CN201503861U - Light-emitting diode packaging structure capable of lightening light source in areas - Google Patents
Light-emitting diode packaging structure capable of lightening light source in areas Download PDFInfo
- Publication number
- CN201503861U CN201503861U CN2009201775030U CN200920177503U CN201503861U CN 201503861 U CN201503861 U CN 201503861U CN 2009201775030 U CN2009201775030 U CN 2009201775030U CN 200920177503 U CN200920177503 U CN 200920177503U CN 201503861 U CN201503861 U CN 201503861U
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- Prior art keywords
- welding pad
- conductive welding
- negative pole
- those
- colloid
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
A light-emitting diode packaging structure capable of lightening a light source in areas comprises a substrate unit, a luminous unit, a conductive unit and a packaging unit, wherein the substrate unit includes a substrate body, a plurality of crystal grain holding areas and a plurality of positive electrode conductive solder pads and negative electrode conductive solder pads; the positive electrode conductive solder pads are divided into a plurality of positive electrode conductive solder pad groups which are electrically insulated to each other; the positive electrode conductive solder pads of each of the positive electrode conductive solder pad groups are electrically connected with each other; the negative electrode conductive solder pads are divided into a plurality of negative electrode conductive solder pad groups which are electrically insulated to each other; and the negative electrode conductive solder pads of each of the negative electrode conductive solder pad groups are electrically connected with each other. The luminous unit is provided with a plurality of light-emitting diode crystal grains positioned on the substrate body. The packaging unit is provided with light-transmitting packaging colloid which is formed on the upper surface of the substrate body so as to cover the luminous unit and the conductive unit.
Description
Technical field
The utility model is relevant for a kind of package structure for LED, but refers to a kind of package structure for LED of subregion point bright light source especially.
Background technology
Press, the invention of electric light can be described as the life style that has changed the whole mankind up hill and dale, if our life does not have electric light, when night or weather conditions are not good, the work of all will be stopped; If be subject to illumination, building construction mode or human life style are thoroughly changed, therefore the whole mankind will can't improve, the age that stays on and fall behind.
Therefore, today employed on the market lighting apparatus, for example: fluorescent lamp, tungsten lamp even the more popular till now Electricity-saving lamp bulb of being accepted are widely used in the middle of the daily life all.Yet this type of electric light has fast, the high power consumption of optical attenuation mostly, be easy to generate high heat, the life-span is short, frangible or shortcoming such as difficult recovery.Therefore, in order to solve the above problems, light emitting diode bulb or light-emitting diode lamp tube in response to and give birth to.
The utility model content
But main purpose of the present utility model is to provide a kind of package structure for LED of subregion point bright light source, and it can light the light source of zones of different respectively along with user's different user demands.
In order to solve the problems of the technologies described above, according to wherein a kind of scheme of the present utility model, but provide a kind of package structure for LED of subregion point bright light source, it comprises: a base board unit, a luminescence unit, a conductive unit and an encapsulation unit.This base board unit has a substrate body and a plurality of crystal area that is arranged at this substrate body upper surface, and the upper surface of this substrate body has a plurality of anodal conductive welding pad and a plurality of negative pole conductive welding pad, wherein those anodal conductive welding pad are distinguished into the many groups of anodal conductive welding pad groups that are electrically insulated each other, each those anodal conductive welding pad of organizing anodal conductive welding pad group is electrically connected to each other, and those negative pole conductive welding pad are distinguished into the many groups of negative pole conductive welding pad groups that are electrically insulated each other, and those negative pole conductive welding pad of each group negative pole conductive welding pad group are electrically connected to each other.This luminescence unit has many LED crystal particle that are arranged at respectively on those crystal areas.This conductive unit has many leads, and wherein each LED crystal particle sees through per two leads and is electrically connected between each anodal conductive welding pad and each the negative pole conductive welding pad.This encapsulation unit has one and forms in this substrate body upper surface to cover the printing opacity packing colloid of this luminescence unit and this conductive unit.
Therefore, the beneficial effects of the utility model are: the utility model can be along with user's different user demands, light the light source of zones of different respectively, and also package structure for LED can be cut into a plurality of independently ray structures, each ray structure all has the function of independently lighting light-emitting diode.
In order further to understand the utility model is to reach technology, means and the effect that predetermined purpose is taked, see also following about detailed description of the present utility model and accompanying drawing, believe the purpose of this utility model, feature and characteristics, go deep into and concrete understanding when getting one thus, yet institute's drawings attached only provides reference and explanation usefulness, is not to be used for the utility model is limited.
Description of drawings
Figure 1A is for looking schematic diagram on the utility model first embodiment;
Figure 1B is the side-looking generalized section of the utility model first embodiment;
Fig. 1 C be after the utility model first embodiment cutting on look schematic diagram;
Fig. 2 A be the utility model first embodiment on look schematic diagram;
Fig. 2 B be after the utility model first embodiment cutting on look schematic diagram; And
Fig. 3 is for looking schematic diagram on the another kind of base board unit of the utility model.
Symbol description
Ray structure Z base board unit 1
Anodal conductive welding pad group S1 exposes anodal weld pad S1 '
Negative pole conductive welding pad 11b negative pole conductive welding pad group S2
Expose negative pole weld pad S2 ' luminescence unit 2
Negative pole end N reflecting unit 3
The spacing space 300 of reflective colloid 30 colloids of circulating type
Circular arc tangential line T angle θ
Height H encapsulation unit 4
Printing opacity packing colloid 40 conductive unit W
Lead Wa
Embodiment
See also shown in Figure 1A to Fig. 1 C, but the utility model first embodiment provides a kind of package structure for LED of subregion point bright light source, it comprises: a base board unit 1, a luminescence unit 2, a reflecting unit 3, a conductive unit W and an encapsulation unit 4.
Wherein, this base board unit 1 has a substrate body 10 and a plurality of crystal area 11 that is arranged at these substrate body 10 upper surfaces, and the upper surface of this substrate body 10 has a plurality of anodal conductive welding pad 11a and a plurality of negative pole conductive welding pad 11b.In addition, those anodal conductive welding pad 11a are distinguished into the many groups of anodal conductive welding pad group S1 that are electrically insulated each other, each those anodal conductive welding pad 11a that organize anodal conductive welding pad group S1 is electrically connected to each other, and each is organized anodal conductive welding pad group S1 and is electrically connected at one and exposes anodal weld pad S1 '.In addition, those negative pole conductive welding pad 11b is distinguished into the many groups of negative pole conductive welding pad group S2 that are electrically insulated each other, those negative pole conductive welding pad 11b of each group negative pole conductive welding pad group S2 is electrically connected to each other, and each group negative pole conductive welding pad group S2 is electrically connected at one and exposes negative pole weld pad S2 '.For example: in first embodiment, those anodal conductive welding pad 11a are distinguished into four groups of anodal conductive welding pad group S1 that are electrically insulated each other, and those negative pole conductive welding pad 11b is distinguished into four groups of negative pole conductive welding pad group S2 that are electrically insulated each other.
In addition, this substrate body 10 have a circuit substrate 100, be arranged at these circuit substrate 100 bottoms heat dissipating layer 101, and one be arranged at these circuit substrate 100 upper surfaces and be used to expose the reflective insulating barrier 102 of those anodal conductive welding pad 11a, those negative pole conductive welding pad 11b and those crystal areas 11.
Moreover, this luminescence unit 2 has many LED crystal particle 20 that are arranged at respectively on those crystal areas 11, and each LED crystal particle 20 has the positive terminal P of corresponding each anodal conductive welding pad 11a and the negative pole end N of corresponding each negative pole conductive welding pad 11b.
In addition, this conductive unit W has many lead Wa, and each LED crystal particle 20 sees through per two lead Wa and is electrically connected between each anodal conductive welding pad 11a and each the negative pole conductive welding pad 11b.In other words, per two lead Wa are electrically connected between the positive terminal P of each LED crystal particle 20 and each the anodal conductive welding pad 11a respectively and are electrically connected between the negative pole end N and each negative pole conductive welding pad 11b of each LED crystal particle 20.
Moreover, this reflecting unit 3 has one and sees through the mode of coating and form in the reflective colloid 30 of circulating type of these substrate body 10 upper surfaces around ground, wherein the reflective colloid 30 of this circulating type is around those LED crystal particle 20, forming a spacing space 300 of colloid that is positioned at these substrate body 10 tops, and this printing opacity packing colloid 40 is limited in the spacing space 300 of this colloid.
In addition, shown in Figure 1B, the upper surface of the reflective colloid 30 of this circulating type is a circular arc, the reflective colloid 30 of this circulating type with respect to the angle θ of the circular arc tangential line T of these substrate body 10 upper surfaces between 40～50 degree, the end face of the reflective colloid 30 of this circulating type with respect to the height H of these substrate body 10 upper surfaces between 0.3～0.7mm, the width of the reflective colloid of this circulating type 30 bottoms is between 1.5～3mm, the thixotropic index of the reflective colloid 30 of this circulating type (thixotropic index) is between 4-6, and the reflective colloid 30 of this circulating type is a white hot that the is mixed with inorganic additive reflective colloid that hardens.
In addition, this encapsulation unit 4 has one and forms in these substrate body 10 upper surfaces to cover the printing opacity packing colloid 40 of this luminescence unit 2 and this conductive unit W.
With first embodiment of the invention for example, each LED crystal particle 20 can be a blue LED crystal grain, and this printing opacity packing colloid 40 can be a fluorescent colloid, therefore the blue light beam (figure does not show) that cast out of those LED crystal particle 20 (those blue LED crystal grain) can directly pass this printing opacity packing colloid 40 (this fluorescent colloid) and throw away, with the white light beam (scheming not show) that produces similar fluorescent lamp source.
Therefore, package structure for LED (shown in Figure 1A) before the utility model can directly use and not cut, and with first embodiment for example, package structure for LED before not cutting can come subregion to light to be positioned at the LED crystal particle 20 in four zones according to actual situation, to reach the purpose of subregion point bright light source.For example: the positive and negative electrode of power supply (figure does not show) is contacted with exposing anodal weld pad S1 ' and exposing negative pole weld pad S2 ' time of first area (left field of Far Left dotted line) respectively, and the LED crystal particle 20 in the first area can be shinny.
Moreover, along with different user demands, the dotted line that the utility model also can prolong package structure for LED Figure 1A cuts (shown in Fig. 1 C), with first embodiment for example, can cut into three groups of independently ray structure Z, and wherein one group (rightmost person among Fig. 1 C) also has the effect (illustrating as above-mentioned) of subregion point bright light source.
See also shown in Fig. 2 A and Fig. 2 B, the difference of the utility model second embodiment and the first embodiment maximum is: in a second embodiment, this encapsulation unit 4 has a plurality of these substrate body 10 upper surfaces that form in to cover the printing opacity packing colloid 40 of this luminescence unit 2 and this conductive unit W.In addition, this reflecting unit 3 has a plurality of reflective colloids 30 of circulating type that form in these substrate body 10 upper surfaces through the mode of coating around ground, wherein the reflective colloid 30 of those circulating types is optionally respectively around those LED crystal particle 20, forming a plurality of spacing spaces 300 of colloid that are positioned at these substrate body 10 tops, and those printing opacity packing colloids 40 are limited in respectively in the spacing space 300 of those colloids.Therefore, the ray structure Z that is cut of each group all has independently reflective colloid 30 of circulating type and printing opacity packing colloid 40.
See also shown in Figure 3, the utility model the 3rd embodiment proposes the schematic diagram of another kind of base board unit 1, and the arrangement mode of the anodal conductive welding pad 11a of those of this base board unit 1 and those negative pole conductive welding pad 11b as shown in FIG., but this arrangement mode just is used for for example, and is not in order to limit the utility model.
In sum, the utility model can be along with user's different user demands, light the light source of zones of different respectively, and also package structure for LED can be cut into a plurality of independently ray structures, each ray structure all has the function of independently lighting light-emitting diode.
But; all closing in the embodiment of the spirit variation similar of the utility model protection range with it; all should be contained in the category of the present utility model; anyly be familiar with this technical staff in field of the present utility model, can think easily and variation or modify all can be encompassed in the scope that following written or printed documents application claim defined.
Claims (10)
1. but the package structure for LED of a subregion point bright light source is characterized in that, comprising:
One base board unit, it has a substrate body and a plurality of crystal area that is arranged at this substrate body upper surface, and the upper surface of this substrate body has a plurality of anodal conductive welding pad and a plurality of negative pole conductive welding pad, wherein those anodal conductive welding pad are distinguished into the many groups of anodal conductive welding pad groups that are electrically insulated each other, each those anodal conductive welding pad of organizing anodal conductive welding pad group is electrically connected to each other, and those negative pole conductive welding pad are distinguished into the many groups of negative pole conductive welding pad groups that are electrically insulated each other, and those negative pole conductive welding pad of each group negative pole conductive welding pad group are electrically connected to each other;
One luminescence unit, it has many LED crystal particle that are arranged at respectively on those crystal areas;
One conductive unit, it has many leads, and wherein each LED crystal particle sees through per two leads and is electrically connected between each anodal conductive welding pad and each the negative pole conductive welding pad; And
One encapsulation unit, it has one and forms in this substrate body upper surface to cover the printing opacity packing colloid of this luminescence unit and this conductive unit.
2. but the package structure for LED of subregion point bright light source according to claim 1, it is characterized in that, also further comprise: a reflecting unit, it has one and sees through the mode of coating and form in the reflective colloid of circulating type of this substrate body upper surface around ground, wherein the reflective colloid of this circulating type is around those LED crystal particle, forming a spacing space of colloid that is positioned at this substrate body top, and this printing opacity packing colloid is limited in the spacing space of this colloid.
3. but the package structure for LED of subregion point bright light source according to claim 2, it is characterized in that: the upper surface of the reflective colloid of this circulating type is a circular arc, the reflective gel phase of this circulating type for the angle of the circular arc tangential line of this substrate body upper surface between 40～50 degree, the end face of the reflective colloid of this circulating type with respect to the height of this substrate body upper surface between 0.3～0.7mm, the width of the reflective colloid of this circulating type bottom is between 1.5～3mm, the thixotropic index of the reflective colloid of this circulating type is between 4-6, and the reflective colloid of this circulating type is a white hot that the is mixed with inorganic additive reflective colloid that hardens.
4. but the package structure for LED of subregion point bright light source according to claim 1, it is characterized in that: this substrate body have a circuit substrate, be arranged at this circuit substrate bottom heat dissipating layer, and one be arranged at this circuit substrate upper surface and be used to expose the reflective insulating barrier of those anodal conductive welding pad, those negative pole conductive welding pad and those crystal areas, and each LED crystal particle is a blue LED crystal grain, and this printing opacity packing colloid is a fluorescent colloid.
5. but the package structure for LED of subregion point bright light source according to claim 1, therefore it is characterized in that: each LED crystal particle has the positive terminal of corresponding each anodal conductive welding pad and the negative pole end of corresponding each negative pole conductive welding pad, and per two leads are electrically connected between the positive terminal of each LED crystal particle and each the anodal conductive welding pad respectively and are electrically connected between the negative pole end and each negative pole conductive welding pad of each LED crystal particle.
6. but the package structure for LED of a subregion point bright light source is characterized in that, comprising:
One base board unit, it has a substrate body and a plurality of crystal area that is arranged at this substrate body upper surface, and the upper surface of this substrate body has a plurality of anodal conductive welding pad and a plurality of negative pole conductive welding pad, wherein those anodal conductive welding pad are distinguished into the many groups of anodal conductive welding pad groups that are electrically insulated each other, each those anodal conductive welding pad of organizing anodal conductive welding pad group is electrically connected to each other, and those negative pole conductive welding pad are distinguished into the many groups of negative pole conductive welding pad groups that are electrically insulated each other, and those negative pole conductive welding pad of each group negative pole conductive welding pad group are electrically connected to each other;
One luminescence unit, it has many LED crystal particle that are arranged at respectively on those crystal areas;
One conductive unit, it has many leads, and wherein each LED crystal particle sees through per two leads and is electrically connected between each anodal conductive welding pad and each the negative pole conductive welding pad; And
One encapsulation unit, it has a plurality of these substrate body upper surfaces that form in to cover the printing opacity packing colloid of this luminescence unit and this conductive unit.
7. but the package structure for LED of subregion point bright light source according to claim 6, it is characterized in that, further comprise: a reflecting unit, it has a plurality of reflective colloids of circulating type that form in this substrate body upper surface through the mode of coating around ground, wherein the reflective colloid of those circulating types is optionally respectively around those LED crystal particle, forming a plurality of spacing spaces of colloid that are positioned at this substrate body top, and those printing opacity packing colloids are limited in respectively in the spacing space of those colloids.
8. but the package structure for LED of subregion point bright light source according to claim 7, it is characterized in that: the upper surface of the reflective colloid of each circulating type is a circular arc, the reflective gel phase of each circulating type for the angle of the circular arc tangential line of this substrate body upper surface between 40～50 degree, the end face of the reflective colloid of each circulating type with respect to the height of this substrate body upper surface between 0.3～0.7mm, the width of the reflective colloid of each circulating type bottom is between 1.5～3mm, the thixotropic index of the reflective colloid of each circulating type (thixotropic index) is between 4-6, and the reflective colloid of each circulating type is a white hot that the is mixed with inorganic additive reflective colloid that hardens.
9. but the package structure for LED of subregion point bright light source according to claim 6, it is characterized in that: this substrate body have a circuit substrate, be arranged at this circuit substrate bottom heat dissipating layer, and one be arranged at this circuit substrate upper surface and be used to expose the reflective insulating barrier of those anodal conductive welding pad, those negative pole conductive welding pad and those crystal areas, and each LED crystal particle is a blue LED crystal grain, and each printing opacity packing colloid is a fluorescent colloid.
10. but the package structure for LED of subregion point bright light source according to claim 6, therefore it is characterized in that: each LED crystal particle has the positive terminal of corresponding each anodal conductive welding pad and the negative pole end of corresponding each negative pole conductive welding pad, and per two leads are electrically connected between the positive terminal of each LED crystal particle and each the anodal conductive welding pad respectively and are electrically connected between the negative pole end and each negative pole conductive welding pad of each LED crystal particle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009201775030U CN201503861U (en) | 2009-08-28 | 2009-08-28 | Light-emitting diode packaging structure capable of lightening light source in areas |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009201775030U CN201503861U (en) | 2009-08-28 | 2009-08-28 | Light-emitting diode packaging structure capable of lightening light source in areas |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201503861U true CN201503861U (en) | 2010-06-09 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009201775030U Expired - Lifetime CN201503861U (en) | 2009-08-28 | 2009-08-28 | Light-emitting diode packaging structure capable of lightening light source in areas |
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| Country | Link |
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| CN (1) | CN201503861U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102468293A (en) * | 2010-11-09 | 2012-05-23 | 柏友照明科技股份有限公司 | Polycrystal packaging structure directly and electrically connected to alternating-current power supply |
| CN111463652A (en) * | 2019-01-22 | 2020-07-28 | 隆达电子股份有限公司 | Light emitting device |
-
2009
- 2009-08-28 CN CN2009201775030U patent/CN201503861U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102468293A (en) * | 2010-11-09 | 2012-05-23 | 柏友照明科技股份有限公司 | Polycrystal packaging structure directly and electrically connected to alternating-current power supply |
| CN111463652A (en) * | 2019-01-22 | 2020-07-28 | 隆达电子股份有限公司 | Light emitting device |
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| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20100609 |
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| CX01 | Expiry of patent term |