JP2001298112A5 - - Google Patents
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- Publication number
- JP2001298112A5 JP2001298112A5 JP2000110527A JP2000110527A JP2001298112A5 JP 2001298112 A5 JP2001298112 A5 JP 2001298112A5 JP 2000110527 A JP2000110527 A JP 2000110527A JP 2000110527 A JP2000110527 A JP 2000110527A JP 2001298112 A5 JP2001298112 A5 JP 2001298112A5
- Authority
- JP
- Japan
- Prior art keywords
- chip
- interposer
- electronic component
- mounting surface
- bump
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims 10
- 230000000875 corresponding Effects 0.000 claims 6
- 230000002093 peripheral Effects 0.000 claims 6
- 230000005611 electricity Effects 0.000 claims 1
Claims (6)
前記導通パターンにおける前記ＩＣチップの周部に対応する部分を、前記インターポーザにおける前記チップ搭載面とは反対側の面部に電気導通しないように構成したことを特徴とする電子部品。 An electronic component having an IC chip mounted on a conduction pattern provided on a chip mounting surface of an interposer,
An electronic component configured such that a portion corresponding to a peripheral portion of the IC chip in the conductive pattern is not electrically connected to a surface portion of the interposer opposite to the chip mounting surface .
前記インターポーザの前記ＩＣチップの周部に対応する部分に前記はんだバンプを設けないようにしたことを特徴とする電子部品。An electronic component in which an IC chip is mounted on an interposer and solder bumps are provided on a surface portion opposite to the chip mounting surface of the interposer,
An electronic component wherein the solder bumps are not provided in a portion corresponding to a peripheral portion of the IC chip of the interposer.
前記インターポーザの前記ＩＣチップの周部に対応する部分に設けた前記はんだバンプのバンプ径を他の前記はんだバンプのバンプ径より大きくしたことを特徴とする電子部品。An electronic component in which an IC chip is mounted on an interposer and solder bumps are provided on a surface portion opposite to the chip mounting surface of the interposer,
An electronic component, wherein a bump diameter of the solder bump provided in a portion corresponding to a peripheral portion of the IC chip of the interposer is made larger than a bump diameter of the other solder bump.
前記電子部品が、インターポーザのチップ搭載面に設けた導通パターン上にＩＣチップを搭載しており、前記導通パターンにおける前記ＩＣチップの周部に対応する部分を、前記インターポーザにおける前記チップ搭載面とは反対側の面部に電気導通しないように構成したことを特徴とする電子部品の実装構造。An electronic component mounting structure in which electronic components are mounted on a mounting surface of a printed wiring board,
The electronic component has an IC chip mounted on a conductive pattern provided on the chip mounting surface of the interposer , and a portion corresponding to the peripheral portion of the IC chip in the conductive pattern is the chip mounting surface of the interposer. A mounting structure for an electronic component, characterized in that it is configured not to conduct electricity to the opposite surface portion .
前記電子部品が、インターポーザにＩＣチップを搭載し且つ前記インターポーザのチップ搭載面とは反対側の面部にはんだバンプを有しており、前記インターポーザの前記ＩＣチップの周部に対応する部分に前記はんだバンプを設けないようにした構成であることを特徴とする電子部品の実装構造。An electronic component mounting structure in which electronic components are mounted on a mounting surface of a printed wiring board,
The electronic component has an IC chip mounted on an interposer, and has solder bumps on the surface of the interposer opposite to the chip mounting surface, and the solder corresponding to the peripheral portion of the IC chip of the interposer. A mounting structure for electronic components, characterized in that no bump is provided.
前記電子部品が、インターポーザにＩＣチップを搭載し且つ前記インターポーザのチップ搭載面とは反対側の面部にはんだバンプを有しており、前記インターポーザの前記ＩＣチップの周部に対応する部分に設けた前記はんだバンプのバンプ径を他の前記はんだバンプのバンプ径より大きくした構成であることを特徴とする電子部品の実装構造。An electronic component mounting structure in which electronic components are mounted on a mounting surface of a printed wiring board,
The electronic component has an IC chip mounted on the interposer and has a solder bump on the surface of the interposer opposite to the chip mounting surface, and is provided in a portion corresponding to the peripheral portion of the IC chip of the interposer. A mounting structure of an electronic component, wherein the bump diameter of the solder bump is larger than the bump diameter of the other solder bump.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000110527A JP2001298112A (en) | 2000-04-12 | 2000-04-12 | Electronic component and mounting structure of this electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000110527A JP2001298112A (en) | 2000-04-12 | 2000-04-12 | Electronic component and mounting structure of this electronic component |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001298112A JP2001298112A (en) | 2001-10-26 |
| JP2001298112A5 true JP2001298112A5 (en) | 2005-04-21 |
Family
ID=18623021
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000110527A Pending JP2001298112A (en) | 2000-04-12 | 2000-04-12 | Electronic component and mounting structure of this electronic component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2001298112A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8525333B2 (en) | 2008-03-17 | 2013-09-03 | Renesas Electronics Corporation | Electronic device and manufacturing method therefor |
-
2000
- 2000-04-12 JP JP2000110527A patent/JP2001298112A/en active Pending
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