CN101964390A - High-power LED packaging structure and packaging method thereof - Google Patents
High-power LED packaging structure and packaging method thereof Download PDFInfo
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- CN101964390A CN101964390A CN2010105232100A CN201010523210A CN101964390A CN 101964390 A CN101964390 A CN 101964390A CN 2010105232100 A CN2010105232100 A CN 2010105232100A CN 201010523210 A CN201010523210 A CN 201010523210A CN 101964390 A CN101964390 A CN 101964390A
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- power led
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Abstract
The embodiment of the invention relates to a high-power LED packaging structure which comprises a substrate, an LED chip fixed on the substrate, a wall structure formed by pressing and injecting on the periphery of the LED chip, a fluorescent glue layer formed by fluorescent glue dripped into the wall structure, a first transparent glue layer coated between the LED chip and the fluorescent glue layer and a second transparent glue layer formed by pressing and injecting outside the wall structure. The embodiment of the invention also provides a high-power LED packaging method. In the packaging method, the thickness of the fluorescent glue layer formed by dripping the fluorescent glue into the wall structure is uniform, fluorescent powder is uniformly distributed, which can better realize the color temperature uniformity in a light source space; and the first transparent glue layer is coated between the LED chip and the fluorescent glue layer, which can overcome the defects of low product reliability and larger light decline which are caused by directly contacting the fluorescent powder with the LED chip with a high heating quantity and the substrate.
Description
Technical field
The present invention relates to the LED encapsulation technology, relate in particular to a kind of high-power LED encapsulation structure and method for packing.
Background technology
Traditional high-power LED encapsulation mode is that led chip is fixed on the substrate, and the glue spots that will be furnished with fluorescent material and then is injected layer of transparent glue through the baking aftershaping around chip again.The inventor is in implementing process of the present invention, there is following technical problem at least in the LED encapsulating structure of finding prior art: 1, owing to the glue of being furnished with fluorescent material is directly put around the chip, the variable thickness of fluorescent glue causes and the fluorescent material skewness can cause the space colour temperature of whole light source inconsistent.2, can reduce adhesion between colloid and the substrate because fluorescent material is deposited to substrate surface, LED lights between colloid and the substrate for a long time layering can occur, reduces reliability of products; 3, fluorescent material is direct contacts with the high chip of caloric value, also can reduce reliability of products, and light decay is relatively large.
Summary of the invention
Embodiment of the invention technical problem to be solved is, a kind of high-power LED encapsulation structure and method for packing are provided, and to realize light source space colour temperature uniformity, light decay is less, and reliability is higher.
For solving the problems of the technologies described above, the invention provides a kind of high-power LED encapsulation structure, comprising:
Substrate;
Be fixed on the led chip of described substrate one side;
The fence structure that pressure injection forms around described led chip;
The fluorescence glue-line that forms by the fluorescent glue of clicking and entering in the described fence structure;
Second substratum transparent that pressure injection forms outside described fence structure.
Further, described LED encapsulating structure also comprises first substratum transparent that is coated between described led chip and the fluorescence glue-line.
Further, described substrate is metal substrate or ceramic substrate.
Further, the colloid of described fence structure, described first substratum transparent and described second substratum transparent is silica gel.
A kind of high-power LED packaging method comprises the steps:
Led chip is fixed to substrate one side;
Pressure injection fence structure around described led chip;
In described fence structure, click and enter fluorescent glue to form the fluorescence glue-line;
Pressure injection forms second substratum transparent outside described fence structure.
Further, described LED method for packing also is included in and applies first substratum transparent between described led chip and the fluorescence glue-line.
Further, described substrate is metal substrate or ceramic substrate.
Further, the colloid of described fence structure, described first substratum transparent and described second substratum transparent is silica gel.
Technique scheme has following beneficial effect at least:
1, the encapsulating structure of the embodiment of the invention is by pressure injection fence structure around led chip, and fluorescent glue clicked and entered in the fence structure form the uniform fluorescence glue-line of thickness, its inner fluorescent material is evenly distributed and can realizes light source space colour temperature uniformity consistency preferably;
2, the LED encapsulating structure of the embodiment of the invention is coated with first substratum transparent between fluorescence glue-line and led chip and substrate, can solve owing to fluorescent material directly and the high led chip of caloric value and the substrate defective that product reliability is low, light decay is bigger that contacts and cause.
Description of drawings
Fig. 1 is the schematic diagram of high-power LED encapsulation structure one embodiment of the present invention;
Fig. 2 is the flow chart of high-power LED packaging method of the present invention.
Embodiment
Below in conjunction with accompanying drawing the embodiment of the invention is described in further detail.
The high-power LED encapsulation structure that the embodiment of the invention provided comprises: substrate 1, led chip 2, fence structure 3, fluorescence glue-line 4 and second substratum transparent 5 as shown in Figure 1.
Wherein led chip 2 is fixed on the side of substrate 1, fence structure 3 with led chip 2 be the center pressure injection around led chip 2, this fence structure 3 can also can adopt square silica gel enclosing wall for being the annular silica gel enclosing wall at center with led chip 2; Clicking and entering the liquid glue of being furnished with fluorescent material in fence structure 3 inside is the transparent silicon glue-line of pressure injection outside fence structure 3 to form uniform fluorescence glue-line 4, the second substratum transparents 5 of thickness, is hemispherical.Wherein, substrate 1 can adopt metal substrate or ceramic substrate.
By in fence structure 3, clicking and entering fluorescent glue, can form regular shape, the uniform fluorescence glue-line 4 of thickness, the distribution of the fluorescent material of fluorescence glue-line 4 inside is also comparatively even, can realize light source space colour temperature uniformity consistency preferably.
LED encapsulating structure of the present invention also comprises first substratum transparent 6 that is coated between described led chip 2 and the fluorescence glue-line 4.Wherein the colloid of the fence structure 3 and first substratum transparent 6 is silica gel, and first substratum transparent 6 can prevent that fluorescent material from directly contacting with the high led chip 2 of caloric value, improves reliability of products, reduces light decay; First substratum transparent 6 can prevent that also the fluorescent material of fluorescence glue-line 4 is deposited in the contact surface of colloid and substrate 1, thereby improves the adhesion between colloid and the substrate 1.
Figure 2 shows that the flow chart of high-power LED packaging method in an embodiment of the present invention, adopt metal substrate or ceramic substrate in the present embodiment, idiographic flow is as follows:
Step 101: fixed L ED chip 2;
During concrete operations, available elargol is fixed to led chip 2 on the side of substrate 1, also can led chip 2 be fixed on the substrate 1 by the mode of alloy welding;
Step 102: pressure injection fence structure 3;
During concrete operations, can adopt mould, be center pressure injection one fence structure 3 on substrate 1 with led chip 2, and this fence structure 3 can also can adopt square silica gel enclosing wall for being the annular silica gel enclosing wall at center with led chip 2;
Step 103: apply first substratum transparent 6;
During concrete operations, on the surface of led chip 2 and the substrate 1 in the fence structure 3, apply one deck silica gel, realize the isolation of 2 of fluorescence glue-line 4 and substrate 1 and led chips to form first substratum transparent 6;
Step 104: in fence structure 3, click and enter fluorescent glue to form the uniform fluorescence glue-line 4 of thickness;
Step 105: pressure injection second substratum transparent 5 outside fence structure 3.
The LED method for packing of the embodiment of the invention is interior to form the uniform fluorescence glue-line 4 of thickness by fluorescent glue being clicked and entered fence structure 3, and the fluorescent material distribution uniform of fluorescence glue-line 4 inside can realize light source space colour temperature uniformity consistency preferably; Between led chip 2 and fluorescence glue-line 4, apply first substratum transparent 6, can solve because the defective that product reliability is low, light decay is bigger that led chip 2 that fluorescent material is direct and caloric value is high and substrate 1 contact and cause.
The above is the specific embodiment of the present invention; should be pointed out that for those skilled in the art, under the prerequisite that does not break away from the principle of the invention; can also make some improvements and modifications, these improvements and modifications also are considered as protection scope of the present invention.
Claims (8)
1. a high-power LED encapsulation structure is characterized in that, comprising:
Substrate;
Be fixed on the led chip of described substrate one side;
The fence structure that pressure injection forms around described led chip;
The fluorescence glue-line that forms by the fluorescent glue of clicking and entering in the described fence structure;
Second substratum transparent that pressure injection forms outside described fence structure.
2. high-power LED encapsulation structure as claimed in claim 1 is characterized in that, described LED encapsulating structure also comprises first substratum transparent that is coated between described led chip and the fluorescence glue-line.
3. high-power LED encapsulation structure as claimed in claim 1 is characterized in that, described substrate is metal substrate or ceramic substrate.
4. high-power LED encapsulation structure as claimed in claim 1 is characterized in that, the colloid of described fence structure, described first substratum transparent and described second substratum transparent is silica gel.
5. a high-power LED packaging method is characterized in that, comprises the steps:
Led chip is fixed to substrate one side;
Pressure injection fence structure around described led chip;
In described fence structure, click and enter fluorescent glue to form the fluorescence glue-line;
Pressure injection forms second substratum transparent outside described fence structure.
6. high-power LED packaging method as claimed in claim 5 is characterized in that, described LED method for packing also is included in and applies first substratum transparent between described led chip and the fluorescence glue-line.
7. high-power LED packaging method as claimed in claim 5 is characterized in that, described substrate is metal substrate or ceramic substrate.
8. high-power LED packaging method as claimed in claim 5 is characterized in that, the colloid of described fence structure, described first substratum transparent and second substratum transparent is silica gel.
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| Application Number | Priority Date | Filing Date | Title |
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| CN2010105232100A CN101964390A (en) | 2010-10-28 | 2010-10-28 | High-power LED packaging structure and packaging method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN2010105232100A CN101964390A (en) | 2010-10-28 | 2010-10-28 | High-power LED packaging structure and packaging method thereof |
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| CN101964390A true CN101964390A (en) | 2011-02-02 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102738372A (en) * | 2012-07-11 | 2012-10-17 | 佛山市中昊光电科技有限公司 | Novel LED (light emitting diode) integrated light source module and preparation method thereof |
| CN103579456A (en) * | 2013-09-30 | 2014-02-12 | 深圳市瑞丰光电子股份有限公司 | COB area light source and glue blocking wall manufacturing method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101308892A (en) * | 2007-05-17 | 2008-11-19 | 兆立光电有限公司 | Manufacture method of light emitting diode encapsulation |
| CN101369614A (en) * | 2007-08-17 | 2009-02-18 | 刘胜 | Packaging structure and method for high power white light LED |
| CN101783384A (en) * | 2010-02-04 | 2010-07-21 | 九江联辉光电有限公司 | Method for sealing large-power LED |
-
2010
- 2010-10-28 CN CN2010105232100A patent/CN101964390A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101308892A (en) * | 2007-05-17 | 2008-11-19 | 兆立光电有限公司 | Manufacture method of light emitting diode encapsulation |
| CN101369614A (en) * | 2007-08-17 | 2009-02-18 | 刘胜 | Packaging structure and method for high power white light LED |
| CN101783384A (en) * | 2010-02-04 | 2010-07-21 | 九江联辉光电有限公司 | Method for sealing large-power LED |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102738372A (en) * | 2012-07-11 | 2012-10-17 | 佛山市中昊光电科技有限公司 | Novel LED (light emitting diode) integrated light source module and preparation method thereof |
| CN103579456A (en) * | 2013-09-30 | 2014-02-12 | 深圳市瑞丰光电子股份有限公司 | COB area light source and glue blocking wall manufacturing method thereof |
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Application publication date: 20110202 |