CN202889770U - Circuit board - Google Patents
Circuit board Download PDFInfo
- Publication number
- CN202889770U CN202889770U CN 201220536528 CN201220536528U CN202889770U CN 202889770 U CN202889770 U CN 202889770U CN 201220536528 CN201220536528 CN 201220536528 CN 201220536528 U CN201220536528 U CN 201220536528U CN 202889770 U CN202889770 U CN 202889770U
- Authority
- CN
- China
- Prior art keywords
- circuit
- circuit board
- base material
- copper foil
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Structure Of Printed Boards (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Abstract
The utility model discloses a circuit board, and mainly provides a circuit board structure which is equipped with at least two circuits different in thickness on the same circuit board substrate. The circuit board is mainly provided with a first circuit board substrate. At least one thin copper foil circuit layer is arranged on a surface of one side of the first circuit board substrate, and at least one circuit groove is disposed on the surface of the other side of the first circuit board substrate. The circuit groove allows the copper foil circuit layer to be exposed at the bottom of the groove. In addition, a conductor is embedded in the circuit groove.
Description
Technical field
The relevant a kind of circuit board of the utility model refers to a kind of circuit board that has at least two kinds of different-thickness circuit at same board substrate especially.
Background technology
Press, circuit board has become the main bearing substrate of general electronics, electric equipment products, owing to be laid with complicated conducting wire and various electronic building brick on the circuit board, makes the function that reaches the expection running by the circulation of electric current, various signals.The available circuit plate is because cooperating the demand of electronic equipment running, some zone needs the larger electric current of circulation, such as: its some zone of the circuit board of power supply unit needs by large electric current (power supply such as electromagnetic coil drive is supplied framework etc.), so, need possess the predetermined set that the larger electric current of circulation is arranged in some zone of this circuit board, for the running of relevant device.
Known associated circuit board is provided with copper foil circuit, and this copper foil circuit links various related electronic components in order to telecommunication; This circuit board also has a large galvanic areas; When this circuit board through the plug-in unit of surface mount technology (SMT) and after crossing the tin stove, slowly weld with manual type in this large galvanic areas and to add tin, make form an area more greatly, thicker tin zone section, this tin zone section of mat allows that large electric current passes through.
So, this known techniques with the shortcoming of artificial secondary operations is: increase labor hour 1.; 2. when constantly with artificial, because flatiron temperature is high, and add time of staying of tin operation at this place of a specified duration, so the disappearance misgivings of heat waste peripheral assembly are arranged; 3. artificial treatment is overflow tin easily and is caused line short; 4. often cause profile not attractive in appearance after the artificial, diminish texture.
The utility model content
The technical problem that the utility model solves is namely providing a kind of circuit board that has at least two kinds of different-thickness circuit at same board substrate.
The technological means that the utility model adopts is as follows.
A kind of circuit board, mainly be provided with a first circuit board base material, this first circuit board base material one side surface is provided with the copper foil circuit layer of at least one thinner thickness, this first circuit board base material in addition side surface then forms at least one circuit groove, this circuit groove makes this copper foil circuit layer appear in its bottom, and other has an electric conductor to fill out to be overlying in this circuit groove.
This circuit board has two stacked gummeds of first circuit board base material to fix, and is provided with at least one conductor that connects in order to consist of predetermining circuit between each first circuit board.
At least one second circuit plate substrate that is provided with at least one copper foil circuit layer further is provided, this first circuit board base material and this at least one second circuit plate substrate superimposed gel are closed, and between this at least one first circuit board and this at least one second circuit plate substrate, be provided with at least one conductor that connects in order to consist of predetermining circuit.
Further be provided with metallic film between this circuit groove inwall and this electric conductor.
This metallic film is covered in all surfaces of inwall.
This metallic film is covered in the middle section surface of inwall
The beneficial effect that the utility model produces is to obtain a kind of circuit board that has at least two kinds of different-thickness circuit at same board substrate.
Description of drawings
Fig. 1 is the structural representation of the first embodiment circuit board in the utility model.
Fig. 2 is the structural representation of the second embodiment circuit board in the utility model.
Fig. 3 is the structural representation of the 3rd embodiment circuit board in the utility model.
Fig. 4 is the structural representation of the 4th embodiment circuit board in the utility model.
Fig. 5 is the structural representation of the 5th embodiment circuit board in the utility model.
Fig. 6 is the structural representation of the 6th embodiment circuit board in the utility model.
The figure number explanation:
10 first circuit board base materials
101 first surfaces
102 second surfaces
11 copper foil circuit layers
12 circuit grooves
13 electric conductors
14 conductors
20 second circuit plate substrates
21 copper foil circuit layers
30 semi-solid preparation films.
Embodiment
Shown in the structural representation of Fig. 1 the utility model the first embodiment circuit board, circuit board of the present utility model mainly is provided with a first circuit board base material 10, and these first circuit board base material 10 1 side surfaces are provided with the copper foil circuit layer 11 of at least one thinner thickness; When implementing, this first circuit board base material 10 is provided with corresponding first surface 101 and second surface 102, this first circuit board base material 10 can be provided with copper foil circuit layer 11 at first surface 101, or all be provided with the copper foil circuit layer on first, second surface 101,102, this first circuit board base material 10 in addition side surface (embodiment as shown in the figure is second surface 102) then forms at least one circuit groove 12, this circuit groove 12 can make the copper foil circuit layer 11 that is positioned at this first surface 101 appear in its bottom, and other has an electric conductor 13 to fill out to be overlying in this circuit groove 12; When implementing, this at least one circuit groove 12 can be connected with copper foil circuit layer 11 in the precalculated position, the state that graphic representation circuit groove 12 bronze medals are connected with paper tinsel circuit layer 11; Certainly, in the specific implementation, the circuit groove also can not be connected with the copper foil circuit layer.
Circuit board of the present utility model can form at least two kinds of different-thickness circuit (a kind of circuit that is made of copper foil circuit layer 12 wherein, another kind of be overlying in the circuit groove 12 and relatively imbed the circuit that the electric conductor 13 of first circuit board base material 10 plate faces consists of by filling out) on same board substrate; When using, can be for utilizing the thinner circuit of thickness (circuit that is consisted of by copper foil circuit layer 12) as the transmission of control signal (digital control signal), and utilize the thicker circuit of thickness (circuit that is consisted of by electric conductor 13) to transmit powerful drive current, so that to reduce the impedance of drive current, avoid circuit burnout or the reduction operational effectiveness because printed circuit board (PCB) is overheated.
Circuit board of the present utility model also can utilize the thicker circuit of thickness (circuit that is made of electric conductor 13) as the waste heat discharge channel of circuit board, to make circuit board be able to normal effect and keep due task performance when using.
Moreover, the utility model is when implementing, except can all being provided with the copper foil circuit layer at two plate faces, make formation one have the circuit board of plural copper foil circuit layer 11, using increases outside the Circnit Layout density, also can be as shown in Figure 2, further will at least two first circuit board base material 10 stacked gummeds (with the semi-solid preparation film 30 shown in scheming with plural first circuit board base material 10 stacked gummeds), and between each first circuit board base material 10, be provided with as shown in Figure 3 at least one conductor 14 that connects in order to consist of predetermining circuit, make the circuit board of obtaining a kind of multi-layer plate-type, can reach equally the purpose that increases Circnit Layout density.
Also can be as shown in Figure 4, at least one second circuit plate substrate 20 that is provided with at least one copper foil circuit layer 21 further is provided, with at least one first circuit board base material 10 and these at least one second circuit plate substrate 20 stacked gummeds (will lack a first circuit board base material 10 and at least one second circuit plate substrate 20 stacked gummeds with the semi-solid preparation film 30 shown in scheming), and as shown in Figure 5, between this at least one first circuit board 10 and this at least one second circuit plate substrate 20, be provided with at least one conductor 14 that connects in order to consist of predetermining circuit, reach the purpose that the purpose that increases Circnit Layout density reaches increases Circnit Layout density, even can be as shown in Figure 6, be overlying in the circuit groove 12 and relatively imbed the circuit that the electric conductor 13 of first circuit board base material 10 plate faces consists of by filling out above-mentioned, be hidden in the plate body internal layer that is consisted of by first circuit board 10 and second circuit plate substrate 20 gummeds fully, as the waste heat discharge channel of circuit board, make circuit board be able to normal effect and keep due task performance.
Because the utility model is imbedded thickness the plate face of first circuit board base material 10 greater than the circuit main body of copper foil circuit layer 11, therefore when being applied to the multi-layer sheet gummed, a large amount of prepreg (semi-solid preparation film) filler not, when being not easy pressing occurs because of resin flows too much or not enough slide plate and the cavity problem of causing, can not make glass directly contact reliability or CAF problem that the copper layer causes because a large amount of resins flow into thick copper space yet.
In addition, further be provided with the metallic film of predetermined thickness between this circuit groove inwall and this electric conductor, this metallic film can be covered in all surfaces or the middle section surface of inwall, to promote the steadiness that engages of this circuit groove and this electric conductor.
Claims (6)
1. circuit board, it is characterized in that, mainly be provided with a first circuit board base material, this first circuit board base material one side surface is provided with at least one copper foil circuit layer, this first circuit board base material in addition side surface then forms at least one circuit groove, this circuit groove makes this copper foil circuit layer appear in its bottom, and other has an electric conductor to fill out to be overlying in this circuit groove.
2. circuit board as claimed in claim 1 is characterized in that, this circuit board has two stacked gummeds of first circuit board base material to fix, and is provided with at least one conductor that connects in order to consist of predetermining circuit between each first circuit board.
3. circuit board as claimed in claim 1, it is characterized in that, at least one second circuit plate substrate that is provided with at least one copper foil circuit layer further is provided, this first circuit board base material and this at least one second circuit plate substrate superimposed gel are closed, and between this at least one first circuit board and this at least one second circuit plate substrate, be provided with at least one conductor that connects in order to consist of predetermining circuit.
4. such as the arbitrary described circuit board of claims 1 to 3, it is characterized in that, further be provided with metallic film between this circuit groove inwall and this electric conductor.
5. circuit board as claimed in claim 4 is characterized in that, this metallic film is covered in all surfaces of inwall.
6. circuit board as claimed in claim 4 is characterized in that, this metallic film is covered in the middle section surface of inwall.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220536528 CN202889770U (en) | 2012-10-19 | 2012-10-19 | Circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220536528 CN202889770U (en) | 2012-10-19 | 2012-10-19 | Circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202889770U true CN202889770U (en) | 2013-04-17 |
Family
ID=48081151
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220536528 Expired - Fee Related CN202889770U (en) | 2012-10-19 | 2012-10-19 | Circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202889770U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107079582A (en) * | 2017-01-22 | 2017-08-18 | 乐健科技（珠海）有限公司 | Circuit substrate and its manufacture method, circuit board and its manufacture method |
-
2012
- 2012-10-19 CN CN 201220536528 patent/CN202889770U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107079582A (en) * | 2017-01-22 | 2017-08-18 | 乐健科技（珠海）有限公司 | Circuit substrate and its manufacture method, circuit board and its manufacture method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130417 Termination date: 20201019 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |