KR101006658B1 - Luminous device mounting substrate, luminous device mounting package, and planar light source device - Google Patents

Abstract

A light emitting element mounting substrate on which a plurality of light emitting elements having different light emitting colors is mounted includes a plurality of light emitting element mounting portions for enclosing light emitting elements corresponding to light emitting colors, respectively, wherein the light emitting element mounting portions include a plurality of light emitting elements. Has a configuration that can be mounted on each light emitting element mounting portion.

Light emitting element mounting substrate, light emitting element mounting portion, opening, substrate electrode pad

Description

Light emitting element mounting substrate, light emitting element mounting package and surface light source device {LUMINOUS DEVICE MOUNTING SUBSTRATE, LUMINOUS DEVICE MOUNTING PACKAGE, AND PLANAR LIGHT SOURCE DEVICE}

This application claims 35 U.S.C. 35 U.S.C. claiming benefit under 35 U.S.C. § 119 (e) (1) of the filing date of Provisional Application No. 60 / 731,494, filed October 31, 2005, pursuant to § 111 (b). An application filed under § 111 (a).

The present invention relates to a light emitting element mounting substrate, a light emitting element mounting package, and a surface light source device using the same for mounting a light emitting element useful as a light source for illumination and backlight for liquid crystals.

More specifically, the present invention relates to a plurality of light emitting devices having different light emitting colors useful as white light sources, packages having light emitting elements, and surface light source devices using them.

In recent years, the luminous efficiency of the light emitting device has been greatly improved, and the application of the light emitting device to illumination has been advanced.

In particular, when a light emitting diode (hereinafter also referred to as LED), which is one of the solid state light emitting elements, is used as a backlight light source (surface light source) for a liquid crystal display, excellent color reproducibility and high-speed response can be realized. It is expected to be obtained.

Conventionally, the mainstream of such backlight light sources for liquid crystal displays has become the so-called edge light type in which a cold cathode tube as a light source is disposed on the edge of the chassis for low power consumption and thinning of the device.

However, in recent years, there has been a growing demand for larger liquid crystal displays, but the edge light type has limitations in improving luminance and luminance uniformity.

Therefore, adoption of the direct type | mold light is examined about the large size liquid crystal display.

In addition, since there is a great demand to improve the display quality, excellent color reproducibility cannot be realized in the case of using a white light emitting diode (LED) utilizing the complementary color of the blue light emitting diode and the yellow phosphor light emitting.

Under these circumstances, recently, a so-called three-in one package in which three primary color light emitting diode (LED) chips of red, green, and blue are disposed in one package and generate white by mixing these colors. LED lamps have been developed. See, e.g., Non-Patent Document 1 (website of STANLEY ELECTRIC CO., LTD.).

As shown in Fig. 9, such a three-in-one package 100 has an appearance of several mm2, each of which has an LED chip 102 emitting red, an LED chip 104 emitting green and The LED chip 106 which emits blue light has a configuration in which the LED chips 106 are disposed close to the positions corresponding to the vertices of the equilateral triangle at the center of the package.

The advantage of a three-in-one LED lamp (light source) is that white light can be easily obtained by mixing the three colors. Thus, the three-in-one package 100 is utilized.

[Non-Patent Document 1] Website, Online, Internet of STANLEY ELECTRIC CO., LTD. <Http://www.stanley-components.com>

However, there are disadvantages associated with heat dissipation because three LED chips 102, 104, 106 must be placed in close proximity to mix colors to obtain good white.

This is especially a serious problem when using so-called high power LEDs having LED chips of 1 mm 2 or more in size.

Therefore, depending on the size of the LED chip to be used, it is necessary to prepare each three-in-one package 100 having a different distance between the LED chip.

When a three-in-one package is used as a backlight light source for a liquid crystal display, the larger the screen size, the easier it is to mix the three colors as compared to the case of the smaller sized screen, Even when the distance is extended, a white light source can be obtained from the backlight surface.

Therefore, to effectively utilize these conditions, the three-in-one package 100 having a long distance between the LED chips must be manufactured separately.

In addition, the three-in-one conventional LED lamp has a configuration in which each of the three color LED elements are formed only in close proximity to each other in one three-in one package 100, thus resulting in low power and low brightness. . In order to express high brightness, a number of three-in-one packages 100 must be arranged in an array pattern.

It is an object of the present invention to manufacture a light emitting device mounting package including light sources having different distances between light emitting devices in a package. Another object of the present invention is to provide a light emitting device mounting substrate, a light emitting device mounting package and a surface light source device using the same, which can realize cost reduction in manufacturing and mounting a light emitting device mounting package.

The present inventors invented a light emitting element mounting substrate, a light emitting element mounting package, and a surface light source device using the same in order to solve the above problem.

More specifically, the present invention includes the following Examples (1) to (16), for example.

(1) A light emitting element mounting substrate on which a plurality of kinds of light emitting elements having different light emitting colors are mounted, each comprising a plurality of light emitting element mounting portions for enclosing light emitting elements corresponding to the light emitting colors, wherein the light emitting element mounting portions include: A light emitting element mounting substrate having a structure that can be mounted on each light emitting element mounting portion.

(2) A light emitting element mounting substrate according to (1), wherein the number of the light emitting element mounting portions formed is equal to or greater than the number of other light emitting colors of the light emitting element to be mounted.

(3) A light emitting element mounting substrate according to (1) or (2), wherein the light emitting element mounting portion is disposed on the light emitting element mounting substrate at a constant pitch.

(4) A light emitting element mounting substrate according to (2), wherein the plurality of light emitting element mounting portions are formed to extend from a fixed point on the light emitting element mounting substrate toward a circle around the fixed point, and at a prescribed angle. The light emitting device mounting substrate is spaced apart.

(5) The light emitting element mounting substrate according to (2), wherein the light emitting element mounting portion has a regular polygonal side whose center of gravity is a fixed point of the light emitting element mounting substrate so as to substantially coincide with a line in the longitudinal direction of the light emitting element mounting portion. A light emitting element mounting substrate disposed.

(6) A light emitting element mounting substrate according to (4) or (5), wherein the fixing point is a center of the light emitting element mounting substrate.

(7) A light emitting element mounting substrate according to (4) or (5), further comprising a plurality of the fixing points.

(8) The light emitting element mounting substrate according to any one of (1) to (7), further comprising a protrusion at a position where the light emitting element mounting portion is disposed on the light emitting element mounting substrate, wherein the light emitting element mounting portion is the above-mentioned. A light emitting element mounting substrate disposed on the protrusion.

(9) A light emitting element mounting substrate according to (8), wherein the protrusion is made of the same material as that of the light emitting element mounting substrate.

(10) The light emitting element mounting substrate according to any one of (1) to (9), wherein the light emitting element mounting substrate is a metal base substrate.

(11) A light emitting element mounting substrate according to any one of (1) to (10), wherein the light emitting element is a light emitting diode (LED).

(12) A light emitting element mounting substrate according to (11), wherein the light emitting diode (LED) is a light emitting diode (LED) chip.

(13) A light emitting element mounting substrate according to (12), further comprising substrate electrode pads connected to anodes and cathodes of the light emitting diode (LED) chip by wire bonding on both sides of the light emitting element mounting portion. Board.

(14) A light emitting element mounting package comprising a reflector having an opening at a position corresponding to a light emitting element mounting portion on the light emitting element mounting substrate according to any one of (1) to (13).

(15) The light emitting device mounting package according to (14), wherein the opening is embedded with a sealing resin such that an upper portion of the opening is substantially flat with the surface of the reflector.

(16) The surface light source device, wherein the light emitting element mounting package according to (14) or (15) is provided on the bottom surface of the chassis.

The light emitting element mounting substrate according to the present invention has a configuration in which light emitting elements having different light emitting colors can be mounted while changing distances between adjacent light emitting elements. Therefore, since light emitting elements having different sizes or different heat generation amounts can be mounted in one kind of light emitting element mounting package, it is not necessary to design and manufacture several kinds of light emitting element mounting substrates and light emitting element mounting packages, and thus, cost This is reduced.

In addition, a plurality of sets of light emitting elements can be mounted on one light emitting element mounting substrate or on one light emitting element mounting package, thus making high brightness appear.

Therefore, by using the light emitting element mounting package according to the present invention, a high performance surface light source device can be obtained at low cost.

1 is a schematic plan view showing a first embodiment of a light emitting element mounting substrate according to the present invention;

FIG. 2 is a schematic cross-sectional view showing a light emitting element mounting substrate along the line VII-VII of FIG. 1; FIG.

Fig. 3 is a schematic plan view showing a package in which a set of LED chips is mounted on the light emitting element mounting substrate shown in Fig. 1;

4 is a schematic cross-sectional view showing the package shown in FIG.

Fig. 5 is a schematic plan view showing a package in which three sets of LED chips are mounted on the light emitting element mounting substrate shown in Fig. 1;

FIG. 6 is a schematic cross-sectional view showing the package shown in FIG. 5; FIG.

7 is a schematic plan view showing a second embodiment of a light emitting element mounting substrate according to the present invention similarly to FIG.

Fig. 8 is a schematic plan view showing a third embodiment of a light emitting element mounting substrate according to the present invention.

9 is a schematic plan view showing a conventional three-in-one package.

Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings.

1 is a schematic plan view showing a first embodiment of a light emitting element mounting substrate according to the present invention. FIG. 2 is a schematic cross-sectional view showing a light emitting element mounting substrate along the line VII-VII of FIG. 1.

As shown in FIG. 1, the red light emitting LED chip R, the green light emitting LED chip G, and the blue light emitting LED chip B are used, and the light emitting device mounting portion 10 has a fixed point O on the light emitting device mounting substrate 1. Is formed so as to extend in three directions toward the circumference around the fixed point O, and three LED chips R, G, and B can be mounted on the respective light emitting element mounting portions 10, respectively. Have

The whole configuration is referred to as the mounting substrate unit 6.

More specifically, the mounting board unit 6 draws a straight line passing through the center of the three light emitting element mounting portions 10 in the longitudinal direction while using the center O on the light emitting element mounting substrate 1 as a starting point. Two straight lines penetrating the central portion of the adjacent light emitting element mounting portion 10 have an angle of approximately 120 degrees (360/3 degrees).

Approximately 120 degrees does not need to be exactly 120 degrees, meaning that a slight difference can be tolerated. The difference within 1/10 of the angle made is preferable.

In the following description, when a plurality of LED chips are distinguished, numbers are added as subscripts to the red light emitting LED chip R, the green light emitting LED chip G and the blue light emitting LED chip B.

More specifically, the LED chips R1, G1 and B1 are positioned at a distance d1 from the center O on the light emitting element mounting substrate 1, the LED chips R2, G2 and B2 are positioned at a distance d2, and the positions are a distance d3. LED chips R3, G3 and B3 can be mounted.

That is, the present invention can be applied to three types of configurations in which the distance between the LED chips is different.

In the embodiment shown in FIG. 1, d1 is less than d2 and d2 is less than d3.

The LED chip is bonded through a paste or heat-dissipating grease to a metal foil or metal base substrate made of aluminum or copper having excellent thermal conductivity as a substrate so that heat of the LED chip is well discharged to the outside.

Substrate electrode pads (anode A and cathode C) (not shown) electrically connected to the electrodes (anode and cathode) of the LED chip by wire bonding of each light emitting element mounting portion 10 on the light emitting element mounting substrate 1 are provided. It is placed on both sides.

The electrode pads RA, RC, GA, GC, BA and BC for each color are electrically connected to the substrate wiring 3 for current supply.

As shown in Fig. 2, the insulating layer 2 is formed on the surface of the light emitting element mounting substrate 1 except for the region where the LED chip is mounted, and the substrate wiring 3 made of copper or the like is used as the insulating layer 2 Is formed on Although not shown in the figure, the insulating layer 2 is on the substrate wiring 3 except for the region of the substrate electrode pad so that the surface of the substrate electrode pad and the surface of the insulating layer 2 are substantially flat at the same height. Is formed more.

As described above, the electrodes of the LED chip and the substrate electrode pads are connected to each other by wire bonding (not shown).

When gold wire is used as the bonding wire, a gold plated layer is formed on the surface of the electrode of the LED chip and the surface of the substrate electrode pad in order to obtain good connection.

3 and 4 respectively show a light emitting element mounting package 12 (mounting) when a set of LED chips R1, G1 and B1 are mounted only at a position d1 from the center O on the light emitting element mounting substrate 1 at a distance d1. It is a schematic plan view and schematic sectional drawing which shows the board | substrate unit 6].

The light emitting element mounting package 12 shown in FIG. 3 includes LED chips of only R1, G1 and B1, and has openings for effectively reflecting light emitted from the LED chip upward from the light emitting device mounting substrate 1. The reflector 4 is formed on the light emitting element mounting substrate 1 (mounting substrate unit 6) so that the reflector covers the periphery of the LED chip.

This reflector 4 is preferably bonded to the surface of the mounting substrate unit 6 via an adhesive.

Therefore, in the light emitting element mounting package 12 shown in Fig. 3, the outer region surrounding the region where the LED chips R1, G1, and B1 are mounted is covered with the reflector 4, and other wiring on the surface of the mounting substrate unit 6 is applied. The pattern is not visible.

Wire bonding causes the electrode pads (not shown) mounted on the LED chips R1, G1 and B1 and the substrate electrode pads around them to be connected to each other.

As shown in Fig. 3, when a small size LED chip is used, each color LED chip can be mounted close to a position close to the center of the substrate O, which advantageously uniforms chromaticity. Let's do it.

As the LED chip size increases, the amount of heat dissipation with light emission increases.

Therefore, when a large LED chip is used, the LED chip can be mounted at a position farther from the center O on the light emitting element mounting substrate 1 (mounting substrate unit 6).

As described above, in response to the size and heat dissipation amount of the LED chip, the mounting position of the LED chip may be appropriately changed in one light emitting device mounting package.

The distance between the substrate electrode (anode and cathode) pads is made larger than the width of the area of the light emitting element which is formed so that the largest LED chip applied can be mounted.

In the light emitting element mounting package 12 shown in Figs. 5 and 6, the positions where the LED chip is a distance d1, d2 and d3 from the center O on the light emitting element mounting substrate 1 (mounting substrate unit 6) are all. Is mounted on.

By the above configuration, the luminance as the LED lamp can be increased.

In this case, the reflector 4 having a circular opening for satisfactorily reflecting the light emitted from the LED chip upward from the light emitting element mounting substrate 1 is the substrate center O on the mounting substrate unit 6. Is formed to cover the outside of the distance d3).

Wire bonding causes the electrode pads (not shown) mounted on the LED chips R1, G1, B1, R2, G2, B2, R3, G3 and B3 and the substrate electrode pads around them to be connected to each other.

It is preferable that an LED chip having the same emission color be mounted on one light emitting element mounting portion 10. More specifically, the LED chips (R1, R2, R3) is mounted on the first light emitting element mounting portion, the LED chips (G1, G2, G3) are mounted on the second light emitting element mounting portion, and the LED chips (B1, B2, B3). ) Is mounted on the third light emitting element mounting portion, and the electrode pads of the LED chip having the same light emitting color are connected by wire bonding to a single electrode pad formed on both sides of the light emitting element mounting portion.

Even when the LED chips have the same shape, the driving currents are different depending on the emission color. Therefore, when LED chips having the same emission color are mounted on one light emitting element mounting portion 10, general control of the LED chips is easy.

However, the configuration other than the above is not excluded from the present invention.

The material of the reflector 4 used is not particularly limited, but preferably a material having good reflectivity, such as an aluminum material, can be applied.

The inner surface 5 of the opening of the reflector 4 is processed into a tapered shape (inclined surface) and functions to effectively reflect light emitted from the LED chip upward from the light emitting element mounting substrate 1 (mounting substrate unit 6). Has It is preferable that the angle (alpha) of the extension line of the inner surface 5 is 90-120 degree.

The opening of the reflector 4 is embedded by a sealing resin 7 such as a silicone resin so that the upper part of the opening is almost flat with the same height as the upper surface of the reflector 4, thus protecting the bonding wire. "Almost flat" means that the upper surfaces of both do not have to be exactly flush, and some degree of unevenness and small external irregularities can be tolerated.

The LED chip is mounted at all positions at distances d1, d2 and d3 from the center O on the light emitting element mounting substrate 1 (mounting substrate unit 6) in the light emitting element mounting package 12 shown in FIG. The LED chip may be mounted at locations only at distances d1 and d2, only at distances d1 and d3, or only at distances d2 and d3.

Although the present embodiment has described the case where the light emitting element mounting portions are formed at three different positions, the present invention is not limited to this embodiment, and the light emitting element mounting portions 10 may be formed at four or more positions. In addition, the present embodiment has described a case where each light emitting element mounting portion is formed with substantially the same width in the circumferential direction from the center of the substrate to the circumferential center with the center of the substrate as the center. It may be formed to become wider as it approaches the circumference.

In addition, up to three LED chips can be mounted on one light emitting element mounting portion 10 in this embodiment, but the present invention is not limited to this embodiment. The position where the LED chips of each color are mounted and the number of LED chips that can be mounted can be appropriately selected and can be changed according to the light emitting element mounting portion.

Fig. 7 is a schematic plan view showing a light emitting element mounting substrate 1 according to the second embodiment of the present invention.

The configuration of the light emitting element mounting substrate 1 shown in FIG. 7 is basically the same as that of the light emitting element mounting substrate 1 according to the first embodiment shown in FIG. Therefore, the same components as those shown in Fig. 2 are denoted by the same reference numerals, and detailed descriptions of the equivalent components will be omitted.

The difference from the first embodiment is that the projection 8 is formed on the region of the metal base substrate 1 on which the LED chip is mounted.

The protrusion 8 is made of ceramic material such as copper and aluminum or aluminum nitride with good thermal conductivity, and is made of the same material as the material of the metal base substrate to dissipate heat of the LED chip to the outside via the protrusion 8. It is desirable to lose.

In this embodiment, the first insulating layer 2 is formed so that the surface of the protrusion 8 and the surface of the first insulating layer 2 are substantially flat with the same height, and the substrate wiring 3 is the first insulating layer. It is formed on (2).

In addition, on the substrate wiring 3 except for the region of the substrate electrode pad so that the surface of the substrate electrode pad and the surface of the second insulating layer 2 'are substantially flat at the same height. Is formed.

Since light emitted from the LED chip can be effectively reflected upward from the light emitting element mounting substrate 1, it is preferable to use a white resist as the second insulating layer 2 '.

A reflector (not shown) is formed in the region of the second insulating layer 2 'and the substrate electrode pad.

Since the surface of the second insulating layer 2 'and the surface of the region of the substrate electrode pad are made almost flat at the same height, there is almost no gap between those surfaces and the opposing surface of the reflector (not shown), and thus excellent adhesion Get

Fig. 8 is a schematic plan view showing a light emitting element mounting substrate 1 according to the third embodiment of the present invention.

The configuration of the light emitting element mounting substrate 1 shown in FIG. 8 is basically the same as that of the light emitting element mounting substrate 1 according to the first embodiment shown in FIG. Therefore, the same components as those shown in FIG. 1 are denoted by the same reference numerals, and detailed descriptions of the equivalent components are omitted.

Fig. 8 shows only the LED chip mounting area and the substrate electrode pad in a schematic plan view. In addition, the present embodiment describes a case where three color LED chips are used.

On the straight line drawn through the central portion of the light emitting element mounting portion 10 in which three LED chips can be mounted between a pair of opposing substrate electrode pads, the center O is positioned on the light emitting element mounting substrate 1. Each side of the equilateral triangle, which is the fixed point and center of gravity of, almost overlaps. "Almost overlap" does not need to overlap exactly, it means that some tilt and displacement are allowed.

More specifically, the LED chips R4, G4 and B4 are mounted at positions d4 from the center O on the light emitting element mounting substrate 1, and the LED chips R5, G5 and B5 are positioned at the distance d5. LED chips R6, G6, and B6 are mounted at positions d6.

In other words, the present invention can be applied to three types of configurations having different distances between LED chips.

In the embodiment shown in Figure 8, d4 is less than d5 and d5 is less than d6.

Similar to the first embodiment, the LED chip may be mounted on only one set of LED chip mounting areas, or may be mounted on two or three sets of LED chip mounting areas.

In addition, the position where the LED chips of each color are mounted and the number of the LED chips to be mounted may be changed according to the light emitting device mounting portion.

Although the first to third embodiments have described a case where three color LED chips are used, four or more color LED chips may be used.

When using four color LED chips, it is desirable to use the orange color as the fourth color, because this color has a color rendering effect.

When n (n is 4 or more) colors are used in the configuration similar to the first and second embodiments, a plurality of LED chips can be mounted in n directions from the center O on the light emitting element mounting substrate 1. (The two adjacent lines in n directions form an angle of approximately 360 / n degrees.)

More specifically, when four colors are used, two straight lines passing through the central portion of the adjacent light emitting element mounting portion form an angle of approximately 90 degrees.

When n (n is four or more) colors are used in the configuration similar to the third embodiment, a plurality of the plurality of sides on each side of the regular polygon having n sides where the center O on the light emitting element mounting substrate 1 is the center of gravity A light emitting device mounting portion on which an LED chip may be mounted may be formed.

In the above embodiment, the number of light emitting colors is equal to the number of light emitting device regions, but the number of light emitting device regions may be larger than the number of light emitting colors.

For example, in three colors R, G, and B, one light emitting element region is formed for R, two light emitting element regions are formed for G, and one light emitting element region is formed for B. That is, the number of light emitting device regions is four.

In this case, the number of light emitting device regions, the configuration of the electrode pads, and the like may be the same as those of the four colors in the first to third embodiments.

As for the metal base substrates used in the first to third embodiments, it is preferable that a printed wiring board including a metal plate having good thermal conductivity as a base is used.

The material and manufacturing method of the metal base substrate are not particularly limited, and conventional materials and conventional manufacturing techniques of the printed wiring board can be directly applied.

In this embodiment, a copper clad laminated plate in which a glass epoxy material is laminated on the surface of the copper plate is used as the insulating layer, and the copper foil is processed to form a wiring pattern (to form a gold plated layer on the surface of the electrode pad). And by selectively removing the insulating layer on the light emitting element mounting portion.

The configuration of the surface light source device using the light emitting element mounting package according to the present invention may be similar to that of the conventional surface light source device. More specifically, the required number of light emitting element mounting packages according to the present invention can be installed on the bottom surface of the chassis of a material such as aluminum. Although each of the first to third embodiments has described the case where the center of the substrate is a fixed point, that is, one light source unit constituting white light emission is formed by mounting a plurality of color LEDs on one substrate. Although the case is described, this invention is not limited to these Examples. Instead, a case may be adopted in which the substrate includes a plurality of fixing points, that is, a plurality of light source units are formed in a row or in an array pattern on one large sized substrate.

Examples of the surface light source device may include a backlight for a liquid crystal display device or light for advertisement.

Although the preferred embodiment of the present invention has been described above, the present invention is not limited to the above embodiment, and various changes, modifications, and functional additions can be made without departing from the scope of the present invention. For example, the light emitting element mounting substrate and the light emitting element mounting package according to the present invention are useful for mounting a plurality of light emitting elements having different light emitting colors, and white light emitting elements that do not require mixing of colors may also be mounted. .

Claims (16)

A light emitting element mounting substrate on which a plurality of light emitting elements having different light emitting colors is mounted, The light emitting device mounting substrate is a metal base substrate, A plurality of light emitting element mounting portions for mounting the light emitting elements corresponding to the light emitting colors and surrounding the light emitting elements corresponding to the light emitting colors; The light emitting element mounting portion is formed to extend so as to mount the plurality of light emitting elements in a straight line for each of the light emitting element mounting portions, and has a structure in which a plurality of light emitting elements having the same light emission color are mounted on one light emitting element mounting portion. Mounting substrate. The method of claim 1, The light emitting element mounting substrate is formed, the number of the light emitting element mounting portion is equal to or greater than the number of light emitting colors of the light emitting element to be mounted. The method according to claim 1 or 2, And the light emitting element mounting portion is disposed on the light emitting element mounting substrate at a constant pitch. The method of claim 2, The plurality of light emitting element mounting portions are formed to extend from a fixed point on the light emitting element mounting substrate toward a circle around the fixed point, and are spaced apart at an angle divided by 360 degrees of the number of light emitting colors of the light emitting element to be mounted. Light emitting element mounting substrate. The method of claim 2, And the light emitting element mounting portion is arranged such that a side of a regular polygon having a fixed point of the light emitting element mounting substrate coincides with a line in the longitudinal direction of the light emitting element mounting portion. The method according to claim 4 or 5, And the fixed point is a center of the light emitting element mounting substrate. The method according to claim 4 or 5, The light emitting device mounting substrate further comprises a plurality of the fixing point. The method according to any one of claims 1, 2, 4 or 5, And a protrusion at a position where the light emitting element mounting portion is disposed on the light emitting element mounting substrate, wherein the light emitting element mounting portion is disposed on the protrusion. The method of claim 8, And the projecting portion is made of the same material as that of the light emitting element mounting substrate. delete The method according to any one of claims 1, 2, 4 or 5, The light emitting device is a light emitting device (LED) mounting substrate. The method of claim 11, The light emitting diode (LED) is a light emitting diode (LED) chip substrate. The method of claim 12, And a substrate electrode pad connected to an anode and a cathode of the light emitting diode (LED) chip by wire bonding on both sides of the light emitting element mounting portion. A light emitting element mounting package comprising a reflector having an opening at a position corresponding to a light emitting element mounting portion on the light emitting element mounting substrate according to any one of claims 1, 2, 4 and 5. The method of claim 14, And the opening is embedded by a sealing resin so that an upper portion of the opening is flush with the surface of the reflector. The surface light source device in which the light emitting element mounting package of Claim 14 is installed in the bottom surface of a chassis.

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