CN201956344U - Compatible packaging structure of driving bare chip and patch - Google Patents
Compatible packaging structure of driving bare chip and patch Download PDFInfo
- Publication number
- CN201956344U CN201956344U CN 201020670697 CN201020670697U CN201956344U CN 201956344 U CN201956344 U CN 201956344U CN 201020670697 CN201020670697 CN 201020670697 CN 201020670697 U CN201020670697 U CN 201020670697U CN 201956344 U CN201956344 U CN 201956344U
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- CN
- China
- Prior art keywords
- patch
- bonding pad
- chip
- pin bonding
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Wire Bonding (AREA)
Abstract
The utility model relates to an electronic integrated-circuit chip (IC), in particular to a packaging structure of a bare chip and a patch. A compatible packaging structure of a driving bare chip and the patch disclosed by the utility model is that: a first pin bonding pad is arranged around a chip positioning block, the driving bare chip is electrically connected onto the corresponding first pin bonding pad through a lacing wire, a patch positioning block is also arranged at the periphery of the pin bonding pad, a second pin bonding pad is arranged outside the patch positioning block, and the first pin bonding pad is electrically connected onto the corresponding second pin bonding pad through a copper-foil wire. Since the technical scheme is adopted by the utility model, chips with different bare-chip and patch structures of the same kind of IC can be compatibly packaged by only needing to design one kind of PCB (Printed Circuit Board), the production cost is greatly lowered, and the assembling and packaging operation is facilitated.
Description
Technical field
The utility model relates to electronic integrated circuit chip (IC), relates in particular to the encapsulating structure of nude film and paster.
Background technology
In the production of circuit board, the IC's of corresponding identical function can be by the paster of nude film or encapsulation.Need in the actual production to relate to two corresponding pcb board of design, to adapt to different IC structures according to the difference of the different sources of supply of IC nude film or paster.This often causes the not convenient property of the raising and the assembling encapsulation of production cost.
The utility model content
Therefore, at the problems referred to above, the utility model proposes the encapsulating structure of a kind of while IC-compatible nude film or paster.
The utility model adopts following technical scheme:
Around the chip locating piece, be provided with the first pin pad, driving nude film is electrically connected on the corresponding first pin pad by the lashing wire silk, also be provided with a paster locating piece in the periphery of pin pad, the paster locating piece is provided with the second pin pad outward, and the described first pin pad is electrically connected at the corresponding second pin pad by the Copper Foil cabling.
The utility model adopts as above technical scheme, only needs a pcb board of design, can reduce production costs greatly and encapsulation operation convenient for assembly with the compatible encapsulation of chip of different nude films or the paster structure of money IC.
Description of drawings
Fig. 1 is a structural representation of the present utility model.
Embodiment
Now with embodiment the utility model is further specified in conjunction with the accompanying drawings.
Consult shown in Figure 1, around chip locating piece 1, be provided with the first pin pad 2, driving nude film is electrically connected on the corresponding first pin pad 2 by the lashing wire silk, also be provided with a paster locating piece 3 in the periphery of the first pin pad 2, be provided with the second pin pad 4 outside the paster locating piece 3, the described first pin pad 2 is electrically connected at the corresponding second pin pad 4 by the Copper Foil cabling.
When the utility model is used for encapsulation driving nude film, the nude film positioning and fixing on chip locating piece 1, will be driven nude film again and will be electrically connected on the corresponding first pin pad 2 by the lashing wire silk.When the utility model is used for encapsulation driving paster, the paster positioning and fixing on paster locating piece 3, will be driven paster again and directly will be welded on the second pin pad 4.Because the described first pin pad 2 is electrically connected at the corresponding second pin pad 4 by the Copper Foil cabling, no matter be that the employing nude film encapsulates or the paster encapsulation all can be with in the electrical place in circuit of this chip therefore.
Although specifically show and introduced the utility model in conjunction with preferred embodiment; but the those skilled in the art should be understood that; in the spirit and scope of the present utility model that do not break away from appended claims and limited; can make various variations to the utility model in the form and details, be protection range of the present utility model.
Claims (1)
1. compatible encapsulating structure that drives nude film and paster, it is characterized in that: be provided with the first pin pad (2) all around at chip locating piece (1), driving nude film is electrically connected on the corresponding first pin pad (2) by the lashing wire silk, also be provided with a paster locating piece (3) in the periphery of pin pad (2), paster locating piece (3) is outer to be provided with the second pin pad (4), and the described first pin pad (2) is electrically connected at the corresponding second pin pad (4) by the Copper Foil cabling.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201020670697 CN201956344U (en) | 2010-12-17 | 2010-12-17 | Compatible packaging structure of driving bare chip and patch |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201020670697 CN201956344U (en) | 2010-12-17 | 2010-12-17 | Compatible packaging structure of driving bare chip and patch |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201956344U true CN201956344U (en) | 2011-08-31 |
Family
ID=44500446
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201020670697 Expired - Fee Related CN201956344U (en) | 2010-12-17 | 2010-12-17 | Compatible packaging structure of driving bare chip and patch |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201956344U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115529724A (en) * | 2022-03-28 | 2022-12-27 | 荣耀终端有限公司 | Circuit board structure, chip system and electronic equipment |
-
2010
- 2010-12-17 CN CN 201020670697 patent/CN201956344U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115529724A (en) * | 2022-03-28 | 2022-12-27 | 荣耀终端有限公司 | Circuit board structure, chip system and electronic equipment |
| CN115529724B (en) * | 2022-03-28 | 2023-08-08 | 荣耀终端有限公司 | Circuit board structure, chip system and electronic equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110831 Termination date: 20131217 |