CN107195642B - Flexible display panel, preparation method thereof and display device - Google Patents
Flexible display panel, preparation method thereof and display device Download PDFInfo
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- CN107195642B CN107195642B CN201710541709.6A CN201710541709A CN107195642B CN 107195642 B CN107195642 B CN 107195642B CN 201710541709 A CN201710541709 A CN 201710541709A CN 107195642 B CN107195642 B CN 107195642B
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- 238000002360 preparation method Methods 0.000 title claims abstract description 6
- 239000000758 substrate Substances 0.000 claims abstract description 67
- 238000004519 manufacturing process Methods 0.000 claims abstract description 18
- 238000000034 method Methods 0.000 claims description 21
- 239000000463 material Substances 0.000 claims description 15
- 238000005520 cutting process Methods 0.000 claims description 6
- -1 polyethylene terephthalate Polymers 0.000 claims description 6
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 6
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 6
- 239000004642 Polyimide Substances 0.000 claims description 4
- 229920001721 polyimide Polymers 0.000 claims description 4
- 239000012528 membrane Substances 0.000 claims 5
- 238000005452 bending Methods 0.000 abstract description 16
- 239000010408 film Substances 0.000 description 44
- 238000010586 diagram Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 4
- 238000011161 development Methods 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 238000002679 ablation Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000000608 laser ablation Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L25/0655—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/6835—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used as a support during build up manufacturing of active devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
- H01L2221/68386—Separation by peeling
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- Microelectronics & Electronic Packaging (AREA)
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Abstract
The invention discloses a flexible display panel, a preparation method thereof and a display device, wherein the flexible display panel comprises a flexible substrate, a display device, an integrated circuit board and a back film, the flexible substrate is provided with a first side surface and a second side surface which are oppositely arranged, the first side surface is divided into a display area and a non-display area which is arranged at the periphery of the display area and used for surrounding the display area, the non-display area is provided with a bending area, and the bending area is provided with a groove formed by inwards recessing the second side surface; the display device is arranged in the display area of the first side surface; the integrated circuit board is arranged in the non-display area of the first side face, the integrated circuit board and the display device are arranged at intervals, and the groove is located between the display device and the integrated circuit board; the back film comprises a first back film part and a second back film part which are arranged at intervals, the first back film part and the second back film part are arranged on the second side surfaces of two sides of the groove, the groove can improve the production efficiency of the flexible display panel, and the manufacturing cost is reduced.
Description
Technical Field
The invention relates to the technical field of display, in particular to a flexible display panel, a preparation method of the flexible display panel and a display device.
Background
The flexible display is an important development direction of the next generation display technology, and the technology has the characteristics of flexibility, insusceptibility to breakage, ultralightness, superthinness, low power consumption, portability and the like, and has wide application prospects and good development prospects in the fields of electronic books, mobile communication, notebooks, televisions, public information and the like. The substrate materials used in the flexible display include organic plastics, thin metal foils, thin glass, etc. Organic plastics are the most potential materials for flexible substrates due to their unique properties.
With the popularization of digital products such as mobile phones and notebook computers (NB), narrow-frame and full-screen display are more and more favored by consumers. And the flexible display can realize the display of four sides narrow frame through the screen (Pad) bending technology. As shown in fig. 1, which is a conventional method for implementing Pad bending technology, a general flexible display device mainly includes the following 4 parts: the flexible substrate comprises a back film 101, a flexible substrate 102, an OLED display device 103 and an integrated circuit 4(IC Chip), wherein the width of a bending region 105 is about 1-3mm, and since the thickness of the back film 101 is large, it is difficult to directly bend the back film, and in the actual bending process, the back film 101 of the bending region 105 is usually removed, and only the flexible substrate 102 and the power supply wiring thereon are bent.
The backing film 101 in the bending region 105 is removed, and a laser ablation method can be generally adopted. For example, two common ways are: mode 1, which uses a laser beam with a small energy to perform ablation in the bending region 105 continuously for a plurality of times, has a disadvantage in that the laser needs to be moved repeatedly for a plurality of times, resulting in a low productivity, and besides, the mode easily leaves the back film 101; mode 2, or a laser beam with larger energy may be used, only two ends of the bending region 105 are ablated, and then the back film 101 in the region is torn off, which has the disadvantages that the laser beam with larger energy easily ablates the flexible substrate 102, and the back film 101 has adhesive thereon, is tightly adhered to the flexible substrate 102, and is not easily removed.
Therefore, how to remove the back film quickly and thoroughly is a long-standing unsolved technical problem for those skilled in the art.
The above information disclosed in this background section is only for enhancement of understanding of the background of the invention.
Disclosure of Invention
It is a primary object of the present invention to overcome at least one of the above-mentioned drawbacks of the prior art and to provide a flexible display panel to reduce the manufacturing cost thereof.
Another primary object of the present invention is to overcome at least one of the above-mentioned drawbacks of the prior art and to provide a display device with reduced manufacturing cost.
Another main object of the present invention is to overcome at least one of the above-mentioned drawbacks of the prior art, and to provide a method for manufacturing a flexible display panel, which reduces the manufacturing cost of the flexible display panel.
In order to achieve the purpose, the invention adopts the following technical scheme:
according to an aspect of the present invention, a flexible display panel is provided, which includes a flexible substrate, a display device, an integrated circuit board, and a back film, wherein the flexible substrate has a first side surface and a second side surface that are oppositely disposed, the first side surface is divided into a display region and a non-display region that is disposed at the periphery of the display region and surrounds the display region, the non-display region is formed with a groove, and the groove is formed by inward recessing of the second side surface; the display device is arranged in the display area of the first side face; the integrated circuit board is arranged in a non-display area of the first side face, the integrated circuit board and the display device are arranged at intervals, and the groove is located between the display device and the integrated circuit board; the notacoria includes first notacoria portion and the second notacoria portion that the interval set up, first notacoria portion with the second notacoria portion set up in the recess both sides on the second side.
According to an embodiment of the invention, the distance between the first backing film portion and the second backing film portion is 1-3 mm.
According to an embodiment of the invention, the distance D between the bottom of the groove and the second side surface1A distance D from the first side surface and the second side surface2The relationship of (1) is: 0.2 × D2≤D1≤0.5*D2。
According to an embodiment of the present invention, a distance between a bottom of the groove of the bending region and the second side surface is 2-5 μm.
According to an embodiment of the present invention, the flexible substrate is made of a polyimide material.
According to an embodiment of the present invention, the back film is made of polyethylene terephthalate or polyethylene terephthalate material.
According to an aspect of the present invention, there is provided a method for manufacturing a flexible display panel, where the flexible display panel is the flexible display panel provided in the present invention, the method for manufacturing the flexible display panel includes the following steps: forming a convex part on the bearing substrate; arranging a flexible substrate on the bearing substrate, wherein the flexible substrate covers the convex part; separating the flexible substrate from the bearing substrate, wherein a groove is formed on the flexible substrate; arranging a back film on the side face of the flexible substrate with the groove; and cutting the back film at the position of the groove by using laser.
According to an embodiment of the present invention, before the step of separating the flexible substrate from the carrier substrate, the method further includes: and manufacturing a display device and an integrated circuit board on the flexible substrate.
According to an embodiment of the present invention, before the step of cutting the back film at the position of the groove by using laser, the method further includes: and connecting the COF with the flexible circuit board through a binding process.
According to an embodiment of the present invention, the convex portion is made of an inorganic thin film material or an organic resin material.
According to another aspect of the present invention, there is provided a display device including the flexible display panel provided in the present invention.
According to the technical scheme, the flexible display panel, the preparation method thereof and the display device have the advantages and positive effects that:
the bending area of the flexible substrate of the flexible display panel is of a groove-shaped structure, when the back film is attached to the side face of the flexible substrate, due to the existence of the groove, a gap exists between the back film of the bending area and the flexible substrate, so that the attachment force between the bottom of the groove and the back film is weakened, the back film is easier to peel off from the groove, and the processing speed of the back film is improved; further, when the back film is cut using laser, the gap can well prevent the flexible substrate from being cut, and thus the flexible substrate can be well protected.
Drawings
Various objects, features and advantages of the present invention will become more apparent from the following detailed description of preferred embodiments of the invention, when considered in conjunction with the accompanying drawings. The drawings are merely exemplary of the invention and are not necessarily drawn to scale. In the drawings, like reference characters designate the same or similar parts throughout the different views. Wherein:
fig. 1 is a partial structural schematic diagram of a flexible display panel in the prior art.
Fig. 2 is a partial structural schematic diagram illustrating a flexible display panel according to an exemplary embodiment.
Fig. 3 is a schematic structural diagram of a carrier substrate for manufacturing the flexible display panel in fig. 2.
Fig. 4 is a schematic structural diagram after a flexible substrate is disposed on the carrier substrate in fig. 3.
Fig. 5 is a schematic structural diagram of a part of the structure of the flexible display panel in fig. 4 after a back film is attached.
Fig. 6 is a schematic structural diagram of the flexible display panel in fig. 2 after being bent.
Wherein the reference numerals are as follows:
101. a back film; 102. A flexible substrate;
103. a display device; 104. An integrated circuit board;
105. a bending region; 106. A groove;
201. a first back film portion; 202. A second back film portion;
a. a carrier substrate; b. A convex portion;
Detailed Description
Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and thus their detailed description will be omitted.
Referring to fig. 2 and 6, according to an aspect of the present invention, there is provided a flexible display panel which may include a flexible substrate 102, a display device 103, an integrated circuit board 104, and a back film 101.
With continued reference to fig. 2 and 6, the flexible substrate 102 may have a first side and a second side opposite to each other, the first side may be divided into a display region and a non-display region disposed at a periphery of the display region for surrounding the display region, the non-display region may be formed with a bending region 105, and the bending region 105 may have a groove 106 formed by recessing the second side inward. According to an embodiment of the present invention, the flexible substrate 102 may be made of a polyimide material, but not limited thereto, and a person skilled in the art can select the polyimide material according to actual needs. Due to the existence of the groove 106, after the back film 101 is attached to the second side, a gap exists between the area of the back film 101 corresponding to the groove 106 and the groove 106, so that the adhesion between the back film 101 and the groove 106 is reduced, the back film 101 in the area of the groove 106 is conveniently peeled from the flexible substrate 102, the processing speed of the back film 101 can be increased, and the efficiency can be improved. On the other hand, due to the existence of the groove 106, the flexible substrate 102 can be prevented from being cut by laser in the process of cutting the back film 101 by laser, so that the yield of products can be improved.
With continued reference to fig. 2 and 6, the display device 103 may be disposed in the display area of the first side. The integrated circuit board 104 may be disposed in the non-display area of the first side surface, the integrated circuit board 104 may be disposed spaced apart from the display device 103, and the groove 106 may be located between the display device 103 and the integrated circuit board 104.
With continued reference to fig. 2 and 6, the backing film 101 may include a first backing film portion 201 and a second backing film portion 202 disposed at an interval, and the first backing film portion 201 and the second backing film portion 202 may be disposed on a second side surface of both sides of the groove 106. According to an embodiment of the present invention, the back film 101 may be made of polyethylene terephthalate or polyethylene terephthalate, but not limited thereto, and those skilled in the art can select the material according to actual needs, and the scope of the present invention is also within the scope of the present invention.
With continued reference to fig. 2 and fig. 6, according to an embodiment of the present invention, the distance between the first back film portion 201 and the second back film portion 202 may be 1-3mm, but not limited thereto, and may be selected according to actual needs.
With continued reference to fig. 2 and 6, in accordance with an embodiment of the present invention, wherein a distance D between the bottom and the second side of the groove 1061A distance D from the first side surface and the second side surface2The relationship of (1) is: 0.2 × D2≤D1≤0.5*D2. According to an embodiment of the present invention, wherein the first side and the second side of the flexible substrate 102The distance between the two side surfaces can be 10 μm, and the distance between the bottom of the groove 106 and the second side surface can be 2-5 μm, but not limited thereto, and can be selected according to actual needs. According to an embodiment of the present invention, the distance D between the bottom and the second side of the groove 1061A distance D from the first side surface and the second side surface2Has a relationship of D1＝0.3*D2. For example, but not limiting of, the distance between the first side and the second side of the flexible substrate 102 may be 10 μm and the distance between the bottom of the groove 106 and the second side may be 3 μm.
Referring to fig. 3 to 5, according to an aspect of the present invention, there is provided a method for manufacturing a flexible display panel, where the flexible display panel may be the flexible display panel provided in the present invention, and the method for manufacturing the flexible display panel includes the following steps: first, a convex portion b may be formed on a carrier substrate a; then, a flexible substrate 102 is disposed on the carrier substrate a, and the flexible substrate 102 may cover the convex portion b; again, the flexible substrate 102 may be separated from the carrier substrate a, so that the groove 106 may be formed on the flexible substrate 102; next, a back film 101 is provided on the side of the flexible substrate 102 having the groove 106; finally, the backing film 101 may be cut with a laser beam where the grooves 106 are located. According to an embodiment of the present invention, the thickness of the convex portion b may be 2-5 μm, but not limited thereto, and may be selected according to actual needs. According to an embodiment of the present invention, the width of the convex portion b may be 1-3mm, but not limited thereto, and may be selected according to actual needs. According to an embodiment of the present invention, the flexible substrate 102 may be peeled off from the carrier substrate a by using an excimer laser, but not limited thereto, and other lasers may be used to separate the flexible substrate 102 from the carrier substrate a, and all of them are within the protection scope of the present invention. According to an embodiment of the present invention, the convex portion b is made of an inorganic thin film material or an organic resin material.
According to an embodiment of the present invention, before the step of separating the flexible substrate 102 from the carrier substrate a, the method further includes: a display device 103 and an integrated circuit board 104 are prepared on a flexible substrate 102.
According to an embodiment of the present invention, before the step of cutting the back film 101 at the position of the groove 106 by using the laser, the method further comprises: and connecting the COF with the flexible circuit board through a binding process.
According to another aspect of the present invention, there is provided a display device including the flexible display panel provided in the present invention.
The described features, structures, or characteristics of the invention may be combined in any suitable manner in one or more embodiments. In the above description, numerous specific details are provided to give a thorough understanding of embodiments of the invention. One skilled in the relevant art will recognize, however, that the invention may be practiced without one or more of the specific details, or with other methods, components, materials, and so forth. In other instances, well-known structures, materials, or operations are not shown or described in detail to avoid obscuring aspects of the invention.
Claims (8)
1. A method for manufacturing a flexible display panel, the flexible display panel comprising:
the flexible substrate is provided with a first side face and a second side face which are oppositely arranged, the first side face is divided into a display area and a non-display area which is arranged on the periphery of the display area and used for surrounding the display area, a groove is formed in the non-display area, and the groove is formed by inwards recessing the second side face;
a display device disposed in the display area of the first side;
the integrated circuit board is arranged in a non-display area of the first side face, the integrated circuit board and the display device are arranged at intervals, and the groove is positioned between the display device and the integrated circuit board;
the back membrane comprises a first back membrane part and a second back membrane part which are arranged at intervals, and the first back membrane part and the second back membrane part are arranged on the second side surfaces at two sides of the groove;
the preparation method of the flexible display panel comprises the following steps:
forming a convex part on the bearing substrate;
arranging a flexible substrate on the bearing substrate;
separating the flexible substrate from the bearing substrate, wherein a groove is formed on the flexible substrate;
disposing a back film on a side of the flexible substrate having the groove;
and cutting the back film at the position of the groove by using laser.
2. The method for manufacturing a flexible display panel according to claim 1, further comprising, before the step of separating the flexible substrate from the carrier substrate: and manufacturing a display device and an integrated circuit board on the flexible substrate.
3. The method for manufacturing a flexible display panel according to claim 1, further comprising, before the step of cutting the back film at a position where the groove is located by using laser light: and connecting the COF with the flexible circuit board through a binding process.
4. The method of manufacturing a flexible display panel according to claim 1, wherein a distance between the first back film portion and the second back film portion is 1 to 3 mm.
5. The method of claim 1, wherein a distance D between a bottom of the groove and the second side surface is between the bottom of the groove and the second side surface1A distance D from the first side surface and the second side surface2The relationship of (1) is: 0.2 × D2≤D1≤0.5*D2。
6. The method of manufacturing a flexible display panel according to claim 1, wherein a distance from a bottom of the groove to the second side surface is 2 to 5 μm.
7. The method according to any one of claims 1 to 6, wherein the flexible substrate is made of a polyimide material.
8. The method of claim 7, wherein the backing film is formed from a polyethylene terephthalate or polyethylene terephthalate material.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710541709.6A CN107195642B (en) | 2017-07-05 | 2017-07-05 | Flexible display panel, preparation method thereof and display device |
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| CN201710541709.6A CN107195642B (en) | 2017-07-05 | 2017-07-05 | Flexible display panel, preparation method thereof and display device |
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| CN107195642A CN107195642A (en) | 2017-09-22 |
| CN107195642B true CN107195642B (en) | 2020-01-17 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107976725A (en) * | 2018-01-19 | 2018-05-01 | 京东方科技集团股份有限公司 | A kind of protective film and preparation method thereof, flexible panel, display device and preparation method thereof |
| JP2019179178A (en) * | 2018-03-30 | 2019-10-17 | 株式会社ジャパンディスプレイ | Display and method for manufacturing display |
| CN108598263A (en) * | 2018-06-19 | 2018-09-28 | 昆山国显光电有限公司 | For the support membranes of flexible display panels, flexible display panels and preparation method thereof |
| CN108986664B (en) * | 2018-07-18 | 2023-10-27 | 京东方科技集团股份有限公司 | Flexible display panel and manufacturing method thereof, flexible display device and manufacturing method thereof |
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| CN109976051B (en) * | 2019-04-15 | 2024-03-26 | 武汉华星光电技术有限公司 | Display panel |
| US10707560B1 (en) * | 2019-04-25 | 2020-07-07 | A.U. Vista, Inc. | Display panel structure for wireless communication with antenna on side surface |
| CN110323231A (en) * | 2019-07-11 | 2019-10-11 | 福州京东方光电科技有限公司 | Array substrate, display panel, display device and preparation method thereof |
| CN110610904A (en) * | 2019-08-29 | 2019-12-24 | 武汉华星光电半导体显示技术有限公司 | Display panel and manufacturing method thereof |
| CN111179757B (en) | 2020-01-03 | 2022-01-25 | 京东方科技集团股份有限公司 | Flexible display device, back film for flexible display device and preparation method of back film |
| CN113363264B (en) * | 2020-03-05 | 2024-05-17 | 京东方科技集团股份有限公司 | Array substrate, preparation method thereof and display device |
| CN111710760B (en) * | 2020-06-28 | 2022-06-03 | 京东方科技集团股份有限公司 | Display substrate, manufacturing method thereof and display device |
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| US9933870B2 (en) * | 2015-03-17 | 2018-04-03 | Lg Display Co., Ltd. | Back plate member for flexible display, display apparatus including the same, and method of manufacturing the same |
| KR102385233B1 (en) * | 2015-08-06 | 2022-04-12 | 삼성디스플레이 주식회사 | Display apparatus and method for manufacturing the same |
| CN106783720B (en) * | 2017-03-03 | 2020-06-23 | 京东方科技集团股份有限公司 | Display substrate and manufacturing method thereof |
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