CN202025744U - Printed circuit board and crystal grain connecting structure - Google Patents
Printed circuit board and crystal grain connecting structure Download PDFInfo
- Publication number
- CN202025744U CN202025744U CN 201120063489 CN201120063489U CN202025744U CN 202025744 U CN202025744 U CN 202025744U CN 201120063489 CN201120063489 CN 201120063489 CN 201120063489 U CN201120063489 U CN 201120063489U CN 202025744 U CN202025744 U CN 202025744U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- crystal grain
- printed circuit
- syndeton
- pcb
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/4824—Connecting between the body and an opposite side of the item with respect to the body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73215—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
Abstract
The utility model discloses a printed circuit board and crystal grain connecting structure, which comprises a circuit board and a crystal grain, wherein a circuit layout layer is arranged on one surface of the circuit board; the crystal grain is connected onto the one surface of the circuit board; an input/output contact is arranged on one surface of the crystal grain; a wiring layer is arranged on one surface of the input/output contact; and a plurality of connecting pads connected with the circuit layout layer are arranged on the wiring layer. Therefore, a shortest package line is formed between the circuit board and the grain crystal, and the efficacies of higher output speed, lower package cost, higher work speed and higher working efficiency are achieved.
Description
Technical field
The utility model relates to a kind of printed circuit board (PCB) and crystal grain syndeton, especially refer to that a kind of circuit board and intercrystalline of making has the encapsulation circuit of shortization, and reach the speed of response comparatively fast, packaging cost is lower, operating rate is very fast and operating frequency is higher effect person.
Background technology
The general printed circuit board (PCB) and the crystal grain syndeton (as shown in Figure 2) of usefulness, it includes a circuit board 3 and a crystal grain 4 constitutes; Wherein the bottom surface of this circuit board 3 is provided with a circuit layout layer 31, and offers at least one perforation 32 on this circuit board 3, and these circuit layout layer 31 bottom surfaces are provided with most tin balls 33; This crystal grain 4 is connected on circuit board 3 one sides in addition; these crystal grain 4 bottom surfaces are provided with I/O contact 41; and this I/O contact 41 is connected with the circuit layout layer 31 of circuit board 3 bottom surfaces in the mode of beating gold thread 42 through perforation; flow into perforation 32 by protection glue 43 more afterwards gold thread 42 encapsulated and form protection; so, can reach the effect of circuit board 3 and crystal grain 4 encapsulation.
Right packaged type with above-mentioned usefulness, because this circuit board 3 is to cooperate the mode of 32 dozens of gold threads 42 of perforation to be connected with crystal grain 4, flowing into perforation 32 with protection glue 43 is more afterwards encapsulated, therefore, the speed of the encapsulation output when not only make making is slower, and more can cause the too high situation of packaging cost because of complicated man-hour and operation; Moreover being connected in the mode of beating gold thread 42 then can be longer because of the encapsulation circuit, and causes that the shortcoming that operating rate is relatively poor and operating frequency is lower is arranged; So the printed circuit board (PCB) of general usefulness and crystal grain syndeton are than can't realistic use required.
Summary of the invention
The utility model main purpose is, provide a kind of circuit board and intercrystalline of making to have the encapsulation circuit of shortization, and reach printed circuit board (PCB) and the crystal grain syndeton that the speed of response is very fast, packaging cost is lower, operating rate is very fast and operating frequency is higher.
For reaching above-mentioned purpose, the utility model is a kind of printed circuit board (PCB) and crystal grain syndeton, includes a circuit board, and its one side is provided with the circuit layout layer; And a crystal grain, be connected on the one side of circuit board, and have the I/O contact on the one side of this crystal grain, and the one side of this I/O contact is provided with the wiring layer, and be provided with most connection pads that are connected with the circuit layout layer of foregoing circuit plate in this wiring layer.
In an embodiment of the present utility model, the another side of this circuit board is provided with another circuit layout layer, and this another circuit layout layer is provided with most connecting portions.
In an embodiment of the present utility model, each connecting portion can be the tin ball.
In an embodiment of the present utility model, this crystal grain can be the dynamic chip of double data sync (DoubleData Rate, DDR chip).
In an embodiment of the present utility model, can be coated with a housing on the lateral surface of this crystal grain, and this connection pad exposes this housing.
In an embodiment of the present utility model, this crystal grain cooperates connection pad to be connected with the circuit layout layer of circuit board in surface mount (SMT) mode.
In an embodiment of the present utility model, this connection pad can be the tin ball.
Compared with prior art, the beneficial effect that the utility model had is: have the I/O contact on the one side of the utility model crystal grain, and the one side of this I/O contact is provided with the wiring layer, and be provided with most connection pads that are connected with the circuit layout layer of circuit board in this wiring layer, the utility model just makes circuit board and intercrystalline have the encapsulation circuit of shortization like this, and the speed of response is very fast, packaging cost is lower, operating rate is very fast and operating frequency is higher and reach.
Description of drawings
Fig. 1 is the utility model generalized section.
Fig. 2 is the generalized section of usefulness.
Label declaration:
Circuit board 1;
Connecting portion 121;
I/O contact 21;
I/O contact 41;
Embodiment
See also shown in Figure 1ly, be generalized section of the present utility model.As shown in the figure: the utility model is a kind of printed circuit board (PCB) and crystal grain syndeton, and it comprises a circuit board 1 at least and a crystal grain 2 constitutes.
The above-mentioned circuit board of carrying 1 its one side is provided with circuit layout layer 11, and the another side of this circuit board 1 is provided with another circuit layout layer 12, and this another circuit layout layer 12 is provided with most connecting portions 121, and each connecting portion 121 can be the tin ball.
This crystal grain 2 can be the dynamic chip of double data sync (Double Data Rate; as: the DDR chip); and this crystal grain 2 is connected on the one side of circuit board 1; and has I/O contact 21(I/O contact on the one side of this crystal grain 2); the one side of this I/O contact 21 is provided with wiring layer 22; and be provided with most connection pads 23 that are connected with circuit layout layer 11 in this wiring layer 22; and this connection pad 23 can be the tin ball; on the lateral surface of this crystal grain 2, can be coated with a housing 24 in addition; as the usefulness of crystal grain 2 protections, and this connection pad 23 exposes this housing.In this way, constitute a brand-new printed circuit board (PCB) and a crystal grain syndeton by above-mentioned structure.
When circuit board of the present utility model 1 with crystal grain 2 during in encapsulation, system is arranged at each connection pad 23 correspondence on the crystal grain 2 set wiring layers 22 on the circuit layout layer 11 of circuit board 1, afterwards again in surface mount (SMT) mode, make this crystal grain 2 cooperate each connection pad 23 to be connected with the circuit layout layer 11 of circuit board 1, so, can finish the encapsulation of circuit board 1 and crystal grain 2, afterwards again according to required and utilize the connecting portion 121 of set another circuit layout layer 12 on this circuit board 1 another side to be connected use (scheming not show) with other electronic equipment, and then replace with the connected mode of beating gold thread, and make circuit board 1 and 2 of crystal grain have the encapsulation circuit of shortization, and by this encapsulation circuit of shortization to reach the speed of response very fast, packaging cost is lower, very fast and the higher effect of operating frequency of operating rate.
In sum, the utility model printed circuit board (PCB) and crystal grain syndeton can effectively be improved the various shortcoming of usefulness, can make circuit board and intercrystalline have the encapsulation circuit of shortization, and reach the effect that the speed of response is very fast, packaging cost is lower, operating rate is very fast and operating frequency is higher.
Claims (7)
1. printed circuit board (PCB) and crystal grain syndeton include:
One circuit board, its one side is provided with the circuit layout layer; And
One crystal grain is connected on the one side of circuit board, and has the I/O contact on the one side of this crystal grain, and the one side of this I/O contact is provided with the wiring layer, and is provided with most connection pads that are connected with the circuit layout layer of foregoing circuit plate in this wiring layer.
2. printed circuit board (PCB) according to claim 1 and crystal grain syndeton is characterized in that, the another side of this circuit board is provided with another circuit layout layer, and this another circuit layout layer is provided with most connecting portions.
3. printed circuit board (PCB) according to claim 2 and crystal grain syndeton is characterized in that, each connecting portion is the tin ball.
4. printed circuit board (PCB) according to claim 1 and crystal grain syndeton is characterized in that, this crystal grain is the dynamic chip of double data sync.
5. printed circuit board (PCB) according to claim 1 and crystal grain syndeton is characterized in that, be coated with a housing on the lateral surface of this crystal grain, and this connection pad expose this housing.
6. printed circuit board (PCB) according to claim 1 and crystal grain syndeton is characterized in that, this crystal grain cooperates connection pad to be connected with the circuit layout layer of circuit board in the surface mount mode.
7. printed circuit board (PCB) according to claim 1 and crystal grain syndeton is characterized in that, this connection pad is the tin ball.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201120063489 CN202025744U (en) | 2011-03-11 | 2011-03-11 | Printed circuit board and crystal grain connecting structure |
| TW100210004U TWM416867U (en) | 2011-03-11 | 2011-06-02 | Connection structure of printed circuit board and grain |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201120063489 CN202025744U (en) | 2011-03-11 | 2011-03-11 | Printed circuit board and crystal grain connecting structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202025744U true CN202025744U (en) | 2011-11-02 |
Family
ID=44850686
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201120063489 Expired - Fee Related CN202025744U (en) | 2011-03-11 | 2011-03-11 | Printed circuit board and crystal grain connecting structure |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN202025744U (en) |
| TW (1) | TWM416867U (en) |
-
2011
- 2011-03-11 CN CN 201120063489 patent/CN202025744U/en not_active Expired - Fee Related
- 2011-06-02 TW TW100210004U patent/TWM416867U/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| TWM416867U (en) | 2011-11-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20111102 Termination date: 20180311 |