In the present embodiment, first circuit board 10 is a flexible PCB, and second circuit board 30 is the hard circuit board, and first electrode is to be formed at first on the first circuit board 10 to leak the copper district, and second electrode is to be formed at second on the second circuit board 20 to leak the copper district.In other embodiments, also can carry out different settings, not limit here according to concrete needs.
In order better to fix, all to be provided with location hole (figure does not show) at the two ends of first circuit board 10, up rightness conducting resinl 20 and second circuit board 30, and to fix through the position of reference column 40 with the three.Reference column 40 is readily appreciated that the location hole of first circuit board 10, up rightness conducting resinl 20 and second circuit board 30 also is corresponding, so that can pass first circuit board 10, up rightness conducting resinl 20 and second circuit board 30 simultaneously.In general, take the mode of interference fit to be connected between reference column 40 and the location hole, but also can take other connected modes, do not limit here.
In order to obtain better locating effect and not influence the transmission of the zone line signal of telecommunication, the location hole of first circuit board 10, up rightness conducting resinl 20 and second circuit board 30 is two, and is separately positioned on the two ends of panel.Certainly, under the situation that does not influence locating effect and electrical signal transfer, the position of location hole can be provided with flexibly, does not limit here.
Quantity that it should be noted that reference column 40 is not limited to two, uses two reference columns 40 in the present embodiment; This be because: generally speaking; 2 reference columns 40 can prevent relatively rotating between each panel, if select 3 or more reference columns, obviously can position better.That is to say that 2 reference columns 40 are the preferred plan that solves orientation problem, but are not unique schemes.Therefore, present embodiment does not limit the quantity of reference column 40.
Understandablely be, the shape of reference column 40 does not constitute qualification of the present invention yet, as long as can implement positioning function, can adopt cylindrical, cuboid or pyramid etc.In addition, reference column 40 can insert after digging out location hole as present embodiment, to realize positioning action; Also reference column 40 can be made into the self structure of first circuit board 10, up rightness conducting resinl 20 or second circuit board 30.For example on first circuit board 10 and second circuit board 30, location hole 40 is set; And reference column 40 is set on up rightness conducting resinl 20, promptly make lug boss (in the present embodiment for cylindrical) respectively and match with location hole on first circuit board 10 and the second circuit board 30 at the upper and lower surfaces of up rightness conducting resinl 20.Here characteristics such as the structure of reference column 40, position, material are not done any qualification.
Mandatory declaration be that reference column 40 is not the necessary condition of circuit board combination of the present invention with location hole.Because up rightness conducting resinl 20 has certain viscosity; Therefore can link together first circuit board 10 and second circuit board 30 with the mode of pasting through up rightness conducting resinl 20; Also can connect and fix in addition, not limit here through other modes such as screws.
The embodiment of the invention is through up rightness conducting resinl 20 and be arranged on the location hole on the circuit board; Can make things convenient for and cheaply circuit board linked together; To form a circuit board combination; Reduced production cost effectively, and problems such as contaminated environment of having avoided adopting welding manner to connect and being caused or inconvenient maintenance, have more practicality.
The second embodiment of the present invention provides a kind of mobile communication equipment, and this mobile communication equipment is equipped with the circuit board combination element among first embodiment, and this mobile communication equipment can be a mobile phone etc.Because detailed explanation has been carried out in the circuit board combination in the first embodiment of the present invention, do not give unnecessary details at this.
The third embodiment of the present invention provides the method for attachment between a kind of circuit board, and concrete steps are following:
Step S400; First circuit board, second circuit board and up rightness conducting resinl are provided; The first circuit board edge is provided with at least one first electrode, and the second circuit panel edges is provided with at least one second electrode, and the up rightness conducting resinl insulate in the vertical direction conduction in the horizontal direction.
Step S401; Make the upper surface of up rightness conducting resinl mutually bonding with the lower surface of first circuit board; The upper surface of second circuit board is mutually bonding with the lower surface of up rightness conducting resinl; Wherein to be positioned at the zone under first electrode be conduction region to the up rightness conducting resinl, and the zone that the up rightness conducting resinl is positioned at directly over second electrode is a conduction region, to be electrically connected first electrode and second electrode.
Particularly, the up rightness conducting resinl is in vertical direction conduction and non-conductive in the horizontal direction, and the number that the copper district is leaked in the first leakage copper district, said second all is no more than ten.
Furthermore; Be provided with first location hole at first circuit board; And be provided with second location hole at second circuit board; The up rightness conducting resinl is provided with two the 3rd location holes, makes first location hole, second location hole and the 3rd location hole corresponding up and down, between first location hole, second location hole and the 3rd location hole, inserts reference column with fixedly first circuit board, second circuit board and up rightness conducting resinl.Through the mode of location hole and reference column, the embodiment of the invention has guaranteed the connection effect between the circuit board.
Method of attachment between the present embodiment circuit board also sees also the associated description of front embodiment about the circuit board combination, in the scope that present technique field personnel combine to understand easily, does not give unnecessary details.
The embodiment of the invention can make things convenient for and cheaply circuit board linked together through the up rightness conducting resinl, has reduced production cost effectively, and problems such as contaminated environment of having avoided adopting welding manner to connect and being caused or inconvenient maintenance, has more practicality.
The above is merely embodiments of the invention; Be not so limit claim of the present invention; Every equivalent structure or equivalent flow process conversion that utilizes specification of the present invention and accompanying drawing content to be done; Or directly or indirectly be used in other relevant technical fields, all in like manner be included in the scope of patent protection of the present invention.
Claims (10)
1. a circuit board combination is characterized in that, comprising:
First circuit board, up rightness conducting resinl and second circuit board;
Said first circuit board edge is provided with at least one first electrode, and said second circuit panel edges is provided with at least one second electrode;
The upper surface of said up rightness conducting resinl is mutually bonding with the lower surface of first circuit board, and the zone that said up rightness conducting resinl is positioned under first electrode is a conduction region;
The upper surface of said second circuit board is mutually bonding with the lower surface of up rightness conducting resinl, and the zone that said up rightness conducting resinl is positioned at directly over second electrode is a conduction region, to be electrically connected said first electrode and second electrode;
Said up rightness conducting resinl insulate in the vertical direction conduction in the horizontal direction.
2. circuit board combination according to claim 1 is characterized in that, said first electrode is the first leakage copper district, and said second electrode is the second leakage copper district, and the number that the said first leakage Tong Qu and two leaks the copper districts all is no more than ten.
3. circuit board combination according to claim 1; It is characterized in that; Said first circuit board is provided with first location hole, and said second circuit board is provided with second location hole, and said up rightness conducting resinl is provided with the 3rd location hole; Said first location hole, second location hole and the 3rd location hole are corresponding up and down, position through first location hole, second location hole and the 3rd location hole between said first circuit board, second circuit board and the up rightness conducting resinl.
4. circuit board combination according to claim 3; It is characterized in that; The quantity of said first location hole, second location hole and the 3rd location hole is two; Two said first location holes lay respectively at the two ends of first electrode of first circuit board, and two said second location holes lay respectively at the two ends of second electrode of second circuit board, and two said the 3rd location holes lay respectively at up rightness conducting resinl two ends.
5. circuit board combination according to claim 1 is characterized in that said first circuit board is a flexible PCB, and said second circuit board is the hard circuit board.
6. a mobile communication equipment is characterized in that, said mobile communication equipment comprises each described circuit board combination according to claim 1-5.
7. mobile communication equipment according to claim 6 is characterized in that, said mobile communication equipment is a mobile phone.
8. the method for attachment between the circuit board is characterized in that, comprises
First circuit board, second circuit board and up rightness conducting resinl are provided; Said first circuit board edge is provided with at least one first electrode; Said second circuit panel edges is provided with at least one second electrode, and said up rightness conducting resinl insulate in the vertical direction conduction in the horizontal direction;
Make the upper surface of said up rightness conducting resinl mutually bonding with the lower surface of first circuit board; The upper surface of said second circuit board is mutually bonding with the lower surface of up rightness conducting resinl; The zone that wherein said up rightness conducting resinl is positioned under first electrode is a conduction region; The zone that said up rightness conducting resinl is positioned at directly over second electrode is a conduction region, to be electrically connected said first electrode and second electrode.
9. method of attachment according to claim 8 is characterized in that, said up rightness conducting resinl is in vertical direction conduction and non-conductive in the horizontal direction, and the number that the copper district is leaked in the said first leakage copper district, said second all is no more than ten.
10. method of attachment according to claim 8; It is characterized in that; Said first circuit board is provided with first location hole; Said second circuit board is provided with second location hole; Said up rightness conducting resinl is provided with two the 3rd location holes, makes said first location hole, said second location hole and said the 3rd location hole corresponding up and down, between said first location hole, said second location hole and said the 3rd location hole, inserts reference column with fixing said first circuit board, said second circuit board and said up rightness conducting resinl.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210219986.2A CN102762029B (en) | 2012-06-28 | 2012-06-28 | The method of attachment of mobile communication equipment and circuit board composition and circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210219986.2A CN102762029B (en) | 2012-06-28 | 2012-06-28 | The method of attachment of mobile communication equipment and circuit board composition and circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102762029A true CN102762029A (en) | 2012-10-31 |
| CN102762029B CN102762029B (en) | 2016-07-13 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201210219986.2A Active CN102762029B (en) | 2012-06-28 | 2012-06-28 | The method of attachment of mobile communication equipment and circuit board composition and circuit board |
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| CN (1) | CN102762029B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104717325A (en) * | 2013-12-12 | 2015-06-17 | 中兴通讯股份有限公司 | Electronic instrument |
| CN104822226A (en) * | 2015-04-28 | 2015-08-05 | 武汉华星光电技术有限公司 | Circuit board assembly |
| CN106061104A (en) * | 2016-07-28 | 2016-10-26 | 广东欧珀移动通信有限公司 | Circuit board of mobile terminal and mobile terminal with same |
| CN112449488A (en) * | 2019-09-05 | 2021-03-05 | 华为技术有限公司 | Circuit board and electronic equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| KR100483399B1 (en) * | 1997-09-09 | 2005-08-10 | 삼성전자주식회사 | Printed wiring board and its connection method |
| CN101296579A (en) * | 2007-04-27 | 2008-10-29 | 欣兴电子股份有限公司 | Station transplantation device of multi-gang circuit board |
| US20090175019A1 (en) * | 2007-03-20 | 2009-07-09 | Keiji Koyama | Circuit-board module and manufacturing method |
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2012
- 2012-06-28 CN CN201210219986.2A patent/CN102762029B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100483399B1 (en) * | 1997-09-09 | 2005-08-10 | 삼성전자주식회사 | Printed wiring board and its connection method |
| US20090175019A1 (en) * | 2007-03-20 | 2009-07-09 | Keiji Koyama | Circuit-board module and manufacturing method |
| CN101296579A (en) * | 2007-04-27 | 2008-10-29 | 欣兴电子股份有限公司 | Station transplantation device of multi-gang circuit board |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104717325A (en) * | 2013-12-12 | 2015-06-17 | 中兴通讯股份有限公司 | Electronic instrument |
| CN104822226A (en) * | 2015-04-28 | 2015-08-05 | 武汉华星光电技术有限公司 | Circuit board assembly |
| CN104822226B (en) * | 2015-04-28 | 2018-09-14 | 武汉华星光电技术有限公司 | Circuit board assemblies |
| CN106061104A (en) * | 2016-07-28 | 2016-10-26 | 广东欧珀移动通信有限公司 | Circuit board of mobile terminal and mobile terminal with same |
| CN106061104B (en) * | 2016-07-28 | 2018-12-04 | 广东欧珀移动通信有限公司 | The circuit board of mobile terminal and mobile terminal with it |
| CN112449488A (en) * | 2019-09-05 | 2021-03-05 | 华为技术有限公司 | Circuit board and electronic equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102762029B (en) | 2016-07-13 |
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