CN104349574A - Circuit board and manufacturing method thereof - Google Patents
Circuit board and manufacturing method thereof Download PDFInfo
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- CN104349574A CN104349574A CN201310327528.5A CN201310327528A CN104349574A CN 104349574 A CN104349574 A CN 104349574A CN 201310327528 A CN201310327528 A CN 201310327528A CN 104349574 A CN104349574 A CN 104349574A
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- circuit substrate
- circuit
- conductive
- insulating barrier
- layer
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
- H05K3/4617—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination characterized by laminating only or mainly similar single-sided circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0141—Liquid crystal polymer [LCP]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09563—Metal filled via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/096—Vertically aligned vias, holes or stacked vias
Abstract
The invention provides a circuit board which comprises a first circuit substrate and a second circuit substrate which are mutually combined, wherein the first circuit substrate comprises an insulation layer, a conductive circuit for high-frequency transmission and a first conductive circuit layer; the conductive circuit for high-frequency transmission and the first conductive circuit layer are formed on two opposite sides of the insulation layer of the first circuit substrate; the insulation layer of the first circuit substrate is internally provided with a groove pattern; the conductive circuit for high-frequency transmission is formed in the groove pattern; the groove pattern is formed by virtue of excimer laser ablation; the second circuit substrate comprises an insulation layer and a second conductive circuit layer; the conductive circuit for high-frequency transmission is contacted with the insulation layer of the second circuit substrate; the insulation layer of the first circuit substrate and the insulation layer of the second circuit substrate are both made from a thermoplastic material. The invention also provides a manufacturing method of the circuit board.
Description
Technical field
The present invention relates to circuit board making technology, particularly relate to a kind of circuit board and preparation method thereof.
Background technology
Along with electronic product is toward development that is miniaturized, high speed direction, circuit board is also from single-sided circuit board, double-sided PCB toward multilayer circuit board future development.Multilayer circuit board refers to the circuit board with multilayer conductive circuit, it has more wiring area, higher interconnect density, thus be widely used, see document Takahashi, A. Ooki, N. Nagai, A. Akahoshi, H. Mukoh, A. Wajima, M. Res. Lab., High density multilayer printed circuit board for HITAC M-880, IEEE Trans. on Components, Packaging, and Manufacturing Technology, 1992,15 (4): 418-425.
In prior art, the insulating barrier in circuit board adopts the material such as polyimides, polyester to make usually.And along with the needs of high-frequency transmission, the thermoplasticity such as liquid crystal polymer (liquid crystal polymer) material adopt the insulating barrier being applied to and making circuit board.In the manufacturing process of circuit board, the making for the conducting wire of high-frequency conduction adopts the mode of etching to be formed usually, and, be usually formed at the surface of liquid crystal high polymer material layer.Like this, due to the impact of the precision of etching, the live width of the conducting wire for high-frequency transmission and the precision of line-spacing of formation can not be ensured.And, owing to being formed at liquid crystal high polymer material layer surface for the conducting wire of high-frequency transmission, when carrying out hot pressing, the described conducting wire for high-frequency transmission is imbedded in liquid crystal high polymer material layer, position for the conducting wire of high-frequency transmission is moved, thus cause the line-spacing of the conducting wire for high-frequency transmission to change, the conducting wire for high-frequency transmission can not be guaranteed in high-frequency transmission performance.
Summary of the invention
Therefore, be necessary to provide a kind of circuit board and preparation method thereof, to solve the problem.
A kind of circuit board, it comprises the first circuit substrate and second circuit substrate that be combined with each other, described first circuit substrate comprises insulating barrier, for conducting wire and first conductive circuit layer of high-frequency transmission, the described conducting wire for high-frequency transmission and the first conductive circuit layer are formed at the relative both sides of the insulating barrier of described first circuit substrate, in the insulating barrier of described first circuit substrate, there is groove pattern, the described conducting wire for high-frequency transmission is formed in described groove pattern, described groove pattern adopts excimer laser ablation to be formed, described second circuit substrate comprises insulating barrier and the second conductive circuit layer, the insulating barrier of described second circuit substrate combines with the insulating barrier of the first circuit substrate, the conducting wire of described high-frequency transmission contacts with the insulating barrier of second circuit substrate, described second conductive circuit layer is positioned at the side of described second circuit substrate away from described first circuit substrate, the insulating barrier of described first circuit substrate and the insulating barrier of second circuit substrate all adopt thermoplastic to make.A kind of circuit board manufacturing method, comprise step: provide two copper-clad base plates, each copper-clad base plate comprises the copper foil layer that insulating barrier is formed at surface of insulating layer; The interior side away from copper foil layer of the insulating barrier of a copper-clad base plate forms the first groove pattern wherein; In described first groove pattern, formation conducting metal obtains the conducting wire for high-frequency transmission; Described copper foil layer is made formation first conductive circuit layer, obtains the first circuit substrate; The copper foil layer of another copper-clad base plate is made formation second conductive circuit layer, thus obtains second circuit substrate; And the first circuit substrate described in pressing and second circuit substrate, the insulating barrier of the insulating barrier of the first circuit substrate and second circuit substrate is be combined with each other, and the conducting wire for high-frequency transmission contacts with the insulating barrier of second circuit substrate.
Circuit board that the technical program provides and preparation method thereof, first according to board design need make multiple circuit substrate, the insulating barrier of each circuit substrate all adopts thermoplastic to make.Further, wherein at least one circuit substrate is when making, and is formed with the conducting wire for high-frequency transmission.The described conducting wire for high-frequency transmission by first forming corresponding groove pattern by laser in insulating barrier, and then forms conducting metal formation in groove pattern.Like this, multiple circuit substrate is being carried out in pressing formation circuit boards, because the described conducting wire for high-frequency transmission has been embedded in insulating barrier, be formed at insulating barrier in for the conducting wire of high-frequency transmission by the mode of pressing compared in prior art, the position of the conducting wire for high-frequency transmission can be avoided to be moved, and cause the line-spacing of the conducting wire for high-frequency transmission to change, the conducting wire for high-frequency transmission can not be guaranteed in high-frequency transmission performance.
Accompanying drawing explanation
Fig. 1 is the generalized section of the copper-clad base plate that the technical program embodiment provides.
Fig. 2 be the copper-clad base plate of Fig. 1 insulating barrier in form the generalized section after the first groove pattern and the first perforate.
Fig. 3 forms the generalized section after for the conducting wire of high-frequency transmission in first groove pattern of Fig. 2.
Fig. 4 be Fig. 3 the first perforate in form conducting metal and obtain the cutaway view after the first conductive hole.
Fig. 5 be copper foil layer in Fig. 4 make formation first conductive circuit layer obtain the first circuit substrate after generalized section.
Fig. 6 to Fig. 7 is the schematic diagram of second circuit substrate manufacture process.
Fig. 8 is the generalized section after pressing first circuit substrate and second circuit substrate.
Fig. 9 is the generalized section of the circuit board that the technical program first embodiment provides.
Figure 10 to Figure 12 is the process schematic making tertiary circuit substrate.
Figure 13 is the generalized section of the 4th circuit substrate made.
Figure 14 is the generalized section after pressing first, second, third and the 4th circuit substrate.
The generalized section of the circuit board that Figure 15 the technical program first embodiment provides.
Main element symbol description
| Copper-clad base plate | 10 |
| Insulating barrier | 11 |
| Copper foil layer | 12 |
| First perforate | 113 |
| First line groove pattern | 114 |
| For the conducting wire of high-frequency transmission | 115 |
| First electric conducting material | 116 |
| First conductive hole | 117 |
| First conductive circuit layer | 118 |
| First substrate | 110 |
| Second perforate | 121 |
| Second electric conducting material | 122 |
| Second conductive hole | 123 |
| Second conductive circuit layer | 124 |
| Second substrate | 120 |
| Circuit board | 100、200 |
| First welding resisting layer | 150、250 |
| First opening | 151、251 |
| First electric contact mat | 1181、1321 |
| Second welding resisting layer | 160、260 |
| Second opening | 161、261 |
| Second electric contact mat | 1181、2421 |
| First insulating substrate | 131 |
| First surface | 1311 |
| Second surface | 1312 |
| Second line groove figure | 1313 |
| 3rd conductive circuit layer | 132 |
| 3rd perforate | 1314 |
| 3rd electric conducting material | 134 |
| 3rd conductive hole | 133 |
| 3rd substrate | 130 |
| Second insulating substrate | 141 |
| Tertiary circuit groove pattern | 1413 |
| 4th conductive circuit layer | 142 |
| 4th conductive hole | 143 |
| Tetrabasal | 140 |
Following embodiment will further illustrate the present invention in conjunction with above-mentioned accompanying drawing.
Embodiment
Below in conjunction with drawings and Examples, multilayer circuit board that the technical program provides and preparation method thereof is described in further detail.
The manufacture method of the multilayer circuit board that the technical program embodiment provides comprises the following steps:
The first step, sees also Fig. 1 to Fig. 5, makes the first circuit substrate 110.
The making of described first circuit substrate 110 comprises the steps:
First, copper-clad base plate 10 is provided.Each copper-clad base plate 10 includes an insulating barrier 11 and is bonded in the copper foil layer 12 of insulating barrier 11 side.
Insulating barrier 11 is made for thermoplastic, preferably there is the thermotropic liquid crystal high polymer material of the characteristics such as low water absorption, low thermal coefficient of expansion, high heat-resisting and halogen high flame retardant, to obtain the multilayer circuit board with the characteristic such as high-dimensional stability, high-fire resistance.
Then, in described insulating barrier 11, multiple first perforate 113 and first line groove pattern 114 is formed.
Described first perforate 113 runs through described insulating barrier 11, and described copper foil layer 12 is exposed from the bottom of each first perforate 113.Described first perforate 113 adopts laser ablation mode to be formed, and described laser can be the various laser that can form perforate.As Ultra-Violet Laser, carbon dioxide laser etc.Described first line groove pattern 114 is corresponding with the conducting wire for high-frequency transmission of follow-up formation, and described line groove figure 114 extends to the inside of insulating barrier 11 from the surface of described insulating barrier 11 away from copper foil layer 12.The distribution of described line groove figure 114 is corresponding with the distribution of the conducting wire for high-frequency transmission for being formed.The degree of depth of described line groove figure 114 is corresponding with the thickness of the conducting wire for high-frequency transmission.Described line groove figure 114 adopts excimer laser ablation to be formed, and meets the needs of the conducting wire for high-frequency transmission with the precision accurately controlling the spacing between the degree of depth of line groove figure 114, width and adjacent grooves formed.
Then, in described line groove figure 114, form the conducting wire 115 being used for high-frequency transmission.
The described conducting wire 115 for high-frequency transmission can adopt the mode of electroless copper or electro-coppering to be formed.The described conducting wire 115 for high-frequency transmission is embedded in described insulating barrier 11.
Then, the first electric conducting material 116 is filled in each first perforate 113, to obtain the first conductive hole 117.
In the present embodiment, can filled conductive cream in the first perforate 113 be passed through, as copper cream etc., to obtain the first conductive hole 117.
Finally, described copper foil layer 12 is made formation first conductive circuit layer 118, obtain the first circuit substrate 110.
This step can adopt image transfer technique and chemical etching process, selective removal part copper layers of foil 12, thus obtains the first conductive circuit layer 118.The conducting strip for electromagnetic shielding can be comprised in described first conductive circuit layer 118.
Second step, refers to Fig. 1, Fig. 6 and Fig. 7, makes second circuit substrate 120.
The making of described second circuit substrate 120 comprises the steps:
First, refer to Fig. 1, copper-clad base plate 10 described in another is provided.
Then, in described insulating barrier 11, form the second perforate 121, and fill the second electric conducting material 122 in described second perforate 121, thus obtain the second conductive hole 123, multiple second conductive holes 123 and multiple first conductive hole 117 one_to_one corresponding.
The formation of described second perforate 121 can be identical with the method for formation first perforate 113.And second the filling of electric conducting material 122 can be identical with the fill method of the first electric conducting material 116.
Finally, copper foil layer 12 is made formation second conductive circuit layer 124.This step can adopt image transfer technique and chemical etching process, selective removal part copper layers of foil 12, thus obtains the second conductive circuit layer 124.The conducting strip for electromagnetic shielding can be comprised in described second conductive circuit layer 124.
3rd step, refers to Fig. 8, the first circuit substrate 110 and second circuit substrate 120 described in pressing, thus obtains circuit board 100.
In this step, first circuit substrate 110 and second circuit substrate 120 described in the mode pressing of employing hot pressing, the insulating barrier 11 of the first circuit substrate 110 and the insulating barrier 11 of second circuit substrate 120 are be combined with each other, and the first circuit substrate 110 and second circuit substrate 120 be combined with each other.Under the effect of the pressure, described first conductive circuit layer 118 is imbedded in the insulating barrier 11 of described first circuit substrate 110, and described second conductive circuit layer 124 is imbedded in the insulating barrier 11 of described second circuit substrate 120.Each second conductive hole 123 connects with the first corresponding conductive hole 117 is mutually corresponding, thus makes the first conductive circuit layer 118 and the second conductive circuit layer 124 electric connection mutually.
Refer to Fig. 9, the circuit board manufacturing method that the technical program provides can further include and forms welding resisting layer respectively on relative two surfaces of circuit board 100.In the present embodiment, be formed with the first welding resisting layer 150 in the first conductive circuit layer 118 side of circuit board 100, be formed with the second welding resisting layer 160 in the second conductive circuit layer 124 side.Be formed with multiple first opening 151 in described first welding resisting layer 150, part first conductive circuit layer 118 is exposed from described first opening 151, forms the first electric connection pad 1181.Be formed with multiple second opening 161 in described second welding resisting layer 160, part second conductive circuit layer 124 is exposed from described second opening 161, forms multiple second electric contact mat 1241.
See also Fig. 8 and Fig. 9, the technical program also provides a kind of circuit board 100, and it comprises the first circuit substrate 110 and second circuit substrate 120 that be combined with each other.Described first circuit substrate 110 comprises insulating barrier 11, for conducting wire 115, first conductive hole 117 of high-frequency transmission and the first conductive circuit layer 118.Described conducting wire 115, first conductive hole 117 for high-frequency transmission and the first conductive circuit layer 118 are all embedded in the insulating barrier 11 of described first circuit substrate 110.Described first conductive circuit layer 118 and be arranged at the relative both sides of insulating barrier 11 of the first circuit substrate 110 for the conducting wire 115 of high-frequency transmission.Described first conductive hole 117 and the first conductive circuit layer 118 are electrically connected to each other.Described second circuit substrate 120 comprises insulating barrier 11, second conductive hole 123 and the second conductive circuit layer 124.The insulating barrier 11 of described second circuit substrate 120 combines with the insulating barrier 11 of the first circuit substrate 110, and the conducting wire 115 of described high-frequency transmission contacts with the insulating barrier 11 of second circuit substrate 120.Described second conductive hole 123 and the second conductive circuit layer 124 are positioned at the insulating barrier 11 of second circuit substrate 120, and described second conductive hole 123 and the first conductive hole 117 connect one to one.Second conductive circuit layer 124 is positioned at the side of second circuit substrate 120 away from the first circuit substrate 110.Described first conductive circuit layer 118 is positioned at the side of the first circuit substrate 110 away from second circuit substrate 120.The insulating barrier 110 of described first circuit substrate 110 and second circuit substrate 120 all adopts thermoplastic to make, and in the present embodiment, the insulating barrier 110 of described first circuit substrate 110 and second circuit substrate 120 all adopts liquid crystal high polymer material to make.
The technical program second embodiment also provides a kind of manufacture method of circuit board, comprises step:
The first step, refers to Fig. 1 to Fig. 5, makes the first circuit substrate 110.In the present embodiment, the manufacture method of described first circuit substrate 110 is identical with the method that the first step that the technical program first embodiment provides makes the first circuit substrate 110.
Second step, refers to Fig. 1, Fig. 6 and Fig. 7, makes second circuit substrate 120.In the present embodiment, the manufacture method of described second circuit substrate 120 is identical with the method that the second step that the technical program first embodiment provides makes second circuit substrate 120.
3rd step, refers to Figure 10 to Figure 13, makes tertiary circuit substrate 130 and the 4th circuit substrate 140.
The making of described tertiary circuit substrate 130 can comprise the steps:
First, the first insulating substrate 131 is provided.The material of described first insulating substrate 131 is thermoplastic resin, preferably there is the characteristic thermotropic liquid crystal high polymer materials such as low water absorption, low thermal coefficient of expansion, high heat-resisting and halogen high flame retardant, to obtain the multilayer circuit board with the characteristic such as high-dimensional stability, high-fire resistance.Described first insulating substrate 131 has the 3rd relative surface 1311 and the 4th surface 1312.
Then, in the first insulating substrate 131, form the second line groove figure 1313, and form the 3rd conductive circuit layer 132 in the second line groove 1313.Described second line groove figure 1313 is offered to the inside of described insulating substrate 131 from described 3rd surface 1311, and described second line groove figure 1313 can adopt laser ablation to be formed.Described 3rd conductive circuit layer 132 can adopt the mode of electro-coppering or electroless copper to be formed.
Finally, in described first insulated substrate 131, multiple 3rd conductive hole 133 is formed.Described 3rd conductive hole 133 and the 3rd conductive circuit layer 132 conduct mutually.Concrete, form multiple 3rd perforate 1314 from described 4th surface 1312 to the 3rd conductive circuit layer 132, part the 3rd conductive circuit layer 132 is exposed bottom the 3rd perforate 1314 of correspondence.In described 3rd perforate 1314, fill the 3rd electric conducting material 134, obtain the 3rd conductive hole 133.Described 3rd electric conducting material 134 can be conductive paste, is preferably copper cream.
Described tertiary circuit substrate 130 is identical with the manufacture method of the 4th circuit substrate 140.Described 4th circuit substrate 140 comprises the second insulating substrate 141, is formed with tertiary circuit groove pattern 1413, is formed with the 4th conductive circuit layer 142 in described tertiary circuit groove pattern 1413 in described second dielectric base 141.The 4th conductive hole 143 is also formed with, described 4th conductive circuit layer 142 and the 4th conductive hole 143 electric connection mutually in described second dielectric base 141.
4th step, refers to Figure 14, the first circuit substrate 110, second circuit substrate 120, tertiary circuit substrate 130 and the 4th circuit substrate 140 described in pressing, thus obtains circuit board 200.
In this step, adopt the mode tertiary circuit substrate 130 described in pressing successively of hot pressing, second circuit substrate 120, first circuit substrate 110 and the 4th circuit substrate 140, the conducting wire 115 for high-frequency transmission of the first circuit substrate 110 is adjacent with second circuit substrate 120, the insulating barrier 11 of the first circuit substrate 110 and the insulating barrier 11 of second circuit substrate 120 be combined with each other, the 3rd conductive hole 133 in tertiary circuit substrate 130 contacts with the second conductive circuit layer 124 of second circuit substrate 120, 4th conductive hole 143 of the 4th circuit substrate 140 contacts with the first conductive circuit layer 118 of the first circuit substrate 110.Under the effect of the pressure, described first conductive circuit layer 118 is imbedded in the insulating barrier 11 of described first circuit substrate 110 and the insulating barrier 1111 of tertiary circuit substrate 130, and described second conductive circuit layer 124 is imbedded in the insulating barrier 11 of described second circuit substrate 120 and the insulating barrier 11 of the 4th circuit substrate 140.Each second conductive hole 123 connects with the first corresponding conductive hole 117 is mutually corresponding, thus makes the first conductive circuit layer 118 and the second conductive circuit layer 124 electric connection mutually.Second conductive circuit layer 124 and the 3rd conductive circuit layer 132 are interconnected by the 3rd conductive hole 133, and described 4th conductive circuit layer 142 and the first conductive circuit layer 118 are by the 4th conductive hole 143 electric connection mutually.
Refer to Figure 15, the circuit board manufacturing method that the technical program provides can further include and forms welding resisting layer respectively on relative two surfaces of circuit board 200.In the present embodiment, be formed with the first welding resisting layer 250 in the 3rd conductive circuit layer 132 side of circuit board 200, be formed with the second welding resisting layer 260 in the 4th conductive circuit layer 142 side.Be formed with multiple first opening 251 in described first welding resisting layer 250, part the 3rd conductive circuit layer 132 is exposed from described first opening 251, forms the first electric connection pad 1321.Be formed with multiple second opening 261 in described second welding resisting layer 260, part the 4th conductive circuit layer 142 is exposed from described second opening 261, forms multiple second electric contact mat 2421.
See also Figure 14 and Figure 15, the technical program also provides a kind of circuit board 200, and it comprises tertiary circuit substrate 130, first circuit substrate 110, second circuit substrate 120 and the 4th circuit substrate 140 that be combined with each other.
Described first circuit substrate 110 comprises insulating barrier 1111, for conducting wire 115, first conductive hole 117 of high-frequency transmission and the first conductive circuit layer 118.Described conducting wire 115, first conductive hole 117 for high-frequency transmission is all embedded in the insulating barrier 11 of described first circuit substrate 110.Described first conductive circuit layer 118 and be arranged at the relative both sides of insulating barrier 11 of the first circuit substrate 110 for the conducting wire 115 of high-frequency transmission.Described first conductive hole 117 and the first conductive circuit layer 118 are electrically connected to each other.
Described second circuit substrate 120 comprises insulating barrier 11, second conductive hole 123 and the second conductive circuit layer 124.The insulating barrier 11 of described second circuit substrate 120 combines with the insulating barrier 11 of the first circuit substrate 110, and the conducting wire 115 of described high-frequency transmission contacts with the insulating barrier 11 of second circuit substrate 120.Described second conductive hole 123 is positioned at the insulating barrier 11 of second circuit substrate 120, and described second conductive hole 123 and the first conductive hole 117 connect one to one.Second conductive circuit layer 124 is positioned at the side of second circuit substrate 120 away from the first circuit substrate 110.Described first conductive circuit layer 118 is positioned at the side of the first circuit substrate 110 away from second circuit substrate 120.Described first conductive circuit layer 118 and the second conductive circuit layer 124 are by the first conductive hole 117 of being interconnected and the second conductive hole 123 electric connection mutually.
Described tertiary circuit substrate 130 comprises insulating barrier 11, the 3rd conductive circuit layer 132 and the 3rd conductive hole 133.The insulating barrier 11 of described tertiary circuit substrate 130 combines with the side of the insulating barrier 11 of second circuit substrate 120 away from the first circuit substrate 110.Described 3rd conductive circuit layer 132 and the 3rd conductive hole 133 are formed in the insulating barrier 11 of tertiary circuit substrate 130.Described 3rd conductive circuit layer 132 is embedded in the side of insulating barrier 11 away from the first circuit substrate 110 of tertiary circuit substrate 130.Described 3rd conductive circuit layer 132 and the second conductive circuit layer 124 are conducted mutually by the 3rd conductive hole 123.Described second conductive circuit layer 124 is embedded in the insulating barrier 11 of tertiary circuit substrate 130.
Described 4th circuit substrate 140 comprises insulating barrier 11, the 4th conductive circuit layer 142 and the 4th conductive hole 143.The insulating barrier 11 of described 4th circuit substrate 140 combines with the side of the insulating barrier 11 of the first circuit substrate 110 away from second circuit substrate 120.Described 4th conductive circuit layer 142 and the 4th conductive hole 143 are formed in the insulating barrier 11 of the 4th circuit substrate 140.Described 4th conductive circuit layer 142 is embedded in the side of insulating barrier 11 away from the first circuit substrate 110 of the 4th circuit substrate 140.Described 4th conductive circuit layer 142 and the first conductive circuit layer 118 are conducted mutually by the 4th conductive hole 143.Described first conductive circuit layer 118 is embedded in the insulating barrier 11 of the 4th circuit substrate 140.
Insulating barrier 11 in each circuit substrate all adopts liquid crystal high polymer material to make.
Circuit board that the technical program provides and preparation method thereof, first according to board design need make multiple circuit substrate, the insulating barrier of each circuit substrate all adopts thermoplastic to make.Further, wherein at least one circuit substrate is when making, and is formed with the conducting wire for high-frequency transmission.The described conducting wire for high-frequency transmission by first forming corresponding groove pattern by laser in insulating barrier, and then forms conducting metal formation in groove pattern.Like this, multiple circuit substrate is being carried out in pressing formation circuit boards, because the described conducting wire for high-frequency transmission has been embedded in insulating barrier, be formed at insulating barrier in for the conducting wire of high-frequency transmission by the mode of pressing compared in prior art, the position of the conducting wire for high-frequency transmission can be avoided to be moved, and cause the line-spacing of the conducting wire for high-frequency transmission to change, the conducting wire for high-frequency transmission can not be guaranteed in high-frequency transmission performance.
Further, because the groove pattern corresponding for the conducting wire of high-frequency transmission adopts excimer laser to be formed, can ensure the live width of the conducting wire of the high-frequency transmission formed and line-spacing accurate, meet the needs of high-frequency transmission.
Be understandable that, for the person of ordinary skill of the art, other various corresponding change and distortion can be made by technical conceive according to the present invention, and all these change the protection range that all should belong to the claims in the present invention with distortion.
Claims (10)
1. a circuit board, it comprises the first circuit substrate and second circuit substrate that be combined with each other, described first circuit substrate comprises insulating barrier, for conducting wire and first conductive circuit layer of high-frequency transmission, the described conducting wire for high-frequency transmission and the first conductive circuit layer are formed at the relative both sides of the insulating barrier of described first circuit substrate, in the insulating barrier of described first circuit substrate, there is groove pattern, the described conducting wire for high-frequency transmission is formed in described groove pattern, described groove pattern adopts excimer laser ablation to be formed, described second circuit substrate comprises insulating barrier and the second conductive circuit layer, the insulating barrier of described second circuit substrate combines with the insulating barrier of the first circuit substrate, the conducting wire of described high-frequency transmission contacts with the insulating barrier of second circuit substrate, described second conductive circuit layer is positioned at the side of described second circuit substrate away from described first circuit substrate, the insulating barrier of described first circuit substrate and the insulating barrier of second circuit substrate all adopt thermoplastic to make.
2. circuit board as claimed in claim 1, it is characterized in that, the first conductive hole is formed in described first circuit substrate, described first conductive hole and the first conductive circuit layer are electrically connected to each other, the second conductive hole is formed in described second circuit substrate, described second conductive hole and the second conductive circuit layer are electrically connected to each other, described second conductive hole is communicated with the first conductive hole one_to_one corresponding, and described first conductive circuit layer and the second conductive circuit layer are interconnected by described first conductive hole and the second conductive hole.
3. circuit board as claimed in claim 1, it is characterized in that, the insulating barrier of described first circuit board and the insulating barrier of second circuit board all adopt liquid crystal high polymer material to make.
4. circuit board as claimed in claim 1, it is characterized in that, described first conductive circuit layer is embedded in the side of insulating barrier away from second circuit substrate of described first circuit substrate, and described second conductive circuit layer is embedded in the side of insulating barrier away from the first circuit substrate of described second circuit substrate.
5. circuit board as claimed in claim 1, it is characterized in that, described circuit board also comprises tertiary circuit substrate and the 4th circuit substrate, described tertiary circuit substrate comprises insulating barrier and the 3rd conductive circuit layer, described tertiary circuit substrate insulating barrier and the insulating barrier of second circuit substrate be combined with each other, not in the side away from second circuit substrate in the insulating barrier that described 3rd conductive circuit layer is formed at tertiary circuit substrate, described 4th circuit substrate comprises insulating barrier and the 4th conductive circuit layer, the described insulating barrier of the 4th circuit substrate combines with the side of the insulating barrier of the first circuit substrate away from second circuit substrate, not in the side away from the first circuit substrate in the insulating barrier that described 4th conductive circuit layer is formed at the 4th circuit substrate, the insulating barrier of described tertiary circuit substrate and the insulating barrier of the 4th circuit substrate all adopt thermoplastic to make.
6. circuit board as claimed in claim 5, it is characterized in that, the insulating barrier of described tertiary circuit substrate and the insulating barrier of the 4th circuit substrate all adopt liquid crystal high polymer material to make.
7. a manufacture method for circuit board, comprises step:
There is provided two copper-clad base plates, each copper-clad base plate comprises the copper foil layer that insulating barrier is formed at surface of insulating layer,
The interior side away from copper foil layer of the insulating barrier of a copper-clad base plate forms groove pattern wherein;
In described line groove figure, formation conducting metal obtains the conducting wire for high-frequency transmission;
Described copper foil layer is made formation first conductive circuit layer, obtains the first circuit substrate;
The copper foil layer of another copper-clad base plate is made formation second conductive circuit layer, thus obtains second circuit substrate; And
First circuit substrate described in pressing and second circuit substrate, make the insulating barrier of the insulating barrier of the first circuit substrate and second circuit substrate be combined with each other, and the conducting wire for high-frequency transmission contacts with the insulating barrier of second circuit substrate.
8. circuit board manufacturing method as claimed in claim 7, is characterized in that, described groove pattern adopts excimer laser ablation to be formed.
9. circuit board manufacturing method as claimed in claim 7, it is characterized in that, also be included in described first circuit substrate and form the first conductive hole, the second conductive hole is formed in described second circuit substrate, after pressing, described first conductive hole and the second conductive hole connect one to one, and the first conductive circuit layer and the second conductive circuit layer are conducted mutually by the first conductive hole and the second conductive hole.
10. circuit board manufacturing method as claimed in claim 7, it is characterized in that, before the first circuit substrate described in pressing and second circuit substrate, also comprise and make tertiary circuit substrate and the 4th circuit substrate, when the first circuit substrate described described in pressing and second circuit substrate, also pressing tertiary circuit substrate and the 4th circuit substrate in the lump, tertiary circuit substrate is made to be formed at second circuit substrate side, described 4th circuit substrate is formed at the first circuit substrate side, and the manufacture method of described tertiary circuit substrate and the 4th circuit substrate comprises respectively:
There is provided insulating substrate, described insulating substrate adopts thermoplastic to make;
In insulating substrate, form the second groove pattern in described insulating substrate side, and in described second groove pattern, form conducting metal formation conducting wire;
The 3rd conductive hole is formed in described insulating substrate, described 3rd conductive hole and the described conducting wire be formed in the second groove pattern are interconnected, and described 3rd conductive hole is for being electrically connected conducting wire in described second groove pattern and the first conductive circuit layer or the second conductive circuit layer.
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| CN201310327528.5A CN104349574B (en) | 2013-07-31 | 2013-07-31 | Circuit board and preparation method thereof |
| TW102129412A TWI531284B (en) | 2013-07-31 | 2013-08-16 | Circuit board and method for manufacturing same |
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| CN201310327528.5A CN104349574B (en) | 2013-07-31 | 2013-07-31 | Circuit board and preparation method thereof |
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| CN104349574B CN104349574B (en) | 2018-02-02 |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN104349574B (en) | 2018-02-02 |
| TWI531284B (en) | 2016-04-21 |
| TW201517712A (en) | 2015-05-01 |
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