JP2006245626A - Manufacturing method of light-emitting diode - Google Patents

Manufacturing method of light-emitting diode Download PDF

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JP2006245626A
JP2006245626A JP2006169212A JP2006169212A JP2006245626A JP 2006245626 A JP2006245626 A JP 2006245626A JP 2006169212 A JP2006169212 A JP 2006169212A JP 2006169212 A JP2006169212 A JP 2006169212A JP 2006245626 A JP2006245626 A JP 2006245626A
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light
resin
substrate
translucent resin
emitting diode
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Koichi Fukazawa
孝一 深澤
Hirohiko Ishii
廣彦 石井
Masahide Watanabe
将英 渡辺
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Citizen Electronics Co Ltd
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Citizen Electronics Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate

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  • Microelectronics & Electronic Packaging (AREA)
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a light-emitting diode manufacturing method and structure that solve problems in conventional methods using molded reflection frames, improve the quality and reliability of light-emitting diode products and further enable product compaction and cost reduction. <P>SOLUTION: This manufacturing method comprises a first process of flowing translucent resin and coating LED elements on a substrate with many LED elements mounted, a second process of hardening the translucent resin and then removing it in an intermediate portion of the LED elements, a third process of filling the translucent resin, substrate and light reflection resin with thermal properties in a groove formed in the second process and a fourth process of hardening the light reflecting resin and then cutting the substrate, in a way that the corresponding light reflecting resin remains around the LED elements to produce separate light-emitting diodes. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は発光ダイオードの製造方法および発光ダイオードの構造に関する。更に詳しくは、製造上および使用上の利点を有する発光ダイオードの新規な製造方法と、それによって得られる発光ダイオードの構造に関する。   The present invention relates to a method for manufacturing a light emitting diode and a structure of the light emitting diode. More particularly, the present invention relates to a novel method for manufacturing a light emitting diode having manufacturing and use advantages and a structure of the light emitting diode obtained thereby.

従来の発光ダイオードの製造方法を図５と図６の斜視図を用いて説明する。
図５において１は基板であり、その上面の電極パターン（図示せず）に所定の位置・間隔で多数のチップ状のＬＥＤ素子２が実装されており、金線等のボンディングワイヤ３等にて必要な接続もされている。発光ダイオードの光利用率を上げるために光反射性の部材が必要である。１０はそのための反射枠で、光反射性とするため白色の熱可塑性樹脂を射出成形したものであり、厚さはＬＥＤ素子２およびボンディングワイヤ３の全高よりも大である。反射枠１０には基板１上のＬＥＤ素子２に合わせた位置に多数の穴１０ａが形成されている。反射枠１０の材質はとしては、例えば液晶ポリマー、ＰＢＴ（ポリブチレンテレフタレート）、ＰＰＳ（ポリフェニレンサルファイド）等が用いられる。 A conventional method for manufacturing a light emitting diode will be described with reference to the perspective views of FIGS.
In FIG. 5, reference numeral 1 denotes a substrate, and a large number of chip-like LED elements 2 are mounted at predetermined positions and intervals on an electrode pattern (not shown) on the upper surface, and bonding wires 3 such as gold wires are used. Necessary connections are also made. In order to increase the light utilization rate of the light emitting diode, a light reflective member is required. A reflecting frame 10 is formed by injection molding a white thermoplastic resin to make it light-reflective, and its thickness is larger than the total height of the LED element 2 and the bonding wire 3. A large number of holes 10 a are formed in the reflecting frame 10 at positions corresponding to the LED elements 2 on the substrate 1. As the material of the reflection frame 10, for example, liquid crystal polymer, PBT (polybutylene terephthalate), PPS (polyphenylene sulfide), or the like is used.

基板１と反射枠１０とを図６のように重ねて接着した後、ＬＥＤ素子２が嵌入した各々の穴１０ａ内に液状の透光性樹脂４を注入し、樹脂を硬化させる。透光性樹脂４は透明であり内部のＬＥＤ素子が見えるので、図面ではこの部分のみを透視図で表現してある。透光性樹脂４には通常透明な熱硬化性樹脂、例えばエポキシ樹脂が使用される。これにより各ＬＥＤ素子２は樹脂封止され、また発光した光は穴１０ａの白色の内面で反射され効率よく利用されることになる。透光性樹脂４の硬化後、ダイシング装置を用いて基板１と反射枠１０とは同時に、矢印線で示したカッティングライン８に沿って薄いダイシングブレード（図示せず）で切込むことにより縦横に切断され、樹脂封止されたＬＥＤ素子を一個づつ含んだ個々の発光ダイオードに分離される。   After the substrate 1 and the reflection frame 10 are overlapped and bonded as shown in FIG. 6, the liquid translucent resin 4 is injected into each hole 10a in which the LED element 2 is inserted, and the resin is cured. Since the translucent resin 4 is transparent and the internal LED element can be seen, only this portion is represented by a perspective view in the drawing. The translucent resin 4 is usually a transparent thermosetting resin such as an epoxy resin. Thereby, each LED element 2 is resin-sealed, and the emitted light is reflected by the white inner surface of the hole 10a and used efficiently. After the translucent resin 4 is cured, the substrate 1 and the reflection frame 10 are simultaneously cut vertically and horizontally by cutting with a thin dicing blade (not shown) along the cutting line 8 indicated by the arrow line using a dicing machine. It is separated into individual light emitting diodes each including cut and resin-sealed LED elements.

上述の従来技術においては以下の問題点がある。
（１）透光性樹脂４（熱硬化性樹脂）と反射枠１０（熱可塑性樹脂）との熱膨張係数を合わせることが困難であるため、リフロー工程等加熱される工程において例えばＬＥＤ素子の剥がれ、ボンディングワイヤの断線、反射枠の剥がれ等の不具合が起ることがあり、製造上の歩留りと製品の信頼性向上に限界があった。 The above prior art has the following problems.
(1) Since it is difficult to match the thermal expansion coefficients of the translucent resin 4 (thermosetting resin) and the reflective frame 10 (thermoplastic resin), for example, the LED element is peeled off in a heating process such as a reflow process. In some cases, defects such as disconnection of the bonding wire and peeling of the reflection frame may occur, and there is a limit to improvement in manufacturing yield and product reliability.

（２）光の反射に寄与するのは反射枠の表面であるから、カッティングで削除されて残る厚さは原理的には極めて薄くてよい。しかし反射枠が射出成形で作られるため、壁面の肉厚を極めて薄くできないのでランプ（発光ダイオード）の小型化に限界があった。
（３）基板と反射枠を貼り合わせるので、貼り公差すなわち接着の位置ずれ量を考慮しなければならない。このこともランプの更なる小型化を妨げる要因となっていた。また接着剤（エポキシ樹脂系が用いられる）の穴内や枠外へのはみ出しも不具合の原因の一つであった。
（４）また反射枠の成形には金型等の設備を用いるので、殊に少量生産の場合低コスト化が困難であった。 (2) Since it is the surface of the reflecting frame that contributes to the reflection of light, the thickness remaining after cutting can be very thin in principle. However, since the reflecting frame is made by injection molding, the wall thickness cannot be made extremely thin, so there is a limit to the miniaturization of the lamp (light emitting diode).
(3) Since the substrate and the reflection frame are bonded together, it is necessary to consider the bonding tolerance, that is, the positional deviation amount of bonding. This was also a factor that hindered further downsizing of the lamp. Further, the sticking out of the adhesive (epoxy resin system) into the hole or out of the frame was one of the causes of the malfunction.
(4) Further, since equipment such as a mold is used for forming the reflection frame, it is difficult to reduce the cost especially in the case of small-scale production.

本発明の目的は、従来の製法における成形した反射枠を用いることによる不具合を解消し、発光ダイオード製品の品質や信頼性を向上させ、更には小型化やコストダウンも可能とする発光ダイオードの製造方法と、それによって達成される発光ダイオードの構造を提供することである。   The object of the present invention is to manufacture a light emitting diode that eliminates the problems caused by using a shaped reflection frame in the conventional manufacturing method, improves the quality and reliability of the light emitting diode product, and further enables downsizing and cost reduction. It is a method and a light emitting diode structure achieved thereby.

本発明の発光ダイオードの製造方法は、次の特徴のいずれかを有する。
（１）ＬＥＤ素子を多数実装した基板の前記個々のＬＥＤ素子を埋没させるように印刷用以外の液状の透光性樹脂を前記基板上に流すことによって覆う第１の工程と、前記透光性樹脂の硬化後に隣接する前記ＬＥＤ素子の中間部の前記透光性樹脂を除去する第２の工程と、該第２の工程によって形成された溝部に、前記透光性樹脂と基材が近似の性質あるいは同質の樹脂に白色顔料を混入しかつ前記透光性樹脂および前記基板と熱的性質を揃えた光反射性樹脂を充填する第３の工程と、前記光反射性樹脂の硬化後に該光反射性樹脂を前記ＬＥＤ素子の周囲に残すように前記基板を切断して個々の発光ダイオードに分離する第４の工程とを含むこと。
（２）（１）において、前記基板を切断して個々の発光ダイオードに分離する第４の工程にはダイシング装置に取り付けたダイシングブレードを用い、また前記ＬＥＤ素子の中間部の前記透光性樹脂を除去する第２の工程には前記第４の工程で用いたのと同じ幅のダイシングブレードを切込みを浅くして複数回平行に走らせることによって必要な溝幅を形成すること。
（３）ＬＥＤ素子を多数実装した基板上の前記ＬＥＤ素子を蛍光剤を混ぜた印刷用以外の液状の透光性樹脂で覆う第１の工程と、前記透光性樹脂の硬化後に隣接する前記ＬＥＤ素子の中間部の前記透光性樹脂を除去する第２の工程と、該第２の工程によって形成された溝部に前記透光性樹脂と基材が近似の性質あるいは同質の樹脂に白色顔料を混入しかつ前記透光性樹脂および前記基板と熱的性質を揃えた光反射性樹脂を充填する第３の工程と、前記光反射性樹脂の硬化後に該光反射性樹脂を前記ＬＥＤ素子の周囲に残すように前記基板を切断して個々の発光ダイオードに分離する第４の工程とを含むことを特徴とし、前記蛍光剤によって前記ＬＥＤ素子から変換された発光色を得るようにしたこと。
（４）（３）において、前記ＬＥＤ素子は青色ＬＥＤであり、前記変換された発光色は白色であること。 The manufacturing method of the light emitting diode of this invention has either of the following characteristics.
(1) a first step of covering the substrate by mounting a liquid translucent resin other than for printing on the substrate so as to bury the individual LED elements of the substrate on which a large number of LED elements are mounted; and the translucency In the second step of removing the translucent resin in the intermediate portion of the LED element adjacent after the resin is cured, and the groove formed by the second step, the translucent resin and the base material are approximate to each other. A third step in which a white pigment is mixed into a resin having the same properties or the same quality and filling the light-transmitting resin and the light-reflecting resin having the same thermal properties as the substrate; and after the light-reflecting resin is cured, And a fourth step of cutting the substrate so as to leave a reflective resin around the LED element and separating the substrate into individual light emitting diodes.
(2) In (1), a dicing blade attached to a dicing device is used in the fourth step of cutting the substrate and separating it into individual light emitting diodes, and the translucent resin at the intermediate portion of the LED element In the second step of removing, a necessary groove width is formed by running a dicing blade having the same width as that used in the fourth step in parallel with a small depth of cut.
(3) A first step of covering the LED element on the substrate on which a large number of LED elements are mounted with a liquid translucent resin other than for printing mixed with a fluorescent agent, and the adjoining after the translucent resin is cured A second step of removing the translucent resin in the intermediate portion of the LED element, and a white pigment in a resin having a property similar to or the same as that of the translucent resin and the base material in the groove formed by the second step And filling the light-transmitting resin and the light-reflecting resin having the same thermal properties as the substrate, and after the light-reflecting resin is cured, the light-reflecting resin is added to the LED element. And a fourth step of separating the substrate into individual light emitting diodes so as to leave the surroundings, and obtaining a light emission color converted from the LED element by the fluorescent agent.
(4) In (3), the LED element is a blue LED, and the converted emission color is white.

本発明の発光ダイオードの構造は、次の特徴のいずれかを有する。
（５）長方形状に切断された基板上にＬＥＤ素子が１個、または所定の間隔に配列された複数のＬＥＤ素子が実装され、該ＬＥＤ素子は個別に印刷用以外の透光性樹脂によって周囲および上面を覆うように封止され、前記ＬＥＤ素子の上面を除く前記透光性樹脂の周囲外側が、該透光性樹脂と基材が近似の性質あるいは同質の樹脂に白色顔料を混入しかつ前記透光性樹脂および前記基板と熱的性質を揃えた光反射性の樹脂によって覆われており、該光反射性樹脂の外側底面の輪郭は前記基板の長方形をなす輪郭にほぼ一致していること。
（６）（５）において、前記透光性樹脂には蛍光剤が混入されており、該蛍光剤によって前記ＬＥＤ素子から変換された発光色を得ること。
（７）（６）において、前記ＬＥＤ素子は青色ＬＥＤであり、前記変換された発光色は白色であること。 The structure of the light emitting diode of the present invention has any of the following features.
(5) One LED element or a plurality of LED elements arranged at predetermined intervals are mounted on a substrate cut into a rectangular shape, and the LED elements are individually surrounded by a translucent resin other than for printing. And the outer periphery of the translucent resin excluding the upper surface of the LED element is mixed with a white pigment mixed in a resin having a property similar to or the same as that of the translucent resin and the base material. It is covered with the light-transmitting resin and a light-reflective resin having the same thermal properties as the substrate, and the outline of the outer bottom surface of the light-reflective resin substantially matches the outline forming the rectangle of the substrate. thing.
(6) In (5), a fluorescent agent is mixed in the translucent resin, and an emission color converted from the LED element by the fluorescent agent is obtained.
(7) In (6), the LED element is a blue LED, and the converted emission color is white.

（１）本発明の製造方法においては透光性樹脂と光反射性樹脂との熱的性質を合わせたため、加熱工程において発生するトラブルを避け、製造上の歩留りと製品の信頼性を向上させることができる。
（２）本発明の製造方法と構造においては光反射性樹脂の厚さをかなり薄くできるので、発光ダイオードの小型化を図ることができる。 (1) In the manufacturing method of the present invention, the thermal properties of the light-transmitting resin and the light-reflecting resin are combined, so that troubles occurring in the heating process are avoided, and the manufacturing yield and product reliability are improved. Can do.
(2) In the manufacturing method and structure of the present invention, the thickness of the light-reflective resin can be considerably reduced, so that the light-emitting diode can be reduced in size.

（３）本発明の製造方法と構造においては反射枠の接着工程がないので光反射性部材の位置ずれが起こらず、その公差に相当する発光ダイオードの小型化を可能とするし、接着剤のはみ出しによる不具合も解消される。
（４）本発明の製造方法においては光反射性部材の成形に必ずしも金型等の設備を必要としないので、殊に少量生産の場合に低コスト化を図ることができる。 (3) In the manufacturing method and structure of the present invention, there is no step of bonding the reflecting frame, so that the position of the light reflecting member does not shift, and it is possible to reduce the size of the light emitting diode corresponding to the tolerance. Problems caused by overhang are also eliminated.
(4) Since the manufacturing method of the present invention does not necessarily require equipment such as a mold for molding the light reflecting member, the cost can be reduced particularly in the case of small-scale production.

以下本発明を実施するための最良の形態例について述べる   The best mode for carrying out the present invention will be described below.

本発明の実施の形態の一例を、その製造工程の要所を示した図１ないし図４を用いて説明する。図１は発光ダイオードの分離工程を示す斜視図、図２は基板全面を透光性樹脂で被覆した状態を示す斜視図、図３は発光ダイオードの周囲に透光性樹脂を島状に形成する工程を示す斜視図、図４は島状の透光性樹脂の間隙に光反射性樹脂を充填した状態を示す斜視図である。各図は基板の全面でなく、角に近い一部を示している。また実際の工程は図２、図３、図４、図１の順に進行するので以下の説明はこの順番に行う。   An example of the embodiment of the present invention will be described with reference to FIGS. 1 to 4 showing the main points of the manufacturing process. FIG. 1 is a perspective view showing a separation process of light emitting diodes, FIG. 2 is a perspective view showing a state in which the entire surface of the substrate is covered with a light transmissive resin, and FIG. FIG. 4 is a perspective view showing a state in which a light-reflecting resin is filled in a gap between island-like light-transmitting resins. Each figure shows a part near the corner, not the entire surface of the substrate. Since the actual process proceeds in the order of FIGS. 2, 3, 4, and 1, the following description will be given in this order.

まず従来例と同様に多数のＬＥＤ素子２が所定位置に実装された基板１を用意し、その上面にＬＥＤ素子２を埋没させるに十分でかつ一様な厚さに液状の透光性樹脂４（普通、半導体の封止に適したエポキシ樹脂が選択される）を流した後硬化させ、ＬＥＤ素子を封止する（第１の工程とする）。硬化後の状態を図２に示す。なお透光性樹脂４は透明で内部が透視できるものとして、従来例（図６）と同様にこの部分を透視図で表した。これは他の図でも同様である。   First, as in the conventional example, a substrate 1 on which a large number of LED elements 2 are mounted at predetermined positions is prepared, and a liquid translucent resin 4 having a uniform thickness sufficient to bury the LED elements 2 on the upper surface thereof is prepared. (Usually, an epoxy resin suitable for semiconductor encapsulation is selected) is flowed and then cured to seal the LED element (first step). The state after curing is shown in FIG. The translucent resin 4 is transparent and the inside can be seen through, and this portion is shown in a perspective view as in the conventional example (FIG. 6). The same applies to other drawings.

図３に示す次の工程（第２の工程とする）においては、ＬＥＤ素子２の中間の透光性樹脂４の層をダイシング装置を用い、発光ダイオードを切断分離する際に用いるよりも幅の広い、厚いダイシングブレード６をカットライン８に沿って走らせる縦横方向のハーフダイシング（基板１を切断しない切削または研削加工）により除去し、透光性樹脂４を基板１の上面に島状に残し、各島状部の中間に縦横に交差した溝９を形成する。溝９の深さは基板１の上面に極めて近いかあるいは基板１に浅く切り込む程度がよい。   In the next step shown in FIG. 3 (referred to as the second step), a layer of translucent resin 4 in the middle of LED element 2 is used with a dicing device, which is wider than that used when cutting and separating the light emitting diode. The wide and thick dicing blade 6 is removed by vertical and horizontal half dicing (cutting or grinding without cutting the substrate 1) to run along the cut line 8, and the translucent resin 4 is left in an island shape on the upper surface of the substrate 1. Then, grooves 9 intersecting vertically and horizontally are formed in the middle of each island-shaped portion. The depth of the groove 9 is preferably close to the upper surface of the substrate 1 or cut shallowly into the substrate 1.

図４は次の工程（第３の工程とする）を行った結果を示す。本工程では溝９内に光反射性樹脂５を透光性樹脂４とほぼ同じ厚さになるよう充填し、かつ硬化させる。光反射性樹脂５は反射性を良くした材質が好ましく、例えば白色顔料を混入したエポキシ樹脂を使用する。充填作業では複雑な金型を必要としない。また光反射性樹脂５は透光性樹脂４とは樹脂の基材が同質（エポキシ系）であれば相互の接合も強く、また基板１の基材もエポキシ樹脂であればそれともよく接合する。また各部材の熱的性質（例えば熱膨張率）や場合によっては他の機械的な性質も揃えやすく、従来例で述べたような不具合が生じ難い。なお、溝に充填された光反射性樹脂５の存在部位を明瞭に示すため、図４においてのみはその表面に打点を行ってある。   FIG. 4 shows the result of performing the next step (the third step). In this step, the light reflecting resin 5 is filled in the groove 9 so as to have almost the same thickness as the light transmitting resin 4 and is cured. The light reflective resin 5 is preferably made of a material having improved reflectivity, and for example, an epoxy resin mixed with a white pigment is used. The filling operation does not require a complicated mold. The light-reflecting resin 5 and the light-transmitting resin 4 are strongly bonded to each other if the resin base material is the same (epoxy type), and if the base material of the substrate 1 is also an epoxy resin, the light-reflecting resin 5 is well bonded. In addition, the thermal properties (for example, thermal expansion coefficient) of each member and other mechanical properties are easily arranged depending on the case, so that the problems as described in the conventional example are not easily generated. In addition, in order to show clearly the presence site | part of the light-reflective resin 5 with which the groove | channel was filled, only in FIG. 4, the spot is performed on the surface.

図１は最終の工程（第４の工程とする）の途中の状態を模式的に示している。本工程においては、充填された光反射性樹脂５の幅の中央部を、下部の基板１と諸共に、薄い（通常の切断用の厚さの）ダイシングブレード６を用い、溝９（本図には図示せず）の中央を通るカッティッグライン８に沿って切断し、個々の発光ダイオードのランプに分離する。ダイシングブレード６の幅が溝幅よりも狭いため、分離された発光ダイオードの周囲には光反射性樹脂５の薄い層が残り、その内面が光反射面として作用する。この反射層は島状の透光性樹脂４の側面と強固に接合しているためかなり薄くて差し支えなく、分離された発光ダイオードのサイズの小型化に寄与する。この製造方法により、従来品と発光性能や機械的性質に差がなく、しかも品質、サイズ、コスト面での長所を有する発光ダイオード製品が量産的に得られる。   FIG. 1 schematically shows a state in the middle of the final step (referred to as the fourth step). In this step, the central portion of the width of the filled light-reflecting resin 5 is thin with a dicing blade 6 (with a thickness for normal cutting) together with the lower substrate 1 to form a groove 9 (this figure). Is cut along the cutting line 8 passing through the center of the light source and separated into individual light-emitting diode lamps. Since the width of the dicing blade 6 is narrower than the groove width, a thin layer of the light-reflecting resin 5 remains around the separated light-emitting diode, and its inner surface acts as a light reflecting surface. Since this reflective layer is firmly bonded to the side surface of the island-like translucent resin 4, it can be made quite thin and contributes to the reduction in the size of the separated light emitting diode. By this manufacturing method, there is no difference in light emitting performance and mechanical properties from conventional products, and light emitting diode products having advantages in quality, size, and cost can be mass-produced.

以上本発明の実施の形態の一例について説明したが、本発明の実施の形態はもとより本例に捕らわれるべきではない。以下にいくつかの変更例を示す。
（１）光反射性樹脂を充填する溝を形成するには必ずしも厚さの異なるブレードを必要としない。同じ幅のブレードで溝の形成と発光ダイオードの分離を切込み深さを変えて行うこともできる。溝の幅が必要な場合には薄いブレードを切込みを浅くして複数回平行に走らせればよい。
（２）光反射性樹脂を充填する空間形成のため、島状の透光性樹脂を切削でなく他の方法、例えば金型等を用いて形成してもよい。 Although an example of an embodiment of the present invention has been described above, the embodiment of the present invention should not be captured by this example. Some examples of changes are shown below.
(1) It is not always necessary to form blades having different thicknesses in order to form the groove filled with the light reflecting resin. It is also possible to form grooves and separate light emitting diodes with the same width blade by changing the cutting depth. When the width of the groove is required, a thin blade may be run in parallel several times with a shallow cut.
(2) In order to form a space filled with the light-reflective resin, the island-shaped light-transmitting resin may be formed by using another method, such as a mold, instead of cutting.

（３）透光性樹脂は着色されていてもよく、また光散乱性を与えられていてもよい。例えば青色ＬＥＤを用いたり、更に透光性樹脂に蛍光剤を混ぜ白色発光などの色変換をさせてもよい。
（４）ＬＥＤ素子やボンディングの型式は任意である。
（５）２個以上の個数のＬＥＤ素子を透光性樹脂で封止し、それらの周囲に光反射性樹脂を残すように切断分離してもよい。 (3) The translucent resin may be colored and may be given light scattering properties. For example, a blue LED may be used, or a fluorescent agent may be further mixed with a translucent resin to cause color conversion such as white light emission.
(4) The type of LED element or bonding is arbitrary.
(5) Two or more LED elements may be sealed with a translucent resin, and cut and separated so as to leave a light-reflective resin around them.

（６）複数のＬＥＤ素子の中間に光反射性樹脂を残したまま、それらをまとめて切断分離してもよい。なおこの場合には分離カットされない部分の光反射性樹脂が充填される溝の幅をカッティングブレードの幅およびその公差分だけ狭くしＬＥＤ素子同志を近接させワンパッケージされた発光ダイオードを小型化ことができる。
なお、基板や透光性樹脂や光反射性樹脂の材質の選択も、本発明の製造方法が適用できる限り任意である。また説明したのは工程の主要部のみであり、その中間に必然的に挿入される補足的なあるいは常識的な工程については説明を省略した。 (6) While leaving the light-reflective resin in the middle of the plurality of LED elements, they may be collectively cut and separated. In this case, the width of the groove filled with the light-reflective resin in the part that is not separated and cut is narrowed by the width of the cutting blade and its tolerance, so that the LED elements can be brought close together to reduce the size of the one-package light emitting diode. it can.
In addition, selection of the material of a board | substrate, translucent resin, and light-reflective resin is arbitrary as long as the manufacturing method of this invention is applicable. Further, only the main part of the process has been described, and a description of a supplementary or common-sense process that is necessarily inserted in the middle thereof is omitted.

本発明の実施の形態の一例における発光ダイオードの分離工程を示す斜視図である。It is a perspective view which shows the isolation | separation process of the light emitting diode in an example of embodiment of this invention. 本発明の実施の形態の一例において基板全面を透光性樹脂で被覆した状態を示す斜視図である。It is a perspective view which shows the state which coat | covered the whole board | substrate with translucent resin in an example of embodiment of this invention. 本発明の実施の形態の一例において発光ダイオードの周囲に透光性樹脂を島状に形成する工程を示す斜視図である。It is a perspective view which shows the process of forming translucent resin in an island shape around a light emitting diode in an example of embodiment of this invention. 本発明の実施の形態の一例において島状の透光性樹脂の間隙に光反射性樹脂を充填した状態を示す斜視図である。It is a perspective view which shows the state which filled the light-reflective resin in the gap | interval of island-like translucent resin in an example of embodiment of this invention. 従来例における基板と反射枠との関係を示す斜視図である。It is a perspective view which shows the relationship between the board | substrate and reflective frame in a prior art example. 従来例における発光ダイオードの分離工程を示す斜視図である。It is a perspective view which shows the isolation | separation process of the light emitting diode in a prior art example.

符号の説明Explanation of symbols

１ 基板
２ ＬＥＤ素子
３ ボンディングワイヤ
４ 透光性樹脂
５ 光反射性樹脂
６ ダイシングブレード
７ 厚いダイシングブレード
８ カッティングライン
９ 溝
１０ 反射枠
１０ａ 穴
DESCRIPTION OF SYMBOLS 1 Board | substrate 2 LED element 3 Bonding wire 4 Translucent resin 5 Light reflective resin 6 Dicing blade 7 Thick dicing blade 8 Cutting line 9 Groove 10 Reflective frame 10a Hole

Claims (7)

ＬＥＤ素子を多数実装した基板の前記個々のＬＥＤ素子を埋没させるように印刷用以外の液状の透光性樹脂を前記基板上に流すことによって覆う第１の工程と、前記透光性樹脂の硬化後に隣接する前記ＬＥＤ素子の中間部の前記透光性樹脂を除去する第２の工程と、該第２の工程によって形成された溝部に、前記透光性樹脂と基材が近似の性質あるいは同質の樹脂に白色顔料を混入しかつ前記透光性樹脂および前記基板と熱的性質を揃えた光反射性樹脂を充填する第３の工程と、前記光反射性樹脂の硬化後に該光反射性樹脂を前記ＬＥＤ素子の周囲に残すように前記基板を切断して個々の発光ダイオードに分離する第４の工程とを含むことを特徴とする発光ダイオードの製造方法。   A first step of covering the substrate on which a large number of LED elements are mounted by flowing a liquid translucent resin other than for printing on the substrate so as to bury the individual LED elements; and curing the translucent resin A second step of removing the translucent resin in the intermediate portion of the LED element that is adjacent thereto, and the translucent resin and the base material have similar properties or the same quality in the groove formed by the second step. A third step of mixing a white pigment in the resin and filling the light-reflecting resin and the light-reflecting resin having the same thermal properties as the substrate; and after curing the light-reflecting resin, the light-reflecting resin And a fourth step of cutting the substrate so as to leave it around the LED element and separating it into individual light emitting diodes. 前記基板を切断して個々の発光ダイオードに分離する第４の工程にはダイシング装置に取り付けたダイシングブレードを用い、また前記ＬＥＤ素子の中間部の前記透光性樹脂を除去する第２の工程には前記第４の工程で用いたのと同じ幅のダイシングブレードを切込みを浅くして複数回平行に走らせることによって必要な溝幅を形成することを特徴とする請求項１記載の発光ダイオードの製造方法。   In the fourth step of cutting the substrate and separating it into individual light emitting diodes, a dicing blade attached to a dicing device is used, and in the second step of removing the translucent resin in the intermediate portion of the LED element. 2. The light emitting diode according to claim 1, wherein a necessary groove width is formed by running a dicing blade having the same width as that used in the fourth step in parallel with a notch being shallowed a plurality of times. Production method. ＬＥＤ素子を多数実装した基板上の前記ＬＥＤ素子を蛍光剤を混ぜた印刷用以外の液状の透光性樹脂で覆う第１の工程と、前記透光性樹脂の硬化後に隣接する前記ＬＥＤ素子の中間部の前記透光性樹脂を除去する第２の工程と、該第２の工程によって形成された溝部に前記透光性樹脂と基材が近似の性質あるいは同質の樹脂に白色顔料を混入しかつ前記透光性樹脂および前記基板と熱的性質を揃えた光反射性樹脂を充填する第３の工程と、前記光反射性樹脂の硬化後に該光反射性樹脂を前記ＬＥＤ素子の周囲に残すように前記基板を切断して個々の発光ダイオードに分離する第４の工程とを含むことを特徴とし、前記蛍光剤によって前記ＬＥＤ素子から変換された発光色を得るようにした発光ダイオードの製造方法。   A first step of covering the LED elements on the substrate on which a large number of LED elements are mounted with a liquid translucent resin other than for printing mixed with a fluorescent agent; and the adjacent LED elements after the translucent resin is cured. A second step of removing the translucent resin in the intermediate portion, and a white pigment mixed in a resin having a property similar to or the same as that of the translucent resin and the base material in the groove formed by the second step. And a third step of filling the light-reflecting resin and a light-reflecting resin having the same thermal properties as the substrate, and leaving the light-reflecting resin around the LED element after the light-reflecting resin is cured. And a fourth step of separating the light-emitting diodes into individual light-emitting diodes, and a method for manufacturing a light-emitting diode that obtains a light-emission color converted from the LED element by the fluorescent agent . 前記ＬＥＤ素子は青色ＬＥＤであり、前記変換された発光色は白色であることを特徴とする請求項３記載の発光ダイオードの製造方法。   4. The method of manufacturing a light emitting diode according to claim 3, wherein the LED element is a blue LED, and the converted emission color is white. 長方形状に切断された基板上にＬＥＤ素子が１個、または所定の間隔に配列された複数のＬＥＤ素子が実装され、該ＬＥＤ素子は個別に印刷用以外の透光性樹脂によって周囲および上面を覆うように封止され、前記ＬＥＤ素子の上面を除く前記透光性樹脂の周囲外側が、該透光性樹脂と基材が近似の性質あるいは同質の樹脂に白色顔料を混入しかつ前記透光性樹脂および前記基板と熱的性質を揃えた光反射性の樹脂によって覆われており、該光反射性樹脂の外側底面の輪郭は前記基板の長方形をなす輪郭にほぼ一致していることを特徴とする発光ダイオードの構造。 One LED element or a plurality of LED elements arranged at a predetermined interval are mounted on a substrate cut into a rectangular shape, and the LED elements are individually surrounded by a translucent resin other than for printing. The outer periphery of the translucent resin excluding the upper surface of the LED element is sealed so as to cover the translucent resin and the base material with similar properties or the same type of resin, and a white pigment is mixed in the translucent resin. It is covered by the light reflective resin having uniform the substrate and the thermal properties and Contact rESIN, the contour of the outer bottom surface of the light reflective resin which substantially matches the contour of a rectangular shape of the substrate Characteristic light emitting diode structure. 前記透光性樹脂には蛍光剤が混入されており、該蛍光剤によって前記ＬＥＤ素子から変換された発光色を得ることを特徴とする請求項５の発光ダイオードの構造。   6. The light-emitting diode structure according to claim 5, wherein a fluorescent agent is mixed in the translucent resin, and a light emission color converted from the LED element by the fluorescent agent is obtained. 前記ＬＥＤ素子は青色ＬＥＤであり、前記変換された発光色は白色であることを特徴とする請求項６記載の発光ダイオードの構造。

7. The light emitting diode structure according to claim 6, wherein the LED element is a blue LED, and the converted emission color is white.

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