200821697 九、背明說明： 【發明所屬之技術領域】 本發明涉及一種液晶顯示裝置用之背光模組及其製 備方法。 【先前技術】 液晶顯示裝置被廣泛應用于個人數位助理、筆記型電 細、數位相機、移動電話、液晶電視等電子產品中。但由 於液曰曰顯不裝i爲非自發光性#，因此其需要借助背光模 組才具顯示功能。 請參閱圖1與圖2, -種習知背光模組1〇。背光模組 10包^框架11，反射片12 ’發光二極體，導光板14， 光予片15。其中，框架11包括用於放置發光二極體13 之:槽111與用於容置反射片12、導光板14及光學片15 之谷置m 112。發光二極體13包括基座131，基座⑶ 士之發光晶片132與封裝發光晶片132之透明樹脂133, 土明樹脂133之表面爲光出射面1331。導光板 光Γ極體13之入光面141，與入光面141相連之： 2及與出光面142相對之底面143。光學片 於導光板14出光面149 + ^七 尤予片15處 底面⑷之下方42之上方，反射片12位於導光板U 光面⑷直接進二作時，發光二極體13發出之光線從入 射片U之反=光板14;經過導光板U之擴散與反 …、而於月光模組10中，雖然發光二極體13與導光 200821697BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a backlight module for a liquid crystal display device and a method of fabricating the same. [Prior Art] Liquid crystal display devices are widely used in electronic products such as personal digital assistants, notebook type digital cameras, digital cameras, mobile phones, and liquid crystal televisions. However, since liquid helium does not mount i as non-self-luminous #, it needs to be displayed by means of a backlight module. Please refer to FIG. 1 and FIG. 2, a conventional backlight module 1〇. The backlight module 10 includes a frame 11, a reflection sheet 12', a light-emitting diode 14, a light guide plate 14, and a light-receiving sheet 15. The frame 11 includes a slot 111 and a valley m 112 for receiving the reflective sheet 12, the light guide plate 14, and the optical sheet 15. The light-emitting diode 13 includes a susceptor 131, a luminescent substrate 132 of the susceptor (3), and a transparent resin 133 for encapsulating the luminescent wafer 132. The surface of the varnish 133 is a light exit surface 1331. Light guide plate The light incident surface 141 of the photoconductor body 13 is connected to the light incident surface 141: 2 and a bottom surface 143 opposite to the light exit surface 142. The optical sheet is above the lower surface 42 of the bottom surface (4) of the light-emitting surface of the light guide plate 14 at the light-emitting surface 149 + ^7, and the light-emitting diode 13 emits light when the reflective sheet 12 is located directly on the light-emitting surface (4) of the light guide plate. The anti-light plate 14 of the incident sheet U; the diffusion and the anti-reflection through the light guide plate U, and in the moonlight module 10, although the light-emitting diode 13 and the light guide 200821697
板14之入光面1 4· 1夕I - 之距離較小，但立相互之門太 〆 層；由於發光二極體13外 鮮 a子在工軋 囔昍斟Ht η, Γ層有用於封裝發先二極體13之 :差=1二透明樹脂133之折射率與空氣之折射率 乂 4虽光線傳輸至透明樹脂133與空氣#之介 面時，部分光線容易於該介面發生全反射而損耗 成發光二極體13之光能利用率降低。 、 而以 【發明内容】 鑒於上述内容，提供一種可提高光線 組及其製備方法實為必需。 手之月先杈 •導光严組，其包括—導光板及至少-點光源，該 、先板”有-個人光面，該點光源#近該人光面，立中該 月先模組還包括填充該入光面與該點光源之間之黏膠體f 一種背光模組之製備方、本，甘七k , 薄膜基材，與-框架；衝料，二二如J步驟：提供- 光源固定于該預製孔内；於哕點 夺”、，占 之預製孔之孔壁之間注入S t:與該點光源光相對 黏膠，固化該黏膠形成黏膠體； 膜基材’形成帶有點光源_ 架組有點光源與黏膠體之導光板與該框 又一種背光模組之製備方法盆七 -插架道上Η辰備万法’其包括如下步驟：提供 V先板與-點光源，其中，該導光板具有一入 ==光源具有一光出射面；將該點光源之光出射面 =該導光板之入光面設置；於該點光源之光出射面與該 U板之人光面之間隙注人轉；固化該黏膠形成黏膠 200821697 =及將連結有黏膠體之導光板與點光源與該框架組裝成 -框^種、f光模組之製備方法，其包括如下步驟：提供 本而# ¥光板與—點光源’其巾’料光板具有一入 朝向兮^光源具有—光出射面；使該點光源之光出射面 點二=板之入光面，並將兩者與該框架相組裝;於該 點先源之光出射面與該導光板之人光面之之間注入黏膠； 及固化該黏膠形成黏膠體。 與習知技術相比較，上述背光模組於導光板之入光面 與點光源之間形成有黏膠體，由於黏膠體之折射率較空氣 與點光源之透明樹脂及導光板之折射率更爲接近，因I光 線於光出射面之全反射角可減小，當光線通過該點光源之 光出射面日t，光線被反射回點光源内部可減少，從而使光 線之損耗降低。因此上述背光模組具有易於提高光線利用 率之優點。 【實施方式】 請參閱圖3與圖4，本發明較佳實施例一之背光模組 20包括框架21，點光源23,導光板24及黏膠體25。其中， 框架21可收容並固定導光板24與點光源23 ;點光源23 可爲使用樹脂材料封裝之發光體，本實施例爲發光二極 體，其包括基座231，基座231上之發光晶片232,及封裝 發光晶片232之透明樹脂233 ;透明樹脂233之外表面爲 點光源23之光出射面2331。導光板24包括一個入光面 241，點光源23靠近導光板24之入光面241，黏膠體25 200821697 位於點光源23與導光板24之人光面24i之間，其用於填 充點光源23之光出射面2331與導光板^入光面241之間 之間隙。 古導光板24之厚度可較薄’例如其可爲㈣乃毫米至 〇·8笔米|光板24之材質可爲透明塑膠，例如甲基丙 酸甲醋、聚醋或聚碳酸酿；優選係可承受較高溫度(如150The distance between the light-emitting surface of the plate 14 and the light-emitting surface of the plate 14 is small, but the door of each other is too thick; because the light-emitting diode 13 is fresh, the a-layer is used in the rolling 囔昍斟Ht η, and the Γ layer is used for The packaged first diode 13 is: the difference between the refractive index of the transparent resin 133 and the refractive index of the air 乂4. When the light is transmitted to the interface of the transparent resin 133 and the air #, part of the light is easily totally reflected by the interface. The light energy utilization rate of the light-emitting diode 13 is reduced. SUMMARY OF THE INVENTION In view of the above, it is necessary to provide a light group and a method for preparing the same. The hand of the month 杈 导 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 The method further comprises a method of preparing a backing module for filling a gap between the light incident surface and the point light source, a method for preparing a backlight module, a substrate, a film substrate, a frame, a punching material, and a second step, such as a J step: providing - The light source is fixed in the pre-made hole; and the S t is injected between the walls of the pre-formed hole; the glue is opposite to the light source of the point source, and the adhesive is cured to form an adhesive; the film substrate is formed With a point light source _ frame group light source and adhesive body light guide plate and the frame another backlight module preparation method pot seven - plug the road on the Η 备 备 ' ' ' 其 其 其 其 其 其 其 其 其 其 其 其 其 其 其 其 : : : : : : : : : : : : The light guide plate has an input==light source having a light exit surface; the light exit surface of the point light source=the light incident surface of the light guide plate; and the light exit surface of the light source and the U panel The gap between the smooth surfaces is turned; the adhesive is cured to form a glue 200821697 = and the light guide plate to which the adhesive is attached The method for preparing a point light source and the frame into a frame and a f-light module comprises the steps of: providing a light source plate and a point light source, and the material of the light plate has an input direction and a light source having - a light exiting surface; causing the light of the point source to exit the surface point 2 = the light incident surface of the panel, and assembling the two with the frame; at the point of the light source exit surface and the light surface of the light guide plate Injecting the adhesive; and curing the adhesive to form a viscose. Compared with the prior art, the backlight module forms an adhesive body between the light incident surface of the light guide plate and the point light source, because the refractive index of the adhesive body is higher than that of the transparent resin and the light guide plate of the air and the point light source. Close, because the total reflection angle of the I light on the light exit surface can be reduced, when the light passes through the light exit surface of the point source, the light is reflected back to the inside of the point source, so that the loss of the light is reduced. Therefore, the above backlight module has an advantage of being easy to improve light utilization. [Embodiment] Referring to FIG. 3 and FIG. 4, a backlight module 20 according to a preferred embodiment of the present invention includes a frame 21, a point light source 23, a light guide plate 24, and an adhesive body 25. The frame 21 can receive and fix the light guide plate 24 and the point light source 23; the point light source 23 can be an illuminant packaged with a resin material. In this embodiment, the light emitting diode includes a pedestal 231 and the illuminating light on the pedestal 231 The wafer 232 and the transparent resin 233 encapsulating the light-emitting chip 232; the outer surface of the transparent resin 233 is the light exit surface 2331 of the point light source 23. The light guide plate 24 includes a light incident surface 241, and the point light source 23 is adjacent to the light incident surface 241 of the light guide plate 24. The adhesive body 25 200821697 is located between the point light source 23 and the human light surface 24i of the light guide plate 24, and is used to fill the point light source 23 The light exit surface 2331 and the gap between the light guide plate and the light guide surface 241. The thickness of the ancient light guide plate 24 can be relatively thin, for example, it can be (4) or millimeters to 8 pens of rice. The material of the light plate 24 can be a transparent plastic, such as methyl methacrylate, polyester or polycarbonate. Can withstand higher temperatures (eg 150
C)之透明塑膠，例如聚糊，或者係添加有耐熱劑之聚 曱基丙烯酸曱酯或聚酯。 K 黏膠體25一爲透明物體，其可由黏膠經固化而成，例 如’該黏膠可爲紫外光固化膠與熱固化膠之一；優選固化 :折射率與點光源23之透明樹脂233及導光板24之折射 率較爲接近之黏膠。 使用時’點光源23產生之光線通過黏膠體25進入 光板24’由於黏膠體25之折射率大於空氣之折射率，发 與點光源23之透明樹脂233及導光板以之 接 近，因此光線於光出射面2331之全反射角可減小，當= 通過點先源23之光出射面咖時，使光線被反射回 源23内。ρ之可能性減少，而使光線之損耗降低，提高點 =23之光線利用率。另’由於黏膠體25與點光源23及導 23^?具有一定之黏附力，因此其還易於確保點光湃 23與導光板24之相對位置固定。 原 #可以理解，當於黏膠體25内加入榮光粒子時， 权、、且20還易於變更其所能提供之出射光線之顏色" 當背光模組20中之點光源23爲藍光發光二極體時，於點 9 200821697 膠體25内摻雜入可被激發産 模組20發出之光線爲白光。U之螢先如’則可使背光 請同時參閱圖5，一種 括如下步驟： 侑月先杈組20之方法，其包 步驟一，提供一薄膜某 基材加可爲片材或卷材，連架21 °該薄膜 爲卷材。該薄膜基材2〇1之厚〜連，生産丄本實施财 米。該薄膜基材2〇1之材二為·〇75笔米至〇·8毫 ^ ^ ψ t 、了爲透明塑膠，例如聚甲基丙C) A transparent plastic such as a polydextrin or a polydecyl acrylate or polyester to which a heat resistant agent is added. The K-adhesive body 25 is a transparent object, which can be cured by an adhesive. For example, the adhesive can be one of an ultraviolet curing adhesive and a thermosetting adhesive; preferably curing: a transparent resin 233 having a refractive index and a point source 23 and The refractive index of the light guide plate 24 is relatively close to the adhesive. When used, the light generated by the point source 23 enters the light plate 24' through the adhesive body 25. Since the refractive index of the adhesive body 25 is greater than the refractive index of the air, the transparent resin 233 and the light guide plate of the point source 23 are close to each other, so that the light is in the light. The total reflection angle of the exit surface 2331 can be reduced, and when the light passing through the point source 23 is emitted, the light is reflected back into the source 23. The possibility of ρ is reduced, and the loss of light is reduced, and the light utilization rate of point = 23 is improved. In addition, since the adhesive body 25 has a certain adhesion force to the point light source 23 and the guide member 23, it is also easy to ensure that the relative positions of the spot diaphragm 23 and the light guide plate 24 are fixed. It can be understood that when the glory particles are added to the adhesive body 25, the weights and the 20s are also easy to change the color of the outgoing light that can be provided. When the point light source 23 in the backlight module 20 is a blue light emitting diode In the case of the body, the light emitted from the colloid 25 in the colloid 25 is white light at point 9 200821697. U-Fluor first can be used as the backlight. Please refer to Figure 5 at the same time. The method includes the following steps: The method of the first group of 20, the package step 1 provides a film and a substrate can be a sheet or a coil. The frame is 21 ° and the film is a coil. The thickness of the film substrate 2〇1 is reduced, and the production of the film is carried out. The film substrate 2〇1 is made of 〇75笔m to 〇·8m ^ ^ ψ t, and is a transparent plastic such as polymethyl propyl
之取甲其⑽’例如聚碳酸酯，或者係添加有耐敎劑 之聚甲基丙烯酸甲酯或聚酯。 另U :驟二’衝魔該薄膜基材2〇1形成預製孔2〇2。 該預製孔202之孔壁之 m ^ ^ Ύ 搬可根據需要安裝之入光面241。該預製孔 浐之^先源23之形狀及點光源Μ之數 f之不同衝壓成不同之形狀。 y驟一將點光源、23固定于該預製孔逝内。 該乂驟中’點光源23可先形成於柔性印刷電路板203 上’然後將該點光源23之光出射面2331朝向該預製孔之 孔土上之入光面241 ’再通過膠貼之方式使該柔性印刷電 路板2〇3與該形成有預製孔逝之薄膜基材201自互固定。 步驟四’於點光源23及與點光源23相對之預製孔202 之孔壁之間注入黏膠。其中’該黏膠可爲紫外光固化膠與 熱固化膠之一；爲使該黏膠具有較快之固化速度，優選爲 i外光固化膠，且爲使於不變更點光源23之前提下，使背 200821697 2杈組20可發出不同顏色之光線，還可於該黏膠内加入特 ，之螢光粒子’例如，當背光模組2〇中之點光源Μ爲藍 光發光二極體時，於黏膠體内加入可被激發産生黃光之^ 光伞刀，則可使背光模組發出之光線爲白光。另外，該注入 黏膠之方法可爲點膠。 v驟五，固化該黏膠形成黏膠體25。該固化過程可根 據所採用之黏膠之不同而選用不同之固化方法；例如，各 (黏膠爲紫外光固化膝時，該固化方法爲紫外光固化。田 、*步驟六，裁切該形成有黏膠體25之薄膜基材2〇卜形 成帶有點光源23與黏膠體25之導光板24。其中，可根據 所需背光模組20外形，將該薄膜基材裁切成所需之外形。 步驟七，將帶有點光源23與黏膠體25之導光 與框架21組裝成型。 另—種製備背光模組20之方法，其包括： 步驟提供—框架21，一導光板24與一點光源U， i 該‘光板24具有一入光面241，該點光源23具有 一光出射面2331。 ’、 步驟二，將點光源23之光出射面2331朝向導光板24 之入光面241設置。 該步驟中，點光源23可先形成於柔性印刷電路板上； …Η將點光源23之光出射面2331與導光板24之入光面 241相對’再通過膠貼之方式使該柔性電路板與該導光 相互固定。 步驟三，於點光源23之光出射面2331與導光板24 11 200821697 之入光面241之之間注入黏膠。其中，該黏膠可爲紫外光 固化膠與熱固化膠之一。 步驟四，固化該黏膠形成黏膠體25。其中，該於固化 過程可根據所採用之黏膠之不同，選用熱固化法或紫外光 固化法。 μ 步驟五，將其連結有黏膠體25之導光板24和點光源 23與框架21組裝成型。 再一種製備背光模組20之方法，其包括如下步驟： 步驟一，提供一框架21，一導光板24與一點光源23, 其中，導光板24具有一入光面241，該點光源23具有一 光出射面241。 步驟二，使該點光源23之光出射面2331朝向該導光 板24之入光面241，並將兩者與該框架21相組裝。 該步驟中，可先將該導光板24固定於該框架21 ;然 後使點光源23之光出射面2331面對該導光板以之入光面 241放置，再將點光源23固定於框架。其中，導光板 24固定於框架21之方法可採用超聲波結合或膠貼合。 步驟二，於點光源23之光出射面2331與導光板24 之入光面241之之間注入黏膠。 步驟四’固化該黏膠形成黏膠體25。 一另外，爲使從點光源進入導光板之光線傳輸效果不 同於導光板入光面與光源相對之位置處可設置不同之微 結構’該微結構可爲凹槽或凸起。 請參閱圖6,本發明較佳實施例二之背光模組3〇之剖 12 200821697 面示考圖。背光模組30與背本伊4 。 、s u1 先杈組20相似，亦包括點光 源33、導光板34與黏膠體35， ^ , 版心，其不同點在於：於導光板 34之入光面341與點光源33 “V”型凸起343。通過“v ^對之位置上形成有複數 # ^ . 孓凸起343之分光作用，可使 == 線於進入導光板34時更加分散，繼 而，導光板％出射之光線具有更好之均勾性。 明參閱圖7，本發明較伟每Α 而一立固t 孕乂铨只施例三之背光模組40之剖 ^圖1光模組40與背光模組30相似，亦包括點光 源43、導光板44與黏膠體45， ’、、 44之入光面341與點光源43 蜍先板 443。通過凹槽443之光分散作用立置上^成之爲凹槽 出射之光線之均勻性。 ，亦可提南從導光板44 可以理解，製備背光模 光模組10之太、车士 7、 、 、、、 4〇之方法可與製備背 也可於導Μ ^目^並且其中導光板人光面之微結構， 也了於導先板之成型過程中_形^ 稱 利二:述，本發明符合發明專利要件，爱依法提出專 =。’二以上所述者僅為本發明之較佳實施方式，I 二人士二 述實施方式為限，舉凡熟悉本案技藝 應包含於以下=精神所作之等效修飾或變化，皆 匕3於以下之申請專利範圍内。 白 【圖式簡單說明】 種習知背光模組之立體分解。 ==上背光模組組裳後之剖面示意圖。 -發明背光模組較佳實施例一之立體示意圖。 13 200821697 11 4係圖3沿IV-IV方向之剖面示意圖。 圖5係製備圖3背光模組之流程示意圖。 圖6係本發明背光模組較佳實施例二之剖面示意圖。 圖7係本發明背光模組較佳實施例三之剖面示意圖。 【主要元件符號說明】 (本發明） 背光模組 20、30 > 40 透明樹脂 233 框架 21 入光面 241、341、441 點光源 23 、 33 > 43 凸起 343 、 443 導光板 24 、 34 > 44 出射面 2331 黏膠體 25 、 35 > 45 薄膜基材 201 基座 231 預製孔 202 發光晶片 232 電路板 203 知） 背光模組 10 發光晶片 132 框架 11 透明樹脂 133 反射片 12 入光面 141 發光二極體 [13 出光面 142 導光板 14 底面 143 光學片 15 出射面 1331 基座 131 14It is made of (10)' such as polycarbonate, or polymethyl methacrylate or polyester to which an anti-caries agent is added. Another U: The second step of the film substrate 2〇1 forms a preformed hole 2〇2. The m ^ ^ 孔 of the hole wall of the pre-formed hole 202 can be attached to the light incident surface 241 as needed. The shape of the pre-made hole 先 and the number of the point source f are differently stamped into different shapes. y First, the point source, 23 is fixed in the pre-made hole. In the step, the 'point source 23 can be formed on the flexible printed circuit board 203' and then the light exit surface 2331 of the point source 23 is directed toward the light-incident surface 241' on the hole of the pre-formed hole. The flexible printed circuit board 2〇3 and the film substrate 201 on which the pre-formed holes are formed are self-fixed. In step 4, an adhesive is injected between the point source 23 and the wall of the preformed hole 202 opposite to the point source 23. Wherein the adhesive may be one of an ultraviolet curing adhesive and a heat curing adhesive; in order to make the adhesive have a faster curing speed, it is preferably an external light curing adhesive, and is provided so as not to change the point light source 23 The back 200821697 2杈 group 20 can emit light of different colors, and a special fluorescent particle can be added into the adhesive, for example, when the point light source in the backlight module 2 is a blue light emitting diode. In the viscose body, a light umbrella that can be excited to generate yellow light is added, so that the light emitted by the backlight module is white light. Alternatively, the method of injecting the adhesive can be dispensing. v. Fifth, the adhesive is cured to form the adhesive body 25. The curing process may use different curing methods depending on the adhesive used; for example, each (the adhesive is UV-cured when the adhesive is UV-cured. Field, *Step 6, cutting the formation) The film substrate 2 having the adhesive body 25 is formed into a light guide plate 24 having a point source 23 and an adhesive body 25. The film substrate can be cut into a desired shape according to the shape of the desired backlight module 20. Step 7: assembling the light guide with the point source 23 and the adhesive body 25 to the frame 21. Another method for preparing the backlight module 20 includes: providing a frame 21, a light guide plate 24 and a point light source U, i The light panel 24 has a light incident surface 241 having a light exit surface 2331. ', Step 2, the light exit surface 2331 of the point light source 23 is disposed toward the light incident surface 241 of the light guide plate 24. The point light source 23 may be formed on the flexible printed circuit board first; the light exit surface 2331 of the point light source 23 is opposite to the light incident surface 241 of the light guide plate 24, and the flexible circuit board is The light guides are fixed to each other. Step 3, The adhesive is injected between the light exit surface 2331 of the light source 23 and the light incident surface 241 of the light guide plate 24 11 200821697. The adhesive may be one of an ultraviolet light curing adhesive and a heat curing adhesive. Step 4: curing the adhesive The adhesive body 25 is formed, wherein the curing process may be performed by a heat curing method or an ultraviolet curing method depending on the adhesive used. μ Step 5, connecting the light guide plate 24 and the point light source 23 of the adhesive body 25 The method of preparing the backlight module 20 includes the following steps: Step 1: providing a frame 21, a light guide plate 24 and a point light source 23, wherein the light guide plate 24 has a light incident surface 241. The point light source 23 has a light exit surface 241. Step 2, the light exit surface 2331 of the point light source 23 is directed toward the light incident surface 241 of the light guide plate 24, and the two are assembled with the frame 21. The light guide plate 24 can be fixed to the frame 21; then the light exit surface 2331 of the point light source 23 is placed facing the light guide plate to the light incident surface 241, and the point light source 23 is fixed to the frame. The method of fixing to the frame 21 can be adopted Ultrasonic bonding or glue bonding. Step 2, injecting glue between the light exit surface 2331 of the point source 23 and the light entrance surface 241 of the light guide plate 24. Step 4 'curing the adhesive to form the adhesive body 25. In order to make the light transmission effect from the point source into the light guide plate different from the light incident surface of the light guide plate at a position opposite to the light source, a different microstructure may be provided. The microstructure may be a groove or a protrusion. Referring to FIG. 6, the present invention The backlight module 3 of the preferred embodiment 2 is shown in Fig. 12 200821697. The backlight module 30 is similar to the back Benyi 4, s u1 杈 杈 group 20, and also includes the point source 33, the light guide plate 34 and the stick. The colloid 35, ^, the core is different in that the light incident surface 341 of the light guide plate 34 and the point light source 33 "V" type projection 343. By the "v ^ pair position formed with a complex # ^ . 孓 protrusion 343 of the light splitting effect, the == line can be more dispersed when entering the light guide plate 34, and then, the light emitted by the light guide plate has a better uniformity Referring to FIG. 7 , the present invention is more versatile and the same as the backlight module 40 of the third embodiment. The optical module 40 is similar to the backlight module 30, and includes a point light source. 43. The light guide plate 44 and the adhesive body 45, the light incident surface 341 of the ', 44, and the point light source 43 蜍 the front plate 443. The light dispersion through the groove 443 is set up to be uniform for the light emitted by the groove. It can also be understood that the light guide plate 44 can be understood from the light guide plate 44, and the method for preparing the backlight mode module 10, the driver, the vehicle, the vehicle, the vehicle can also be used as a guide. The microstructure of the light surface of the light guide plate is also in the molding process of the guide plate. _ Form ^ Li 2: The invention complies with the invention patent requirements, and the love is proposed according to law. The preferred embodiment of the invention, the second embodiment of the second embodiment is limited to the following, and the skill of the present invention should be included in the following = fine The equivalent modification or change made by God is within the scope of the following patent application. White [Simple Description] The stereoscopic decomposition of the conventional backlight module. == The schematic diagram of the backlight module after the skirt. - A perspective view of a preferred embodiment of the backlight module. 13 200821697 11 4 is a schematic cross-sectional view along the IV-IV direction of Fig. 3. Fig. 5 is a schematic flow chart of the backlight module of Fig. 3. Fig. 6 is a backlight mode of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS Figure 7 is a cross-sectional view showing a preferred embodiment 3 of the backlight module of the present invention. [Main component symbol description] (Invention) Backlight module 20, 30 > 40 Transparent resin 233 frame 21 Light-in surface 241, 341, 441 Point light source 23, 33 > 43 Raised 343, 443 Light guide plate 24, 34 > 44 Exit surface 2331 Adhesive body 25, 35 > 45 Film substrate 201 Base 231 Pre-made hole 202 illuminating chip 232 circuit board 203 know) backlight module 10 illuminating chip 132 frame 11 transparent resin 133 reflecting sheet 12 light incident surface 141 light emitting diode [13 light emitting surface 142 light guide plate 14 bottom surface 143 optical sheet 15 exit surface 1331 pedestal 131 14