CN101292368A - Luminous device mounting substrate, luminous device mounting package, and planar light source device - Google Patents
Luminous device mounting substrate, luminous device mounting package, and planar light source device Download PDFInfo
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- CN101292368A CN101292368A CNA2006800386354A CN200680038635A CN101292368A CN 101292368 A CN101292368 A CN 101292368A CN A2006800386354 A CNA2006800386354 A CN A2006800386354A CN 200680038635 A CN200680038635 A CN 200680038635A CN 101292368 A CN101292368 A CN 101292368A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Abstract
A luminous device mounting substrate, a luminous device mounting component and a planar light source. In the luminous device mounting substrate, plural kinds of luminous devices with different luminance colors are mounted, is characterized by comprising a plurality of luminous device mounting portions each of which is for enclosing a luminous device corresponding to a luminance color, wherein the luminous device mounting portion has a configuration in which a plurality of luminous devices can be mounted on each luminous device mounting portion.
Description
The cross reference of related application
The application is the application of submitting to down at 35U.S.C. § 111 (a), and this application requires the rights and interests in the applying date of the provisional application 60/731,494 of submission on October 31st, 2005 according to 35U.S.C. § 111 (b) according to 35.U.S.C. § 119 (e) (1).
Technical field
The present invention relates to a kind of light-emitting device mounted substrate, a kind of light-emitting device installation component and a kind ofly utilize the planar light source device (planar light source device) that they install a light-emitting device, this light-emitting device is used to throw light on and as the luminous element of LCD backlight.
More specifically, the present invention relates to a kind of light-emitting device mounted substrate, a kind of light-emitting device installation component and a kind of planar light source device that uses them, described light-emitting device mounted substrate is used to install the light-emitting device that has a plurality of different glow colors, and this light-emitting device can be used as a white-light emitting body.
Background technology
In recent years, the luminous efficiency of light-emitting device has had very big improvement, and the application of light-emitting device in illumination is studied.
Particularly will be used as the light-emitting diode (after this being also referred to as LED) of one of solid luminous device under LCD backlight luminous element (surface source of light) situation, can realize extraordinary colour reproduction and high-speed response, thereby be expected to obtain high-quality demonstration.
Traditionally, this main flow that is used for the backlight liquid crystal display luminous element is so-called edge-lit type, and wherein the cold-cathode tube as luminous element is positioned on the edge surface on chassis, with thickness and the power consumption that reduces this device.
But, in recent years, require the size of LCD increasing, there is limitation in the edge-lit type aspect the uniformity that improves brightness and brightness.
Therefore, to study the employing of direct light emitting-type light for the large scale liquid crystal display.
In addition, owing to require to improve display quality day by day, and luminously can not realize extraordinary colour reproduction when using white light emitting diode as complementary color what utilize the luminous of blue light-emitting diode and jaundice light fluorescent material.
Under this background, recently, developed a kind of LED lamp of so-called three-in-one component, wherein the trichromatic light-emitting diode of red, green and blue (LED) chip is placed an assembly, mix these three kinds of colors and produce white light (for example seeing non-patent literature 1 (STANLEY ELECTRICCO., the website of LTD.)).
As shown in Figure 9, the profile of this three-in-one component 100 is about several square millimeters, and has a configuration, in this configuration, the led chip 102 that glows, green light led chip 104, the blue light-emitting led chip 106 that each is about 0.35 square millimeter places the position corresponding to the equilateral triangle drift angle of these assembly central authorities respectively.
The advantage of three-in-one type LED lamp (luminous element) is that white light is formed by three kinds of blend of colors easily.Therefore, use above-mentioned three-in-one component 100.
Non-patent literature 1:STANLEY ELECTRIC CO., the website of LTD., [online], internet＜http://www.stanley-components.com 〉
Summary of the invention
Problem to be solved by this invention
But owing to will obtain out good white by blend color, three led chips 102,104 and 106 must placed adjacent, therefore have the shortcoming that is difficult for heat radiation.
Have under the situation of so-called great power LED of 1 square millimeter or bigger led chip size this problem in use especially outstanding.
Therefore, must prepare each different three-in-one component 100 of distance between the led chip according to the size of employed led chip.
Three-in-one component is being used as under the situation of backlight liquid crystal display luminous element, if it is big that screen size becomes, the situation of the relative small-size screen of mixing of three kinds of colors is easier, even also can obtain the white-light emitting body on surface backlight under the situation that the distance between the led chip of three kinds of colors increases.
Therefore, for effectively utilizing this condition, must make the big three-in-one component 100 of distance between the led chip separately.
In addition, in traditional three-in-one type LED lamp, each LED matrix of three kinds of colors is leaned on very closely mutually in a three-in-one component 100, so power is low, and brightness is low.In order to make brightness seem high, must be arranged to array type to a plurality of three-in-one components 100.
A purpose of the present invention is to propose a kind of light-emitting device installation component, and this light-emitting device installation component is included in a kind of assembly the different luminous element of distance between the light-emitting device.Another object of the present invention provides production and a kind of light-emitting device mounted substrate of installation cost, a kind of light-emitting device installation component and a kind of planar light source that uses them that can reduce a light-emitting device installation component.
The method of dealing with problems
For addressing the above problem, the present inventor finds a kind of light-emitting device mounted substrate, a kind of light-emitting device installation component and a kind of planar light source that uses them.
More specifically, the present invention relates to for example the following example (1)-(16).
(1) the light-emitting device mounted substrate of the multiple light-emitting device have different glow colors wherein is installed, comprise a plurality of light-emitting device installation portions, each light-emitting device installation portion light-emitting device that is used to pack into corresponding to a kind of glow color, wherein, described light-emitting device installation portion has a configuration, in this configuration, on each light-emitting device installation portion, a plurality of light-emitting devices can be installed.
(2) press the described light-emitting device mounted substrate of the foregoing description (1), wherein, the quantity of the light-emitting device installation portion of being arranged is equal to or greater than the quantity of the different glow colors of the light-emitting device that will install.
(3) press the described light-emitting device mounted substrate in the foregoing description (1) or (2), wherein, described light-emitting device installation portion is arranged on this light-emitting device mounted substrate with constant pitch (pitch).
(4) press the described light-emitting device mounted substrate of the foregoing description (2), wherein, a plurality of light-emitting device installation portions are from the circumferential extension of the on-chip fixing point of light-emitting device to a circle, in this circle, this fixing point is the center, and described a plurality of light-emitting device installation portion is with the spaced apart setting of given angle.
(5) press the described light-emitting device mounted substrate of the foregoing description (2), wherein, each light-emitting device installation portion is arranged to like this, make fixing point with this light-emitting device mounted substrate be center of gravity equilateral polygon the limit with along the light-emitting device installation portion longitudinally straight line almost overlap.
(6) press the described light-emitting device mounted substrate in the foregoing description (4) or (5), wherein, described fixing point is the center of this light-emitting device mounted substrate.
(7) press the described light-emitting device mounted substrate in the foregoing description (4) or (5), also comprise a plurality of fixing points.
(8) press the described light-emitting device mounted substrate of arbitrary embodiment in the foregoing description (1)-(7), the position that is arranged on the light-emitting device mounted substrate of light-emitting device installation portion also comprises a projection therein, wherein, described light-emitting device installation portion is arranged on this projection.
(9) press the described light-emitting device mounted substrate of the foregoing description (8), wherein, described projection is by making with the material identical materials of light-emitting device mounted substrate.
(10) press the described light-emitting device mounted substrate of arbitrary embodiment in the foregoing description (1)-(9), wherein, this light-emitting device mounted substrate is the metallic matrix substrate.
(11) press the described light-emitting device mounted substrate of arbitrary embodiment in the foregoing description (1)-(10), wherein, described light-emitting device is light-emitting diode (LED).
(12) press the described light-emitting device mounted substrate of the foregoing description (11), wherein, described light-emitting diode (LED) is light-emitting diode (LED) chip.
(13) press the described light-emitting device mounted substrate of the foregoing description (12), also be included in the substrate electrod sheet that light-emitting device installation portion both sides are connected with anode by the wire-bonded and the negative electrode of light-emitting diode (LED) chip.
(14) one light-emitting device installation components comprise a reflector, and this reflector is provided with a peristome on the position corresponding to the light-emitting device installation portion on the described light-emitting device mounted substrate of arbitrary embodiment in by the foregoing description (1)-(13).
(15) press the described light-emitting device installation component of the foregoing description (14), wherein, described peristome is embedding by sealing resin, makes the top of described peristome and the flush of described reflector.
(16) one planar light source devices wherein, are installed on the bottom surface on chassis by the foregoing description (14) or (15) described light-emitting device installation component.
Effect of the present invention
Light-emitting device mounted substrate according to the present invention has a configuration, in this configuration, the light-emitting device with different glow colors can be installed, and changes the distance between the adjacent light-emitting device simultaneously.Therefore, vary in size or light-emitting device that caloric value is different, therefore need not to design and produce many kinds of light-emitting device mounted substrates and light-emitting device installation component, thereby reduce cost owing to can in a kind of light-emitting device installation component, install.
In addition, also can in a light-emitting device mounted substrate or a light-emitting device installation component, the multi-group light-emitting device be installed, make brightness seem very high thus.
Therefore, the light-emitting device installation component of the application of the invention can obtain high performance planar light source device with low cost.
Description of drawings
Fig. 1 is the schematic plan of first embodiment of light-emitting device mounted substrate of the present invention;
Fig. 2 is for cuing open the schematic sectional view of the light-emitting device mounted substrate of getting along X-X line among Fig. 1;
Fig. 3 is the schematic plan of an assembly, in this assembly, on a light-emitting device mounted substrate shown in Figure 1 one group of led chip is installed;
Fig. 4 is the schematic cross sectional view of assembly shown in Figure 3;
Fig. 5 is the schematic plan of an assembly, in this assembly, on a light-emitting device mounted substrate shown in Figure 1 three groups of led chips is installed;
Fig. 6 is the schematic cross sectional view of assembly shown in Figure 5;
Fig. 7 is the schematic plan view that is similar to Fig. 2 of light-emitting device mounted substrate second embodiment of the present invention;
Fig. 8 is the schematic plan of the 3rd embodiment of light-emitting device mounted substrate of the present invention; And
Fig. 9 is the schematic plan of traditional three-in-one component.
Embodiment
Describe one embodiment of the invention (example) in detail below in conjunction with accompanying drawing.
Fig. 1 is the vertical view of first embodiment of light-emitting device mounted substrate of the present invention.Fig. 2 is for cuing open the sectional view of the light-emitting device mounted substrate of getting along X-X line among Fig. 1.
In configuration embodiment illustrated in fig. 1, use a led chip R who glows, the led chip G of a green light and the led chip B of a blue light-emitting, fixing point O from the light-emitting device mounted substrate 1 is furnished with light-emitting device installation portion 10, three led chip R, G in the mode that stretches and B can be installed in respectively on each light-emitting device installation portion 10 to the circumference that with this fixing point O is the center along three directions.
Above-mentioned whole configuration is called a mounted substrate unit 6.
More specifically, mounted substrate unit 6 has such configuration, promptly, center O on the light-emitting device mounted substrate 1 is used as basic point, extend through three light-emitting device installation portions 10 vertically on the straight line of median plane in, the angle between two straight lines of the median plane by adjacent light-emitting device installation portion 10 is about 120 ° ((360/3) °).
Being about 120 ° of fingers needn't strictness be 120 °, but allows variant slightly.Preferably, this difference angle to be formed 1/10 in.
In following explanation, add a suffix numeral to distinguish a plurality of led chips to the led chip R, the led chip G of green light that glow and the led chip B of blue light-emitting.
More specifically, led chip R1, G1 and B1 can be installed in center O on light-emitting device mounted substrate 1 apart from the position of d1, led chip R2, G2 and B2 can be installed in center O on light-emitting device mounted substrate 1 apart from the position of d2, and led chip R3, G3 and B3 can be installed in center O on light-emitting device mounted substrate 1 apart from the position of d3.
That is to say that the present invention can be used for three kinds of different configurations of distance between the led chip.
In the embodiment shown in fig. 1, d1 is less than d2, and d2 is less than d3.
Led chip is bonded in thermal conductivity good metal substrate by paste or heat radiation grease or is used as on the Copper Foil or aluminium foil of substrate, thereby makes led chip outwards heat radiation well.
The both sides of each light-emitting device installation portion 10 are provided with the substrate electrod sheet (anode A and negative electrode C) that is electrically connected with the electrode (anode and negative electrode) of led chip (not shown) by wire-bonded on light-emitting device mounted substrate 1.
The electrode slice RA of each color, RC, GA, GC, BA and BC are electrically connected with substrate lead-in wire 3, to power to electrode slice.
As shown in Figure 2, on the surface of light-emitting device mounted substrate 1, except the zone that led chip is installed, be formed with an insulating barrier 2, on insulating barrier 2, be formed with the substrate lead-in wire of making by copper or similar material 3.On substrate lead-in wire 3, except the substrate electrod panel region, also be formed with insulating barrier 2, make substrate electrod sheet surface almost flush, although this point does not illustrate in the drawings with the surface of insulating barrier 2.
As mentioned above, the electrode of led chip and substrate electrod sheet are connected to each other by the wire-bonded (not shown).
With spun gold as under the situation of bonding wire, on the electrode surface of led chip and substrate electrod sheet surface, form a Gold plated Layer, to obtain good connection.
Fig. 3 and 4 is respectively at light-emitting device mounted substrate 1 (mounted substrate unit 6) and goes up schematic plan and the schematic cross sectional view that the light-emitting device installation component 12 of one group of led chip R1, G1 and B1 only is installed apart from the d1 place at decentre O.
Light-emitting device installation component 12 shown in Figure 3 includes only led chip R1, G1 and B1, on light-emitting device mounted substrate 1 (mounted substrate unit 6), be furnished with a reflector 4 that is provided with a peristome, make this reflector cover the periphery of led chip and upwards reflect the light that sends from led chip effectively from light-emitting device mounted substrate 1.
This reflector 4 preferably by adhesives to the surface of mounted substrate unit 6.
Therefore, in light-emitting device installation component 12 shown in Figure 3, reflector 4 coverings one center on the perimeter in the zone of led chip R1, G1 and B1 wherein are installed, and can't see mounted substrate unit 6 lip-deep lead-in wires and arrange.
Wire-bonded makes the electrode slice (not shown) and the substrate electrod sheet around them that are installed on led chip R1, G1 and the B1 be connected to each other.
Under the situation of using the small size led chip as shown in Figure 3, versicolor led chip can be adjacent to be installed in from the little position of substrate center O distance advantageously to make colourity even.
The led chip size is big more, and the thermal exposure of following when luminous increases.
Therefore, when using the large scale led chip, led chip can be installed in the position that light-emitting device mounted substrate 1 (mounted substrate unit 6) is gone up decentre O distance.
As mentioned above, according to the size and the thermal exposure of led chip, in a light-emitting device installation component, can change the installation site of led chip.
Distance between substrate electrod (anode and the negative electrode) sheet makes the maximum led chip that will use can be installed greater than the width in formed light-emitting device zone.
In the light-emitting device installation component 12 shown in Fig. 5 and 6, go up decentre O apart from d1 at light-emitting device mounted substrate 1 (mounted substrate unit 6), led chip all is equipped with in the position of d2 and d3.
By using above-mentioned configuration, the brightness that can improve the LED lamp.
In the case, be provided with the reflector 4 that is used for upwards reflecting effectively the circular open portion of the light that sends from led chip and arrange like this, make this reflector cover substrate center O on mounted substrate unit 6 apart from the outside of d3 from light-emitting device mounted substrate 1.
Wire-bonded makes and is installed in led chip R1, G1, and B1, R2, G2, B2, R3, electrode slice (not shown) on G3 and the B3 and the substrate electrod sheet around them are connected to each other.
Preferably, the identical led chip of glow color is installed on a light-emitting device installation portion 10.More specifically, led chip R1 preferably is installed on the first light-emitting device installation portion, R2 and R3, led chip G1 is installed on the second light-emitting device installation portion, G2 and G3, led chip B1 is installed on the 3rd light-emitting device installation portion, B2 and B3, the electrode slice of the led chip that glow color is identical is connected with the single electrode slice of arranging in light-emitting device installation portion both sides by wire-bonded.
Even under the identical situation of the shape of each led chip, drive current is also looked the difference of glow color and difference.Therefore, when the identical led chip of glow color is installed on a light-emitting device installation portion 10, easily led chip is totally controlled.
But the present invention also can comprise the configuration different with above-mentioned configuration.
Although the material of the reflector that uses 4 is not particularly limited, preferably use very high material of reflectivity such as aluminum.
The inner surface 5 of the peristome of reflector 4 is processed into taper (inclined-plane), and is used for upwards reflecting the light that sends from led chip effectively from light-emitting device mounted substrate 1 (mounted substrate unit 6).The angle [alpha] of the extended line of inner surface 5 is preferably 90 °-120 °.
The peristome of reflector 4 is embedding as silicones with sealing resin 7, makes the top of peristome almost flush with the upper surface of reflector 4, protects bonding wire thus." almost flush " and refer to make two upper surface strictnesses to flush, but allow a small amount of irregular and a little external waviness.
Although in light-emitting device installation component 12 shown in Figure 5, on center O all positions on the light-emitting device mounted substrate 1 (mounted substrate unit 6), led chip is being installed all apart from d1, d2 and d3, but also can be only in the center O on light-emitting device mounted substrate 1 (mounted substrate unit 6) apart from d1 and d2, d1 and d3, or on the position of d2 and d3 led chip is installed.
Although in this embodiment, the light-emitting device installation portion is arranged on three diverse locations, and the present invention is not subjected to the restriction of this embodiment, and light-emitting device installation portion 10 also can be arranged on four or more the position.In addition, although in this embodiment, each light-emitting device installation portion is formed with essentially identical width from substrate center on the direction of circumference that with the substrate center is the center of circle, but each light-emitting device installation portion also can form like this, makes that this width is wide more from this circumference is near more along with the light-emitting device installation portion.
In addition, although on a light-emitting device installation portion 10 nearly three led chips can be installed in this embodiment, the present invention is not subjected to the restriction of this embodiment.The installation site of the led chip of every kind of color and the quantity of installable led chip can suitably be selected, and can change according to the light-emitting device installation portion.
Fig. 7 is the schematic plan view that the light-emitting device mounted substrate 1 of second embodiment of the invention is shown.
The configuration of light-emitting device mounted substrate 1 shown in Figure 7 is with basic identical according to the light-emitting device mounted substrate 1 of first embodiment shown in Figure 2.Therefore, parts same as shown in Figure 2 are represented with same numeral, and no longer described similar elements are described in detail at this.
Be that with the difference of above-mentioned first embodiment zone that led chip wherein is installed is formed with a projection 8 on metal substrate 1.
In this embodiment, first insulating barrier 2 forms like this, makes the surface of projection 8 almost flush with the surface of first insulating barrier 2, and is formed with substrate lead-in wire 3 on first insulating barrier 2.
In addition, the zone except that substrate electrod sheet of second insulating barrier 2 ' on substrate lead-in wire 3 forms like this, makes the surface of substrate electrod sheet almost flush with the surface of second insulating barrier 2 '.
Preferably with white protective layer (white resist) as second insulating barrier 2 ', because can be from light-emitting device mounted substrate 1 light that sends from led chip of usable reflection upwards.
Second insulating barrier 2 ' and substrate electrod sheet region are furnished with a reflector (not shown).
Because the surface of second insulating barrier 2 ' and the surface of substrate electrod sheet region almost flush, therefore almost very close to each other between these surfaces and the reflector (not shown) surface faced, obtain good bonding thus.
Fig. 8 is the vertical view that the light-emitting device mounted substrate 1 of third embodiment of the invention is shown.
The configuration of light-emitting device mounted substrate 1 shown in Figure 8 is with basic identical according to the light-emitting device mounted substrate 1 of first embodiment shown in Figure 1.Therefore, parts same as shown in Figure 1 are represented with same numeral, and no longer described similar elements are elaborated.
Fig. 8 only illustrates led chip installation region and substrate electrod sheet with schematic plan.This embodiment has also illustrated the situation of wherein using the led chip of three kinds of colors.
With center O for example the fixing point of light-emitting device mounted substrate 1 be that each limit of the equilateral triangle of center of gravity almost overlaps with the vertically straight line by median plane along each light-emitting device installation portion 10, in each light-emitting device installation portion, three led chips are installed between a pair of relative substrate electrod sheet." almost overlap " refer to and needn't strictly overlap, but allow to tilt slightly and depart from.
More specifically, led chip R4, G4 and B4 can be installed on the light-emitting device mounted substrate 1 decentre O apart from the d4 position, led chip R5, G5 and B5 can be installed in decentre O apart from the d5 position, and led chip R6, G6 and B6 can be installed in decentre O apart from the d6 position.
That is to say that the present invention can be used for three kinds of different configurations of distance between the led chip.
In the embodiment shown in fig. 8, d4 is less than d5, and d5 is less than d6.
Similar with first embodiment, can be only on one group of led chip installation region or two groups or three groups of led chip installation regions, led chip be installed.
In addition, the quantity of the installation site of the led chip of every kind of color and led chip to be installed can change according to the light-emitting device installation portion.
Although in above-mentioned first to the 3rd embodiment, use the led chip of three kinds of colors, also can use the led chip of four kinds or more colors.
When using four kinds of color led chips, preferably will olive colourly be used as the 4th kind of color, this is to play the colour developing effect because of it.
When with the similar configuration of first and second embodiment in use under the situation of n kind (n is equal to or greater than 4) color, a plurality of led chips can installed (angle on the n direction between the adjacent in twos straight line be about (360/n) °) by center O along n direction on the light-emitting device mounted substrate 1.
More specifically, when using four kinds of colors, the angle between two straight lines of the median plane by adjacent light-emitting device installation portion is about 90 °.
When with the similar configuration of the 3rd embodiment in when using n kind (n is equal to or greater than 4) color, the light-emitting device installation portion of a plurality of led chips can disposed thereonly be installed, and it is each limit of the equilateral polygon with n limit of center of gravity that described led chip is installed in the center O on the light-emitting device mounted substrate 1.
Although the quantity of glow color equals the quantity in light-emitting device zone in the above-described embodiments, the quantity in light-emitting device zone also can be greater than the quantity of glow color.
For example, for R, G and three kinds of colors of B, can be furnished with a light-emitting device zone at R, at G two light-emitting device zones be arranged, at B a light-emitting device zone be arranged, promptly the quantity in light-emitting device zone is 4.
At this moment, configuration of the quantity in light-emitting device zone and electrode slice etc. can be identical with the situation of four kinds of colors among above-mentioned first to the 3rd embodiment.
With regard to the metal substrate that uses among above-mentioned first to the 3rd embodiment, the printed substrate that preferably will contain thermal conductivity good metal sheet material is as matrix.
Although the material of metal substrate and manufacture method are not particularly limited, the directly traditional material of application of printed wiring board and traditional manufacturing technique.
Make this embodiment by using copper-coated laminate, wherein on the copper coin surface lamination glass epoxide material with as insulating barrier, Copper Foil is processed into lead pattern (forming Gold plated Layer on the electrode slice surface), and selectivity is removed the insulating barrier on the light-emitting device installation portion then.
Use the configuration and the conventional planar light supply apparatus of planar light source device of light-emitting device installation component of the present invention similar.Exactly, the light-emitting device installation component of the present invention of predetermined quantity can be installed on the bottom surface on the chassis of being made by material such as aluminium.Although in each in first to the 3rd embodiment, the center of substrate is a fixing point, promptly forms a light source cell that emits white light by the LED that multiple color is installed on a substrate, and the present invention is not subjected to the restriction of these embodiment.But a substrate can contain a plurality of fixing points,, arranges the light source cell of a plurality of that be arranged in a row or an array on a large size substrate that is.
Planar light source device can be specially, and for example, is used for the backlight or advertising lighting of liquid crystal indicator.
Although each preferred embodiment of the present invention more than has been described, the present invention is not subjected to the restriction of these embodiment, therefore can make all changes, modification and increase function in the case without departing from the scope of the present invention.For example, although light-emitting device mounted substrate of the present invention is used to install the different a plurality of light-emitting devices of glow color with the light-emitting device installation component, also the white light emitting device that need not blend color can be installed.
Claims (16)
1. light-emitting device mounted substrate, the different multiple light-emitting device of glow color is installed in this light-emitting device mounted substrate, this light-emitting device mounted substrate comprises a plurality of light-emitting device installation portions, each light-emitting device installation portion light-emitting device that is used to pack into corresponding to a kind of glow color, wherein, described light-emitting device installation portion has a configuration, on each light-emitting device installation portion a plurality of light-emitting devices can be installed in this configuration.
2. by the described light-emitting device mounted substrate of claim 1, it is characterized in that the quantity of formed light-emitting device installation portion is equal to or greater than the quantity of the different glow colors of the light-emitting device that will install.
3. by claim 1 or 2 described light-emitting device mounted substrates, it is characterized in that described light-emitting device installation portion is arranged on this light-emitting device mounted substrate with constant pitch.
4. by the described light-emitting device mounted substrate of claim 2, it is characterized in that, a plurality of light-emitting device installation portions stretch from the girth of the on-chip fixing point of light-emitting device to a circle, and described fixing point is the center of circle of described circle, and described a plurality of light-emitting device installation portions are with given angle intervals setting.
5. by the described light-emitting device mounted substrate of claim 2, it is characterized in that, described light-emitting device installation portion is arranged to like this, make fixing point with the light-emitting device mounted substrate be center of gravity equilateral polygon the limit with along the light-emitting device installation portion longitudinally straight line almost overlap.
6. by claim 4 or 5 described light-emitting device mounted substrates, it is characterized in that described fixing point is the center of described light-emitting device mounted substrate.
7. by claim 4 or 5 described light-emitting device mounted substrates, it is characterized in that, also comprise a plurality of fixing points.
8. by the described light-emitting device mounted substrate of arbitrary claim among the claim 1-7, the position that also described therein light-emitting device installation portion is arranged on the described light-emitting device mounted substrate comprises a projection, wherein, described light-emitting device installation portion is arranged on this projection.
9. by the described light-emitting device mounted substrate of claim 8, it is characterized in that described projection is by making with the material identical materials of described light-emitting device mounted substrate.
10. by the described light-emitting device mounted substrate of arbitrary claim among the claim 1-9, it is characterized in that described light-emitting device mounted substrate is a metallic matrix substrate.
11., it is characterized in that described light-emitting device is a light-emitting diode (LED) by the described light-emitting device mounted substrate of arbitrary claim among the claim 1-10.
12., it is characterized in that described light-emitting diode (LED) is a light-emitting diode (LED) chip by the described light-emitting device mounted substrate of claim 11.
13. by the described light-emitting device mounted substrate of claim 12, it is characterized in that, also be included in the substrate electrod sheet that described light-emitting device installation portion both sides are connected with anode by the wire-bonded and the negative electrode of light-emitting diode (LED) chip.
14. a light-emitting device installation component comprises a reflector, the position corresponding to the light-emitting device installation portion on the described light-emitting device mounted substrate of this reflector arbitrary claim in by claim 1-13 is provided with a peristome.
15. by the described light-emitting device installation component of claim 14, it is characterized in that described peristome is embedding by sealing resin, make the top of described peristome almost flush with the surface of described reflector.
16. a planar light source device wherein, is equipped with one by claim 14 or 15 described light-emitting device installation components on the bottom surface on chassis.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP306051/2005 | 2005-10-20 | ||
| JP2005306051 | 2005-10-20 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101292368A true CN101292368A (en) | 2008-10-22 |
| CN100565950C CN100565950C (en) | 2009-12-02 |
Family
ID=39803865
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2006800386354A Expired - Fee Related CN100565950C (en) | 2005-10-20 | 2006-10-16 | Light-emitting device mounted substrate, light-emitting device installation component and planar light source device |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR101006658B1 (en) |
| CN (1) | CN100565950C (en) |
| TW (1) | TW200737547A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101881381B (en) * | 2009-05-05 | 2012-09-05 | 宁波晶科光电有限公司 | White light emitting diode and white light emitting diode lamp |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI506812B (en) * | 2013-04-22 | 2015-11-01 | Lextar Electronics Corp | Light-emitting diode with side-wall bump structure and mounting structure having the same |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003195791A (en) * | 2001-12-26 | 2003-07-09 | Kenwood Corp | Light emitting display device |
| JP2005210043A (en) * | 2003-12-24 | 2005-08-04 | Kyocera Corp | Package for housing light-emitting element, light-emitting apparatus and illumination apparatus |
| JP4654670B2 (en) * | 2003-12-16 | 2011-03-23 | 日亜化学工業株式会社 | Light emitting device and manufacturing method thereof |
| CN1869504B (en) * | 2005-05-25 | 2010-04-07 | 新灯源科技有限公司 | LED cluster bulb |
-
2006
- 2006-10-16 KR KR1020087011863A patent/KR101006658B1/en not_active IP Right Cessation
- 2006-10-16 CN CNB2006800386354A patent/CN100565950C/en not_active Expired - Fee Related
- 2006-10-18 TW TW095138428A patent/TW200737547A/en unknown
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101881381B (en) * | 2009-05-05 | 2012-09-05 | 宁波晶科光电有限公司 | White light emitting diode and white light emitting diode lamp |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100565950C (en) | 2009-12-02 |
| KR101006658B1 (en) | 2011-01-10 |
| KR20080058496A (en) | 2008-06-25 |
| TW200737547A (en) | 2007-10-01 |
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