CN100470853C - Novel alignment light emitting diode packaging construction - Google Patents

Novel alignment light emitting diode packaging construction Download PDF

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CN100470853C
CN100470853C CN 200410078142 CN200410078142A CN100470853C CN 100470853 C CN100470853 C CN 100470853C CN 200410078142 CN200410078142 CN 200410078142 CN 200410078142 A CN200410078142 A CN 200410078142A CN 100470853 C CN100470853 C CN 100470853C
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collimator lens
emitting diode
lens
light emitting
portion
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CN 200410078142
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CN1604346A (en
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毅 罗
飞 胡
钱可元
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清华大学
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Abstract

一种具有准直功能的发光二极管的封装结构,属于发光二极管照明应用中的封装领域,其特征是通过采用一个具有旋转对称性的准直透镜封装发光二极管芯片,从而使得发光二极管出射的光通过准直透镜以后以较小发散角度出射,形成一个定向发射的面光源。 A light emitting diode package structure having a collimating function, belonging to the packaging field of LED lighting applications, characterized by using a collimator lens having a light emitting diode chip packaged rotational symmetry, so that the LED light emitted by collimator lens after exiting a smaller divergence angle, the surface light source is formed of a directional transmission. 该面光源可以用在手电、射灯、矿灯、投影仪等器件上。 The surface light source may be used in the flashlight, spotlights, lamp, a projector device. 通过使用正N边形的准直透镜来封装功率型LED,能得到正N边形的LED照明模块。 By using the collimator lens regular N-gon be packaged LED power type, to get regular N-gon LED lighting module. 将多个正N边形的LED照明模块合并,能够得到更大面积的定向发射的面光源。 The plurality of regular N-gon combined LED lighting modules, it is possible to obtain a surface light source emitted from a larger area oriented. 本发明高效的将近似点光源的LED芯片发出的光导出,形成均匀的光束,消除了发光二极管的高亮度给人眼带来的危险性。 Light efficiently approximate a point light source emitted from the LED chip of the present invention is derived form a uniform beam, eliminating a high-brightness light-emitting diode brings danger to the human eye.

Description

准直发光二极管封装结构 Collimated LED package structure

技术领域 FIELD

本发明涉及一种准直发光二极管的封装结构,目的是为了将发光二极管发出的光准直并形成一个面光源输出。 The present invention relates to a collimated light emitting diode package structure, the purpose of collimating light emitted by the LEDs to form a linear light output face. 本发明属于发光二极管的封装技术领域。 The present invention belongs to the technical field of packaging light emitting diode. 背景技术 Background technique

图1描述了一种常规的发光二极管的封装结构20。 1 depicts a package 20 of a conventional light emitting diode. 发光二极管的常规封装结构20中采用一个半球形的透镜21封装,封装结构20具有一个纵向的对称轴23,封装结构20的光强远场分布图近似为22。 A conventional light emitting diode package structure 20 employs a hemispherical lens package 21, package 20 having a longitudinal axis of symmetry 23, the package structure 20 of the far field intensity distribution is approximately 22. 由图一可见,常规封装的发光二极管的光强远场分布在纵向对称轴处具有最大值,调整半球形的透镜21的高度可以调整封装结构20的光强远场分布。 A seen from FIG., The far field light intensity of a conventional light emitting diode package of the longitudinal axis of symmetry in the distribution has a maximum value, to adjust the height of the hemispherical lens package 21 may adjust the light intensity distribution in the far field 20. 封装结构20存在的问题是具有较小的发光面积,在其小的发光面积上光强很大。 The package structure 20 there is a problem with a small emitting area, in which a small light-emitting area large polishing strength. 而发光二极管的亮度随着技术的发展越来越大,所以封装结构20对人眼健康存在威胁。 The brightness of light emitting diodes is increasing with the development of technology, there is the threat of encapsulation structure 20 to the human eye health.

图2是将具有封装结构20的发光二极管配合一个二次光学元件——抛物面形状的反射镜25来将具有封装结构20的发光二极管发出的光进一步准直。 FIG 2 is a package structure having the light emitting diode 20 with a secondary optical element - the parabolic mirror 25 to the light emitting diode package structure 20 has the further emitted collimated. 采用抛物面形状的反射镜25存在的一个问题是:如果要使得光束角很窄,抛物面形状的反射镜25需要做的很深,因而在应用中会显得很不简洁。 Using a paraboloid reflector 25 exists problem: if you want a very narrow beam angle such that, in the parabolic shape of the reflecting mirror 25 needs to be done very deep, thus the application will become very simple. 而且具有封装结构20的发光二极管配合抛物面形状的反射镜25得到的光强分布在垂直于对称轴23的方向上难以均匀。 Light intensity and the light emitting diode package structure 20 with the parabolic shape of the reflecting mirror 25 resulting distribution in the direction perpendicular to the axis of symmetry 23 is difficult to uniformly. 一些特定的场合比如投影仪的光源需要光源的光束角很窄,而且光斑要求均匀。 Some specific occasions such as the beam angle of the light source of the projector requires a light source is narrow, and spot uniformity requirements. 这些特定场合的应用要求使得有必要设计新型的发光二极管封装结构,使得新的封装设计能够实现准直出光,而且能够满足均匀性的要求。 These applications require particular situation makes it necessary to design a new type of light emitting diode package structure, such that the new package design collimated light can be realized, and uniformity able to meet the requirements.

图3是将具有封装结构20的发光二极管配合另外一个二次光学元件——准直透镜(US6547423)来将具有封装结构20的发光二极管发出的光进一步准直。 FIG 3 is a package structure having the light emitting diode 20 with the addition of a secondary optical element - a collimating lens (US6547423) to light having a light emitting diode package structure further 20 emitted collimated. 这种采用透镜来准真发光二极管的光束的方法改变了传统的结构(图2)。 Such lenses use a quasi real beam method of changing the light emitting diode of the conventional configuration (FIG. 2). 相对于图2的结构,采用具有封装结构20的发光二极管配合准直透镜的结构能够更将光束分布得更加均匀,而且达到相同的准直效果,图3的结构更加简洁。 2 with respect to the structure of FIG, 20 is a light emitting diode with a collimator lens structure can further be more evenly distributed beam having a package structure, and achieve the same effect of the collimator, Figure 3 configuration more compact. 但是图3所述的结构也存在问题:采用了二次光学元件, 而且一次光学元件和二次光学元件之间有空气隙。 However, the structure of FIG. 3, there is a problem: using a secondary optical element, and an air gap between the first optical element and the secondary optical element. 如果能够采用一个光学元件就能够实现准直,不仅节省了透镜成本和制作工艺,还能够消除图3中一次光学元件和二次光学元件之间的空气隙。 If the optical element can be employed a collimation can be achieved, not only saves the cost and the lens manufacturing process, can also eliminate the air gap between the first optical element in FIG. 3 and the secondary optical element. 减少光学元件能减小光学元件之间的耦合损耗,而且更少的光学元件意味着设计更加简洁。 The optical element can be reduced to reduce the coupling loss between the optical elements, fewer optical elements and more compact design means.

发光二极管的生长和封装技术的发展使得发光二极管的电光转换效率不断提高,因而使得采用发光二极管来作通用照明光源成为可能。 Growth and development of packaging technology is such that a light emitting diode emitting diode optical conversion efficiency continue to increase, thus making a light emitting diode for general lighting source to become possible. 目前,功率型发光二极管的输入电功率达到IW(DA Steigerwald, JC Bhat, D. Collins, RM Fletcher, M. 0. Holcomb, et al, Illumination With Solid State Lighting Technology, IEEE J. Sel. Top. Quant. At present, the input power of the power light emitting diodes reaches IW (DA Steigerwald, JC Bhat, D. Collins, RM Fletcher, M. 0. Holcomb, et al, Illumination With Solid State Lighting Technology, IEEE J. Sel. Top. Quant.

Electron. 2002 8(2): 310-320),商用的功率型白光LED的流明效率达到301m/W,发光二极管面积达到lmm2。 Electron 2002 8 (2):. 310-320), a commercial power white LED lumen efficiency of 301m / W, an area of ​​the light emitting diode lmm2. 功率型LED的亮度很高,发光面积很小,利用传统封装结构20封装得到的LED正面轴向的光强很大,对人眼的健康造成了威胁。 Power LED of high brightness, the light emitting area is very small, a large conventional package using the light intensity obtained LED package structure 20 of the axial front of the human eye health threat. 由于发光二极管的特殊尺寸和特殊发光特性,使其应用在半导体照明方面需要合适的结构。 Because of special sizes and special characteristics of the luminescent light emitting diode, its application requires an appropriate configuration in the semiconductor lighting. 图4是采用传统封装结构20封装多个发光二极管,然后集群使用来获得一个大面积的光源。 Figure 4 is a plurality of LED packages 20 conventional package structure, and then use the cluster to obtain a large area source. 图4这种利用发光二极管作照明光源的结构没有能够消除LED的高亮度对人眼带来的威胁。 FIG 4 such as a light emitting diode using the structure of the illumination light source is not possible to eliminate the high brightness of LED threat posed by the human eye. 而且图4所示的光源难以做到均匀,发光面是由一个个离散的发光点组成,这难以符合高质量照明光源的要求。 And light source shown in FIG. 4 is difficult to achieve uniform surface light emission by a light emitting discrete dots, it is difficult to meet the requirements of high-quality illumination light source. 综上所述,现阶段的半导体照明的封装结构不能满足半导体照明的需要,有必要设计一种能将发光二极管的近似点光源转变成均匀出光的面光源的封装结构。 In summary, the package structure of the semiconductor lighting stage not meet the needs of the semiconductor lighting, it is necessary to design a light-emitting diode point light source capable approximation is converted into a uniform surface light source package structure of the light. 发明内容 SUMMARY

本发明是为了解决发光二极管照明应用中的采用一个透镜将LED发出的光均匀准直输出,形成一个定向发射的面光源的问题而完成的,其目的是提供一种高效率、简洁的发光二极管的封装结构。 The present invention is made to solve the LED lighting applications using a quasi-uniform lens emitted from the LED light output directly, forming a directional transmission problems of the surface light source, and has an object to provide an efficient, simple and light emitting diode the package structure.

本发明的特征在于: The present invention is characterized in that:

它含有一个封装底座和一个绑定在封装底座上封装发光二极管的准直透镜。 A package base comprising a collimating lens and a light emitting diode package on package base binding. 所述准直透镜含有: The collimator lens comprising:

准直透镜顶部的折射部分,位于透镜上表面中心区域且准直透镜旋转对称轴穿过该部分,它所折射的是发光二极管发出的光中与所述准直透镜的旋转对称轴夹角小的那一部分光线; A collimator lens top refracting portion located on the surface of the central region of the lens and the collimator lens portion through which the axis of rotational symmetry, it is refracted light emitted from the light emitting diode and the collimator lens in the axis of rotational symmetry of Small and that part of the light;

准直透镜下侧面的全反射部分,位于透镜的侧表面的下部,与封装底座邻接,它所全反射的是发光二极管发出的光中与所述准直透镜的旋转对称轴夹角大的那一部分光线; The collimator microscopic total reflection side surface portion, located at the lower side surface of the lens, and the package base adjacent to it a total reflection angle that is large rotational symmetry axis of the light emitted by the light emitting diode and the collimator lens part of the light;

准直透镜上表面的折射/全反射部分,邻接于准直透镜顶部的折射部分和准直透镜上侧面的全反射部分,它所折射的是从上述准直透镜下侧面的全反射部分所全反射出来的光线和从准直透镜上侧面全反射部分全反射出来的光线;它所全反射的是从发光二极管发出的光中与所述准直透镜的旋转对称轴夹角居中的那一部分光线; 所述的准直透镜上侧面的全反射部分,位于透镜的侧表面的上部,邻接于准直透镜上表面的折射/全反射部分和准直透镜下侧面的全反射部分,它所全反射的是从上述准直透镜上表面折射/全反射部分中所全反射过来的那一部分光线。 A collimator lens refracting / total reflection surface portion, adjacent to the side surface portion of the collimating lens is totally reflected on the top of the refractive portion and the collimator lens, it is refracted from the collimating totally endoscopic portion of the side surface of the whole and light reflected from the collimator lens side is totally reflected light out of the total reflection portion; it is totally reflected light emitted from the light emitting diode and the angle between the axis of rotational symmetry of the collimator lens center portion of the light that ; total reflection portion on the side of said collimator lens, located at an upper side surface of the lens, adjacent to the upper surface of the collimator lens refracting / collimating totally endoscopic portion and a side portion of the total reflection, it is totally reflected the refracting surface / total reflection portion over that part of the totally reflected light rays from said collimator lens.

所述的准直透镜在与所述旋转对称轴垂直的平面上的投影是一个正N边形,N>2,是一个正N边形准直透镜。 The collimator lens projected on a plane perpendicular to the axis of symmetry of the rotation of the polygon is a regular N, N> 2, is a regular N-gon collimator lens.

所述准直透镜所用材料的折射率在1. 3〜3. 5之间。 The refractive index of the collimator lens material between 1. 3~3. 5.

所述准直透镜中,其顶部的折射部分、上表面折射/全反射部分、上侧面和下表面的全反射部分的轮廓线是直线的一段和下列曲线的一段:圆、双曲线、椭圆、抛物线、曲线方程在2次以上的高次曲线,或者是上述直线和曲线中任何一种两条或两条以上拼接的一段。 The collimator lens, the refraction portion of the top, the upper surface refracting / total reflection portion, and the total reflection on the side surface of the lower portion of the contour line is a straight line section and the following section of the curve: circular, hyperbolic, elliptical, parabola, at least 2 times higher curve equation of the curve, and the straight line or a curved section of any one of two or more than two splice.

所述准直透镜上侧面全反射部分镀有高反射率膜。 The total reflection on the side surface of the collimator lens portion is plated with a high reflectance film.

所述准直透镜的构成部分进一步包括一个用于放置发光二极管且形状任意的区域,所述区域是用透明材料填充的,所述透明材料的折射率在1.3〜3.5之间,它的折射率与所述准直透镜的材料的折射率之差An〈1. 0。 The component further includes a collimator lens for placing a light emitting diode and the shape of any region, the region is filled with a transparent material, the refractive index of the transparent material is between 1.3~3.5, its refractive index An difference in refractive index between the collimator lens material is <1.0.

所述准直透镜的构成部分进一步包括一个用于放置一个采用半球形透镜封装的LED的区域,该区域的形状与上述半球形透镜的形状相吻合,两者之间是透明的材料,所述透明材料的折射率在1. 3〜3. 5之间,它的折射率与所述准直透镜的材料的折射率之差An〈1. 0。 The collimator lens component further comprises a hemispherical lens is placed using a LED package for the region, a hemispherical lens shape above the region coincide, a transparent material therebetween, said between the refractive index of the transparent material 1. 3~3. 5, the difference An in refractive index having a refractive index of the collimator lens material <1.0.

所述准直透镜的构成部分进一步包括一个用于放置一个采用半球形透镜封装的LED的区域,该区域的形状与上述半球形透镜的形状相吻合,但两者之间存在一个空腔。 The collimator lens component further comprises a hemispherical lens using a region of the LED package for placing, a hemispherical lens shape above the region coincide, but there is a cavity therebetween.

所述的准直透镜是一个准直透镜组,它由M个相同的准直透镜水平拼装扩展而成,它的面积为MXS,等于一个定向发射的面光源的面积,其中S是所述透镜组中每一个透镜在俯视图上的投影面积。 The collimator lens is a collimator lens group, which extends from the same level of the collimator lens assembly from the M, MXS its area, equal to the area of ​​the surface light source of a directional transmission, wherein said lens is S group each lens projected area on a plan view.

所述的发光二极管是用点光源来代替的。 The light emitting diode is replaced by a point light source.

通过实验制作得到具有旋转对称的圆形准直透镜和正六边形的准直透镜。 To obtain round and hexagonal collimator lens collimating lens having rotation symmetry experimentally produced. 进而将圆形和六角形的准直透镜封装在LED的封装底座上,分别得到圆形和六角形的准直LED。 Turn round and hexagonal collimator lens packaged on the LED package base, respectively, a collimated LED hexagonal and circular. 采用LED 测试设备测量准直LED的光强远场分布和总光通量,得到准直LED的光强远场分布图和总光通量的值。 LED test measurement equipment using LED collimated far field light intensity distribution and total luminous flux, to obtain the value of the far field intensity distribution of the LED and collimating the total luminous flux. 实验结果表明:圆形和六角形的准直LED的光强远场分布的1/2强度全龟(ei/2) 为12度左右,与理论计算的结果10度左右非常接近,因而准直LED的光发散角使其能实现定向发射。 The results showed that: 1/2 full strength turtle (ei / 2) far-field light intensity distribution of a circular and collimated LED hexagon is about 12 degrees, with the theoretical calculation very close to 10 degrees, and thus the collimator LED light divergence angle so as to achieve directional transmission. 在采用相同芯片封装的条件下,圆形和六角形的准直LED与采用传统圆顶透镜封装的LED相比,总光通量为其90%,这说明采用准直LED封装的LED具有良好的准直功能,而且出光效率接近传统的简单圆顶透镜。 Under the same conditions employed in the chip package, hexagonal and circular collimated LED dome lenses compared with conventional LED packages, for a total luminous flux of 90%, indicating that the LED package using the LED collimator has good quasi- linear function, and the light extraction efficiency close to the conventional simple dome lens. 本发明公布的新型准直LED将LED的近似点光源高效地转化成面光源,有效消除了LED对人眼健康的威胁,在各种需要准直投射功能的场合如投影仪、射灯、手电、舞台灯等将得到广泛的应用。 The present invention discloses novel collimating the LED point light source LED is approximately efficiently converted into a surface light source, the LED effectively eliminate health threat to the human eye, in a variety of applications requiring collimating projected feature such as projectors, spotlights, flashlight , the stage lights will be widely used. 附图说明 BRIEF DESCRIPTION

图l为常规封装的LED封装结构示意图。 Figure l is a schematic view of the LED package structure of a conventional package. 图2为常规封装的LED和反射器组合结构图。 FIG 2 is a combination of the LED and the reflector configuration view of a conventional package.

图3为常规封装的LED和带有空气隙的准直透镜组合应用的断面图。 3 is a sectional view of a conventional LED package and the collimator lens in combination with an air gap applications.

图4为多个常规封装的LED组合形成大面积光源的基本结构图。 Fig 4 form a substantially large-area light source configuration diagram of a combination of a plurality of conventional LED packages.

图5为本发明实施例1的的封装结构断面图。 5 a sectional view of a package structure of the embodiment of the invention.

图6为本发明实施例1的具有旋转对称性的准直透镜三维图。 FIG collimator lens 6 having a three-dimensional rotational symmetry of the embodiment of Example 1 of the present invention.

图7为本发明实施例1中准直透镜和常规封装的LED紧密配合使用的基本结构图。 The basic structure of FIG. 7 in FIG. 1 and the collimator lens a conventional LED packages used in Example mating embodiment of the present invention.

图8为本发明实施例1中准直透镜和常规封装的LED非紧密配合使用的基本结构图。 8 basic block diagram of an embodiment of the collimator lens and a conventional LED packages used in the non-mating embodiment of the present invention.

图9为本发明实例1中准直透镜和封装底座绑定方式图。 Example 1 FIG. 9 and the collimator lens package base binding embodiment of the present invention, FIG.

图10为本发明实施例1的光线追踪图。 FIG 10 FIG raytracing Embodiment 1 of the present invention.

图ll为本发明实施例2的光线追踪图。 FIG ll raytracing FIG Example 2 of the present embodiment of the invention.

图12为本发明实施例3的正N边形准直透镜的三维图。 FIG 12 N n-side three-dimensional shape of the collimator lens according to the third embodiment of the present invention.

图13为本发明实施例3多个正N边形准直LED水平拼装扩展为大面积定向面光源酌结构示意图。 EXAMPLE 3 embodiment a plurality of regular N-gon LED collimator extended horizontally oriented planar light source assembly is a schematic structure of a large area of ​​discretion FIG. 13 of the present invention.

图14为本发明公开的准直透镜50经过实验测试以后得到的极坐标下四个不同截面上的光强远场分布图。 FIG collimator lens 14 through 50 disclosed in the present invention after experimental tests obtained at four different polar far field light intensity distribution on the cross section. 具体实施方式 Detailed ways

下面通过实施例对本发明做进一歩说明。 The following examples do ho into a description of the present invention.

本发明所公开的准直发光二极管的基本结构如图5所示。 The basic structure of the collimated light emitting diode disclosed in the present invention as shown in FIG. 图5描述准直发光二极管的封装结构包含一个旋转对称轴52,准直发光二极管包含一个准直透镜50和一个封装底座51。 5 depicts a collimated light emitting diode package structure comprises a rotational symmetry axis 52, the collimator comprises a light emitting diode 50 and a collimator lens package base 51. 准直透镜50被绑定在封装底座51上。 The collimator lens 50 is bound in the package base 51. 封装底座51的形式较多,其中58是发光二极管。 More form package base 51, where 58 is a light emitting diode. 发光二极管被固定在金属热沉上,再由金丝、铝丝等绑定。 Light emitting diode is fixed on a metal heat sink, and then bind the gold, aluminum wire. 封装底座51可能包括一个金属反射杯,芯片被固定在金属反射杯里面,使得由发光二极管芯片58发出的光经过金属反射杯反射以后向上射出。 Package base 51 may comprise a metallic reflective cup, the metal chip is fixed inside the reflective cup, so that the light is emitted upward through subsequent metal reflective cup reflects light emitted from the LED chip 58. 发光二极管芯片58本身底部可能包含有高反射率的金属层,使得发光二极管58的有源层发出的向下发射的光经过高反射率的金属层反射向上射出。 The bottom of the LED chip 58 itself may comprise a metal layer with a high reflectance, such that the light emitting diode emits light upwardly emitted from the active layer 58 is emitted downward through the metal layer reflects high reflectance. 发光二极管芯片58可以是AlGalnN材料系的发光二极管,也可以是AlGalnP材料系的发光二极管。 LED chip 58 may be a light emitting diode-based material AlGalnN, AlGalnP may be a light emitting diode-based material. 发光二极管芯片58可以是常规尺寸的LED(350nmx350,),也可以是功率型的LED(l咖xlmm)。 LED chip 58 may be a conventional size LED (350nmx350,), may be a power-type LED (l coffee xlmm). 发光二极管芯片58上可以涂覆有荧光粉。 It may be coated with a phosphor on the LED chip 58. 总之,从发光二极管芯片58发出的光由准直透镜50所收集,进而得到准直。 In short, the light emitted from the light emitting diode chip 58 is collected by a collimator lens 50, and then a collimated.

图5中,准直透镜50底部存在一个空腔57。 5, there is a cavity 57 at the bottom of the collimator lens 50. 在准直透镜和封装底座51进行绑定的时候,空腔57被填充一种透明的树脂。 When binding the collimating lens and the package base 51, the cavity 57 is filled with a transparent resin. 空腔57填充的透明树脂使得发光二极管芯片得到保护,而且能够减小发光二极管芯片58的材料折射率和准直透镜的材料折射率之间的失配带来的光提取的损失。 Filling the cavity 57 of a transparent resin so that the light emitting diode chip to be protected, but also to reduce the loss of light extraction refractive index mismatch between the LED chip 58 and the refractive index of the collimator lens caused. 所述透明树脂的材料折射率可以和准直透镜50的材料折射率匹配,也可以处于发光二极管芯片58的体材料折射率和准直透镜50材料折射率之间。 The refractive index may be a transparent resin material and the refractive index of the material of the collimator lens 50 match the refractive index of the material may be between the light emitting diode chip 58 and the body 50 of material having a refractive collimating lens. 所述透明树脂的材料折射率在1. 3-3. 5之间。 The refractive index of the transparent resin material between 1. 3-3. 5.

图5中,准直透镜50将来之不同方向的光分别使用不同的导引机制进行准直。 5, the light in different directions of the collimator lens 50 for future use different mechanisms for guiding the collimator. 从纵剖面图看,准直透镜50的构成部分分为顶部椭圆部分53,圆形上表面全反射/折射部分54, 直线形上侧面全反射部分55,双曲线形下侧面的全反射部分56。 From FIG longitudinal section view, components of the collimator lens 50 into an elliptical top portion 53, the surface of the total reflection / refraction on the circular portion 54, the straight portion 55 side is totally reflected, the total reflection hyperbolic lower side portion 56 . 顶部椭圆部分53用来收集准直与旋转对称轴52夹角较小(大约0°-30°)的光线。 Elliptical top portion 53 for collecting the collimation angle of the rotary shaft 52 is small symmetric (about 0 ° -30 °) light. 下侧面的全反射部分56和上表面全反射/折射部分共同起作用来收集准直与旋转对称轴52夹角很大(大约50°-90°)的光线。 Total reflection at the side surface portion 56 and an upper total reflection / refraction function to collect part of the common axis of rotational symmetry collimated rays large angle (approximately 50 ° -90 °) 52. 上表面全反射/折射部分54和上侧面全反射部分55共同起作用来准直与旋转对称轴52夹角适中(大约30。-50。)的光线。 The upper surface of the total reflection / refraction portion 54 and the total reflection on the side portion 55 works together with the collimating axis of rotational symmetry 52 moderate angle (about 30.-50.) Light. 这样,与旋转对称轴52夹角0。 Thus, the angle between the axis of rotational symmetry 52 0. 到90。 90. 的光线都能得到准直。 Collimated light can get. 准直透镜50可以由一系列的方法来制作,包括模具注塑、灌注脱膜、金刚石刀具加工等方法。 The collimator lens 50 can be prepared by a number of methods, including injection mold, filling stripping, diamond cutting tools or the like. 准直透镜50的制作材料是透明的,透射率要求较高。 The collimator lens forming material 50 is transparent, high transmittance requirements. 准直透镜50的制作材料可以是但不限于聚甲基丙烯酸甲酯(PMMA)、聚碳酸脂(PC)、 PEI、 COC等。 The collimator lens forming material 50 may be, but is not limited to, polymethyl methacrylate (PMMA), polycarbonate (PC), PEI, COC like. 准直透镜50的制作材料要求透明,可以是某种有颜色的材料。 The collimator lens forming material 50 is required to be transparent, there may be some color material. 准直透镜50的材料折射率在1.3-3.5之间。 Material of the collimator lens 50 is a refractive index between 1.3-3.5.

图6是本发明公开的准直透镜50的三维结构示意图。 FIG 6 is a schematic view of a three-dimensional structure of the collimator lens 50 of the present invention is disclosed. 其中52是旋转对称轴,61是发光二极管芯片的中心点。 Where 52 is the axis of rotational symmetry, a center point 61 of the light emitting diode chip. 图7是本发明公开的准直透镜50和传统封装结构20粘接配合,达到准直效果的结构图。 FIG 7 is a disclosure of the present invention, the collimator lens 50 and a conventional package structure 20 with an adhesive, to achieve the effect of the collimating structure. 传统封装结构20含有一个半球形的透镜,同时准直透镜50的空腔57的形状与传统封装结构20的半球型透镜吻合。 Conventional package structure 20 includes a hemispherical lens, collimator lens shape while the conventional package structure of the hemispherical lens cavity 57 50 20 anastomosis. 再采用折射率合适的树脂材料将准直透镜50的空腔和传统封装20的半球形透镜粘接,粘接用的树脂材料的折射率与准直透镜50的材料折射率和传统封装20的透镜材料折射率同时匹配。 Then using a resin material suitable refractive index material having a refractive collimator lens cavity 50 of a hemispherical lens and the conventional package 20 is bonded, with an adhesive resin material the refractive index of the collimator lens 50 and the package 20 is conventional matching the refractive index of the lens material at the same time. 如果准直透镜50的材料折射率和传统封装20的材料折射率不一致,可以采用折射率在两者之间的树脂材料来粘接。 If the refractive index material having a refractive collimating lens 50 and a conventional package 20 is inconsistent, the refractive index between the adhesive resin material can be employed. 粘接用的树脂材料可以是但不限于环氧树脂、硅胶等。 Bonding the resin material may be, but not limited to, epoxy resins, silicone and the like. 粘接用的树脂材料折射率在1.3-3.5之间。 Bonding the resin material between the refractive index of 1.3-3.5. 通过准直透镜和传统封装结构20粘接配合使用,能够使来之发光二极管芯片的光得到准直,形成一个面光源输出。 By using a collimating lens with the conventional package structure 20 and an adhesive, it is possible to make the light emitting diode chip to give a collimator, a light output face is formed. 图8是本发明公开的准直透镜50和传统封装结构20非接触配合,达到准直效果的结构图。 FIG 8 is a configuration diagram of a conventional collimator lens 50 and the package 20 of the present invention is disclosed with a non-contact, to effect collimation. 传统封装结构20含有一个半球形的透镜,同时准直透镜50的空腔57的形状也是半球形,但是空腔57的半球形半径大于传统封装20的半球形透镜的半径。 Conventional package structure 20 includes a hemispherical lens, and the collimator lens 57 of the shape of the cavity 50 is hemispherical, but the cavity 57 is greater than the radius of the hemispherical conventional package 20 of the hemispherical lens radius. 因此准直透镜50 和传统封装结构20之间存在一个空气隙59。 59 there is an air gap 20 between the collimator lens 50 and a conventional package structure. 通过准直透镜和传统封装结构20存在空气隙的非接触配合使用,能够使来自发光二极管芯片的光得到准直,形成一个面光源输出。 Non-contact by the presence of the air gap and the collimator lens 20 with the use of conventional package structure, the light from the light emitting diode chip to give a collimator, a light output face is formed. 图9是本发明公开的一种准直透镜50和封装底座的绑定方式。 FIG 9 is a binding way collimating lens 50 of the present invention and the disclosure of the package base. 准直透镜50的底部有4 根伸出的桩62,封装底座的基板上分布了与准直透镜50底部的4根桩62对应的4个小孔。 Bottom collimator lens 50 has four projecting piles 62, distributed four piles four apertures 62 corresponding to the bottom of the collimator lens 50 on the package base substrate. 准直透镜50的4根伸出的桩62深入到封装底座的基板上的4个小孔中,再用粘胶粘牢。 4 collimator lens 50 piles 62 extending deep into the four holes in the package base board, and then the adhesive cement. 准直透镜也可以被超声焊接在LED的封装底座上。 The collimator lens may be ultrasonically welded on the LED package base. 准直透镜也可以被加热固定在LED的封装底座上。 The collimator lens may be heat-fixed on the LED package base. 准直透镜或者被咬合在LED的封装底座上。 Or collimator lens is snapped onto the LED package base. 图10和图11是本发明公开的两种不同形状的准直透镜50的光线追踪示意图。 10 and 11 are two different shapes of the present invention is disclosed in light of the collimator lens 50 Tracking FIG. 准直透镜50具有一个旋转对称轴52。 The collimator lens 50 having a rotational symmetry axis 52. 发光二极管芯片的中心点是61,准直透镜50的构成部分分为顶部椭圆部分53,上表面全反射/折射部分54,准直透镜上侧面反射部分55,准直透镜下侧面的全反射部分56。 Is the center point of the light emitting diode chip 61, constituting part of the collimator lens 50 into an elliptical top portion 53, the upper surface of the total reflection / refraction portion 54, the collimator lens side surface reflection portion 55, a collimating totally endoscopic portion of the side surface 56. 图10中,上表面全反射/折射部分54、准直透镜上侧面全反射部分55、准直透镜下侧面的全反射部分56均为光滑的曲线。 10, the upper surface of the total reflection / refraction portion 54, totally reflected on the side surface portion of the collimator lens 55, the collimating side of the microscope portion 56 are totally smooth curve. 图ll中,准直透镜上侧面全反射部分55由两条直线构成,上表面全反射/折射部分54由多段直线构成,准直透镜下侧面的全反射部分56为光滑曲线。 FIG ll, the upper side surface of the collimator lens portion 55 is composed of totally two lines, the upper surface of the total reflection / refraction portion 54 is constituted by multi-stage linear, totally endoscopic collimating side surface portion 56 is a smooth curve. 图10和图11中,与旋转对称轴52夹角较小(大约0°-30°) 的从发光二极管发出的光线直接通过准直透镜顶部的折射部分53得到折射,经过一次折射得到准直。 In FIGS. 10 and 11, 52 with the axis of rotational symmetry small angle (approximately 0 ° -30 °) of the light emitted from the light emitting diode directly through the refracting portion refracting the top of the collimator lens 53, through a collimating refractive give . 与旋转对称轴52夹角较大(大约50°-90。)的从发光二极管发出的光线直接通过准直透镜下侧面的全反射部分56得到全反射,再通过准直透镜上表面折射/全反射部分54 得到折射,光线经过一次全反射和一次折射得到准直。 52 with the axis of rotational symmetry greater angle (approximately 50 ° -90.) From the light emitting diode is emitted directly through the collimating side of the microscope portion 56 to obtain the total reflection is totally reflected, refracted through the upper surface of the collimator lens / Full to give the reflecting portion 54 is refracted and totally reflected light passes through a first collimating refractive obtained. 与旋转对称轴夹角适中(大约30°-50°) 的从发光二极管发出的光线直接通过准直透镜上表面的折射/全反射部分54得到全反射, 再通过准直透镜上侧面反射部分55得到反射,最后经过准直透镜上表面折射/全反射部分54得到折射,光线经过一次全反射、 一次反射和一次折射得到准直。 Light emitted from the light emitting diode and the axis of rotational symmetry moderate angle (approximately 30 ° -50 °) is directly obtained totally by refraction / total reflection portion 54 on the surface of the collimator lens, then reflected by the side surface of the collimator lens portion 55 obtained reflection, and finally through the collimating lens refracting surface / total reflection portion 54 to give refracted, totally reflected light passes through a primary reflector and a collimating refractive obtained. 这样,与旋转对称轴52夹角0°到90°的光线都能得到准直。 Thus, the light 52 with an angle of 0 ° to 90 ° rotational symmetry axis of the collimator can be obtained. 由于所述准直透镜上側面全反射部分54处不满足光线全反射条件,需要在所述准直透镜上侧面反射部分54处镀高反射率金属膜。 Since the collimator lens at a side surface portion 54 does not satisfy the total reflection condition of total reflection of light, high reflectivity requires plating the metal film 54 at a portion on the side surface of the reflective collimator lens. 镀膜的方式可以是,但不限于真空蒸发、溅射、电镀等,采用的材料可以是但不限于铝、银、镍铬合金等金属图12是本发明公开的不具有旋转对称性的准直透镜70的三维示意图。 Coating mode may be, but is not limited to vacuum evaporation, sputtering, plating or the like, may be used, but the material is not limited to FIG metal aluminum, silver, nickel-chromium alloy 12 of the present invention is disclosed without rotational symmetry collimating lens 70 D representation. 准直透镜70具有一个对称轴71,发光二极管芯片的中心位于点61。 A collimator lens 70 having an axis of symmetry 71, the light emitting diode chip is located at the center point 61. 准直透镜70的通过对称轴71的任意端面均具有图10或者图11的结构,只是准直透镜70不具有旋转对称性。 A collimator lens 70 by any of the symmetry axis of the end faces 71 each having the structure of FIG. 10 or FIG. 11, only the collimating lens 70 does not have rotational symmetry. 准直透镜70是由准直透镜50直接切割而成,切割的结果是准直透镜70的上表面全反射/折射曲面在对称轴71的方向上的投影是一个正N边形(图12描述的是一个正方形),所以准直透镜70具有正N边形结构。 The collimator lens 70 is a collimator lens 50 cut directly from, the result is the cutting of the collimator lens on the surface of the total reflection / refraction curved projection in the direction of the axis of symmetry 71 N 70 is a positive edge-shaped (FIG. 12 described is a square), the collimator lens 70 having a regular N-gon structure. 正N边形结构的准直透镜同样可以制作准直发光二极管。 N collimating lens regular polygon structure can also create a collimated light emitting diode. 正N边形准直透镜的最大优势在于可扩展性。 Regular N-polygon collimating lens biggest advantage is scalability. 多个由正N边形准直透镜封装的准直发光二极管可以集群使用,形成一个更大面积的光源。 A plurality of clusters may be used by the collimator lens collimating the light emitting diode package shaped positive side N, form a larger area of ​​the light source. 图13是本发明公开的正N边形准直透镜集群使用的示意图。 FIG 13 is a schematic side regular N-shaped collimator lens cluster used in the present disclosure. 多个(1〈N〈1000000)由正N 边形准直透镜70封装的准直发光二极管可以集群使用,绑定在散热基板42上,形成一个更大面积的光源。 A plurality (1 <N <1000000) shaped collimator lens 70 collimating the light emitting diode package may be used by the cluster N positive side, the heat bound in the substrate 42, forming a larger area of ​​the light source. 所述多个(KN〈1000000)正N边形准直透镜70封装的LED模块之间的连接可以采用咬合方式、粘接方式等。 The plurality of (KN <1000000) connected between regular N-gon collimator lens 70 packaged LED module engaging manner, adhering manner may be employed. 所述多个正N边形准直透镜70封装的LED模块可以采用一个整体的正N边形准直透镜,由模具注塑的方法制作。 The plurality of regular N-polygon collimating lens 70 packaged LED module may employ a regular N-gon integral collimating lens, a mold produced by injection molding. 所述多个正N边形准直透镜封装的LED模块可以采用一个整体的正N边形准直透镜,由灌注脱膜的方法制作。 The plurality of regular N-gon packaged LED collimator lens module may employ a regular N-gon integral collimating lens, produced by the process of release of perfused. 所述多个正N边形准直透镜封装的LED模块可以釆用一个整体的正N边形准直透镜,由金刚石刀具加工的方法制作。 The plurality of regular N-gon packaged LED collimator lens module may preclude integrally formed collimating lens side of the regular N, produced by the method of diamond cutting tools. 所述准直透镜50也可以封装除发光二极管以外的其他任意近似点光源,可以是但不限于白炽灯、卤素灯。 The collimator lens 50 may also be encapsulated in any other similar light emitting diode other than the point light source, but is not limited to, incandescent lamps, halogen lamps. 图14是本发明公开的准直透镜50经过实验检验以后得到的极坐标下四个不同截面上的光强远场分布图。 FIG 14 is a far-field light intensity distribution on the polar coordinates four different sections of the collimator lens 50 through the disclosure of the present invention after experimental tests obtained. 由图14可见,91/2 (光强远场分布全角)仅为12。 As it is seen in FIG. 14, 91/2 (far-field light intensity distribution full angle) is only 12. 左右,这说明本发明公开的准直透镜50能够有效的将发光二极管的近似点光源转换成一个定向性很好的面光源。 Left, indicating that the collimator lens 50 of the present invention disclosed can effectively convert a point light source similar to light emitting diode is a very good orientation of a surface light source. 而且图14显示:四个截面上的光强远场分布图近似重合,说明准直透镜50封装的具有准直功能的发光二极管的光强分布在旋转轴方向上也具有对称性。 And Figure 14 shows: the far-field light intensity distribution on a cross-sectional view four approximately coincident described light emitting diode having a collimating function of the collimator lens 50 of the package to the symmetric intensity distribution in the rotational axis direction.

Claims (10)

1. 一种具有准直功能的发光二极管封装结构,其特征在于,它含有一个封装底座和一个绑定在封装底座上封装发光二极管的准直透镜,所述准直透镜含有:准直透镜顶部的折射部分,位于透镜上表面中心区域且准直透镜的旋转对称轴穿过该部分,它所折射的是发光二极管发出的光中与所述准直透镜的旋转对称轴夹角小的那一部分光线;准直透镜下侧面的全反射部分,位于透镜的侧表面的下部,与封装底座邻接,它所全反射的是发光二极管发出的光中与所述准直透镜的旋转对称轴夹角大的那一部分光线;准直透镜上表面的折射/全反射部分,邻接于准直透镜顶部的折射部分和准直透镜上侧面的全反射部分,它所折射的是从上述准直透镜下侧面的全反射部分所全反射出来的光线和从准直透镜上侧面全反射部分全反射出来的光线;它所全反射的是从发光二 1. A light emitting diode package having a collimating function, characterized in that it comprises a package base and a collimating lens package on the light emitting diode package base binding, the collimator lens comprising: a collimating lens top refractive portion, a rotationally symmetrical surface is located in a central region of the lens and the collimator lens through which the shaft portion, it is the axis of rotational symmetry of the refractive angle that small portion of the light emitted by the light emitting diode and the collimator lens light; collimating microscopic total reflection side surface portion, located at the lower side surface of the lens, adjacent to the package base, it is totally reflected in the light emitted from the light emitting diode and the collimator lens axis of rotational symmetry and large that portion of the light; refraction / total reflection surface portion of the collimator lens, the refractive portion adjacent to the top collimator lens and the collimator lens is totally reflected on the side surface portion, it is refracted from the side of the collimator microscope totally reflected by the total reflection portion out of the light from the collimator lens and the side surface portion of the total reflection is totally reflected light out; it is totally reflected from the light emitting 极管发出的光中与所述准直透镜的旋转对称轴夹角居中的那一部分光线;所述的准直透镜上侧面的全反射部分,位于透镜的侧表面的上部,邻接于准直透镜上表面的折射/全反射部分和准直透镜下侧面的全反射部分,它所全反射的是从上述准直透镜上表面折射/全反射部分中所全反射过来的那一部分光线。 Light emitted by the diode angle of rotation of the axis of symmetry of the collimator lens portion of the light that is centered; total reflection portion on the side of said collimator lens, an upper side surface of the lens positioned adjacent to the collimator lens refracting / collimating totally endoscopic portion and a side portion of the total reflection surface, it is the total reflection surface refracting / totally reflected by the total reflection portion over that portion of the light from said collimator lens.
2. 根据权利要求1所述的一种具有准直功能的发光二极管封装结构,其特征在于: 所述的准直透镜在与所述旋转对称轴垂直的平面上的投影是一个正N边形,N〉2,是一个正N边形准直透镜。 2. A method according to claim 1 having a light emitting diode package collimating function, wherein: said collimator lens and said axis of symmetry perpendicular to the plane of projection of the rotation is a regular N-gon , N> 2, is a regular N-gon collimator lens.
3. 根据权利要求1或2所述的一种具有准直功能的发光二极管封装结构,其特征在于:所述准直透镜所用材料的折射率在1. 3〜3. 5之间。 3. A member according to claim 1 or claim 2, wherein the light emitting diode package having a collimating function, wherein: said collimating lens with a refractive index of the material between 5 1. 3~3.
4. 根据权利要求1所述的一种具有准直功能的发光二极管封装结构,其特征在于: 所述准直透镜中,其顶部的折射部分、上表面折射/全反射部分、上侧面和下侧面的全反射部分的轮廓线是直线的一段和下列曲线的一段:圆、双曲线、椭圆、抛物线、曲线方程在2次以上的高次曲线,或者是上述直线和曲线中任何一种两条或两条以上拼接的一段。 According to one of the claim 1 having a light emitting diode package collimating function, characterized in that: said collimator lens, the refraction portion of the top, the upper surface refracting / total reflection portion, an upper side and a lower the side contour line portion is a section totally linear curves and the following: more than 2 times higher circle curve, hyperbolic, elliptical, parabolic, curve equation, the straight line or curve and any one of two or a period of more than two splice.
5. 根据权利要求1所述的一种具有准直功能的发光二极管封装结构,其特征在于:所述准直透镜上侧面全反射部分镀有高反射率膜。 5. A method according to claim 1 having a light emitting diode package collimating function, wherein: said side surface is totally reflected on the collimator lens portion is plated with a high reflectance film.
6. 根据权利要求1所述的一种具有准直功能的发光二极管封装结构,其特征在于: 所述准直透镜的构成部分进一步包括一个用于放置发光二极管且形状任意的区域, 所述区域是用透明材料填充的,所述透明材料的折射率在1.3〜3.5之间,它的折射率与所述准直透镜的材料的折射率之差ArKl. 0。 6. A method according to claim 1 having a light emitting diode package collimating function, wherein: said component further comprises a collimator lens for placing a light emitting diode and the shape of any region, the region is filled with a transparent material, the refractive index of the transparent material between 1.3~3.5, the refractive index difference ArKl having a refractive index of the collimator lens material. 0.
7. 根据权利要求1所述的一种具有准直功能的发光二极管封装结构,其特征在于: 所述准直透镜的构成部分进一步包括一个用于放置一个采用半球形透镜封装的LED 的区域,该区域的形状与上述半球形透镜的形状相吻合,两者之间是透明的材料, 所述透明材料的折射率在1. 3〜3. 5之间,它的折射率与所述准直透镜的材料的折射率之差An〈1.0。 According to one of the claim 1 having a light emitting diode package collimating function, wherein: said component further comprises a collimator lens of a LED placed in a region for the use of hemispherical lens package, the shape of the region and the shape of the hemispherical lens coincide therebetween is a transparent material, the refractive index of the transparent material is between 1 3~3. 5, that the refractive index of the collimating An difference between the refractive index of the lens material is <1.0.
8. 根据权利要求1所述的一种具有准直功能的发光二极管封装结构,其特征在于: 所述准直透镜的构成部分进一步包括一个用于放置一个采用半球形透镜封装的LED 的区域,该区域的形状与上述半球形透镜的形状相吻合,但两者之间存在一个空腔。 According to claim 1, wherein one of the light emitting diode package having a collimating function, wherein: said component further comprises a collimator lens of a LED placed in a region for the use of hemispherical lens package, the shape of the region and the shape of the hemispherical lens coincide, but there is a cavity therebetween.
9. 根据权利要求1所述的一种具有准直功能的发光二极管封装结构,其特征在于-所述的准直透镜是一个准直透镜组,它由M个相同的准直透镜水平拼装扩展而成, 它的面积不小于MXS,其中S是所述透镜组中每一个透镜在俯视图上的投影面积。 According to claim 1, wherein one of the light emitting diode package having a collimating function, characterized in that - said collimating lens is a collimator lens group, which consists of M identical collimator lens assembly horizontally extended made, its area is not less than MXS, where S is the projected area of ​​each lens group in a plan view of the lens.
10. 根据权利要求1所述的一种具有准直功能的发光二极管封装结构,其特征在于:所述的发光二极管是用点光源来代替的。 1 according to one of said light emitting diode package structure as claimed in claim collimating function, wherein: said light emitting diode is replaced by a point light source.
CN 200410078142 2004-09-17 2004-09-17 Novel alignment light emitting diode packaging construction CN100470853C (en)

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Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101098338B1 (en) 2005-04-22 2011-12-26 삼성전자주식회사 Optic package, optic lens and backlight assembly and display device having the optic package
JP4542954B2 (en) 2005-06-14 2010-09-15 株式会社リコー Light irradiation apparatus and an image reading apparatus and an image forming apparatus using the same
EP1734388A1 (en) 2005-06-14 2006-12-20 Ricoh Company, Ltd. Optical irradiation apparatus, image reading apparatus using the same, and image forming apparatus using the same
CN100399149C (en) 2005-09-19 2008-07-02 中强光电股份有限公司 Illuminating device and plane light-source module
US7795632B2 (en) 2006-06-26 2010-09-14 Osram Sylvania Inc. Light emitting diode with direct view optic
CN101206271B (en) 2006-12-19 2012-04-11 香港应用科技研究院有限公司 Device for transmitting and coupling in full reflection side
CN101182904B (en) 2007-11-30 2010-06-09 中国计量学院 Traffic signal light taking high power LED as light source high power LED
CN101725901B (en) 2008-10-24 2012-07-18 鸿富锦精密工业(深圳)有限公司 The light source module
CN101476695B (en) 2009-01-21 2012-07-11 杭州杭科光电有限公司 Lens of LED light source for road lamp and road lamp using the same
CN101691915B (en) 2009-07-16 2012-01-04 江苏伯乐达光电科技有限公司 Led street light lens
CN101684919B (en) 2009-07-16 2012-01-11 江苏伯乐达光电科技有限公司 Led street light lens
CN101621107B (en) 2009-07-30 2012-09-26 深圳市聚飞光电股份有限公司 Light-emitting diode with high light efficiency and encapsulation method thereof
CN101994991B (en) 2009-08-27 2012-02-29 杨璨源 Energy saving lamp
CN101900291A (en) * 2010-07-22 2010-12-01 李瑞坤 LED street lamp lens
CN102322610A (en) * 2011-06-24 2012-01-18 深圳市众明半导体照明有限公司 Condensing lens, luminaire and camera
CN102313246B (en) * 2011-09-05 2013-12-04 广东威创视讯科技股份有限公司 Area light source collimation device and light beam collimation method
CN102364713A (en) * 2011-11-08 2012-02-29 吕能兵 Light emitting diode (LED) bracket and crystallizing method

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000024062A1 (en) 1998-10-21 2000-04-27 Koninklijke Philips Electronics N.V. Led module and luminaire
WO2001069300A2 (en) 2000-03-16 2001-09-20 Led Products, Inc. High efficiency non-imaging optics

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000024062A1 (en) 1998-10-21 2000-04-27 Koninklijke Philips Electronics N.V. Led module and luminaire
WO2001069300A2 (en) 2000-03-16 2001-09-20 Led Products, Inc. High efficiency non-imaging optics

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