CN202889771U

CN202889771U - Structure of circuit board

Info

Publication number: CN202889771U
Application number: CN 201220537990
Authority: CN
Inventors: 李建成
Original assignee: Boardtek Electronics Corp
Current assignee: Boardtek Electronics Corp
Priority date: 2012-10-19
Filing date: 2012-10-19
Publication date: 2013-04-17
Anticipated expiration: 2022-10-19

Abstract

The utility model discloses a structure of a circuit board, and mainly provides the circuit board structure of which at least one large sectional area circuit hidden in a board body is formed on a circuit board base material. The circuit board is mainly provided with a first circuit board base material. At least one copper foil circuit layer with small thickness is arranged on the surface of one side of the first circuit board base material, and at least one circuit groove is arranged on the surface of the other side of the first circuit board base material. The copper foil circuit layer can be exposed on the bottom of the circuit groove by the circuit groove, and a large sectional area circuit conductor is covered in the at least one circuit groove and is invaginated or extruded on the surface of the first circuit board base material, and a semi-solidified adhesive layer is covered on the surfaces of the first circuit board base material and the large sectional area circuit, so that smoothness of the surface of the structure of the circuit board is maintained.

Description

The structure of circuit board

Technical field

The structure of the relevant a kind of circuit board of the utility model refers to a kind of structure that the circuit board of circuit is amassed at least one heavy in section that is hidden in plate body inside that forms especially on board substrate.

Background technology

Press, circuit board has become the main bearing substrate of general electronics, electric equipment products, owing to be laid with complicated conducting wire and various electronic component on the circuit board, makes the function that reaches the expection running by the circulation of electric current, various signals.The available circuit plate is because cooperating the demand of electronic equipment running, some zone needs the larger electric current of circulation, such as: its some zone of the circuit board of power supply unit needs by large electric current (power supply such as electromagnetic coil drive is supplied framework etc.), so, need possess the predetermined set that the larger electric current of circulation is arranged in some zone of this circuit board, for the running of relevant device.

Known associated circuit board is provided with copper foil circuit, and this copper foil circuit links various associated electronic components in order to telecommunication; This circuit board also has a large galvanic areas; When this circuit board through the plug-in unit of surface mount technology (SMT) and after crossing the tin stove, slowly weld with manual type in this large galvanic areas and to add tin, make form an area more greatly, thicker tin zone section, this tin zone section of mat allows that large electric current passes through.

So, this known techniques with the shortcoming of artificial secondary operations is: increase labor hour 1.; 2. when constantly with artificial, because flatiron temperature is high, and add time of staying of tin operation at this place of a specified duration, so the disappearance misgivings of heat waste peripheral cell are arranged; 3. artificial treatment is overflow tin easily and is caused line short; 4. often cause profile not attractive in appearance after the artificial, diminish texture.

Summary of the invention

The technical problem that the utility model solves is namely providing a kind of structure of amassing the circuit board of circuit at least one heavy in section that is hidden in plate body inside of board substrate formation.

The technological means that the utility model adopts is as follows.

Circuit board of the present utility model mainly is provided with the first circuit board base material, this first circuit board base material one side surface is provided with the copper foil circuit layer of at least one thinner thickness, this first circuit board base material in addition side surface then forms at least one circuit groove, this circuit groove can make this copper foil circuit layer appear in its bottom, and in this at least one circuit groove and fill out and be covered with the long-pending circuit conductor in heavy in section, the long-pending circuit conductor in this heavy in section is recessed into or protrudes from this first circuit board substrate surface, and this first circuit board backing material plate face and this heavy in section are amassed circuit surface and are coated with the semi-solid preparation glue-line, and keep the smooth of surface.

Described circuit board can have two overlapped gummeds of first circuit board base material to fix, and is provided with at least one conductor that connects in order to consist of predetermining circuit between each first circuit board.

At least one second circuit plate substrate that is provided with at least one copper foil circuit layer further is provided, with this first circuit board base material and the overlapped gummed of this at least one second circuit plate substrate, and between this at least one first circuit board and this at least one second circuit plate substrate, be provided with at least one conductor that connects in order to consist of predetermining circuit.

Further be provided with metallic film between the long-pending circuit conductor in described circuit groove inwall and this heavy in section.

The beneficial effect that the utility model produces is to obtain a kind of structure that the circuit board of circuit is amassed at least one heavy in section that is hidden in plate body inside that forms on board substrate.

Description of drawings

Fig. 1 is the structural representation of the first embodiment circuit board in the utility model.

Fig. 2 is the structural representation of the second embodiment circuit board in the utility model.

Fig. 3 is the structural representation of the 3rd embodiment circuit board in the utility model.

Fig. 4 is the structural representation of the 4th embodiment circuit board in the utility model.

Fig. 5 is the structural representation of the 5th embodiment circuit board in the utility model.

The figure number explanation:

10 first circuit board base materials

101 first surfaces

102 second surfaces

11 copper foil circuit layers

12 circuit grooves

Circuit conductor is amassed in 13 heavies in section

14 semi-solid preparation glue-lines

15 conductors

20 second circuit plate substrates

21 copper foil circuit layers

30 semi-solid preparation films.

Embodiment

Shown in the structural representation of Fig. 1 the utility model the first embodiment board structure of circuit, circuit board of the present utility model mainly is provided with a first circuit board base material 10, and these first circuit board base material 10 1 side surfaces are provided with the copper foil circuit layer 11 of at least one thinner thickness; When implementing, this first circuit board base material 10 is provided with corresponding first surface 101 and second surface 102, this first circuit board base material 10 can be provided with copper foil circuit layer 11 at first surface 101, or first, second surface 101,102 all are provided with the copper foil circuit layer, this first circuit board base material 10 in addition side surface (embodiment as shown in the figure is second surface 102) then forms at least one circuit groove 12, this circuit groove 12 can make the copper foil circuit layer 11 that is positioned at this first surface 101 appear in its bottom, and in this at least one circuit groove 12 and fill out and be covered with the long-pending circuit conductor 13 in heavy in section, the long-pending circuit conductor in this heavy in section protrudes from the second surface 102 of this first circuit board base material, and these first circuit board base material 10 plate faces and this heavy in section are amassed circuit 13 surfaces and are coated with semi-solid preparation glue-line 14, and keep the smooth of surface; When implementing, this at least one circuit groove 12 can be connected with copper foil circuit layer 11 in the precalculated position, the state that graphic representation circuit groove 12 bronze medals are connected with paper tinsel circuit layer 11; Certainly, in the specific implementation, the circuit groove also can not be connected with the copper foil circuit layer; And the long-pending circuit conductor in this heavy in section can also be for being recessed in the form of this first circuit board substrate surface.

Circuit board of the present utility model can form the circuit (a kind of circuit that is made of copper foil circuit layer 12 wherein, another kind of be overlying in the circuit groove 12 and relatively imbed the circuit that the long-pending circuit 13 in heavy in section in the plate body consists of by filling out) of at least two kinds of different-thickness (different cross-sectional) on same board substrate; When using, can be for utilizing the thinner circuit of thickness (circuit that is consisted of by copper foil circuit layer 12) as the transmission of control signal (digital control signal), and utilize the thicker circuit of thickness (amassing the circuit that circuit 13 consists of by the heavy in section) to transmit powerful drive current, so that to reduce the impedance of drive current, avoid circuit burnout or the reduction operational effectiveness because printed circuit board (PCB) is overheated.

Circuit board of the present utility model also can utilize the thicker circuit of thickness (amassing the circuit that circuit 13 consists of by the heavy in section) as the waste heat discharge passage of circuit board when using, and makes circuit board be able to normal effect and keeps due task performance.

Moreover, the utility model is when implementing, except can all being provided with the copper foil circuit layer at two plate faces, make formation one have the circuit board of plural copper foil circuit layer 11, using increases outside the Circnit Layout density, also can be as shown in Figure 2, further will at least two first circuit board base material 10 overlapped gummeds (with the semi-solid preparation film 30 shown in scheming with plural first circuit board base material 10 overlapped gummeds), and between each first circuit board base material 10, be provided with as shown in Figure 3 at least one conductor 15 that connects in order to consist of predetermining circuit, make the circuit board of obtaining a kind of multi-layer plate-type, can reach equally the purpose that increases Circnit Layout density.

Also can be as shown in Figure 4, at least one second circuit plate substrate 20 that is provided with at least one copper foil circuit layer 21 further is provided, with at least one first circuit board base material 10 and these at least one second circuit plate substrate 20 overlapped gummeds (will lack a first circuit board base material 10 and at least one second circuit plate substrate 20 overlapped gummeds with the semi-solid preparation film 30 shown in scheming), and as shown in Figure 5, between this at least one first circuit board 10 and this at least one second circuit plate substrate 20, be provided with at least one conductor 15 that connects in order to consist of predetermining circuit, reach the purpose that the purpose that increases Circnit Layout density reaches increases Circnit Layout density.

Because the utility model is imbedded thickness the plate face of first circuit board base material 10 greater than the circuit main body of copper foil circuit layer 11, therefore when being applied to the multi-layer sheet gummed, a large amount of prepreg (semi-solid preparation film) filler not, when being not easy pressing occurs because of resin flows too much or not enough slide plate and the cavity problem of causing, can not make glass directly contact reliability or CAF problem that the copper layer causes because a large amount of resins flow into thick copper space yet.

In addition, further be provided with the metallic film of predetermined thickness between the long-pending circuit in this circuit groove inwall and this heavy in section, amass the steadiness that engages of circuit to promote this circuit groove and this heavy in section.

Claims

1. the structure of a circuit board, it is characterized in that, mainly be provided with a first circuit board base material, this first circuit board base material one side surface is provided with the copper foil circuit layer of at least one thinner thickness, this first circuit board base material in addition side surface then forms at least one circuit groove, this circuit groove can make this copper foil circuit layer appear in its bottom, and in this at least one circuit groove and fill out and be covered with the long-pending circuit conductor in heavy in section, the long-pending circuit conductor in this heavy in section is recessed or protrude from this first circuit board substrate surface, and this first circuit board backing material plate face and this heavy in section are amassed circuit surface and be coated with the semi-solid preparation glue-line.

2. the structure of circuit board as claimed in claim 1 is characterized in that this circuit board has two overlapped gummeds of first circuit board base material to fix, and is provided with at least one conductor that connects in order to consist of predetermining circuit between each first circuit board.

3. the structure of circuit board as claimed in claim 1, it is characterized in that, at least one second circuit plate substrate that is provided with at least one copper foil circuit layer further is provided, with this first circuit board base material and the overlapped gummed of this at least one second circuit plate substrate, and between this at least one first circuit board and this at least one second circuit plate substrate, be provided with at least one conductor that connects in order to consist of predetermining circuit.

4. such as the structure of arbitrary described circuit board in the claims 1 to 3, it is characterized in that, further be provided with metallic film between the long-pending circuit conductor in this circuit groove inwall and this heavy in section.