CN104349574B - Circuit board and preparation method thereof - Google Patents
Circuit board and preparation method thereof Download PDFInfo
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- CN104349574B CN104349574B CN201310327528.5A CN201310327528A CN104349574B CN 104349574 B CN104349574 B CN 104349574B CN 201310327528 A CN201310327528 A CN 201310327528A CN 104349574 B CN104349574 B CN 104349574B
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- circuit substrate
- circuit
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- insulating barrier
- layer
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
- H05K3/4617—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination characterized by laminating only or mainly similar single-sided circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0141—Liquid crystal polymer [LCP]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09563—Metal filled via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/096—Vertically aligned vias, holes or stacked vias
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
A kind of circuit board, it includes the first circuit substrate be combineding with each other and second circuit substrate.First circuit substrate includes insulating barrier, the conducting wire for high-frequency transmission and the first conductive circuit layer.The opposite sides of the insulating barrier that first circuit substrate is formed at for the conducting wire of high-frequency transmission and the first conductive circuit layer.There is groove pattern in the insulating barrier of first circuit substrate, the conducting wire for high-frequency transmission is formed in the groove pattern, and the groove pattern is formed using PRK ablation.The second circuit substrate includes insulating barrier and the second conductive circuit layer.The conducting wire of the high-frequency transmission is in contact with the insulating barrier of second circuit substrate.The insulating barrier of first circuit substrate and the insulating barrier of second circuit substrate are made of thermoplastic.The present invention also provides a kind of preparation method of circuit board.
Description
Technical field
The present invention relates to circuit board making technology, more particularly to a kind of circuit board and preparation method thereof.
Background technology
As electronic product is toward miniaturization, the development in high speed direction, circuit board is also from single-sided circuit board, double-sided PCB
Develop toward multilayer circuit board direction.Multilayer circuit board refers to the circuit board with multilayer conductive circuit, and it has more wiring
Area, higher interconnection density, thus be widely used, referring to document Takahashi, A. Ooki, N. Nagai, A.
Akahoshi, H. Mukoh, A. Wajima, M. Res. Lab., High density multilayer printed
Circuit board for HITAC M-880, IEEE Trans. on Components, Packaging, and
Manufacturing Technology, 1992, 15(4): 418-425。
In the prior art, the insulating barrier generally use in circuit board is made of materials such as polyimides, polyester.And with
The needs of high-frequency transmission, liquid crystal polymer（liquid crystal polymer）The thermoplasticity such as material, which use, to be applied to make electricity
The insulating barrier of road plate.In the manufacturing process of circuit board, what the making generally use for the conducting wire of high-frequency conduction etched
Mode is formed, also, is generally formed in the surface of liquid crystal high polymer material layer.So, due to etching precision influence, it is impossible to
Ensure the line width of the conducting wire for high-frequency transmission and the precision of line-spacing formed.It is additionally, since leading for high-frequency transmission
Electric line is formed at liquid crystal high polymer material layer surface, and when carrying out hot pressing, the conducting wire for high-frequency transmission is buried
Enter in liquid crystal high polymer material layer, the position for the conducting wire of high-frequency transmission is moved, so as to cause to keep pouring in for height
The line-spacing of defeated conducting wire produces change so that the conducting wire for high-frequency transmission can not be protected in high-frequency transmission performance
Card.
The content of the invention
Therefore, it is necessary to a kind of circuit board and preparation method thereof is provided, to solve the above problems.
A kind of circuit board, it includes the first circuit substrate be combineding with each other and second circuit substrate, the first circuit base
Plate includes insulating barrier, the conducting wire for high-frequency transmission and the first conductive circuit layer, the conductor wire for high-frequency transmission
Road and the first conductive circuit layer are formed at the opposite sides of the insulating barrier of first circuit substrate, first circuit substrate
There is groove pattern in insulating barrier, the conducting wire for high-frequency transmission is formed in the groove pattern, the groove
Figure is formed using PRK ablation, and the second circuit substrate includes insulating barrier and the second conductive circuit layer, and described
The insulating barrier of two circuit substrates is combined with the insulating barrier of the first circuit substrate, the conducting wire of the high-frequency transmission and the second electricity
The insulating barrier of base board is in contact, and second conductive circuit layer is located at the second circuit substrate away from the first circuit base
The side of plate, the insulating barrier of first circuit substrate and the insulating barrier of second circuit substrate are made of thermoplastic.
A kind of circuit board manufacturing method, including step：Two copper-clad base plates are provided, each copper-clad base plate is formed at insulation including insulating barrier
The copper foil layer of layer surface；The side away from copper foil layer forms the first groove pattern in the insulating barrier of wherein one copper-clad base plate；
Conducting metal, which is formed, in first groove pattern obtains the conducting wire for high-frequency transmission；By the copper foil layer system
Make to form the first conductive circuit layer, obtain the first circuit substrate；The copper foil layer of another copper-clad base plate is made and to form second and leads
Electric line layer, so as to obtain second circuit substrate；And pressing first circuit substrate and second circuit substrate so that first
The insulating barrier of circuit substrate and the insulating barrier of second circuit substrate be combined with each other, conducting wire and the second electricity for high-frequency transmission
The insulating barrier of base board is in contact.
Circuit board that the technical program provides and preparation method thereof, needs to make multiple electricity according to board design first
Base board, the insulating barrier of each circuit substrate are made of thermoplastic.Also, wherein at least one circuit substrate is making
When, formed with the conducting wire for high-frequency transmission.The conducting wire for high-frequency transmission is led to by elder generation in insulating barrier
Cross laser and form corresponding groove pattern, then form conducting metal in groove pattern again and formed.So, by multiple circuit bases
Plate carries out pressing and formed in circuit boards, because the conducting wire for high-frequency transmission has been embedded in insulating barrier,
It is formed at compared to the conducting wire for being used for high-frequency transmission in the prior art by way of pressing in insulating barrier, can avoids using
It is moved in the position of the conducting wire of high-frequency transmission, and causes the line-spacing of the conducting wire for high-frequency transmission to produce change
Change so that the conducting wire for high-frequency transmission can not be guaranteed in high-frequency transmission performance.
Brief description of the drawings
Fig. 1 is the diagrammatic cross-section for the copper-clad base plate that the technical program embodiment provides.
Fig. 2 is the diagrammatic cross-section formed in the insulating barrier of Fig. 1 copper-clad base plate after the first groove pattern and the first perforate.
Fig. 3 is the diagrammatic cross-section after being formed in Fig. 2 the first groove pattern for the conducting wire of high-frequency transmission.
Fig. 4 is to form conducting metal in Fig. 3 the first perforate to obtain the sectional view after the first conductive hole.
Fig. 5 is that the copper foil layer in Fig. 4 makes to form the first conductive circuit layer and obtain the signal of the section after the first circuit substrate
Figure.
Fig. 6 to Fig. 7 is the schematic diagram of second circuit substrate manufacture process.
Fig. 8 is to press the diagrammatic cross-section after the first circuit substrate and second circuit substrate.
Fig. 9 is the diagrammatic cross-section for the circuit board that the technical program first embodiment provides.
Figure 10 to Figure 12 is the process schematic for making tertiary circuit substrate.
Figure 13 is the diagrammatic cross-section of the 4th circuit substrate made.
Figure 14 is the diagrammatic cross-section after the circuit substrate of pressing first, second, third and the 4th.
The diagrammatic cross-section for the circuit board that Figure 15 the technical program first embodiment provides.
Main element symbol description
| Copper-clad base plate | 10 |
| Insulating barrier | 11 |
| Copper foil layer | 12 |
| First perforate | 113 |
| First line groove pattern | 114 |
| Conducting wire for high-frequency transmission | 115 |
| First conductive material | 116 |
| First conductive hole | 117 |
| First conductive circuit layer | 118 |
| First substrate | 110 |
| Second perforate | 121 |
| Second conductive material | 122 |
| Second conductive hole | 123 |
| Second conductive circuit layer | 124 |
| Second substrate | 120 |
| Circuit board | 100、200 |
| First welding resisting layer | 150、250 |
| First opening | 151、251 |
| First electric contact mat | 1181、1321 |
| Second welding resisting layer | 160、260 |
| Second opening | 161、261 |
| Second electric contact mat | 1181、2421 |
| First insulating substrate | 131 |
| First surface | 1311 |
| Second surface | 1312 |
| Second line groove figure | 1313 |
| 3rd conductive circuit layer | 132 |
| 3rd perforate | 1314 |
| 3rd conductive material | 134 |
| 3rd conductive hole | 133 |
| 3rd substrate | 130 |
| Second insulating substrate | 141 |
| Tertiary circuit groove pattern | 1413 |
| 4th conductive circuit layer | 142 |
| 4th conductive hole | 143 |
| Tetrabasal | 140 |
Following embodiment will combine above-mentioned accompanying drawing and further illustrate the present invention.
Embodiment
Multilayer circuit board provided below in conjunction with drawings and Examples the technical program and preparation method thereof is made into one
The detailed description of step.
The preparation method for the multilayer circuit board that the technical program embodiment provides comprises the following steps：
The first step, also referring to Fig. 1 to Fig. 5, make the first circuit substrate 110.
The making of first circuit substrate 110 comprises the following steps:
First, there is provided copper-clad base plate 10.Each copper-clad base plate 10 includes an insulating barrier 11 and is bonded in insulating barrier 11
The copper foil layer 12 of side.
Insulating barrier 11 is made up of thermoplastic, it is however preferred to have low water absorption, low thermal coefficient of expansion, high heat-resisting and Halogen
The thermotropic liquid crystal high polymer material of the characteristics such as plain high fire-retardance, to obtain that there is the characteristics such as high-dimensional stability, high-fire resistance
Multilayer circuit board.
Then, multiple first perforates 113 and first line groove pattern 114 are formed in the insulating barrier 11.
First perforate 113 runs through the insulating barrier 11 so that the copper foil layer 12 is from the bottom of each first perforate 113
Expose in portion.First perforate 113 is formed using laser ablation mode, and the laser can form swashing for perforate to be various
Light.Such as Ultra-Violet Laser, carbon dioxide laser.The first line groove pattern 114 is used for high-frequency transmission with what is be subsequently formed
Conducting wire it is corresponding, the line groove figure 114 is from the surface of the insulating barrier 11 away from copper foil layer 12 to insulating barrier
11 inside extension.The distribution and the distribution for the conducting wire for high-frequency transmission to be formed of the line groove figure 114
It is corresponding.The depth of the line groove figure 114 is corresponding with the thickness of the conducting wire for high-frequency transmission.The circuit
Groove pattern 114 is formed using PRK ablation, the depth and width of the line groove figure 114 formed with accurate control
And the precision of the spacing between adjacent grooves meets the needs of the conducting wire for high-frequency transmission.
Then, the conducting wire 115 for high-frequency transmission is formed in the line groove figure 114.
The conducting wire 115 for high-frequency transmission can be formed by the way of electroless copper or electro-coppering.Institute
State and be embedded in for the conducting wire 115 of high-frequency transmission in the insulating barrier 11.
Then, the first conductive material 116 is filled in each first perforate 113, to obtain the first conductive hole 117.
, can be conductive to obtain first by the filling conductive paste in the first perforate 113, such as copper cream in the present embodiment
Hole 117.
Finally, the copper foil layer 12 is made to form the first conductive circuit layer 118, obtains the first circuit substrate 110.
This step can use image transfer technique and chemical etching process, selective removal part copper foil layer 12, so as to
Obtain the first conductive circuit layer 118.The conducting strip for being electromagnetically shielded can be included in first conductive circuit layer 118.
Second step, Fig. 1, Fig. 6 and Fig. 7 are referred to, make second circuit substrate 120.
The making of the second circuit substrate 120 comprises the following steps:
First, referring to Fig. 1, providing another copper-clad base plate 10.
Then, the second perforate 121 is formed in the insulating barrier 11, and filling second is led in second perforate 121
Electric material 122, so as to obtain the second conductive hole 123, multiple second conductive holes 123 correspond with multiple first conductive holes 117.
Being formed for second perforate 121 can be identical with forming the method for the first perforate 113.And second conductive material
122 filling can be identical with the fill method of the first conductive material 116.
Finally, copper foil layer 12 is made to form the second conductive circuit layer 124.This step can use image transfer technique and
Chemical etching process, selective removal part copper foil layer 12, so as to obtain the second conductive circuit layer 124.Second conductor wire
The conducting strip for being electromagnetically shielded can be included in road floor 124.
3rd step, referring to Fig. 8, pressing first circuit substrate 110 and second circuit substrate 120, so as to obtain electricity
Road plate 100.
In this step, first circuit substrate 110 and second circuit substrate 120 are pressed by the way of hot pressing, is made
The insulating barrier 11 of the insulating barrier 11 and second circuit substrate 120 that obtain the first circuit substrate 110 be combined with each other, the first circuit substrate
110 and second circuit substrate 120 be combined with each other.Under the effect of the pressure, first conductive circuit layer 118 is embedded to described first
In the insulating barrier 11 of circuit substrate 110, second conductive circuit layer 124 is embedded to the insulating barrier of the second circuit substrate 120
In 11.Each second conductive hole 123 and the mutually corresponding connection of corresponding first conductive hole 117, so that the first conducting wire
Layer 118 is in electrical communication with one another with the second conductive circuit layer 124.
Referring to Fig. 9, the circuit board manufacturing method that the technical program provides can further include in circuit board 100
With respect to two surfaces form welding resisting layer respectively.In the present embodiment, formed in the side of the first conductive circuit layer 118 of circuit board 100
There is the first welding resisting layer 150, in the side of the second conductive circuit layer 124 formed with the second welding resisting layer 160.First welding resisting layer 150
It is interior to expose formed with the multiple first openings 151, the first conductive circuit layer of part 118 from the described first opening 151, form the first electricity
Property connection gasket 1181.Formed with the multiple second openings 161 in second welding resisting layer 160, the second conductive circuit layer of part 124 from
Second opening 161 is exposed, and forms multiple second electric contact mats 1241.
Also referring to Fig. 8 and Fig. 9, the technical program also provides a kind of circuit board 100, and it includes first to be combined with each other
Circuit substrate 110 and second circuit substrate 120.First circuit substrate 110 includes insulating barrier 11, leading for high-frequency transmission
Electric line 115, the first conductive hole 117 and the first conductive circuit layer 118.The conducting wire 115, first for high-frequency transmission
The conductive circuit layer 118 of conductive hole 117 and first is embedded in the insulating barrier 11 of first circuit substrate 110.Described first
Conductive circuit layer 118 and conducting wire 115 for high-frequency transmission are arranged at the relative of the insulating barrier 11 of the first circuit substrate 110
Both sides.First conductive hole 117 is electrically connected to each other with the first conductive circuit layer 118.The second circuit substrate 120 includes exhausted
Edge layer 11, the second conductive hole 123 and the second conductive circuit layer 124.The electricity of insulating barrier 11 and first of the second circuit substrate 120
The insulating barrier 11 of base board 110 is combined, the conducting wire 115 of the high-frequency transmission and the insulating barrier of second circuit substrate 120
11 are in contact.The conductive circuit layer 124 of second conductive hole 123 and second is located in the insulating barrier 11 of second circuit substrate 120,
Second conductive hole 123 connects one to one with the first conductive hole 117.Second conductive circuit layer 124 is located at second circuit base
Side of the plate 120 away from the first circuit substrate 110.First conductive circuit layer 118 is located at the first circuit substrate 110 away from
The side of two circuit substrates 120.The insulating barrier 110 of first circuit substrate 110 and second circuit substrate 120 uses thermoplastic
Property material is made, and in the present embodiment, the insulating barrier 110 of first circuit substrate 110 and second circuit substrate 120 uses liquid
Polycrystalline macromolecule material is made.
The technical program second embodiment also provides a kind of preparation method of circuit board, including step:
The first step, Fig. 1 to Fig. 5 is referred to, make the first circuit substrate 110.In the present embodiment, first circuit substrate
The method that 110 preparation method makes the first circuit substrate 110 with the first step that the technical program first embodiment provides is identical.
Second step, Fig. 1, Fig. 6 and Fig. 7 are referred to, make second circuit substrate 120.In the present embodiment, the second circuit
The method that the preparation method of substrate 120 makes second circuit substrate 120 with the second step that the technical program first embodiment provides
It is identical.
3rd step, Figure 10 to Figure 13 is referred to, make tertiary circuit substrate 130 and the 4th circuit substrate 140.
The making of the tertiary circuit substrate 130 may include steps of：
First, there is provided the first insulating substrate 131.The material of first insulating substrate 131 is thermoplastic resin, is preferably
With characteristic thermotropic liquid crystal high polymer materials such as low water absorption, low thermal coefficient of expansion, high heat-resisting and halogen-free high fire-retardances, to obtain
To the multilayer circuit board with characteristics such as high-dimensional stability, high-fire resistances.First insulating substrate 131 has relative the
Three surfaces 1311 and the 4th surface 1312.
Then, the second line groove figure 1313 is formed in the first insulating substrate 131, and in the second line groove 1313
The 3rd conductive circuit layer 132 of interior formation.The second line groove figure 1313 is from the 3rd surface 1311 to the insulation
The inside of base material 131 is opened up, and the second line groove figure 1313 can be formed using laser ablation.3rd conductor wire
Road floor 132 can be formed by the way of electro-coppering or electroless copper.
Finally, multiple 3rd conductive holes 133 are formed in first insulated substrate 131.3rd conductive hole 133 with
3rd conductive circuit layer 132 mutually conducts.Specifically, formed from the 4th surface 1312 to the 3rd conductive circuit layer 132
Multiple 3rd perforates 1314, the conductive circuit layer 132 of part the 3rd are exposed from the corresponding bottom of 3rd perforate 1314.The described 3rd
The 3rd conductive material 134 of filling, obtains the 3rd conductive hole 133 in perforate 1314.3rd conductive material 134 can be conduction
Cream, preferably copper cream.
The tertiary circuit substrate 130 is identical with the preparation method of the 4th circuit substrate 140.4th circuit substrate
140 include the second insulating substrate 141, formed with tertiary circuit groove pattern 1413 in second dielectric base 141, described the
Formed with the 4th conductive circuit layer 142 in three line groove figures 1413.The 4th is also formed with second dielectric base 141
Conductive hole 143, the 4th conductive circuit layer 142 and the 4th conductive hole 143 are in electrical communication with one another.
4th step, Figure 14 is referred to, press first circuit substrate 110, second circuit substrate 120, tertiary circuit base
The circuit substrate 140 of plate 130 and the 4th, so as to obtain circuit board 200.
In this step, pressed successively by the way of hot pressing the tertiary circuit substrate 130, second circuit substrate 120,
First circuit substrate 110 and the 4th circuit substrate 140, the conducting wire 115 for high-frequency transmission of the first circuit substrate 110 with
Second circuit substrate 120 is adjacent, and the insulating barrier 11 of the first circuit substrate 110 and the insulating barrier 11 of second circuit substrate 120 are mutual
With reference to the 3rd conductive hole 133 in tertiary circuit substrate 130 connects with the second conductive circuit layer 124 of second circuit substrate 120
Touch, the 4th conductive hole 143 of the 4th circuit substrate 140 is in contact with the first conductive circuit layer 118 of the first circuit substrate 110.
Under the effect of the pressure, first conductive circuit layer 118 is embedded to the electricity of insulating barrier 11 and the 3rd of first circuit substrate 110
In the insulating barrier 1111 of base board 130, second conductive circuit layer 124 is embedded to the insulating barrier of the second circuit substrate 120
11 and the 4th circuit substrate 140 insulating barrier 11 in.Each second conductive hole 123 and corresponding first conductive hole 117 are mutually right
It should connect, so that the first conductive circuit layer 118 and the second conductive circuit layer 124 are in electrical communication with one another.Second conductive circuit layer
124 and the 3rd conductive circuit layer 132 by the 3rd conductive hole 133 be interconnected, the 4th conductive circuit layer 142 is led with first
Electric line layer 118 is in electrical communication with one another by the 4th conductive hole 143.
Figure 15 is referred to, the circuit board manufacturing method that the technical program provides can further include in circuit board 200
Relative two surfaces form welding resisting layer respectively.In the present embodiment, in the side shape of the 3rd conductive circuit layer 132 of circuit board 200
Into there is the first welding resisting layer 250, in the side of the 4th conductive circuit layer 142 formed with the second welding resisting layer 260.First welding resisting layer
Expose formed with the multiple first openings 251, the conductive circuit layer 132 of part the 3rd from the described first opening 251 in 250, form the
One electric connection pad 1321.Formed with the multiple second openings 261, the conductive circuit layer of part the 4th in second welding resisting layer 260
142 expose from the described second opening 261, form multiple second electric contact mats 2421.
Also referring to Figure 14 and Figure 15, the technical program also provides a kind of circuit board 200, and it includes to be combined with each other
Three-circuit substrate 130, the first circuit substrate 110, the circuit substrate 140 of second circuit substrate 120 and the 4th.
First circuit substrate 110 includes insulating barrier 1111, the conduction of conducting wire 115, first for high-frequency transmission
The conductive circuit layer 118 of hole 117 and first.The conducting wire 115 for high-frequency transmission, the first conductive hole 117 are embedded in
In the insulating barrier 11 of first circuit substrate 110.First conductive circuit layer 118 and the conducting wire for high-frequency transmission
115 are arranged at the opposite sides of the insulating barrier 11 of the first circuit substrate 110.The conducting wire of first conductive hole 117 and first
Layer 118 is electrically connected to each other.
The second circuit substrate 120 includes insulating barrier 11, the second conductive hole 123 and the second conductive circuit layer 124.It is described
The insulating barrier 11 of second circuit substrate 120 is combined with the insulating barrier 11 of the first circuit substrate 110, the conduction of the high-frequency transmission
Circuit 115 is in contact with the insulating barrier 11 of second circuit substrate 120.Second conductive hole 123 is located at second circuit substrate 120
Insulating barrier 11 in, second conductive hole 123 connects one to one with the first conductive hole 117.Second conductive circuit layer 124
In side of the second circuit substrate 120 away from the first circuit substrate 110.First conductive circuit layer 118 is located at the first circuit
Side of the substrate 110 away from second circuit substrate 120.First conductive circuit layer 118 passes through with the second conductive circuit layer 124
Interconnected the first conductive hole 117 and the second conductive hole 123 is in electrical communication with one another.
The tertiary circuit substrate 130 includes insulating barrier 11, the 3rd conductive circuit layer 132 and the 3rd conductive hole 133.It is described
The insulating barrier 11 of tertiary circuit substrate 130 and side of the insulating barrier 11 of second circuit substrate 120 away from the first circuit substrate 110
It is combined.3rd conductive circuit layer 132 and the 3rd conductive hole 133 are formed in the insulating barrier 11 of tertiary circuit substrate 130.
3rd conductive circuit layer 132 is embedded in one of the insulating barrier 11 of tertiary circuit substrate 130 away from the first circuit substrate 110
Side.3rd conductive circuit layer 132 is mutually conducted with the second conductive circuit layer 124 by the 3rd conductive hole 123.Described
Two conductive circuit layers 124 are embedded in the insulating barrier 11 of tertiary circuit substrate 130.
4th circuit substrate 140 includes insulating barrier 11, the 4th conductive circuit layer 142 and the 4th conductive hole 143.It is described
Side of the insulating barrier 11 away from second circuit substrate 120 of the circuit substrate 110 of insulating barrier 11 and first of 4th circuit substrate 140
It is combined.4th conductive circuit layer 142 and the 4th conductive hole 143 are formed in the insulating barrier 11 of the 4th circuit substrate 140.
4th conductive circuit layer 142 is embedded in one of the insulating barrier 11 of the 4th circuit substrate 140 away from the first circuit substrate 110
Side.4th conductive circuit layer 142 is mutually conducted with the first conductive circuit layer 118 by the 4th conductive hole 143.Described
One conductive circuit layer 118 is embedded in the insulating barrier 11 of the 4th circuit substrate 140.
Insulating barrier 11 in each circuit substrate is made of liquid crystal high polymer material.
Circuit board that the technical program provides and preparation method thereof, needs to make multiple electricity according to board design first
Base board, the insulating barrier of each circuit substrate are made of thermoplastic.Also, wherein at least one circuit substrate is making
When, formed with the conducting wire for high-frequency transmission.The conducting wire for high-frequency transmission is led to by elder generation in insulating barrier
Cross laser and form corresponding groove pattern, then form conducting metal in groove pattern again and formed.So, by multiple circuit bases
Plate carries out pressing and formed in circuit boards, because the conducting wire for high-frequency transmission has been embedded in insulating barrier,
It is formed at compared to the conducting wire for being used for high-frequency transmission in the prior art by way of pressing in insulating barrier, can avoids using
It is moved in the position of the conducting wire of high-frequency transmission, and causes the line-spacing of the conducting wire for high-frequency transmission to produce change
Change so that the conducting wire for high-frequency transmission can not be guaranteed in high-frequency transmission performance.
Further, because groove pattern corresponding to the conducting wire for high-frequency transmission is formed using PRK,
It can ensure that line width and the line-spacing of the conducting wire for the high-frequency transmission to be formed are accurate, meet the needs of high-frequency transmission.
It is understood that for the person of ordinary skill of the art, it can be conceived with the technique according to the invention and done
Go out other various corresponding changes and deformation, and all these changes and deformation should all belong to the protection model of the claims in the present invention
Enclose.
Claims (8)
1. a kind of circuit board, it includes the first circuit substrate be combineding with each other and second circuit substrate, first circuit substrate
Conducting wire and the first conductive circuit layer including insulating barrier, for high-frequency transmission, the conducting wire for high-frequency transmission
And first conductive circuit layer be formed at first circuit substrate insulating barrier opposite sides, first circuit substrate it is exhausted
There is groove pattern in edge layer, the conducting wire for high-frequency transmission is formed in the groove pattern, the groove figure
Shape is formed using PRK ablation, and the second circuit substrate includes insulating barrier and the second conductive circuit layer, and described second
The insulating barrier of circuit substrate is combined with the insulating barrier of first circuit substrate, the conducting wire of the high-frequency transmission with it is described
The insulating barrier of second circuit substrate is in contact, and second conductive circuit layer is located at the second circuit substrate away from described first
The insulating barrier of the side of circuit substrate, the insulating barrier of first circuit substrate and the second circuit substrate uses thermoplasticity
Material is made, formed with the first conductive hole, first conductive hole and the first conductive circuit layer phase in first circuit substrate
Mutually electrical connection, the second circuit substrate are interior formed with the second conductive hole, second conductive hole and second conducting wire
Layer is electrically connected to each other, and second conductive hole and first conductive hole are corresponded and connected, first conductive circuit layer with
Second conductive circuit layer is interconnected by first conductive hole and second conductive hole, first conductive hole and
Conductive paste is filled with second conductive hole, includes being used in first conductive circuit layer and second conductive circuit layer
The conducting strip of electromagnetic shielding.
2. circuit board as claimed in claim 1, it is characterised in that the insulating barrier of first circuit substrate and second electricity
The insulating barrier of base board is made of liquid crystal high polymer material.
3. circuit board as claimed in claim 1, it is characterised in that first conductive circuit layer is embedded in first circuit
Side of the insulating barrier of substrate away from the second circuit substrate, second conductive circuit layer are embedded in the second circuit base
Side of the insulating barrier of plate away from first circuit substrate.
4. circuit board as claimed in claim 1, it is characterised in that the circuit board also includes tertiary circuit substrate and the 4th electricity
Base board, the tertiary circuit substrate include insulating barrier and the 3rd conductive circuit layer, the insulating barrier of the tertiary circuit substrate
It is be combined with each other with the insulating barrier of the second circuit substrate, the 3rd conductive circuit layer is formed at the tertiary circuit substrate
Not in the side away from the second circuit substrate in insulating barrier, the 4th circuit substrate includes insulating barrier and the 4th conduction
Line layer, the insulating barrier of the 4th circuit substrate is with the insulating barrier of first circuit substrate away from the second circuit substrate
Side be combined, the 4th conductive circuit layer is formed in the insulating barrier of the 4th circuit substrate not in away from described
The insulating barrier of the side of first circuit substrate, the insulating barrier of the tertiary circuit substrate and the 4th circuit substrate is using warm
Plastic material is made.
5. circuit board as claimed in claim 4, it is characterised in that the insulating barrier of the tertiary circuit substrate and the 4th electricity
The insulating barrier of base board is made of liquid crystal high polymer material.
6. a kind of preparation method of circuit board, including step：
Two copper-clad base plates are provided, each copper-clad base plate includes the copper foil layer that insulating barrier is formed at the surface of insulating layer,
The side away from the copper foil layer forms groove pattern in the insulating barrier of wherein one copper-clad base plate；
Conducting metal is formed in the groove pattern and obtains the conducting wire for high-frequency transmission；
The copper foil layer is made to form the first conductive circuit layer, obtains the first circuit substrate, in first conductive circuit layer
Including the conducting strip for electromagnetic shielding；
The copper foil layer of another copper-clad base plate is made to form the second conductive circuit layer, so as to obtain second circuit base
Plate, the interior conducting strip included for being electromagnetically shielded of second conductive circuit layer；
The first conductive hole is formed in first circuit substrate, the second conductive hole, institute are formed in the second circuit substrate
State in the first conductive hole and second conductive hole and be filled with conductive paste；And
Press first circuit substrate and the second circuit substrate so that the insulating barrier of first circuit substrate and described
The insulating barrier of second circuit substrate be combined with each other, and the conducting wire for high-frequency transmission is exhausted with the second circuit substrate
Edge layer is in contact, and first conductive hole and second conductive hole connect one to one, first conductive circuit layer and institute
The second conductive circuit layer is stated mutually to conduct by first conductive hole and second conductive hole.
7. circuit board manufacturing method as claimed in claim 6, it is characterised in that the groove pattern is burnt using PRK
Erosion is formed.
8. circuit board manufacturing method as claimed in claim 6, it is characterised in that pressing first circuit substrate and described the
Before two circuit substrates, in addition to make tertiary circuit substrate and the 4th circuit substrate, press first circuit substrate and
During the second circuit substrate, the tertiary circuit substrate and the 4th circuit substrate are also pressed in the lump so that the described 3rd
Circuit substrate is formed at the second circuit substrate side, and the 4th circuit substrate is formed at first circuit substrate one
The preparation method of side, the tertiary circuit substrate and the 4th circuit substrate includes respectively：
Insulating substrate is provided, the insulating substrate is made of thermoplastic；
The second groove pattern is formed in the one lateral insulating substrate of insulating substrate, and is formed in second groove pattern
Conducting metal forms conducting wire；
The 3rd conductive hole is formed in the insulating substrate, the 3rd conductive hole is formed at second groove pattern with described
Interior conducting wire is connected with each other, and the 3rd conductive hole is used to electrically connect conducting wire and the institute in second groove pattern
State the first conductive circuit layer or second conductive circuit layer.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310327528.5A CN104349574B (en) | 2013-07-31 | 2013-07-31 | Circuit board and preparation method thereof |
| TW102129412A TWI531284B (en) | 2013-07-31 | 2013-08-16 | Circuit board and method for manufacturing same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310327528.5A CN104349574B (en) | 2013-07-31 | 2013-07-31 | Circuit board and preparation method thereof |
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| Publication Number | Publication Date |
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| CN104349574A CN104349574A (en) | 2015-02-11 |
| CN104349574B true CN104349574B (en) | 2018-02-02 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201310327528.5A Active CN104349574B (en) | 2013-07-31 | 2013-07-31 | Circuit board and preparation method thereof |
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| Country | Link |
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| CN (1) | CN104349574B (en) |
| TW (1) | TWI531284B (en) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106163124A (en) * | 2015-04-02 | 2016-11-23 | 富葵精密组件(深圳)有限公司 | Circuit board manufacturing method |
| CN107027241B (en) * | 2016-02-02 | 2019-07-02 | 景硕科技股份有限公司 | Has the increasing layer carrying board structure of magnetic induction coil and soft board |
| CN108701681B (en) * | 2016-02-15 | 2021-04-27 | 川斯普公司 | EMI shielded integrated circuit package and method of making same |
| US10256028B2 (en) | 2016-03-31 | 2019-04-09 | Kinsus Interconnect Technology Corp. | Buildup board structure |
| CN105848409B (en) * | 2016-05-11 | 2019-03-19 | 昆山龙朋精密电子有限公司 | A kind of FPC plate of low-loss high flexibility high-frequency transmission |
| CN105828517B (en) * | 2016-05-11 | 2019-03-15 | 昆山龙朋精密电子有限公司 | A kind of preparation method of the FPC plate of low-loss high flexibility high-frequency transmission |
| CN111182741B (en) * | 2018-11-09 | 2021-08-20 | 庆鼎精密电子（淮安）有限公司 | Flexible circuit board and manufacturing method thereof |
| CN112449514B (en) * | 2019-08-31 | 2022-12-20 | 鹏鼎控股(深圳)股份有限公司 | Multilayer circuit board and manufacturing method thereof |
| CN112492737A (en) * | 2019-09-11 | 2021-03-12 | 宏启胜精密电子(秦皇岛)有限公司 | Circuit board and method for manufacturing circuit board |
| CN112543550A (en) * | 2020-11-17 | 2021-03-23 | 惠州市特创电子科技股份有限公司 | Multilayer circuit board, board body and processing method thereof |
| CN115884494A (en) * | 2021-09-28 | 2023-03-31 | 深南电路股份有限公司 | Circuit embedded method and circuit embedded PCB |
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Also Published As
| Publication number | Publication date |
|---|---|
| TW201517712A (en) | 2015-05-01 |
| TWI531284B (en) | 2016-04-21 |
| CN104349574A (en) | 2015-02-11 |
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