CN101018450B - Base board welding structure - Google Patents
Base board welding structure Download PDFInfo
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- CN101018450B CN101018450B CN2007100852321A CN200710085232A CN101018450B CN 101018450 B CN101018450 B CN 101018450B CN 2007100852321 A CN2007100852321 A CN 2007100852321A CN 200710085232 A CN200710085232 A CN 200710085232A CN 101018450 B CN101018450 B CN 101018450B
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- electrical connection
- connection pad
- welding
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- distributing board
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Abstract
The related substrate welding structure comprises: a first layout plate including a first electric connection pad with two sides and a welding groove formed on the first pad and connected two sides, at least one second layout plate including a second electric pad overlapped partially with the first one. This invention increases welding strength, and simplifies procedure.
Description
Technical field
The present invention relates to a kind of printed circuit board (PCB) Welding Structure, and relate in particular to a kind of flexible printed wiring board and be fit to the base board welding structure that various printed circuit board (PCB)s are welded.
Background technology
In recent years, (Flexible Printed Circuit FPC) is widely used in the consumption electronic products field, for example: mobile phone, personal digital assistant, digital camera, notebook computer and flat-panel monitor etc. flexible printed wiring board.
Because flexible printed wiring board has frivolous and characteristic such as deflection, makes product be able to design more and more compactly.Mainly by gathering inferior acyl ammonia film (PI, a kind of base material of wiring board), the coating adhesive agent forms with the pressing of naked copper substrate general flexible printed wiring board again.Yet, impaired for fear of the naked copper substrate surface, on the naked copper substrate surface, can cover welding resisting layer again, be used to protect and the naked copper substrate that insulate on circuit.
As shown in Figure 1, it is the front view that known two flexible printed wiring boards are fitted.First printed circuit board (PCB) 10 digs on the surface of naked copper substrate 12,24 and is provided with welding resisting layer 18 to form at least one welding region 12, supplies the welding region 24 corresponding settings of second printed circuit board (PCB) 20.These welding regions 12,24 are the naked copper substrate, on the naked copper substrate, are provided with to have the conducting film (not shown) of one patterned.Again please be simultaneously with reference to shown in Figure 2; Dig in the welding region 12 of known welding manner with first printed circuit board (PCB) 10 and establish circular hole 14; And being through to the surface of second printed circuit board (PCB), 20 welding regions 24, the scolder 30 that imposes fusion connects, and treats that it solidifies the back and is connected to each other.Wherein first and second printed circuit board (PCB) 10,20 is respectively by welding resisting layer 18,22; Naked copper substrate 12,24 and basement membrane 16,26 constitute.
Knownly weld to dig the mode of establishing circular hole 14; First printed circuit board (PCB) 10 is connected with second printed circuit board (PCB) 20 fixing, yet, owing to dig the mode of establishing circular hole 14; Its opening is less; So the space that can supply scolder 30 to get into is also comparatively narrow and small, add factors such as scolder 30 self surface tension, make scolder 30 be difficult for flowing into fully in first printed circuit board (PCB) 10 and second printed circuit board (PCB), 20 spaces.Therefore, cause welding complete and form emptying aperture 32 easily, and then influence opening circuit or the situation generation of naked copper fracture of circuit.
Summary of the invention
Main purpose of the present invention is to provide a kind of base board welding structure, can increase the weld strength of product.
Another object of the present invention is to provide a kind of base board welding structure, have the assembly program of simplifying.
Another object of the present invention is to provide a kind of base board welding structure, have the advantages that to be easy to weld.
Another object of the present invention is to provide a kind of base board welding structure, import production procedure more easily.
A kind of base board welding structure of the present invention comprises one first distributing board.This distributing board comprises an electrical connection pad and a coating, and this coating is arranged on this electrical connection pad surface; One welding groove; Connect this coating and this electrical connection pad; And this welding groove area that runs through this coating forms greater than the area of this welding groove that runs through this electrical connection pad that the welding region of this electrical connection pad has relative dual-side behind this welding groove, and this welding groove connects the relative dual-side of this welding region
In preferred embodiment, this first distributing board also comprises coating and basic unit, and coating covers the surface of electrical connection pad, and basic unit is shaped and is connected in the below of electrical connection pad.In addition, preferable formation rectangle behind two sides of each welding groove connection.That is to say preferable electrical connection pad and the basic unit of running through of this rectangle.
The present invention also provides one second distributing board, is used for welding with first distributing board.Yet second distributing board also has second electrical connection pad.The part position folded of the position of second electrical connection pad and first electrical connection pad, and corresponding setting with welding groove.Therefore, when the low-melting-point metal tunicle with fusion imposed in the space of first electrical connection pad and second electrical connection pad, first distributing board and second distributing board were treated can be connected to each other after the metal tunicle solidifies.
Description of drawings
Fig. 1 is the front view that flexible printed wiring board is fitted in the known technology;
Fig. 2 is known flexible printed wiring board Welding Structure profile;
Fig. 3 is the part front view of the present invention's first preferred embodiment;
Fig. 4 is the cutaway view of Fig. 3 along the A-A direction;
Fig. 5 fits for the part of the present invention's second preferred embodiment and schemes;
Fig. 6 is the decomposing schematic representation of Fig. 5:
Fig. 7 is the profile of Fig. 5 along the B-B direction;
Fig. 8 is another preferred embodiment figure of Fig. 5;
Fig. 9 is the part assembling sketch map of the present invention's the 3rd preferred embodiment;
Figure 10 is the decomposing schematic representation of Fig. 9; And
Figure 11 is the user mode sketch map of base board welding structure of the present invention.
Wherein, description of reference numerals is following:
100 show panel 200 first distributing boards 202 first electrical connection pads
204 first welding grooves, 206 sides, 208 first coating
210 first basic units, 220 insulation divisions, 230 welding regions
300 second distributing boards, 304 second coating, 306 second electrical connection pads
310 second basic units, 400 metal tunicles
Embodiment
The base board welding structure that the present invention is welded for a kind of flexible printed wiring board and suitable various printed circuit board (PCB)s.This base board welding structure comprises first distributing board and second distributing board.This first distributing board and this second distributing board comprise at least one electrical connection pad and at least one welding groove respectively.Each said first electrical connection pad is arranged on this first distributing board, and each said first electrical connection pad has dual-side.With regard to preferred embodiment as shown in Figure 8, first distributing board be preferably the single sided board flexible printed wiring board (FlexiblePrinted Circuit, FPC); The preferable flexible printed wiring boards such as single sided board, double sided board or multi-layer sheet that then comprise of second distributing board, even rigid printed circuit board (Printed Circuit Board, PCB).Here said this first distributing board and the applied product of this second distributing board comprise: electronic products such as mobile phone, personal digital assistant, digital camera, notebook computer and flat-panel monitor.Below be conjunction with figs., further specify each specific embodiment of the present invention and step.
Fig. 3 and shown in Figure 4 faces and cutaway view for the part of the present invention's first preferred embodiment.In this embodiment, base board welding structure is connected with other circuit board (not shown) for using first distributing board 200 with single first electrical connection pad 202.First distributing board 200 comprises first coating 208, first electrical connection pad 202, first basic unit 210 and first welding groove 204.Wherein first electrical connection pad 202 has dual-side 206.First welding groove 204 is through first coating 208, first electrical connection pad 202 and first basic unit 210, and is communicated with the dual-side 206 of first electrical connection pad 202.In other words, first welding groove 204 all blocks each said side 206 to be discontinuous two parts.In embodiment as shown in Figure 4, first coating 208 and first basic unit 210 lay respectively at the upper and lower surface of first electrical connection pad 202, in order to protect the effect of first electrical connection pad 202 and tool insulation.Further, dig up the welding region 230 that first coating 208 promptly forms first electrical connection pad 202; First welding groove 204 promptly from then on welding region 230 run through respectively again and extend to first electrical connection pad 202 and first basement membrane 210.It is preferable greater than running through first electrical connection pad 202 and first basic unit, 210 formed surface areas wherein to be communicated with the surface area that first welding groove 204 of first coating 208 forms.In addition, first welding groove, 204 shapes are preferably rectangle.Yet in other various embodiment, first welding groove 204 also can be ellipse, rectangle or other comprises non-circular shape.
Like Fig. 5 and shown in Figure 6, it is the assembling and the exploded view of the present invention's second preferred embodiment.Particularly, the present invention also provides a kind of second distributing board 300, and is used for and 200 seam of first distributing board.In other words, further specify the Welding Structure and the welding relation thereof of first distributing board 200 and second distributing board 300 in the present embodiment.In the present embodiment, second distributing board 300 has second electrical connection pad 306.The part position folded of the position of second electrical connection pad 306 and first electrical connection pad 202.In embodiment as shown in Figure 6, second distributing board 300 is preferable has excavated second coating 304, and forms a larger area second electrical connection pad 306 (shown in hatching) so that with 202 seam of first electrical connection pad.Yet in other various embodiment, also can excavate second coating, 304 surface areas (i.e. the areas of second electrical connection pad, 306 formation) with the corresponding size of first electrical connection pad, 202 surface areas.In other words, the preferable surface area of the surface area of second electrical connection pad 306 greater than first electrical connection pad 202.Yet in various embodiment, the surface area of second electrical connection pad 306 also can be less than or equal to the surface area of first electrical connection pad 202.In like Fig. 5 and embodiment shown in Figure 6,, and each said side 206 is all blocked be discontinuous two parts because first welding groove 204 forms connection dual-side 206 on first electrical connection pad 202.Therefore first welding groove 204 can be communicated to first electrical connection pad 202, first basic unit 210 from first coating 208, up to second coating 304 of second distributing board 300.
In like Fig. 5, Fig. 6 and embodiment shown in Figure 7, first welding groove, 204 shapes are preferably rectangle.In the application of reality, said here rectangle can be formed by connecting approximate rectangular with circular hole for four jiaos.Yet in other various embodiment, first welding groove 204 also can be ellipse, rectangle or other comprises non-circular shape.In the present embodiment, first welding groove 204 forms one I-shaped in cutaway view as shown in Figure 7.In other words, the preferable surface area with second electrical connection pad 306 of surface area of first electrical connection pad, 202 formation is similar.Yet in vertical view as shown in Figure 5, because the preferable rectangle that is of sectional area of first welding groove 204, meaning is that the sectional area of first electrical connection pad 202 and first basic unit 210 is a rectangle.Therefore when fitting and welding first distributing board 200 and second distributing board 300, the metal tunicle flowed in this first rectangular welding groove 204 in 4,000 minutes easily, and increased weld strength simultaneously.In other words, when metal tunicle 400 flowed into first welding groove 204 of rectangular area, metal tunicle 400 at first was filled in first coating 208, flowed into first electrical connection pad 202, first basic unit 210, until filling up second coating 304.The electric connection each other even treat metal tunicle 400 to solidify back first distributing boards 200 and 300 seam of second distributing board.Here said metal tunicle 400 comprises low-melting scolding tin, terne metal or other soldering material.What need to specify is, said here second distributing board 300 is preferable to be the single sided board flexible printed wiring board with first distributing board 200, as shown in Figure 7.Yet in embodiment as shown in Figure 8, second distributing board 300 can be the flexible circuit board of double sided board, multi-layer sheet or other structure, is printed circuit board (PCB) perhaps also.
Fig. 9 and shown in Figure 10 for the assembling and the exploded view of the present invention's the 3rd preferred embodiment.The present invention also provides first distributing board 200 with a plurality of first electrical connection pads 202 second distributing board, 300 Welding Structures with a plurality of second electrical connection pads 306.In the embodiment shown in fig. 9, first distributing board 200 has first electrical connection pad 202 of paired setting.Each said first electrical connection pad 202 has dual-side 206.Each first welding groove 204 is arranged on each said first electrical connection pad 202, and connects dual-side 206, to form welding region 230 respectively.In embodiment shown in figure 10, has insulation division 220 in the middle of per two first welding grooves 204 at interval.In other words, 204 of per two first welding grooves do not excise, and make in welding process first distributing board 200 can warpage and be easy to welding.Wherein the area size of insulation division 220 is preferably the gap size of two second electrical connection pads 306 of second distributing board 300.Yet in other various embodiment, the area size of insulation division 220 also can be greater than the gap size of two second electrical connection pads 306.In addition, second distributing board 300 is preferable also has second electrical connection pad 306.The part position folded of the position of second electrical connection pad 306 and first electrical connection pad 202, and with the corresponding setting in the position of first welding groove 204.Other structure sees also as stated, repeats no more here.
Therefore, when first distributing board 200 and second distributing board 300 are fitted and are welded, second electrical connection pad 306 of welding region 230 corresponding second distributing boards 300 of each said first electrical connection pad 202.Also respectively corresponding each said second electrical connection pad 306 of the first rectangular welding groove 204 is in order to welding.Metal tunicle 400 can successfully flow into and be filled between first electrical connection pad 202 and second electrical connection pad 306 in the first rectangular welding groove 204, please be simultaneously with reference to figure 8 and shown in Figure 9.Therefore, first welding groove, 204 areas can solve metal tunicle 400 more greatly easily because of surface tension of liquid is difficult for flowing into, and then cause electrical connection pad to expose and problems such as generation line broken circuit.
Generally speaking; The first/the second coating 208,304 of first distributing board 200 and second distributing board 300 and the insulation material of the first/the second basic unit 210,310 comprise rubber composition, plastic hybrid or special saturated polyester resin, and are formed by stacking through the conductive layer hot pressing of machine with the first/the second electrical connection pad 202,306.With preferred embodiment, the first/the second electrical connection pad, 202,306 materials are preferably tin-coated copper material, copper alloy or other relevant conductive material.
What this need stress be, first distributing board 200 and second distributing board 300 can be the single sided board flexible printed wiring board, and its profile is as shown in Figure 7.Yet in various embodiment, second distributing board 300 can be the flexible circuit board (as shown in Figure 8) of double sided board, multi-layer sheet or other structure, or general printed circuit board (PCB).
Shown in figure 11, it welds the user mode sketch map of two parts for the present invention.In preferred embodiment shown in figure 11, it is first distributing board 200 and the welded condition sketch map that is applied in second distributing board 300 of light-emitting diode of display unit 100.Yet in other various embodiment, first distributing board 200 of two parts and second distributing board 300 also can be respectively electronic goods such as mobile phone, personal digital assistant, digital camera, notebook computer and flat-panel monitor.In addition, in preferable welding process, after can first distributing board 200 and second distributing board 300 being pasted with the adhesive tape (not shown) usually, weld again.In other words, be about to second electrical connection pad, the 306 mutual corresponding settings of first welding groove 204 with second distributing board 300 of first electrical connection pad 202, be beneficial to welding.
The present invention is described by above-mentioned related embodiment, yet the foregoing description is merely the example of embodiment of the present invention.Must be pointed out that the embodiment that has disclosed does not limit protection scope of the present invention.On the contrary, all modifications of under being contained in the spirit of scope of patent protection, being accomplished and equivalence are provided with all and are contained in protection scope of the present invention.
Claims (25)
1. base board welding structure, it comprises:
One distributing board, this distributing board comprise an electrical connection pad and a coating, and this coating is arranged on this electrical connection pad surface;
One welding groove connects this coating and this electrical connection pad, and runs through the area of this welding groove area of this coating greater than this welding groove that runs through this electrical connection pad;
Form that the welding region of this electrical connection pad has relative dual-side behind this welding groove, this welding groove connects the relative dual-side of this welding region.
2. base board welding structure as claimed in claim 1, wherein, this distributing board comprises a flexible printed wiring board.
3. base board welding structure as claimed in claim 1, wherein, this distributing board comprises a basic unit, and this electrical connection pad is arranged in this basic unit.
4. base board welding structure as claimed in claim 1, wherein, being shaped as of this welding groove is approximate rectangular.
5. base board welding structure, it comprises:
One first distributing board comprises:
One first electrical connection pad and one first coating, this first coating is arranged on the surface of this first electrical connection pad;
One first welding groove runs through this first coating and this first electrical connection pad, and runs through the area of this first welding groove area of this first coating greater than this first welding groove that runs through this first electrical connection pad;
Form that the welding region of this first electrical connection pad has relative dual-side behind this first welding groove, this first welding groove connects the relative dual-side of this welding region; And
One second distributing board, itself and this first distributing board welds, and this second distributing board comprises:
One second electrical connection pad, the position of this second electrical connection pad and this first electrical connection pad part at least are superimposed and to should first welding groove;
Wherein, this first electrical connection pad surface electrical is communicated in this second electrical connection pad, and this first distributing board and this second distributing board are connected to each other.
6. base board welding structure as claimed in claim 5, wherein, this first distributing board comprises a flexible printed wiring board.
7. base board welding structure as claimed in claim 5; Wherein, This base board welding structure also comprises a metal tunicle, and it is arranged between this first electrical connection pad surface and this second electrical connection pad surface, and this metal tunicle also is filled to, and this first welding groove is interior to be reached between second electrical connection pad.
8. base board welding structure as claimed in claim 7, wherein, this metal tunicle also comprises low-melting welding material.
9. base board welding structure as claimed in claim 5, wherein, this first distributing board comprises one first basic unit, and this first electrical connection pad is arranged in this first basic unit.
10. base board welding structure as claimed in claim 9, wherein, this first welding groove also runs through this first basic unit.
11. base board welding structure as claimed in claim 5, wherein, this second distributing board comprises at least one second basic unit, and this second electrical connection pad is arranged in said second basic unit.
12. base board welding structure as claimed in claim 5, wherein, this second distributing board also comprises one second welding groove, and with the superimposed setting of this first welding groove.
13. base board welding structure as claimed in claim 5, wherein, this second distributing board also comprises at least one second coating, and said second coating is arranged on this second electrical connection pad surface.
14. base board welding structure as claimed in claim 5, wherein, this second distributing board also comprises a printed circuit board (PCB).
15. base board welding structure as claimed in claim 5, wherein, this second distributing board also comprises a flexible printed wiring board.
16. base board welding structure as claimed in claim 5, wherein, being shaped as of this first welding groove is approximate rectangular.
17. a base board welding structure, it comprises:
One first distributing board comprises:
A plurality of first electrical connection pads and a plurality of first coating, each said first coating are arranged on the said first electrical connection pad surface;
A plurality of welding grooves run through said first coating and said first electrical connection pad, and run through the area of this welding groove area of this first coating greater than this welding groove that runs through said first electrical connection pad;
Form that the welding region of said first electrical connection pad has relative dual-side behind this welding groove, this welding groove connects the relative dual-side of this welding region; And one second distributing board, itself and this first distributing board welding, this second distributing board comprises:
Part is superimposed at least with the position of said first electrical connection pad respectively for a plurality of second electrical connection pads, each said second electrical connection pad, and corresponding said welding groove;
Wherein, at each said second electrical connection pad of surface electrical connection of each said first electrical connection pad,
This first distributing board and this second distributing board are connected to each other.
18. base board welding structure as claimed in claim 17, wherein, this first distributing board comprises a flexible printed wiring board.
19. base board welding structure as claimed in claim 17; Wherein, Between said first welding groove through the metal tunicle being filled to this first distributing board and said second electrical connection pad of this second distributing board, make the surface of said first electrical connection pad be communicated with the surface of said second electrical connection pad.
20. base board welding structure as claimed in claim 17, wherein, this first distributing board comprises a plurality of first basic units, and said first electrical connection pad is arranged in said first basic unit.
21. base board welding structure as claimed in claim 20, wherein, said welding groove also comprises and runs through said first basic unit.
22. base board welding structure as claimed in claim 17, wherein, this second distributing board comprises at least one second basic unit, and this second electrical connection pad is arranged in said second basic unit.
23. base board welding structure as claimed in claim 17, wherein, this second distributing board also comprises at least one second coating, and said second coating is arranged on the said second electrical connection pad surface.
24. base board welding structure as claimed in claim 17, wherein, this second distributing board also comprises a printed circuit board (PCB).
25. base board welding structure as claimed in claim 17, wherein, this second distributing board also comprises a flexible printed wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007100852321A CN101018450B (en) | 2007-02-14 | 2007-02-14 | Base board welding structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007100852321A CN101018450B (en) | 2007-02-14 | 2007-02-14 | Base board welding structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101018450A CN101018450A (en) | 2007-08-15 |
| CN101018450B true CN101018450B (en) | 2012-04-04 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2007100852321A Expired - Fee Related CN101018450B (en) | 2007-02-14 | 2007-02-14 | Base board welding structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101018450B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101252808B (en) * | 2008-02-29 | 2010-06-02 | 友达光电（苏州）有限公司 | Soldering circuit plate and soldering method thereof |
| CN104103222A (en) * | 2013-04-01 | 2014-10-15 | 群创光电股份有限公司 | Display module and display device comprising same |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1368838A (en) * | 2000-02-04 | 2002-09-11 | 奥林巴斯光学工业株式会社 | Base plate connecting device |
| CN1805656A (en) * | 2006-01-05 | 2006-07-19 | 友达光电股份有限公司 | Circuit board module and its forming method |
-
2007
- 2007-02-14 CN CN2007100852321A patent/CN101018450B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1368838A (en) * | 2000-02-04 | 2002-09-11 | 奥林巴斯光学工业株式会社 | Base plate connecting device |
| CN1805656A (en) * | 2006-01-05 | 2006-07-19 | 友达光电股份有限公司 | Circuit board module and its forming method |
Non-Patent Citations (5)
| Title |
|---|
| JP平1-289191A 1989.11.21 |
| JP特开2000-183484A 2000.06.30 |
| JP特开2003-283088A 2003.10.03 |
| JP特开平10-321978A 1998.12.04 |
| 同上. |
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| CN101018450A (en) | 2007-08-15 |
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Granted publication date: 20120404 Termination date: 20210214 |