CN212461714U

CN212461714U - LED lamp bead and LED display structure

Info

Publication number: CN212461714U
Application number: CN202020802585.XU
Authority: CN
Inventors: 陈倏贤; 何昆鹏; 王启权; 吴涵渠
Original assignee: Shenzhen Aoto Electronics Co Ltd
Current assignee: Shenzhen Aoto Electronics Co Ltd
Priority date: 2020-05-14
Filing date: 2020-05-14
Publication date: 2021-02-02
Anticipated expiration: 2030-05-14

Abstract

The application relates to an LED lamp bead and an LED display structure. The LED lamp bead comprises a support, a light-emitting chip and pins, the support is provided with a light-emitting surface, the light-emitting chip is fixed on the light-emitting surface, the pins are arranged on the support, the light-emitting chip is electrically connected to the pins, an installation position is arranged on one side of the support, which is far away from the light-emitting surface, and at least part of the pins are contained in the installation position and are fixedly connected to the support. The LED display structure at least comprises a PCB, LED lamp beads and a glue filling sealing layer, wherein the LED lamp bead array is arranged on the PCB, the glue filling sealing layer is arranged on the PCB and filled in gaps among the LED lamp beads, and the thickness of the glue filling sealing layer meets the requirement of at least covering the installation positions of the LED lamp beads. Because the LED lamp bead is provided with the installation position, when glue is poured, the difficulty of glue pouring is greatly reduced, the quality of the glue pouring is improved, and the waterproof effect of the LED display structure is ensured.

Description

LED lamp bead and LED display structure

Technical Field

The application relates to the field of LED display, in particular to an LED lamp bead and an LED display structure.

Background

At present outdoor LED display screen, the protection of module lamp pearl generally adopts ripe casting glue technology, covers the pin of LED lamp pearl through the casting glue, plays waterproof effect. Receive the restriction of lamp pearl encapsulating protection technology, generally the point interval can not be done too little, because the point interval is too little, when the encapsulating, glue receives surface tension's influence in the gap, can not normally flow, can not cover the lamp pearl pin completely, influences the waterproof reliability of module.

However, the requirement for the space is smaller and smaller due to market demands, gaps among the lamp beads are also smaller and are influenced by the surface tension of the pouring sealant, and when the gaps are small, the pouring sealant cannot flow well, so that the pins of the lamp beads cannot be completely covered easily, and the pins are exposed in the air, so that the waterproof reliability of the product is seriously influenced.

Disclosure of Invention

Based on this, it is necessary to reduce the problem that influences waterproof reliability to the point interval of module, provides a LED lamp pearl and LED display structure.

The first aspect of the application provides an LED lamp pearl, including support, luminous chip and pin, the support has a play plain noodles, luminous chip is fixed in go out on the plain noodles, the pin set up in on the support, luminous chip electricity connect in the pin, the support deviate from one side of going out the plain noodles is provided with the installation position, the pin at least part accept in the installation position to fixed connection in the support.

In one embodiment, the bracket is in a square block shape, the mounting positions are arranged corresponding to four corners of the bracket, so that the bracket forms a stepped structure at the mounting positions, and the pins are fixed by the stepped structure.

In one embodiment, the installation position satisfies the following conditions: when the pins are fixed, the parts of the pins in the mounting positions are completely accommodated in the mounting positions and are not exposed out of the bracket.

In one embodiment, the bracket includes a first branch body and a second branch body, the first branch body is fixedly connected to the second branch body, the light emitting chip is disposed on an end surface of the first branch body away from the second branch body, and the pin is fixed on the second branch body;

the first branch body and the second branch body are provided with side faces, and the side face with at least one second branch body is concave relative to the side face of the first branch body to form the mounting position.

In one embodiment, the pin is L-shaped, and includes a first folded edge and a second folded edge, the first folded edge is perpendicular to the second folded edge, the first folded edge is accommodated in the mounting position and is fixedly connected to the bracket, and the second folded edge is fixed on an end surface of the bracket away from the light emitting surface.

In one embodiment, an end surface of the bracket, which faces away from the light exit surface, is provided with an accommodating groove, the accommodating groove is communicated with the mounting position, and the second flange is accommodated in the accommodating groove.

In one embodiment, the light emitting chip is disposed on the light emitting surface.

In one embodiment, a lamp cup is further arranged on the support, and the light-emitting chip is arranged in the lamp cup.

Above-mentioned LED lamp pearl is through setting up the installation position for in the pin can not lean out the installation position, then when the subsides dress formed the booth apart from the display screen, the pin can not enter into between two adjacent LED lamp pearls, therefore, when carrying out the encapsulating, the pin can not cause the influence to glue flow in the clearance between two LED lamp pearls, glue can be with comparatively full of the clearance packing between two LED lamp pearls. Simultaneously, the setting of installation position for even the tin cream climbs along the pin, also can not cause the influence to the flow of glue in the clearance between two LED lamp pearls.

The second aspect of the application provides a LED display structure, includes PCB board, LED lamp pearl and encapsulating sealing layer at least, wherein, LED lamp pearl is aforementioned arbitrary LED lamp pearl, LED lamp pearl array set up in on the PCB board, the encapsulating sealing layer set up in on the PCB board, fill in the clearance between the LED lamp pearl, just the thickness of encapsulating sealing layer satisfies and covers at least the installation position of LED lamp pearl.

In one embodiment, the installation positions of the LED lamp beads are communicated with two gaps on two adjacent sides of the LED lamp beads.

Above-mentioned LED shows structure, because the installation position has on the LED lamp pearl, when the encapsulating, greatly reduced the degree of difficulty of encapsulating, promoted the quality of encapsulating simultaneously, ensured LED shows the water-proof effects of structure. Meanwhile, the pins are accommodated in the installation positions, so that the problem that the pins of the LED lamp beads on the outermost side of the small-space LED display product exceed the edges of the PCB is solved, the adhesive force of the LED lamp beads on the outermost side is not affected, the overall dimension of the PCB can be smaller, more space is reserved for the thin wall of the bottom shell, the wall thickness is thicker, the forming is easier, and the structure is firmer.

Drawings

Fig. 1 is a schematic structural diagram of an LED lamp bead according to an embodiment of the present application;

fig. 2 is a schematic structural diagram of the other side of the LED lamp bead according to an embodiment of the present application.

Detailed Description

To facilitate an understanding of the present application, the present application will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present application are given in the accompanying drawings. This application may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

Referring to fig. 1 and fig. 2, a schematic structural diagram of an LED lamp bead 10 according to an embodiment of the present disclosure is exemplarily shown, where the LED lamp bead 10 includes a support 110, a light emitting chip (not shown) and a pin 120, the support 110 has a light emitting surface 110a, the light emitting chip is fixed on the light emitting surface 110a of the support 110, the pin 120 is disposed on the support 110, the light emitting chip is electrically connected to the pin 120, and when the LED lamp bead 10 is mounted on a PCB, the pin 120 is electrically connected to a circuit on the PCB.

One side of the support 110 facing away from the light emitting surface may be provided with a mounting position 130, and the pin 120 is at least partially accommodated in the mounting position 130 and is fixedly connected to the support 110. For example, in the embodiment shown in fig. 1, the bracket 110 has a substantially square block shape, and the mounting locations 130 are disposed corresponding to four corners of the bracket 110, so that the bracket 110 forms a stepped structure at the mounting locations 130 and fixes the pins 120 by using the stepped structure. The mounting location 130 satisfies the following conditions: when the pin 120 is fixed, the portion of the pin 120 in the mounting position 130 is completely received in the mounting position 130 and is not exposed to the bracket 110. Through setting up installation position 130, and make pin 120 can not lean out installation position 130, then when pasting dress formation booth apart from display screen, pin 120 can not enter into between two adjacent LED lamp pearls 10, on the one hand, be favorable to further realizing the booth apart from, on the other hand, under the condition of same point interval, because pin 120 does not enter into between two adjacent LED lamp pearls 10, therefore, when encapsulating, pin 120 can not cause the influence to the flow of glue in the clearance between two LED lamp pearls 10, glue can be with the comparatively full of the clearance packing between two LED lamp pearls 10. Particularly, when LED lamp pearl 10 pastes dress PCB board on, use the solder paste welding usually, when the welding, the solder paste can climb along pin 120, if pin 120 enters into the clearance between two LED lamp pearls 10, then the circulation of glue can further be blocked to the solder paste, installation position 130's setting for even the solder paste climbs along pin 120, can not cause the influence to the flow of glue in the clearance between two LED lamp pearls 10 yet. For example, when the mounting positions 130 are disposed at four corners of the bracket 110, the mounting positions 130 have enough redundant space for receiving solder paste climbing onto the leads 120.

Further, installation position 130 communicates in the clearance between two LED lamp pearl 10, and then glue can also flow via installation position 130, further promotes the flow of glue in the clearance between two LED lamp pearl 10, can make the encapsulating more smooth and easy, and the encapsulating effect is better. For example, when the mounting positions 130 are arranged corresponding to four corners of the bracket 110, two gaps on two adjacent sides of the LED lamp beads 10 are communicated through the mounting positions 130, which is more favorable for the flow of glue in the gap between the LED lamp beads 10.

Referring to fig. 1, in one or more embodiments, the bracket 110 includes a first support 111 and a second support 113, the first support 111 is fixedly connected to the second support 113, the light emitting chip is disposed on an end surface of the first support 111 away from the second support 113, and the pin 120 is fixed on the second support 113. The first branch 111 and the second branch 113 have side surfaces, and the side surface of at least one second branch 113 is recessed relative to the side surface of the first branch 111 to form a mounting position 130. For example, in the embodiment shown in fig. 1, the first branch 111 has a substantially square shape, and the second branch 113 has a substantially octagonal prism shape, wherein four side surfaces of the second branch 113 are disposed corresponding to four corners of the first branch 111, and the remaining four side surfaces are flush with the side surfaces of the first branch 111.

The light emitting chip can be directly arranged on the light emitting surface. For example, the light emitting device can further comprise a bonding pad, wherein the bonding pad is directly fixed on the light emitting surface, and the light emitting chip is fixedly crystallized on the bonding pad.

Referring to fig. 2, the bracket 110 may further include a lamp cup 110b, and the light emitting chip is disposed in the lamp cup 110 b. For example, the bonding pad is directly disposed in the lamp cup 110b, and the light emitting chip is die-bonded to the bonding pad.

The light emitting chip is at least one of a red chip, a blue chip and a green chip. For example, in order to realize full-color display, the light-emitting chip includes a red chip, a blue chip and a green chip, chip die bonding regions are arranged on the bonding pad corresponding to the red chip, the blue chip and the green chip, and the red chip, the blue chip and the green chip are respectively attached to the same or different chip die bonding regions of the bonding pad.

Referring to fig. 1, in one or more embodiments, the pins 120 may be L-shaped to enhance the coupling force between the pins 120 and the support 110. For example, the pin 120 may include a first folded edge 121 and a second folded edge 123, the first folded edge 121 is perpendicular to the second folded edge 123, the first folded edge 121 is received in the mounting position 130 and is fixedly connected to the bracket 110, and the second folded edge 123 is fixed on an end surface of the bracket 110 that faces away from the light emitting surface.

In one or more embodiments, an end surface of the bracket 110 facing away from the light exit surface is further provided with a receiving groove 110d, the receiving groove 110d is communicated with the mounting position 130, and at least a portion of the lead 120 is received in the receiving groove 110 d. For example, the second flange 123 is received in the receiving groove 110 d. Through setting up accepting groove 110d, can be better paste LED lamp pearl 10 and paste to the PCB board on.

Above-mentioned LED lamp pearl 10, through setting up installation position 130 for pin 120 can not lean out in installation position 130, then when subsides dress formed the booth apart from the display screen, pin 120 can not enter into between two adjacent LED lamp pearls 10, therefore, when carrying out the encapsulating, pin 120 can not flow in the clearance of glue between two LED lamp pearls 10 and cause the influence, and glue can be comparatively full with the clearance packing between two LED lamp pearls 10. Meanwhile, due to the arrangement of the mounting position 130, even if the solder paste climbs along the pin 120, the flowing of the glue in the gap between the two LED lamp beads 10 is not affected.

The application also provides a LED display structure, LED display structure includes PCB board, LED lamp pearl and encapsulating sealing layer at least, wherein, LED lamp pearl be any above-mentioned embodiment LED lamp pearl 10, LED lamp pearl array sets up on the PCB board, the encapsulating sealing layer sets up on the PCB board, fills in the clearance between LED lamp pearl, and the thickness of encapsulating sealing layer satisfies the installation position that covers LED lamp pearl at least.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims

1. The LED lamp bead comprises a support, a light-emitting chip and pins, wherein the support is provided with a light-emitting surface, the light-emitting chip is fixed on the light-emitting surface, the pins are arranged on the support, and the light-emitting chip is electrically connected with the pins.

2. The LED lamp bead according to claim 1, wherein the support is in a square shape, and the mounting positions are disposed corresponding to four corners of the support, so that the support forms a stepped structure at the mounting positions, and the pins are fixed by the stepped structure.

3. The LED lamp bead according to claim 1, wherein the mounting position satisfies: when the pins are fixed, the parts of the pins in the mounting positions are completely accommodated in the mounting positions and are not exposed out of the bracket.

4. The LED lamp bead according to claim 1, wherein the support includes a first branch body and a second branch body, the first branch body is fixedly connected to the second branch body, the light emitting chip is disposed on an end surface of the first branch body away from the second branch body, and the pin is fixed on the second branch body;

5. The LED lamp bead according to claim 1, wherein the pin is L-shaped and includes a first folded edge and a second folded edge, the first folded edge is perpendicular to the second folded edge, the first folded edge is received in the mounting position and is fixedly connected to the bracket, and the second folded edge is fixed to an end surface of the bracket that is away from the light emitting surface.

6. The LED lamp bead according to claim 5, wherein an accommodating groove is formed in an end surface of the bracket facing away from the light exit surface, the accommodating groove is communicated with the mounting position, and the second flange is accommodated in the accommodating groove.

7. The LED lamp bead according to claim 1, wherein the light emitting chip is disposed on the light emitting surface.

8. The LED lamp bead according to claim 1, wherein a lamp cup is further disposed on the support, and the light emitting chip is disposed in the lamp cup.

9. An LED display structure is characterized by at least comprising a PCB (printed circuit board), LED lamp beads and a glue-pouring sealing layer, wherein the LED lamp beads are the LED lamp beads in any one of claims 1-8, the LED lamp bead array is arranged on the PCB, the glue-pouring sealing layer is arranged on the PCB and filled in gaps among the LED lamp beads, and the thickness of the glue-pouring sealing layer at least covers the installation positions of the LED lamp beads.

10. The LED display structure of claim 9, wherein the mounting locations of the LED beads communicate with two gaps on two adjacent sides of the LED beads.