CN108617091A - A kind of on-plane surface pcb board - Google Patents
A kind of on-plane surface pcb board Download PDFInfo
- Publication number
- CN108617091A CN108617091A CN201810537592.9A CN201810537592A CN108617091A CN 108617091 A CN108617091 A CN 108617091A CN 201810537592 A CN201810537592 A CN 201810537592A CN 108617091 A CN108617091 A CN 108617091A
- Authority
- CN
- China
- Prior art keywords
- pit
- pcb board
- circuit
- plane surface
- plane
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 230000002093 peripheral effect Effects 0.000 claims abstract description 7
- 238000000748 compression moulding Methods 0.000 claims description 2
- 230000005611 electricity Effects 0.000 claims 1
- 238000005516 engineering process Methods 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09036—Recesses or grooves in insulating substrate
Abstract
The present invention discloses a kind of on-plane surface pcb board, forms the identical or different pit of one or more shapes on the pcb board, is equipped with circuit and pad in pit, and the circuit in pit uninterruptedly extends to the plane domain of pcb board from pit peripheral wall.The pcb board has the characteristics that frivolous, safety is easy-to-use, realizes the protection also realized by groove while entire control circuit is laid to device.
Description
Technical field
The present invention relates to technical field of PCB board, more particularly to a kind of on-plane surface pcb board.
Background technology
The circuit of traditional PCB is produced in the smooth plane of whole face, and the circuit of unicom is needed between Different Plane
It is generally connected by the way of punching, this structure is unfavorable for the product of certain particular/special requirements.
Also there are the technology connected up using groove, application number 201610554540.3 to disclose a kind of PCB embedments in the prior art
The manufacturing method of formula circuit, the invention refer to a kind of technology generating circuit in groove, include being preset with recessed
The motherboard of line pattern and pattern transfer daughter board with line pattern protrusion, the pcb board are multilayered structure, and thickness is thicker, recessed
Slot is to form the mould ditch of circuit, and device all exposed surfaces, groove do not lay the function of device；
Application number 201710977049.6 discloses a kind of production method of high density embedded lines, which refers to not
The technology of circuit is generated in the groove inscribed on rust steel, groove is the mould ditch to form circuit, the single layer board which makes
In, groove effect is turning circuit（Such as lay positive and negative anodes iron plate）, rather than the whole circuit of layout.
The common ground of above two circuit generation technique is that circuit is generated in groove, and between not solving Different Plane
The installation question of the problem of connection and device, that is to say, that circuit is separate lines in the groove, can not solve difference
Connection problem between plane also cannot achieve being welded for particular device in groove, and can not complete entire control line
The layout on road.
In view of this, the present invention develops a kind of on-plane surface pcb board, thus this case generates.
Invention content
The purpose of the present invention is to provide a kind of on-plane surface pcb board, has the characteristics that frivolous, safety is easy-to-use, realize whole
A control circuit also realizes the protection to device by groove while laying.
To achieve the goals above, technical scheme is as follows：
A kind of on-plane surface pcb board forms the identical or different pit of one or more shapes on the pcb board, is equipped in pit
Circuit and pad, and the circuit in pit uninterruptedly extends to the plane domain of pcb board from pit peripheral wall.
The pit bottom surface is flat, arcuate bottom or spherical bottom.
Being welded on pad in the pit has electronic component.
The pit uses mold compression moulding.
After adopting the above scheme, on-plane surface pcb board of the invention is molded respectively by fixture on traditional plane pcb board
The pit of kind shape, and pit is integrally formed with plane domain, and molding mode may be used fixture compacting or by mold system
It makes, pit peripheral wall can form conservation of nature to the device that inside is welded, and the circuit in pit can uninterruptedly extend along peripheral wall
The laying that entire control circuit is completed to plane domain is especially beneficial the cloth that short space domestic demand wants control circuit between Different Plane
If electronic component can be welded on the pad of pit, levels connection can be carried out to avoid only passing through to punch between device
And device is avoided to be exposed to the plane domain of pcb board, achieve the purpose that protect device, between the adjacent pit of on-plane surface pcb board
A degree of light partition can also be formed, therefore the present invention can accomplish light, entirety and safety is easy-to-use, enriches pcb board
Specific use.
Below in conjunction with the drawings and specific embodiments, the present invention will be further described.
Description of the drawings
Fig. 1 is the stereogram of the present invention；
Fig. 2 is the vertical view of the present invention；
Fig. 3 is the sectional view in the directions A-A of Fig. 2；
Fig. 4 is the sectional view in the directions B-B of Fig. 2；
Fig. 5 is enlarged drawing at the C of Fig. 3.
Label declaration
Pcb board 1, pit 11, pit peripheral wall 111, pit bottom surface 112, plane domain 12, circuit 2, pad 3, electronic component 4.
Specific implementation mode
A kind of on-plane surface pcb board disclosed as shown in Figs. 1-5 for the present invention, is pressed into using mold on the pcb board 1
The identical or different pit 11 of type one or more shape, pit 11 is interior to be equipped with circuit 2 and pad 3, and the circuit 2 in pit 11
The plane domain 12 of pcb board 1 is uninterruptedly extended to from pit peripheral wall 111.The pad designed in pit 11 is for the electronics that is welded
Component 4, these electronic components are usually to need special protection or special requirement（Such as reflector）Device.
The shape of above-mentioned pit 11 may be used round and rectangular, and the present invention does not limit the shape of pit 11 certainly
Shape, such as ellipse, prismatic of pit 11 etc. can be selected according to the difference of device and circuit on demand in this.Equally
, 112 shape of pit bottom surface is also required to according to demand to design, and in practical applications, pit bottom surface 112 mostly uses flat, arc
Shape bottom or spherical bottom.
Specific embodiments of the present invention are these are only, not to the restriction of protection scope of the present invention.All setting according to this case
The equivalent variations that meter thinking is done, each fall within the protection domain of this case.
Claims (4)
1. a kind of on-plane surface pcb board, it is characterised in that：Identical or different recessed of one or more shapes is formed on the pcb board
Hole, pit is interior to be equipped with circuit and pad, and the circuit in pit uninterruptedly extends to the plane domain of pcb board from pit peripheral wall.
2. a kind of on-plane surface pcb board as described in claim 1, it is characterised in that：The pit bottom surface be flat, arcuate bottom or
Spherical bottom.
3. a kind of on-plane surface pcb board as described in claim 1, it is characterised in that：Being welded on pad in the pit has electricity
Sub- component.
4. a kind of on-plane surface pcb board as described in claim 1, it is characterised in that：The pit uses mold compression moulding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810537592.9A CN108617091A (en) | 2018-05-30 | 2018-05-30 | A kind of on-plane surface pcb board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810537592.9A CN108617091A (en) | 2018-05-30 | 2018-05-30 | A kind of on-plane surface pcb board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108617091A true CN108617091A (en) | 2018-10-02 |
Family
ID=63664423
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810537592.9A Withdrawn CN108617091A (en) | 2018-05-30 | 2018-05-30 | A kind of on-plane surface pcb board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108617091A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5055637A (en) * | 1989-05-02 | 1991-10-08 | Hagner George R | Circuit boards with recessed traces |
| JPH06244304A (en) * | 1993-02-19 | 1994-09-02 | Nec Corp | Leadless chip carrier package |
| JPH0823151A (en) * | 1994-07-06 | 1996-01-23 | Tanaka Kikinzoku Kogyo Kk | Chip-on-board and its production |
| CN1253662A (en) * | 1997-04-30 | 2000-05-17 | 日立化成工业株式会社 | Board for mounting semiconductor element, method for manufacturing same, and semiconductor device |
| CN201868429U (en) * | 2010-11-29 | 2011-06-15 | 苏州君耀光电有限公司 | Embedded-type encapsulating structure of luminous diode |
| CN201928517U (en) * | 2010-08-24 | 2011-08-10 | 王定锋 | Circuit board with pit |
| CN102412246A (en) * | 2011-06-17 | 2012-04-11 | 杭州华普永明光电股份有限公司 | LED (Light-emitting diode) module based on metal matrix PCB (Printed Circuit Board) board and manufacture method thereof |
-
2018
- 2018-05-30 CN CN201810537592.9A patent/CN108617091A/en not_active Withdrawn
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5055637A (en) * | 1989-05-02 | 1991-10-08 | Hagner George R | Circuit boards with recessed traces |
| JPH06244304A (en) * | 1993-02-19 | 1994-09-02 | Nec Corp | Leadless chip carrier package |
| JPH0823151A (en) * | 1994-07-06 | 1996-01-23 | Tanaka Kikinzoku Kogyo Kk | Chip-on-board and its production |
| CN1253662A (en) * | 1997-04-30 | 2000-05-17 | 日立化成工业株式会社 | Board for mounting semiconductor element, method for manufacturing same, and semiconductor device |
| CN201928517U (en) * | 2010-08-24 | 2011-08-10 | 王定锋 | Circuit board with pit |
| CN201868429U (en) * | 2010-11-29 | 2011-06-15 | 苏州君耀光电有限公司 | Embedded-type encapsulating structure of luminous diode |
| CN102412246A (en) * | 2011-06-17 | 2012-04-11 | 杭州华普永明光电股份有限公司 | LED (Light-emitting diode) module based on metal matrix PCB (Printed Circuit Board) board and manufacture method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Address after: 363000 Tailong Industrial Park, jiaomei Wenpu Industrial Park, Zhangzhou City, Fujian Province Applicant after: Tailong Electronics Co.,Ltd. Address before: 363000 Tailong Industrial Park, jiaomei Wenpu Industrial Park, Zhangzhou City, Fujian Province Applicant before: TECNON (FUJIAN) COMMERCIAL LIGHTING Co.,Ltd. |
|
| CB02 | Change of applicant information | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20181002 |
|
| WW01 | Invention patent application withdrawn after publication |