CN209045575U - Solar panel - Google Patents
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- CN209045575U CN209045575U CN201821695055.9U CN201821695055U CN209045575U CN 209045575 U CN209045575 U CN 209045575U CN 201821695055 U CN201821695055 U CN 201821695055U CN 209045575 U CN209045575 U CN 209045575U
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- cathode
- silicon wafer
- electrically connected
- solar panel
- wafer unit
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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Abstract
The utility model provides a kind of solar panel, solar panel, including circuit board and silicon wafer component, the circuit boards have for the cathode circuit of the anode electric connection with external equipment and for the cathode traces with the electric connection of the cathode of the external equipment, and the silicon wafer component has positive electrode and negative electrode；The silicon wafer component is set on the circuit board by way of Placement, and the positive electrode and the cathode circuit are electrically connected, the solar panel further includes the first conductive connecting piece, and the both ends of first conductive connecting piece are contacted and are electrically connected with the cathode traces, the negative electrode respectively by way of Placement.Solar panel provided by the utility model effectively increases production efficiency, placement accuracy height, to solve the prior art since the case where causing production efficiency low by way of human weld and appearance out-of-flatness occurs.
Description
Technical field
The utility model belongs to solar panel technology field, is to be related to a kind of solar panel more specifically.
Background technique
Current solar panel generally includes multiple silicon wafers, and the front of each silicon wafer is printed with negative electrode grid, reverse side
It is printed with positive electrode grid line, when assembling, needs that first silicon wafer is fixed on circuit board, then manually utilize welding to weld silica gel piece
Mode realize it is in series or in parallel.Its production efficiency is low, and appearance the case where be easy to cause appearance out-of-flatness.
Utility model content
The purpose of this utility model is to provide a kind of solar panels, to solve in the prior art due to using welding
The technical problem that the mode of welding causes production efficiency low.
In order to achieve the above purposes, the technical solution adopted by the utility model is: provides a kind of solar panel, including electricity
Road plate and silicon wafer component, the circuit boards have for external equipment anode be electrically connected cathode circuit and
For the cathode traces with the electric connection of the cathode of the external equipment, the silicon wafer component has positive electrode and negative electrode；
The silicon wafer component is set on the circuit board by way of Placement, and the positive electrode and the cathode circuit
It is electrically connected, the solar panel further includes the first conductive connecting piece, and the both ends of first conductive connecting piece pass through patch
The mode of piece machine attachment is contacted and is electrically connected with the cathode traces, the negative electrode respectively.
Further, silicon wafer unit and several second conductive connecting piece group of the silicon wafer component by several series connections
At the front of the silicon wafer unit is provided with negative electrode grid, and the back side of the silicon wafer unit is provided with positive electrode grid；Each silicon
The back side of blade unit is fixed on the circuit board by way of Placement, the positive electricity of one of them silicon wafer unit
Pole grid and the cathode circuit are electrically connected, and the negative electrode grid of another silicon wafer unit pass through first conductive connecting piece
It is electrically connected with the cathode traces, the two neighboring silicon wafer unit is connected by second conductive connecting piece.
Further, the silicon wafer component is made of several silicon wafer units being connected in parallel, the front of the silicon wafer unit
Negative electrode grid are provided with, the back side of the silicon wafer unit is provided with positive electrode grid；The back side of each silicon wafer unit passes through patch
The mode of machine attachment is fixed on the circuit board, and the positive electrode grid of each silicon wafer unit are electrical with the cathode circuit respectively
The negative electrode grid of connection, each silicon wafer unit are electrically connected by first conductive connecting piece and the cathode traces.
Further, the silicon wafer unit is monocrystalline silicon piece or polysilicon chip.
Further, the gap between the two neighboring silicon wafer unit is 0.5mm-15mm.
Further, the cathode circuit includes the cathode conductive film being electrically connected with the positive electrode and the anode
The positive leading-out piece and be electrically connected with the positive leading-out piece and be used for the anode with external equipment that conductive sheet is electrically connected
The positive conductive rivet of electric connection；
The cathode traces include leading with the cathode conductive film of first conductive connecting piece electric connection, with the cathode
The cathode leading-out piece and be electrically connected with the cathode leading-out piece and be used for the negative electricity with external equipment that electric piece is electrically connected
Property connection negative conductive rivet, first through hole and the second through-hole are offered on the circuit board, the positive conductive rivet leads to
The mode for crossing Placement is fixed in the first through hole, and the negative conductive rivet is consolidated by way of Placement
Due in second through-hole.
Further, the cathode circuit includes the cathode conductive film being electrically connected with the positive electrode and the anode
The positive leading-out piece and be electrically connected with the positive leading-out piece and be used for the anode with external equipment that conductive sheet is electrically connected
The positive electrode conducting layer of electric connection；
The cathode traces include leading with the cathode conductive film of first conductive connecting piece electric connection, with the cathode
The cathode leading-out piece and be electrically connected with the cathode leading-out piece and be used for the negative electricity with external equipment that electric piece is electrically connected
Property connection negative conducting layer, offer first through hole and the second through-hole on the circuit board, the positive electrode conducting layer is set to
In the inner wall of the first through hole, the negative conducting layer is set in the inner wall of second through-hole.
Further, the cathode conductive film includes contact jaw and the connecting pin with contact jaw electric connection, institute
It states the back side of silicon wafer component and the contact end in contact and covers the contact jaw, the connecting pin exposing silicon wafer component
Outside.
Further, the cathode conductive film is copper sheet.
Further, the solar battery further includes diaphragm, and the circuit board and the silicon wafer component package are in institute
It states in diaphragm.
The beneficial effect of solar panel provided by the utility model is: compared with prior art, the utility model
Solar panel, silica gel component are set on circuit board by way of Placement, and solar panel further includes
One conductive connecting piece, the both ends of the first conductive connecting piece are electric with cathode traces, negative electrode respectively by way of Placement
Property connection, it is high to effectively increase production efficiency, placement accuracy, to solve the prior art due to by way of human weld
The case where causing production efficiency low and appearance out-of-flatness, occurs.
Detailed description of the invention
It, below will be to embodiment or the prior art in order to illustrate more clearly of the technical scheme in the embodiment of the utility model
Attached drawing needed in description is briefly described, it should be apparent that, the accompanying drawings in the following description is only that this is practical new
Some embodiments of type for those of ordinary skill in the art without any creative labor, can be with
It obtains other drawings based on these drawings.
Fig. 1 is the schematic perspective view for the solar panel that the utility model first embodiment provides, wherein each silicon
It is series connection between blade unit；
Fig. 2 is another angle schematic perspective view of Fig. 1；
Fig. 3 is the configuration schematic diagram for the solar panel that the utility model first embodiment provides, wherein each silicon
It is series connection between blade unit；
Fig. 4 is the schematic perspective view of circuit board used by the utility model first embodiment；
Fig. 5 is the positive structure schematic of silicon wafer unit used by the utility model first embodiment；
Fig. 6 is the structure schematic diagram of silicon wafer unit used by the utility model first embodiment；
Fig. 7 be the utility model first embodiment solar panel circuit diagram, wherein each silicon wafer unit it
Between for be connected in series；
Fig. 8 be the utility model second embodiment solar panel circuit diagram, wherein each silicon wafer unit it
Between to be connected in parallel.
Wherein, each appended drawing reference in figure:
10- circuit board；11- first through hole；The second through-hole of 12-；20- silicon wafer component；21- silicon wafer unit；211- negative electrode
Grid；212- positive electrode grid；The second conductive connecting piece of 22-；23- positive electrode；24- negative electrode；30- cathode circuit；31- positive conductive
Piece；311- contact jaw；The connecting pin 312-；32- anode leading-out piece；33- positive conductive rivet；40- cathode traces；41- cathode is led
Electric piece；42- cathode leading-out piece；43- negative conductive rivet；The first conductive connecting piece of 50-；60- diaphragm.
Specific embodiment
In order to which technical problem to be solved in the utility model, technical solution and beneficial effect is more clearly understood, with
Lower combination accompanying drawings and embodiments, the present invention will be further described in detail.It should be appreciated that specific reality described herein
It applies example to be only used to explain the utility model, is not used to limit the utility model.
It should be noted that it can be directly another when element is referred to as " being fixed on " or " being set to " another element
On one element or indirectly on another element.When an element is known as " being connected to " another element, it can
To be directly to another element or be indirectly connected on another element.
It is to be appreciated that term " length ", " width ", "upper", "lower", "front", "rear", "left", "right", "vertical",
The orientation or positional relationship of the instructions such as "horizontal", "top", "bottom" "inner", "outside" is that orientation based on the figure or position are closed
System, is merely for convenience of describing the present invention and simplifying the description, rather than the device or element of indication or suggestion meaning are necessary
It with specific orientation, is constructed and operated in a specific orientation, therefore should not be understood as limiting the present invention.
In addition, term " first ", " second " are used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance
Or implicitly indicate the quantity of indicated technical characteristic.Define " first " as a result, the feature of " second " can be expressed or
Implicitly include one or more of the features.The meaning of " plurality " is two or two in the description of the present invention,
More than, unless otherwise specifically defined.
Embodiment one
Also referring to Fig. 1 to Fig. 7, now solar panel provided by the utility model is illustrated.Solar-electricity
Pond plate, including circuit board 10 and silicon wafer component 20.It is printed on circuit board 10 for the anode with external equipment (in figure not
Show) cathode circuit 30 that is electrically connected and for the cathode traces with the electric connection of the cathode (not shown) of external equipment
40.Silicon wafer component 20 has positive electrode 23 and negative electrode 24；Silicon wafer component 20 is set to electricity by way of Placement
On road plate 10, and positive electrode 23 and cathode circuit 30 are electrically connected, and solar panel further includes the first conductive connecting piece 50, the
The both ends of one conductive connecting piece 50 are contacted respectively with cathode traces 40, negative electrode 24 by way of Placement and are electrically connected
It connects.
Solar panel provided by the utility model, compared with prior art, the solar panel of the utility model,
Silica gel component is set on circuit board 10 by way of Placement, and solar panel further includes the first conductive connecting piece
50, the both ends of the first conductive connecting piece 50 are electrically connected with cathode traces 40, negative electrode 24 respectively by way of Placement
It connects, production efficiency, placement accuracy height is effectively increased, to solve the prior art due to causing by way of human weld
The case where production efficiency is low and appearance out-of-flatness occurs.
Further, Fig. 1, Fig. 3 and Fig. 7 are please referred to, a kind of tool as solar panel provided by the utility model
Body embodiment, specifically, in the present embodiment, silicon wafer component 20 is by the silicon wafer unit 21 of several series connections and several
Two conductive connecting pieces 22 composition.The front of silicon wafer unit 21 is provided with negative electrode grid 211, and the back side of silicon wafer unit 21 is provided with just
Electrode grid 212.The back side of each silicon wafer unit 21 is fixed on circuit board 10 respectively by way of Placement, one of them
The positive electrode grid 212 and cathode circuit 30 of silicon wafer unit 21 are electrically connected, and the negative electrode grid 211 of another silicon wafer unit 21 pass through
First conductive connecting piece 50 is electrically connected with cathode traces 40, and two neighboring silicon wafer unit 21 is gone here and there by the second conductive connecting piece 22
Connection.It wherein, can be by the negative electrode grid 211 and cathode of another silicon wafer unit 21 by the setting of the first conductive connecting piece 50
Circuit 40 is electrically connected, and the series connection between two neighboring silicon wafer unit 21 may be implemented by the second conductive connecting piece 22.The
Two conductive connecting pieces 22 are also that two neighboring silicon wafer unit 21 is connected by way of Placement.Specifically, if silicon wafer list
The quantity of member 21 is that four, then the positive electrode grid 212 of first silicon wafer unit 21 and cathode circuit 30 are electrically connected, first silicon
The positive electrode grid 212 of the negative electrode grid 211 of blade unit 21 and second silicon wafer unit 21 second are conductively connected by one of them
Piece 22, which is realized, to be electrically connected, the positive electrode grid 212 of the negative electrode grid 211 of third silicon wafer unit 21 and the 4th silicon wafer unit 21
It is realized and is electrically connected by another second conductive connecting piece 22, and the negative electrode grid 211 and cathode of the 4th silicon wafer unit 21
Circuit 40 is realized by the first conductive connecting piece 50 and is electrically connected.
Further, as a kind of specific embodiment of solar panel provided by the utility model, silicon wafer unit
21 be monocrystalline silicon piece or polysilicon chip, can be configured according to actual needs.
Further, referring to Fig. 1, a kind of specific embodiment party as solar panel provided by the utility model
Formula, the gap between two neighboring silicon wafer unit 21 is 0.5mm-15mm, such as can be 0.5mm, 5.0mm or 15mm.
Further, Fig. 1, Fig. 3, Fig. 4 and Fig. 7 are please referred to, one as solar panel provided by the utility model
Kind specific embodiment, cathode circuit 30 include the cathode conductive film 31 being electrically connected with positive electrode 23 and cathode conductive film 31
The positive leading-out piece 32 of electric connection and with positive leading-out piece 32 be electrically connected and for external equipment anode electrically connect
The positive conductive rivet 33 connect.Cathode traces 40 include with the first conductive connecting piece 50 be electrically connected cathode conductive film 41, with
The cathode leading-out piece 42 and be electrically connected and be used for and external equipment with cathode leading-out piece 42 that cathode conductive film 41 is electrically connected
The negative conductive rivet 43 that is electrically connected of cathode, offer first through hole 11 and the second through-hole 12 on circuit board 10, anode is led
Rivet weld nail 33 is fixed in first through hole 11 by way of Placement, and negative conductive rivet 43 passes through Placement
Mode is fixed in the second through-hole 12, can be by the solar panel by positive conductive rivet 33 and negative conductive rivet 43
Positive and negative electrode current export, to supply electricity to external equipment.Wherein, the quantity of the cathode conductive film 31 is spaced multiple,
So that the positive electrode grid 212 of each silicon wafer unit 21 contact respectively with each cathode conductive film 31 to realize and be electrically connected.
It should be noted that the cathode circuit 30 and the set-up mode of cathode traces 40 are not limited thereto, for example, at this
In another preferable implementation of utility model, cathode circuit 30 include with positive electrode 23 be electrically connected cathode conductive film 31, with just
The positive leading-out piece 32 and be electrically connected and be used for and external equipment with positive leading-out piece 32 that pole conductive sheet 31 is electrically connected
The positive electrode conducting layer (not shown) that anode is electrically connected.Cathode traces 40 include being electrically connected with the first conductive connecting piece 50
Cathode conductive film 41 is electrically connected with the cathode leading-out piece 42 of the electric connection of cathode conductive film 41 and with cathode leading-out piece 42
And it is used for the negative conducting layer (not shown) with the electric connection of the cathode of external equipment, first through hole is offered on circuit board 10
11 and second through-hole 12, positive electrode conducting layer be set in the inner wall of first through hole 11, negative conducting layer is set to the second through-hole 12
Inner wall in, by the setting of positive electrode conducting layer and negative conducting layer, conductive function equally may be implemented.
Further, referring to Fig. 4, a kind of specific embodiment party as solar panel provided by the utility model
Formula, cathode conductive film 31 include contact jaw 311 and the connecting pin 312 with the electric connection of contact jaw 311, the back of silicon wafer unit 21
Face contacts with contact jaw 311 and covers contact jaw 311, and connecting pin 312 is exposed outside silicon wafer unit 21.Preferably, contact jaw 311
Area is greater than the area of connecting pin 312, and cathode conductive film 31 may include multiple spaced contact jaws 311, thus
When attachment, can on contact jaw 311 print solder paste, realize and be preferably connected and fixed work between silicon wafer unit 21 and circuit board 10
With preventing from loosening.
Further, referring to Fig. 4, a kind of specific embodiment party as solar panel provided by the utility model
Formula, cathode conductive film 31, the first conductive connecting piece 50, the second conductive connecting piece 22 can be set to copper sheet or iron plate etc.,
It has good conductive property.First conductive connecting piece 50, the second conductive connecting piece 22 set-up mode be not limited thereto,
Such as in other preferable implementations of the utility model, first conductive connecting piece 50, the second conductive connecting piece 22 may be
The conduct pieces such as wire jumper or Ohmic resistance.
Further, Fig. 1 to Fig. 2 is please referred to, a kind of specific reality as solar panel provided by the utility model
Mode is applied, solar panel further includes diaphragm 60, and diaphragm 60 is covered in the surface of circuit board 10 and silicon wafer component 20.The film
Piece 60 is packaged in the surface of circuit board 10 Yu silicon wafer component 20, i.e., the described circuit board 10 and the silicon wafer by the way of encapsulation
Component 20 is packaged in the diaphragm 60, so as to play a good protective effect.
The preparation process of the solar panel of the present embodiment is as follows:
Firstly, it is necessary to positive leading-out piece 32 and the multiple cathode conductive films 31 of interval setting are set on the circuit board 10, and
Cathode leading-out piece 42 and cathode conductive film 41 are set on the circuit board 10, and open up first through hole 11 and the on the circuit board 10
Two through-holes 12, one end of the anode leading-out piece 32 and one of cathode conductive film 31 are electrically connected, and the other end extends to first
The peripheral position of through-hole 11；One end of the cathode leading-out piece 42 and the cathode conductive film 41 are electrically connected, and the other end extends to the
The peripheral position of two through-holes 12；
Secondly, printing the first tin respectively on the contact jaw of each cathode conductive film 31, first through hole 11, the second through-hole 12
Cream, and be fixed on each silicon wafer unit 21 by way of Placement on each contact jaw for being printed with the first tin cream,
And positive conductive rivet 33 and negative conductive rivet 43 are individually fixed in first through hole 11, the second through-hole of the first tin cream of printing
In 12, so that positive conductive rivet 33 connects with positive leading-out piece 32, cathode leading-out piece 42 respectively with negative conductive rivet 43
Touching；
Then, circuit board 10 is heated to the first preset temperature in reflow machine so that first tin cream solidify, from
And each silicon wafer unit 21 is fixed on each contact jaw for being printed with first tin cream, the positive conductive riveting
Nail 33 is fixed on the first through hole 11 for being printed with first tin cream, the negative conductive rivet 43 has been fixed on printing
It states in second through-hole 12 of the first tin cream, connects very solid and reliable；
Followed by the connecting pin of each cathode conductive film 31 on circuit board 10 and cathode conductive film are printed second respectively
Tin cream, and third tin cream is printed in the position where the negative electrode grid of each silicon wafer unit 21 simultaneously, and paste by chip mounter
The both ends of first conductive connecting piece 50 are individually fixed in by the mode of dress to be printed with the cathode of second tin cream and leads
Electric piece 41 and one of them be printed on the negative electrode grid of the third tin cream, and by way of Placement
One of them described silicon wafer unit one end of second conductive connecting piece 22 being fixed in the two neighboring silicon wafer unit 21
On 21 negative electrode grid, the other end is fixed on to be connect with another described silicon wafer unit 21 in the two neighboring silicon wafer unit 21
On the connecting pin of touching, so that the positive and negative electrode grid of each silicon wafer unit 21 are sequentially connected, series connection is formed；
Then, circuit board 10 is heated to the second preset temperature in reflow machine so that second tin cream, described
Three tin creams solidification, so that the cathode conductive film 41 is printed with the negative electrode grid of the third tin cream with one of them
It is connected and fixed, and made described in one of them in the two neighboring silicon wafer unit 21 by first conductive connecting piece 50
It the negative electrode grid of silicon wafer unit 21 and contacts with another described silicon wafer unit 21 in the two neighboring silicon wafer unit 21
The connecting pin is connected and fixed by second conductive connecting piece 22；
Finally, diaphragm 60 is sticked in circuit board 10 and silicon wafer assembly surface by way of encapsulation, so that circuit board
10 and silicon wafer component 20 encapsulation finish.
Embodiment two
Referring to Fig. 8, existing be illustrated the solar panel of second embodiment provided by the utility model.This second
The structure of embodiment and the structure of the first embodiment are essentially identical, except that:
In the present embodiment, silicon wafer component 20 is made of several silicon wafer units 21 being connected in parallel, and silicon wafer unit 21 is just
Face is provided with negative electrode grid 211, and the back side of silicon wafer unit 21 is provided with positive electrode grid 212；The back side of each silicon wafer unit 21 passes through
The mode of Placement is fixed on circuit board 10, and the positive electrode grid 212 of each silicon wafer unit 21 are electric with cathode circuit 30 respectively
Property connection, the negative electrode grid 211 of each silicon wafer unit 21 are electrically connected by the first conductive connecting piece 50 with cathode traces 40, thus
Complete being connected in parallel between each silicon wafer unit 21.It is attached by way of in parallel between each silicon wafer unit 21, when it
In silicon wafer unit 21 when breaking down, which can also work on, to guarantee Electrical Safety, meet and use
Family demand.
The utility model additionally provides a kind of preparation method of solar panel, including step A and step B.
A, be printed on circuit boards for external equipment anode be electrically connected cathode circuit and be used for and institute
State the cathode traces that the cathode of external equipment is electrically connected.
B, silicon wafer component is fixed on the circuit board by way of Placement, so that the silicon wafer component
Positive electrode and the cathode circuit are electrically connected；And make the both ends point of the first conductive connecting piece by way of Placement
Does not contact and be electrically connected with the negative electrode of the cathode traces, the silicon wafer component.
Specifically, in the present embodiment, the step B specifically includes the following steps:
B1, the contact jaw of each cathode conductive film on circuit boards, first through hole, the first tin is printed respectively on the second through-hole
Cream, and each silicon wafer unit is fixed on to each contact jaw for being printed with first tin cream by way of Placement
On, and positive conductive rivet and negative conductive rivet be individually fixed in be printed with first tin cream the first through hole,
In second through-hole.
B2, the circuit board that step B1 is obtained is heated to the first preset temperature in reflow machine so that first tin cream
Solidification, so that each silicon wafer unit is fixed on each contact jaw for being printed with first tin cream, the anode
Conductive rivet is fixed on the first through hole for being printed with first tin cream, the negative conductive rivet has been fixed on printing
It states in second through-hole of the first tin cream.
B3, the connecting pin of each cathode conductive film on the circuit board in step B2 and cathode conductive film are printed respectively
Two tin creams, and third tin cream is printed in the position where the negative electrode grid of each silicon wafer unit simultaneously, and paste by chip mounter
The both ends of first conductive connecting piece are individually fixed in the negative conductive for being printed with second tin cream by the mode of dress
Piece and one of them be printed on the negative electrode grid of the third tin cream, and by by way of Placement
The negative electrode of one of them silicon wafer unit in the two neighboring silicon wafer unit is fixed in one end of two conductive connecting pieces
On grid, the other end is fixed on the connecting pin contacted with another described silicon wafer unit in the two neighboring silicon wafer unit
On.
B4, the circuit board that step B3 is obtained is heated to the second preset temperature in reflow machine so that second tin
Cream, third tin cream solidification, so that the cathode conductive film is printed with the described of the third tin cream with one of them
Negative electrode grid are connected and fixed by first conductive connecting piece, and make one of them in the two neighboring silicon wafer unit
The negative electrode grid of the silicon wafer unit and the institute contacted with another described silicon wafer unit in the two neighboring silicon wafer unit
Connecting pin is stated to be connected and fixed by second conductive connecting piece.
Wherein, the value of first preset temperature and the second preset temperature can be set according to actual needs, such as can be
150℃-300℃。
Further include step C after step B: encapsulating a film in circuit board and silicon wafer assembly surface by way of encapsulation
Piece.So as to play preferably insulation and dustproof effect.Specifically, the diaphragm is PET (Polyethylene
Terephthalate, poly terephthalic acid class plastics) diaphragm, utilize EVA (ethylene-vinyl acetate copo, second
Alkene-acetate ethylene copolymer) glue is to by diaphragm be fixed on circuit board and silicon wafer assembly surface.
The above is only the preferred embodiment of the utility model only, is not intended to limit the utility model, all at this
Made any modifications, equivalent replacements, and improvements etc., should be included in the utility model within the spirit and principle of utility model
Protection scope within.
Claims (10)
1. solar panel, it is characterised in that: including circuit board and silicon wafer component, the circuit boards have for
The cathode circuit that the anode of external equipment is electrically connected and the negative electricity for being electrically connected with the cathode of the external equipment
Road, the silicon wafer component have positive electrode and negative electrode；The silicon wafer component is set to institute by way of Placement
It states on circuit board, and the positive electrode and the cathode circuit are electrically connected, the solar panel further includes the first conduction
Connection sheet, the both ends of first conductive connecting piece by way of Placement respectively with cathode traces, described negative
Electrode is contacted and is electrically connected.
2. solar panel as described in claim 1, it is characterised in that: the silicon wafer component by several series connections silicon
Blade unit and several second conductive connecting pieces composition, the front of the silicon wafer unit is provided with negative electrode grid, the silicon wafer list
The back side of member is provided with positive electrode grid；The circuit is fixed at the back side of each silicon wafer unit by way of Placement
On plate, the positive electrode grid and the cathode circuit of one of them silicon wafer unit are electrically connected, another described silicon wafer unit
Negative electrode grid be electrically connected by first conductive connecting piece and the cathode traces, the two neighboring silicon wafer unit is logical
Cross the second conductive connecting piece series connection.
3. solar panel as described in claim 1, it is characterised in that: the silicon wafer component is by several silicon being connected in parallel
Blade unit composition, the front of the silicon wafer unit are provided with negative electrode grid, and the back side of the silicon wafer unit is provided with positive electrode grid；
The back side of each silicon wafer unit is fixed on the circuit board by way of Placement, and each silicon wafer unit is just
Electrode grid is electrically connected with the cathode circuit respectively, and the negative electrode grid of each silicon wafer unit are conductively connected by described first
Piece and the cathode traces are electrically connected.
4. the solar panel as described in claim 2 or 3, it is characterised in that: the silicon wafer unit be monocrystalline silicon piece or
Person's polysilicon chip.
5. the solar panel as described in claim 2 or 3, it is characterised in that: between the two neighboring silicon wafer unit
Gap be 0.5mm-15mm.
6. solar panel as described in claim 1, it is characterised in that: the cathode circuit includes and the positive electrode is electric
Property the cathode conductive film of connection, the positive leading-out piece that is electrically connected with the cathode conductive film and with the positive leading-out piece
The positive conductive rivet for being electrically connected and being used to be electrically connected with the anode of external equipment；
The cathode traces include the cathode conductive film being electrically connected with first conductive connecting piece and the cathode conductive film
It the cathode leading-out piece of electric connection and is electrically connected with the cathode leading-out piece and is used to electrically connect with the cathode of external equipment
The negative conductive rivet connect offers first through hole and the second through-hole on the circuit board, and the positive conductive rivet passes through patch
The mode of piece machine attachment is fixed in the first through hole, and the negative conductive rivet is fixed on by way of Placement
In second through-hole.
7. solar panel as described in claim 1, it is characterised in that: the cathode circuit includes and the positive electrode is electric
Property the cathode conductive film of connection, the positive leading-out piece that is electrically connected with the cathode conductive film and with the positive leading-out piece
The positive electrode conducting layer for being electrically connected and being used to be electrically connected with the anode of external equipment；
The cathode traces include the cathode conductive film being electrically connected with first conductive connecting piece and the cathode conductive film
It the cathode leading-out piece of electric connection and is electrically connected with the cathode leading-out piece and is used to electrically connect with the cathode of external equipment
The negative conducting layer connect, first through hole and the second through-hole are offered on the circuit board, and the positive electrode conducting layer is set to described
In the inner wall of first through hole, the negative conducting layer is set in the inner wall of second through-hole.
8. the solar panel as described in claim 6 or 7, it is characterised in that: the cathode conductive film includes contact jaw
And described in the connecting pin being electrically connected with the contact jaw, the back side of the silicon wafer component and the contact end in contact and covering
Contact jaw, the connecting pin are exposed outside the silicon wafer component.
9. the solar panel as described in claim 6 or 7, it is characterised in that: the cathode conductive film is copper sheet.
10. solar panel as described in claim 1, it is characterised in that: the solar battery further includes diaphragm, described
Circuit board and the silicon wafer component package are in the diaphragm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821695055.9U CN209045575U (en) | 2018-10-18 | 2018-10-18 | Solar panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821695055.9U CN209045575U (en) | 2018-10-18 | 2018-10-18 | Solar panel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209045575U true CN209045575U (en) | 2019-06-28 |
Family
ID=67036677
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821695055.9U Active CN209045575U (en) | 2018-10-18 | 2018-10-18 | Solar panel |
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| Country | Link |
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| CN (1) | CN209045575U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109659376A (en) * | 2018-10-18 | 2019-04-19 | 珈伟新能源股份有限公司 | Solar panel and preparation method thereof |
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2018
- 2018-10-18 CN CN201821695055.9U patent/CN209045575U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109659376A (en) * | 2018-10-18 | 2019-04-19 | 珈伟新能源股份有限公司 | Solar panel and preparation method thereof |
| CN109659376B (en) * | 2018-10-18 | 2024-04-05 | 珈伟新能源股份有限公司 | Solar cell panel and preparation method thereof |
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