JP2005150283A5 - - Google Patents

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Publication number
JP2005150283A5
JP2005150283A5 JP2003383617A JP2003383617A JP2005150283A5 JP 2005150283 A5 JP2005150283 A5 JP 2005150283A5 JP 2003383617 A JP2003383617 A JP 2003383617A JP 2003383617 A JP2003383617 A JP 2003383617A JP 2005150283 A5 JP2005150283 A5 JP 2005150283A5
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JP
Japan
Prior art keywords
bga package
pad
pads
circuit component
electronic device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2003383617A
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Japanese (ja)
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JP2005150283A (en
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Publication date
Application filed filed Critical
Priority to JP2003383617A priority Critical patent/JP2005150283A/en
Priority claimed from JP2003383617A external-priority patent/JP2005150283A/en
Publication of JP2005150283A publication Critical patent/JP2005150283A/en
Publication of JP2005150283A5 publication Critical patent/JP2005150283A5/ja
Pending legal-status Critical Current

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Claims (10)

内部に半導体ＩＣを収容し、底面に他の装置との接続のための複数のパッドが設けられたＢＧＡパッケージにおいて、
前記複数のパッドのうちの少なくとも１つに、回路部品が接続されたことを特徴とするＢＧＡパッケージ。 In a BGA package in which a semiconductor IC is accommodated and a plurality of pads are provided on the bottom surface for connection to other devices.
A BGA package, wherein a circuit component is connected to at least one of the plurality of pads. 前記回路部品の一方の端子は、前記ＢＧＡパッケージのパッドに接続され、他方の端子は前記他の装置に接続されることを特徴とする請求項１記載のＢＧＡパッケージ。   2. The BGA package according to claim 1, wherein one terminal of the circuit component is connected to a pad of the BGA package, and the other terminal is connected to the other device. 前記回路部品は、前記ＢＧＡパッケージの複数のパッドのうちの隣接するパッド間に接続されることを特徴とする請求項１記載のＢＧＡパッケージ。   2. The BGA package according to claim 1, wherein the circuit component is connected between adjacent pads of the plurality of pads of the BGA package. 前記回路部品は複数あることを特徴とする請求項１乃至３のいずれかに記載のＢＧＡパッケージ。   4. The BGA package according to claim 1, wherein there are a plurality of the circuit components. 前記回路部品は、バイパスコンデンサ、抵抗、コイルのうちの少なくとも１つであることを特徴とする請求項１乃至４のいずれかに記載のＢＧＡパッケージ。   The BGA package according to any one of claims 1 to 4, wherein the circuit component is at least one of a bypass capacitor, a resistor, and a coil. 内部に半導体ＩＣを収容し、底面に他の装置との接続のための複数のパッドが設けられたＢＧＡパッケージと、  A BGA package containing a semiconductor IC therein and provided with a plurality of pads on the bottom surface for connection to other devices;
前記ＢＧＡパッケージが搭載される複数のパッドを備えたプリント基板とを有する電子装置において、  In an electronic device having a printed circuit board having a plurality of pads on which the BGA package is mounted,
前記ＢＧＡパッケージの第一のパッドと、前記第一のパッドに対向する前記プリント基板上の第二のパッドとの間に、前記ＢＧＡパッケージと前記プリント基板とを接続する回路部品が取付けられたことを特徴とする電子装置。  A circuit component for connecting the BGA package and the printed board is attached between the first pad of the BGA package and the second pad on the printed board facing the first pad. An electronic device characterized by the above. 前記回路部品は、バイパスコンデンサ、抵抗あるいはコイルのいずれか一つであることを特徴とする請求項６記載の電子装置。  The electronic device according to claim 6, wherein the circuit component is any one of a bypass capacitor, a resistor, and a coil. 内部に半導体ＩＣを収容し、底面に他の装置との接続のための複数のパッドが設けられたＢＧＡパッケージと、  A BGA package containing a semiconductor IC therein and provided with a plurality of pads on the bottom surface for connection to other devices;
前記ＢＧＡパッケージが搭載される複数のパッドを備えたプリント基板とを有する電子装置において、  In an electronic device having a printed circuit board having a plurality of pads on which the BGA package is mounted,
前記ＢＧＡパッケージの第一のパッドと第二のパッドとの間に、前記第一のパッドと前記第二のパッドとを接続する回路部品が取付けられていることを特徴とする電子装置。  An electronic device, wherein a circuit component for connecting the first pad and the second pad is attached between the first pad and the second pad of the BGA package. 前記第一のパッドと前記第二のパッドとは互いに隣接していることを特徴とする請求項８記載の電子装置。  The electronic device according to claim 8, wherein the first pad and the second pad are adjacent to each other. 前記回路部品は、バイパスコンデンサ、抵抗あるいはコイルのいずれか一つであることを特徴とする請求項８記載の電子装置。  9. The electronic device according to claim 8, wherein the circuit component is one of a bypass capacitor, a resistor, and a coil.
JP2003383617A 2003-11-13 2003-11-13 Bga package Pending JP2005150283A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003383617A JP2005150283A (en) 2003-11-13 2003-11-13 Bga package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003383617A JP2005150283A (en) 2003-11-13 2003-11-13 Bga package

Publications (2)

Publication Number Publication Date
JP2005150283A JP2005150283A (en) 2005-06-09
JP2005150283A5 true JP2005150283A5 (en) 2006-11-24

Family

ID=34692286

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003383617A Pending JP2005150283A (en) 2003-11-13 2003-11-13 Bga package

Country Status (1)

Country Link
JP (1) JP2005150283A (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4817110B2 (en) * 2005-12-26 2011-11-16 株式会社村田製作所 Multilayer circuit board and IC package
JP2007250928A (en) * 2006-03-17 2007-09-27 Mitsubishi Electric Corp Multilayer printed wiring board
WO2016052221A1 (en) 2014-09-30 2016-04-07 株式会社村田製作所 Semiconductor package and mounting structure thereof
CN117133545A (en) * 2017-05-15 2023-11-28 京瓷Avx元器件公司 Multilayer capacitor and circuit board including the same
WO2020250947A1 (en) * 2019-06-14 2020-12-17 キヤノン株式会社 Semiconductor module manufacturing method, electronic device manufacturing method, semiconductor module, and electronic device
CN117941273A (en) * 2021-08-20 2024-04-26 株式会社村田制作所 High frequency module

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