CN105957947B - LED area light source and preparation method thereof - Google Patents
LED area light source and preparation method thereof Download PDFInfo
- Publication number
- CN105957947B CN105957947B CN201610325646.6A CN201610325646A CN105957947B CN 105957947 B CN105957947 B CN 105957947B CN 201610325646 A CN201610325646 A CN 201610325646A CN 105957947 B CN105957947 B CN 105957947B
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- reflector
- wiring board
- led chip
- led
- light source
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/13—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L33/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Led Device Packages (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
Abstract
The present invention provides a kind of LED area light source, including wiring board, reflector and at least one LED chip, the LED chip and the circuit board electrical connection, the wiring board is fixed on the reflector, the wiring board and the reflector are arranged in angle, the LED chip is set on the wiring board, and the light that the LED chip issues is reflected in the direction that the reflector is used to be directed away from the reflector.The invention further relates to a kind of preparation methods of LED area light source.LED area light source of the invention, light are uniformly projected from a front surface and a side surface of LED area light source, are realized and are uniformly gone out light.
Description
Technical field
The present invention relates to LED fields more particularly to a kind of LED area light source and preparation method thereof.
Background technique
For LED through years development, technology is gradually mature, considerably reduces its production cost, can give full play to its at
This and the advantage of scale, cost of implementation rationally, the LED flexible surface light source illuminating product of stay in grade.However, existing LED flexible face
Light source, LED chip are typically all to be directly anchored on substrate.
For example, the Chinese patent of Publication No. CN104319273A, a kind of LED light source is disclosed, including substrate and at least
Two LED chips, each LED chip are fixed on substrate, and substrate surface is equipped at least one membrane electrode, at least one LED core
At least one electrode of piece is electrically connected with corresponding membrane electrode.However, the LED light source of the program, LED chip and substrate are in patch
The state of conjunction shines and concentrates on close to the position of LED chip, non-uniform light.
Summary of the invention
The technical problems to be solved by the present invention are: providing a kind of uniform LED area light source of light-emitting surface；Further provide for one
The preparation method of kind LED area light source.
In order to solve the above-mentioned technical problem, the technical solution adopted by the present invention are as follows:
A kind of LED area light source, including wiring board, reflector and at least one LED chip, the LED chip and the line
The electrical connection of road plate, the wiring board are fixed on the reflector, and the wiring board and the reflector are arranged in angle, described
LED chip is set on the wiring board, and the LED chip is reflected in the direction that the reflector is used to be directed away from the reflector
The light of sending.
Another technical solution provided by the invention are as follows:
A kind of preparation method of LED area light source, the LED chip of at least one is set on wiring board, then will be equipped with
The wiring board of LED chip is set on reflector, along the periphery of the LED chip by the LED chip and wiring board from described
It is separated on reflector, until a unclosed tangent line is formed on the reflector, then by the LED chip and route
Plate is bent by the unclosed tangent line, and site then is arranged on the reflector, obtains the area source.
The beneficial effects of the present invention are:
(1) LED area light source of the invention, wiring board and reflector be in angle, LED chip be arranged on the circuit board, because
This LED chip and reflector are also in angle, so that the light that LED chip issues uniformly is projected from front, the side of reflector, without
Concentrate on to be formed the LED area light source for uniformly going out light again close to the position of LED chip.
(2) preparation method of LED area light source of the invention by LED chip and carries the wiring board of LED chip from reflective
It is separated on plate, so that wiring board is not exclusively connect with reflector, and then LED chip and wiring board can be passed through incomplete
The place bending of connection, so that LED chip and reflector are in a certain angle, the light that LED chip issues can be from reflector just
Face, side are projected, to prepare the LED area light source of uniform in light emission.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the LED area light source of the embodiment of the present invention；
Fig. 2 is the structural schematic diagram of the LED area light source of the embodiment of the present invention one；
Fig. 3 is the structural schematic diagram of the LED area light source of the embodiment of the present invention two；
Fig. 4 is the top view of the LED area light source of the embodiment of the present invention two；
Fig. 5 is the structural schematic diagram of the LED area light source of the embodiment of the present invention three.
Label declaration:
1, wiring board；2, reflector；3, LED chip；4, cover board；5, fixing piece；6, site；7, encapsulated layer.
Specific embodiment
To explain the technical content, the achieved purpose and the effect of the present invention in detail, below in conjunction with embodiment and cooperate attached
Figure is explained.
The most critical design of the present invention is: LED chip and wiring board are arranged in angle, light is dispersed, is obtained equal
The LED area light source of even light out.
Fig. 1 is please referred to, the present invention provides a kind of LED area light source, including wiring board 1, reflector 2 and at least one LED core
Piece 3, the LED chip 3 are electrically connected with the wiring board 1, and the wiring board 1 is fixed on the reflector 2, the wiring board 1
It is arranged with the reflector 2 in angle, the LED chip 3 is set on the wiring board 1, and the reflector 2 is used for towards remote
The light that the LED chip 3 issues is reflected in direction from the reflector 2.
As can be seen from the above description, the beneficial effect of LED area light source of the present invention is: LED chip 3 and reflector 2 are in certain
Angle setting, LED chip 3 issue light uniformly projected from front, the side of reflector 2, formed uniformly go out light the face LED light
Source.
Further, the wiring board 1 and the reflector 2 are integrally formed, and the reflector 2 is equipped with circuit and the circuit
It is electrically connected with the LED chip 3 on the wiring board 1.
As can be seen from the above description, wiring board 1 and reflector 2 are integrally formed, structure is simple, firm.Wiring board 1 and reflector
2 can also be two independent components, and specific setting can be adjusted according to practical application.
It further, further include cover board 4, the wiring board 1 is equipped with the opening of at least one, and the opening is set to line
The position that road plate 1 and reflector 2 connect, the cover board 4 cover the opening.
As can be seen from the above description, setting cover board 4 covers the part being open between wiring board 1 and reflector 2, to be open into
Row filling, it is ensured that LED chip 3 and route work normally.
Further, the wiring board 1 and the reflector 2 are flexible base board, further include fixing piece 5, the fixing piece 5 is
One face of rigid structure, the fixing piece 5 is fixed on the reflector 2, another face of the fixing piece 5 is fixed on this
On wiring board 1, so that the wiring board 1 and the reflector 2 are arranged in angle.
As can be seen from the above description, LED chip 3 is fixed by fixing piece 5, thus between wiring board 1 and reflector 2
Volume angle is fixed, moreover it is possible to LED chip 3 be avoided to fall off from wiring board 1.
It further, further include site 6, the site 6 is set on the reflector 2, and the site 6 is described for reflecting
The light that LED chip 3 issues.
As can be seen from the above description, the light that LED chip 3 issues is reflected after encountering site 6, formed on light direction originally
Total reflection be destroyed.
It further, further include encapsulated layer 7, the encapsulated layer 7 covers the LED chip 3 and the reflector of the wiring board 1
2。
As can be seen from the above description, encapsulated layer 7 on wiring board 1 LED chip 3 and reflector 2 be packaged, to LED core
Piece 3 is sealed protection.
Another technical solution of the invention are as follows:
A kind of preparation method of LED area light source, the LED chip of at least one is set on wiring board, then will be equipped with
The wiring board of LED chip is set on reflector, along the periphery of the LED chip by the LED chip and wiring board from described
It is separated on reflector, until a unclosed tangent line is formed on the reflector, then by the LED chip and route
Plate is bent by the unclosed tangent line, and site then is arranged on the reflector, obtains the area source.
As can be seen from the above description, the beneficial effect of the preparation method of LED area light source of the present invention is:
LED chip and wiring board are separated from reflector, so as to which LED chip and wiring board are passed through separation
Place bending so that LED chip and reflector are in a certain angle, light that LED chip issues being capable of front, side from reflector
Face is projected, and the LED area light source of uniform in light emission is formed.
Further, in fixing piece is arranged on wiring board, the LED chip after making bending is fixed on wiring board.
As can be seen from the above description, it is by setting fixing piece in the circuit board that LED chip is fixed on the circuit board, it prevents
LED chip falls off.
Further, the surrounding of LED chip and site after bending is packaged.
As can be seen from the above description, being sealed protection to LED chip by the surrounding encapsulation to LED chip and site.
Referring to figure 2., the embodiment of the present invention one are as follows:
A kind of LED area light source, including the multiple cover boards 4 of multiple wiring boards 1, reflector 2,3 level-one of multiple LED chips, it is described
Wiring board 1, the quantity of cover board 4 are consistent with the quantity of the LED chip 3, and the wiring board 1 is vertically arranged with reflector 2, and anti-
The position that tabula rasa 2 is connect with each wiring board 1 is equipped with opening；Single LED chip 3 is fixed on the single line by tin cream
On road plate 1；Right angle fixed pin is provided on the wiring board 1 LED chip 3 is fixed；The cover board 4 covers described open
Mouthful.Wherein, the wiring board 1 and reflector 2 are flexible circuit board, and the wiring board 1 and reflector 2 are integrally formed.Such as
Shown in Fig. 2, the direction of arrow meaning is the light direction of LED chip 3.
Referring to figure 3. and Fig. 4, the embodiment of the present invention two are as follows:
A kind of LED area light source, the difference with above-described embodiment one are that the reflector 2 is equipped with the site 6 of protrusion；
The wiring board 1 is set to the one side that route is equipped with far from the reflector 2, and the site 6 is set to reflector 2 and is not provided with line
The one side on road.As shown in Fig. 2 and Fig. 4.Total reflection is formed by the light that the site 6 of protrusion prevents LED chip 3 from issuing, is such as schemed
Light direction shown in middle arrow.
Referring to figure 5., the embodiment of the present invention three are as follows:
A kind of LED area light source, the difference with above-described embodiment one and embodiment two are, further include encapsulation made of silica gel
Layer 7, the encapsulated layer 7 is set to the one side that reflector 2 is not provided with route, and coats the LED chip 3；The encapsulated layer 7
LED chip 3 on entire wiring board and wiring board can be coated.The encapsulated layer is recessed close to the inner surface of LED chip 3
Convex injustice, the light for avoiding LED chip 3 from issuing is formed in package surface and is totally reflected.
The embodiment of the present invention four are as follows:
A kind of preparation method of LED area light source, multiple LED chips is fixed in the circuit board by tin cream, and use
Right angle fixed pin is fixed in the circuit board by LED chip；Then along the periphery of each LED chip by LED chip and wiring board from
It is separated on reflector, until forming a notch；Then the LED chip and wiring board are carried out by the notch curved
Folding；An opening is formed after bending on the reflector；The opening is covered with wiring board.Preferably, the line
Road plate is flexible circuit board.
The embodiment of the present invention five are as follows:
A kind of preparation method of LED area light source, the difference with above-described embodiment four be, the LED chip and wiring board
It is not provided with the one side bending of route towards the reflector, the net of protrusion is set in the one side that the reflector is not provided with route
Point.Other light directions in LED chip also can be set in the site, or inner concavity, as long as can be realized destruction
The total reflection for the light that LED chip issues.
The embodiment of the present invention six are as follows:
A kind of preparation method of LED area light source, the difference with above-described embodiment four and embodiment five is, silica gel is made
The inner surface of packaging part be arranged to rough, be then coated on the surrounding of LED chip and site, which can also be with
Entire wiring board and LED chip are coated.
In conclusion LED area light source provided by the invention, LED chip and reflector are arranged in angle, light is from reflector
A front surface and a side surface uniformly projects, and realizes and uniformly goes out light.The preparation method of LED area light source of the invention, by LED chip and will set
There is the wiring board of LED chip to separate from reflector, keep LED chip and reflector shape at a certain angle, realize front and
Side uniformly goes out light.
The above description is only an embodiment of the present invention, is not intended to limit the scope of the invention, all to utilize this hair
Equivalents made by bright specification and accompanying drawing content are applied directly or indirectly in relevant technical field, similarly include
In scope of patent protection of the invention.
Claims (8)
1. a kind of LED area light source, including wiring board, reflector and at least one LED chip, the LED chip and the route
Plate electrical connection, which is characterized in that the wiring board is fixed on the reflector, and the wiring board is set with the reflector in angle
It sets, the LED chip is set on the wiring board, and the reflector is used to be directed away from described in the direction reflection of the reflector
The light that LED chip issues；
The wiring board and the reflector are integrally formed, and the reflector is equipped with circuit and on the circuit and the wiring board
LED chip electrical connection；It wherein, further include cover board, the wiring board is equipped with the opening of at least one, and the opening is set to line
The position that road plate is connected with reflector, the cover board cover the opening.
2. LED area light source according to claim 1, which is characterized in that the wiring board and the reflector are flexible base board,
It further include fixing piece, the fixing piece is rigid structure, and a face of the fixing piece is fixed on the reflector, described solid
Another face for determining part is fixed on the circuit board, so that the wiring board and the reflector are arranged in angle.
3. LED area light source according to claim 1, which is characterized in that further include site, it is reflective that the site is set to this
On plate, the site is used to reflect the light that the LED chip issues.
4. LED area light source according to claim 1, which is characterized in that further include encapsulated layer, described in the encapsulated layer covering
LED chip and the reflector on wiring board.
5. LED area light source according to claim 1, which is characterized in that more than two including more than two wiring boards
The wiring board is arranged at intervals on the reflector.
6. a kind of preparation method of LED area light source, which is characterized in that the LED chip of at least one is set on wiring board, so
The wiring board for being equipped with LED chip is set on reflector afterwards, along the periphery of the LED chip by the LED chip and route
Plate is separated from the reflector, until a unclosed tangent line is formed on the reflector, then by the LED core
Piece and wiring board bend by the unclosed tangent line, and site then is arranged on the reflector, obtains the face light
Source；At least one opening is arranged in the position that assist side is connected with reflector, and setting cover board covers the opening.
7. the preparation method of LED area light source according to claim 6, which is characterized in that in fixing piece is arranged on wiring board,
The LED chip after making bending is fixed on wiring board.
8. the preparation method of LED area light source according to claim 6, which is characterized in that the LED chip and net after bending
The surrounding of point is packaged.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610325646.6A CN105957947B (en) | 2016-05-16 | 2016-05-16 | LED area light source and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610325646.6A CN105957947B (en) | 2016-05-16 | 2016-05-16 | LED area light source and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105957947A CN105957947A (en) | 2016-09-21 |
| CN105957947B true CN105957947B (en) | 2019-01-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610325646.6A Active CN105957947B (en) | 2016-05-16 | 2016-05-16 | LED area light source and preparation method thereof |
Country Status (1)
| Country | Link |
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| CN (1) | CN105957947B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106641884A (en) * | 2016-12-27 | 2017-05-10 | 四川联恺照明有限公司 | LED light source capable of realizing uniform luminescence |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2630892Y (en) * | 2003-05-24 | 2004-08-04 | 鸿富锦精密工业（深圳）有限公司 | LED area source |
| CN1837930A (en) * | 2005-01-24 | 2006-09-27 | 西铁城电子股份有限公司 | Planar light source unit |
| JP4411732B2 (en) * | 2000-03-02 | 2010-02-10 | 日亜化学工業株式会社 | Planar light emitting device |
| CN103928594A (en) * | 2014-03-21 | 2014-07-16 | 京东方科技集团股份有限公司 | Light-emitting device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102261584A (en) * | 2010-05-31 | 2011-11-30 | 启耀光电股份有限公司 | Light-emitting module |
-
2016
- 2016-05-16 CN CN201610325646.6A patent/CN105957947B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4411732B2 (en) * | 2000-03-02 | 2010-02-10 | 日亜化学工業株式会社 | Planar light emitting device |
| CN2630892Y (en) * | 2003-05-24 | 2004-08-04 | 鸿富锦精密工业（深圳）有限公司 | LED area source |
| CN1837930A (en) * | 2005-01-24 | 2006-09-27 | 西铁城电子股份有限公司 | Planar light source unit |
| CN103928594A (en) * | 2014-03-21 | 2014-07-16 | 京东方科技集团股份有限公司 | Light-emitting device |
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| Publication number | Publication date |
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| CN105957947A (en) | 2016-09-21 |
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Effective date of registration: 20210706 Address after: 629000 Sichuan Suining economic and Technological Development Zone Microelectronics Industrial Park workshop Patentee after: Suining Heidexin Photoelectric Technology Co.,Ltd. Address before: 363900 Xingtai Industrial Park, Changtai County Economic Development Zone, Zhangzhou, Fujian Patentee before: Zhangzhou Lidaxin Optoelectronic Technology Co.,Ltd. |