CN202873182U - Dual-layer circuit board - Google Patents
Dual-layer circuit board Download PDFInfo
- Publication number
- CN202873182U CN202873182U CN201220540134.9U CN201220540134U CN202873182U CN 202873182 U CN202873182 U CN 202873182U CN 201220540134 U CN201220540134 U CN 201220540134U CN 202873182 U CN202873182 U CN 202873182U
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- Prior art keywords
- circuit board
- face
- double
- utility
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structure Of Printed Boards (AREA)
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Abstract
A dual-layer circuit board is formed by stacking a first circuit board and a second circuit board both with a same shape, a top end face of the first circuit board contacts with a bottom end face of the second circuit board, the top end face of the first circuit board is provided with a wiring groove, a top end face and the bottom end face of the second circuit board are provided with corresponding welding discs corresponding to a position of the wiring groove, centers of the welding discs are provided with through holes passing through the second circuit board, and inner walls of the through holes are coated with conductive material connected with the welding discs. Wiring space and mounting space of earth copper sheets are both enlarged, earthing protection effect is reinforced, performance is stabilized, and protection effects of EMI and static shock of a cell phone are improved.
Description
Technical field
The utility model relates to a kind of circuit board, particularly relates to a kind of circuit board for the mobile phone integrated circuit.
Background technology
The main circuit board of slip cover phone is flexible printed circuit, is called for short FPC, and cabling and connector and pad coplanar, connector peripheral space are often inadequate again, and the Design of Hardware Architecture personnel are for this reason space negotiation communication repeatedly, affects project process.In addition, can be reasonable in order to make cabling order, wiring installation teacher and schematic diagram engineer also need repeatedly to confirm to link up, and revise schematic diagram, have both wasted the time, energy, have also increased the probability of makeing mistakes.
The utility model content
The purpose of this utility model is a kind of double-layered circuit board, solves the cabling space anxiety of connector neighboring area and the technical problem of line order complexity.
Double-layered circuit board of the present utility model, wherein: be formed by stacking by two block-shaped identical first circuit boards and second circuit board, the upper surface of first circuit board contacts with the lower surface of second circuit board, the upper surface of first circuit board offers one and walks line groove, on the second circuit board, correspondence is walked the position of line groove, and upper and lower end face is provided with corresponding pad, the center of pad offers the through hole that runs through second circuit board, is coated with the electric conducting material that is connected with pad on the inwall of through hole.
The upper surface of described first circuit board offers some line grooves of walking.
Described first circuit board adopts flexible substrate, and second circuit board adopts stiffening plate.
Double-layer circuit board of the present utility model so that the installing space of cabling space and ground copper sheet all becomes greatly, has been strengthened the ground protection effect, is conducive to stability, has also strengthened the EMI of mobile phone, the protection effect of beating static.Can satisfy the process capability requirement of plate factory, simplify production technology, and guarantee the performance of circuit board.
Below in conjunction with accompanying drawing embodiment of the present utility model is described further.
Description of drawings
Fig. 1 is the vertical view of the utility model double-layered circuit board;
Fig. 2 is the A-A view of the utility model double-layered circuit board.
Embodiment
As depicted in figs. 1 and 2, double-layered circuit board of the present utility model is formed by stacking by two block-shaped identical first circuit boards 1 and second circuit board 2, and the upper surface of first circuit board 1 contacts with the lower surface of second circuit board 2.
The upper surface of first circuit board 1 offers away line groove 1a, as sliding area, can carry out the cabling of circuit in the sliding area and arrange laying.
Walk line groove 1a and can be made as rectangle, can offer in the upper surface of first circuit board 1 a plurality of line groove 1a of walking as sliding area.
On the second circuit board 2, the position of corresponding sliding area, upper and lower end face is provided with corresponding pad 2a, and the center of pad 2a offers the through hole 2b that runs through second circuit board 2, is coated with the electric conducting material 2c that is connected with pad 2a on the inwall of through hole 2b.
The upper surface of second circuit board 2 is used for installing various intermateable connectors 3.
Double-layered circuit board first circuit board 1 of the present utility model adopts flexible substrate, and second circuit board 2 adopts stiffening plate.
Double-layered circuit board of the present utility model is conveniently adjusted the order of cabling, and does not affect the performance of any wire, and the connection performance of whole cabling does not change.The utility model thinking that breaks traditions so that the installing space of cabling space and ground copper sheet all becomes greatly, has been strengthened the ground protection effect, is conducive to stability, has also strengthened the EMI of mobile phone, the protection effect of beating static.
Above-described embodiment is described preferred implementation of the present utility model; be not that scope of the present utility model is limited; under the prerequisite that does not break away from the utility model design spirit; various distortion and improvement that those of ordinary skills make the technical solution of the utility model all should fall in the definite protection range of the utility model claims.
Claims (3)
1. double-layered circuit board, it is characterized in that: be formed by stacking by two block-shaped identical first circuit boards (1) and second circuit board (2), the upper surface of first circuit board (1) contacts with the lower surface of second circuit board (2), the upper surface of first circuit board (1) offers one and walks line groove (1a), on the second circuit board (2), correspondence is walked on the position of line groove (1a), the lower surface is provided with corresponding pad (2a), the center of pad (2a) offers the through hole (2b) that runs through second circuit board (2), is coated with the electric conducting material (2c) that is connected with pad (2a) on the inwall of through hole (2b).
2. double-layered circuit board according to claim 1 is characterized in that: the upper surface of described first circuit board (1) offers some line grooves (1a) of walking.
3. double-layered circuit board according to claim 1 and 2 is characterized in that: described first circuit board (1) employing flexible substrate, second circuit board (2) employing stiffening plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201220540134.9U CN202873182U (en) | 2012-10-19 | 2012-10-19 | Dual-layer circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201220540134.9U CN202873182U (en) | 2012-10-19 | 2012-10-19 | Dual-layer circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202873182U true CN202873182U (en) | 2013-04-10 |
Family
ID=48039859
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201220540134.9U Expired - Fee Related CN202873182U (en) | 2012-10-19 | 2012-10-19 | Dual-layer circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202873182U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107320186A (en) * | 2017-07-31 | 2017-11-07 | 成都中科博恩思医学机器人有限公司 | The mobile handrail of operating robot surgeon console |
| CN107320190A (en) * | 2017-07-31 | 2017-11-07 | 成都中科博恩思医学机器人有限公司 | The surgeon console of operating robot |
-
2012
- 2012-10-19 CN CN201220540134.9U patent/CN202873182U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107320186A (en) * | 2017-07-31 | 2017-11-07 | 成都中科博恩思医学机器人有限公司 | The mobile handrail of operating robot surgeon console |
| CN107320190A (en) * | 2017-07-31 | 2017-11-07 | 成都中科博恩思医学机器人有限公司 | The surgeon console of operating robot |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Beijing Tianyu Langtong Communication Equipment Co.,Ltd. Assignor: BEIJING BENY WAVE SCIENCE AND TECHNOLOGY Co.,Ltd. Contract record no.: 2014110000045 Denomination of utility model: Double-layer circuit board based on micro-nano imprinting and addition process technology and manufacturing method for double-layer circuit board Granted publication date: 20130410 License type: Exclusive License Record date: 20140811 |
|
| LICC | Enforcement, change and cancellation of record of contracts on the licence for exploitation of a patent or utility model | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130410 Termination date: 20211019 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |