201142182 六、發明說明 發明所屬之技術領域】 種具有發光 本發明係關於一種發光模組，特別關於 ‘極體的發光模組。 【先前技術】 發光二極體為一種新興的發光源，其具有壽命長、不 產人：ί體積小等優點。發光二極體亦應用於許多的 ::::用於照明設備或是平面顯示裝置的背光單元 中八中，發光二極體係排列形成一光 應用於側置式背光單元。 g t bar)而 請參照圖1A所示，其為習知一種側置式背 的剖視圖。JL中，背#罝々 ,.Ί八？彳先早兀1係以發光二極體光條（light bar) 11作為發光源。 名背光單元1包含一發光二極體光條u、一導光板I]、 政熱早το 13以及-背板14。發光二極體光條n設置於 導光板12之一入光侧12卜且位於散熱單元U及背板14 之上。發光二極體光條n所產生的熱量可經由散熱單元 13及背板14傳導出去。 、 为光單元1更包含一框體15及一光學膜片組16。其 中，光學膜片組16設置於導光板12之一出光側122，二 f發光二極體光條u所發出的光線均勻地射出，進而提 昇光線之光學性質。另外，藉由框體15與背板14的結合， 俾使發光二極體光條u、導光板12及光學膜片組16固定 201142182 於框體15及背板14之間。 請參照圖1B所示，其係為圖1A之發光二極體光條 11之示意圖。發光二極體光條n包括一電路板1U及複 數發光二極體112，發光二極體112係以一維排列設置於 • 電路板111上。 發光二極體112分別具有至少一發光二極體晶粒D、 -封裝殼體Η及一封膠體S。封裝殼體_表面黏著於電 路板111’發光二極體晶粒D係分別設置於封裝殼體Η後， 再以封膠體S對每-個封裝殼體Η内之發光二極體晶粒D 進行點膠的製程。 然而，上述發光二極體光條u之製作過程，需於電 路板111上一個個表面安裝封裝殼體11後，再一一 :體S的點膠製程’因此相當費時費力。再者，由於點膠 2間較長時’封㈣s中之螢光粉會逐漸沈殿，進而造 膠螢光粉濃度不均勻。另外，發光二極 散敎二所產生的熱量只能經由電路板111將熱能傳導至 …早兀13及背板14,散熱路徑及散熱效能也可能不足。 升何°又彳冑發光模組，能夠加速製程並可提 月…效能，已逐漸成為重要課題之一。 【發明内容】 一種能夠加速 有鑑於上述課題，本發明之目的為提供 :¾•並可提升散熱效能之發光模組。 為達上述目的 依據本發明之—種發光模組包括一基 5 201142182 板、複數發光二極體晶粒、一容置元件以及一封膠體。發 光二極體晶粒以打線接合或覆晶接合設置於基板。容置元 件具有一容置部，基板及該等發光二極體晶粒係容置於容 置部。封膠體覆蓋該等發光二極體晶粒並接觸容置元件。 在本發明之一實施例中，封膠體接觸容置元件之容置 部的一侧壁。容置元件之容置部作為封膠體之擋牆。容置 部位於容置元件的一侧。容置部更具有一底侧，基板設置 於底侧並與底側平行。 在本發明之一實施例中，容置元件之一侧壁具有一反 射表面，以反射該等發光二極體晶粒所發出之光線。其 中，反射表面包含一平面、或一曲面、或一凸面、或一凹 面。 在本發明之一實施例中，封膠體包含一螢光材料，且 係連續覆蓋至少二該等發光二極體晶粒。封膠體係具有一 缝隙或一氣泡，缝隙或氣泡係位於二相鄰之該等發光二極 體晶粒之間。 在本發明之一實施例中，發光模組更包含至少一間隔 物，係設置於二相鄰之該等發光二極體晶粒之間。其中， 間隔物係設置於基板上，間隔物係具有透光性，間隔物係 具有高反射表面，間隔物的高度係低於封膠體之高度。 承上所述，因依據本發明之一種發光模組是以容置元 件之容置部來容置基板及發光二極體晶粒，而封膠體係覆 蓋複數發光二極體晶粒並接觸容置元件。換言之，本發明 係以容置部作為封膠體之擋牆。藉此，可避免點膠製程 201142182 時，封膠體產生溢膠的現象。與習知技術中，於電路板上 一個個進行發光二極體晶粒的點膠製程相較，本發明之發 光模組不用設置封裝殼體，且封膠體可一次就完成複數發 光二極體晶粒的封膠製程並且固化成形，因此可加速製 . 程。另外，發光二極體晶粒除了可經由基板將熱能傳導至 容置元件外，也可經由封膠體，再經由容置部將熱能傳導 至容置元件外。因此，本發明具有較多的散熱路徑，也可 提升發光模組的散熱效能。此外，在本發明之一實施例 Φ 中，封膠體可一次就完成複數發光二極體晶粒的封膠製 程，故不同發光二極體内的封膠體，不會造成螢光粉濃度 不均勻，進而可達到發光模組出光均勻的效果。 【實施方式】 以下將參照相關圖式，說明依本發明較佳實施例之發 光模組，其中相同的元件將以相同的參照符號加以說明。 請參照圖2A及圖2B所示，其分別為本發明較佳實施 • 例之一種發光模組2的立體示意圖及側視圖。發光模組2 包括一基板21、複數發光二極體晶粒22、一容置元件23 - 以及一封膠體24。本發明之發光模組2除可例如應用於一 顯示裝置而成為其背光單元外，也可應用於一照明裝置、 一廣告燈箱、一戶外看板、或一交通號諸。 此外，發光模組2之發光二極體晶粒22之數量及排 列方式，並不受限制。本實施例是以複數發光二極體晶粒 22呈一維直線排列設置於基板21為例來說明。當然，亦 201142182 可依據實際產品需求，將複數發光二極體晶粒22呈二維 陣列排列或其他排列，甚至是不規則排列而設置於基板21 上。 發光二極體晶粒22係以打線接合或覆晶接合設置於 基板21。換言之，發光二極體晶粒22係以晶粒直接構裝 (chip-on-board, COB )的技術直接設置於基板21上。其 中，基板21可例如為一印刷電路板，其材質可例如包含 玻璃、或金屬、或陶瓷、或玻璃纖維、或樹脂，於此並不 加以限制。 容置元件23具有一容置部231，並位於容置元件23 的一側232，於此為一侧邊，基板21及發光二極體晶粒 22係容置於容置部231内。在本實施例中，容置部231的 形狀例如可具有一長條狀的凹槽，而基板21及發光二極 體晶粒22係容置於凹槽内。其中，容置部231更可具有 一底側B，基板21係設置於底側B並與底側B實質平行。 在本實施例中，容置元件23可為一散熱元件，其可包含 一導熱材料，例如金屬或合金，以將發光二極體晶粒22 所發出的熱量傳遞出去。另外，容置元件23也可具有散 熱結構，例如散熱鰭片，以協助其散熱，散熱結構可位於 容置部231背對發光二極體晶粒22之一側。此外，容置 元件23例如可以擠型製程或沖壓製程製造而為一擠型元 件（例如為鋁擠型元件）或一沖壓元件。 另外，如圖3所示，本發明另一態樣的發光模組2a 之容置元件23a更可包含一反射表面233，反射表面233 201142182 係位於容置部231之一侧壁W。於此，係以容置部231之 上下兩侧壁W分別具有一反射表面233為例，兩侧壁W 可具有相同或不相同的長度’本貫施例中係以兩側壁W具 有不相同的長度為例。反射表面233可反射發光二極體晶 . 粒22所發出之光線。其中，反射表面233例如可於側壁 W上貼附一高反射率、金屬鍛膜之反射層或反射片而形 成；或者，容置元件23a之侧壁W即為高反射率材質所製 成而具有反射表面233。於此，係以容置元件23a之侧壁 φ W貼附一反射層為例。利用反射表面233可反射發光二極 體晶粒22所發出的光線，而提升發光模組2a之光線利用 率。 特別一提的是，反射表面233並不限制為平面，其也 可依需求而有所不同，例如可包含一曲面、或一凸面、或 一凹面、或一錐面等，以反射並修飾發光二極體晶粒22 之光形及其出光方向。 請再參照圖2A及圖2B所示，封膠體24係覆蓋該等 ® 發光二極體晶粒22並接觸容置元件23。其中，封膠體24 係接觸容置元件23之容置部231的上下兩侧壁W為例。 ' 因封膠體24於點膠製程時，為具流動性的膠體，利用容 置元件23之容置部231的上下兩侧壁W作為封膠體24 之擋牆，可使封膠體24限制於容置部231内並固化成形。 其中，封膠體24係連續覆蓋至少二發光二極體晶粒 22，於此，係以封膠體24連續覆蓋全部發光二極體晶粒 22為例。另外，封膠體24可包含一螢光物質，螢光物質 201142182 受發光二極體晶粒22激發且光線在混光後，發光模組2 可產生所需要的色光，例如為白光。另外，由於封膠體24 接觸發光二極體晶粒22及容置元件23，故發光二極體晶 粒22所產生之熱量可直接經由封膠體24傳導至容置元件 23而提升散熱效能。此外，由於本實施例係一次就完成複 數發光二極體晶粒22的點膠製程，故封膠體24内之螢光 粉較不易因時間因素而濃度不均勻，進而可達到發光模組 2出光均勻的效果。反觀習知，由於需分次進行各個發光 二極體的點膠，故封膠體内之螢光粉隨著每次的點膠而慢 慢沉澱以致產生濃度不均勻。 另外，請分別參照圖4A、圖4B及圖4C所示，其分 別為本發明之變化態樣之發光模組2b、2c、2d的立體示意 圖。為了清楚說明，圖4A、圖4B及圖4C係與圖2A具有 不同的視角方向。 發光模組2b、2c、2d與發光模組2之主要不同在於， 發光模組2b、2c、2d之封膠體24a、24b、24c係分別具有 至少一缝隙241a、241b、241c或一氣泡，缝隙241a、241b、 241c或氣泡係分別位於二相鄰之發光二極體晶粒22 .之 間。於此，係以分別具有縫隙241a、241b、241c為例。 其中，缝隙241a、241b、241c可利用雷射切割或其他 物理切割方法形成；而氣泡則可靠雷射雕刻或其他方法形 成。缝隙241a係使發光模組2b之封膠體24a完全截斷成 一塊一塊的，縫隙241b係使發光模組2c二晶粒22之間的 封膠體24b由上而下的一部分截斷，而缝隙241c係使發光 10 201142182 模組2d二晶粒22之間的封膠體24c由下而上的一部分截 斷。 由於封膠體24a、24b、24c係連續覆蓋複數發光二極 體晶粒22，故可能會有累積的應力產生，嚴重時可能會扯 斷發光二極體晶粒22之打線而降低發光模組2b、2c、2d 之可靠性。因此，藉由缝隙241a、241b、241c或氣泡的設 置可破壞封膠體24a、24b、24c於連續封膠製程所累積的 應力，以達到保護發光模組2b、2c、2d的目的。另外，縫 φ 隙241a、241b、241c或氣泡不一定全部的發光二極體晶粒 22之間均需要設置，也可視需要設置。 請分別參照圖5A及圖5B所示，其分別為本發明再一 變化態樣之發光模組3a及3b的立體示意圖。 發光模組3a、3b與發光模組2之主要不同在於，發光 模組3a、3b更可包含至少一間隔物35a、35b，其係設置 於基板31上或是容置元件331上，且位於二相鄰之發光 -一極體晶粒3 2之間。於此’係以兩晶粒3 2之間均設置間 鲁 隔物35a、35b為例，當然，其非限制性，部分兩晶粒32 之間亦可不設置間隔物35a、35b。間隔物35a、35b可為 藍寶石基板或是玻璃。另外，間隔物35a、35b可具有高反 射表面（例如為反射片），以反射發光二極體晶粒32所發 出的光線，達到光指向性的效果、或者間隔物35a、35b 亦可透光以達到混光的效果，例如為毛玻璃。利用間隔物 35a、35b可破壞設置封膠體34a、34b所累積的應力以提 升保護發光模組3a、3b的可靠度。 201142182 特別說明的是，間隔物35a、35b的設置最高高度（於 發光二極體的出光方向上）係可高於或低於封膠體34a、 34b之上表面高度、或者可比發光二極體晶粒32的上表面 高或低、或者比發光二極體晶粒32之打線的最高點高或 低。於此，係以間隔物35a、35b的設置最高高度低於封膠 體34a、34b之上表面高度為例。另外，間隔物35a、35b 可完全隔斷封膠體34a、34b，當然，也可部分隔斷封膠體 34a、34b (如圖5A及圖5B)。間隔物35a、35b可藉由植 晶機而設置於基板31上。 鲁 如圖5A所示，間隔物35a例如可為一間隔板，並完 全隔斷封膠體34a，並可減少發光二極體晶粒32之間的出 光干擾（crosstalk);或者，如圖5B所示，間隔物35b例 如可為一肋條，並部分隔斷封膠體34b。 此外，請參照圖6所示，以說明本發明之一種發光模 組5應用於背光單元4。 背光單元4包括一發光模組5、一導光板41、一背板 43、一框體44以及一光學膜片組45。發光模組5包括一 ® 基板51、複數發光二極體晶粒52、一容置元件53以及一 封膠體54。發光二極體晶粒52以打線接合或覆晶接合設 置於基板51。容置元件53具有一容置部531並位於容置 元件53之一側532,基板51及該等發光二極體晶粒52係 容置於容置部531。封膠體54覆蓋該等發光二極體晶粒 52並接觸容置元件53。 發光模組5之容置部53卜基板51及發光二極體晶粒 12 201142182 52係設置於導光板41之一入光側411。光學膜片組45係 設置於導光板41之一出光侧412,以將發光模組5所發出 的光線均勻地射出，進而提昇光線之光學性質。另外，容 置元件53與容置部531相連之一侧53.4可作為反射片之 作用，其表面可反射發光模組5所發出的光線。此外，藉 由框體44與背板43的結合，俾使發光模組5、導光板41 及光學膜片組45固定於框體44及背板43之間。 特別說明的是，本發明的發光模組5之容置元件53 φ 除可容置基板51及發光二極體晶粒52外，發光二極體晶 粒52所散發的熱量亦可透過基板51、封膠體54、容置元 件53的上下兩側壁W及底側B，以及背板43發散出去， 因此，其熱量散發路徑比習知技術的多，進而可提升發光 模組5的可靠度。 另外，由於發光模組5可具有前述所有態樣之發光模 組之技術特徵，於此不再贅述。 綜上所述，因依據本發明之一種發光模組是以容置元 ® 件之容置部來容置基板及發光二極體晶粒，而封膠體係覆 蓋複數發光二極體晶粒並接觸容置元件。換言之，本發明 ' 係以容置部作為封膠體之擋牆。藉此，可避免點膠製程 時，封膠體產生溢膠的現象。與習知技術中，於電路板上 一個個進行發光二極體晶粒的點膠製程相較，本發明之發 光模組不用設置封裝殼體，且封膠體可一次就完成複數發 光二極體晶粒的封膠製程並且固化成形，因此可加速製 程。另外，發光二極體晶粒除了可經由基板將熱能傳導至 13 201142182 容置元件外，也可經由封膠體，再經由容置部將熱能傳導 至容置元件外。因此，本發明具有較多的散熱路徑，也可 提升發光模組的散熱效能。此外，在本發明之一實施例 T ’封膠體可—次就完成複數發光二極體晶㈣封膠製 程’故不同發光二極體内的封夥體，不會造成螢光粉濃度 不均勻，進而可達到發光模組出光均勻的效果。 以上所述僅為舉例性，而非為限制性者。任何未脫離 本發明之精神與範脅，而對其進行之等效修改或變更，均 應包括於後附之申請專利範圍中。 【圖式簡單說明】 圖1A為習知一種側置式背光單元的剖視示意圖； 圖1B為圖ία之發光二極體光條之示意圖； 圖2A及圖2B分別為本發明較佳實施例之—種發光模 組的立體示意圖及側視示意圖； 、 圖3為本發明另—態樣之發錢_側視示意圖； 圖4A、圖4B及圖4C合别盔士欢 發光模組的立體示意圖；]為柄明又—變化態樣之 圖5A及圖犯分別為本發明再n 的立體示意圖；以及 知艽犋，，且 圖6為應用本發明發光模 圖。 尤犋、，且之是先早兀之剖視示意 【主要元件符號說明】 201142182 1、 4 :背光單元 II :發光二極體光條 III :電路板 112 :發光二極體 12、41 :導光板 121、 411 :入光侧 122、 412 :出光側 13 :散熱單元 φ 14、43 :背板 15、 44 :框體 16、 45 :光學膜片組 2、 2a、2b、2c、2d、3a、3b、5 :發光模組 2卜3卜51 :基板 22、 32、52 :發光二極體晶粒 23、 23a、53 :容置元件 231、531 :容置部 β 232 、 532 、 534 :側 233 :表面 24、 24a、24b、24c、34a、34b、54 :封膠體 241a、241b、241c ··缝隙 35a、35b :間隔物 B :底侧 D:發光二極體晶粒 Η :殼體 15 201142182 s :封膠體 w :侧壁BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light-emitting module, and more particularly to a 'polar body light-emitting module. [Prior Art] A light-emitting diode is an emerging light source, which has the advantages of long life, unproductive: small volume, and the like. Light-emitting diodes are also used in many :::: backlight units for lighting devices or flat-panel display devices. Eight of them are arranged in a light-emitting diode system for use in a side-mounted backlight unit. g t bar) Referring to Figure 1A, it is a cross-sectional view of a conventional side-mounted back. JL, back #罝々,.Ί八? The first light system 1 uses a light bar 11 as a light source. The backlight unit 1 includes a light-emitting diode strip u, a light guide plate I], a hot air το 13 and a back plate 14. The light-emitting diode strip n is disposed on one of the light-incident sides 12 of the light guide plate 12 and above the heat-dissipating unit U and the back plate 14. The heat generated by the light-emitting diode strip n can be conducted through the heat radiating unit 13 and the back plate 14. The light unit 1 further includes a frame 15 and an optical film set 16 . The optical film group 16 is disposed on one of the light-emitting sides 122 of the light guide plate 12, and the light emitted by the two-light-emitting diode strips u is uniformly emitted, thereby improving the optical properties of the light. In addition, the light-emitting diode strip u, the light guide plate 12, and the optical film group 16 are fixed between the frame 15 and the back plate 14 by the combination of the frame 15 and the back plate 14. Please refer to FIG. 1B, which is a schematic diagram of the light-emitting diode strip 11 of FIG. 1A. The light-emitting diode strip n includes a circuit board 1U and a plurality of light-emitting diodes 112, and the light-emitting diodes 112 are arranged on the circuit board 111 in a one-dimensional arrangement. The light-emitting diodes 112 respectively have at least one light-emitting diode die D, a package casing and a gel S. The package housing _ surface is adhered to the circuit board 111'. The LEDs of the LEDs are respectively disposed on the package housing, and then the LEDs of the LEDs in each package housing are sealed by the sealant S. Perform the dispensing process. However, in the manufacturing process of the above-mentioned light-emitting diode strips, it is necessary to install the package casing 11 on the surface of the circuit board 111, and then the dispensing process of the body S is quite time-consuming and labor-intensive. Furthermore, since the phosphor powder in the seal (four) s is gradually swelled, the concentration of the fluorescing powder is not uniform. In addition, the heat generated by the light-emitting diodes can only conduct heat energy through the circuit board 111 to the early stage 13 and the back board 14, and the heat dissipation path and heat dissipation performance may also be insufficient. It is one of the important topics that can be used to speed up the process and improve the performance of the moon. SUMMARY OF THE INVENTION One aspect that can be accelerated In view of the above problems, an object of the present invention is to provide a light-emitting module that can improve heat dissipation performance. In order to achieve the above object, a light-emitting module according to the present invention comprises a base 5 201142182 board, a plurality of light-emitting diode dies, a accommodating element and a gel. The light-emitting diode crystal grains are provided on the substrate by wire bonding or flip chip bonding. The accommodating member has a receiving portion, and the substrate and the illuminating diode dies are placed in the accommodating portion. The encapsulant covers the luminescent diode dies and contacts the accommodating element. In one embodiment of the invention, the encapsulant contacts a side wall of the receiving portion of the receiving member. The accommodating portion of the accommodating member serves as a retaining wall of the sealant. The accommodating portion is located on one side of the accommodating member. The accommodating portion further has a bottom side, and the substrate is disposed on the bottom side and parallel to the bottom side. In one embodiment of the invention, one of the side walls of the accommodating member has a reflective surface for reflecting the light emitted by the illuminating diode dies. The reflective surface comprises a plane, or a curved surface, or a convex surface, or a concave surface. In one embodiment of the invention, the encapsulant comprises a phosphor material and continuously covers at least two of the dichroic crystal grains. The encapsulation system has a slit or a bubble, and the slit or bubble is located between the two adjacent illuminating diode dies. In an embodiment of the invention, the light emitting module further comprises at least one spacer disposed between the two adjacent light emitting diode dies. Wherein, the spacer is disposed on the substrate, the spacer is light transmissive, and the spacer has a highly reflective surface, and the height of the spacer is lower than the height of the encapsulant. According to the above description, a light-emitting module according to the present invention accommodates a substrate and a light-emitting diode die by a receiving portion of the receiving component, and the sealing system covers the plurality of light-emitting diode crystal grains and contacts the capacitance. Set the component. In other words, the present invention uses the accommodating portion as a retaining wall for the sealant. In this way, it is possible to avoid the phenomenon that the sealant is overflowed when the dispensing process 201142182 is used. Compared with the prior art, the light-emitting module of the present invention does not need to be provided with a package casing, and the sealant can complete the complex light-emitting diode at one time. The encapsulation process of the die is solidified and formed, thus speeding up the process. In addition, the light-emitting diode die can conduct heat energy to the outside of the accommodating member via the accommodating portion, in addition to transferring heat energy to the accommodating member via the substrate. Therefore, the present invention has more heat dissipation paths and can also improve the heat dissipation performance of the light emitting module. In addition, in one embodiment of the present invention, the sealing body can complete the sealing process of the plurality of light-emitting diode crystals at one time, so that the sealing body in different light-emitting diodes does not cause uneven concentration of the fluorescent powder. In turn, the light-emitting module can achieve uniform light output. [Embodiment] Hereinafter, a light-emitting module according to a preferred embodiment of the present invention will be described with reference to the accompanying drawings, wherein the same elements will be described with the same reference numerals. Please refer to FIG. 2A and FIG. 2B , which are respectively a perspective view and a side view of a light-emitting module 2 according to a preferred embodiment of the present invention. The light-emitting module 2 includes a substrate 21, a plurality of light-emitting diode dies 22, a accommodating member 23 - and a colloid 24. The light-emitting module 2 of the present invention can be applied to, for example, a backlight unit as a backlight unit, and can also be applied to a lighting device, an advertising light box, an outdoor billboard, or a traffic number. In addition, the number and arrangement of the light-emitting diode dies 22 of the light-emitting module 2 are not limited. This embodiment is described by taking an example in which the plurality of light-emitting diode dies 22 are arranged in a one-dimensional line on the substrate 21. Of course, 201142182 can also arrange the plurality of LED dies 22 in a two-dimensional array or other arrangement according to actual product requirements, or even arranged on the substrate 21 in an irregular arrangement. The light-emitting diode crystal grains 22 are provided on the substrate 21 by wire bonding or flip chip bonding. In other words, the light-emitting diode die 22 is directly disposed on the substrate 21 by a chip-on-board (COB) technique. The substrate 21 may be, for example, a printed circuit board, and the material thereof may include, for example, glass, or metal, or ceramic, or glass fiber, or a resin, which is not limited herein. The accommodating member 23 has a receiving portion 231 and is disposed on one side 232 of the accommodating member 23, and is disposed on one side thereof. The substrate 21 and the LED dies 22 are disposed in the accommodating portion 231. In this embodiment, the shape of the receiving portion 231 can have, for example, a long groove, and the substrate 21 and the light-emitting diode die 22 are received in the groove. The receiving portion 231 may further have a bottom side B, and the substrate 21 is disposed on the bottom side B and substantially parallel to the bottom side B. In the present embodiment, the accommodating member 23 may be a heat dissipating member which may include a heat conductive material such as a metal or an alloy to transfer heat emitted from the illuminating diode die 22. In addition, the accommodating member 23 may also have a heat dissipating structure, such as a heat dissipating fin, to assist in heat dissipation thereof, and the heat dissipating structure may be located on a side of the accommodating portion 231 facing away from the illuminating diode dies 22. Further, the accommodating member 23 can be manufactured, for example, by an extrusion process or a stamping process as an extruded member (e.g., an aluminum extruded member) or a stamped member. In addition, as shown in FIG. 3, the accommodating member 23a of the illuminating module 2a of another aspect of the present invention may further include a reflecting surface 233, and the reflecting surface 233 201142182 is located at one side wall W of the accommodating portion 231. For example, the upper and lower sidewalls W of the accommodating portion 231 respectively have a reflecting surface 233, and the two sidewalls W may have the same or different lengths. In the present embodiment, the two sidewalls W have different The length is an example. The reflective surface 233 reflects the light emitted by the luminescent diode 22 . The reflective surface 233 can be formed, for example, by attaching a reflective layer or a reflective sheet of high reflectivity and a metal forged film to the sidewall W. Alternatively, the sidewall W of the accommodating member 23a can be made of a high reflectivity material. There is a reflective surface 233. Here, a reflection layer is attached to the side wall φ W of the accommodating member 23a. The reflective surface 233 reflects the light emitted by the light-emitting diode die 22 to increase the light utilization rate of the light-emitting module 2a. In particular, the reflective surface 233 is not limited to a plane, and may be different according to requirements, for example, may include a curved surface, or a convex surface, or a concave surface, or a tapered surface to reflect and modify the illumination. The light shape of the diode crystal 22 and its light exiting direction. Referring to FIG. 2A and FIG. 2B again, the encapsulant 24 covers the LEDs 22 and contacts the accommodating member 23. The sealing body 24 is an example of the upper and lower sidewalls W of the accommodating portion 231 of the accommodating member 23 . When the sealing body 24 is a fluid colloid, the upper and lower side walls W of the accommodating portion 231 of the accommodating member 23 are used as the retaining wall of the sealing body 24, so that the sealing body 24 can be restricted to the capacity. The inside of the portion 231 is solidified and formed. The encapsulant 24 continuously covers at least two LED dipoles 22, and the encapsulant 24 continuously covers all of the LED dipoles 22 as an example. In addition, the encapsulant 24 may comprise a phosphor, and the phosphor material 201142182 is excited by the LED die 22 and after the light is mixed, the illumination module 2 can generate a desired color, such as white light. In addition, since the encapsulant 24 contacts the illuminating diode die 22 and the accommodating member 23, the heat generated by the luminescent diode 22 can be directly conducted to the accommodating member 23 via the encapsulant 24 to improve heat dissipation performance. In addition, since the dispensing process of the plurality of light-emitting diode dies 22 is completed at one time, the phosphor powder in the sealing body 24 is less likely to be uneven in concentration due to time factors, and thus the light-emitting module 2 can be lighted out. Uniform effect. On the other hand, since the dispensing of each of the light-emitting diodes is required to be performed in stages, the phosphor powder in the sealant body slowly precipitates with each dispensing to cause uneven density. Further, please refer to Figs. 4A, 4B, and 4C, respectively, which are perspective views of the light-emitting modules 2b, 2c, and 2d which are different aspects of the present invention. For clarity of illustration, Figures 4A, 4B, and 4C have different viewing angle directions from Figure 2A. The main difference between the light-emitting modules 2b, 2c, and 2d and the light-emitting module 2 is that the sealants 24a, 24b, and 24c of the light-emitting modules 2b, 2c, and 2d respectively have at least one slit 241a, 241b, 241c or a bubble. 241a, 241b, 241c or bubble are respectively located between two adjacent light-emitting diode crystal grains 22. Here, the slits 241a, 241b, and 241c are respectively taken as an example. Among them, the slits 241a, 241b, 241c may be formed by laser cutting or other physical cutting methods; and the bubbles may be formed by laser engraving or other methods. The slit 241a completely cuts the sealing body 24a of the light-emitting module 2b into one piece. The slit 241b cuts off the sealing body 24b between the two crystal grains 22 of the light-emitting module 2c from the top to the bottom, and the slit 241c makes the gap 241c Illumination 10 201142182 The encapsulant 24c between the module 2d two crystal grains 22 is cut off from the bottom up portion. Since the sealing bodies 24a, 24b, and 24c continuously cover the plurality of light-emitting diode crystal grains 22, accumulated stress may be generated. In severe cases, the wiring of the light-emitting diode crystal grains 22 may be broken and the light-emitting module 2b may be lowered. , 2c, 2d reliability. Therefore, the stress accumulated by the sealants 24a, 24b, and 24c in the continuous encapsulation process can be broken by the slits 241a, 241b, 241c or the arrangement of the bubbles to achieve the purpose of protecting the light-emitting modules 2b, 2c, and 2d. Further, the slit φ slits 241a, 241b, and 241c or the light-emitting diode crystal grains 22 which are not necessarily all of the slits need to be provided, and may be provided as needed. Please refer to FIG. 5A and FIG. 5B respectively, which are perspective views of the light-emitting modules 3a and 3b according to still another variation of the present invention. The main difference between the illuminating modules 3a and 3b and the illuminating module 2 is that the illuminating modules 3a and 3b can further include at least one spacer 35a, 35b disposed on the substrate 31 or on the accommodating member 331. Two adjacent illuminators - between one of the polar crystal grains 3 2 . Here, the inter-layer spacers 35a and 35b are provided between the two crystal grains 3 2 as an example. Of course, the spacers 35a and 35b may not be provided between the two crystal grains 32. The spacers 35a, 35b may be sapphire substrates or glass. In addition, the spacers 35a, 35b may have a highly reflective surface (for example, a reflective sheet) to reflect the light emitted by the LED die 32 to achieve a light directivity effect, or the spacers 35a, 35b may also transmit light. In order to achieve the effect of light mixing, such as frosted glass. The spacers 35a, 35b can be used to break the stress accumulated by the sealants 34a, 34b to improve the reliability of the protective lighting modules 3a, 3b. 201142182 Specifically, the highest height of the spacers 35a, 35b (in the light-emitting direction of the light-emitting diode) may be higher or lower than the upper surface height of the sealant 34a, 34b, or a comparable light-emitting diode crystal. The upper surface of the particles 32 is high or low, or higher or lower than the highest point of the line of the light-emitting diode grains 32. Here, the height of the spacers 35a, 35b is set to be lower than the height of the upper surface of the sealants 34a, 34b. Further, the spacers 35a, 35b can completely block the sealants 34a, 34b, and of course, the sealants 34a, 34b can be partially interrupted (as shown in Figs. 5A and 5B). The spacers 35a, 35b can be disposed on the substrate 31 by a crystallizer. As shown in FIG. 5A, the spacer 35a can be, for example, a spacer, and completely blocks the encapsulant 34a, and can reduce crosstalk between the LEDs 32; or, as shown in FIG. 5B. The spacer 35b may be, for example, a rib and partially partitions the sealant 34b. Further, please refer to Fig. 6 for explaining that the light-emitting module 5 of the present invention is applied to the backlight unit 4. The backlight unit 4 includes a light emitting module 5, a light guide plate 41, a back plate 43, a frame 44, and an optical film set 45. The light-emitting module 5 includes a ® substrate 51, a plurality of light-emitting diode dies 52, a receiving member 53, and a sealant 54. The LED die 52 is placed on the substrate 51 by wire bonding or flip chip bonding. The accommodating member 53 has a receiving portion 531 and is located on one side 532 of the accommodating member 53. The substrate 51 and the illuminating diode dies 52 are disposed in the accommodating portion 531. The encapsulant 54 covers the illuminating diode dies 52 and contacts the accommodating member 53. The accommodating portion 53 of the light-emitting module 5, the substrate 51, and the light-emitting diode dies 12 201142182 52 are disposed on the light-incident side 411 of one of the light guide plates 41. The optical film group 45 is disposed on one of the light-emitting sides 412 of the light guide plate 41 to uniformly emit light emitted from the light-emitting module 5, thereby improving the optical properties of the light. In addition, one side 53.4 of the accommodating member 53 and the accommodating portion 531 can function as a reflection sheet, and the surface thereof can reflect the light emitted by the illuminating module 5. Further, the light-emitting module 5, the light guide plate 41, and the optical film group 45 are fixed between the frame 44 and the back plate 43 by the combination of the frame 44 and the back plate 43. In addition, the accommodating member 53 φ of the illuminating module 5 of the present invention can displace the substrate 51 and the illuminating diode die 52, and the heat radiated from the illuminating diode die 52 can also pass through the substrate 51. The sealing body 54, the upper and lower side walls W and the bottom side B of the accommodating member 53 and the backing plate 43 are diverge. Therefore, the heat dissipation path is more than that of the prior art, and the reliability of the illuminating module 5 can be improved. In addition, since the illuminating module 5 can have the technical features of all the foregoing illuminating modules, it will not be described again. In summary, a light-emitting module according to the present invention accommodates a substrate and a light-emitting diode die by accommodating a receiving portion of the element, and the sealing system covers the plurality of light-emitting diode dies and Contact the receiving component. In other words, the present invention uses the accommodating portion as a retaining wall for the sealant. Thereby, it is possible to avoid the phenomenon that the sealant is overflowed when the dispensing process is performed. Compared with the prior art, the light-emitting module of the present invention does not need to be provided with a package casing, and the sealant can complete the complex light-emitting diode at one time. The encapsulation process of the die is cured and shaped, thus speeding up the process. In addition, the light-emitting diode die can conduct heat energy to the outside of the accommodating member via the accommodating portion, in addition to transferring the thermal energy to the accommodating member via the substrate. Therefore, the present invention has more heat dissipation paths and can also improve the heat dissipation performance of the light emitting module. In addition, in one embodiment of the present invention, the T' sealant can complete the complex light-emitting diode (4) sealing process, so that the body of the different light-emitting diodes does not cause uneven phosphor concentration. In turn, the light-emitting module can achieve uniform light output. The above is intended to be illustrative only and not limiting. Any equivalent modifications or alterations of the present invention are intended to be included in the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1A is a schematic cross-sectional view of a side-mounted backlight unit; FIG. 1B is a schematic view of a light-emitting diode strip of FIG. 1A; FIG. 2A and FIG. 2B are respectively a preferred embodiment of the present invention; FIG. 3 is a perspective view and a side view of a light-emitting module; FIG. 3 is a schematic view of a side view of the present invention; FIG. 4A, FIG. 4B and FIG. FIG. 5A and FIG. 5A are respectively a perspective view of the present invention; and FIG. 6 is a light-emitting mode diagram to which the present invention is applied.尤犋,, and the first is a cross-sectional view of the early 【 [Main component symbol description] 201142182 1, 4: backlight unit II: LED light strip III: circuit board 112: LEDs 12, 41: guide Light plate 121, 411: light-incident side 122, 412: light-emitting side 13: heat-dissipating unit φ 14, 43: back plate 15, 44: frame 16, 45: optical film group 2, 2a, 2b, 2c, 2d, 3a , 3b, 5: light-emitting module 2, 3, 51: substrate 22, 32, 52: light-emitting diode die 23, 23a, 53: accommodating elements 231, 531: accommodating parts β 232, 532, 534: Side 233: surface 24, 24a, 24b, 24c, 34a, 34b, 54: sealant 241a, 241b, 241c · slit 35a, 35b: spacer B: bottom side D: light-emitting diode die Η: case 15 201142182 s : Sealant w: Side wall