CN204153494U - Optoelectronic integration module - Google Patents
Optoelectronic integration module Download PDFInfo
- Publication number
- CN204153494U CN204153494U CN201420459364.1U CN201420459364U CN204153494U CN 204153494 U CN204153494 U CN 204153494U CN 201420459364 U CN201420459364 U CN 201420459364U CN 204153494 U CN204153494 U CN 204153494U
- Authority
- CN
- China
- Prior art keywords
- substrate
- led
- mounting groove
- circular substrate
- installation structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000005693 optoelectronics Effects 0.000 title claims abstract description 11
- 239000000758 substrate Substances 0.000 claims abstract description 44
- 238000009434 installation Methods 0.000 claims abstract description 12
- 239000003990 capacitor Substances 0.000 claims abstract description 4
- 238000005070 sampling Methods 0.000 claims abstract description 4
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 6
- 230000005496 eutectics Effects 0.000 claims description 5
- 238000005476 soldering Methods 0.000 claims description 5
- -1 aluminium silicon Chemical compound 0.000 claims description 4
- HBMJWWWQQXIZIP-UHFFFAOYSA-N Silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 230000005619 thermoelectricity Effects 0.000 description 2
- 206010037660 Pyrexia Diseases 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminum Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006011 modification reaction Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
Abstract
The utility model discloses optoelectronic integration module, comprise: the circular substrate mounting groove that be arranged at circular substrate in nested with, described mounting groove height is lower than circular substrate, one LED being evenly arranged at circular substrate surrounding, and one is uniformly distributed in substrate orientation hole in mounting groove, whole module is installed on fixture by described substrate orientation hole, also comprises the electric supply installation structure that is positioned at mounting groove, and described electric supply installation structure provides electric energy for LED.Described electric supply installation structure comprises LED driver, chip inductor, filter capacitor and the sampling resistor being positioned at LED driver side.LED driver, LED and substrate junction are integrated, replacing accessory can be carried out fast, and owing to being directly connected with substrate, improve the thermal diffusivity of whole device.
Description
Technical field
The utility model relates to photoelectric field, is specifically related to optoelectronic integration module.
Background technology
The features such as LED has energy-saving and environmental protection, the life-span is long, volume is little, fast response time, have been applied to lighting field more and more widely, have been considered to the forth generation light source after incandescent lamp, fluorescent lamp, high-intensity gas discharge lamp.But the thing followed, the fever phenomenon that LED light source is produced at work, especially for high-power LED light source, its heating problem is especially outstanding, and long-time use can affect luminous efficiency and service life greatly, constrains the application of high-power LED light source.
Therefore, provide the LED chip encapsulating structure with excellent heat dispersion performance to become and be the trend that following LED heat radiation substrate develops, be also the key subject of current LED light source technology penetration and promotion.
Utility model content
The technical problems to be solved in the utility model is to provide optoelectronic integration module, LED driver, LED and substrate junction is integrated, and can carry out replacing accessory fast, and owing to being directly connected with substrate, improves the thermal diffusivity of whole device.
For achieving the above object, the technical solution of the utility model is as follows:
Optoelectronic integration module, comprising:
The one circular substrate mounting groove that be arranged at circular substrate in nested with, described mounting groove height lower than circular substrate,
One LED being evenly arranged at circular substrate surrounding,
And one is uniformly distributed in substrate orientation hole in mounting groove, whole module is installed on fixture by described substrate orientation hole,
Also comprise the electric supply installation structure that is positioned at mounting groove, described electric supply installation structure provides electric energy for LED.
In a preferred embodiment of the present utility model, described electric supply installation structure comprises LED driver, chip inductor, filter capacitor and the sampling resistor being positioned at LED driver side.
In a preferred embodiment of the present utility model, described circular substrate adopts aluminium silicon carbide substrate.
In a preferred embodiment of the present utility model, between described LED and substrate, smear eutectic soldering paste.
By technique scheme, the beneficial effects of the utility model are:
LED driver, LED and substrate junction are integrated by the utility model, are convenient to change after breaking down; Eutectic soldering paste will be smeared between LED and substrate, directly LED and substrate can be combined, reduce heat dissipation channel thermal resistance, reach the effect that thermoelectricity is separated.
Accompanying drawing explanation
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only embodiments more of the present utility model, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is structural representation of the present utility model.
Detailed description of the invention
The technological means realized to make the utility model, creation characteristic, reaching object and effect is easy to understand, below in conjunction with concrete diagram, setting forth the utility model further.
Optoelectronic integration module, comprising: a circular substrate 100 mounting groove 200 that be arranged at circular substrate in nested with, this mounting groove 200 height lower than circular substrate 100,
One LED 110 being evenly arranged at circular substrate 100 surrounding, smears eutectic soldering paste between LED 110 and substrate 100,
And one is uniformly distributed in substrate orientation hole 210 in mounting groove 200, whole module is installed on fixture by described substrate orientation hole 210,
Also comprise the electric supply installation structure 300 that is positioned at mounting groove, described electric supply installation structure 300 provides electric energy for LED; Further, electric supply installation structure 300 comprises LED driver 310, chip inductor 320, filter capacitor 330 and the sampling resistor 340 being positioned at LED driver 310 side.
Above-mentioned circular substrate adopts aluminium silicon carbide substrate; Aluminium silicon carbide (AlSiC) is the abbreviation of aluminum-base silicon carbide particulate reinforced composite, it fully combines the different advantages of silicon carbide ceramics and metallic aluminium, the thermal coefficient of expansion have high-termal conductivity, matching with chip, density are little, lightweight, and high rigidity and high-flexural strength
LED driver, LED and substrate junction are integrated by the utility model, are convenient to change after breaking down; Eutectic soldering paste will be smeared between LED and substrate, directly LED and substrate can be combined, reduce heat dissipation channel thermal resistance, reach the effect that thermoelectricity is separated.
More than show and describe general principle of the present utility model and principal character and advantage of the present utility model.The technical staff of the industry should understand; the utility model is not restricted to the described embodiments; what describe in above-described embodiment and description just illustrates principle of the present utility model; under the prerequisite not departing from the utility model spirit and scope; the utility model also has various changes and modifications, and these changes and improvements all fall within the scope of claimed the utility model.The claimed scope of the utility model is defined by appending claims and equivalent thereof.
Claims (4)
1. optoelectronic integration module, is characterized in that, comprising:
The one circular substrate mounting groove that be arranged at circular substrate in nested with, described mounting groove height lower than circular substrate,
One LED being evenly arranged at circular substrate surrounding,
And one is uniformly distributed in substrate orientation hole in mounting groove, whole module is installed on fixture by described substrate orientation hole,
Also comprise the electric supply installation structure that is positioned at mounting groove, described electric supply installation structure provides electric energy for LED.
2. optoelectronic integration module according to claim 1, is characterized in that, described electric supply installation structure comprises LED driver, chip inductor, filter capacitor and the sampling resistor being positioned at LED driver side.
3. optoelectronic integration module according to claim 1, is characterized in that, described circular substrate adopts aluminium silicon carbide substrate.
4. optoelectronic integration module according to claim 1, is characterized in that, smears eutectic soldering paste between described LED and substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420459364.1U CN204153494U (en) | 2014-08-14 | 2014-08-14 | Optoelectronic integration module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420459364.1U CN204153494U (en) | 2014-08-14 | 2014-08-14 | Optoelectronic integration module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204153494U true CN204153494U (en) | 2015-02-11 |
Family
ID=52511608
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420459364.1U Expired - Fee Related CN204153494U (en) | 2014-08-14 | 2014-08-14 | Optoelectronic integration module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204153494U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105570848A (en) * | 2015-12-02 | 2016-05-11 | 宁波凯耀电器制造有限公司 | Compound type LED circuit board and manufacturing method |
| US10935197B2 (en) | 2019-04-04 | 2021-03-02 | Delta Electronics (Shanghai) Co., Ltd. | Light module and method of manufacturing the same |
-
2014
- 2014-08-14 CN CN201420459364.1U patent/CN204153494U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105570848A (en) * | 2015-12-02 | 2016-05-11 | 宁波凯耀电器制造有限公司 | Compound type LED circuit board and manufacturing method |
| GB2545285A (en) * | 2015-12-02 | 2017-06-14 | Ningbo Klite Electric Mft Co Ltd | Composite LED circuit board and manufacturing method |
| GB2545285B (en) * | 2015-12-02 | 2020-11-11 | Ningbo Klite Electric Mft Co Ltd | Composite LED Circuit Board and Manufacturing Method |
| US10935197B2 (en) | 2019-04-04 | 2021-03-02 | Delta Electronics (Shanghai) Co., Ltd. | Light module and method of manufacturing the same |
| US11193639B2 (en) | 2019-04-04 | 2021-12-07 | Delta Electronics (Shanghai) Co., Ltd. | Light module and method of manufacturing the same |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN204153494U (en) | Optoelectronic integration module | |
| CN201983059U (en) | Light-emitting diode (LED) ceramic lamp cup | |
| CN202719394U (en) | Ceramic seat light-emitting diode (LED) illuminating lamp | |
| CN204062595U (en) | A kind of LED lamp | |
| CN2856708Y (en) | Semiconductor luminous bulbs | |
| CN204062597U (en) | The luminous radiator structure of a kind of LED light source | |
| CN104501013A (en) | Led lamp | |
| CN205137127U (en) | Heat dissipation lamp stand of LED shot -light | |
| CN201724015U (en) | Solid lighting LED light source module convenient in maintenance | |
| CN203950803U (en) | Luminescent device | |
| CN203523078U (en) | LED constant-current drive circuit, lighting device provided therewith, and lamp holder | |
| CN203150615U (en) | High-efficiency heat-dissipation LED light source module | |
| CN102339943A (en) | Heat-radiating structure for polycrystalline metal base-type light-emitting diode (LED) and method for manufacturing same | |
| CN105244432A (en) | LED point-like COB module and manufacturing method thereof | |
| CN202521431U (en) | Light-emitting diode (LED) street lamp | |
| CN204300770U (en) | Led lamp | |
| CN205560320U (en) | High -power light emitting diode (LED) lamp fitting | |
| CN203656876U (en) | Novel LED lamp radiator | |
| CN202660334U (en) | Light-emitting diode (LED) light source with high heat dissipation efficiency | |
| CN203757619U (en) | Led energy-saving lamp lighting device | |
| CN205092269U (en) | LED light source | |
| CN203384937U (en) | LED (light-emitting diode) lamp radiating module | |
| CN203162611U (en) | Wide-angle luminous LED lamp tube | |
| CN105444036A (en) | Light-emitting diode (LED) light source light-emitting and heat-dissipating structure and light-emitting and heat-dissipating method thereof | |
| CN202195293U (en) | High-radiation type light-emitting diode (LED) bulb lamp |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150211 Termination date: 20170814 |