1345662 100年04月27日修正替换頁 發明說明： 【發明所屬之技術領域】 [0001] 本發明涉及一種液晶顯示裝置用之背光模組及其製備方 法。 【先前技術】 [0002] 液晶顯示裝置被廣泛應用于個人數位助理'筆記型電腦 、數位相機、移動電話、液晶電視等電子産品中。但由 [0003] 於液晶顯示裝置爲非自發光性的，因此其需要借助背光 模組才具顯示功能。 4參閱圖1與圖2，一種習知背光模組1 〇。背光模組丨〇包 括框架11，反射片12,發光二極體13，導光板14，及光 學片15。其中，框架1丨包括用於放置發光二極體13之凹 槽111與用於容置反射片12、導光板14及光學片15之容 置空間112。發光二極體13包括基座131，基座131上之 發光晶片132與封裝發光晶片132之透明樹脂133，透明 樹脂133之表面爲光出射面1331。導光板14包括可靠近 發光二極體13之入光面141，與入光面141相連之出光面 142，及與出光面142相對之底面143。光學片15處於導 光板14出光面142之上方，反射片12位於導光板14底面 143之下方。工作時，發光二極體13發出之光線從入光面 141直接進入導光板14 ;經過導光板14之擴散與反射片 12之反射作用’光線會從導光板14之出光面142均勻出射 至光學片15。 然而，於背光模組10中，雖然發光二極體13與導光板14 之入光面141之距離較小，但其相互之間存在空氣層；由 095140831 表單編號A0101 第3頁/共21頁 1003146812-0 [0004] 1345662 100年04月27日核正替换頁 於發光二極體13外層有用於封裝發光二極體13之透明樹 脂133，而透明樹脂133之折射率與空氣之折射率相差較 大，因此當光線傳輸至透明樹脂133與空氣層之介面時， 部分光線容易於該介面發生全反射而損耗，從而造成發 光二極體13之光能利用率降低。 【發明内容】 [0005] 鑒於上述内容，提供一種可提高光線利用率之背光模組 及其製備方法實為必需。 [0006] 一種背光模組，其包括一導光板及至少一點光源，該導 光板具有一個入光面，該點光源靠近該入光面，其中該 背光模組還包括填充該入光面與該點光源之間之黏膠體 。且該導光板之入光面形成有微結構。 [0007] 一種背光模組之製備方法，其包括如下步驟：提供一薄 膜基材，與一框架；衝壓該薄膜基材形成預製孔；將點 光源固定于該預製孔内；於該點光源及與該點光源光相 對之預製孔之孔壁之間注入黏膠；固化該黏膠形成黏膠 體；裁切該形成有黏膠體之薄膜基材，形成帶有點光源 與黏膠體之導光板；及將該帶有點光源與黏膠體之導光 板與該框架組裝成型。 [0008] 與習知技術相比較，上述背光模組於導光板之入光面與 點光源之間形成有黏膠體，由於黏膠體之折射率較空氣 與點光源之透明樹脂及導光板之折射率更爲接近，因此 光線於光出射面之全反射角可減小，當光線通過該點光 源之光出射面時，光線被反射回點光源内部可減少，從 而使光線之損耗降低。因此上述背光模組具有易於提高 095140831 表單編號 A0101 第 4 頁/共 21 頁 1003146812-0 1345662 100年04月27日按正替换w 光線利用率之優點。 【實施方式】 [0009] 請參閱圖3與圖4，本發明較佳實施例一之背光模組20包 括框架21，點光源23，導光板24及黏膠體25。其中，框 架21可收容並固定導光板24與點光源23 ;點光源23可爲 使用樹脂材料封裝之發光體，本實施例爲發光二極體， 其包括基座231，基座231上之發光晶片232，及封裝發 光晶片232之透明樹脂233 ;透明樹脂233之外表面爲點 光源23之光出射面2331。導光板24包括一個入光面241 ，點光源23靠近導光板24之入光面241，黏膠體25位於 點光源23與導光板24之入光面241之間，其用於填充點光 源23之光出射面2331與導光板24入光面241之間之間隙 [0010] 導光板24之厚度可較薄，例如其可爲0. 075毫米至0. 8毫 米。導光板24之材質可爲透明塑膠，例如曱基丙烯酸甲 酯、聚酯或聚碳酸酯；優選係可承受較高溫度（如150°C) 丨之透明塑膠，例如聚碳酸酯，或者係添加有耐熱劑之聚 曱基丙烯酸曱酯或聚酯。 [0011] 黏膠體25爲透明物體，其可由黏膠經固化而成，例如， 該黏膠可爲紫外光固化膠與熱固化膠之一；優選固化後 折射率與點光源23之透明樹脂233及導光板24之折射率較 爲接近之黏膠。 [0012] 使用時，點光源23産生之光線通過黏膠體25進入導光板 24，由於黏膠體25之折射率大於空氣之折射率，其與點 光源23之透明樹脂233及導光板24之折射率較爲接近，因 095140831 表單編號 A0101 第 5 頁/共 21 頁 1003146812-0 1345662 100年04月27日按正替换頁 此光線於光出射面2331之全反射角可減小，當光線通過 點光源23之光出射面2331時，使光線被反射回點光源23 内部之可能性減少，而使光線之損耗降低，提高點光源 23之光線利用率。另，由於黏膠體25與點光源23及導光 板24皆具有一定之黏附力，因此其還易於確保點光源23 與導光板24之相對位置固定。 [0013] 可以理解，當於黏膠體25内加入螢光粒子時，背光模組 20還易於變更其所能提供之出射光線之顏色。例如，當 背光模組20中之點光源23爲藍光發光二極體時，於黏膠 體25内摻雜入可被激發産生黃光之螢光粉，則可使背光 模組2 0發出之光線爲白光。 [0014] 請同時參閱圖5，一種製備背光模組20之方法，其包括如 下步驟： [0015] 步驟一，提供一薄膜基材201，與一框架21。該薄膜基材 201可爲片材或卷材，爲便於連續生産，本實施例中爲卷 材。該薄膜基材201之厚度可爲0. 075毫米至0. 8毫米。 該薄膜基材201之材質可爲透明塑膠，例如聚曱基丙烯酸 甲酯、聚酯或聚碳酸酯；優選係可承受較高溫度（如150 °C)之透明塑膠，例如聚碳酸酯，或者係添加有耐熱劑之 聚曱基丙烯酸曱酯或聚酯。 [0016] 步驟二，衝壓該薄膜基材201形成預製孔202。其中，該 預製孔202之孔壁之一側可用作入光面241。該預製孔 202可根據需要安裝之點光源2 3之形狀及點光源23之數量 之不同衝壓成不同之形狀。 095140831 表單編號A0101 第6頁/共21頁 1003146812-0 100年〇4月27日梭正替换頁 1345662 [0017] 步驟三，將點光源23固定于該預製孔202内。 [0018] 該步驟中，點光源23可先形成於柔性印刷電路板203上， 然後將該點光源23之光出射面2331朝向該預製孔之孔壁 上之入光面241，再通過膠貼之方式使該柔性印刷電路板 203與該形成有預製孔202之薄膜基材201相互固定。 [0019] 步驟四，於點光源23及與點光源23相對之預製孔202之孔 壁之間注入黏膠。其中，該黏膠可爲紫外光固化膠與熱 固化膠之一；爲使該黏膠具有較快之固化速度，優選爲 紫外光固化膠；且爲使於不變更點光源23之前提下，使 背光模組20可發出不同顏色之光線，還可於該黏膠内加 入特定之螢光粒子；例如，當背光模組20中之點光源23 爲藍光發光二極體時，於黏膠體内加入可被激發産生黃 光之螢光粉，則可使背光模組發出之光線爲白光。另外 ，該注入黏膠之方法可爲點膠。 [0020] 步驟五，固化該黏膠形成黏膠體25。該固化過程可根據 所採用之黏膠之不同而選用不同之固化方法；例如，當 黏膠爲紫外光固化膠時，該固化方法爲紫外光固化。 [0021] 步驟六，裁切該形成有黏膠體25之薄膜基材201，形成帶 有點光源23與黏膠體25之導光板24。其中，可根據所需 背光模組20外形，將該薄膜基材裁切成所需之外形。 [0022] 步驟七，將帶有點光源23與黏膠體25之導光板24與框架 21組裝成型。 [0023] 另一種製備背光模組20之方法，其包括： 1003146812-0 095140831 表單編號A0101 第7頁/共21頁 1345662 100年04月27日按正替換頁 [0024] [0025] [0026] [0027] [0028] [0029] [0030] [0031] [0032] 095140831 步驟一，提供一框架21，一導光板24與一點光源23，其 中，該導光板24具有一入光面241，該點光源23具有一光 出射面2331。 步驟二，將點光源23之光出射面2331朝向導光板24之入 光面241設置。 該步驟中，點光源23可先形成於柔性印刷電路板上；然 後將點光源23之光出射面2331與導光板24之入光面241 相對，再通過膠貼之方式使該柔性電路板與該導光板24 相互固定。 · 步驟三，於點光源23之光出射面2331與導光板24之入光 面241之之間注入黏膠。其中，該黏膠可爲紫外光固化膠 與熱固化膠之一。 步驟四，固化該黏膠形成黏膠體25。其中，該於固化過 程可根據所採用之黏膠之不同，選用熱固化法或紫外光 固化法。 步驟五，將其連結有黏膠體25之導光板24和點光源23與 框架21組裝成型。 再一種製備背光模組20之方法，其包括如下步驟： 步驟一，提供一框架21，一導光板24與一點光源23，其 中，導光板24具有一入光面241，該點光源23具有一光出 射面241。 步驟二，使該點光源23之光出射面2331朝向該導光板24 之入光面241，並將兩者與該框架21相組裝。 表單編號A0101 第8頁/共21頁 1003146812-0 1345662 100年〇4月27日核正替換百 [0033] 該步驟中，可先將該導光板24固定於該框架21 ;然後使 點光源23之光出射面2331面對該導光板24之入光面241 放置；再將點光源23固定於框架21。其中，導光板24固 定於框架21之方法可採用超聲波結合或膠貼合。 [0034] 步驟三，於點光源23之光出射面2331與導光板24之入光 面241之之間注入黏膠。 [0035] 余驟四，固化該黏膠形成黏膠體25。 [0036] • 另外，爲使從點光源進入導光板之光線傳輸效果不同， 於導光板入光面與光源相對之位置處可設置不同之微結 構，該微結構可爲凹槽或凸起。 [0037] 籲 請參閱圖6，本發明較佳實施例二之背光模組30之剖面示 意圖。背光模組30與背光模組20相似，亦包括點光源33 、導光板34與黏膠體35，其不同點在於：於導光板34之 入光面341與點光源33相對之位置上形成有複數“V”型 凸起343。通過“V”型凸起343之分光作用，可使點光源 33所産生之光線於進入導光板34時更加分散，繼而可使 從導光板34出射之光線具有更好之均勻性。 [0038·] 請參閱圖7，本發明較佳實施例三之背光模組40之剖面示 意圖。背光模組40與背光模組30相似，亦包括點光源43 、導光板44與黏膠體45，其不同點在於：於導光板44之 入光面341與點光源43相對之位置上形成之爲凹槽443。 通過凹槽443之光分散作用，亦可提高從導光板44出射之 光線之均勻性。 [0039] 可以理解，製備背光模組30，40之方法可與製備背光模 095140831 表單編號A0101 第9頁/共21頁 1003146812-0 1345662 100年04月27日梭正替换頁 組1 0之方法相似，並且其中導光板入光面之微結構，也 可於導光板之成型過程中同時形成。 [0040] 綜上所述，本發明符合發明專利要件，爰依法提出專利 申請。惟，以上所述者僅為本發明之較佳實施方式，本 發明之範圍並不以上述實施方式為限，舉凡熟悉本案技 藝之人士，於援依本案發明精神所作之等效修飾或變化 ，皆應包含於以下之申請專利範圍内。 【圖式簡單說明】1345662 Correction replacement page of April 27, 2014. Description of the Invention: [Technical Field] [0001] The present invention relates to a backlight module for a liquid crystal display device and a method of fabricating the same. [Prior Art] [0002] Liquid crystal display devices are widely used in personal digital assistants such as 'notebook computers, digital cameras, mobile phones, and LCD TVs. However, the liquid crystal display device is non-self-luminous, so it needs to be displayed by means of a backlight module. 4 Referring to FIG. 1 and FIG. 2, a conventional backlight module 1 〇. The backlight module includes a frame 11, a reflection sheet 12, a light emitting diode 13, a light guide plate 14, and an optical sheet 15. The frame 1 includes a recess 111 for accommodating the LED 13 and an accommodating space 112 for accommodating the reflective sheet 12, the light guide plate 14, and the optical sheet 15. The light-emitting diode 13 includes a susceptor 131, a light-emitting chip 132 on the susceptor 131, and a transparent resin 133 that encapsulates the light-emitting chip 132. The surface of the transparent resin 133 is a light-emitting surface 1331. The light guide plate 14 includes a light incident surface 141 adjacent to the light emitting diode 13, a light exit surface 142 connected to the light incident surface 141, and a bottom surface 143 opposite to the light exit surface 142. The optical sheet 15 is above the light-emitting surface 142 of the light guide plate 14, and the reflection sheet 12 is located below the bottom surface 143 of the light guide plate 14. During operation, the light emitted by the LED 13 directly enters the light guide plate 14 from the light incident surface 141; the diffusion of the light guide plate 14 and the reflection of the reflection sheet 12 are transmitted, and the light is uniformly emitted from the light exit surface 142 of the light guide plate 14 to the optical Slice 15. However, in the backlight module 10, although the distance between the light-emitting diode 13 and the light-incident surface 141 of the light guide plate 14 is small, there is an air layer between them; 095140831 Form No. A0101 Page 3 of 21 1003146812-0 [0004] 1345662 On April 27, 100, the nuclear replacement page has a transparent resin 133 for encapsulating the light-emitting diode 13 on the outer layer of the light-emitting diode 13, and the refractive index of the transparent resin 133 is different from the refractive index of the air. It is large, so when light is transmitted to the interface between the transparent resin 133 and the air layer, part of the light is easily lost by total reflection of the interface, thereby causing a decrease in the light energy utilization rate of the light-emitting diode 13. SUMMARY OF THE INVENTION [0005] In view of the above, it is necessary to provide a backlight module that can improve light utilization efficiency and a method of fabricating the same. [0006] A backlight module includes a light guide plate and at least one light source, the light guide plate has a light incident surface, the point light source is adjacent to the light incident surface, wherein the backlight module further comprises filling the light incident surface and the light The adhesive between the point sources. And the light incident surface of the light guide plate is formed with a microstructure. [0007] A method for fabricating a backlight module, comprising the steps of: providing a film substrate, and a frame; stamping the film substrate to form a pre-made hole; fixing a point source in the pre-made hole; Injecting adhesive between the walls of the pre-formed holes opposite to the point source light; curing the adhesive to form an adhesive; cutting the film substrate on which the adhesive is formed to form a light guide plate with a point source and an adhesive; The light guide plate with the point source and the adhesive body is assembled with the frame. [0008] Compared with the prior art, the backlight module forms an adhesive body between the light incident surface of the light guide plate and the point light source, because the refractive index of the adhesive body is larger than that of the transparent resin and the light guide plate of the air and the point light source. The rate is closer, so the total reflection angle of the light on the light exit surface can be reduced. When the light passes through the light exit surface of the point source, the light is reflected back to the inside of the point source to be reduced, thereby reducing the loss of light. Therefore, the above backlight module has an easy to improve 095140831 Form No. A0101 Page 4 of 21 1003146812-0 1345662 On April 27, 100, the advantage of positively replacing w light utilization. [0009] Referring to FIG. 3 and FIG. 4, a backlight module 20 according to a preferred embodiment of the present invention includes a frame 21, a point light source 23, a light guide plate 24, and an adhesive body 25. The frame 21 can receive and fix the light guide plate 24 and the point light source 23; the point light source 23 can be an illuminant packaged with a resin material. In this embodiment, the light emitting diode includes a base 231 and the light on the base 231 The wafer 232 and the transparent resin 233 encapsulating the light-emitting chip 232; the outer surface of the transparent resin 233 is the light exit surface 2331 of the point light source 23. The light guide plate 24 includes a light incident surface 241. The point light source 23 is adjacent to the light incident surface 241 of the light guide plate 24. The adhesive body 25 is located between the point light source 23 and the light incident surface 241 of the light guide plate 24, and is used to fill the point light source 23. 075毫米至0. 8毫米。 The light-emitting surface 2331 and the light-receiving surface of the light-receiving surface of the light-receiving surface 241. The material of the light guide plate 24 may be a transparent plastic, such as methyl methacrylate, polyester or polycarbonate; preferably a transparent plastic that can withstand higher temperatures (such as 150 ° C), such as polycarbonate, or added A polydecyl methacrylate or polyester having a heat resistant agent. [0011] The adhesive body 25 is a transparent object, which can be cured by an adhesive. For example, the adhesive can be one of an ultraviolet light curing adhesive and a heat curing adhesive; preferably, the refractive index and the transparent resin 233 of the point light source 23 after curing. And the refractive index of the light guide plate 24 is relatively close to the adhesive. [0012] In use, the light generated by the point source 23 enters the light guide plate 24 through the adhesive body 25. Since the refractive index of the adhesive body 25 is greater than the refractive index of the air, the refractive index of the transparent resin 233 and the light guide plate 24 of the point source 23 is different. Closer, because 095140831 Form No. A0101 Page 5 of 21 1003146812-0 1345662 On April 27, 100, according to the replacement page, the total reflection angle of the light on the light exit surface 2331 can be reduced when the light passes through the point source. When the light exiting surface 2331 is 23, the possibility that the light is reflected back to the inside of the point source 23 is reduced, and the loss of light is reduced, and the light utilization efficiency of the point source 23 is improved. In addition, since the adhesive body 25 has a certain adhesion force to the point light source 23 and the light guide plate 24, it is also easy to ensure that the relative positions of the point light source 23 and the light guide plate 24 are fixed. [0013] It can be understood that when the fluorescent particles are added into the adhesive body 25, the backlight module 20 is also easy to change the color of the outgoing light that can be provided. For example, when the point light source 23 in the backlight module 20 is a blue light emitting diode, the phosphor 25 is doped with phosphor powder that can be excited to generate yellow light, so that the light emitted by the backlight module 20 is white light. . [0014] Referring to FIG. 5, a method for preparing a backlight module 20 includes the following steps: [0015] Step 1 provides a film substrate 201 and a frame 21. The film substrate 201 may be a sheet or a web, which is a coil in this embodiment for the convenience of continuous production. 075毫米至0. 8毫米。 The thickness of the film substrate may be 0. 075 mm to 0. 8 mm. The material of the film substrate 201 may be a transparent plastic such as polymethyl methacrylate, polyester or polycarbonate; preferably a transparent plastic which can withstand higher temperatures (such as 150 ° C), such as polycarbonate, or It is a polydecyl methacrylate or polyester to which a heat resistant agent is added. [0016] Step two, stamping the film substrate 201 to form a preformed hole 202. One side of the hole wall of the preformed hole 202 can be used as the light incident surface 241. The pre-formed holes 202 can be stamped into different shapes depending on the shape of the point source 2 3 to be mounted and the number of point sources 23. 095140831 Form No. A0101 Page 6 of 21 1003146812-0 100 Years 〇 April 27 Shuttle Replacement Page 1345662 [0017] Step 3, the point source 23 is fixed in the prefabricated hole 202. [0018] In this step, the point light source 23 can be formed on the flexible printed circuit board 203 first, and then the light exit surface 2331 of the point light source 23 is directed toward the light incident surface 241 on the hole wall of the prefabricated hole, and then passed through the adhesive tape. The flexible printed circuit board 203 and the film substrate 201 on which the preformed holes 202 are formed are fixed to each other. [0019] Step 4: Injecting glue between the point source 23 and the hole wall of the preformed hole 202 opposite to the point source 23. Wherein, the adhesive may be one of an ultraviolet curing adhesive and a heat curing adhesive; in order to make the adhesive have a faster curing speed, it is preferably an ultraviolet curing adhesive; and in order to remove the point light source 23 before changing, The backlight module 20 can emit light of different colors, and can also add specific fluorescent particles into the adhesive; for example, when the point light source 23 in the backlight module 20 is a blue light emitting diode, in the adhesive body Adding fluorescent powder that can be excited to produce yellow light can make the light emitted by the backlight module white. In addition, the method of injecting the adhesive may be dispensing. [0020] Step 5, curing the adhesive to form the adhesive body 25. The curing process may use different curing methods depending on the adhesive used; for example, when the adhesive is an ultraviolet curing adhesive, the curing method is ultraviolet curing. [0021] Step 6. The film substrate 201 on which the adhesive body 25 is formed is cut to form a light guide plate 24 having a light source 23 and an adhesive body 25. The film substrate can be cut into a desired shape according to the shape of the backlight module 20 required. [0022] Step VII, the light guide plate 24 with the point source 23 and the adhesive body 25 is assembled with the frame 21. [0023] Another method of preparing the backlight module 20, comprising: 1003146812-0 095140831 Form No. A0101 Page 7 / Total 21 Page 1345662 On April 27, 100, press the replacement page [0024] [0025] [0026] [0028] [0028] [0030] [0032] [0032] Step 095140831, a first frame 21, a light guide plate 24 and a point light source 23, wherein the light guide plate 24 has a light incident surface 241, The point light source 23 has a light exit surface 2331. In the second step, the light exit surface 2331 of the point light source 23 is disposed toward the light incident surface 241 of the light guide plate 24. In this step, the point light source 23 can be formed on the flexible printed circuit board first; then the light exit surface 2331 of the point source 23 is opposite to the light incident surface 241 of the light guide plate 24, and the flexible circuit board is The light guide plates 24 are fixed to each other. Step 3: Injecting glue between the light exit surface 2331 of the point source 23 and the light incident surface 241 of the light guide plate 24. The adhesive may be one of an ultraviolet curing adhesive and a heat curing adhesive. In step four, the adhesive is cured to form the adhesive body 25. Among them, the curing process may be a thermal curing method or an ultraviolet curing method depending on the adhesive to be used. In step five, the light guide plate 24 and the point light source 23 to which the adhesive body 25 is attached are assembled with the frame 21. The method of preparing the backlight module 20 includes the following steps: Step 1: providing a frame 21, a light guide plate 24 and a point light source 23, wherein the light guide plate 24 has a light incident surface 241, and the point light source 23 has a Light exit surface 241. In step two, the light exit surface 2331 of the point light source 23 is directed toward the light incident surface 241 of the light guide plate 24, and the two are assembled with the frame 21. Form No. A0101 Page 8 / 21 pages 1003146812-0 1345662 100 years 〇 April 27th nuclear replacement 100 [0033] In this step, the light guide plate 24 can be fixed to the frame 21; then the point source 23 The light exit surface 2331 is placed facing the light incident surface 241 of the light guide plate 24; the point light source 23 is fixed to the frame 21. The method of fixing the light guide plate 24 to the frame 21 may be performed by ultrasonic bonding or adhesive bonding. [0034] Step 3: Injecting glue between the light exit surface 2331 of the point source 23 and the light incident surface 241 of the light guide plate 24. [0035] In the fourth step, the adhesive is cured to form the adhesive body 25. [0036] In addition, in order to make the light transmission effect from the point source into the light guide plate different, a different microstructure may be disposed at a position where the light incident surface of the light guide plate is opposite to the light source, and the microstructure may be a groove or a protrusion. [0037] Referring to FIG. 6, a cross-sectional view of a backlight module 30 according to a second preferred embodiment of the present invention is shown. The backlight module 30 is similar to the backlight module 20, and includes a point light source 33, a light guide plate 34 and an adhesive body 35. The difference is that a plurality of light-emitting surfaces 341 of the light guide plate 34 are opposite to the point light source 33. "V" shaped projection 343. By the light splitting action of the "V" shaped protrusions 343, the light generated by the point source 33 can be more dispersed when entering the light guide plate 34, and the light emitted from the light guide plate 34 can be made to have better uniformity. [0038] Please refer to FIG. 7, which is a cross-sectional view of a backlight module 40 according to a third embodiment of the present invention. The backlight module 40 is similar to the backlight module 30, and includes a point light source 43, a light guide plate 44 and an adhesive body 45. The difference is that the light incident surface 341 of the light guide plate 44 is opposite to the point light source 43. Groove 443. The uniformity of the light emitted from the light guide plate 44 can also be improved by the light dispersion of the grooves 443. [0039] It can be understood that the method for preparing the backlight module 30, 40 can be combined with the method for preparing the backlight module 095140831 Form No. A0101 Page 9/21 pages 1003146812-0 1345662 April 27th, the shuttle is replacing the page group 1 0 Similarly, and the microstructure of the light guide plate into the light surface can also be formed simultaneously during the molding process of the light guide plate. [0040] In summary, the present invention complies with the requirements of the invention patent, and submits a patent application according to law. However, the above description is only the preferred embodiment of the present invention, and the scope of the present invention is not limited to the above-described embodiments, and those skilled in the art will be equivalently modified or changed in the spirit of the invention. All should be included in the scope of the following patent application. [Simple description of the map]
[0041] 圖1係一種習知背光模組之立體分解示意圖。 [0042] 圖2係圖1背光模組組裝後之剖面示意圖。 [0043] 圖3係本發明背光模組較佳實施例一之立體示意圖。 [0044] 圖4係圖3沿IV-IV方向之剖面示意圖。 [0045] 圖5係製備圖3背光模組之流程示意圖。 [0046] 圖6係本發明背光模組較佳實施例二之剖面示意圖。1 is a perspective exploded view of a conventional backlight module. 2 is a cross-sectional view of the backlight module of FIG. 1 after assembly. 3 is a perspective view of a preferred embodiment 1 of a backlight module of the present invention. 4 is a schematic cross-sectional view of FIG. 3 taken along the line IV-IV. 5 is a schematic flow chart of preparing the backlight module of FIG. 3. 6 is a cross-sectional view showing a second preferred embodiment of the backlight module of the present invention.
[0047] 圖7係本發明背光模組較佳實施例三之剖面示意圖。 【主要元件符號說明】 [0048] (本發明） [0049] 背光模組： 20 、 30 、 40 [0050] 透明樹脂： 233 [0051] 框架：21 [0052] 入光面：241、341、441 095140831 表單編號A0101 第10頁/共21頁 1003146812-0 13456627 is a cross-sectional view showing a third preferred embodiment of the backlight module of the present invention. [Main component symbol description] [0048] (Invention) [0049] Backlight module: 20, 30, 40 [0050] Transparent resin: 233 [0051] Frame: 21 [0052] Light-in surface: 241, 341, 441 095140831 Form No. A0101 Page 10 / Total 21 Page 1003146812-0 1345662
[0053] 點光源：23、33、43 [0054] 凸起：343、443 [0055] 導光板：24、34、44 [0056] 出射面：2331 [0057] 黏膠體：25、35、45 [0058] 薄膜基材：201 [0059] 基座：231 [0060] 預製孔：202 [0061] 發光晶片：232 [0062] 電路板：203 [0063] (習知） [0064] 背光模組：10 [0065] 發光晶片：132 [0066] 框架：11 [0067] 透明樹脂：133 [0068] 反射片：12 [0069] 入光面：141 [0070] 發光二極體：13 [0071] 出光面：142 095140831 表單編號A0101 第11頁/共21頁 100年〇4月27日核正替換頁 1003146812-0 1345662 10CI年04月27日核正替換頁 [0072] 導光板：14 [0073] 底面：143 [0074] 光學片：15 [0075] 出射面：1331 [0076] 基座：131 1003146812-0 095140831 表單編號A0101 第12頁/共21頁Point light source: 23, 33, 43 [0054] Raised: 343, 443 [0055] Light guide plate: 24, 34, 44 [0056] Exit surface: 2331 [0057] Viscose: 25, 35, 45 [ 0058] Film substrate: 201 [0059] Base: 231 [0060] Prefabricated hole: 202 [0061] Light-emitting chip: 232 [0062] Circuit board: 203 [0063] (General) [0064] Backlight module: 10 [0065] Light-emitting wafer: 132 [0066] Frame: 11 [0067] Transparent resin: 133 [0068] Reflecting sheet: 12 [0069] Light-in surface: 141 [0070] Light-emitting diode: 13 [0071] Light-emitting surface: 142 095140831 Form No. A0101 Page 11 of 21 100 Years 〇 April 27th Nuclear Replacement Page 1003146812-0 1345662 10CI Year 27th Nuclear Replacement Page [0072] Light Guide: 14 [0073] Bottom: 143 [0074] Optical sheet: 15 [0075] Exit surface: 1331 [0076] Base: 131 1003146812-0 095140831 Form number A0101 Page 12 of 21