CN101752341A - Lead frame of multi-chip integrated circuit - Google Patents
Lead frame of multi-chip integrated circuit Download PDFInfo
- Publication number
- CN101752341A CN101752341A CN 200810147806 CN200810147806A CN101752341A CN 101752341 A CN101752341 A CN 101752341A CN 200810147806 CN200810147806 CN 200810147806 CN 200810147806 A CN200810147806 A CN 200810147806A CN 101752341 A CN101752341 A CN 101752341A
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- CN
- China
- Prior art keywords
- pin
- lead frame
- dao
- integrated circuit
- pins
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Lead Frames For Integrated Circuits (AREA)
Abstract
The invention discloses a lead frame of a multi-chip integrated circuit, which comprises side bands, a plurality of pins, pin connecting bars, an island connecting bar and 2-3 islands, wherein the pins are connected with the side bands through the pin bars, one island is connected with the side band through the island connecting bar, other islands are connected with the pins, pin holes are formed on the pins, and chip mounting positions are arranged on the islands. The lead frame is characterized by full functions, a wide range of applications, small volume, few packaging times, low cost, material conservation, safe and reliable working and long service life, and can be used as an electronic amplifier and a power supply manager.
Description
Technical field
Type of the present invention relates to semiconductor element, and more particularly, it relates to a kind of circuit lead frame that has the multicore sheet.
Background technology
Circuit lead frame is the primary element of semiconductor components and devices, in actual the use, also needs encapsulating material to lead frame and the encapsulation of other part, forms the semiconductor element of an integral body.A chip has only a Ji Dao in the circuit lead frame that uses at present, so can only be set.The power supervisor that uses is general at present adopts a plurality of independently semiconductor elements to combine, and it encapsulates often, and the production time is long, the cost height, and it is big to take up room simultaneously, and the scope of application is restricted.Along with electronic product develops to microminiaturized, ultra-thinization and the direction that economizes on resources, need urgently a plurality of chipsets are combined on the circuit lead frame, satisfy user's multiple requirement.
Summary of the invention
The technical problem to be solved in the present invention provides the lead frame of multi-chip integrated circuit that a kind of volume is little, function is many.
The present invention addresses the above problem the technical scheme that is adopted to be:
A kind of lead frame of multi-chip integrated circuit comprises pin, sideband, pin dowel, basic island dowel and Ji Dao, also is provided with two Ji Dao on the right of Ji Dao, and two Ji Dao on the right link together, and pin is connected with the Ji Dao on the right respectively.
Be respectively arranged with pin bores on the described pin.
Adopt above structure, lead frame of multi-chip integrated circuit of the present invention is compared with the circuit of single-chip integrated lead frame of prior art, has following beneficial effect:
1, function is complete, and the scope of application is wide, and a plurality of Ji Dao are arranged on the circuit lead frame of the present invention, and 1-3 chip can be installed, and not only can make power amplifier, and can make power supervisor, realizes the low pressure conversion.
2, volume is little, and the encapsulation number of times is few, and cost is low, in a packaging body a plurality of chips is arranged, and is equivalent to make up a plurality of electric elements, has saved material.
3, safe and reliable, long service life.
Description of drawings
Fig. 1 is the front view of lead frame of multi-chip integrated circuit of the present invention;
Fig. 2 is the left view of Fig. 1;
Fig. 3 is the front view of the present invention's two chip circuit lead frames.
Be labeled as among the figure: 1-pin, 2-pin, 3-pin, 4-pin, 5-sideband, 6-pin dowel, 7-pin bores, 8-base island dowel, 9-Ji Dao, 10-Ji Dao, 11-chip installation position, 12-Ji Dao, 13-pin, 14-pin, 15-pin, 16-pin.
Embodiment
The present invention is further illustrated below in conjunction with drawings and Examples
Situation shown in Figure 2 as Fig. 1, that it is combined for two lead frames of the present invention.Each circuit lead frame comprises pin 1,2,3,4,13,14,15,16, sideband 5, pin muscle 6, basic island dowel 8, basic island 9,10,12, pin 1,2,3,4,13,14,15,16 respectively is provided with a pin bores 7, so that pin and packaging body are fixing reliable after encapsulation.Pin 1,2,3,4 and pin 13,14,15,16 are separately positioned on the both sides on basic island 9,10,12, with pin muscle 6 it are connected with sideband 5, and the basic island of 9 usefulness, basic island dowel 8 is connected with sideband 5.Base island 10 is an integral body with basic island 12, and pin 13,14 is connected with basic island 10 respectively, and pin 15 is connected with basic island 12, and a chip installation position 11 respectively is set on basic island 9, basic island 10 and the basic island 12, so that three chips to be installed.
Be illustrated in figure 3 as the situation of two chip circuit lead frames, basic island 10 is what to separate with basic island 12, and a chip installation position, all the other same Fig. 1 respectively are set on basic island 9 and basic island 10.
Claims (3)
1. lead frame of multi-chip integrated circuit, comprise pin (1,2,3,4,13,14,15,16), sideband (5), pin dowel (6), basic island dowel (8) and Ji Dao (9), it is characterized in that: also be provided with Ji Dao (10) and Ji Dao (12) on the right of Ji Dao (9), Ji Dao (10) and Ji Dao (12) link together, pin (13,14) is connected with Ji Dao (10) respectively, and pin (15) is connected with Ji Dao (12).
2. lead frame of multi-chip integrated circuit according to claim 1 is characterized in that: described Ji Dao (10) and Ji Dao (12) are separated from each other.
3. lead frame of multi-chip integrated circuit according to claim 1 and 2 is characterized in that: described pin is respectively arranged with pin hole (7) on (1,2,3,4,13,14,15,16).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200810147806 CN101752341A (en) | 2008-12-09 | 2008-12-09 | Lead frame of multi-chip integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200810147806 CN101752341A (en) | 2008-12-09 | 2008-12-09 | Lead frame of multi-chip integrated circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101752341A true CN101752341A (en) | 2010-06-23 |
Family
ID=42479054
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200810147806 Pending CN101752341A (en) | 2008-12-09 | 2008-12-09 | Lead frame of multi-chip integrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101752341A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102034783A (en) * | 2010-10-28 | 2011-04-27 | 吴江巨丰电子有限公司 | Seven-pin lead frame |
| CN102368492A (en) * | 2011-10-25 | 2012-03-07 | 张轩 | Triode lead frame with lead hole |
| CN105789169A (en) * | 2016-05-19 | 2016-07-20 | 中国电子科技集团公司第五十八研究所 | Lead frame structure for lead packaging |
| CN106158809A (en) * | 2015-04-24 | 2016-11-23 | 特科芯有限公司 | TSOP-48L chip package increases the error-proof structure of identification point |
| CN108257881A (en) * | 2018-01-03 | 2018-07-06 | 四川明泰电子科技有限公司 | A kind of TDIP8L chip packaging methods |
| CN110752197A (en) * | 2019-09-30 | 2020-02-04 | 华为技术有限公司 | Lead frame, packaged integrated circuit board, power supply chip and packaging method of circuit board |
| CN113410202A (en) * | 2021-06-15 | 2021-09-17 | 江苏兴宙微电子有限公司 | Lead frame and semiconductor chip |
-
2008
- 2008-12-09 CN CN 200810147806 patent/CN101752341A/en active Pending
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102034783A (en) * | 2010-10-28 | 2011-04-27 | 吴江巨丰电子有限公司 | Seven-pin lead frame |
| CN102034783B (en) * | 2010-10-28 | 2012-03-28 | 吴江巨丰电子有限公司 | Seven-pin lead frame |
| CN102368492A (en) * | 2011-10-25 | 2012-03-07 | 张轩 | Triode lead frame with lead hole |
| CN106158809A (en) * | 2015-04-24 | 2016-11-23 | 特科芯有限公司 | TSOP-48L chip package increases the error-proof structure of identification point |
| CN105789169A (en) * | 2016-05-19 | 2016-07-20 | 中国电子科技集团公司第五十八研究所 | Lead frame structure for lead packaging |
| CN105789169B (en) * | 2016-05-19 | 2019-05-03 | 中国电子科技集团公司第五十八研究所 | A kind of lead frame structure of leaded package |
| CN108257881A (en) * | 2018-01-03 | 2018-07-06 | 四川明泰电子科技有限公司 | A kind of TDIP8L chip packaging methods |
| CN110752197A (en) * | 2019-09-30 | 2020-02-04 | 华为技术有限公司 | Lead frame, packaged integrated circuit board, power supply chip and packaging method of circuit board |
| US11887918B2 (en) | 2019-09-30 | 2024-01-30 | Huawei Technologies Co., Ltd. | Lead frame, packaged integrated circuit board, power chip, and circuit board packaging method |
| CN113410202A (en) * | 2021-06-15 | 2021-09-17 | 江苏兴宙微电子有限公司 | Lead frame and semiconductor chip |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| DD01 | Delivery of document by public notice |
Addressee: Shi Chengzhi Document name: Notification of before Expiration of Request of Examination as to Substance |
|
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| DD01 | Delivery of document by public notice |
Addressee: Shi Chengzhi Document name: Notification of Decision on Request for Restoration of Right Addressee: Shi Chengzhi Document name: Notification of Patent Invention Entering into Substantive Examination Stage |
|
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20100623 |