CN101963288A - Light-emitting structure capable of improving light-emitting efficiency and controlling emergent angle and manufacture method thereof - Google Patents
Light-emitting structure capable of improving light-emitting efficiency and controlling emergent angle and manufacture method thereof Download PDFInfo
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- CN101963288A CN101963288A CN2009101574036A CN200910157403A CN101963288A CN 101963288 A CN101963288 A CN 101963288A CN 2009101574036 A CN2009101574036 A CN 2009101574036A CN 200910157403 A CN200910157403 A CN 200910157403A CN 101963288 A CN101963288 A CN 101963288A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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Abstract
The invention relates to a light-emitting structure capable of improving light-emitting efficiency and controlling an emergent angle, which comprises a base plate unit, a light-emitting unit, a reflecting unit and a packaging unit, wherein the base plate unit is provided with a base plate body and a crystal placing area; the light-emitting unit is provided with a plurality of light-emitting diode (LED) grains which are electrically arranged on the crystal placing area; the reflecting unit is provided with a surrounding type reflecting colloid which is annularly formed on the upper surface of the base plate body in a coating way; the surrounding type reflecting colloid surrounds the LED grains which are arranged on the crystal placing area to form a colloid limiting space above the base plate body; the packaging unit is provided with a transmitted packaging colloid which is formed on the upper surface of the base plate body to cover the LED grains; and the transmitted packaging colloid is limited in the colloid limiting space, thereby improving the light-emitting efficiency of an LED packaging structure.
Description
Technical field
The present invention relates to a kind of package structure for LED and preparation method thereof, refer to a kind of ray structure that improves luminous efficiency and control rising angle and preparation method thereof especially.
Background technology
The invention of electric light can be described as the life style that has changed the whole mankind up hill and dale, if our life does not have electric light, when night or weather conditions are not good, the work of all will be stopped; If be subject to illumination, building construction mode or human life style are thoroughly changed, therefore the whole mankind will can't improve, the age that stays on and fall behind.
Be with, today employed on the market lighting apparatus, for example: fluorescent lamp, tengsten lamp even the more popular till now Electricity-saving lamp bulb of being accepted are widely used in the middle of the daily life all.Yet this type of electric light has fast, the high power consumption of optical attenuation mostly, be easy to generate high heat, the life-span is short, frangible or shortcoming such as difficult recovery.Moreover; the color rendering of traditional fluorescent lamp is relatively poor; so produce pale light and be out of favour; in addition because principle of luminosity is 120 times quick flowing in a second of fluorescent tube two utmost point electronics; when firm unlatching and electric current instability, cause flicker easily; this phenomenon is considered to cause the arch-criminal of domestic high rate of myopia usually; but this problem can solve by means of the fluorescent tube of repacking with " high-frequency electrical minor stabilizer "; its high-frequency electrical minor stabilizer not only can fall 20% to the power consumption of traditional fluorescent lamp again; when lighting a lamp because of high frequency moment again; the light wave of output is highly stable; therefore almost flicker free takes place; and when power supply voltage variation or fluorescent tube are in low temperature, be not easy to produce flicker, this helps the protection of eyesight.Yet the stabilizer of general Electricity-saving lamp bulb and power-saving lighting tube all is fixed, if eliminate the words of trade-in, must connect stabilizer abandons together, moreover no matter fluorescent tube how power saving again,, still inevitably environment is caused serious pollution after discarded because of it contains the coating of mercury.
Therefore, in order to solve the above problems, light emitting diode bulb or light-emitting diode lamp tube in response to and give birth to, the employed light-emitting diode chip for backlight unit of known light emitting diode bulb or light-emitting diode lamp tube generally all cooperates a white framework to increase the light extraction efficiency of light-emitting diode chip for backlight unit.Yet, the known white framework that adopts all is to make by a shaping dies, therefore not only increase the cost of making, and when the shape of white framework need change, the shape of shaping dies also will change, so in the time will developing a kind of new product, shaping dies also will and then be developed.Therefore, known employed white framework on changing without any elasticity can say.
So, the improving of the above-mentioned defective of inventor's thoughts, and according to the correlation experience of being engaged in for many years in this respect, the concentrated observation and research, and cooperate the utilization of scientific principle, and propose a kind of reasonable in design and effectively improve the present invention of above-mentioned defective.
Summary of the invention
Technical problem to be solved by this invention is to provide a kind of ray structure that improves luminous efficiency and control rising angle and preparation method thereof.The mode of the present invention by coating is with the reflective colloid of circulating type that can be arbitrary shape that is shaped (circulating type white colloid), therefore and with position of limiting to a printing opacity packing colloid (fluorescent colloid) and the surface configuration of adjusting this printing opacity packing colloid, package structure for LED of the present invention can " improve the luminous efficiency of LED crystal particle " and reach " rising angle of controlling LED crystal particle " by the reflective colloid of this circulating type.
In order to solve the problems of the technologies described above, according to wherein a kind of scheme of the present invention, provide a kind of ray structure that improves luminous efficiency and control rising angle, it comprises: a base board unit, a luminescence unit, a reflecting unit and an encapsulation unit.Wherein, this base board unit has the crystal area that a substrate body and is arranged at this substrate body upper surface.This luminescence unit has many LED crystal particles on the crystal area that is arranged at this base board unit electrically.This reflecting unit has one and forms in the reflective colloid of circulating type of this substrate body upper surface by the mode of coating around ground, wherein the reflective colloid of this circulating type is arranged at LED crystal particle on this crystal area around those, to form a spacing space of colloid that is positioned at this substrate body top.This encapsulation unit has one and forms in this substrate body upper surface to cover the printing opacity packing colloid of those LED crystal particles, and wherein this printing opacity packing colloid is limited in the spacing space of this colloid.
In order to solve the problems of the technologies described above, according to wherein a kind of scheme of the present invention, provide a kind of underlying structure that can improve luminous efficiency and control rising angle, it comprises: a base board unit and a reflecting unit.Wherein, this base board unit has the crystal area that a substrate body and is arranged at this substrate body upper surface.This reflecting unit has one and forms in the reflective colloid of circulating type of this substrate body upper surface by the mode of coating around ground, and wherein the reflective colloid of this circulating type is around this crystal area, to form a spacing space of colloid that is positioned at this substrate body top.
In order to solve the problems of the technologies described above, according to wherein a kind of scheme of the present invention, a kind of preparation method that improves the ray structure of luminous efficiency and control rising angle is provided, it comprises the following steps: at first, one base board unit is provided, and it has the crystal area that a substrate body and is arranged at this substrate body upper surface; Then, optionally execution in step (a) or step (b), wherein step (a) is: earlier many LED crystal particles are arranged on the crystal area of this base board unit electrically, and then be coated with liquid glue material in this substrate body upper surface around ground, solidify this liquid state glue material at last again to form the reflective colloid of a circulating type; Step (b) is: be coated with liquid glue material in this substrate body upper surface around ground earlier, and then solidify this liquid state glue material to form the reflective colloid of a circulating type, more LED crystal particles are arranged on the crystal area of this base board unit electrically at last; Wherein the reflective colloid of this circulating type is arranged at LED crystal particle on this crystal area around those, to form a spacing space of colloid that is positioned at this substrate body top; At last, the printing opacity packing colloid that is shaped is in the upper surface of this substrate body, and to cover those LED crystal particles, wherein this printing opacity packing colloid is limited in the spacing space of this colloid.
Therefore, beneficial effect of the present invention is: by means of the use of the reflective colloid of this circulating type, so that this printing opacity packing colloid is limited in the spacing space of this colloid, and then can control " use amount of this printing opacity packing colloid and position "; Moreover by means of use amount and the position of controlling this printing opacity packing colloid, with surface configuration and the height of adjusting this printing opacity packing colloid, and then control " rising angle of the white light beam that those LED crystal particles produced "; In addition, the present invention also can be by means of the use of the reflective colloid of this circulating type, so that the light beam that those LED crystal particles produced projects the inwall of the reflective colloid of this circulating type and produces reflection, and then can increase " luminous efficiency of package structure for LED of the present invention ".
Reach technology, means and the effect that predetermined purpose is taked in order further to understand the present invention, see also following about detailed description of the present invention and accompanying drawing, believe purpose of the present invention, feature and characteristics, go deep into and concrete understanding when getting one thus, yet accompanying drawing only provides reference and explanation usefulness, is not to be used for the present invention is limited.
Description of drawings
Fig. 1 can improve the flow chart of first embodiment of preparation method of the ray structure of luminous efficiency and control rising angle for the present invention;
Figure 1A to Fig. 4 B is respectively the making schematic flow sheet of first embodiment that the present invention can improve the ray structure of luminous efficiency and control rising angle;
Fig. 5 can improve the flow chart of second embodiment of preparation method of the ray structure of luminous efficiency and control rising angle for the present invention;
Fig. 5 A to Fig. 5 C is respectively the making schematic flow sheet of second embodiment that the present invention can improve the ray structure of luminous efficiency and control rising angle;
Fig. 6 can improve the generalized section of the 3rd embodiment of the ray structure of luminous efficiency and control rising angle for the present invention;
Fig. 7 A can improve the schematic perspective view of the 4th embodiment of the ray structure of luminous efficiency and control rising angle for the present invention;
Fig. 7 B can improve the generalized section of the 4th embodiment of the ray structure of luminous efficiency and control rising angle for the present invention;
Fig. 8 A can improve the schematic perspective view of the 5th embodiment of the ray structure of luminous efficiency and control rising angle for the present invention; And
Fig. 8 B can improve the generalized section of the 5th embodiment of the ray structure of luminous efficiency and control rising angle for the present invention.
[main element description of reference numerals]
[first embodiment]
Base board unit 1a substrate body 10a
Heat dissipating layer 101a
The reflective colloid 30a of reflecting unit 3a circulating type
The spacing space 300a of colloid
Circular arc tangential line T
Angle θ
Height H
Blue light beam L1
White light beam L2
[second embodiment]
Heat dissipating layer 101b
The reflective colloid 30b of reflecting unit 3b circulating type
The spacing space 300b of colloid
Circular arc tangential line T
Angle θ
Height H
Blue light beam L1
White light beam L2
[the 3rd embodiment]
Printing opacity packing colloid 40c
[the 4th embodiment]
The spacing space 300d of colloid
[the 5th embodiment]
Base board unit 1e
The spacing space 300e of colloid
The specific embodiment
See also shown in Figure 1, first embodiment of the invention provides a kind of preparation method that improves the ray structure of luminous efficiency and control rising angle, it comprises: at first, provide a base board unit, it has the crystal area that a substrate body and is arranged at this substrate body upper surface; Then, earlier many LED crystal particles are arranged on the crystal area of this base board unit electrically; Then be coated with liquid glue material in this substrate body upper surface around ground again; And then solidify this liquid state glue material forming the reflective colloid of a circulating type, and the reflective colloid of this circulating type is arranged at LED crystal particle on this crystal area around those, to form a spacing space of colloid that is positioned at this substrate body top; At last, the printing opacity packing colloid that is shaped is in the upper surface of this substrate body, and to cover those LED crystal particles, wherein this printing opacity packing colloid is limited in the spacing space of this colloid.
Please cooperate Fig. 1 and consult shown in Figure 1A to Fig. 4 B, below with first embodiment of the invention disclosed " can improve the preparation method of the ray structure of luminous efficiency and control rising angle ", carry out the description of thin portion:
Please cooperate shown in Fig. 1, Figure 1A and Figure 1B (Figure 1B is the profile of Figure 1A), at first, provide a base board unit 1a, it has the crystal area 11a (step S100) that a substrate body 10a and is arranged at this substrate body 10a upper surface.Wherein, this substrate body 10a has a circuit substrate 100a, and is arranged at the heat dissipating layer 101a of this circuit substrate 100a bottom, a plurality of conductive welding pad 102a that is arranged at this circuit substrate 100a upper surface, and one is arranged at this circuit substrate 100a upper surface and is used to expose the insulating barrier 103a of those conductive welding pad 102a.Therefore, this heat dissipating layer 101a can be used for increasing the heat dissipation of this circuit substrate 100a, and those insulating barriers 103a is a kind of welding resisting layer that can be used for only allowing those conductive welding pad 102a expose out and reach the limitation welding region.
Yet above-mentioned is not that the substrate of any pattern is all the applicable category of the present invention such as in order to qualification the present invention for defining of substrate body 10a.For example: this substrate body 10a can be a printed circuit board (PCB), a soft base plate, an aluminium base, a ceramic substrate or a copper base.
Please cooperate shown in Fig. 1, Fig. 2 A and Fig. 2 B (Fig. 2 B is the profile of Fig. 2 A), the crystal area 11a that many LED crystal particle 20a is arranged at electrically this base board unit 1a goes up (step S102).In other words, the designer can cook up a predetermined crystal area 11a in advance on this base board unit 1a, so that those LED crystal particles 20a can be placed on the crystal area 11a of this base board unit 1a electrically.With first embodiment of the invention for example, the mode of those LED crystal particles 20a by routing (wire-bonding) is on the crystal area 11a that is arranged at this base board unit 1a electrically.
Please cooperate Fig. 1, shown in Fig. 3 A and Fig. 3 B (Fig. 3 B is the profile of Fig. 3 A), at first, be coated with liquid glue material (figure does not show) in this substrate body 10a upper surface (step S104) around ground, it is (for example circular wherein should liquid state glue material can optionally to be surrounded into a predetermined shape, square, rectangle or the like), the thixotropic index of this liquid state glue material (thixotropic index) is between 4-6, be coated with this liquid state glue material in the pressure of this substrate body 10a upper surface between 350-450kpa, be coated with this liquid state glue material in the speed of this substrate body 10a upper surface between 5-15mm/s, and to be coated with this liquid state glue material around ground be identical position in the starting point of this substrate body 10a upper surface with terminating point; Then, solidify this liquid state glue material again to form the reflective colloid 30a of a circulating type, and the reflective colloid 30a of this circulating type is arranged at LED crystal particle 20a on the 11a of this crystal area around those, to form a colloid spacing space 300a (step 8106) who is positioned at this substrate body 10a top, wherein should harden by the mode of baking by liquid state glue material, the temperature of baking is between the 120-140 degree, and the time of baking is between 20-40 minute.
Moreover, the upper surface of the reflective colloid 30a of this circulating type can be a circular arc, the reflective colloid 30a of this circulating type with respect to the angle θ of the circular arc tangential line T of this substrate body 10a upper surface between 40～50 degree, the end face of the reflective colloid 30a of this circulating type with respect to the height H of this substrate body 10a upper surface between 0.3～0.7mm, the width of the reflective colloid 30a of this circulating type bottom is between 1.5～3mm, and the thixotropic index of the reflective colloid 30a of this circulating type (thixotropic index) is between 4-6.In addition, the cross section of the spacing space 300a of this colloid can be circle, ellipse or polygon (for example: square, rectangle or the like), and with first embodiment of the invention, the cross section of the spacing space 300a of this colloid is circular.
Please cooperate shown in Fig. 1, Fig. 4 A and Fig. 4 B (Fig. 4 B is the profile of Fig. 4 A), be shaped a printing opacity packing colloid 40a in the upper surface of this substrate body 10a, to cover those LED crystal particles 20a, wherein this printing opacity packing colloid 40a is limited in the spacing space 300a of this colloid (step S108), the reflective colloid 30a of this circulating type can be a white hot that the is mixed with inorganic additive reflective colloid (light tight colloid) that hardens, and the upper surface of this printing opacity packing colloid 40a is a convex surface.
With first embodiment of the invention for example, each LED crystal particle 20a can be a blue LED crystal grain, and this printing opacity packing colloid 40a can be a fluorescent colloid, therefore the blue light beam L1 that cast out of those LED crystal particles 20a (those blue LED crystal grain) can pass this printing opacity packing colloid 40a (this fluorescent colloid), to produce the white light beam L2 in similar fluorescent lamp source.
In other words, by means of the use of the reflective colloid 30a of this circulating type,, and then can control " use amount of this printing opacity packing colloid 40a " so that this printing opacity packing colloid 40a is limited in the spacing space 300a of this colloid; Moreover by means of the use amount of controlling this printing opacity packing colloid 40a, with surface configuration and the height of adjusting this printing opacity packing colloid 40a, and then control " rising angle of the white light beam L2 that those LED crystal particles 20a is produced "; In addition, the present invention also can be by means of the use of the reflective colloid 30a of this circulating type, so that the white light beam L1 that those LED crystal particles 20a is produced projects the inwall of the reflective colloid 30a of this circulating type and produces reflection, and then can increase " luminous efficiency of package structure for LED of the present invention ".
See also shown in Figure 5, second embodiment of the invention provides a kind of preparation method that improves the ray structure of luminous efficiency and control rising angle, it comprises: at first, provide a base board unit, it has the crystal area that a substrate body and is arranged at this substrate body upper surface; Then, be coated with liquid glue material in this substrate body upper surface around ground earlier; Then solidify this liquid state glue material again forming the reflective colloid of a circulating type, and the reflective colloid of this circulating type is arranged at LED crystal particle on this crystal area around those, to form a spacing space of colloid that is positioned at this substrate body top; And then many LED crystal particles are arranged at electrically on the crystal area of this base board unit; At last, the printing opacity packing colloid that is shaped is in the upper surface of this substrate body, and to cover those LED crystal particles, wherein this printing opacity packing colloid is limited in the spacing space of this colloid.
Please cooperate Fig. 5 and consult shown in Fig. 5 A to Fig. 5 C, below with second embodiment of the invention disclosed " can improve the preparation method of the ray structure of luminous efficiency and control rising angle ", carry out the description of thin portion:
Please cooperate shown in Fig. 5 and Fig. 5 A, at first, provide a base board unit 1b, it has the crystal area 11b (step S200) that a substrate body 10b and is arranged at this substrate body 10b upper surface.Wherein, this substrate body 10b has a circuit substrate 100b, and is arranged at the heat dissipating layer 101b of this circuit substrate 100b bottom, a plurality of conductive welding pad 102b that is arranged at this circuit substrate 100b upper surface, and one is arranged at this circuit substrate 100b upper surface and is used to expose the insulating barrier 103b of those conductive welding pad 102b.
Please cooperate shown in Fig. 5 and Fig. 5 A, be coated with liquid glue material (figure does not show) in this substrate body 10b upper surface (step S202) around ground, it is (for example circular wherein should liquid state glue material can optionally to be surrounded into a predetermined shape, square, rectangle or the like), the thixotropic index of this liquid state glue material (thixotropic index) is between 4-6, be coated with this liquid state glue material in the pressure of this substrate body 10b upper surface between 350-450kpa, be coated with this liquid state glue material in the speed of this substrate body 10b upper surface between 5-15mm/s, and to be coated with this liquid state glue material around ground be identical position in the starting point of this substrate body 10b upper surface with terminating point; Then, solidify this liquid state glue material again to form the reflective colloid 30b of a circulating type, and the reflective colloid 30b of this circulating type is around this crystal area 11b, to form a spacing space 300b of colloid (step S204) that is positioned at this substrate body 10b top, wherein should harden by the mode of baking by liquid state glue material, the temperature of baking is between the 120-140 degree, and the time of baking is between 20-40 minute.
Moreover, the upper surface of the reflective colloid 30b of this circulating type can be a circular arc, the reflective colloid 30b of this circulating type with respect to the angle θ of the circular arc tangential line T of this substrate body 10b upper surface between 40～50 degree, the end face of the reflective colloid 30b of this circulating type with respect to the height H of this substrate body 10b upper surface between 0.3～0.7mm, the width of the reflective colloid 30b of this circulating type bottom is between 1.5～3mm, and the thixotropic index of the reflective colloid 30b of this circulating type (thixotropic index) is between 4-6.In addition, the cross section of the spacing space 300b of this colloid can be circle, ellipse or polygon (for example: square, rectangle or the like).
Please cooperate shown in Fig. 5 and Fig. 5 B, the crystal area 11b that many LED crystal particle 20b is arranged at electrically this base board unit 1b goes up (step S206), and the reflective colloid 30b of this circulating type is arranged at LED crystal particle 20b on the 11b of this crystal area around those.In other words, the designer can cook up a predetermined crystal area 11b in advance on this base board unit 1b, so that those LED crystal particles 20b can be placed on the crystal area 11b of this base board unit 1b electrically.
Please cooperate shown in Fig. 5 and Fig. 5 C, be shaped a printing opacity packing colloid 40b in the upper surface of this substrate body 10b, to cover those LED crystal particles 20b, wherein this printing opacity packing colloid 40b is limited in the spacing space 300b of this colloid (step S208), the reflective colloid 30b of this circulating type can be a white hot that the is mixed with inorganic additive reflective colloid that hardens, and the upper surface of this printing opacity packing colloid 40b is a convex surface.
With second embodiment of the invention for example, each LED crystal particle 20b can be a blue LED crystal grain, and this printing opacity packing colloid 40b can be a fluorescent colloid, therefore the blue light beam L 1 that cast out of those LED crystal particles 20b (those blue LED crystal grain) can pass this printing opacity packing colloid 40b (this fluorescent colloid), to produce the white light beam L2 in similar fluorescent lamp source.
Therefore, by above-mentioned Fig. 1 and Fig. 5 as can be known, a kind of preparation method that improves the ray structure of luminous efficiency and control rising angle provided by the present invention, it comprises: at first, one base board unit is provided, and it has the crystal area that a substrate body and is arranged at this substrate body upper surface; Then, optionally execution in step (a) or step (b), wherein step (a) is: earlier many LED crystal particles are arranged on the crystal area of this base board unit electrically, and then be coated with liquid glue material in this substrate body upper surface around ground, solidify this liquid state glue material at last again to form the reflective colloid of a circulating type; Step (b) is: be coated with liquid glue material in this substrate body upper surface around ground earlier, and then solidify this liquid state glue material to form the reflective colloid of a circulating type, more LED crystal particles are arranged on the crystal area of this base board unit electrically at last; The reflective colloid of this circulating type is arranged at LED crystal particle on this crystal area around those in addition, to form a spacing space of colloid that is positioned at this substrate body top; At last, the printing opacity packing colloid that is shaped is in the upper surface of this substrate body, and to cover those LED crystal particles, wherein this printing opacity packing colloid is limited in the spacing space of this colloid.
Moreover, by means of above-mentioned preparation method, see also shown in Fig. 4 A, Fig. 4 B and Fig. 5 C, the invention provides a kind of ray structure that improves luminous efficiency and control rising angle, it comprises: a base board unit (1a, 1b), a luminescence unit (2a, 2b), a reflecting unit (3a, 3b) and an encapsulation unit (4a, 4b).
Wherein, this base board unit (1a, 1b) has the crystal area (11a, 11b) that a substrate body (10a, 10b) and is arranged at this substrate body (10a, 10b) upper surface.This luminescence unit (2a, 2b) has many LED crystal particles (20a, 20b) on the crystal area (11a, 11b) that is arranged at this base board unit (1a, 1b) electrically.
In addition, this reflecting unit (3a, 3b) has one and forms in the reflective colloid of circulating type (30a, 30b) of this substrate body (10a, 10b) upper surface by the mode of coating around ground, wherein the reflective colloid of this circulating type (30a, 30b) is arranged at LED crystal particle (20a, 20b) on this crystal area (11a, 11b) around those, to form a spacing space of colloid (300a, 300b) that is positioned at this substrate body (10a, 10b) top.
In addition, this encapsulation unit (4a, 4b) has one and forms in the printing opacity packing colloid (40a, 40b) of this substrate body (10a, 10b) upper surface to cover those LED crystal particles (20a, 20b), and wherein this printing opacity packing colloid (40a, 40b) is limited in the spacing space of this colloid (300a, 300b).
Moreover this base board unit (1a, 1b) and this reflecting unit (3a, 3b) are combined into a kind of underlying structure that can improve luminous efficiency and control rising angle, that is underlying structure of the present invention can be applicable in any field of light fittings with light-emitting component.
See also shown in Figure 6ly, third embodiment of the invention is with the different of above-mentioned first and second embodiment maximum: in the 3rd embodiment, the upper surface of this printing opacity packing colloid 40c is a concave surface.Certainly, according to different design requirements, the upper surface of this printing opacity packing colloid 40c also can be a plane (figure does not show).
See also shown in Fig. 7 A and Fig. 7 B, fourth embodiment of the invention is with the different of above-mentioned first and second embodiment maximum: in the 4th embodiment, the cross section of the spacing space 300d of this colloid is square, and therefore the package structure for LED of the 4th embodiment can produce similar square light-emitting zone.In addition, the area of this base board unit 1d strengthens (increase area of dissipation) especially, to be used to increase the radiating efficiency of this luminescence unit 2d.
See also shown in Fig. 8 A and Fig. 8 B, fifth embodiment of the invention is with the different of above-mentioned first and second embodiment maximum: in the 5th embodiment, the cross section of the spacing space 300e of this colloid is a rectangle, and therefore the package structure for LED of the 5th embodiment can produce the light-emitting zone of strip.In addition, the area of this base board unit 1e strengthens (increase area of dissipation) especially, to be used to increase the radiating efficiency of this luminescence unit 2e.
In sum, the mode of the present invention by coating is with the reflective colloid of circulating type that can be arbitrary shape that is shaped (circulating type white colloid), therefore and with position of limiting to a printing opacity packing colloid (fluorescent colloid) and the surface configuration of adjusting this printing opacity packing colloid, package structure for LED of the present invention can " improve the luminous efficiency of LED crystal particle " and reach " rising angle of controlling LED crystal particle " by the reflective colloid of this circulating type.
In other words, by means of the use of the reflective colloid of this circulating type,, and then can control " use amount of this printing opacity packing colloid and position " so that this printing opacity packing colloid is limited in the spacing space of this colloid; Moreover by means of use amount and the position of controlling this printing opacity packing colloid, with surface configuration and the height of adjusting this printing opacity packing colloid, and then control " rising angle of the white light beam that those LED crystal particles produced "; In addition, the present invention also can be by means of the use of the reflective colloid of this circulating type, so that the light beam that those LED crystal particles produced projects the inwall of the reflective colloid of this circulating type and produces reflection, and then can increase " luminous efficiency of package structure for LED of the present invention ".
But; all scopes of the present invention should be as the criterion with described claim; all closing in the embodiment of the spirit variation similar of claim of the present invention with it; all should be contained in the category of the present invention; any those of ordinary skill in the field of the invention, can think easily and variation or revise all can be encompassed in the claim protection domain of this case.
Claims (10)
1. the ray structure that can improve luminous efficiency and control rising angle is characterized in that, comprising:
One base board unit, it has the crystal area that a substrate body and is arranged at this substrate body upper surface;
One luminescence unit, it has many LED crystal particles on the crystal area that is arranged at this base board unit electrically;
One reflecting unit, it has one and forms in the reflective colloid of circulating type of this substrate body upper surface by the mode of coating around ground, wherein the reflective colloid of this circulating type is arranged at LED crystal particle on this crystal area around those, to form a spacing space of colloid that is positioned at this substrate body top; And
One encapsulation unit, it has one and forms in this substrate body upper surface to cover the printing opacity packing colloid of those LED crystal particles, and wherein this printing opacity packing colloid is limited in the spacing space of this colloid.
2. the ray structure that improves luminous efficiency and control rising angle as claimed in claim 1 is characterized in that: this substrate body has a circuit substrate, and is arranged at the heat dissipating layer of this circuit substrate bottom, a plurality of conductive welding pad that is arranged at this circuit substrate upper surface, an and insulating barrier that is arranged at this circuit substrate upper surface and is used to expose those conductive welding pad.
3. the ray structure that improves luminous efficiency and control rising angle as claimed in claim 1, it is characterized in that: each LED crystal particle is a blue LED crystal grain, and this printing opacity packing colloid is a fluorescent colloid.
4. the ray structure that improves luminous efficiency and control rising angle as claimed in claim 1, it is characterized in that: the cross section in this spacing space of colloid is circle, ellipse or polygon.
5. the ray structure that improves luminous efficiency and control rising angle as claimed in claim 1, it is characterized in that: the upper surface of the reflective colloid of this circulating type is a circular arc; The reflective gel phase of this circulating type for the angle of the circular arc tangential line of this substrate body upper surface between 40～50 degree; Between 0.3～0.7mm, the width of the reflective colloid of this circulating type bottom is between 1.5～3mm with respect to the height of this substrate body upper surface for the end face of the reflective colloid of this circulating type, and the thixotropic index of the reflective colloid of this circulating type is between 4-6.
6. the ray structure that improves luminous efficiency and control rising angle as claimed in claim 1, it is characterized in that: the reflective colloid of this circulating type is a white hot that the is mixed with inorganic additive reflective colloid that hardens.
7. the underlying structure that can improve luminous efficiency and control rising angle is characterized in that, comprising:
One base board unit, it has the crystal area that a substrate body and is arranged at this substrate body upper surface; And
One reflecting unit, it has one and forms in the reflective colloid of circulating type of this substrate body upper surface by the mode of coating around ground, and wherein the reflective colloid of this circulating type is around this crystal area, to form a spacing space of colloid that is positioned at this substrate body top.
8. the underlying structure that can improve luminous efficiency and control rising angle as claimed in claim 7, it is characterized in that: the cross section in this spacing space of colloid is for circular, ellipse or polygon, the upper surface of the reflective colloid of this circulating type is a circular arc, the reflective gel phase of this circulating type for the angle of the circular arc tangential line of this substrate body upper surface between 40～50 degree, the end face of the reflective colloid of this circulating type with respect to the height of this substrate body upper surface between 0.3～0.7mm, the width of the reflective colloid of this circulating type bottom is between 1.5～3mm, the thixotropic index of the reflective colloid of this circulating type is between 4-6, and the reflective colloid of this circulating type is a white hot that the is mixed with inorganic additive reflective colloid that hardens.
9. the preparation method that can improve the ray structure of luminous efficiency and control rising angle is characterized in that, comprises the following steps:
One base board unit is provided, and it has the crystal area that a substrate body and is arranged at this substrate body upper surface;
Optionally execution in step a or step b, wherein step a is: earlier many LED crystal particles are arranged on the crystal area of this base board unit electrically, and then be coated with liquid glue material in this substrate body upper surface around ground, solidify this liquid state glue material at last again to form the reflective colloid of a circulating type; Step b is: be coated with liquid glue material in this substrate body upper surface around ground earlier, and then solidify this liquid state glue material to form the reflective colloid of a circulating type, more LED crystal particles are arranged on the crystal area of this base board unit electrically at last; Wherein the reflective colloid of this circulating type is arranged at LED crystal particle on this crystal area around those, to form a spacing space of colloid that is positioned at this substrate body top; And
Be shaped a printing opacity packing colloid in the upper surface of this substrate body, and to cover those LED crystal particles, wherein this printing opacity packing colloid is limited in the spacing space of this colloid.
10. the preparation method that improves the ray structure of luminous efficiency and control rising angle as claimed in claim 9, it is characterized in that: this liquid state glue material hardens by the mode of baking, the temperature of baking is between the 120-140 degree, the time of baking is between 20-40 minute, be coated with this liquid state glue material in the pressure of this substrate body upper surface between 350-450kpa, and be coated with this liquid state glue material in the speed of this substrate body upper surface between 5-15mm/s.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101574036A CN101963288A (en) | 2009-07-24 | 2009-07-24 | Light-emitting structure capable of improving light-emitting efficiency and controlling emergent angle and manufacture method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101574036A CN101963288A (en) | 2009-07-24 | 2009-07-24 | Light-emitting structure capable of improving light-emitting efficiency and controlling emergent angle and manufacture method thereof |
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| Publication Number | Publication Date |
|---|---|
| CN101963288A true CN101963288A (en) | 2011-02-02 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2009101574036A Pending CN101963288A (en) | 2009-07-24 | 2009-07-24 | Light-emitting structure capable of improving light-emitting efficiency and controlling emergent angle and manufacture method thereof |
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| CN (1) | CN101963288A (en) |
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| CN102425737A (en) * | 2011-12-14 | 2012-04-25 | 中山市共炫光电科技有限公司 | Efficient LED (light-emitting diode) lamp |
| CN102800783A (en) * | 2011-05-25 | 2012-11-28 | 宏齐科技股份有限公司 | Light-emitting diode packaging structure with symmetrical reflective framework and method for manufacturing light-emitting diode packaging structure |
| CN103165591A (en) * | 2011-12-15 | 2013-06-19 | 宙达光子实业股份有限公司 | Light-emitting diode (LED) area light source module and packaging method thereof |
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| CN103247749A (en) * | 2012-02-06 | 2013-08-14 | 东莞柏泽光电科技有限公司 | Multiple-chip encapsulation structure and manufacturing method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102800783A (en) * | 2011-05-25 | 2012-11-28 | 宏齐科技股份有限公司 | Light-emitting diode packaging structure with symmetrical reflective framework and method for manufacturing light-emitting diode packaging structure |
| CN103165589A (en) * | 2011-12-08 | 2013-06-19 | 东莞柏泽光电科技有限公司 | Mixed light type polycrystal packaging structure |
| CN102425737A (en) * | 2011-12-14 | 2012-04-25 | 中山市共炫光电科技有限公司 | Efficient LED (light-emitting diode) lamp |
| CN103165591A (en) * | 2011-12-15 | 2013-06-19 | 宙达光子实业股份有限公司 | Light-emitting diode (LED) area light source module and packaging method thereof |
| CN103247749A (en) * | 2012-02-06 | 2013-08-14 | 东莞柏泽光电科技有限公司 | Multiple-chip encapsulation structure and manufacturing method thereof |
| CN103311401A (en) * | 2012-03-14 | 2013-09-18 | 华新丽华股份有限公司 | Substrate for bearing light-emitting diode and manufacturing method of substrate |
| CN103489984A (en) * | 2012-06-13 | 2014-01-01 | 亿光电子工业股份有限公司 | Light-emitting diode packaging structure and manufacturing method thereof |
| CN115249440A (en) * | 2022-07-18 | 2022-10-28 | 武汉恩倍思科技有限公司 | Photoelectric glass display screen and process |
| CN115249440B (en) * | 2022-07-18 | 2023-08-25 | 武汉恩倍思科技有限公司 | Photoelectric glass display screen and process |
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Application publication date: 20110202 |