CN201234403Y - Flexible printed circuit board and mobile phone using the same - Google Patents

Flexible printed circuit board and mobile phone using the same Download PDF

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Publication number
CN201234403Y
CN201234403Y CNU2008201266407U CN200820126640U CN201234403Y CN 201234403 Y CN201234403 Y CN 201234403Y CN U2008201266407 U CNU2008201266407 U CN U2008201266407U CN 200820126640 U CN200820126640 U CN 200820126640U CN 201234403 Y CN201234403 Y CN 201234403Y
Authority
CN
China
Prior art keywords
fpc
zone
flexible printed
mobile phone
hollow out
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CNU2008201266407U
Other languages
Chinese (zh)
Inventor
张春渐
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Holitech Optoelectronics Co Ltd
Original Assignee
BYD Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BYD Co Ltd filed Critical BYD Co Ltd
Priority to CNU2008201266407U priority Critical patent/CN201234403Y/en
Application granted granted Critical
Publication of CN201234403Y publication Critical patent/CN201234403Y/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Abstract

The utility model discloses a flexible printed circuit (FPC). In the FPC, the bended zone free of lines is the hollowed-out zone, that is, the line-free parts of the bended zone of the FPC are hollowed to form the engraved zone. Therefore, the area of the bended zone in the FPC is reduced and the stress produced in the bended zone is reduced. The utility model further discloses a mobile phone using the FPC. The flexible printed circuit (FPC) ensures the compact structure of the liquid crystal module (LCN) and increases the yield rate of a mobile phone.

Description

Flexible printed wiring board and use the mobile phone of this flexible printed wiring board
Technical field
The utility model relates to the flexible printed wiring board technology, refers to flexible printed wiring board that a kind of needs bending is used and the mobile phone that uses this flexible printed wiring board especially.
Background technology
Flexible printed wiring board (FPC, Flexible Printed Circuit) is a kind of flexible wiring board that uses polyimides (PI) or polyester film as base material.FPC and common printed substrate (PCB, Printed Circuit Board) are compared, and have in light weight, thin thickness, be convenient to the three-dimensional assembling in folding back and can bear repeatedly dynamically characteristics such as flex motion.Because the advantage of FPC self, has obtained using widely in consumer electronics products such as mobile phone, notebook computer, PDA the nearly more than ten years.FPC generally all with the PCB realization electric function that links together.
At present, in mobile phone, use flexible printed wiring board as being electrically connected medium mostly, all be connected by FPC such as between: the single screen of nearly all LCM module and the mobile phone mainboard (pcb board of mainboard); Also all be connected between the PCB of LCM Dan Ping and module by FPC.Have cabling on FPC, this cabling is used for setting up between the both sides that connect by FPC and is electrically connected to realize electric function.After FPC and PCB welding, FPC is sweeping usually, will produce stress in the FPC bending place.
Fig. 1 a is the front schematic view that is connected by FPC between the PCB of the single screen 10 of LCM and module in the existing mobile phone, and Fig. 1 b is the right view of Fig. 1 a, and Fig. 1 c is the enlarged diagram of FPC bending place.Can clearly be seen that from Fig. 1 b after the PCB welding (weld is 12) of FPC and module, there is a FPC bending place 11 in FPC.Shown in Fig. 1 c, can produce opposing stress after the FPC bending.
Fig. 2 is the extension schematic diagram of FPC shown in Fig. 1 b, and dash area is bending zone 21 among Fig. 2.As shown in Figure 2, in existing FPC, bending zone 21 comprises all parts of FPC bending, large-area bending zone can produce bigger stress, if stress is bigger, and can be with the PCB jack-up of module, influence the compactedness of LCM structure, thereby reduce the yields of mobile phone.
Summary of the invention
In view of this, main purpose of the present utility model is to provide a kind of flexible printed wiring board, can reduce the stress that FPC bending back produces.
Another purpose of the present utility model is to provide a kind of mobile phone that uses the utility model FPC, can guarantee the compactedness of LCM structure, improves the yields of mobile phone.
For achieving the above object, the technical solution of the utility model specifically is achieved in that
A kind of flexible printed wiring board does not have the bending zone of cabling to be the hollow out zone in the described flexible printed wiring board.
A kind of mobile phone that uses described flexible printed wiring board does not have the bending zone of cabling to be the hollow out zone in the described flexible printed wiring board.
As seen from the above technical solution, in the bending zone of the utility model FPC, will not have the part hollow out of cabling, and make it form the hollow out zone, like this, reduced the area in bending zone among the FPC, thereby reduced the stress that the bending zone produces;
Simultaneously; use in the mobile phone of described flexible printed wiring board; the part that does not have cabling in the bending zone of hollow out FPC; make it form the hollow out zone, the bending zone only comprises the part of removing the hollow out zone in the FPC bending part, and the area in bending zone has reduced; the stress of its generation has also reduced thereupon; protect the PCB that links to each other with this FPC not by jack-up, guaranteed the compactedness of LCM structure in the mobile phone, thereby improved the yields of mobile phone.
Description of drawings
Fig. 1 a is the front schematic view that is connected by FPC between the PCB of LCM Dan Ping and module in the existing mobile phone;
Fig. 1 b is the right view of Fig. 1 a;
Fig. 1 c is the enlarged diagram of FPC bending place;
Fig. 2 is the extension schematic diagram of FPC shown in Fig. 1 b;
Fig. 3 is the schematic diagram in bending zone of the FPC of the utility model one preferred embodiment.
Embodiment
For making the purpose of this utility model, technical scheme and advantage clearer, below with reference to the accompanying drawing embodiment that develops simultaneously, the utility model is further described.
In FPC of the present utility model, there is not the bending zone of cabling to be the hollow out zone.Specifically be exactly, in the bending zone of FPC, will do not have the part hollow out of cabling, make it form the hollow out zone,, bend the stress that the zone produces thereby reduce to reduce to bend the area in zone.Fig. 3 is the schematic diagram in the bending zone of the utility model FPC, as shown in Figure 3, because the existence in hollow out zone 30 is compared with the existing bending zone of all parts of FPC bending that comprises, has obviously reduced the area in bending zone 31.
The shape in hollow out zone 30 can be ellipse, rectangle etc.; The size in hollow out zone 30 can decide according to the cabling density degree, promptly guarantees good electric property to turn to principle with the fretwork area maximum under the situation that does not influence circuit 32.Such as, preferably can be arranged in the adjacent traces spacing be bending zone more than 2 millimeters or 2 millimeters in hollow out zone 30.
Using FPC as being electrically connected in the mobile phone of medium; if there is not the part of cabling in the bending zone of hollow out FPC; make it form the hollow out zone, so, the bending zone only comprises the part of removing the hollow out zone in the FPC bending part; the area in bending zone has reduced; the stress of its generation has also reduced thereupon, like this, has protected the PCB that links to each other with this FPC not by jack-up; guarantee the compactedness of LCM structure in the mobile phone, thereby improved the yields of mobile phone.
Simultaneously, realization of the present utility model only needs in the profile mould of FPC the hollow out mould to be set and gets final product, and the hollow out mould need not be set separately, and therefore, the FPC die cost can not increase.
The above is preferred embodiment of the present utility model only, is not to be used to limit protection range of the present utility model.All within spirit of the present utility model and principle, any modification of being done, be equal to and replace and improvement etc., all should be included within the protection range of the present utility model.

Claims (6)

1. a flexible printed wiring board is characterized in that, does not have the bending zone of cabling to be the hollow out zone in the described flexible printed wiring board.
2. flexible printed wiring board according to claim 1 is characterized in that, it is bending zone more than 2 millimeters or 2 millimeters that described hollow out zone is arranged in the adjacent traces spacing.
3. flexible printed wiring board according to claim 1 and 2 is characterized in that, described hollow out zone is ellipse or rectangle.
4. mobile phone uses the flexible printed wiring board of claim 1, it is characterized in that not having the bending zone of cabling to be the hollow out zone in the described flexible printed wiring board.
5. mobile phone according to claim 4 is characterized in that, it is bending zone more than 2 millimeters or 2 millimeters that described hollow out zone is arranged in the adjacent traces spacing.
6. according to claim 4 or 5 described mobile phones, it is characterized in that described hollow out zone is ellipse or rectangle.
CNU2008201266407U 2008-06-27 2008-06-27 Flexible printed circuit board and mobile phone using the same Expired - Lifetime CN201234403Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNU2008201266407U CN201234403Y (en) 2008-06-27 2008-06-27 Flexible printed circuit board and mobile phone using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNU2008201266407U CN201234403Y (en) 2008-06-27 2008-06-27 Flexible printed circuit board and mobile phone using the same

Publications (1)

Publication Number Publication Date
CN201234403Y true CN201234403Y (en) 2009-05-06

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Family Applications (1)

Application Number Title Priority Date Filing Date
CNU2008201266407U Expired - Lifetime CN201234403Y (en) 2008-06-27 2008-06-27 Flexible printed circuit board and mobile phone using the same

Country Status (1)

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CN (1) CN201234403Y (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104378911A (en) * 2014-11-26 2015-02-25 河源中光电通讯技术有限公司 Improved flexible circuit board of mobile phone display screen
WO2015096690A1 (en) * 2013-12-24 2015-07-02 昆山维信诺显示技术有限公司 Fpc of capacitive touch screen and method for mounting fpc
CN105554198A (en) * 2016-02-01 2016-05-04 广东欧珀移动通信有限公司 Display device and mobile terminal with the same
CN106211551A (en) * 2016-07-27 2016-12-07 京东方科技集团股份有限公司 A kind of flexible PCB and preparation method thereof, display module

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015096690A1 (en) * 2013-12-24 2015-07-02 昆山维信诺显示技术有限公司 Fpc of capacitive touch screen and method for mounting fpc
TWI562049B (en) * 2013-12-24 2016-12-11 Kunshan Visionox Display Co Ltd
US10162455B2 (en) 2013-12-24 2018-12-25 Kunshan Visionox Display Co., Ltd. FPC of a capacitive touchscreen and a method for mounting the FPC
CN104378911A (en) * 2014-11-26 2015-02-25 河源中光电通讯技术有限公司 Improved flexible circuit board of mobile phone display screen
CN105554198A (en) * 2016-02-01 2016-05-04 广东欧珀移动通信有限公司 Display device and mobile terminal with the same
CN106211551A (en) * 2016-07-27 2016-12-07 京东方科技集团股份有限公司 A kind of flexible PCB and preparation method thereof, display module

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
ASS Succession or assignment of patent right

Owner name: SHENZHEN BYD ELECTRONIC COMPONENT CO., LTD.

Free format text: FORMER OWNER: BIYADI CO., LTD.

Effective date: 20150901

C41 Transfer of patent application or patent right or utility model
TR01 Transfer of patent right

Effective date of registration: 20150901

Address after: 518119 Guangdong province Shenzhen City Dapeng new Kwai town Yanan Road No. 1 building experimental Byd Co

Patentee after: Shenzhen BYD Electronic Component Co., Ltd.

Address before: 518118 Pingshan Road, Pingshan Town, Shenzhen, Guangdong, No. 3001, No.

Patentee before: Biyadi Co., Ltd.

CX01 Expiry of patent term
CX01 Expiry of patent term

Granted publication date: 20090506