CN102252206A - Heat dissipation and circuit insulating device of high-power light emitting diode (LED) lamp - Google Patents
Heat dissipation and circuit insulating device of high-power light emitting diode (LED) lamp Download PDFInfo
- Publication number
- CN102252206A CN102252206A CN2011102058770A CN201110205877A CN102252206A CN 102252206 A CN102252206 A CN 102252206A CN 2011102058770 A CN2011102058770 A CN 2011102058770A CN 201110205877 A CN201110205877 A CN 201110205877A CN 102252206 A CN102252206 A CN 102252206A
- Authority
- CN
- China
- Prior art keywords
- heat
- conducting plate
- led
- led lamp
- bar
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The invention relates to a heat dissipation and circuit insulating device of a high-power light emitting diode (LED) lamp. The device comprises a heat conducting plate, and a plurality of strip grooves formed on the front lateral surface of the heat conducting plate and used for arranging power supply circuit board strips; the luminous part of each high-power LED chip in the LED lamp on the heat conducting plate is jointed to a joint face at one side of the strip groove, a heat conducting tube formed at one time together with the heat conducting plate is arranged opposite to the joint face on the rear lateral surface of the heat conducting plate, and each heat conducting tube is connected with a cooling system; and anodes and cathodes of the high-power LED chips are connected in series or in parallel through the power supply circuit board strips. The power supply part and the luminous part of the high-power LED are separately produced and then nearly jointed on the same plane. Therefore, insulation of a high-current circuit is fully protected, and isolation-free heat dissipation of a luminous body is met. The power supply circuit part of the LED has more reliable safe insulation performance, and the heat dissipation part of the LED has better heat dissipation effect.
Description
Technical field
The present invention relates to the technical field of LED lamp, specifically is a kind of heat radiation and circuit seal of high-powered LED lamp.
Background technology
Current, the energy saving of LED product is extensively admitted.But the major obstacle that restricts its development and a large amount of uses has 2 points; The one, cost is higher; The 2nd, light decay is serious.The serious main cause of light decay is a heat dissipation problem.Supply current is bigger during great power LED work, therefore need adopt thicker insulating barrier when great power LED is installed.And blocked up insulating barrier is unfavorable to dispelling the heat, and this is a pair of contradiction.
How not only to reduce cost but also reduce light decay, be the technical barrier that this area will solve.
Summary of the invention
The technical problem to be solved in the present invention provides heat radiation and the circuit seal that a kind of cost is lower, be suitable for making the less high-powered LED lamp of great power LED light decay.
In order to solve the problems of the technologies described above, the invention provides a kind of heat radiation and circuit seal of high-powered LED lamp, it comprises: the heat-conducting plate of metal material, be located at a plurality of bar-shaped troughs that being used on this heat-conducting plate leading flank is provided with supply line's lath; The luminous component of the high-power LED chip in heat conduction onboard led lamp fits on the binding face of this bar-shaped trough one side, and be provided with and the one-time formed heat pipe of heat-conducting plate with described binding face opposite position on the trailing flank of described heat-conducting plate, each heat pipe links to each other with a cooling system; The positive and negative electrode of each high-power LED chip is realized serial or parallel connection by described supply line lath.
Further, described heat-conducting plate is aluminium section bar board or inflation plate.
Further, described bar-shaped trough comprises a pair of of parallel adjacent setting, is described binding face at this to the table top between the bar-shaped trough, and the positive and negative electrode of each high-power LED chip is realized serial or parallel connection by being located at this to the described supply line lath in the bar-shaped trough.
Further, described supply line lath by prepreg hot pressing in described bar-shaped trough.
Further, be coated with the high phosphorus nickel coating between the luminous component of high-power LED chip and the described binding face, further to be beneficial to heat conduction, to accelerate heat radiation.
Further, described cooling system comprises: link to each other with described heat pipe two ends respectively and constitute the radiating tube of heat-radiation loop; Be filled with refrigerant in described heat pipe and the radiating tube.Radiating tube is coiled pipe or coil pipe, and radiating tube and horizontal plane angle＞12 ° so that the height of described radiating tube setting is higher than the height of described heat pipe integral body, and make the liquid refrigerants of condensation be entered in the heat pipe fast by the gravity effect.
Technique scheme of the present invention has the following advantages compared to existing technology:
(1) heat radiation of high-powered LED lamp of the present invention and circuit seal separate production with the power pack of great power LED with luminous component (also being heating part), are almost fitting on the same plane then.The no isolation radiating (luminous component of led chip directly fits on the heat-conducting plate) of illuminator has been satisfied in so both the adequately protected insulation of high-current circuit again.Make the power supply circuits part safe insulation of LED more reliable, radiator portion heat radiation is better.
(2) traditional LED circuit is that whole Copper Foil is fitted on the aluminium base, after corroding remaining be used for circuit only account for below 20% of whole Copper Foil.And the present invention only makes useful wiring board separately, has so not only saved copper material but also can add thick dielectric layer.Because wiring board separates with illuminator, so do not influence heat radiation.
(3) traditional LED heat radiation is by thick and heavy aluminium section bar heat loss through conduction, needs that aluminium is more, radiating effect is bad, and adding has insulating barrier above the aluminium base, and its radiating effect is poorer.And the present invention directly is fitted in the LED illuminator on aluminium section bar or the inflation plate because circuit board separates with illuminator, utilizes the heat radiation of refrigerant low-temperature evaporation principle.Like this, both can save the aluminium more than 50%, but several times improve radiating effect again.Heat dispersion improves, and light decay reduces, and the life-span prolongs, and makes that the power pack insulation is more reliable, the luminous component heat radiation is faster, more thorough.
Description of drawings
For the easier quilt of content of the present invention is clearly understood, below the specific embodiment and in conjunction with the accompanying drawings of basis, the present invention is further detailed explanation, wherein
Fig. 1 is the partial front structure chart of high-powered LED lamp of the present invention;
Fig. 2 is the vertical view of the heat-conducting plate among the present invention.
Among Fig. 3 the present invention is the partial structurtes schematic diagram of cooling system.
The specific embodiment
Embodiment 1
See Fig. 1, it comprises the heat radiation of the high-powered LED lamp of present embodiment and circuit seal: heat-conducting plate 1, be located at a plurality of bar-shaped troughs 2 that are used to be provided with supply line's lath on this heat-conducting plate 1 leading flank.
Have a plurality of parallel luminous zones on the high-powered LED lamp of present embodiment, the mode that described bar-shaped trough 2 constitutes a luminous zone comprises two kinds:
First kind: a pair of bar-shaped trough 2 parallel adjacent settings, this is a binding face 5 to the table top between the bar-shaped trough 2, the luminous component 4 of each high-power LED chip on the same luminous zone fits on this binding face 5, and the positive and negative electrode of each high-power LED chip is realized serial or parallel connection by being located at this to the supply line's lath in the bar-shaped trough 2.
Second kind: adopt a bar-shaped trough 2, the luminous component 4 of each high-power LED chip on the same luminous zone fits on the binding face 5 of these bar-shaped trough 2 one sides, and the positive and negative electrode of each high-power LED chip is realized serial or parallel connection by the supply line's lath in this bar-shaped trough 2.
Above-mentioned two kinds of luminous zones can be used in the same LED lamp simultaneously, also can distinguish separately and use.
See Fig. 2, on the trailing flank of described heat-conducting plate 1, be provided with and heat-conducting plate 1 one-time formed heat pipe 3 that each heat pipe 3 links to each other with a refrigerant type cooling system with described binding face 5 opposite positions.
Described heat-conducting plate 1 is the inflation plate of aluminium section bar board or aluminium or copper product.
Described supply line lath passes through prepreg hot pressing in described bar-shaped trough 2, and makes the leading flank of described heat-conducting plate 1 concordant.Be coated with the high phosphorus nickel coating between the luminous component 4 of high-power LED chip and the described binding face 5, further to be beneficial to heat conduction, to accelerate heat radiation.
Described cooling system comprises: link to each other with each heat pipe 3 two ends respectively and constitute the radiating tube 6 of heat-radiation loop; Be filled with refrigerant in described heat pipe 3 and the radiating tube 6.Radiating tube 6 is coiled pipe or coil pipe.
Playing the thickness of the epoxy resin of the prepreg of insulating effect and forming circuit lath can determine according to the size of current of LED.(glass cloth dipping is gone up resin adhesive liquid, again through heat treatment (preliminary drying) and the sheeting of making is called prepreg.)
As Fig. 3, be filled with refrigerant in the heat pipe 3, just produce a large amount of heat when 4 work of LED luminous component, at this moment refrigerant is met thermal evaporation and is entered radiating tube 6 heat radiations by liquid displacement steam state; Treat heat radiation, after the condensation, be converted to liquid state by steam state again, and be back in the described heat pipe 3, change so repeatedly and realize heat radiation.
Obviously, the foregoing description only is for example of the present invention clearly is described, and is not to be qualification to embodiments of the present invention.For those of ordinary skill in the field, can also make other changes in different forms on the basis of the above description.Here need not also can't give exhaustive to all embodiments.And these belong to conspicuous variation or the change that spirit of the present invention extended out and still are among protection scope of the present invention.
Claims (7)
1. the heat radiation of a high-powered LED lamp and circuit seal is characterized in that comprising: the heat-conducting plate of metal material (1), be located at a plurality of bar-shaped troughs (2) that being used on this heat-conducting plate (1) leading flank is provided with supply line's lath; The luminous component (4) of going up the high-power LED chip in the LED lamp at heat-conducting plate (1) fits on the binding face (5) of these bar-shaped trough (2) one sides, and be provided with and the one-time formed heat pipe of heat-conducting plate (1) (3) with described binding face (5) opposite position on the trailing flank of described heat-conducting plate (1), each heat pipe (3) links to each other with a cooling system; The positive and negative electrode of each high-power LED chip is realized serial or parallel connection by described supply line lath.
2. the heat radiation of high-powered LED lamp according to claim 1 and circuit seal, it is characterized in that: described heat-conducting plate (1) is aluminium section bar board or inflation plate.
3. the heat radiation of high-powered LED lamp according to claim 1 and 2 and circuit seal, it is characterized in that: described bar-shaped trough (2) comprises a pair of of parallel adjacent setting, is described binding face (5) at this to the table top between the bar-shaped trough (2), and the positive and negative electrode of each high-power LED chip is realized serial or parallel connection by being located at this to the described supply line lath in the bar-shaped trough (2).
4. the heat radiation of high-powered LED lamp according to claim 1 and 2 and circuit seal is characterized in that: described supply line lath by prepreg hot pressing in described bar-shaped trough (2).
5. the heat radiation of high-powered LED lamp according to claim 1 and 2 and circuit seal is characterized in that: be coated with the high phosphorus nickel coating between luminous component of high-power LED chip (4) and the described binding face (5).
6. the heat radiation of high-powered LED lamp according to claim 1 and 2 and circuit seal, it is characterized in that: described cooling system comprises: respectively with described heat pipe (3) two ends radiating tubes that link to each other and that constitute heat-radiation loop (6); Be filled with refrigerant (7) in described heat pipe (3) and the radiating tube (6).
7. the heat radiation of high-powered LED lamp according to claim 6 and circuit seal is characterized in that: the height that described radiating tube (6) is provided with is higher than the whole height of described heat pipe (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102058770A CN102252206A (en) | 2011-07-22 | 2011-07-22 | Heat dissipation and circuit insulating device of high-power light emitting diode (LED) lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102058770A CN102252206A (en) | 2011-07-22 | 2011-07-22 | Heat dissipation and circuit insulating device of high-power light emitting diode (LED) lamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102252206A true CN102252206A (en) | 2011-11-23 |
Family
ID=44979666
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011102058770A Pending CN102252206A (en) | 2011-07-22 | 2011-07-22 | Heat dissipation and circuit insulating device of high-power light emitting diode (LED) lamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102252206A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103062731A (en) * | 2012-12-17 | 2013-04-24 | 秦大春 | Blowing-up plate type light-emitting diode (LED) street lamp radiator structure |
| CN109814296A (en) * | 2019-02-28 | 2019-05-28 | 深圳康佳电子科技有限公司 | A kind of blow-up plate type radiator piece and side entering type LCD TV |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101078835A (en) * | 2007-06-26 | 2007-11-28 | 上海广电光电子有限公司 | LED backlight module group |
| CN201281266Y (en) * | 2008-10-31 | 2009-07-29 | 包建敏 | High power LED road lighting lamp |
| CN101666440A (en) * | 2009-09-24 | 2010-03-10 | 汪纯燕 | High-power LED lamp |
| CN201652263U (en) * | 2009-11-23 | 2010-11-24 | 四川新力光源有限公司 | Heat radiating device of light-emitting diode (LED) illuminating lamp |
| CN202171146U (en) * | 2011-07-22 | 2012-03-21 | 常州市新华电子有限公司 | Radiating and circuit insulating device for large-power light-emitting diode (LED) lamp |
-
2011
- 2011-07-22 CN CN2011102058770A patent/CN102252206A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101078835A (en) * | 2007-06-26 | 2007-11-28 | 上海广电光电子有限公司 | LED backlight module group |
| CN201281266Y (en) * | 2008-10-31 | 2009-07-29 | 包建敏 | High power LED road lighting lamp |
| CN101666440A (en) * | 2009-09-24 | 2010-03-10 | 汪纯燕 | High-power LED lamp |
| CN201652263U (en) * | 2009-11-23 | 2010-11-24 | 四川新力光源有限公司 | Heat radiating device of light-emitting diode (LED) illuminating lamp |
| CN202171146U (en) * | 2011-07-22 | 2012-03-21 | 常州市新华电子有限公司 | Radiating and circuit insulating device for large-power light-emitting diode (LED) lamp |
Non-Patent Citations (1)
| Title |
|---|
| 徐瑞东等: "高磷非晶态镍磷合金镀层的研究", 《电镀与环保》 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103062731A (en) * | 2012-12-17 | 2013-04-24 | 秦大春 | Blowing-up plate type light-emitting diode (LED) street lamp radiator structure |
| CN109814296A (en) * | 2019-02-28 | 2019-05-28 | 深圳康佳电子科技有限公司 | A kind of blow-up plate type radiator piece and side entering type LCD TV |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101408298B (en) | Upright post type LED heat radiator | |
| CN201204203Y (en) | Radiating device for high-power LED | |
| CN102401360A (en) | High-power light emitting diode (LED) radiating structure | |
| CN201232984Y (en) | Radiating module for LED lamp | |
| CN102252206A (en) | Heat dissipation and circuit insulating device of high-power light emitting diode (LED) lamp | |
| CN202171146U (en) | Radiating and circuit insulating device for large-power light-emitting diode (LED) lamp | |
| CN201078677Y (en) | Upright post type LED heat radiator | |
| WO2011134121A1 (en) | Led light source module | |
| CN201425286Y (en) | Heat dissipation structure of LED lamp | |
| CN201448618U (en) | Dispersed liquid heat emission LED lamp | |
| CN201466057U (en) | High-power led circuit board | |
| CN203743906U (en) | LED with cooling system | |
| CN202048541U (en) | Circuit board assembly structure for SMT (surface mount technology) distribution constant current LED drive power supply | |
| CN204350537U (en) | For the cold drawing of gondola height heat power consumption electronic equipment dissipating heat | |
| CN206803064U (en) | High heat dissipation circuit board for LED lamps and lanterns | |
| CN104234280B (en) | LED efficiency efficiently changes hollow glass curtain wall attachment structure | |
| CN202423393U (en) | Radiating structure of LED (Light Emitting Diode) | |
| CN203533494U (en) | Heat dissipation system of high-power LED lamp | |
| CN203260619U (en) | Novel high-heat-conductivity COB substrate | |
| CN102036470A (en) | Low-thermal-resistance and high-radiation metal-base circuit board | |
| CN201903030U (en) | Radiating structure used for high power LED (light emitting diode) lamp | |
| CN215680686U (en) | Packaging structure of high-power diode | |
| CN206743642U (en) | A kind of light-emitting diode display double-sided PCB | |
| CN202203720U (en) | LED (light emitting diode) light source module | |
| CN206365150U (en) | A kind of New LED single-sided aluminum-base plate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20111123 |