CN102324423A - Integrated COBLED (Chip on Board Light-emitting Diode) encapsulation structure - Google Patents
Integrated COBLED (Chip on Board Light-emitting Diode) encapsulation structure Download PDFInfo
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- CN102324423A CN102324423A CN201110204460A CN201110204460A CN102324423A CN 102324423 A CN102324423 A CN 102324423A CN 201110204460 A CN201110204460 A CN 201110204460A CN 201110204460 A CN201110204460 A CN 201110204460A CN 102324423 A CN102324423 A CN 102324423A
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Abstract
The invention relates to an integrated COBLED (Chip on Board Light-emitting Diode) encapsulation structure, which solves the technical problems of poor radiation effect, bad emergent light effect and air tightness in the existing integrated COBLED encapsulation structure. A COBLED comprises a substrate and a circuit layer arranged on the substrate, a plurality of strip-shaped slots which are arranged in parallel are arranged on the substrate, luminous chips are evenly distributed at the bottom of the strip-shaped slots, a circle of enclosure glue is arranged at the peripheries of the strip-shaped slots, and transparent glue is filled in a region surrounded by the enclosure glue. The integrated COBLED encapsulation structure has the advantages that the luminous chips are integrated in the strip-shaped slots so as to improve the encapsulation density of the luminous chips, and the luminous chips are directly contacted with the substrate, thus having a good radiation effect; the luminous chips can conduct radiation through the substrate, and current passes through the circuit layer on the surface of the substrate, thus forming a heat-electricity separation structure and further increasing the service life and stability of an LED (light-emitting diode); and the enclosure glue is embedded in the substrate, thus ensuring the air tightness and physical strength of the encapsulation; and the side walls of the strip-shaped slots are oblique, thus improving the light extraction rate of the luminous chips.
Description
Technical field
The present invention relates to a kind of lighting technical field, especially relate to the COBLED integrated encapsulation structure of a kind of heat radiation, bright dipping, good sealing effect.
Background technology
Existing C OBLED (Chip on Board) generally is the line layer that is arranged in luminescence chip substrate surface; Peripheral regional with the embedding that forms glue through pressing one circle plastic packaging material; Perhaps make lead frame in order to fill out enclosure wall glue at substrate surface; Perhaps pressing one deck glue material on substrate is made taper hole in the glue material, arranges led chip and sealing in the taper hole.But these encapsulation schemes also have many shortcomings, are not directly to contact with substrate like luminescence chip, but through the extremely low line layer of one deck conductive coefficient, integral heat sink poor; Luminescence chip all is positioned at substrate surface, does not have the reflector, and it is bad to go out light effect; The capsulation material of pressing, lead frame and substrate adherence are bad, phenomenons such as glue can occur leaking, and moisture in the environment and pernicious gas also infiltrate in the packaging body easily; Greatly reduce the useful life of LED, in addition, make lead frame in order to fill out enclosure wall glue; Enclosure wall glue be the associativity of contact substrate wiring layer surface and substrate be not fine, have the air-tightness problem equally.Like application number is 201010253905.1; Name is called China's invention application of chip integrated always high-power LED encapsulation technology and products thereof; It comprises wiring board, led chip, fluorescent coating and silica gel type body, and said silica gel type body surrounds end to end close-shaped in the circuit board, and the led chip setting in the circuit board; Fluorescent coating is coated on the led chip surface through binder, and led chip and fluorescent coating all are limited in close-shaped that the silica gel type body surrounds.This LED encapsulating products just has above-mentioned shortcoming, the luminescence chip setting in the circuit board, radiating effect is poor; And luminescence chip is arranged on the PCB surface, does not have reflector layer, and it is bad that luminescence chip goes out light effect; Adherence is bad between silica gel type body and the wiring board, occurs leaking the glue phenomenon easily.
Summary of the invention
The present invention mainly be solve the radiating effect that integrated form COBLED encapsulating structure exists in the prior art poor, go out light effect and the bad technical problem of air-tightness, the COBLED integrated encapsulation structure of a kind of heat radiation, bright dipping, good sealing effect is provided.
Above-mentioned technical problem of the present invention mainly is able to solve through following technical proposals: a kind of COBLED integrated encapsulation structure; Comprise substrate and be arranged on the line layer on the substrate surface; Said substrate is provided with some bar-shaped troughs that are arranged in parallel; Evenly be placed with some luminescence chips in the bar-shaped trough bottom, be equipped with a corral wall glue, in enclosure wall glue area surrounded, be filled with transparent adhesive tape in said bar-shaped trough outer periphery.On substrate, offer bar-shaped trough among the present invention; Then luminescence chip is controlled in bar-shaped trough; Realized that luminescence chip is once integrated, improved the packaging density of luminescence chip, a plurality of bar-shaped troughs are arranged in parallel, and to form secondary integrated; Converted the LED point-source of light to area source, made to be applicable to general lighting.Luminescence chip is controlled in the bar-shaped trough bottom, directly contacts with substrate, and heat sheds through substrate, and radiating effect is better.Enclosure wall glue surrounds bar-shaped trough, and spot printing transparent adhesive tape in the bar-shaped trough area surrounded has been realized sealing and protection to the chip gold thread, and the colleague has also guaranteed the air-tightness and the physical strength of encapsulation.
As a kind of preferred version, said luminescence chip links to each other with line layer through routing.Formed a kind of thermoelectric isolating construction, heat sheds through the high substrate of conductive coefficient, and electric current has improved LED designed life and long-time stability then through the line layer of substrate surface.
As a kind of preferred version, in said bar-shaped trough, be filled with fluorescent glue.Fluorescent glue produces white light in order to the photoreactivation with luminescence chip.
As a kind of preferred version, the sidewall of said bar-shaped trough is skewed.The bar-shaped trough sidewall forms the reflection shield structure, has improved luminescence chip like this and has gone out light effect.
As a kind of preferred version, said bar-shaped trough peripheral substrate is provided with mounting groove, and three of said mounting grooves center on bar-shaped trough, and said enclosure wall glue lower end is embedded in the mounting groove.The lower end of enclosure wall glue is embedded in the mounting groove, has prevented leakage glue phenomenon, and in moisture in the environment and the pernicious gas infiltration packaging body, has guaranteed the air-tightness and the physical strength of encapsulation.
As a kind of preferred version, said substrate is an aluminium base.Make substrate have good thermal conductivity, substrate also is not limited only to aluminium base among the present invention, also can be other material substrates such as copper base.
Therefore, the advantage that the present invention has is: 1. luminescence chip is integrated in the bar-shaped trough, has improved the packaging density of luminescence chip, and luminescence chip directly contacts with substrate, good heat dissipation effect; 2. luminescence chip dispels the heat through substrate, and electric current has constituted a kind of thermoelectric isolating construction through the line layer of substrate surface, has improved LED life-span and stability; 3. enclosure wall glue is embedded in the substrate, has guaranteed the air-tightness and the physical strength of encapsulation; 4. the bar-shaped trough sidewall becomes skewed, has improved the luminescence chip light emission rate.
Description of drawings
Accompanying drawing 1 is a kind of structural representation of the present invention;
Accompanying drawing 2 is a kind of structural representations after the present invention removes enclosure wall glue;
On the accompanying drawing 3 in the accompanying drawing 1 A-A to cross-sectional view.
1-substrate 2-line layer 3-bar-shaped trough 4-luminescence chip 5-enclosure wall glue 6-mounting groove 7-fluorescent glue 8-transparent adhesive tape.
Embodiment
Pass through embodiment below, and combine accompanying drawing, do further bright specifically technical scheme of the present invention.
Embodiment:
A kind of COBLED integrated encapsulation structure of present embodiment, as shown in figures 1 and 3, include substrate 1 and be arranged on the line layer 2 on the substrate surface; This substrate is an aluminium base; Substrate is provided with 5 bar-shaped troughs that are arranged in parallel 3, and luminescence chip 4 is the blue-light-emitting chip in the present embodiment, and luminescence chip evenly is arranged in the bottom of bar-shaped trough 3; Luminescence chip realizes that with the line layer 2 on the substrate circuit is connected through routing; As shown in Figure 3, the sidewall of this bar-shaped trough is skewed, constitutes the structure of a reflection shield.As shown in Figure 2, be equipped with mounting groove 6 in the bar-shaped trough outer periphery, these mounting groove three bread enclose bar-shaped trough, also are provided with a corral wall glue 5 in the bar-shaped trough periphery, and this enclosure wall glue surrounds bar-shaped trough, and the bottom of enclosure wall glue is embedded in the mounting groove 6.In bar-shaped trough, be filled with fluorescent glue 7, in the zone that enclosure wall glue is surrounded, be filled with transparent adhesive tape 8, this transparent adhesive tape is a silica gel.
Specific embodiment described herein only is that the present invention's spirit is illustrated.Person of ordinary skill in the field of the present invention can make various modifications or replenishes or adopt similar mode to substitute described specific embodiment, but can't depart from spirit of the present invention or surmount the defined scope of appended claims.
Although this paper has used terms such as substrate, line layer, enclosure wall glue, bar-shaped trough, transparent adhesive tape morely, do not get rid of the possibility of using other term.Using these terms only is in order to describe and explain essence of the present invention more easily; It all is contrary with spirit of the present invention being construed to any additional restriction to them.
Claims (7)
1. COBLED integrated encapsulation structure; Comprise substrate and be arranged on the line layer on the substrate surface; It is characterized in that: said substrate (1) is provided with some bar-shaped troughs that are arranged in parallel (3); Evenly be placed with some luminescence chips (4) in the bar-shaped trough bottom, be equipped with a corral wall glue (5), in enclosure wall glue area surrounded, be filled with transparent adhesive tape (8) in said bar-shaped trough (3) outer periphery.
2. a kind of COBLED integrated encapsulation structure according to claim 1 is characterized in that said luminescence chip (4) links to each other with line layer (2) through routing.
3. a kind of COBLED integrated encapsulation structure according to claim 1 and 2 is characterized in that in said bar-shaped trough (3), being filled with fluorescent glue (7).
4. a kind of COBLED integrated encapsulation structure according to claim 1 and 2, the sidewall that it is characterized in that said bar-shaped trough (3) is skewed.
5. a kind of COBLED integrated encapsulation structure according to claim 3, the sidewall that it is characterized in that said bar-shaped trough (3) is skewed.
6. a kind of COBLED integrated encapsulation structure according to claim 1 and 2; It is characterized in that said bar-shaped trough (3) peripheral substrate is provided with mounting groove (6); Three of said mounting grooves center on bar-shaped trough, and said enclosure wall glue (5) lower end is embedded in the mounting groove.
7. a kind of COBLED integrated encapsulation structure according to claim 1 and 2 is characterized in that said substrate (1) is an aluminium base.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110204460A CN102324423A (en) | 2011-07-21 | 2011-07-21 | Integrated COBLED (Chip on Board Light-emitting Diode) encapsulation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110204460A CN102324423A (en) | 2011-07-21 | 2011-07-21 | Integrated COBLED (Chip on Board Light-emitting Diode) encapsulation structure |
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| Publication Number | Publication Date |
|---|---|
| CN102324423A true CN102324423A (en) | 2012-01-18 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110204460A Pending CN102324423A (en) | 2011-07-21 | 2011-07-21 | Integrated COBLED (Chip on Board Light-emitting Diode) encapsulation structure |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107731992A (en) * | 2017-11-28 | 2018-02-23 | 西安科锐盛创新科技有限公司 | LED encapsulation structure |
| CN107994013A (en) * | 2017-11-28 | 2018-05-04 | 西安科锐盛创新科技有限公司 | A kind of LED encapsulation method |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201348169Y (en) * | 2009-02-06 | 2009-11-18 | 厦门华联电子有限公司 | White light-emitting diode (LED) integrated array light source encapsulated based on chip-on-board (COB) technology |
| KR100964812B1 (en) * | 2008-09-29 | 2010-06-22 | 주식회사 에피밸리 | Semiconductor light emitting device package |
| CN101783384A (en) * | 2010-02-04 | 2010-07-21 | 九江联辉光电有限公司 | Method for sealing large-power LED |
| CN202189782U (en) * | 2011-07-21 | 2012-04-11 | 浙江英特来光电科技有限公司 | Integrated encapsulating structure for COBLED (chip on board light-emitting diode) |
-
2011
- 2011-07-21 CN CN201110204460A patent/CN102324423A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100964812B1 (en) * | 2008-09-29 | 2010-06-22 | 주식회사 에피밸리 | Semiconductor light emitting device package |
| CN201348169Y (en) * | 2009-02-06 | 2009-11-18 | 厦门华联电子有限公司 | White light-emitting diode (LED) integrated array light source encapsulated based on chip-on-board (COB) technology |
| CN101783384A (en) * | 2010-02-04 | 2010-07-21 | 九江联辉光电有限公司 | Method for sealing large-power LED |
| CN202189782U (en) * | 2011-07-21 | 2012-04-11 | 浙江英特来光电科技有限公司 | Integrated encapsulating structure for COBLED (chip on board light-emitting diode) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107731992A (en) * | 2017-11-28 | 2018-02-23 | 西安科锐盛创新科技有限公司 | LED encapsulation structure |
| CN107994013A (en) * | 2017-11-28 | 2018-05-04 | 西安科锐盛创新科技有限公司 | A kind of LED encapsulation method |
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Application publication date: 20120118 |