CN211088299U - Light emitting diode packaging structure capable of emitting white light - Google Patents

Abstract

The utility model discloses a can send white light's emitting diode packaging structure, the substrate of installation L ED chip is distinguished by the left hand and is constituted with the right hand, L ED chip is sealed by the fluorescent glue parcel outward the utility model discloses packaging structure can make L ED produce the white light to can reduce the height of L ED encapsulation, protection L ED does not receive the pollution, reinforcing packaging structure.

Description

Light emitting diode packaging structure capable of emitting white light

Technical Field

The present invention relates to light emitting diode (L ED) technology, and more particularly, to a L ED package for emitting white light.

Background

Conventional L ED generally emits light of short wavelength such as blue, UV, bluish violet, UV, etc. rather than white light, in the L ED package of the prior art, L ED chips are mounted on the left side of a substrate with a gap between the substrate and divided into a left-hand region and a right-hand region, bottom electrodes of L ED chips are mounted on the left-hand region, top electrodes of L ED chips are connected to the right-hand region by wires, extensions of the left-hand and right-hand regions serve as terminals for surface mounting of L ED packages, the substrate and chips are encapsulated in a sealant, as shown in FIG. 2, a through hole and a notch are inserted in the substrate to fill the substrate and provide stronger adhesion, and the package cannot emit white light because L ED can generally emit only colored light.

Disclosure of Invention

The utility model aims to solve the technical problem of realize a can send emitting diode packaging structure of white light

In order to achieve the purpose, the technical scheme adopted by the utility model is that the LED packaging structure capable of emitting white light comprises a left-hand area and a right-hand area, wherein a substrate for mounting L ED chips is composed of a left-hand area and a right-hand area, and the L ED chips are wrapped and sealed by fluorescent glue.

A surrounding board surrounding the L ED chip is fixed on the substrate, and the fluorescent glue is filled in the surrounding board and the filling height is lower than the height of the surrounding board.

Transparent adhesive is filled above the fluorescent glue.

The transparent adhesive overflows the coaming and wraps the periphery of the coaming.

And through holes are formed in the left-hand area and the right-hand area.

The utility model discloses packaging structure can make L ED produce white light to can reduce the height of L ED encapsulation, protection L ED does not receive the pollution, reinforcing packaging structure.

Drawings

The following brief descriptions of the contents expressed by each figure and the marks in the figures in the specification of the present invention are as follows:

FIG. 1 is a top view of a prior art L ED package;

FIG. 2 is a side view of a prior art L ED package;

FIG. 3 is a basic structure of an L ED package of the present invention;

FIG. 4 is a schematic illustration of the coaming;

FIG. 5 is a schematic view of an embodiment of the mounting enclosure of the present invention;

FIG. 6 is a schematic view of an embodiment of the present invention covered with a transparent adhesive;

FIG. 7 is a schematic view of an embodiment of a reinforcement layer of the present invention;

the marks in the figure are 1, left hand area, 2, right hand area, 3, lead, 4, cut, 5, through hole, 6, fluorescent glue, 7, coaming, 8, transparent adhesive, 9, reinforcing layer and 10, L ED chip.

Detailed Description

The following description of the embodiments with reference to the drawings is intended to illustrate the present invention in further detail, such as the shapes and structures of the components, the mutual positions and connections between the components, the functions and working principles of the components, the manufacturing process, and the operation and use methods, etc., so as to help those skilled in the art understand the present invention more completely, accurately and deeply.

As shown in FIG. 3, a short wavelength L ED chip 10 is mounted on a left-hand region 1 of a metal substrate, the left-hand region 1 and a right-hand region 2 are separated from each other with a gap, an upper electrode of the L ED chip 10 is connected with the right-hand region 2 by a lead 3, the L ED chip 10, the left-hand region 1 and the right-hand region 2 are sealed by a fluorescent glue 6, and the fluorescent glue 6 can cover the color light emitted by the L ED chip 10 into white light

The left-hand area 1 and the right-hand area 2 are provided with through holes 5 in the metal section for allowing the fluorescent glue 6 to flow through during the sealing process, thereby reinforcing the structure, and the extension parts of the left-hand area 1 and the right-hand area 2 are not covered by the fluorescent glue 6 water and are used as L ED surface mounting terminals.

Fig. 4 shows a shroud 7 for enclosing L ED chips 10, the shroud 7 may have the same height as the fluorescent glue 6 or a different height.

As shown in fig. 5, the enclosing plate 7 with high adhesive of the fluorescent glue 6, and the transparent adhesive 8 fills the empty space above the fluorescent glue 6 to protect the fluorescent glue 6, as shown in fig. 7, the transparent glue also covers the outer surface of the enclosing plate 7 to serve as a reinforcing layer 9 of the structure.

The present invention has been described above with reference to the accompanying drawings, and it is to be understood that the invention is not limited to the specific embodiments described above, and that the invention is not limited to the specific embodiments described above, but rather is intended to cover various insubstantial modifications of the inventive method and solution, or its application to other applications without modification.

Claims (2)

1. A can send the white light LED packaging structure, the substrate to mount L ED chip is formed by left hand area and right hand area, wherein wrap up and seal by the fluorescent glue outside the said L ED chip;

a surrounding plate surrounding the L ED chip is fixed on the substrate, and the fluorescent glue is filled in the surrounding plate and the filling height is lower than that of the surrounding plate;

transparent adhesive is filled above the fluorescent glue;

the transparent adhesive overflows the coaming and wraps the periphery of the coaming to form a reinforcing layer.

2. The light emitting diode package structure capable of emitting white light according to claim 1, wherein: and through holes are formed in the left-hand area and the right-hand area.

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