CN105530765A - Circuit board with embedded element and manufacturing method thereof - Google Patents
Circuit board with embedded element and manufacturing method thereof Download PDFInfo
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- CN105530765A CN105530765A CN201410511781.0A CN201410511781A CN105530765A CN 105530765 A CN105530765 A CN 105530765A CN 201410511781 A CN201410511781 A CN 201410511781A CN 105530765 A CN105530765 A CN 105530765A
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Abstract
The invention provides a multilayer circuit board with an embedded element, which comprises a core-layer circuit board, an electronic part, a first film, a second film and a conductive circuit layer, wherein a through mounting hole is formed in the core-layer circuit board; the electronic part is accommodated in the mounting hole; multiple conductive convex blocks are formed on the electrode of the electronic part; the sectional areas of the conductive convex blocks in the direction far away from the electrode from the electrode are gradually decreased; the first film and the second film are formed respectively at opposite two sides of the core-layer circuit board; the multiple conductive convex blocks pass through the first film; the conductive circuit layer is formed on the surface of the first film and the surface of the second film respectively; and the conductive convex blocks passing through the first film and the conductive circuit layer attached to the first film are contacted and electrically connected. The invention also relates to a method of manufacturing the above circuit board.
Description
Technical field
The present invention relates to circuit board making field, particularly relate to a kind of circuit board with embedded element and preparation method thereof.
Background technology
In order to compact object will be reached, multilayer circuit intralamellar part is embedded in each manufacturer starts to be devoted to be changed into by the electronic component being originally welded in multilayer circuit board surface, increase the wiring area of circuit board surface with this thus reduce circuit board size and reduce its weight and thickness, this electronic component can be active or passive device.Be embedded in existing multilayer circuit board mount built-in type electronic component time, need by cross reflow by tin cream welding electronic elements in circuit board, because reflow in-furnace temperature is higher, easily cause circuit board to be out of shape, thus affect quality of circuit board.
Summary of the invention
Therefore, be necessary to provide a kind of and do not need reflow and higher circuit board with embedded element of quality and preparation method thereof.
There is a manufacture method for the multilayer circuit board of embedded element, comprise step: sandwich layer circuit board is provided, described sandwich layer circuit board forms through installing hole; There is provided electronic component, the electrode of described electronic component is formed multiple conductive projection, each described conductive projection is reducing to away from the area of section on the direction of electrode gradually from described electrode; Described electronic component after forming conductive projection is contained in the installing hole of described sandwich layer circuit board, and at described sandwich layer circuit board both sides superimposed film and Copper Foil all successively; Pressing make described sandwich layer circuit board and each described Copper Foil bonding by a described film, and make each described conductive projection run through film described in one and contact with the described Copper Foil that described film is affixed and be electrically connected, thus forming circuit substrate; Each described Copper Foil is made and forms conductive circuit layer, described electronic component and described conductive circuit layer are electrically connected, thus described in being formed, there is the multilayer circuit board of embedded element.
There is a multilayer circuit board for embedded element, comprise a sandwich layer circuit board, an electronic component, the first film, the second film and conductive circuit layer.Described sandwich layer circuit board is formed with through installing hole.Described electronic component is contained in described installing hole.Multiple conductive projection is formed on the electrode of described electronic component, and each described conductive projection is reducing to away from the area of section on the direction of electrode gradually from described electrode.Described first film and the second film are formed at the relative both sides of described sandwich layer circuit board respectively, and multiple described conductive projection runs through described first film.Described conductive circuit layer is formed at described first film and described second film face respectively.The described conductive projection running through described first film contacts with the conductive circuit layer that described first film is affixed and is electrically connected.
Relative to prior art, the multilayer circuit board with embedded element of the embodiment of the present invention embodiment of the present invention and manufacture method by forming the cuspidated conductive projection of tool on electronic component, make conductive projection pierce through film to be electrically connected with conductive circuit layer, thus bury in electronic component, and do not need reflow, the problem such as can reduce the circuit board warpage because reflow causes, harmomegathus is not mated, thus improve circuit board making yield.
Accompanying drawing explanation
Fig. 1 is the cutaway view with the multilayer circuit board of embedded element that first embodiment of the invention provides.
Fig. 2 is the cutaway view that second embodiment of the invention provides sandwich layer circuit board.
Fig. 3 forms the cutaway view after installing hole by the sandwich layer circuit board in Fig. 2.
Fig. 4 provides the cutaway view after electronic component forms conductive projection in second embodiment of the invention.
The electronic component of Fig. 4 is contained in the installing hole in the sandwich layer circuit board of Fig. 3 and cutaway view after the superimposed increasing layer material in sandwich layer circuit board both sides forms iterative structure by Fig. 5.
Fig. 6 is by cutaway view after iterative structure pressing formation circuit substrate in Fig. 5.
Copper Foil in Fig. 6 makes to form the cutaway view had after the circuit board of embedded element that conductive circuit layer obtains four layers by Fig. 7.
Main element symbol description
| There is the multilayer circuit board of embedded element | 100 |
| Sandwich layer circuit board | 10 |
| Electronic component | 17 |
| First film | 181 |
| Second film | 191 |
| 3rd conductive circuit layer | 22 |
| 4th conductive circuit layer | 23 |
| Substrate layer | 11 |
| First conductive circuit layer | 121 |
| Second conductive circuit layer | 131 |
| Conductive through hole | 141 |
| Installing hole | 16 |
| Main part | 173 |
| Electrode | 171 |
| Upper surface | 1711 |
| Lower surface | 1712 |
| Conductive projection | 172 |
| First conductive blind hole | 24 |
| Second conductive blind hole | 25 |
| 3rd film | 27 |
| 5th conductive circuit layer | 28 |
| 4th film | 29 |
| 6th conductive circuit layer | 30 |
| First conductive layer | 12 |
| Second conductive layer | 13 |
| Line areas | 14 |
| Part installing zone | 15 |
| First increases layer material | 18 |
| Second increases layer material | 19 |
| Iterative structure | 20 |
| First Copper Foil | 182 |
| Second Copper Foil | 192 |
| The circuit board with embedded element of four layers | 26 |
Following embodiment will further illustrate the present invention in conjunction with above-mentioned accompanying drawing.
Embodiment
Refer to Fig. 1, first embodiment of the invention provides a kind of multilayer circuit board 100 with embedded element, comprising: a sandwich layer circuit board 10, the electronic component 17 be contained in sandwich layer circuit board 10, formed and sandwich layer circuit board 10 both sides the first film 181 and the second film 191, be formed at the 3rd conductive circuit layer 22 of the first film 181 side and be formed at the 4th conductive circuit layer 23 of the second film 191 side.
Described sandwich layer circuit board 10 comprises substrate layer 11, and be arranged at the first conductive circuit layer 121 and the second conductive circuit layer 131 of the relative both sides of substrate layer 11, one conductive through hole 141 is electrically connected described first conductive circuit layer 121 and the through described sandwich layer circuit board 10 of described second conductive circuit layer 131, installing hole 16.
Described electronic component 17 is contained in described installing hole 16.Described electronic component 17 comprises main part 173 and electrode 171, and the thickness of described electronic component 17 is equal to or slightly less than the degree of depth of described installing hole 16.Described main part 173 is roughly rectangle, described two electrodes 171 and be formed at the two ends of described main part 173 length direction, described two electrodes 171 include a upper surface 1711 and the lower surface 1712 relative with described upper surface 1711, two described upper surfaces 1711 are positioned at the same side of described electronic component 17, two described lower surfaces 1712 are positioned at the relative opposite side of described electronic component 17, and the upper surface 1711 of described two electrodes 171 and lower surface 1712 are formed with conductive projection 172.The bearing of trend that described conductive projection 172 is outstanding and described sandwich layer circuit board 10 perpendicular.Described conductive projection 172 is reducing to the direction upper section area away from electrode 171 gradually from described electrode 171.
At least one first conductive blind hole 24 is formed in described first film 181, at least one second conductive blind hole 25 is formed in described second film 191, described first conductive blind hole 24 is electrically connected described first conductive circuit layer 121 and described 3rd conductive circuit layer 22, and described second conductive blind hole 25 is electrically connected described second conductive circuit layer 131 and described 4th conductive circuit layer 23.Described electronic component 17 both sides conductive projection 172 run through first and second film 181,191 described respectively, and to be electrically connected with the described 3rd and the 4th conductive circuit layer 22,23 respectively.
Described 3rd conductive circuit layer 22 side is also formed with the 3rd film 27 and the 5th conductive circuit layer 28 successively, and described 4th conductive circuit layer 23 side is also formed with the 4th film 29 and the 6th conductive circuit layer 30 successively.The 3rd conductive blind hole 31 and the 4th conductive blind hole 32 is formed respectively in described 3rd film 27 and the 4th film 29, described 3rd conductive blind hole 31 is electrically connected described 3rd conductive circuit layer 22 and described 5th conductive circuit layer 28, and described 4th conductive blind hole 32 is electrically connected described 4th conductive circuit layer 23 and described 6th conductive circuit layer 30.
See also Fig. 2-7, second embodiment of the invention provides a kind of above-mentioned manufacture method with the multilayer circuit board 100 of embedded element, comprises the steps:
The first step, refers to Fig. 2, provides a sandwich layer circuit board 10, and described sandwich layer circuit board 10 comprises substrate layer 11, and is arranged at the first conductive layer 12 and the second conductive layer 13 of the relative both sides of substrate layer 11.
In the present embodiment, be described for a circuit board unit of described sandwich layer circuit board 10, described sandwich layer circuit board 10 marks off line areas 14 and a part installing zone 15.The size of described part installing zone 15 is roughly the same with the size of part to be installed.Described first conductive layer 12 in described line areas 14 and the second conductive layer 13 are the conductive circuit layer being formed with conducting wire, and described first conductive layer 12 in definition line areas 14 and the second conductive layer 13 are respectively the first conductive circuit layer 121 and the second conductive circuit layer 131.Described sandwich layer circuit board 10 is also formed with at least one conductive through hole 141 in described line areas 14, and described conductive through hole 141 is electrically connected described first conductive circuit layer 121 and described second conductive circuit layer 131.Described first conductive layer 12 in described part installing zone 15 and the second conductive layer 13 do not form conducting wire, and disconnect with the first conductive layer 12 in line areas 14 and the second conductive layer 13 phase respectively.In another embodiment, described first conductive layer 12 in described part installing zone 15 and the second conductive layer 13 also can not disconnect with the first conductive layer 12 in described line areas 14 and the second conductive layer 13 phase.In other embodiments, described first conductive layer 12 and the second conductive layer 13 can not also be formed in described part installing zone 15.
In the present embodiment, the material of the first conductive layer 12 and the second conductive layer 13 is copper.In described the present embodiment, described substrate layer 11 is insulating barrier, and namely described sandwich layer circuit board 10 is double-sided PCB.In other embodiments, described substrate layer 11 also can comprise multilayer dielectric layer and conductive circuit layer, now, insulating barrier and conductive circuit layer are alternately arranged, and substrate layer 11 outermost both sides are insulating barrier, are also, in other embodiments, described sandwich layer circuit board 10 also can be multilayer circuit board.In other embodiments, the quantity of described part installing zone 15 also can be multiple; Described sandwich layer circuit board 10 can comprise multiple circuit board unit.
Second step, sees also Fig. 3, removes the described sandwich layer circuit board 10 in described part installing zone 15, thus form an installing hole 16 on described sandwich layer circuit board 10.
In the present embodiment, cut described sandwich layer circuit board 10 along described line areas 14 with the boundary line of described part installing zone 15 by the mode of laser cutting, thus remove the described sandwich layer circuit board 10 in described part installing zone 15.The through described sandwich layer circuit board 10 of described installing hole 16, described installing hole 16 is for accommodating an electronic component.Because of in the present embodiment, described first conductive layer 12 in described part installing zone 15 and the second conductive layer 13 disconnect with the first conductive layer 12 in line areas 14 and the second conductive layer 13 phase respectively, therefore, only cut to substrate layer 11 during cutting and conductive layer can't be cut to, being easier to cutting.In other embodiments, also can by stamp, drag for the modes such as type and form described installing hole 16.
3rd step, refers to Fig. 4, provides an electronic component 17, and the electrode 171 of described electronic component 17 forms conductive projection 172, and described conductive projection 172 is reducing to the direction upper section area away from electrode 171 gradually from described electrode 171.
In the present embodiment, described electronic component 17 comprises main part 173 and two electrodes 171.Described main part 173 is roughly rectangle, described two electrodes 171 and be formed at the two ends of described main part 173 length direction, described two electrodes 171 include a upper surface 1711 and the lower surface 1712 relative with described upper surface 1711, two described upper surfaces 1711 are positioned at the same side of described electronic component 17, and two described lower surfaces 1712 are positioned at the relative opposite side of described electronic component 17.The quantity of described conductive projection 172 is four, on the upper surface 1711 being formed at described two electrodes 171 respectively and lower surface 1712.The thickness of described electronic component 17 is equal to or slightly less than the degree of depth of described installing hole 16.
The electrode 171 of described electronic component 17 is formed conductive projection 172 and comprises step: first, wherein upper surface 1711 and lower surface 1712 form conducting paste by the mode of printing at each electrode 171 of described electronic component 17, described conducting paste can be silver paste, copper cream etc.; Secondly, described conducting paste solidification is obtained described conductive projection 172, described conductive projection 172 is reducing to the direction upper section area away from electrode 171 gradually from described electrode 171, and described conductive projection 172 can be coniform, round table-like, Rhizoma Sparganii taper, three prism-frustum-shapeds, multi-prism taper, many prism-frustum-shapeds etc.
In other embodiments, described conductive projection 172 also can only be formed on described upper surface 1711, or is only formed on described lower surface 1712; The quantity of described conductive projection 172 is also not limited to the present embodiment, such as, the upper surface 1711 of each electrode 171 and lower surface 1712 can also form two or more conductive projection 172.
4th step, refer to Fig. 5, described electronic component 17 after forming conductive projection 172 is contained in the installing hole 16 of described sandwich layer circuit board 10, and increase layer material 18 and the second increasing layer material 19 in described sandwich layer circuit board 10 both sides difference superimposed one first, the conductive projection 172 of described electronic component 17 is all contacted with increasing layer material, thus forms an iterative structure 20.
In the present embodiment, described first increases layer material 18 comprises one first film 181 and one first Copper Foil 182, described second increases layer material 19 comprises one second film 191 and one second Copper Foil 192, and the conductive projection 172 of described electronic component 17 both sides directly contacts with described first and film 181,191 respectively.First and second film 181,191 described can be semi-solid preparation insulating resin sheet, and can comprise the toughening materials such as glass fabric.The height that the conductive projection 172 that the thickness of described first film 181 and the second film 191 contacts with it respectively protrudes from described sandwich layer circuit board 10 is roughly the same.
In the present embodiment, the forming step of described iterative structure 20 comprises: first, provides described first film 181, by the mode of roll extrusion, described first film is fitted in advance the side of described sandwich layer circuit board 10, also namely, the one end open of described installing hole 16 is closed by described first film 181; Afterwards, the described electronic component 17 after forming conductive projection 172 is contained in the installing hole 16 of described sandwich layer circuit board 10, and makes the conductive projection 172 of described electronic component 17 side be supported on described first film 181; Then, at side superimposed described first Copper Foil 182 of described first film 181 away from described sandwich layer circuit board 10, at side successively superimposed described second film 191 and one second Copper Foil 192 of described sandwich layer circuit board 10 away from described first film 181, thus form described iterative structure 20.
5th step, refer to Fig. 6, iterative structure 20 described in pressing, making described sandwich layer circuit board 10 and described first increase layer material 18 and second, to increase layer material 19 bonding, and make described electronic component 17 both sides conductive projection 172 run through first and second film 181,191 described respectively, and be electrically connected with the described Copper Foil of homonymy respectively, thus form a circuit substrate 21.
Because of in the present embodiment, described conductive projection 172 is reducing to the direction upper section area away from electrode 171 gradually from described electrode 171, also namely there is more sharp-pointed end, therefore, under pressure, described conductive projection 172 can pierce through described first film 181 and the second film 191 thus with first and second Copper Foil 182, 192 are electrically connected, the height that the conductive projection 172 contacted with it because of the thickness of described first film 181 and the second film 191 again protrudes from described sandwich layer circuit board 10 is roughly the same, therefore, described conductive projection 172 can with first and second Copper Foil 182 described, 192 are electrically connected and do not pierce through first and second Copper Foil 182 described, 192.
6th step, refer to Fig. 7, described first Copper Foil 182 is made formation the 3rd conductive circuit layer 22, described second Copper Foil 192 is made formation the 4th conductive circuit layer 23, and at least one first conductive blind hole 24 is formed in described first film 181, at least one second conductive blind hole 25 is formed in described second film 191, described first conductive blind hole 24 is made to be electrically connected described first conductive circuit layer 121 and described 3rd conductive circuit layer 22, described second conductive blind hole 25 is made to be electrically connected described second conductive circuit layer 131 and described 4th conductive circuit layer 23, and make described electronic component 17 both sides conductive projection 172 be electrically connected with the described conductive circuit layer of homonymy respectively, also be, make described electronic component 17 and the described 3rd and the 4th conductive circuit layer 22, 23 are electrically connected, thus obtain the circuit board 26 with embedded element of or four layers.
In the present embodiment, described conductive blind hole and conductive circuit layer can be formed as follows: first, form at least one blind hole by being laser-ablated on described first film 181 and the first Copper Foil 182, and form at least one blind hole on described second film 191 and the second Copper Foil 192; Afterwards, electroplate and form electrodeposited coating at described blind hole hole wall, thus described blind hole is made formation first conductive blind hole 24 and the second conductive blind hole 25; Finally, by image transfer technique and etch process, described first Copper Foil 182 is made formation the 3rd conductive circuit layer 22, and described second Copper Foil 192 is made formation the 4th conductive circuit layer 23.
7th step, see also Fig. 1, layer is increased circuit board 26 both sides with embedded element of described four layers, form the 3rd film 27 and the 5th conductive circuit layer 28 respectively, 4th film 29 and the 6th conductive circuit layer 30, and in described 3rd film 27 and the 4th film 29, form the 3rd conductive blind hole 31 and the 4th conductive blind hole 32 respectively respectively, described 3rd conductive blind hole 31 is made to be electrically connected described 3rd conductive circuit layer 22 and described 5th conductive circuit layer 28, described 4th conductive blind hole 32 is made to be electrically connected described 4th conductive circuit layer 23 and described 6th conductive circuit layer 30, thus obtain the multilayer circuit board 100 with embedded element.
Increase layer mode in this step and the 4th to the 6th step is similar, be namely first pressing film and Copper Foil, in film, form conductive blind hole afterwards, finally again Copper Foil is made into conducting wire.Certainly, if only need to form four-layer circuit board, then do not need carry out this step.
Be appreciated that and can also form welding resisting layer with the conducting wire protecting outermost both sides exposed on the described multilayer circuit board 100 with embedded element; The multilayer circuit board of this case can also form more conductive circuit layer by the mode of the 7th step thus obtain comprising the multilayer circuit board 100 with embedded element of more multi-layered line layer.
Relative to prior art, the multilayer circuit board 100 with embedded element of the embodiment of the present invention and manufacture method by forming the cuspidated conductive projection 172 of tool on electronic component 17, make conductive projection pierce through film to be electrically connected with conductive circuit layer, thus bury in electronic component 17, and do not need reflow, the problem such as can reduce the circuit board warpage because reflow causes, harmomegathus is not mated, thus improve circuit board making yield.
Be understandable that, for the person of ordinary skill of the art, other various corresponding change and distortion can be made by technical conceive according to the present invention, and all these change the protection range that all should belong to the claims in the present invention with distortion.
Claims (20)
1. there is a manufacture method for the multilayer circuit board of embedded element, comprise step:
Sandwich layer circuit board is provided, described sandwich layer circuit board forms through installing hole;
There is provided electronic component, the electrode of described electronic component is formed multiple conductive projection, each described conductive projection is reducing to away from the area of section on the direction of electrode gradually from described electrode;
Described electronic component after forming conductive projection is contained in the installing hole of described sandwich layer circuit board, and at described sandwich layer circuit board both sides superimposed film and Copper Foil all successively;
Pressing make described sandwich layer circuit board and each described Copper Foil bonding by a described film, and make each described conductive projection run through film described in one and contact with the described Copper Foil that described film is affixed and be electrically connected, thus forming circuit substrate;
Each described Copper Foil is made and forms conductive circuit layer, described electronic component and described conductive circuit layer are electrically connected, thus described in being formed, there is the multilayer circuit board of embedded element.
2. there is the manufacture method of the multilayer circuit board of embedded element as claimed in claim 1, it is characterized in that, on described sandwich layer circuit board, form described installing hole by laser cutting, stamp or the type that drags for.
3. there is the manufacture method of the multilayer circuit board of embedded element as claimed in claim 1, it is characterized in that, described sandwich layer circuit board comprises substrate layer and is arranged at the first conductive circuit layer and second conductive circuit layer of the relative both sides of substrate layer, described sandwich layer circuit board comprises a line areas and a part installing zone, described first conductive circuit layer and the second conductive circuit layer are only formed at described line areas, boundary line along described line areas and described part installing zone cuts described sandwich layer circuit board, to remove the described sandwich layer circuit board in described part installing zone, form described installing hole.
4. there is the manufacture method of the multilayer circuit board of embedded element as claimed in claim 1, it is characterized in that, described sandwich layer circuit board comprises substrate layer and is arranged at the first conductive layer and second conductive layer of the relative both sides of substrate layer, described sandwich layer circuit board comprises a line areas and a part installing zone, described first conductive layer in described line areas and the second conductive layer disconnect mutually with described first conductive layer in described part installing zone and the second conductive layer, described first conductive layer of described line areas and the second conductive layer are respectively the first conductive circuit layer and the second conductive circuit layer, boundary line along described line areas and described part installing zone cuts described sandwich layer circuit board, to remove the described sandwich layer circuit board in described part installing zone, form described installing hole.
5. there is the manufacture method of the multilayer circuit board of embedded element as claimed in claim 1, it is characterized in that, the method forming described conductive projection comprises: at the printed on electrodes conducting paste of described electronic component, and solidifies described conducting paste and obtain described conductive projection.
6. have the manufacture method of the multilayer circuit board of embedded element as claimed in claim 1, it is characterized in that, described conducting paste is silver paste or copper cream.
7. have the manufacture method of the multilayer circuit board of embedded element as claimed in claim 1, it is characterized in that, the shape of described conductive projection is coniform, round table-like, Rhizoma Sparganii taper, three prism-frustum-shapeds, multi-prism taper or many prism-frustum-shapeds.
8. there is the manufacture method of the multilayer circuit board of embedded element as claimed in claim 1, it is characterized in that, described electronic component comprises main part and two electrodes, described two electrodes include a lower surface, two described lower surfaces are positioned at the same side of described electronic component, the lower surface of each described electrode is formed with at least one conductive projection, during pressing, each described conductive projection runs through the described film of described sandwich layer circuit board side and is electrically connected with the described Copper Foil be affixed with described film.
9. there is the manufacture method of the multilayer circuit board of embedded element as claimed in claim 8, described two electrodes also comprise the upper surface relative with described lower surface, two described upper surfaces are positioned at the relative opposite side of described electronic component, the upper surface of each described electrode is also formed with conductive projection described at least one, during pressing, each described conductive projection runs through the described film of homonymy respectively and is electrically connected with the described Copper Foil be affixed with described film.
10. have the manufacture method of the multilayer circuit board of embedded element as claimed in claim 9, it is characterized in that, the quantity of described conductive projection is four, and described conductive projection is formed at upper surface and the lower surface of described two electrodes respectively.
11. manufacture methods as claimed in claim 9 with the multilayer circuit board of embedded element, it is characterized in that, described electronic component after forming conductive projection is contained in the installing hole of described sandwich layer circuit board, and comprise in the step of described sandwich layer circuit board both sides all successively superimposed film and Copper Foil: one first film is provided, by the mode of roll extrusion, described first film is fitted in advance the side of described sandwich layer circuit board, afterwards, described electronic component after forming conductive projection is contained in the installing hole of described sandwich layer circuit board, and make the conductive projection of described electronic component side be supported on described first film, then, at side superimposed described first Copper Foil of described first film away from described sandwich layer circuit board, at side successively superimposed described second film and one second Copper Foil of described sandwich layer circuit board away from described first film.
12. manufacture methods as claimed in claim 11 with the multilayer circuit board of embedded element, is characterized in that, the thickness of described first film and the second film protrudes from described sandwich layer circuit board respectively height with the conductive projection contacted with it is identical.
13. manufacture methods as claimed in claim 1 with the multilayer circuit board of embedded element, it is characterized in that, the thickness of described electronic component is equal to or slightly less than the degree of depth of described installing hole.
14. manufacture methods as claimed in claim 1 with the multilayer circuit board of embedded element, is characterized in that, are made by each described Copper Foil after forming conductive circuit layer, are also included in the step that layer is carried out increasing in each described conductive circuit layer surface.
15. 1 kinds of multilayer circuit boards with embedded element, comprising:
One sandwich layer circuit board, described sandwich layer circuit board is formed with through installing hole;
One electronic component, described electronic component is contained in described installing hole, and multiple conductive projection is formed on the electrode of described electronic component, and each described conductive projection is reducing to away from the area of section on the direction of electrode gradually from described electrode;
Be formed at the first film and second film of the described relative both sides of sandwich layer circuit board, multiple described conductive projection runs through described first film; And
Be formed at the conductive circuit layer of described first film and the second film face respectively, the described conductive projection running through described first film contacts with the conductive circuit layer that described first film is affixed and is electrically connected.
16. multilayer circuit boards as claimed in claim 15 with embedded element, it is characterized in that, multiple conductive projection runs through described second film, and the described conductive projection running through described second film is electrically connected with the conductive circuit layer that described first film is affixed.
17. multilayer circuit boards as claimed in claim 15 with embedded element, it is characterized in that, described conductive projection is formed by curing conductive lotion.
18. multilayer circuit boards as claimed in claim 15 with embedded element, it is characterized in that, described electronic component comprises main part and two electrodes, described two electrodes include a lower surface and the upper surface relative with described lower surface, two described lower surfaces are positioned at the same side of described electronic component, two described upper surfaces are positioned at the relative opposite side of described electronic component, the quantity of described conductive projection is four, and described conductive projection is formed at upper surface and the lower surface of described two electrodes respectively.
19. multilayer circuit boards as claimed in claim 15 with embedded element, it is characterized in that, the shape of described conductive projection is coniform, round table-like, Rhizoma Sparganii taper, three prism-frustum-shapeds, multi-prism taper or many prism-frustum-shapeds.
20. multilayer circuit boards as claimed in claim 15 with embedded element, it is characterized in that, the thickness of described electronic component is equal to or slightly less than the degree of depth of described installing hole.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410511781.0A CN105530765A (en) | 2014-09-29 | 2014-09-29 | Circuit board with embedded element and manufacturing method thereof |
| TW103138088A TWI599290B (en) | 2014-09-29 | 2014-11-03 | Printed circuit board with embeded electronic component and method for manufacturing same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410511781.0A CN105530765A (en) | 2014-09-29 | 2014-09-29 | Circuit board with embedded element and manufacturing method thereof |
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| CN105530765A true CN105530765A (en) | 2016-04-27 |
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| CN201410511781.0A Pending CN105530765A (en) | 2014-09-29 | 2014-09-29 | Circuit board with embedded element and manufacturing method thereof |
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| TW (1) | TWI599290B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114786367A (en) * | 2021-01-22 | 2022-07-22 | 宏恒胜电子科技（淮安）有限公司 | High-density interconnection circuit board and preparation method thereof |
| WO2023272642A1 (en) * | 2021-06-30 | 2023-01-05 | 深南电路股份有限公司 | Electronic component package, electronic component, voltage regulator module, and voltage stabilizing device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2020073344A1 (en) * | 2018-10-12 | 2020-04-16 | 庆鼎精密电子（淮安）有限公司 | Embedded circuit board and manufacturing method therefor |
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| CN103633020A (en) * | 2012-08-21 | 2014-03-12 | 新科金朋有限公司 | Semiconductor device and method of forming rdl using uv-cured conductive ink over wafer level package |
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| CN114786367A (en) * | 2021-01-22 | 2022-07-22 | 宏恒胜电子科技（淮安）有限公司 | High-density interconnection circuit board and preparation method thereof |
| WO2023272642A1 (en) * | 2021-06-30 | 2023-01-05 | 深南电路股份有限公司 | Electronic component package, electronic component, voltage regulator module, and voltage stabilizing device |
| US11737212B2 (en) | 2021-06-30 | 2023-08-22 | Shennan Circuits Co., Ltd. | Electronic component package, electronic assembly, voltage regulation module, and voltage regulator member |
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| Publication number | Publication date |
|---|---|
| TWI599290B (en) | 2017-09-11 |
| TW201613437A (en) | 2016-04-01 |
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