TWI599744B - Light guide structure and backlight module - Google Patents

Description

Light guiding structure and backlight module thereof

The invention relates to the field of light guiding, in particular to a light guiding structure and a backlight module which are directly combined with a light source.

In the field of display devices today, the light guide plate is one of the important components for adjusting the light-emitting effect. The principle is to guide the light to the distal end of the light guide plate through the total reflection optical property, and the vertical light can be adjusted by using the microstructure disposed thereon. Uniformity and brightness, etc.

The light guide plate can be further applied to the backlight module. At present, the light source used in the backlight module is mainly a light-emitting diode (LED), and the light source can be located at the bottom or side of the light guide plate, thereby forming a direct type with respect to the light guide plate. Light source or side-entry light source. However, in order to respond to the trend of thinner and lighter display devices, how to effectively reduce the overall size of the backlight module and improve the light use efficiency is an important issue. In a conventional backlight module, an LED is disposed on a circuit board and electrically connected to other control devices or power sources by wires to control the illumination state of the light source. Then, the circuit board and the light source and the light guide plate are connected to each other, and the light emitted by the light source is processed by the light guide plate to obtain a uniform surface light source. However, due to the existence of the circuit board, the overall thickness of the backlight module cannot be smoothly reduced, and the processes of wiring and electrical connection of the circuit board and the light source are also complicated, thereby increasing the processing time and material cost of the backlight module.

Therefore, the inventor conceived a light guiding structure and a backlight module thereof, which can be solved by hope. The lack of conventional knowledge, in addition to reducing the complexity of the assembly process and material costs, can also be more in line with the current market expectations for thinner and lighter backlight modules.

An object of the present invention is to provide a light guiding structure and a backlight module thereof, which can effectively simplify the complexity of the overall process, thereby reducing manufacturing cost and time cost.

In order to achieve the above object, the present invention discloses a light guiding structure for connecting to a light source module, wherein the light source module includes a substrate and at least one light source disposed on the substrate, and the method includes: a light guide plate having a joint surface and at least one recess for attaching to the light source module, the recess being located at the joint surface for receiving the light source, and the substrate and the light guide plate The same material is used; and a circuit layer is disposed on the joint surface to be electrically connected to the light source. By making the light guide plate and the substrate made of the same material, the consistency of the material between the light guiding structure and the light source module can be improved, thereby avoiding the influence of the different material characteristics on the light guiding performance and the light source. The module and the light guiding structure are connected into an integrated light guiding structure, which simplifies the process and reduces the time consuming, and has better convenience in application. Based on this embodiment, the remaining technical features of the present invention are further disclosed in the following embodiments.

In another embodiment, the illuminating source is a flip chip packaged LED to meet the advantages of high illuminating efficiency and low material cost; in order to further meet the requirements of thinning, the illuminating source may be a wafer-level package flip chip LED. In order to reduce the thickness of the light guide plate by reducing the size of the light source.

In another embodiment, the material of the light guide plate and the substrate may be transparent plastic, and according to different requirements, for example, polycarbonate or polyethylene terephthalate may be selected. A material such as an ester or a polyimide is used to form a light guide plate and a substrate.

In addition, in an embodiment, an optically transparent adhesive is further disposed between the light guide plate and the substrate for bonding the light guiding structure and the light source mode, in order to improve the bonding strength between the light guiding structure and the light source module. group.

In one embodiment, a backlight module includes: a light source module, comprising: a substrate having a bearing surface; at least one light source fixed to the bearing surface; and a first circuit The layer is disposed on the bearing surface and electrically connected to the light source; and a light guiding structure includes: a light guide plate having a joint surface and at least one recess, the joint surface being attached to the light source module, The recess is located on the joint surface and is configured to receive the light source, and the substrate and the light guide plate are made of the same material; and a second circuit layer is disposed on the joint surface and electrically connected to the first circuit layer Sexual connection. With the above structural design, the backlight module effectively simplifies the overall process, thereby reducing time cost and material cost, and improving the flexibility of circuit layout in the backlight module. Based on this embodiment, the remaining technical features of the present invention are further disclosed in the following embodiments.

As described above, in another embodiment, the light source is a flip chip packaged LED to meet the advantages of high luminous efficiency and low material cost.

In another embodiment, the material of the light guide plate and the substrate may be transparent plastic, and according to different requirements, for example, polycarbonate or polyethylene terephthalate may be selected. A material such as an ester or a polyimide is used to form a light guide plate and a substrate.

In addition, in an embodiment, an optically transparent adhesive is further disposed between the light guide plate and the substrate for bonding the light guiding structure and the light source mode, in order to improve the bonding strength between the light guiding structure and the light source module. group.

In addition, in an embodiment, a reflective solder resist layer is further included, which is coated on The bearing surface is to achieve protection for the first circuit layer.

And, in an embodiment, a reflector is disposed on a bottom surface of the substrate opposite to the bearing surface to effectively improve overall light usage.

In summary, the light guiding structure and the backlight module disclosed in the present invention integrate the light guiding structure and the light source module, thereby effectively simplifying the manufacturing process of the backlight module and reducing the process of the backlight module. The cost and the flexibility of the backlight module in the circuit layout are improved, thereby making the actuation control of the illumination source more convenient. In addition, the substrate and the light guide plate are made of the same material, so that the substrate and the light guide plate have the same amount of thermal expansion or contraction, thereby avoiding the influence of the different material properties on the light guiding performance in practical use.

[First Embodiment]

1‧‧‧Light guiding structure

10‧‧‧Light guide plate

101‧‧‧ joint surface

102‧‧‧ recess

11‧‧‧ circuit layer

111‧‧‧thin sheet

112‧‧‧ wiring

12‧‧‧Optical transparent adhesive

2‧‧‧Light source module

20‧‧‧Substrate

21‧‧‧Light source

[Second and Third Embodiments]

3‧‧‧Backlight module

30‧‧‧Light source module

301‧‧‧Substrate

3011‧‧‧ bearing surface

302‧‧‧Light source

303‧‧‧First circuit layer

3031‧‧‧First thin sheet

3032‧‧‧First electrical contact

31‧‧‧Light guiding structure

311‧‧‧Light guide plate

3111‧‧‧ joint surface

3112‧‧‧ recess

312‧‧‧Second circuit layer

3121‧‧‧Second thin sheet

3122‧‧‧Second electrical contact

32‧‧‧Reflective solder mask

33‧‧‧reflector

34‧‧‧Optical transparent adhesive

Fig. 1 is an exploded perspective view showing a first embodiment of the present invention.

Fig. 2 is a schematic view showing the assembly of the first embodiment of the present invention.

Fig. 3 is an exploded perspective view showing a second embodiment of the present invention.

Fig. 4 is a schematic view showing the assembly of the second embodiment of the present invention.

Fig. 5 is a schematic view showing the assembly of the third embodiment of the present invention.

In order to make your members understand the contents of the present invention clearly, please use the following text to explain in detail, please consider.

Please refer to FIGS. 1 and 2, which are schematic exploded views and assembled views of the first embodiment of the present invention. The light guide structure 1 of the present embodiment is connected to a light source module 2, wherein the light source module 2 includes a substrate 20 and at least one light source 21 disposed on the substrate. The light structure 1 includes a light guide plate 10 and a circuit layer 11.

The light guide plate 10 has a joint surface 101 and at least one concave portion 102. The joint surface 101 is disposed to be in contact with the light source module 2, and the concave portion 102 is disposed on the joint surface 101 for receiving the light source 21, and the substrate 20 is The light guide plate 10 is made of the same material; the circuit layer 11 is disposed on the joint surface 101 to be electrically connected to the light source 21 . The light guide plate 10 is disposed in the recessed portion 102 to receive the light source 21 and electrically connected to the circuit layer 11 to adjust the operating state of the light source 21 through the control device or the power source. By integrally connecting the light guiding structure 1 and the light source module 2 to form an integrated light-emitting light guiding structure, the time required for the process can be reduced, and the complexity of the process can be effectively simplified. The light guide plate 10 and the substrate 20 are made of the same material, so that they have the same physical properties and chemical properties, so that the guiding light is more uniform. For example, the substrate 20 and the light guide plate 10 can be prevented from being different due to different materials. The occurrence of different thermal expansion amounts after heating, which affects the light guiding effect. For better light guiding effect, the light guide plate 10 and the substrate 20 can be made of transparent glass to achieve the desired optical requirements by virtue of its characteristics. Moreover, the flexibility of the light guide plate 10 and the substrate 20 after bonding is considered. Preferably, the material of the light guide plate 10 and the substrate 20 may be transparent plastic. If the overall light transmittance is further considered, the light guide plate 10 and the substrate 20 may be made of polycarbonate (Polycarbonate, PC) or polyethylene terephthalate (PET); or further, the circuit layer may be laid. For the stability, the light guide plate 10 and the substrate 20 can be made of Polyimide (PI).

When the light guiding structure 1 is applied to a general backlight module, and the effects of transparency and double-sided illumination are not required, the circuit layer 11 can be made of any electrically conductive material. However, if it is applied in the field of a double-sided light-emitting display or a transparent display, and the light-guiding structure 1 and the light source module 2 are connected to have a certain transparency, the material of the circuit layer 11 may be selected from indium tin oxide or silver. Metal such as plasma circuit, or pre-stretched carbon nanotubes. In addition, the circuit layer 11 can be directly printed on the light guide plate 10, or the circuit layer 11 includes a thin plate 111 and a plurality of wires 112 printed on the thin plate 111, and then the circuit layer 11 is permeable to the in-mold decoration. In-Mold Decoration (IMD), such as an IMR (In-Mold Roller) or IMF (In-Mold Forming) process, is disposed on the bonding surface 101 of the light guide plate 10, but the circuit layer 11 is not disposed in a manner This is limited.

Due to the maturity of LED packaging technology, LEDs with high luminous efficiency and low material cost have been the main considerations in the current market. For example, flip-chip LEDs have this characteristic. Therefore, the light source 21 preferably uses a flip chip package LED and is disposed on the substrate 20 in plural. In order to meet the requirements of thinning and thinning, in addition to the foregoing considerations, the illumination source 21 can further be used as a wafer-level packaged flip-chip LED to reduce the volume of the illumination source 21 and to guide the corresponding illumination source 21 The thickness of the light panel 10 is lowered.

In addition, in order to improve the bonding strength between the light guiding structure 1 and the light source module 2, the present invention further includes an optical transparent adhesive 12 coated on the light guide plate 10 and the substrate 20 in another embodiment. For the purpose of bonding the light guiding structure 1 and the light source module 2, the bonding between the light guiding structure 1 and the light source module 2 is not limited to the use of the optical transparent adhesive 12 described above.

Please refer to FIGS. 3 and 4 , which are schematic exploded view and assembly diagram of the second embodiment of the present invention. In this embodiment, a backlight module 3 is disclosed. The backlight module 3 includes a light source module 30 and a light guiding structure 31. The light source module 30 includes a substrate 301, at least one light source 302, and a first circuit layer 303. The light guide structure 31 includes a light guide plate 311 and a second circuit layer 312.

The substrate 301 of the light source module 30 has a bearing surface 3011 for carrying the light source 302 and the first circuit layer 303. The light source 302 is fixed on the bearing surface 3011, and the first circuit layer 303 is disposed on the bearing surface 3011 and electrically connected to the light source 302. The light guide plate 311 has a joint surface 3111 and at least one recess 3112. The joint surface 3111 is configured to fit the light guide structure 31 to the light source module 30. The recess 3112 is located at the joint surface 3111 and is configured to receive the light source 302. The number of 3112 is set corresponding to the number of illumination sources 302. The substrate 301 and the light guide plate 311 are made of the same material, and the second circuit layer 312 is disposed on the joint surface 3111 and electrically connected to the first circuit layer 312. After the light source module 30 is attached to the light guiding structure 31, the light source 302 is correspondingly located in the recess 3112, and the first circuit layer 303 and the second circuit layer 312 are electrically connected to each other to form an integrated structure. . Therefore, the backlight module 3 of the present embodiment can effectively reduce the overall process time and material cost compared to the conventional backlight module.

In addition, as described in the first embodiment, the first circuit layer 303 and the second circuit layer 312 may be formed on the bearing surface 3011 and the bonding surface 3111, respectively, or as shown in this embodiment. The first circuit layer 303 and the second circuit layer 312 respectively include a first thin plate 3031 and a second thin plate 3121, and a plurality of first electrical contacts 3032 are formed on the first thin plate 3031, and the second thin plate is formed. A plurality of second electrical contacts 3122 are formed on the third electrode to electrically connect the first circuit layer 303 and the second circuit layer 312 by the first electrical contact 3032 and the second electrical contact 3122. The material of the first circuit layer 303 and the second circuit layer 312 are selected, as described in the first embodiment, and may be any conductive material, or an indium tin oxide or silver paste circuit, according to the overall setting of the backlight module 3. Metal, as well as pre-stretched carbon nanotubes.

In order to further prevent the first circuit layer 303 from being short-circuited or broken due to scratches, the conduction performance is affected. In another embodiment, a reflective solder resist layer 32 is further disposed on the bearing surface 3011. Preferably, the reflective solder resist layer 32 is disposed on a region of the bearing surface 3011 that does not correspond to the second electrical contact 3122, and even if the first circuit layer 303 corresponds to the second electrical contact 3122. The region is not covered by the reflective solder resist layer 32 to form a plurality of first electrical contacts 3032 to be electrically connected to the second electrical contacts 3122, and the remaining portions are reflected by the solder resist layer 32 to achieve the aforementioned protective effect.

In addition, the backlight module 3 further includes a reflector 33 disposed on the bottom surface 3012 of the substrate 301 opposite to the bearing surface 3011 to effectively reflect the light of the light source 302 into the light guide plate 311 or leak the light from the light guide plate 311. The light is reflected back to the light guide plate 311, thereby improving the utilization of light.

In addition, according to the first embodiment, the illumination source 302 can be a flip chip package LED, and further can be a wafer level flip chip package LED to meet the current thinning requirements of the backlight module 3. In addition, the substrate 301 and the light guide plate 311 are optionally made of a material having high light transmittance, such as glass or the like. If further consideration is given to the flexibility requirements, it can be made of a transparent plastic material, such as polycarbonate (Polycarbonate, PC) or polyethylene terephthalate (PET); if considering the stability of the circuit layer layout , can be made of Polyimide (PI). In another embodiment, in order to improve the bonding strength between the light source module 30 and the light guiding structure 31, the present invention further includes an optical transparent adhesive 34 coated on the light guiding plate 311 and the substrate 301. In between, the light guiding structure 31 and the light source module 30 are bonded.

Please refer to FIG. 5, which is a schematic view of the assembly of the third embodiment of the present invention. The first and second embodiments are the same, and the same portions will not be described again. The difference between the first and second embodiments is that the first electrical contacts 3032 are disposed on opposite sides of the light source 302, and the second electrical contacts 3122 are located on the second circuit layer 312. After being electrically connected to the corresponding first electrical contact 3032, the electrical source 302 can be electrically connected to another adjacent light source 302, thereby electrically connecting any two adjacent light sources. 302. However, the electrical connection manner disclosed in the second embodiment or the present embodiment can be adjusted according to actual application requirements. Yes, The backlight module 3 provided with the first circuit layer 303 and the second circuit layer 312 can have certain flexibility in circuit layout.

In summary, the light guiding structure and the backlight module disclosed in the present invention integrate the light guiding structure and the light source module, and the light source is corresponding to the concave structure of the light guiding plate and the circuit on the light guiding plate. The layers are electrically connected to each other to facilitate control. Thereby, the process steps of the backlight module can be effectively simplified, and the process cost of the backlight module can be reduced. According to the second and third embodiments, the first circuit layer and the second circuit layer are respectively disposed in the light source module and the light guiding structure, thereby improving the flexibility of the backlight module in the circuit layout, and further It makes the operation control of the light source more convenient. In addition, the substrate and the light guide plate of the present invention are made of the same material, so that the substrate and the light guide plate have the same amount of thermal expansion or contraction, thereby avoiding the influence of the different material properties on the light guiding performance in practical use. In addition, the invention also effectively improves the circuit layout flexibility and overall robustness of the backlight module.

The above are only the preferred embodiments of the present invention, and are not intended to limit the scope of the present invention; therefore, equivalent changes and modifications may be made without departing from the spirit and scope of the invention. Within the scope of the patent.

1‧‧‧Light guiding structure

10‧‧‧Light guide plate

101‧‧‧ joint surface

102‧‧‧ recess

11‧‧‧ circuit layer

111‧‧‧thin sheet

112‧‧‧ wiring

12‧‧‧Optical transparent adhesive

2‧‧‧Light source module

20‧‧‧Substrate

21‧‧‧Light source

Claims (8)

A light guiding structure is connected to a light source module, wherein the light source module comprises a substrate and at least one light source disposed on the substrate, comprising: a light guide plate having a joint surface and at least one concave portion, The bonding surface is disposed to be in contact with the light source module, the concave portion is located on the bonding surface and is configured to receive the light source, and the substrate and the light guide plate are made of the same material, wherein the light guide plate and the substrate are The material is transparent plastic; and a circuit layer is disposed on the bonding surface to be electrically connected to the light source. The light guiding structure of claim 1, wherein the light source is a flip chip LED. The light guiding structure of claim 1, further comprising an optically transparent adhesive coated between the light guide plate and the substrate for bonding the light guiding structure and the light source module. A backlight module includes: a light source module, comprising: a substrate having a bearing surface; at least one light source fixed to the bearing surface; and a first circuit layer disposed on the bearing surface and The light source is electrically connected; and a light guiding structure comprises: a light guiding plate having a joint surface and at least one concave portion, the joint surface is for fitting with the light source module, the concave portion is located at the joint surface and is provided The light source is disposed, and the substrate and the light guide plate are made of the same material, wherein the light guide plate and the substrate are made of transparent plastic; and a second circuit layer is disposed on the joint surface and the first The circuit layer is electrically connected. The backlight module of claim 4, wherein the light source is a flip chip LED. The backlight module of claim 4, further comprising an optically transparent adhesive coated between the light guide plate and the substrate for bonding the light guiding structure and the light source module. The backlight module of claim 4, further comprising a reflective solder mask layer disposed on the bearing surface. The backlight module of claim 4, further comprising a reflector disposed on a bottom surface of the substrate opposite to the bearing surface.