CN204153494U - Optoelectronic integration module - Google Patents

Optoelectronic integration module Download PDF

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Publication number
CN204153494U
CN204153494U CN201420459364.1U CN201420459364U CN204153494U CN 204153494 U CN204153494 U CN 204153494U CN 201420459364 U CN201420459364 U CN 201420459364U CN 204153494 U CN204153494 U CN 204153494U
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CN
China
Prior art keywords
substrate
led
mounting groove
circular substrate
installation structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201420459364.1U
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Chinese (zh)
Inventor
刘焕荣
郭继伟
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SHAANXI GOLDEN DIGITAL PHOTOELECTRIC TECHNOLOGY Co Ltd
Original Assignee
SHAANXI GOLDEN DIGITAL PHOTOELECTRIC TECHNOLOGY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SHAANXI GOLDEN DIGITAL PHOTOELECTRIC TECHNOLOGY Co Ltd filed Critical SHAANXI GOLDEN DIGITAL PHOTOELECTRIC TECHNOLOGY Co Ltd
Priority to CN201420459364.1U priority Critical patent/CN204153494U/en
Application granted granted Critical
Publication of CN204153494U publication Critical patent/CN204153494U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model discloses optoelectronic integration module, comprise: the circular substrate mounting groove that be arranged at circular substrate in nested with, described mounting groove height is lower than circular substrate, one LED being evenly arranged at circular substrate surrounding, and one is uniformly distributed in substrate orientation hole in mounting groove, whole module is installed on fixture by described substrate orientation hole, also comprises the electric supply installation structure that is positioned at mounting groove, and described electric supply installation structure provides electric energy for LED.Described electric supply installation structure comprises LED driver, chip inductor, filter capacitor and the sampling resistor being positioned at LED driver side.LED driver, LED and substrate junction are integrated, replacing accessory can be carried out fast, and owing to being directly connected with substrate, improve the thermal diffusivity of whole device.

Description

Optoelectronic integration module
Technical field
The utility model relates to photoelectric field, is specifically related to optoelectronic integration module.
Background technology
The features such as LED has energy-saving and environmental protection, the life-span is long, volume is little, fast response time, have been applied to lighting field more and more widely, have been considered to the forth generation light source after incandescent lamp, fluorescent lamp, high-intensity gas discharge lamp.But the thing followed, the fever phenomenon that LED light source is produced at work, especially for high-power LED light source, its heating problem is especially outstanding, and long-time use can affect luminous efficiency and service life greatly, constrains the application of high-power LED light source.
Therefore, provide the LED chip encapsulating structure with excellent heat dispersion performance to become and be the trend that following LED heat radiation substrate develops, be also the key subject of current LED light source technology penetration and promotion.
Utility model content
The technical problems to be solved in the utility model is to provide optoelectronic integration module, LED driver, LED and substrate junction is integrated, and can carry out replacing accessory fast, and owing to being directly connected with substrate, improves the thermal diffusivity of whole device.
For achieving the above object, the technical solution of the utility model is as follows:
Optoelectronic integration module, comprising:
The one circular substrate mounting groove that be arranged at circular substrate in nested with, described mounting groove height lower than circular substrate,
One LED being evenly arranged at circular substrate surrounding,
And one is uniformly distributed in substrate orientation hole in mounting groove, whole module is installed on fixture by described substrate orientation hole,
Also comprise the electric supply installation structure that is positioned at mounting groove, described electric supply installation structure provides electric energy for LED.
In a preferred embodiment of the present utility model, described electric supply installation structure comprises LED driver, chip inductor, filter capacitor and the sampling resistor being positioned at LED driver side.
In a preferred embodiment of the present utility model, described circular substrate adopts aluminium silicon carbide substrate.
In a preferred embodiment of the present utility model, between described LED and substrate, smear eutectic soldering paste.
By technique scheme, the beneficial effects of the utility model are:
LED driver, LED and substrate junction are integrated by the utility model, are convenient to change after breaking down; Eutectic soldering paste will be smeared between LED and substrate, directly LED and substrate can be combined, reduce heat dissipation channel thermal resistance, reach the effect that thermoelectricity is separated.
Accompanying drawing explanation
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only embodiments more of the present utility model, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is structural representation of the present utility model.
Detailed description of the invention
The technological means realized to make the utility model, creation characteristic, reaching object and effect is easy to understand, below in conjunction with concrete diagram, setting forth the utility model further.
Optoelectronic integration module, comprising: a circular substrate 100 mounting groove 200 that be arranged at circular substrate in nested with, this mounting groove 200 height lower than circular substrate 100,
One LED 110 being evenly arranged at circular substrate 100 surrounding, smears eutectic soldering paste between LED 110 and substrate 100,
And one is uniformly distributed in substrate orientation hole 210 in mounting groove 200, whole module is installed on fixture by described substrate orientation hole 210,
Also comprise the electric supply installation structure 300 that is positioned at mounting groove, described electric supply installation structure 300 provides electric energy for LED; Further, electric supply installation structure 300 comprises LED driver 310, chip inductor 320, filter capacitor 330 and the sampling resistor 340 being positioned at LED driver 310 side.
Above-mentioned circular substrate adopts aluminium silicon carbide substrate; Aluminium silicon carbide (AlSiC) is the abbreviation of aluminum-base silicon carbide particulate reinforced composite, it fully combines the different advantages of silicon carbide ceramics and metallic aluminium, the thermal coefficient of expansion have high-termal conductivity, matching with chip, density are little, lightweight, and high rigidity and high-flexural strength
LED driver, LED and substrate junction are integrated by the utility model, are convenient to change after breaking down; Eutectic soldering paste will be smeared between LED and substrate, directly LED and substrate can be combined, reduce heat dissipation channel thermal resistance, reach the effect that thermoelectricity is separated.
More than show and describe general principle of the present utility model and principal character and advantage of the present utility model.The technical staff of the industry should understand; the utility model is not restricted to the described embodiments; what describe in above-described embodiment and description just illustrates principle of the present utility model; under the prerequisite not departing from the utility model spirit and scope; the utility model also has various changes and modifications, and these changes and improvements all fall within the scope of claimed the utility model.The claimed scope of the utility model is defined by appending claims and equivalent thereof.

Claims (4)

1. optoelectronic integration module, is characterized in that, comprising:
The one circular substrate mounting groove that be arranged at circular substrate in nested with, described mounting groove height lower than circular substrate,
One LED being evenly arranged at circular substrate surrounding,
And one is uniformly distributed in substrate orientation hole in mounting groove, whole module is installed on fixture by described substrate orientation hole,
Also comprise the electric supply installation structure that is positioned at mounting groove, described electric supply installation structure provides electric energy for LED.
2. optoelectronic integration module according to claim 1, is characterized in that, described electric supply installation structure comprises LED driver, chip inductor, filter capacitor and the sampling resistor being positioned at LED driver side.
3. optoelectronic integration module according to claim 1, is characterized in that, described circular substrate adopts aluminium silicon carbide substrate.
4. optoelectronic integration module according to claim 1, is characterized in that, smears eutectic soldering paste between described LED and substrate.
CN201420459364.1U 2014-08-14 2014-08-14 Optoelectronic integration module Expired - Fee Related CN204153494U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201420459364.1U CN204153494U (en) 2014-08-14 2014-08-14 Optoelectronic integration module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201420459364.1U CN204153494U (en) 2014-08-14 2014-08-14 Optoelectronic integration module

Publications (1)

Publication Number Publication Date
CN204153494U true CN204153494U (en) 2015-02-11

Family

ID=52511608

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201420459364.1U Expired - Fee Related CN204153494U (en) 2014-08-14 2014-08-14 Optoelectronic integration module

Country Status (1)

Country Link
CN (1) CN204153494U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105570848A (en) * 2015-12-02 2016-05-11 宁波凯耀电器制造有限公司 Compound type LED circuit board and manufacturing method
US10935197B2 (en) 2019-04-04 2021-03-02 Delta Electronics (Shanghai) Co., Ltd. Light module and method of manufacturing the same

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105570848A (en) * 2015-12-02 2016-05-11 宁波凯耀电器制造有限公司 Compound type LED circuit board and manufacturing method
GB2545285A (en) * 2015-12-02 2017-06-14 Ningbo Klite Electric Mft Co Ltd Composite LED circuit board and manufacturing method
GB2545285B (en) * 2015-12-02 2020-11-11 Ningbo Klite Electric Mft Co Ltd Composite LED Circuit Board and Manufacturing Method
US10935197B2 (en) 2019-04-04 2021-03-02 Delta Electronics (Shanghai) Co., Ltd. Light module and method of manufacturing the same
US11193639B2 (en) 2019-04-04 2021-12-07 Delta Electronics (Shanghai) Co., Ltd. Light module and method of manufacturing the same

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20150211

Termination date: 20170814