CN101078835A

CN101078835A - LED backlight module group

Info

Publication number: CN101078835A
Application number: CNA2007100426540A
Authority: CN
Inventors: 何永新
Original assignee: SVA Group Co Ltd
Current assignee: SVA Group Co Ltd
Priority date: 2007-06-26
Filing date: 2007-06-26
Publication date: 2007-11-28

Abstract

The invention discloses a LED aphototropism module, which comprises the following parts: back board, which lies at the bottom of the aphototropism module and two opposite sides; metal circuit base, which lies on the bottom of the aphototropism module; several LED tubes, which are distributed on the upper surface of the metal circuit base to connect the metal circuit base electrically; radiating fin, which is doubled on the back of the back board and is extended into the back board to contact the metal circuit base with high radiating efficiency, in order to avoid the inferior effect for the aphototropism module due to the accumulated heat.

Description

The LED-backlit module

Technical field

The present invention relates to a kind of module backlight, particularly a kind of LED down straight aphototropism mode set that is used for LCD.

Background technology

LCD (LCD) is widely used in computer, communication apparatus, televisor and other various displays.General LCD mainly is made up of liquid crystal panel and module backlight.Wherein liquid crystal panel itself is not luminous, and the light source of panel is provided by module backlight.Module backlight can be divided into two kinds of side-light type and straight-down negatives, and wherein down straight aphototropism mode set is widely used on TV and the large-scale LCD.Down straight aphototropism mode set adopts several straight shape cold cathode fluorescent lamp (Cold Cathode Fluorescent Lamps more at present, CCFL) or light emitting diode (LightEmitting Diode, LED) as backlight, and these luminophors are in operation and can produce heat, and the lighting circuit control system equally also can produce heat when operation.Because heat accumulative total can cause module backlight to cross cause thermal damage for a long time.

As shown in Figure 1, traditional LED-backlit module with radiator structure comprises a backboard 114 at present, is positioned at the bottom surface and relative both sides of module backlight; Several LED fluorescent tubes 110 are distributed in the top of described backboard 114, and are connected on the metallic circuit substrate 115 by LED electrode 111, and described metallic circuit substrate 115 fits with backboard 114 upper surfaces; And radiating fin 116, described radiating fin 116 is fitted with the lower surface of backboard 114, in order to strengthen radiating effect, on metallic circuit substrate 115 and backboard 114, can offer several apertures 117, perhaps on metallic circuit substrate 115 and backboard 114, coat the coating of good heat dissipation, but in traditional LED-backlit module, the continuous accumulative total of heat remains a very severe problem, therefore needs effective more radiator structure and mode to solve.

Summary of the invention

Therefore, the technical matters that solves of the present invention provides heat that a kind of effective eliminating fluorescent tube and Circuits System distribute, avoids the direct-light type LED backlight module that damages because of heat accumulative total.

For achieving the above object, LED-backlit module of the present invention comprises a backboard, is positioned at the bottom surface and relative both sides of module backlight; One metallic circuit substrate is positioned at the top of described backboard bottom surface; Several LED fluorescent tubes are distributed in the upper surface of described metallic circuit substrate, and are electrically connected with the metallic circuit substrate; And radiating fin; The back side of wherein said radiating fin and described backboard fits, and extend into and contact with described metallic circuit substrate in the backboard.

The below of described circuit substrate also can be provided with heat pipe, and described heat pipe is fixed in the square groove of radiating fin, and tangent with each limit of radiating fin.

The structure of described radiating fin and metallic circuit substrate contacts part can be long strip type.

By LED-backlit module of the present invention, because radiating fin is extend in the module backlight, and fit with circuit substrate, the heat that light source is produced directly is transmitted to outside the module backlight by radiating fin, radiating efficiency is higher, especially be embedded with and the contacted heat pipe of metallic circuit substrate at radiating fin, the heat that light source is produced conducts rapidly to heat pipe, heat pipe can fall heat release rapidly by the circulation of inside, perhaps conduct by radiating fin, all the other heats of metallic circuit substrate then directly are transmitted to module backlight outside by radiating fin, the heat that light source is produced obtains discharging more rapidly, avoid the accumulative total of heat, guaranteed that heat has multiple heat radiation approach to be conducted, improve the efficient of heat radiation, the heat stage is fully discharged, avoid the accumulative total of heat and the module backlight that causes is bad.

Description of drawings

Fig. 1 is the schematic cross-section of traditional LED-backlit module;

Fig. 2 is the schematic cross-section of the LED-backlit module of one embodiment of the invention;

Fig. 3 is the floor map of the LED-backlit module of one embodiment of the invention;

Fig. 4 is the schematic cross-section of the LED-backlit module of another embodiment of the present invention;

Fig. 5 is the floor map of the LED-backlit module of another embodiment of the present invention.

Accompanying drawing part symbol description:

110:LED fluorescent tube 111:LED electrode 114: backboard

115: circuit substrate 116: radiating fin 117: aperture

10:LED fluorescent tube 11:LED electrode 12: heat pipe

13: thermal grease 14: backboard 15: circuit substrate

16: radiating fin

Embodiment

Below in conjunction with accompanying drawing the present invention is further described.

Embodiment one

With reference to Fig. 2, Fig. 3, the LED-backlit module comprises a backboard 14, is positioned at the bottom surface and relative both sides of module backlight; One metallic circuit substrate 15 is positioned at the top of described backboard 14 bottom surfaces; Several LED fluorescent tubes are distributed in the upper surface of described metallic circuit substrate 15, and are electrically connected with metallic circuit substrate 15; And radiating fin 16; Described radiating fin 16 stretches to module internal backlight, fit tightly with the lower surface and backboard 14 lower surfaces of metallic circuit substrate 15, LED fluorescent tube 10 is fixed on the metallic circuit substrate 15 by electrode 11, in the lower surface arrangement of metallic circuit substrate 15 heat pipe 12 and its applying, heat pipe 12 then is fixed in the square groove of radiating fin 16, make heat pipe 12 and radiating fin 16 each limit tangent, in the groove all the other not attaching space fill up with thermal grease 13, assurance metal circuit substrate 15, heat pipe 12 and radiating fin 16 fully contact.

Described radiating fin 16, heat pipe 12 are the metal with thermal conductive resin and high thermal conductivity coefficient and make, as aluminium, copper or aluminium alloy.Thermal grease 13 is for having the material of thermal conductive resin and high thermal conductivity coefficient, as silicon oil.

Therefore, the LED-backlit module of present embodiment structure, from LED fluorescent tube 10 heats that send in service, at first thermal contact conductance pipe 12 is by the internal heat exchange cycles, rapidly with heat release, the heat that remaining heat and metallic circuit substrate 15 produces passes to radiating fin 16 by heat pipe 12 again or is directly obtained discharging by radiating fin 16, and the heat that other conducts to radiating fin 16 conducts simultaneously to backboard 14, again by backboard 14 with heat release.

Above radiating mode guaranteed that heat has multiple heat radiation channel to be conducted, and improved the efficient of heat radiation, and the heat stage is fully discharged, and avoids the accumulative total of heat and the module backlight that causes is bad.

Embodiment two

With reference to Fig. 4, Fig. 5, described module backlight comprises backboard 14, is positioned at the bottom surface and relative both sides of module backlight; One metallic circuit substrate 15 is positioned at the top of described backboard 14 bottom surfaces; Several LED fluorescent tubes are distributed in the upper surface of described metallic circuit substrate 15, and are electrically connected with metallic circuit substrate 15; And radiating fin 16; Radiating fin 16 passes backboard 14 and extend into module internal backlight, its upper surface and metallic circuit substrate 15 are fitted, radiating fin 16 is fitted with backboard 14 lower surfaces again, radiating fin 16 stretches into the below that part is in LED fluorescent tube 10, and itself and metallic circuit substrate 15 contact portions be shaped as long strip type, be arranged in permutation LED fluorescent tube 10 belows, when fluorescent tube and Circuits System generation heat in service, conduct to the long strip type radiating fin 16 of below rapidly, increased the contact area of heat radiation, made heat be discharged into module backlight outside by radiating fin 16 rapidly.

Claims

1, a kind of LED-backlit module comprises

One backboard is positioned at the bottom surface and relative both sides of module backlight;

One metallic circuit substrate is positioned at the top of described backboard bottom surface;

Several LED fluorescent tubes are distributed in the upper surface of described metallic circuit substrate, and are electrically connected with the metallic circuit substrate; And

Radiating fin;

The back side that it is characterized in that described radiating fin and described backboard fits, and extend into and contact with described metallic circuit substrate in the backboard.

2, LED-backlit module according to claim 1 is characterized in that, described LED fluorescent tube is connected to described metallic circuit substrate by the LED electrode.

3, LED-backlit module according to claim 1 is characterized in that, the below of described metallic circuit substrate also is provided with heat pipe, and described heat pipe is fixed in the square groove of radiating fin, and tangent with each limit of radiating fin.

According to claim 1 or 3 described LED-backlit modules, it is characterized in that 4, described radiating fin, heat pipe are that the metal with thermal conductive resin and high thermal conductivity coefficient is made.

5, LED-backlit module according to claim 4 is characterized in that described radiating fin, heat pipe made by aluminium, copper or aluminium alloy.

6, LED-backlit module according to claim 3 is characterized in that, is filled with thermal grease in the described square groove.

7, LED-backlit module according to claim 6 is characterized in that, described thermal grease is a silicon oil.

8, LED-backlit module according to claim 1 is characterized in that, described radiating fin and metallic circuit substrate contacts part be shaped as long strip type.