CN101783384A - Method for sealing large-power LED - Google Patents
Method for sealing large-power LED Download PDFInfo
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- CN101783384A CN101783384A CN201010105127A CN201010105127A CN101783384A CN 101783384 A CN101783384 A CN 101783384A CN 201010105127 A CN201010105127 A CN 201010105127A CN 201010105127 A CN201010105127 A CN 201010105127A CN 101783384 A CN101783384 A CN 101783384A
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- silica gel
- enclosing wall
- crystal particle
- fluorescent powder
- glue
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Abstract
The invention relates to a method for sealing a large-power LED, comprising the following steps: fixing an LED crystal particle chip on a support; conveying the fixed LED crystal particle chip into an oven; carrying out glue painting or glue dispensing on silica gel with appropriate viscosity coefficient around the LED crystal particle chi p with a glue dispenser; solidifying and then routing a silica gel enclosing wall; and filling a layer of fluorescent powder silica gel in a preset area after completing routing. The invention has the beneficial effects that as the silica gel enclosing wall is coated with silica gel around the LED crystal particle chip, the fluorescent powder silica gel does not flow out of a non-luminous area due to fluid mechanics, so that the fluorescent powder silica gel can be evenly coated on the surface of the actual LED crystal particle chip without wasting the fluorescent powder silica gel and increasing integral luminous efficiency.
Description
Technical field
The present invention relates to a kind of high-power LED packaging method.
Background technology
At present high-power LED encapsulation is to place metallic support and solid brilliant back coating fluorescent glue with chip, and irritates and go up filling gel and be packaged into required finished form again; At present the coating method of fluorescent material all depend on the material cup size of support and must all fill up and filling thickness big, waste a large amount of fluorescent material easily and cause the luminous efficiency of chip own to reduce, shorten the LED life-span.The conventional package method is if will make the attenuation of fluorescence silica gel layer that luminous efficiency is improved, but because can be when being subject to fluorescent powder silica gel and being coated on the crystal grain chip because the silica gel fluid relation, cause whole fluorescent powder silica gel different whole according to the form of support, body is on average spread on integral support material cup, and the fluorescent powder silica gel of spreading on non-actual luminescent grain chip surface all belongs in the invalid light-emitting zone of waste.Up to the present be difficult to find the high-power LED encapsulation mode of a spot of fluorescent powder silica gel of perfusion, increase white light LEDs luminous energy.White light LEDs has plurality of advantages such as environment-friendly and energy-saving emission-reduction safety and long service life, uses white light LEDs in high-power LED packaging method of the present invention, more can improve the luminous intensity and the light transmittance efficiency of white light LEDs.
Summary of the invention
The purpose of this invention is to provide a kind of high-power LED packaging method, can improve luminous efficiency and big good fortune promotes high-power LED lighteness, and big good fortune reduces the fluorescent material use amount, make the fluorescent powder silica gel can even and a spot of being coated on the LED crystal particle chip.
The objective of the invention is to be achieved through the following technical solutions:
A kind of high-power LED packaging method comprises following step:
1) the LED crystal particle chip is fixed on above the support;
2) support that will consolidate the LED crystal particle chip is sent into baking box, and temperature is 120 ℃ in the baking box, and be 60 minutes curing time;
3) silica gel that coefficient of viscosity is suitable, use point gum machine around the LED crystal particle chip, to carry out picture glue or some glue, around the LED crystal particle chip, be coated with the last layer silica gel enclosing wall, silica gel enclosing wall can be carried out single or multiple according to required fluorescent powder silica gel thickness and be drawn glue and some glue, when desired thickness is higher, can use 3D to draw the glue function, will carry out the silica gel enclosing wall coating once more after the silica gel enclosing wall coating once, determine the height of silica gel enclosing wall again according to required coating fluorescent powder silica gel thickness;
4) support that will coat silica gel enclosing wall is sent into baking box, carries out silica gel enclosing wall and solidifies, and is cured according to selected silica gel processing procedure cure parameter condition, and selected silica gel is DOW CORNING silica gel, and during curing, the baking box internal temperature is 150 ℃, and be 60 minutes curing time;
5) silica gel enclosing wall is carried out routing after solidifying;
6) irritate layer of fluorescent powder silica gel in the routing preset area after completing.
Beneficial effect of the present invention is: use silica gel coating silica gel enclosing wall around the LED crystal particle chip, fluorescent powder silica gel can not flow to outside the non-luminous region because of the fluid mechanics relation, fluorescent powder silica gel above the whole actual leds crystal grain chip surface can evenly be coated with, can not cause the waste of fluorescent powder silica gel and increase whole luminous efficiency.
Description of drawings
With reference to the accompanying drawings the present invention is described in further detail below.
Fig. 1 is the structural representation after the described a kind of high-power LED packaging method encapsulation of the embodiment of the invention finishes;
Fig. 2 is the process chart of the described a kind of high-power LED packaging method of the embodiment of the invention.Among the figure:
1, support; 2, silica gel enclosing wall; 3, LED crystal particle chip; 4, fluorescent powder silica gel.
Embodiment
Shown in Fig. 1-2, the described a kind of high-power LED packaging method of the embodiment of the invention comprises following step:
1) LED crystal particle chip 3 is fixed on above the support 1;
2) support 1 that will consolidate LED crystal particle chip 3 is sent into baking box, and oven temperature is 120 ℃, and be 60 minutes curing time;
3) silica gel that coefficient of viscosity is suitable, use point gum machine around LED crystal particle chip 3, to carry out picture glue or some glue, around LED crystal particle chip 3, be coated with last layer silica gel enclosing wall 2, silica gel enclosing wall 2 can be carried out single or multiple according to required fluorescent powder silica gel 4 thickness and be drawn glue and some glue, when desired thickness is higher, can use 3D to draw the glue function, to carry out silica gel enclosing wall 2 coatings once more after silica gel enclosing wall 2 coatings once, determine the height of silica gel enclosing wall 2 again according to required coating fluorescent powder silica gel 4 thickness;
4) support 1 that will coat silica gel enclosing wall 2 is sent into baking box, carries out silica gel enclosing wall 2 and solidifies, and is cured according to selected silica gel processing procedure cure parameter condition, selected silica gel is DOW CORNING silica gel, during curing, the baking box internal temperature is 150 ℃, and be 60 minutes curing time;
5) carry out routing after silica gel enclosing wall 2 is solidified;
6) irritate layer of fluorescent powder silica gel 4 in the routing preset area after completing.
Owing to around the LED crystal particle chip, use silica gel coating silica gel enclosing wall, fluorescent powder silica gel can not flow to outside the non-luminous region because of the fluid mechanics relation, fluorescent powder silica gel above the whole actual leds crystal grain chip surface can evenly be coated with, can not cause the waste of fluorescent powder silica gel and increase whole luminous efficiency.
Claims (3)
1. high-power LED packaging method is characterized in that: comprise following step:
1) the LED crystal particle chip is fixed on above the support;
2) support that will consolidate the LED crystal particle chip is sent into baking box, and temperature is 120 ℃ in the baking box, and be 60 minutes curing time;
3) silica gel that coefficient of viscosity is suitable uses point gum machine to carry out picture glue or some glue around the LED crystal particle chip, is coated with the last layer silica gel enclosing wall around the LED crystal particle chip;
4) support that will coat silica gel enclosing wall is sent into baking box, carries out silica gel enclosing wall and solidifies, and is cured according to selected silica gel processing procedure cure parameter condition, and selected silica gel is DOW CORNING silica gel, and during curing, the baking box internal temperature is 150 ℃, and be 60 minutes curing time;
5) silica gel enclosing wall is carried out routing after solidifying;
6) irritate layer of fluorescent powder silica gel in the routing preset area after completing.
2. high-power LED packaging method according to claim 1 is characterized in that: silica gel enclosing wall can be carried out single or multiple according to required fluorescent powder silica gel thickness and be drawn glue and some glue.
3. high-power LED packaging method according to claim 1, it is characterized in that: when desired thickness is higher, can use 3D to draw the glue function, will carry out the silica gel enclosing wall coating once more after the silica gel enclosing wall coating once, determine the height of silica gel enclosing wall again according to required coating fluorescent powder silica gel thickness.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010105127A CN101783384A (en) | 2010-02-04 | 2010-02-04 | Method for sealing large-power LED |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010105127A CN101783384A (en) | 2010-02-04 | 2010-02-04 | Method for sealing large-power LED |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101783384A true CN101783384A (en) | 2010-07-21 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010105127A Pending CN101783384A (en) | 2010-02-04 | 2010-02-04 | Method for sealing large-power LED |
Country Status (1)
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| CN (1) | CN101783384A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101964390A (en) * | 2010-10-28 | 2011-02-02 | 深圳市天电光电科技有限公司 | High-power LED packaging structure and packaging method thereof |
| CN102120213A (en) * | 2011-01-10 | 2011-07-13 | 惠州市华阳多媒体电子有限公司 | LED fluorescent powder spraying process |
| CN102324423A (en) * | 2011-07-21 | 2012-01-18 | 浙江英特来光电科技有限公司 | Integrated COBLED (Chip on Board Light-emitting Diode) encapsulation structure |
| CN102394266A (en) * | 2011-11-30 | 2012-03-28 | 陕西科技大学 | Curable adhesive type light emitting diode (LED) dispensing structure |
| CN102447049A (en) * | 2011-12-31 | 2012-05-09 | 杭州电子科技大学 | LED (light-emitting diode) package structure based on COB (chip on board) package technology and LED illuminator |
| CN102738372A (en) * | 2012-07-11 | 2012-10-17 | 佛山市中昊光电科技有限公司 | Novel LED (light emitting diode) integrated light source module and preparation method thereof |
| CN106848101A (en) * | 2017-03-10 | 2017-06-13 | 上海小糸车灯有限公司 | A kind of OLED car lights and its OLED encapsulating structure and method for packing |
-
2010
- 2010-02-04 CN CN201010105127A patent/CN101783384A/en active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101964390A (en) * | 2010-10-28 | 2011-02-02 | 深圳市天电光电科技有限公司 | High-power LED packaging structure and packaging method thereof |
| CN102120213A (en) * | 2011-01-10 | 2011-07-13 | 惠州市华阳多媒体电子有限公司 | LED fluorescent powder spraying process |
| CN102120213B (en) * | 2011-01-10 | 2013-07-17 | 惠州市华阳光电技术有限公司 | LED fluorescent powder spraying process |
| CN102324423A (en) * | 2011-07-21 | 2012-01-18 | 浙江英特来光电科技有限公司 | Integrated COBLED (Chip on Board Light-emitting Diode) encapsulation structure |
| CN102394266A (en) * | 2011-11-30 | 2012-03-28 | 陕西科技大学 | Curable adhesive type light emitting diode (LED) dispensing structure |
| CN102447049A (en) * | 2011-12-31 | 2012-05-09 | 杭州电子科技大学 | LED (light-emitting diode) package structure based on COB (chip on board) package technology and LED illuminator |
| CN102447049B (en) * | 2011-12-31 | 2013-08-14 | 杭州电子科技大学 | LED (light-emitting diode) package structure based on COB (chip on board) package technology and LED illuminator |
| CN102738372A (en) * | 2012-07-11 | 2012-10-17 | 佛山市中昊光电科技有限公司 | Novel LED (light emitting diode) integrated light source module and preparation method thereof |
| CN106848101A (en) * | 2017-03-10 | 2017-06-13 | 上海小糸车灯有限公司 | A kind of OLED car lights and its OLED encapsulating structure and method for packing |
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| C53 | Correction of patent for invention or patent application | ||
| CB03 | Change of inventor or designer information |
Inventor after: Chen Zhenghuan Inventor after: Zhang Jiongyu Inventor before: Zhang Jiongyu |
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Free format text: CORRECT: INVENTOR; FROM: ZHANG JIONGYU TO: CHEN ZHENGHUAN ZHANG JIONGYU |
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| AD01 | Patent right deemed abandoned |
Effective date of abandoning: 20100721 |
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| C20 | Patent right or utility model deemed to be abandoned or is abandoned |