KR100985481B1 - Led back light module - Google Patents

Led back light module Download PDF

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Publication number
KR100985481B1
KR100985481B1 KR1020100034418A KR20100034418A KR100985481B1 KR 100985481 B1 KR100985481 B1 KR 100985481B1 KR 1020100034418 A KR1020100034418 A KR 1020100034418A KR 20100034418 A KR20100034418 A KR 20100034418A KR 100985481 B1 KR100985481 B1 KR 100985481B1
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South Korea
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bar type
bar
type lead
pcb
guide groove
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KR1020100034418A
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Korean (ko)
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고민관
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(주)에스이피
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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133603—Direct backlight with LEDs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133608—Direct backlight including particular frames or supporting means
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133612—Electrical details

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Planar Illumination Modules (AREA)

Abstract

PURPOSE: An LED backlight module is provided to junction circuit network terminal unit of a bar type lead unit and circuit network terminal unit of a bar type PCB by ultrasonic vibration, thereby controlling toxic gas due to existing lead connection. CONSTITUTION: A plurality of LED(Light Emitting Diodes) is arranged in a bar-type lead unit(100). A circuit network is printed to the bar-type lead unit to electrically connect LEDs. A coating layer(220) of flexible material is installed to cover the circuit network. In a plurality of bar-type PCB(Printed Circuit Board), the terminal part(211) of circuit network is combined by ultrasonic vibration of the terminal unit of the circuit network of the bar-type lead unit. A jig frame fixes the bar-type lead unit and the bar-type PCB on single side.

Description

ＬＥＤ 백라이트 모듈{LED BACK LIGHT MODULE}LED backlight module {LED BACK LIGHT MODULE}

본 발명은 LED 백라이트 모듈에 관한 것으로, 상세하게 나란히 병립된 복수 개의 바타입 리드부에 바타입 PCB를 초음파진동에 의해 초음파접합함으로써 공정시간을 대폭 절감하고, 바타입 리드부의 회로망 단자부와 바타입 PCB의 회로망 단자부가 초음파진동으로 접합됨으로써 기존의 납땜 접속으로 발생되는 유독가스를 억제여 환경친화적 공정으로 제조되는 LED 백라이트 모듈에 관한 것이다.
The present invention relates to an LED backlight module, and the ultrasonically bonded bar-type PCB to the plurality of bar-type lead portion side by side in parallel by ultrasonic vibration significantly reduce the process time, the network terminal portion of the bar type lead portion and the bar type PCB This invention relates to an LED backlight module which is manufactured in an environmentally friendly process by suppressing toxic gas generated by conventional solder connection by joining a terminal of a network by ultrasonic vibration.

일반적으로 사용되고 있는 표시장치는 CRT(Cathode Ray Tube), 전계 광학적인 효과를 이용한 액정표시장치(Liquid Crystal Display :LCD), 가스방전을 이용한 플라즈마 표시소자(PDP : Plasma Display Panel) 및 전계발광 효과를 이용한 EL 표시소자(ELD : Electro Luminescence Display) 등이 있으며, 그 중에서 액정표시장치에 대한 연구가 활발히 진행되고 있다.Commonly used display devices include CRT (Cathode Ray Tube), Liquid Crystal Display (LCD) using field optical effects, Plasma Display Panel (PDP) and electroluminescent effects using gas discharge. There is an EL display element (ELD: Electro Luminescence Display) used, and among them, research on the liquid crystal display device is being actively conducted.

이러한 액정표시장치는 최근에는 평판 표시장치로서의 역할을 충분히 수행할 수 있을 정도로 개발되어 랩탑형 컴퓨터의 모니터뿐만 아니라, 데스크탑형 컴퓨터의 모니터 및 대형 정보 표시장치등에 사용되고 있어 액정표시 장치의 수요는 계속적으로 증가되고 있는 실정이다.Recently, the liquid crystal display device has been developed enough to perform a role as a flat panel display device and is used not only for a monitor of a laptop computer but also for a monitor and a large information display device of a desktop computer. It is increasing.

이와 같은 액정표시장치의 대부분은 외부에서 들어오는 광의 양을 조절하여 화상을 표시하는 수광성 장치이기 때문에 LCD 패널에 광을 조사하기 위한 백라이트 유닛(Back Light Unit)이 반드시 필요하다.Since most of the liquid crystal display devices are light-receiving devices that display images by controlling the amount of light coming from the outside, a back light unit for irradiating light to the LCD panel is necessary.

일반적으로, 액정표시장치에서 광원을 제공하는 백라이트 유닛은 원통형의 형광 램프를 배치하는 방식으로서, 에지 방식과 직하 방식으로 구분된다.In general, a backlight unit providing a light source in a liquid crystal display device is a method of disposing a cylindrical fluorescent lamp, and is divided into an edge method and a direct method.

에지 방식은 빛을 안내하는 도광판의 측면에 램프 유닛이 설치되는 것으로써, 램프 유닛은 빛을 발산하는 램프, 램프의 양단에 삽입되어 램프를 보호하는 램프 홀더 및 램프의 외주면을 감싸고 일측면이 도광판의 측면에 끼워져 램프에서 발산된 빛을 도광판 쪽으로 반사시켜 주는 램프 반사판을 구비한다. 이와 같이 도광판의 측면에 램프 유닛이 설치되는 에지 방식은 주로 랩탑형 컴퓨터 및 데스크탑형 컴퓨터의 모니터와 같이 비교적 크기가 작은 액정표시장치에 적용되는 것으로, 빛의 균일성이 좋고, 내구 수명이 길며, 액정표시장치의 박형화에 유리하다.The edge method is that the lamp unit is installed on the side of the light guide plate for guiding the light, the lamp unit is a lamp that emits light, the lamp holder is inserted into both ends of the lamp to protect the lamp and the outer circumferential surface of the lamp, one side is the light guide plate It is fitted to the side of the lamp reflector for reflecting the light emitted from the lamp toward the light guide plate. The edge method in which the lamp unit is installed on the side of the light guide plate is applied to a relatively small liquid crystal display device such as a monitor of a laptop computer and a desktop computer, and has good light uniformity and a long durability life. It is advantageous to thin the liquid crystal display device.

한편, 직하 방식은 액정표시장치의 크기가 20인치 이상으로 대형화되기 시작하면서 중점적으로 개발되기 시작한 것으로, 확산판의 하부면에 복수개의 램프를 일렬로 배열시켜 LCD 패널의 전면으로 빛을 직접 조광하는 것이다.
On the other hand, the direct method began to be developed mainly as the size of the liquid crystal display device became larger than 20 inches, and arranged a plurality of lamps in a row on the lower surface of the diffuser plate to direct light directly to the front of the LCD panel. will be.

LCD 패널에 광을 조사하기 위한 백라이트 유닛(Back Light Unit)은 지그프레임에 복수 개의 발광 LED 및 LED에 전원을 공급하기 위해 전기적으로 접속되는 PCB를 부착하여 제조하게 되는데, 기존에는 그 제조과정에 있어서 수작업으로 납땜하는 경우가 대부분으로 접합과정에서 유독가스가 발생함은 물론 수작업에 의존하는 관계로 공정시간이 지체되고 작업자의 숙련도에 따라 접합부위의 불량률이 빈번하게 발생되는 문제점이 있었다.
The backlight unit for irradiating light to the LCD panel is manufactured by attaching a plurality of light emitting LEDs and a PCB electrically connected to the jig frame to supply power to the jig frame. Most of the soldering by hand, toxic gas is generated during the joining process, as well as the process time is delayed due to the manual work, and the defect rate of the joint is frequently generated according to the skill of the operator.

본 발명은 상기한 점을 감안하여 안출된 것으로, 본 발명의 목적은 환경친화적인 공정시스템 및 공정시간을 대폭 절감할 수 있는 LED 백라이트 모듈을 제공하는 데 있다.
The present invention has been made in view of the above, an object of the present invention to provide an LED backlight module that can significantly reduce the environmentally friendly process system and processing time.

상기의 목적을 달성하기 위하여 본 발명에 따른 LED 백라이트 모듈은 발광하는 복수 개의 LED가 상호 전기적으로 연결되도록 일면의 길이방향을 따라 일렬로 배열되어 접합된 바타입 리드부; 바타입 리드부는 복수 개가 일정간격 이격된 상태로 병립하여 나란히 배치되며 바타입 리드부를 각각 전기적으로 연결하는 복수 개의 바타입 PCB; 바타입 리드부 및 바타입 PCB를 일면에 안착고정시키는 절연체인 지그프레임;을 포함하여 구성되며, LED가 각각 전기적으로 연결되도록 바타입 리드부는 외표면에 회로망이 프린팅되고, 바타입 PCB는 몸체부인 회로망을 감싸도록 외표면에 플렉시블한 재질의 코팅막이 구비되며 바타입 리드부의 회로망 단자부와 바타입 PCB의 회로망 단자부가 초음파진동에 의해 접합된다.In order to achieve the above object, the LED backlight module according to the present invention includes a bar type lead unit which is arranged in a line along a longitudinal direction of one surface to be electrically connected to a plurality of LEDs emitting light; A plurality of bar type lead parts arranged side by side in parallel with a plurality of spaced apart at a predetermined interval, and a plurality of bar type PCBs electrically connecting the bar type lead parts, respectively; The bar type lead part and the jig frame which is an insulator for fixing the bar type PCB to one side, and configured to include, the bar type lead part is printed on the outer surface so that the LED is electrically connected, respectively, the bar type PCB is the body part A flexible coating film is provided on the outer surface to surround the network, and the network terminal portion of the bar type lead portion and the network terminal portion of the bar type PCB are joined by ultrasonic vibration.

바타입 리드부의 회로망 단자부와 맞닿아 접속되는 바타입 PCB의 회로망 단자부 외표면에는 전도체의 금속층이 코팅되며, 이 금속층은 바람직하게 금(Au), 구리(Cu) 중 어느 하나로 구성된다.The outer surface of the network terminal portion of the bar type PCB, which is in contact with the network terminal portion of the bar type lead portion, is coated with a metal layer of a conductor, and the metal layer is preferably composed of one of gold (Au) and copper (Cu).

바타입 PCB는, 바타입 리드부의 길이방향에 대해 수직으로 배치되며, LED가 접합된 바타입 리드부의 대향면에 접속된다.Bar type PCB is arrange | positioned perpendicularly to the longitudinal direction of a bar type lead part, and is connected to the opposing surface of the bar type lead part in which LED was joined.

지그프레임에는, 바타입 PCB의 저면이 안착되어 끼워지도록 복수 개의 제1가이드홈이 형성되고, 바타입 PCB에 연결되는 바타입 리드부의 저면이 안착되어 끼워지도록 복수 개의 제2가이드홈이 형성되며, 제2가이드홈에는 제2가이드홈의 길이방향을 따라 제2가이드홈과 바타입 리드부를 체결하는 양면접착부재가 구비된다.
In the jig frame, a plurality of first guide grooves are formed to seat and fit the bottom of the bar type PCB, and a plurality of second guide grooves are formed to seat and fit the bottom of the bar type lead connected to the bar type PCB. The second guide groove is provided with a double-sided adhesive member for fastening the second guide groove and the bar type lead along the longitudinal direction of the second guide groove.

본 발명에 따른 LED 백라이트 모듈은 바타입 리드부의 회로망 단자부와 바타입 PCB의 회로망 단자부가 초음파진동으로 접합됨으로써 기존의 납땜 접속으로 발생되는 유독가스를 억제하여 환경친화적이라는 유용한 효과가 있다.The LED backlight module according to the present invention has a useful effect of being environmentally friendly by suppressing toxic gas generated by conventional solder connection by joining the network terminal portion of the bar type lead portion and the network terminal portion of the bar type PCB by ultrasonic vibration.

또한 나란히 병립된 복수 개의 바타입 리드부에 바타입 PCB를 납땜 접합에 의해 수작업에 의존되던 기존의 공정을 초음파진동에 의해 초음파접합함으로써 공정시간을 대폭 절감하는 효과가 있다.
In addition, it is possible to significantly reduce the process time by ultrasonically joining a conventional process, which was dependent on manual operation by soldering a bar type PCB to a plurality of bar type lead parts parallel to each other, by ultrasonic vibration.

[도 1]은 본 발명에 따른 LED 백라이트 모듈의 전체구성을 도시한 개략도,
[도 2]는 [도 1]의 일부를 발췌하여 확대한 요부확대도,
[도 3]은 본 발명에 따른 바타입 리드부와 바타입 PCB가 접합된 상태의 사시도,
[도 4]는 본 발명에 따른 바타입 리드부와 바타입 PCB가 접합된 상태의 또 다른 사시도,
[도 5]는 본 발명에 따른 LED 백라이트 모듈을 초음파진동자에 의해 초음파접합시키는 과정을 도시한 사용상태도,
[도 6]은 [도 5]의 일부를 발췌하여 확대한 요부확대도이다.1 is a schematic diagram showing the overall configuration of an LED backlight module according to the present invention;
2 is an enlarged lumbar enlargement extracting a part of [1],
3 is a perspective view of a bar type lead unit and a bar type PCB bonded state according to the present invention;
4 is another perspective view of a bar type lead unit and a bar type PCB in a bonded state according to the present invention;
5 is a state diagram showing a process of ultrasonically bonding the LED backlight module according to the present invention by an ultrasonic vibrator,
FIG. 6 is an enlarged view of a main part extracted by extracting a part of FIG. 5.

이하, 첨부된 도면을 참조하여 본 발명을 한정하지 않는 바람직한 실시예를 상세히 설명한다.
Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[도 1]은 본 발명에 따른 LED 백라이트 모듈의 전체구성을 도시한 개략도, [도 2]는 [도 1]의 일부를 발췌하여 확대한 요부확대도, [도 3]은 본 발명에 따른 바타입 리드부와 바타입 PCB가 접합된 상태의 사시도, [도 4]는 본 발명에 따른 바타입 리드부와 바타입 PCB가 접합된 상태의 또 다른 사시도, [도 5]는 본 발명에 따른 LED 백라이트 모듈을 초음파진동자에 의해 초음파접합시키는 과정을 도시한 사용상태도, [도 6]은 [도 5]의 일부를 발췌하여 확대한 요부확대도를 나타낸다.
1 is a schematic diagram showing the overall configuration of the LED backlight module according to the present invention, [2] is an enlarged view of the main portion enlarged by extracting a part of [1], [3] is according to the present invention 4 is a perspective view of a state in which a bar type PCB is bonded with a lead type, and FIG. 4 is another perspective view of a bar type lead in which a bar type PCB is bonded according to the present invention, and FIG. FIG. 6 is a diagram illustrating a process in which the backlight module is ultrasonically bonded by an ultrasonic vibrator, and FIG. 6 illustrates an enlarged part of an enlarged part by extracting part of FIG. 5.

[도 1] 내지 [도 6]에서 보는 바와 같이, 본 발명에 따른 LED 백라이트 모듈은 발광하는 복수 개의 LED(120)가 일면의 길이방향을 따라 일렬로 배열되어 접합되며, LED(120)가 상호 전기적으로 연결되도록 LED(120)가 접합된 일면에 회로망(110)이 프린팅된 바타입 리드부(100); 바타입 리드부(100)는 복수 개가 일정간격 이격된 상태로 병립하여 나란히 배치되고 이렇게 배치된 바타입 리드부(100)를 각각 전기적으로 연결하며, 몸체부인 회로망(210)을 감싸도록 외표면에 플렉시블한 재질의 코팅막(220)이 구비되고 몸체부인 회로망(210) 단자부(211)가 바타입 리드부(100)의 회로망(110) 단자부와 초음파진동에 의해 접합되는 복수 개의 바타입 PCB(200); 바타입 리드부(100) 및 바타입 PCB(200)를 일면에 안착고정시키는 절연체인 지그프레임(300);을 포함하여 구성되며, 바타입 PCB(200)의 회로망(210) 단자부(211) 외표면에는 금(Au), 구리(Cu) 중 어느 하나로 된 전도체의 금속층(212)이 코팅되고, 지그프레임(300)에는 바타입 PCB(200)의 저면이 안착되어 끼워지도록 복수 개의 제1가이드홈(310)이 형성된다.
1 to 6, in the LED backlight module according to the present invention, a plurality of LEDs 120 emitting light are arranged in a row in a line along the longitudinal direction of one surface, and the LEDs 120 are mutually connected. A bar type lead part 100 in which a network 110 is printed on one surface to which an LED 120 is bonded to be electrically connected; Bar-type lead portion 100 is arranged side by side in a plurality of spaced apart at a predetermined interval and electrically connected to each of the bar type lead portion 100 disposed in this way, the outer surface to surround the network 210, the body portion A plurality of bar type PCBs 200 having a coating film 220 made of a flexible material and having a body portion 210 connected to the terminal portion 211 of the bar type lead portion 100 by ultrasonic vibrations are provided. ; The bar type lead unit 100 and the bar type PCB 200, a jig frame 300 that is an insulator for seating and fixed on one surface; including, and the other than the terminal 210 of the network 210 of the bar type PCB 200 On the surface, a metal layer 212 of a conductor made of any one of gold (Au) and copper (Cu) is coated, and a plurality of first guide grooves are mounted on the jig frame 300 so that the bottom surface of the bar type PCB 200 is seated and fitted. 310 is formed.

[도 2], [도 4], [도 6]에서 보는 바와 같이, 바타입 리드부(100)의 회로망 단자부(110)와 맞닿아 접속되는 바타입 PCB(200)의 회로망(210) 단자부(211) 외표면에는 전도체의 금속층(212)이 코팅된다. 이는 바타입 PCB(200)의 회로망(210) 단자부(211)와 바타입 리드부(100)의 회로망(110) 단자부가 맞닿은 상태에서 상하방으로 진동하는 초음파진동자(M)의 초음파진동에 의해 압착되는 경우 금속층(212)에 마찰열이 발생함에 따라 금속층(212)이 연질의 용융상태로 변화되면서 바타입 PCB(200)의 회로망(210) 단자부(211)와 바타입 리드부(100)의 회로망(110) 단자부를 잇는 접착제의 역할을 하게 된다.As shown in FIGS. 2, 4, and 6, the terminal 210 of the network 210 of the bar type PCB 200, which is abutted and connected to the network terminal 110 of the bar type lead unit 100, may be connected with the network terminal 110. 211) The outer surface is coated with a metal layer 212 of a conductor. This is crimped by the ultrasonic vibration of the ultrasonic vibrator M which vibrates up and down in a state where the terminal 210 of the bar type PCB 200 and the terminal 110 of the bar type lead part 100 are in contact with each other. In this case, as the frictional heat is generated in the metal layer 212, the metal layer 212 is changed into a soft molten state, and the network of the terminal 210 of the bar type PCB 200 and the terminal portion 211 of the bar type lead part 100 ( 110) serves as an adhesive connecting the terminal portion.

또한, 금속층(212)은 바람직하게 금(Au), 구리(Cu) 중 어느 하나로 구성되는데, 이는 바타입 PCB(200)의 회로망(210) 단자부(211)와 바타입 리드부(100)의 회로망(110) 단자부에 전기전도성을 향상시키고 초음파접합 후 접합부가 산화되는 것을 방지하는 기능도 하게 되며, 기존의 납땜에 의해 접합하는 경우 발생되는 유동성 물질의 발생을 억제함은 물론 접합된 후 산화에 취약함을 개선시키는 역할도 하게 된다.
In addition, the metal layer 212 is preferably composed of any one of gold (Au), copper (Cu), which is the network of the terminal 210 of the network type 210 of the bar type PCB 200 and the bar type lead portion 100 (110) It also improves the electrical conductivity of the terminal portion and prevents the oxidization of the joint after ultrasonic bonding, and suppresses the generation of fluid substances generated when joining by conventional soldering, as well as susceptible to oxidation after the bonding. It will also play a role in improving shipbuilding.

바타입 PCB(200)는 바람직하게 구리 등의 금속으로 회로망(210)을 구성하며, 이 회로망(210)의 외표면에 플렉시블한 재질의 코팅막(220)을 형성하여 접촉되는 인접부위와의 합선을 차단한다. 물론 바타입 리드부(100)의 회로망(110) 단자부와 연결되는 바타입 PCB(200)의 회로망(210)의 단자부(211)에 대응되는 회로망(210)에는 코팅막(220)이 절개된 상태로 구성되어 바타입 리드부(100)와 접합된 후 전기전도성을 향상시키게 된다.Bar-type PCB 200 preferably constitutes a network 210 of metal such as copper, and forms a coating film 220 of a flexible material on the outer surface of the network 210 to short-circuit with adjacent parts in contact. Block it. Of course, the coating film 220 is cut in the network 210 corresponding to the terminal 211 of the network 210 of the bar type PCB 200 connected to the terminal 110 of the bar type lead part 100. It is configured to improve the electrical conductivity after being bonded with the bar type lead portion 100.

바타입 리드부(100)는 바람직하게 유리섬유(glass fiber) 재질로 구성되며, 복수 개의 LED(120)가 각각 전기적으로 연결되도록 바타입 리드부(100)는 외표면에 회로망(110)이 프린팅된다. 바타입 PCB(200)의 회로망(210) 단자부(211)가 연결되는 바타입 리드부(100)의 회로망(110) 단자부는 LED(120)가 접합된 바타입 리드부(100)의 대향면에 접속된다.
Bar-type lead portion 100 is preferably made of glass fiber (glass fiber) material, the bar type lead portion 100 is printed on the outer surface so that the plurality of LED 120 is electrically connected to each other, the network 110 do. The network portion 110 of the bar type lead portion 100 to which the terminal portion 211 of the network 210 of the bar type PCB 200 is connected is connected to an opposite surface of the bar type lead portion 100 to which the LED 120 is bonded. Connected.

[도 5] 및 [도 6]를 참조하여, 바타입 리드부와 바타입 PCB가 초음파접합되는 과정을 순차적으로 설명하면 다음과 같다.Referring to FIGS. 5 and 6, the bar type lead unit and the bar type PCB will be sequentially described as follows.

먼저, 유리섬유 재질의 바타입 리드부(100)의 회로망(110) 단자부와 바타입 PCB(200)의 회로망(210)망 단자부(211)가 상호 맞닿은 상태에서 초음파진동자(M)에 의해 초음파진동으로 압착하여 초음파접합을 하게 된다. 물론 이 과정에서 바타입 PCB(200)의 회로망(210) 단자부(211) 외표면에 금속층(212)의 코팅이 선행된다.First, the ultrasonic vibration by the ultrasonic vibrator (M) in a state in which the network terminal 110 terminal portion of the bar-type lead portion 100 of the glass fiber and the network terminal portion 211 of the network 210 of the bar type PCB 200 abut each other It is pressed by ultrasonic bonding. In this process, the coating of the metal layer 212 is preceded by the outer surface of the terminal portion 211 of the network 210 of the bar type PCB 200.

바타입 리드부(100)의 일면에 바타입 PCB(200)가 초음파진동자(M)에 의해 초음파접합된 후, 바타입 리드부(100) 타면의 길이방향을 따라 발광하는 복수 개의 LED(120)가 일렬로 배열되어 접합된다.After the bar type PCB 200 is ultrasonically bonded to one surface of the bar type lead part 100 by the ultrasonic vibrator M, the plurality of LEDs 120 emit light along the length direction of the other surface of the bar type lead part 100. Are arranged in a line and joined.

[도 5] 및 [도 6]의 도면부호 P는 초음파진동자의 하단부에 돌출된 혼(Horn)부를 나타내고, 도면부호 S는 혼부가 하방으로 진동하는 경우 그에 대응되어 상호 맞물리는 베이스를 나타내며, 도면부호 T는 외부로부터의 전기적인 신호를 초음파진동자에 진동신호로 변환하여 전달하는 변환부를 나타내고, 도면부호 L은 변환부의 전기적인 신호에 대응하여 초음파진동자의 물리적인 운동을 지지연결하는 링크부를 나타낸다.
5 and 6 denote a horn protruding from the lower end of the ultrasonic vibrator, and S denotes a base engaged with each other when the horn vibrates downward. Reference numeral T denotes a conversion unit that converts an electrical signal from the outside into a vibration signal to the ultrasonic vibrator, and reference numeral L denotes a link unit that supports and physically connects the physical motion of the ultrasonic vibrator in response to the electrical signal of the conversion unit.

복수 개가 일정간격 이격된 상태로 병립하여 나란히 배치된 바타입 리드부(100)를 전기적으로 연결하기 위해 바타입 PCB(200)는 바타입 리드부(100)의 길이방향에 대해 수직으로 배치된 상태로 LED(120)가 접합된 바타입 리드부(100)의 대향면에 접속된다.
The bar type PCB 200 is vertically disposed with respect to the longitudinal direction of the bar type lead part 100 in order to electrically connect the bar type lead parts 100 arranged side by side in parallel with a plurality of spaced apart. The furnace 120 is connected to the opposite surface of the bar type lead portion 100 to which the LED 120 is joined.

바타입 PCB(200)에 수직배치되어 전기적으로 연결되되 복수 개가 일정간격 이격된 상태로 병립하여 나란히 배치된 바타입 리드부(100)를 효율적으로 고정시키기 위해 지그프레임(300)에는, 바타입 PCB(200)의 저면이 안착되어 끼워지도록 복수 개의 제1가이드홈(310)이 형성되며, 바타입 PCB(200)에 연결된 바타입 리드부(100)의 저면이 안착되어 끼워지도록 복수 개의 제2가이드홈(320)이 형성된다.
The bar type PCB 200 is vertically arranged and electrically connected to the bar type PCB 200 in order to efficiently fix the bar type lead parts 100 arranged side by side in parallel with a predetermined spaced apart state, in the bar type PCB A plurality of first guide grooves 310 are formed to seat and fit the bottom of the 200, and a plurality of second guides to seat and fit the bottom of the bar type lead part 100 connected to the bar type PCB 200. Groove 320 is formed.

제2가이드홈(320)에는 제2가이드홈(320)의 길이방향을 따라 제2가이드홈(320)과 바타입 리드부(100)를 체결하는 양면접착부재(400)가 구비된다. 양면접착부재(400)를 제2가이드홈(320)에 부착시킨 상태에서 바타입 PCB(200)에 의해 전기적으로 연결된 복수 개의 바타입 리드부(100)를 제2가이드홈(320)에 대응되는 양면접착부재(400)의 상면에 안착시키는 작업으로 간편하게 지그프레임(300)에 부착시킬 수 있어 작업의 효율성을 극대화할 수 있게 된다.
The second guide groove 320 is provided with a double-sided adhesive member 400 for fastening the second guide groove 320 and the bar type lead part 100 along the longitudinal direction of the second guide groove 320. In the state in which the double-sided adhesive member 400 is attached to the second guide groove 320, the plurality of bar type lead portions 100 electrically connected to the second guide groove 320 by the bar type PCB 200 may correspond to the second guide groove 320. By mounting on the upper surface of the double-sided adhesive member 400 can be easily attached to the jig frame 300 it is possible to maximize the efficiency of the work.

제2가이드홈(320)과 제2가이드홈(320) 사이에 대응되는 지그프레임(300)에는 전,후면을 관통하는 복수 개의 관통공(330)이 형성된다. 이는 바타입 리드부(100)의 일면에 부착된 발광하는 복수 개의 LED(120)로부터 생성되는 열을 외부로 방열하기 위함이다.
A plurality of through holes 330 penetrating the front and rear surfaces are formed in the jig frame 300 corresponding to the second guide groove 320 and the second guide groove 320. This is to dissipate heat generated from the plurality of LEDs 120 emitting light attached to one surface of the bar type lead unit 100 to the outside.

[도 1] 내지 [도 4]를 참조하여 초음파진동으로 상호 접합된 바타입 리드부 및 바타입 PCB가 지그프레임에 부착되는 과정을 순차적으로 설명하면, 먼저 지그프레임(300)의 일면에 형성된 제2가이드홈(320)에 양면접착부재(400)를 안착시켜 고정한 후, 초음파진동에 의해 바타입 PCB(200)가 일면에 접합되고 타면에 복수 개의 LED(120)가 접합된 바타입 리드부(100)를 양면접착부재(400)에 안착시켜 고정한다. 이 경우 바타입 리드부(100)와 양면접착부재(400)가 맞닿는 면은 바타입 리드부(100)의 LED(120)가 부착된 대향면에 대응되도록 배치된다.
Referring to FIGS. 1 to 4, the process of attaching the bar-type lead part and the bar-type PCB to each other by ultrasonic vibration in a jig frame is sequentially described. After seating and fixing the double-sided adhesive member 400 in the two guide grooves 320, the bar type PCB 200 is bonded to one surface by ultrasonic vibration and a plurality of LEDs 120 are bonded to the other surface. 100) is fixed to the double-sided adhesive member 400 by mounting. In this case, the surface where the bar type lead portion 100 and the double-sided adhesive member 400 contact each other is disposed to correspond to the opposite surface to which the LED 120 of the bar type lead portion 100 is attached.

100 : 바타입 리드부 110 : 회로망
120 : LED 200 : 바타입 PCB
210 : 회로망 211 : 단자부
212 : 금속층 220 : 코팅막
300 : 지그프레임 310 : 제1가이드홈
320 : 제2가이드홈 330 : 관통공
400 : 양면접착부재 T : 변환부
L : 링크부 M : 초음파진동자
P : 혼(Horn)부 S : 베이스100: bar type lead portion 110: a network
120: LED 200: Bar type PCB
210: network 211: terminal portion
212: metal layer 220: coating film
300: jig frame 310: the first guide groove
320: second guide groove 330: through hole
400: double-sided adhesive member T: conversion unit
L: Link part M: Ultrasonic vibrator
P: Horn S: Base

Claims (8)

삭제delete 삭제delete 삭제delete 삭제delete 발광하는 복수 개의 LED(120)가 일면의 길이방향을 따라 일렬로 배열되어 접합되며, 상기 LED(120)가 상호 전기적으로 연결되도록 LED(120)가 접합된 일면에 회로망(110)이 프린팅된 바타입 리드부(100);
상기 바타입 리드부(100)는 복수 개가 일정간격 이격된 상태로 병립하여 나란히 배치되고 이렇게 배치된 바타입 리드부(100)를 각각 전기적으로 연결하며, 몸체부인 회로망(210)을 감싸도록 외표면에 플렉시블한 재질의 코팅막(220)이 구비되고 몸체부인 상기 회로망(210) 단자부(211)가 상기 바타입 리드부(100)의 회로망(110) 단자부와 초음파진동에 의해 접합되는 복수 개의 바타입 PCB(200);
상기 바타입 리드부(100) 및 상기 바타입 PCB(200)를 일면에 안착고정시키는 절연체인 지그프레임(300);을 포함하여 구성되며,
상기 바타입 PCB(200)의 회로망(210) 단자부(211) 외표면에는 금(Au), 구리(Cu) 중 어느 하나로 된 전도체의 금속층(212)이 코팅되고,
상기 지그프레임(300)에는 상기 바타입 PCB(200)의 저면이 안착되어 끼워지도록 복수 개의 제1가이드홈(310)이 형성된 것을 특징으로 하는 LED 백라이트 모듈.A plurality of LEDs 120 emitting light are arranged in a line along the longitudinal direction of one surface, and the network 110 is printed on one surface to which the LEDs 120 are bonded so that the LEDs 120 are electrically connected to each other. A type lead part 100;
The bar type lead unit 100 is arranged side by side in a plurality of spaced apart at a predetermined interval and electrically connected to each of the bar type lead unit 100 arranged in this way, the outer surface to surround the network 210, the body portion A plurality of bar-type PCBs are provided with a coating film 220 of a flexible material on the body 210 and the terminal portion 211 of the body 210 is joined to the terminal portion 110 of the bar type lead portion 100 by ultrasonic vibration. 200;
And a jig frame 300 which is an insulator for fixing the bar type lead unit 100 and the bar type PCB 200 to one surface thereof.
The outer surface of the terminal portion 211 of the network 210 of the bar type PCB 200 is coated with a metal layer 212 of a conductor made of any one of gold (Au) and copper (Cu),
The jig frame 300 is a LED backlight module, characterized in that a plurality of first guide grooves 310 are formed so that the bottom surface of the bar type PCB 200 is seated and fitted. 청구항 5에 있어서,
상기 지그프레임(300)에는,
상기 바타입 PCB(200)에 연결되는 상기 바타입 리드부(100)의 저면이 안착되어 끼워지도록 복수 개의 제2가이드홈(320)이 형성된 것을 특징으로 하는 LED 백라이트 모듈.The method according to claim 5,
The jig frame 300,
LED backlight module, characterized in that a plurality of second guide groove 320 is formed so that the bottom surface of the bar type lead portion 100 is connected to the bar type PCB (200) is seated and fitted. 청구항 6에 있어서,
상기 제2가이드홈(320)에는 제2가이드홈(320)의 길이방향을 따라 제2가이드홈(320)과 상기 바타입 리드부(100)를 체결하는 양면접착부재(400)가 구비되는 것을 특징으로 하는 LED 백라이트 모듈.The method of claim 6,
The second guide groove 320 is provided with a double-sided adhesive member 400 for fastening the second guide groove 320 and the bar type lead portion 100 along the longitudinal direction of the second guide groove 320. LED backlight module characterized by. 청구항 6에 있어서,
상기 제2가이드홈(320)과 제2가이드홈(320) 사이에 대응되는 상기 지그프레임(300)에는 전,후면을 관통하는 복수 개의 관통공(330)이 형성된 것을 특징으로 하는 백라이트 모듈.The method of claim 6,
The jig frame 300 corresponding to the second guide groove 320 and the second guide groove 320, the backlight module, characterized in that a plurality of through holes penetrating the front, rear 330 is formed.
KR1020100034418A 2010-04-14 2010-04-14 Led back light module KR100985481B1 (en)

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