CN102261584A - Light-emitting module - Google Patents
Light-emitting module Download PDFInfo
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- CN102261584A CN102261584A CN2010101952174A CN201010195217A CN102261584A CN 102261584 A CN102261584 A CN 102261584A CN 2010101952174 A CN2010101952174 A CN 2010101952174A CN 201010195217 A CN201010195217 A CN 201010195217A CN 102261584 A CN102261584 A CN 102261584A
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- light emitting
- emitting module
- adhesive body
- led crystal
- light
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Abstract
A light-emitting module comprises a substrate, a plurality of light-emitting diode dies, a receiving assembly and a sealant. The light-emitting diode dies are arranged on the substrate in a wire bonding or flip-chip bonding manner. The receiving assembly is provided with a receiving portion in which the substrate and the light-emitting diode dies are accommodated. The sealant covers the light-emitting diode dies and contacts with the receiving assembly. The light-emitting module of the invention is capable of accelerating the manufacture procedure and improving the heat radiation efficacy.
Description
Technical field
The invention relates to a kind of light emitting module, particularly about a kind of light emitting module with light emitting diode
Background technology
Light emitting diode is a kind of emerging light emitting source, and it has long, advantage such as cracky and volume be not little of life-span.Light emitting diode also is applied to many products, for example is applied in the lighting apparatus or the back light unit of flat display apparatus.Wherein, light emitting diode is that arrangement forms a striation (light bar) and is applied to side-mounted back light unit.
Please refer to shown in Figure 1A, it is the cutaway view of known a kind of side-mounted back light unit 1.Wherein, back light unit 1 is as light emitting source with LED optical strip (light bar) 11.
Back light unit 1 comprises a LED optical strip 11, a LGP 12, a heat-sink unit 13 and a backboard 14.LED optical strip 11 is arranged at the light inlet side 121 of LGP 12, and is positioned on heat-sink unit 13 and the backboard 14.The heat that LED optical strip 11 is produced can conduct via heat-sink unit 13 and backboard 14.
Back light unit 1 more comprises a framework 15 and an optical diaphragm group 16.Wherein, optical diaphragm group 16 is arranged at the bright dipping side 122 of LGP 12, penetrates equably with the light that LED optical strip 11 is sent, and then promotes the optical property of light.In addition, by combining of framework 15 and backboard 14, LED optical strip 11, LGP 12 and optical diaphragm group 16 are fixed between framework 15 and the backboard 14.
Please refer to shown in Figure 1B, it is the schematic diagram of the LED optical strip 11 of Figure 1A.LED optical strip 11 comprises a circuit board 111 and plural light emitting diode 112, and light emitting diode 112 is to arrange with one dimension to be arranged on the circuit board 111.
Light emitting diode 112 has at least one LED crystal particle D, an encapsulating housing H and an adhesive body S respectively.Encapsulating housing H be surface mount in circuit board 111, LED crystal particle D is after being arranged at encapsulating housing H respectively, with adhesive body S the LED crystal particle D in each encapsulating housing H is carried out the processing procedure of a glue again.
Yet the manufacturing process of above-mentioned LED optical strip 11 needs to carry out the some glue processing procedure of adhesive body S more one by one after encapsulating housing H is installed on the surface one by one on the circuit board 111, therefore quite wastes time and energy.Moreover because the time of some glue is longer, the fluorescent material among the adhesive body S can precipitate gradually, and then causes the fluorescent material density unevenness in each adhesive body S even.In addition, the heat that LED optical strip 11 is produced can only be via circuit board 111 with thermal energy conduction to heat-sink unit 13 and backboard 14, heat dissipation path and heat dissipation also may be not enough.
Therefore, how to design a kind of light emitting module, can quicken processing procedure and can promote heat dissipation, become one of important topic gradually.
Summary of the invention
Because above-mentioned problem the purpose of this invention is to provide a kind of light emitting module that can quicken processing procedure and can promote heat dissipation.
For reaching above-mentioned purpose, comprise a substrate, plural LED crystal particle, a ccontaining assembly and an adhesive body according to a kind of light emitting module of the present invention.LED crystal particle engages with routing or chip bonding is arranged at substrate.Ccontaining assembly has a holding part, and substrate and this LED crystal particle are to be placed in holding part.Adhesive body covers this LED crystal particle and contacts ccontaining assembly.
In one embodiment of this invention, adhesive body contacts a sidewall of the holding part of ccontaining assembly.The holding part of ccontaining assembly is as the barricade of adhesive body.Holding part is positioned at a side of ccontaining assembly.Holding part has more a bottom side, and substrate is arranged at bottom side and parallel with the bottom side.
In one embodiment of this invention, a sidewall of ccontaining assembly has a reflecting surface, to reflect the light that this LED crystal particle is sent.Wherein, reflecting surface comprises a plane or a curved surface or a convex surface or a concave surface.
In one embodiment of this invention, adhesive body comprises a fluorescent material, and is to cover at least two these LED crystal particles continuously.Adhesive body is to have a slit or a bubble, and slit or bubble are between two these adjacent LED crystal particles.
In one embodiment of this invention, light emitting module more comprises at least one sept, is to be arranged between two these adjacent LED crystal particles.Wherein, sept is to be arranged on the substrate, and sept has light transmission, and sept has high reflecting surface, and the height of sept is lower than the height of adhesive body.
From the above, because of foundation a kind of light emitting module of the present invention, it is with next ccontaining substrate of the holding part of ccontaining assembly and LED crystal particle, and adhesive body covers plural LED crystal particle and contact ccontaining assembly.In other words, the present invention is with the barricade of holding part as adhesive body.Whereby, in the time of can avoiding a some glue processing procedure, adhesive body produces the phenomenon of the glue that overflows.In known technology, carrying out the some glue processing procedure of LED crystal particle on circuit board one by one compares, light emitting module of the present invention need not be provided with encapsulating housing, and adhesive body can once just finish the manufacture procedure of adhesive and the solidified forming of plural LED crystal particle, therefore can quicken processing procedure.In addition, LED crystal particle except can via substrate with thermal energy conduction to the ccontaining assembly, also can be via adhesive body, again via holding part with thermal energy conduction to ccontaining assembly.Therefore, the present invention has more heat dissipation path, also can promote the heat dissipation of light emitting module.In addition, in one embodiment of this invention, adhesive body can once just be finished the manufacture procedure of adhesive of plural LED crystal particle, so the adhesive body in the different light emitting diode can not cause the fluorescent material density unevenness even, and then can reach light emitting module emitting uniform effect
Description of drawings
Figure 1A is the cross-sectional schematic of known a kind of side-mounted back light unit;
Figure 1B is the schematic diagram of the LED optical strip of Figure 1A;
Fig. 2 A and Fig. 2 B are respectively the schematic perspective view and the schematic side view of a kind of light emitting module of preferred embodiment of the present invention;
Fig. 3 is the schematic side view of the light emitting module of another aspect of the present invention;
Fig. 4 A, Fig. 4 B and Fig. 4 C are respectively the schematic perspective view of the light emitting module of the another variation aspect of the present invention;
Fig. 5 A and Fig. 5 B are respectively the present invention's schematic perspective view of the light emitting module of a variation aspect again; And
Fig. 6 is the cross-sectional schematic of the back light unit of application light emitting module of the present invention.
The primary clustering symbol description:
1,4: back light unit
11: LED optical strip
111: circuit board
112: light emitting diode
12,41: LGP
121,411: the light inlet side
122,412: the bright dipping side
13: heat-sink unit
14,43: backboard
15,44: framework
16,45: optical diaphragm group
2,2a, 2b, 2c, 2d, 3a, 3b, 5: light emitting module
21,31,51: substrate
22,32,52: LED crystal particle
23,23a, 53: ccontaining assembly
231,531: holding part
232,532,534: side
233: the surface
24,24a, 24b, 24c, 34a, 34b, 54: adhesive body
241a, 241b, 241c: slit
35a, 35b: sept
B: bottom side
D: LED crystal particle
H: housing
S: adhesive body
W: sidewall
The specific embodiment
Hereinafter with reference to correlative type, the light emitting module according to preferred embodiment of the present invention is described, wherein identical assembly will be illustrated with identical reference marks.
Please refer to shown in Fig. 2 A and Fig. 2 B, it is respectively the schematic perspective view and the side view of a kind of light emitting module 2 of preferred embodiment of the present invention.Light emitting module 2 comprises a substrate 21, plural LED crystal particle 22, one ccontaining assembly 23 and an adhesive body 24.Light emitting module 2 of the present invention becomes its back light unit except that can for example being applied to a display unit, also can be applicable to a lighting device, an advertising lamp box, an outdoor billboard or a traffic sign.
In addition, the quantity and the arrangement mode of the LED crystal particle 22 of light emitting module 2, and unrestricted.Present embodiment is that to be the one dimension substrate 21 that is arranged at arranged in a straight line with plural LED crystal particle 22 be that example illustrates.Certainly, also can be according to the actual product demand, plural LED crystal particle 22 is two-dimensional array arranges or other arrangement, or even irregular alignment and being arranged on the substrate 21.
In addition, as shown in Figure 3, the ccontaining assembly 23a of the light emitting module 2a of another aspect of the present invention more can comprise a reflecting surface 233, and reflecting surface 233 is sidewall W that are positioned at holding part 231.At this, be the W of two side up and down with holding part 231 to have a reflecting surface 233 respectively be example, two side W can have length identical or inequality, is that to have length inequality with two side W be example in the present embodiment.Reflecting surface 233 can reflect the light that LED crystal particle 22 is sent.Wherein, reflecting surface 233 for example can attach the reflecting layer of a high reflectance, metal coating or reflector plate and form on sidewall W; Perhaps, it is made and have reflecting surface 233 that the sidewall W of ccontaining assembly 23a is the high reflectance material.In this, be that to attach a reflecting layer be example for sidewall W with ccontaining assembly 23a.Utilize reflecting surface 233 can reflect the light that LED crystal particle 22 is sent, and promote the light utilization of light emitting module 2a.
Special one carry be, reflecting surface 233 is not restricted to the plane, it also can be on demand and different, for example can comprise a curved surface or a convex surface or a concave surface or a conical surface etc., with reflection and modify the light shape and the light direction thereof of LED crystal particle 22.
Shown in Fig. 2 A and Fig. 2 B, adhesive body 24 is to cover this LED crystal particle 22 and contact ccontaining assembly 23.Wherein, adhesive body 24 is that the W of two side up and down of the holding part 231 of the ccontaining assembly 23 of contact is an example.Because of adhesive body 24 when some glue processing procedure, be the colloid of tool flowability, the W of two side up and down of holding part 231 that utilizes ccontaining assembly 23 can make adhesive body 24 be limited in the holding part 231 and solidified formings as the barricade of adhesive body 24.
Wherein, adhesive body 24 is to cover continuously at least two LED crystal particles 22, at this, is that to cover whole LED crystal particles 22 continuously with adhesive body 24 be example.In addition, adhesive body 24 can comprise a fluorescent material, fluorescent material excited by LED crystal particle 22 and light behind mixed light, light emitting module 2 can produce needed coloured light, for example is white light.In addition, because adhesive body 24 contact LED crystal particle 22 and ccontaining assemblies 23 promote heat dissipation so the heat that LED crystal particle 22 produced can directly conduct to ccontaining assembly 23 via adhesive body 24.In addition, because present embodiment is the some glue processing procedure of once just finishing plural LED crystal particle 22,, and then can reach light emitting module 2 emitting uniform effects so the fluorescent materials in the adhesive body 24 are difficult for sparing because of the time factor density unevenness.Review known owing to need gradation to carry out the some glue of each light emitting diode, thus the fluorescent material in the adhesive body along with each some glue precipitation so that produce density unevenness and spare slowly.
In addition, please respectively with reference to shown in Fig. 4 A, Fig. 4 B and Fig. 4 C, it is respectively light emitting module 2b, the 2c of variation aspect of the present invention, the schematic perspective view of 2d.In order to clearly demonstrate, Fig. 4 A, Fig. 4 B and Fig. 4 C have different view directions with Fig. 2 A.
The main difference of light emitting module 2b, 2c, 2d and light emitting module 2 is, adhesive body 24a, the 24b of light emitting module 2b, 2c, 2d, 24c have at least one slit 241a, 241b, 241c or a bubble respectively, and slit 241a, 241b, 241c or bubble are to lay respectively between the two adjacent LED crystal particles 22.In this, be with have slit 241a, 241b respectively, 241c is an example.
Wherein, slit 241a, 241b, 241c can utilize laser cutting or other physics cutting method to form; Then reliable laser carved or other method formation of bubble.Slit 241a makes the adhesive body 24a of light emitting module 2b block into one one fully, slit 241b blocks the adhesive body 24b part from top to bottom between light emitting module 2c two crystal grain 22, and slit 241c blocks the adhesive body 24c part from bottom to top between light emitting module 2d two crystal grain 22.
Because adhesive body 24a, 24b, 24c cover plural LED crystal particle 22 continuously, produce so may have the stress of accumulation, may pull apart the routing of LED crystal particle 22 in the time of seriously and reduce the reliability of light emitting module 2b, 2c, 2d.Therefore, can destroy the stress that adhesive body 24a, 24b, 24c accumulate at manufacture procedure of adhesive continuously by the setting of slit 241a, 241b, 241c or bubble, to reach the purpose of protection light emitting module 2b, 2c, 2d.In addition, all need between the not necessarily whole LED crystal particle 22 of slit 241a, 241b, 241c or bubble to be provided with, also can optionally be provided with.
Please respectively with reference to shown in Fig. 5 A and Fig. 5 B, it is respectively the present invention and one changes the light emitting module 3a of aspect and the schematic perspective view of 3b again.
The main difference of light emitting module 3a, 3b and light emitting module 2 is that light emitting module 3a, 3b more can comprise at least one sept 35a, 35b, and it is to be arranged on the substrate 31 or on the ccontaining assembly 331, and between two adjacent LED crystal particles 32.In this, be to be example so that sept 35a, 35b all to be set between two crystal grain 32, certainly, it is nonrestrictive, also sept 35a, 35b can be set between part two crystal grain 32.Sept 35a, 35b can be sapphire substrate or glass.In addition, sept 35a, 35b can have high reflecting surface (for example being reflector plate), with the light that sent of reflection LED crystal particle 32, reach the effect of light directive property or sept 35a, 35b also light-permeable for example be frosted glass to reach the effect of mixed light.Utilize sept 35a, 35b to destroy to be provided with stress that adhesive body 34a, 34b accumulated to promote the reliability of protection light emitting module 3a, 3b.
What specify is, the maximum height (on the light direction of light emitting diode) that is provided with of sept 35a, 35b is that can be higher or lower than the upper surface of the upper level of adhesive body 34a, 34b or comparable LED crystal particle 32 high or low or more high or low than the peak of the routing of LED crystal particle 32.At this, be with sept 35a, 35b the upper level that maximum height is lower than adhesive body 34a, 34b is set is example.In addition, sept 35a, 35b can cut off adhesive body 34a, 34b fully, certainly, also can partly cut off adhesive body 34a, 34b (as Fig. 5 A and Fig. 5 B).Sept 35a, 35b can be arranged on the substrate 31 by planting brilliant machine.
Shown in Fig. 5 A, sept 35a for example can be a space bar, and cuts off adhesive body 34a fully, and (crosstalk) disturbed in the bright dipping that can reduce between the LED crystal particle 32; Perhaps, shown in Fig. 5 B, sept 35b for example can be a rib, and part is cut off adhesive body 34b.
In addition, please refer to shown in Figure 6ly, illustrate that a kind of light emitting module 5 of the present invention is applied to back light unit 4.
Back light unit 4 comprises a light emitting module 5, a LGP 41, a backboard 43, a framework 44 and an optical diaphragm group 45.Light emitting module 5 comprises a substrate 51, plural LED crystal particle 52, one ccontaining assembly 53 and an adhesive body 54.LED crystal particle 52 engages with routing or chip bonding is arranged at substrate 51.Ccontaining assembly 53 has a holding part 531 and is positioned at a side 532 of ccontaining assembly 53, and substrate 51 and these LED crystal particles 52 are to be placed in holding part 531.Adhesive body 54 covers this LED crystal particle 52 and contacts ccontaining assembly 53.
The holding part 531 of light emitting module 5, substrate 51 and LED crystal particle 52 are arranged on the light inlet side 411 of LGP 41.Optical diaphragm group 45 is arranged on the bright dipping side 412 of LGP 41, penetrates equably with the light that light emitting module 5 is sent, and then promotes the optical property of light.In addition, the side 534 that ccontaining assembly 53 links to each other with holding part 531 can be used as reflector plate, and the light that light emitting module 5 is sent can be reflected in its surface.In addition, by combining of framework 44 and backboard 43, light emitting module 5, LGP 41 and optical diaphragm group 45 are fixed between framework 44 and the backboard 43.
What specify is, the ccontaining assembly 53 of light emitting module 5 of the present invention except that can ccontaining substrate 51 and LED crystal particle 52, the heat that LED crystal particle 52 is distributed also can see through the W of two side up and down and the bottom side B of substrate 51, adhesive body 54, ccontaining assembly 53, and backboard 43 exhales, therefore, its heat distributes path many than known technology, and then can promote the reliability of light emitting module 5.
In addition, because light emitting module 5 can have the technical characterictic of the light emitting module of aforementioned all aspects, repeat no more in this.
In sum, because of foundation a kind of light emitting module of the present invention is with next ccontaining substrate of the holding part of ccontaining assembly and LED crystal particle, and adhesive body is to cover plural LED crystal particle and contact ccontaining assembly.In other words, the present invention is with the barricade of holding part as adhesive body.Whereby, in the time of can avoiding a some glue processing procedure, adhesive body produces the phenomenon of the glue that overflows.In known technology, carrying out the some glue processing procedure of LED crystal particle on circuit board one by one compares, light emitting module of the present invention need not be provided with encapsulating housing, and adhesive body can once just finish the manufacture procedure of adhesive and the solidified forming of plural LED crystal particle, therefore can quicken processing procedure.In addition, LED crystal particle except can via substrate with thermal energy conduction to the ccontaining assembly, also can be via adhesive body, again via holding part with thermal energy conduction to ccontaining assembly.Therefore, the present invention has more heat dissipation path, also can promote the heat dissipation of light emitting module.In addition, in one embodiment of this invention, adhesive body can once just be finished the manufacture procedure of adhesive of plural LED crystal particle, so the adhesive body in the different light emitting diode, can not cause the fluorescent material density unevenness even, and then can reach light emitting module emitting uniform effect.
The above only is an illustrative, but not is restricted.Anyly do not break away from spirit of the present invention and category, and, all should be included in the appended claim its equivalent modifications of carrying out or change
Claims (12)
1. light emitting module comprises:
One substrate;
The plural number LED crystal particle is arranged at this substrate with routing joint or chip bonding;
One ccontaining assembly has a holding part, and this substrate and this LED crystal particle are placed in this holding part; And
One adhesive body covers this LED crystal particle and this ccontaining assembly of contact.
2. light emitting module according to claim 1, wherein this ccontaining assembly is a radiating subassembly.
3. light emitting module according to claim 1, wherein this adhesive body contacts a sidewall of this holding part of this ccontaining assembly.
4. light emitting module according to claim 1, wherein this holding part of this ccontaining assembly is as the barricade of this adhesive body.
5. light emitting module according to claim 1, wherein this holding part has more a bottom side, and this substrate is arranged at this bottom side and parallel with this bottom side.
6. light emitting module according to claim 1, wherein this ccontaining assembly is a crowded type assembly or a punch assembly.
7. light emitting module according to claim 1, wherein this adhesive body covers at least two these LED crystal particles continuously.
8. light emitting module according to claim 1, wherein this adhesive body has a slit or a bubble, and this slit or this bubble are between two these adjacent LED crystal particles.
9. light emitting module according to claim 1 more comprises:
At least one sept is to be arranged between two these adjacent LED crystal particles.
10. light emitting module according to claim 9, wherein this sept has light transmission.
11. light emitting module according to claim 9, wherein this sept has high reflecting surface.
12. light emitting module according to claim 9, wherein the height of this sept is lower than the height of this adhesive body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101952174A CN102261584A (en) | 2010-05-31 | 2010-05-31 | Light-emitting module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101952174A CN102261584A (en) | 2010-05-31 | 2010-05-31 | Light-emitting module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102261584A true CN102261584A (en) | 2011-11-30 |
Family
ID=45008336
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010101952174A Pending CN102261584A (en) | 2010-05-31 | 2010-05-31 | Light-emitting module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102261584A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104895264A (en) * | 2015-05-21 | 2015-09-09 | 深圳迪生鸿基科技有限公司 | Light-emitting wall face structure |
| CN105957947A (en) * | 2016-05-16 | 2016-09-21 | 漳州立达信光电子科技有限公司 | LED area light source and preparation method thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101354121A (en) * | 2007-07-25 | 2009-01-28 | 群康科技(深圳)有限公司 | Light source, method for manufacturing light source and backlight module unit using the same |
| CN101546063A (en) * | 2008-03-27 | 2009-09-30 | 深圳帝光电子有限公司 | Ultra thin type LCD use backlight module taking LED as light source |
-
2010
- 2010-05-31 CN CN2010101952174A patent/CN102261584A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101354121A (en) * | 2007-07-25 | 2009-01-28 | 群康科技(深圳)有限公司 | Light source, method for manufacturing light source and backlight module unit using the same |
| CN101546063A (en) * | 2008-03-27 | 2009-09-30 | 深圳帝光电子有限公司 | Ultra thin type LCD use backlight module taking LED as light source |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104895264A (en) * | 2015-05-21 | 2015-09-09 | 深圳迪生鸿基科技有限公司 | Light-emitting wall face structure |
| CN105957947A (en) * | 2016-05-16 | 2016-09-21 | 漳州立达信光电子科技有限公司 | LED area light source and preparation method thereof |
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Application publication date: 20111130 |