KR101386572B1 - Method for fabricating liquid crystal display device - Google Patents

Abstract

The present invention is a distortion phenomenon and brightness of the white light generated by mixing the light between the LED package and the LED package when configuring the LED backlight by arranging and fixing the PCB formed by forming the LED package on the bottom cover A method of manufacturing a liquid crystal display device to which a standardized screwing method is applied to reduce the nonuniformity of the method may include: preparing a lower cover; Providing at least one PCB on the lower cover; Fix the LED package by forming a plurality of rows on the PCB, the four LED packages adjacent to each other in the odd and even rows when the LED package is formed in a row of multiples of 2 square, rectangular, parallel Fixing to form one of the quadrilaterals; Fastening a screw to a center of gravity of four LED packages fixed in at least one of the square, rectangular, and parallelogram shapes; It characterized in that it comprises a step of providing a liquid crystal panel on the PCB is provided with the LED package.

Printed Circuit Board (PCB), Light Emitting Diode Package

Description

Manufacturing method of liquid crystal display device {METHOD FOR FABRICATING LIQUID CRYSTAL DISPLAY DEVICE}

The present invention relates to a method of manufacturing a liquid crystal display device, and more particularly, when configuring a LED backlight by arranging and fixing a printed circuit board (PCB) on which a LED package is formed in a row on a bottom cover. The present invention relates to a method for manufacturing a liquid crystal display device, to which a conventional screw fastening method can be applied, which can reduce distortion and unevenness of white light generated by mixing light between the LED package and the LED package.

In general, a direct type back-light used in a large-scale liquid crystal display reflects light from a cold cathode fluorescent lamp from a reflecting plate to a front liquid crystal panel. In addition, a milky white scattering plate is additionally disposed in the light reflection path, so that light having a locally uniform brightness is illuminated on the liquid crystal display. However, this method involves the problem of bringing the liquid crystal display into a large and complicated model with respect to the thickness of the backlight.

In recent years, as a surface light source device, it is a two-pole device that emits light only when a current passes, and the backlight is thinned by using a light emitting diode (LED) which has characteristics such as fast response speed, low power consumption, and semi-permanent life. At the same time, brightness is improved. Above all, it is possible to reproduce natural colors and high-definition images compared to the existing cold cathode fluorescent lamps, and to replace the cold cathode fluorescent lamp backlight device by resolving the problem of after-image of the video and the recognition that it is an eco-friendly product that does not use mercury. As a core part of next generation LCD which is present, there is no problem.

Hereinafter, a conventional direct type LED liquid crystal display device will be described with reference to the accompanying drawings.

1 is a cross-sectional view of a general direct type LED liquid crystal display device.

As shown in FIG. 1, the liquid crystal display is based on a main support 50 made of a synthetic resin or a stainless steel (SUS STEEL) mold having a rectangular frame shape, and an image is formed thereon. The liquid crystal panel 10 is provided, and at the bottom, a backlight device for providing light to the liquid crystal panel 10 is provided.

Here, the backlight device includes a plurality of printed circuit boards (PCBs) 34 arranged and fixed on the reflecting plate 32 provided on the lower cover 40 and the lower cover 40 to which the reflecting plate 32 is attached. ) And a package of red (R), green (G), and blue (B) LED chips as one cluster on the PCB 34. The LED package 36 formed in a row is formed, a diffuser plate 42 provided above the LED array to diffuse light emitted from the LED array, and light passing through the diffuser plate 42. Prismatic sheet 44 to increase the brightness of the prism sheet 44 and the protective sheet 46 to increase the viewing angle.

In this case, as shown in the drawings, the reflecting plates 32 and 38 are provided with the reflecting plate 32 attached to the lower front surface of the region where the PCB 34 is driven, and the LED package 36 forming at least one row. It consists of a reflector plate 38 attached to each PCB 34, where the reflector plate 38 formed on each PCB 34 is attached by forming a hole in a region corresponding to the LED package 36. .

In addition, the liquid crystal panel 10 includes a thin film transistor array substrate bonded to face each other to maintain a uniform cell gap, a color filter substrate on which color filters of R, G, and B are formed, and a liquid crystal layer formed between the two substrates. It consists of.

FIG. 2 is a plan view showing PCBs arranged and fixed on the lower cover of FIG.

As shown in FIG. 2, LED arrays 36 formed as a package by using R, G and B LED chips as a cluster are formed on each PCB 34. Since the LED chips of R, G, and B, which substantially constitute one cluster, have different driving voltages, many conductive wires are formed on the PCB 34 for this purpose. For example, the LED chips of R located in one LED package 36 on the PCB 34 and the LED chips of R located in the LED package 36 neighboring each other in the same row are parallel to each other by a DC voltage from the outside. Conductive wirings are formed to drive.

In addition, the PCB 34, in which the LED packages 36 are fixed in a row, is arranged and fixed on the lower cover 30 by screwing, as well as detaching and detaching the reflecting plate attached to each PCB 34. It includes a plurality of screw fastening portion 38 to which the screw is fastened to prevent the screw, wherein the screw fastening portion 38 is the four corner areas of the PCB 34 and the four places on the PCB 34 during manufacturing On the basis of the screw fastening portion 38 formed at the corner region, the screw fastening portions 38 are further formed between the centers of each other.

However, when the plurality of LED packages 36 formed as a package on the PCB 34 by using the LED chips of R, G, B as a cluster substantially in the same manner, the screw fastening portion 38 Is biased to a specific LED package 36, so that the light provided from the LED package 36 is first reflected by the light from the screw of its adjacent screwing portion 38, so that the LED as a whole is viewed through the backlight. The color mixing between the packages 36 is not smoothly performed, which results in inevitably distorting white light. This eventually leads to a deterioration in image quality.

In addition, although not shown in detail in the drawings, the R, G, and B LED chips formed in the LED package 36 in a row on the PCB 34 are driven in parallel by receiving a DC voltage from the outside, where the PCB ( The screwed portion 38 is formed on the specific LED package 36 on the part 34 so that part of the wiring for connecting each of the R, G, and B LED chips to each other within a given PCB 34 is inevitable. This requires a routing change that bypasses and redesigns. This decreases the efficiency of the operation and reduces the yield of the liquid crystal display.

The present invention has been made to solve the above problems, the object of which is to square the through a plurality of rows when fixing the LED package to form a row in multiples of 2 or multiples of 3 on the PCB provided on the lower cover The present invention provides a method of manufacturing a liquid crystal display device using a prescribed screwing method for fixing a screw to a center of gravity of four LED packages having one of rectangular, parallelogram and diamond shapes.

One manufacturing method of the liquid crystal display according to the present invention for achieving the above object comprises the steps of preparing a lower cover; Providing at least one PCB on the lower cover; Fix the LED package by forming a plurality of rows on the PCB, the four LED packages adjacent to each other in the odd and even rows when the LED package is formed in a row of multiples of 2 square, rectangular, parallel Fixing to form one of the quadrilaterals; Fastening a screw to a center point of four LED packages fixed in at least one of the square, rectangular, and parallelogram shapes; It characterized in that it comprises a step of providing a liquid crystal panel on the PCB is provided with the LED package.

In addition, another manufacturing method of the liquid crystal display according to the present invention comprises the steps of preparing a lower cover; Providing at least one PCB on the lower cover; Fix the LED package by forming a plurality of rows on the PCB, the four LED packages adjacent to each other in the odd and even row to reach the diamond shape when the LED package is formed in a row of multiples of three Fixing; Fastening a screw to a center point of the four LED packages fixed in the diamond shape; It characterized in that it comprises a step of providing a liquid crystal panel on the PCB is provided with the LED package.

As a result of the above, the manufacturing method of the liquid crystal display according to the present invention provides a standard screw fastening standard on a PCB on which a plurality of LED packages are formed, thereby reducing the color mixing of light provided from the LED package provided in the lower part of the liquid crystal panel. It is possible to smoothly obtain white light with uniform luminance.

In addition, by maintaining the same length of the wiring connected between the LED chip of each of the R, G, B constituting the LED package, it is possible to obtain a light of uniform brightness by eliminating the difference in the amount of current caused by factors such as line resistance. .

Hereinafter, a configuration and manufacturing method of a liquid crystal display according to the present invention will be described in detail with reference to the accompanying drawings.

3 is an exploded perspective view of a liquid crystal display according to a first exemplary embodiment of the present invention, FIG. 4A is a plan view illustrating the backlight of FIG. 3, and FIG. 4B is a diagram illustrating a method of fastening screws on the PCB of FIG. 4A. .

As shown in FIGS. 3, 4A, and 4B, a direct type LED backlight device is provided on the lower cover 130 to provide light to the liquid crystal panel 160. A covering first reflecting plate (not shown) is attached. Here, the first reflector is a film coated with silver (Ag), aluminum (Al) and the like, the thickness of the film will be about 75 ~ 200㎛. Generally, in the first reflector, the light reflectance of visible light is about 90 to 97%, and the thicker the coated film, the higher the reflectance.

In addition, a plurality of PCBs 132 are arranged on the lower cover 130 to which the first reflecting plate (not shown) is attached at regular intervals. For example, in the present invention, the PCB 132 is formed of a kind of metal bar. Metal PCBs may be used. Of course, a conductive wiring is formed on the metal PCB to allow the LED package 136, which is composed of LED chips of R, G, and B, to be driven by an applied voltage from the outside. Due to the problem of heat generation at high temperature, a separate metal material is formed to facilitate heat dissipation.

In addition, the LED package 136 formed as a package is fixed on the PCB 132 by forming a cluster of R, G, and B LEDs in a delta, that is, a triangle. In this case, for example, as shown in FIGS. 3 and 4A, the LED package 136 constituting the first column and the LED package 136 constituting the second column are fixed on the PCB 132 to be disposed in the first and second rows. Four LED packages 136 neighboring each other may form a square. In other words, the distance between the odd-numbered LED package 136 forming the first row and the even-numbered LED package 136 in the same row when the center point of the LED package 136 is referred to is the odd-numbered LED package 136 in the first row. ) And the odd-numbered LED package 136 of the second row means the same as each other.

In addition, a second reflector (not shown) for exposing the plurality of LED packages 136 to the outside is attached to the plurality of PCBs 132 provided on the lower cover 130. Since the second reflecting plate is attached to each PCB 132 unlike the first reflecting plate, the second reflecting plate may be different from each other in terms of size, but like the first reflecting plate above, silver (Ag), aluminum (Al), etc. are coated films This is used, the thickness of the film is suitable about 75 ~ 200㎛. Of course, the light reflectance of the visible light in the second reflector is about 90 to 97%, and the thicker the coated film, the higher the reflectance.

In this manner, on each PCB 132 to which the second reflecting plate is attached, four LED packages 136 are formed in a square shape in the first and second rows so as to prevent detachment of the second reflecting plate. When the diagonals (l, m) between two LED packages 136 positioned diagonally to each other as shown in FIG. 4B, respectively, are diagonally crossed (l, m), a screw is inserted into the screwed portion 138 at a portion that forms a center of gravity. It is fastened. This ensures that the screwed fastening portion 138 is located at the same distance (1 / 2l, 1 / 2m) from each other in all four LED packages 136, which are laterally radiated from the LED package 136. Color mixing of the white light provided from the plurality of LED packages 136 can be smoothly maintained by creating the same conditions, that is, the same distance that light can be reflected through the screw fastened to the screwed portion 138. .

In addition, the conductive wires formed on the PCB 132 due to the screws that are positioned in the first and second columns on the PCB 132 and are fastened to the square center of gravity formed by the four LED packages 136 may have the same condition. Will have That is, sufficient routing space for securing the conductive wiring on the PCB 132 is secured, and as a result, the length of the conductive wiring connected between each of the R, G, and B LED chips constituting the LED package 136 is changed. The same can be maintained by forming. This makes it possible to prevent the difference in the amount of current which may be caused by factors such as line resistance, so that light of uniform brightness is provided from the backlight.

For example, a screw fastened to a square center of gravity formed by four LED packages 136 allows a sufficient routing space to be secured so that the first row of odd-numbered LED packages are arranged and fixed on each PCB 132. The length of the conductive wiring between the LED chip of R in R 136 and the LED chip of the even-numbered LED package 136 constitutes the LED chip of R and the even-numbered LED package of the odd-numbered LED package 136 in the second column. The length of the conductive wiring formed by the LED chip of R 136 is maintained to be the same as each other. This, of course, applies equally between the LED chips of G and the LED chips of B in the odd-numbered LED package 136 and the even-numbered LED package 136 that are fixed in rows on each PCB 132.

The diffusion plate 141 and the diffusion sheet 142 that mitigate nonuniformity of light emitted from the LED package 136 are formed on the upper side of the PCB 132 in which the LED package 136 is formed by forming a plurality of rows, A prism sheet 144 for increasing the luminance of light transmitted through the diffusion plate 141 and the diffusion sheet 142 and a protective sheet 146 for protecting the prism sheet 144 and increasing the viewing angle are loaded.

In addition, the main support 150 is provided to balance the overall force of the liquid crystal display. The main support 150 is a mold of synthetic resin or sus steel having a substantially rectangular frame shape to form a predetermined pattern for loading the liquid crystal panel 110 on the top, and surrounds the outer cover of the lower cover 130. do.

The liquid crystal panel 160 is mounted on the main support 150 to receive light from the lower backlight and to implement data information from the outside. Of course, the liquid crystal panel 160 includes a thin film transistor array substrate on which a thin film transistor as a switching element is arranged for each unit pixel, a color filter substrate on which a color filter representing color is formed, and a liquid crystal injected between two substrates. It is configured by.

The upper cover 170 covers four edges of the liquid crystal panel 160 and is assembled and fastened to the main support 150 and the lower cover 130.

FIG. 5A is a plan view illustrating a backlight of a liquid crystal display according to a second exemplary embodiment of the present invention, and FIG. 5B is a view illustrating a method of fastening screws on the PCB of FIG. 5A.

5A and 5B, the backlight of the liquid crystal display according to the second exemplary embodiment of the present invention is provided on the lower cover 230 to provide light, and the first column on the plurality of PCBs 236. And the arrangement state of the LED package 236 formed in the second row is different, and thus the position of the screw fastening portion is slightly different from the first embodiment of the present invention.

In addition, a plurality of PCBs 232 are arranged at regular intervals on the lower cover 230 to which the first reflecting plate is attached. For example, the PCB 232 may be a metal PCB made of a kind of metal bar. have. On the metal PCB, a conductive wiring is formed in which R, G, and B LED chips form a cluster so that the LED packages 236 constituted as packages are driven by an applied voltage from the outside. Due to the high temperature heat generation problems involved, a separate metal material is coated to facilitate heat dissipation.

In addition, on the PCB 232, the LED package 236 of the R, G, B LED chip as a cluster to form a plurality of columns are fixed. For example, as shown in FIGS. 5A and 5B, the LED package 236 constituting the first column and the LED package 236 constituting the second column are fixed on the PCB 232 to each other in the first and second rows. Neighboring four LED packages 236 form a parallelogram. In other words, when the odd-numbered LED package 236 and the even-numbered LED package 236 in the first row are formed at predetermined intervals, the odd-numbered and even-numbered LED packages 236 constituting the second row are It is formed at a position corresponding to the area between the odd-numbered LED package 236 and the even-numbered LED package 236 forming the first row. As a result, four LED packages 236 adjacent to each other in the first and second columns form a parallelogram. Of course, the spacing between the four LED packages 236 adjacent to each other in the first row and the second row to form a parallelogram will not be particularly limited thereto.

In addition, a second reflector (not shown) for exposing the plurality of LED packages 236 to the outside is attached to the plurality of PCBs 232 provided on the lower cover 230. Since the second reflecting plate is attached to each PCB 232 differently from the first reflecting plate, the second reflecting plate is inevitably different from each other in size. However, the second reflecting plate is coated with silver (Ag), aluminum (Al), etc. like the first reflecting plate. This is used, the thickness of the film is suitable about 75 ~ 200㎛. Of course, the light reflectance of the visible light in the second reflector is about 90 to 97%, and the thicker the coated film, the higher the reflectance.

In this way, on each PCB 232 to which the second reflecting plate is attached, the four LED packages 236 are arranged in the first column and the second column so as to prevent detachment of the second reflecting plate to form a parallelogram. When the diagonals (l, m) are drawn between two LED packages 236 positioned diagonally to each other as shown in FIG. 5B, the screws are inserted in the screwing portion 238 at the cross section to form a center of gravity. It is fastened. This ensures that the screwed fastening portion 238 is located at the same distance (1 / 2l, 1 / 2m) from each other in all four LED packages 236, which are laterally radiated from the LED package 236. Color mixing of the white light provided from the plurality of LED packages 236 can be smoothly maintained by creating the same conditions, ie, the same distance, that light can be reflected through the screw fastened to the screwing portion 238. .

In addition, the conductive wires formed on the PCB 232 due to the screws which are positioned in the first and second columns on the PCB 232 and are fastened to the center of gravity of the parallelogram formed by the four LED packages 236 may have the same conditions. Will have That is, sufficient routing space for securing conductive wiring on the PCB 232 is secured, and as a result, the length of the conductive wiring connected between each of the R, G, and B LED chips constituting the LED package 236 is changed without changing the length of the conductive wiring. The same can be maintained to form repeatedly. This makes it possible to prevent the difference in the amount of current which may be caused by factors such as line resistance, so that light of uniform brightness is provided from the backlight.

For example, a screw fastened to the center of gravity of the parallelogram formed by the four LED packages 236 allows a sufficient routing space to be secured so that the first row of odd-numbered LEDs are arranged and fixed on each PCB 232. The length of the conductive wiring between the LED chip of R in the package 236 and the LED chip of R in the even-numbered LED package 236 is equal to the length of the LED chip of R and the even-numbered LED that constitute the odd-numbered LED package 236 in the second column. The lengths of the conductive wirings of the LED chips of R constituting the package 236 are maintained to be the same. This, of course, applies equally between the LED chip of B and the LED chips of B in the odd-numbered LED package 236 and the even-numbered LED package 236 that are fixed in rows on each PCB 232.

A diffusion plate and a diffusion sheet for alleviating the nonuniformity of light emitted from the LED package 236 and a diffusion plate and the diffusion sheet are formed on the upper side of the plurality of PCBs 232 on which the LED package 236 is formed by forming a plurality of rows. A prism sheet for increasing the luminance of transmitted light and a protective sheet for protecting the prism sheet and increasing the viewing angle are loaded to form a backlight.

6 is a plan view illustrating a backlight of a liquid crystal display according to a third exemplary embodiment of the present invention.

As shown in FIG. 6, the backlight of the liquid crystal display according to the third exemplary embodiment of the present invention is fixed on a plurality of PCBs 333 provided on the lower cover 330 to provide light and have a first row. Since the arrangement state of the LED package 336 constituting the fourth row is a square, the position of the screw fastening part is the same as that of the first embodiment of the present invention. However, when the LED package 336 composed of a plurality of rows on the PCB 333 is formed in rows by multiples of two, the screwing method of the present invention is intended to be more effective. Therefore, it is also not specifically limited.

Through this, the screwing portion of the present invention is positioned along the center area center of gravity of the LED packages 336 forming a square adjacent to each other in the first row and the second row, and the square adjacent to each other in the third row and the fourth row. It is formed along the center of gravity center point of the LED package 336 constituting.

This is, of course, so that the screw fastening portion 338, which is fixed to the screw, is positioned at the same distance from the LED package 336 which is diagonal to each other, as described above, so that light can be reflected from the screw fastened to the screw fastening portion 338. By creating similar conditions, the plurality of LED packages 336 can smoothly maintain their color mix when producing white light.

In addition, the conductive wiring formed on the PCB 332 is formed of the R, G, and B components of the LED package 336 due to the screw fastened to the center area center point of the LED package 336 forming a square in the first row and the second row. It is possible to form the same length without changing the path of the conductive wiring between the LED chips. As a result, the conditions under which the LED chips of the R, G, and B constituting the LED package 336 can be emitted by different amounts of current may be improved due to factors such as line resistance, thereby providing light of uniform brightness from the backlight. have.

7 is a plan view illustrating a backlight of a liquid crystal display according to a fourth exemplary embodiment of the present invention.

As shown in FIG. 7, the backlight of the liquid crystal display according to the fourth exemplary embodiment of the present invention is provided on the lower cover 430 to provide light, and the first and second rows on each PCB 433 are provided. The arrangement state of the LED package 436 composed of R, G, G and B LED chips arranged in a rectangular shape in a row as a single clotor is a rectangular shape, and thus the position of the screwing portion is shown. It is slightly different from the first embodiment of the invention.

As a result, the screws fastened to the screw fastening unit 438 are positioned at the same distance from each other in the LED package 436, which is diagonal to each other, and furthermore, LED chips respectively configured in the four LED packages 436. This also surrounds the screws fastened to the screwed portion 438 and forms R, G, G, and B to create similar conditions in which side-radiated light from the LED package 436 can be reflected by the screws. At the same time, the optimum arrangement of the LED chip was found to smoothly mix colors to generate white light throughout the backlight.

At this time, of course, the conductive wiring formed on the PCB 432 is R, constituting the LED package 436 due to the screw fastened to the center of gravity center point of the LED package 436 forming a rectangular shape in the first row and the second row, It is possible to form the same length of the conductive wiring between the LED chips of G, G, and B. As a result, uniform light may be provided from the backlight by excluding conditions under which LED chips of R, G, G, and B constituting the LED package 436 may emit light by different amounts of current due to line resistance.

FIG. 8A is a plan view illustrating a backlight of a liquid crystal display according to a fifth exemplary embodiment of the present invention, and FIG. 8B is a view illustrating a method of fastening screws on the PCB of FIG. 8A.

As shown in FIGS. 8A and 8B, the backlight of the liquid crystal display according to the fifth exemplary embodiment of the present invention is provided on the lower cover 530 to provide light and is fixed on the plurality of PCBs 533. The arrangement state of the LED package 536 constituting the first to third rows is in the shape of a diamond (or diamond), thereby determining the position of the screw fastening portion 538. Here, to show that the screwing method of the present invention can be more effective when the LED package 536 is formed by forming a row in multiples of 3 on each PCB 533 provided in the lower cover 530. will be.

For example, a plurality of PCBs 532 are arranged at regular intervals on the lower cover 530 to which the first reflecting plate is attached as shown in FIG. 8A. In the present invention, the PCB 532 is formed of a metal bar as described above. Metal PCBs may be used. On this metal PCB, a conductive wiring is formed so that the LED package 536 constituting the R, G and B LED chips as a cluster is driven by a voltage applied from the outside, and the back side of the LED Due to the problem of heat generation at high temperatures, a separate metallic material is coated.

In addition, on each PCB 532, an LED package 536 in which R, G, and B LED chips are packaged as one cluster is fixed in three rows. For example, as shown in FIGS. 8A and 8B, the LED package 536 constituting the radix and even in the first row and the LED package 536 constituting the radix and even in the third column are adjacent to each other. The four LED packages 536 form a square (or rectangle). In this case, LED packages 536 forming a second row are formed corresponding to a region between the LED packages 536 adjacent to each other in a first column and a third column to form a square (or rectangle). As a result, the four LED packages 536 adjacent to each other in the first to third rows form a diamond (or diamond) shape.

In addition, a second reflector (not shown) for exposing the plurality of LED packages 536 to the outside is attached to the plurality of PCBs 532 provided on the lower cover 530. Since the second reflecting plate is attached to each PCB 532 differently from the first reflecting plate, the second reflecting plate is inevitably different from each other in size, and the film coated with silver (Ag), aluminum (Al), etc. like the first reflecting plate above This is used, the thickness of the film is suitable about 75 ~ 200㎛. Of course, the light reflectance of the visible light in the second reflector is about 90 to 97%, and the thicker the coated film, the higher the reflectance.

As such, on each PCB 532 to which the second reflecting plate is attached, in order to prevent the detachment of the second reflecting plate, the four LED packages 536 are located in the first to third rows to form a diamond shape. As shown in FIG. 8B, when the diagonals l and m are drawn between the two LED packages 536 positioned diagonally (or facing each other) as shown in FIG. 8B, the screws are screwed to the screwed portions 538 of the portions that cross each other to form a center of gravity. Is fastened. This ensures that the screwed portion 538 with screws is located at the same distance (1 / 2l, 1 / 2m) from each of the four LED packages 536, which is a side emission from the LED package 536. Color mixing of the white light provided from the plurality of LED packages 536 can be smoothly maintained by creating the same conditions, that is, the same distance that the light to be reflected through the screw fastened to the screwing portion 538 can be maintained. have.

In addition, the conductive wires formed on the PCB 532 due to screws which are positioned in the first to third rows on the PCB 532 and fastened to the diamond-shaped center of gravity formed by the four LED packages 536 have the same conditions. Will have That is, sufficient routing space for securing conductive wiring on the PCB 532 is secured, and as a result, the length of the conductive wiring connected between each of the R, G, and B LED chips constituting the LED package 536 is changed without changing the length of the conductive wiring. The same can be maintained to form repeatedly. This makes it possible to prevent the difference in the amount of current which may be caused by factors such as line resistance, so that light of uniform brightness is provided from the backlight.

For example, a screw fastened to a diamond-shaped center of gravity formed by four LED packages 536 allows sufficient routing space to be secured so that the first row of odd-numbered LEDs are arranged and fixed on each PCB 532. The length of the conductive wiring between the LED chips of R in the package 536 and the LED chips of R in the even-numbered LED package 536 constitutes the LED chips of R constituting the odd-numbered LED package 536 in the second row and the third row. And the length of the conductive wiring formed by the LED chip of R constituting the even-numbered LED package 536 to be the same. This, of course, applies equally between the LED chips of G and the LED chips of B in the odd-numbered LED package 536 and the even-numbered LED package 536 which are fixed in rows on each PCB 532.

A diffusion plate and a diffusion sheet for alleviating the nonuniformity of light emitted from the LED package 536 and a diffusion plate and the diffusion sheet are formed on the upper side of the PCB 532 in which the LED package 536 is formed by forming a plurality of rows. A prism sheet for increasing the luminance of transmitted light and a protective sheet for protecting the prism sheet and increasing the viewing angle are loaded to form a backlight.

1 is a cross-sectional view of a typical direct-type LED liquid crystal display device

2 is a plan view showing PCBs arranged and fixed on the bottom cover of FIG.

3 is an exploded perspective view of the liquid crystal display device according to the first embodiment of the present invention.

4A is a plan view illustrating the backlight of FIG. 3.

4B illustrates a method of fastening screws on the PCB of FIG. 4A.

5A is a plan view illustrating a backlight of a liquid crystal display according to a second exemplary embodiment of the present invention.

5B illustrates a method of fastening screws onto the PCB of FIG. 5A.

6 is a plan view illustrating a backlight of a liquid crystal display according to a third exemplary embodiment of the present invention.

7 is a plan view illustrating a backlight of a liquid crystal display according to a fourth exemplary embodiment of the present invention.

8A is a plan view illustrating a backlight of a liquid crystal display according to a fifth exemplary embodiment of the present invention.

FIG. 8B illustrates a method of fastening screws on the PCB of FIG. 8A

Claims (8)

Preparing a lower cover; Providing at least one PCB on the lower cover; Fix the LED package by forming a plurality of rows on the PCB, the four LED packages adjacent to each other in the odd and even columns when the LED package is formed in a row of multiples of 2 square, rectangular, parallel Fixing to form at least one of the quadrilaterals; Fastening a screw to a center area center of gravity of the four LED packages fixed in the form of at least one of square, rectangular or parallelogram on the PCB; And providing a liquid crystal panel on the PCB on which the LED package is provided. The method of claim 1, wherein the fastening of the screws comprises fastening the screws onto reflective plates attached to the PCBs. The liquid crystal display device of claim 1, wherein the LED package comprises R, G, and B LED chips arranged in a triangular shape, and conductive wirings connected to the LED chips to which voltage is applied from the outside. Manufacturing method. The liquid crystal display of claim 1, wherein the LED package comprises R, G, G, and B LED chips arranged in a quadrangular shape, and conductive wirings connected to the LED chips to which voltage is applied from the outside. Method of manufacturing the device. Preparing a lower cover; Providing at least one PCB on the lower cover; Fixing a plurality of rows of the LED package on the PCB, when the LED package is formed in rows of multiples of three to fix the four LED packages adjacent to each other in the odd and even row to form a diamond shape step; Fastening a screw to a center area center of gravity of the four LED packages fixed to form the diamond shape; And providing a liquid crystal panel on the PCB on which the LED package is provided. 6. The method of claim 5, wherein the fastening of the screws comprises fastening the screws onto reflective plates attached to the PCBs. The liquid crystal display device of claim 5, wherein the LED package comprises R, G, and B LED chips arranged in a triangular shape, and conductive wirings connected to the LED chips to which voltage is applied from the outside. Manufacturing method. The liquid crystal display of claim 5, wherein the LED package comprises R, G, G, and B LED chips arranged in a rectangular shape, and conductive wires connected to the LED chips to which a voltage is applied from the outside. Method of manufacturing the device.

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