CN202195374U - Light source device and LCD - Google Patents

Light source device and LCD Download PDF

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Publication number
CN202195374U
CN202195374U CN2011203380733U CN201120338073U CN202195374U CN 202195374 U CN202195374 U CN 202195374U CN 2011203380733 U CN2011203380733 U CN 2011203380733U CN 201120338073 U CN201120338073 U CN 201120338073U CN 202195374 U CN202195374 U CN 202195374U
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CN
China
Prior art keywords
light
emitting diode
substrate
backboard
led
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2011203380733U
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Chinese (zh)
Inventor
林权一
陈翠敏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SUZHOU ZHOUQIAO PRECISION METAL CO Ltd
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SUZHOU ZHOUQIAO PRECISION METAL CO Ltd
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Filing date
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Priority to CN2011203380733U priority Critical patent/CN202195374U/en
Application granted granted Critical
Publication of CN202195374U publication Critical patent/CN202195374U/en
Anticipated expiration legal-status Critical
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  • Planar Illumination Modules (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)

Abstract

The utility model discloses a light source, which comprises a back plate and at least one LED module, wherein the back plate comprises a bottom plate and a plurality of side plates connected to the edge of the bottom plate; the LED module comprises a substrate and at least one LED; the substrate is provided with a first surface and an opposite second surface; the substrate is welded or fused on the inner-side surface of the bottom plate in a manner that the second surface thereof faces to the bottom plate; and the LED is arranged on the first surface of the substrate. In the light source device provided by the utility model, the back plate can scatter heat energy generated by the LED, so that the light source device does not need an additionally arranged heat-dissipating component. Meanwhile, the utility model further discloses an LCD comprising the above the light source device.

Description

Light supply apparatus and LCD
Technical field
The utility model is relevant a kind of light supply apparatus and LCD, particularly a kind of with light emitting diode as light emitting source and improve the light supply apparatus and the LCD of radiating effect.
Background technology
Light emitting diode (Light Emitting Diode; LED) have that power consumption is lower, colour gamut is wide and an advantage such as life of product is long; Therefore light emitting diode has been applied to the multiple technologies field, wherein is one of important application as a Backlight For Liquid Crystal Display Panels.Yet, the problem that the heat radiation of light emitting diode need solve for the industry utmost point always.
The backlight module of prior art is light-emitting diode light bar to be utilized locked assemblies such as screw or bolt be fixed on the radiating subassembly, through with thermal energy conduction to the radiating subassembly that light emitting diode produced, with the temperature of effective reduction light emitting diode.Yet, light-emitting diode light bar maybe when work because of the temperature expansion bending that raises, only make between light-emitting diode light bar and the radiating subassembly locked assembly form contact on the sealed position, cause radiating efficiency to reduce.In addition, the substrate of lamp bar need be reserved locking position, and it is big and increase manufacturing cost to cause circuit to dispose comparatively complicacy and substrate area.In addition, the light-emitting diode light bar locking is assembled to LCD again on radiating subassembly, will increase spare part quantity and number of assembling steps like this, also causes cost effectively to reduce.
In sum, how light-emitting diode light bar being flattened on radiating subassembly and reducing the spare part number is the target that the present utmost point need be made great efforts.
The utility model content
The utility model provides a kind of light supply apparatus and LCD, its be with light-emitting diode (LED) module welding or welding at the inner surface of the backboard of LCD, make light-emitting diode (LED) module can be flattened on backboard.Backboard is as a radiating subassembly, and the heat energy that light emitting diode is produced can conduct to backboard and dissipate.Therefore the light supply apparatus and the LCD of the utility model need not the extra effect that radiating subassembly can reduce luminous diode temperature that is provided with, more and then reduce the quantity of spare part.
The light supply apparatus of an embodiment of the utility model is a backlight that is used to provide a LCD.Light supply apparatus comprises a backboard and at least one light-emitting diode (LED) module.Backboard comprises a base plate and a plurality of side plate that is connected bottom edge.Light-emitting diode (LED) module comprises a substrate and at least one light emitting diode.Substrate has a first surface and an opposing second surface, and substrate with second surface towards base plate welding or welding inner surface at base plate.Light emitting diode then is arranged on the first surface of substrate.
The LCD of another embodiment of the utility model comprises a light supply apparatus, a front baffle and a panel module.Light supply apparatus comprises a backboard and at least one light-emitting diode (LED) module.Backboard comprises a base plate and a plurality of side plate that is connected bottom edge.Light-emitting diode (LED) module comprises a substrate and at least one light emitting diode.Substrate has a first surface and an opposing second surface, and substrate with second surface towards base plate welding or welding inner surface at base plate.Light emitting diode then is arranged on the first surface of substrate.Front baffle and backboard are formed a framework, and framework has an accommodation space.Panel module then is arranged on a bright dipping side of accommodation space and light-emitting diode (LED) module.
Below combine accompanying drawing to explain in detail through specific embodiment, should be easier to understand purpose, technology contents, characteristics of the utility model and the effect of being reached thereof.
Description of drawings
Fig. 1 is a stereogram, shows the light supply apparatus of an embodiment of the utility model;
Fig. 2 is a profile, shows the cross-section structure of the embodiment of Fig. 1 along the AA line;
Fig. 3 is a profile, shows the cross-section structure of the light supply apparatus of another embodiment of the utility model;
Fig. 4 is a profile, shows the cross-section structure of the light supply apparatus of another embodiment of the utility model;
Fig. 5 is a profile, shows the cross-section structure of the LCD of an embodiment of the utility model;
Wherein,
10 light supply apparatuses
11 backboards
111 base plates
112 side plates
113 grooves
12 light-emitting diode (LED) modules
121 substrates
1211 first surfaces
1212 second surfaces
122 light emitting diodes
123 bonding lands
13 leaded light components
14 diffusion sheets
20 front baffles
21 perforates
22 accommodation spaces
30 panel modules
The specific embodiment
The light supply apparatus of the utility model is a backlight that is used to provide a LCD.Please refer to Fig. 1 and Fig. 2, the light supply apparatus 10 of an embodiment of the utility model comprises a backboard 11 and at least one light-emitting diode (LED) module 12.Backboard 11 is made up of a base plate 111 and 112 of a plurality of side plates, and its latus inframedium 112 is the edges that are connected base plate 111.But as a kind of embodiment, backboard 11 can be formed in one or combined by a plurality of workpiece.12 of light-emitting diode (LED) modules comprise a substrate 121 and at least one light emitting diode 122.Substrate 121 has a first surface 1211 and an opposing second surface 1212, and substrate 121 is the inner surfaces that are arranged on base plate 111 with second surface 1212 towards the mode of base plate 111.122 of light emitting diodes are arranged on the first surface 1211 of substrate 121.It is understandable that light-emitting diode (LED) module 12 comprises a circuit layer (not shown), said circuit layer is arranged on the first surface 1211 of substrate 121.Light emitting diode 122 and circuit layer are electrically connected, and light emitting diode 122 can be obtained external power source and accept control so that a direct-light-type backlight to be provided via circuit layer.
In one embodiment, light-emitting diode (LED) module 12 is the inner surfaces that are connected to base plate 111 with the mode of welding.But as a kind of embodiment, the material of the substrate 121 of light-emitting diode (LED) module 12 can be metal material, the preferably, and the material of substrate 121 can be highly heat-conductive material, for example aluminium, copper etc.And the material of backboard 11 can be galvanized steel plain sheet, lagging steel plate, steel plate with baking paint or above combination, and utilize solder technology such as radium-shine welding or spot welding can between the base plate 111 of substrate 121 and backboard 11, form bonding land 123 this moment, as shown in Figure 2.Bonding land 123 can be continuous welding bead, and light-emitting diode (LED) module 12 can be flattened on the base plate 111 of backboard 11.Perhaps, bonding land 123 can be the comparatively intensive solder joint of spacing, and the substrate 121 of light-emitting diode (LED) module 12 is unlikely to because of the expansion bending when accumulation high temperature.Be noted that welding is meant the fusion of material own and is engaged with each other that a welding material perhaps also capable of using is bonded together the substrate 121 of light-emitting diode (LED) module 12 and the base plate 111 of backboard 11.
In one embodiment, light-emitting diode (LED) module 12 can also be connected to the inner surface of base plate 111 with fusing mode.But as a kind of embodiment, as shown in Figure 3, produce the phenomenon of fusion between the second surface 1212 of the substrate 121 of light-emitting diode (LED) module 12 and the base plate 111 of backboard 11 and be engaged with each other, form a bonding land 123.Compare with the existing mode of colloid engage both of utilizing, the welding mode of the utility model has preferable bond strength, and can avoid bonding land 123 to separate because of the high-temperature deterioration.According to aforementioned structure, the heat energy that light emitting diode 122 is produced dissipates to air or other heat conduction medium after can conducting to backboard 11 via the contact area of bonding land 123 and/or other substrate 121 and backboard 11.Therefore, backboard 11 can be used as the radiating subassembly of light emitting diode 122.In addition, backboard 11 also can carry the required functional unit of LCD.
Please refer to Fig. 4, in one embodiment, backboard 11 can have a groove 113.The groove 113 that light-emitting diode (LED) module 12 can be arranged on backboard 11 welds again.According to this structure, between the substrate 121 of light-emitting diode (LED) module 12 and the base plate 111 of backboard 11 bigger contact area is arranged, and then promote heat conduction speed with the further radiating effect that improves light emitting diode 122.
Please refer to Fig. 2 to Fig. 4, in one embodiment, the light supply apparatus of the utility model also comprises a leaded light component 13, and it is arranged on a bright dipping side of light-emitting diode (LED) module 12.Leaded light component 13 can be directed to the light source that light-emitting diode (LED) module 12 is sent the panel module of LCD more efficiently, to be lifted out optical efficiency.In addition, the light supply apparatus of the utility model can also comprise a diffusion sheet 14, and it also is arranged on the bright dipping side of light-emitting diode (LED) module 12.The light source that diffusion sheet 14 can make light-emitting diode (LED) module 12 sent is comparatively even.The preferably, diffusion sheet 14 is arranged on the bright dipping side of leaded light component 13.
Please refer to Fig. 5, the LCD of an embodiment of the utility model comprises a light supply apparatus 10, a front baffle 20 and a panel module 30.Light supply apparatus 10 is used to provide a backlight, and its detailed structure repeats no more at this as previously mentioned.Front baffle 20 has a perforate 21, and forms a framework with the backboard 11 of light supply apparatus 10.This framework has an accommodation space 22, is used to hold the required functional unit of LCD work.In one embodiment, front baffle 20 can be formed in one or combined by a plurality of workpiece.Panel module 30 is arranged in the accommodation space 22 of framework, and is arranged on the bright dipping side of light-emitting diode (LED) module 12.The light that light-emitting diode (LED) module 12 is sent illuminates and penetration surface plate module 30, lets the user watch 30 of panel modules to present image via the perforate 21 of front baffle 20.Be noted that; But the LCD that has common knowledge the knowledgeable knowledge capital utility model in the affiliated technical field comprises the functional unit that other work is required; For example panel driving assembly, power management, controller etc., this is existing technological means, repeats no more at this.
The LCD of the utility model can comprise an appearance component, and it is coated on the outside of front baffle 20 and backboard 11.Appearance component is generally plastic material.Perhaps, in one embodiment, see through suitable design, front baffle 20 and backboard 11 can be directly as the appearance component of LCD.Can further reduce spare part quantity like this, and preferable radiating effect is arranged.
Comprehensively above-mentioned, light supply apparatus of the utility model and LCD light-emitting diode (LED) module is directly welded or welding at the inner surface of the backboard of LCD, make light-emitting diode (LED) module can be flattened on backboard.Can be considered heat energy that the backboard of a radiating subassembly produces light emitting diode can conduct to backboard and dissipate.Therefore the light supply apparatus and the LCD of the utility model need not the extra effect that radiating subassembly can reduce luminous diode temperature that is provided with, and and then reduce the quantity of spare part and simplify number of assembling steps.In addition, utilize welding or fusion techniques to engage the substrate surface area that light-emitting diode (LED) module and backboard can avoid taking light-emitting diode (LED) module as far as possible, but so less substrate and the circuit layout of light-emitting diode (LED) module usable floor area comparatively simple.
Above-described embodiment only is technological thought and the characteristics for explanation the utility model; Its purpose makes the personage who has the knack of this technology can understand the content of the utility model and is implementing according to this; When can not with the claim of qualification the utility model; The equalization of promptly doing according to the spirit that the utility model disclosed generally changes or modifies, and must be encompassed in the claim of the utility model.

Claims (12)

1. light supply apparatus, it is a backlight that is used to provide a LCD, it is characterized in that: said light supply apparatus comprises:
One backboard, said backboard comprise a base plate and a plurality of side plate, and said side plate is connected the edge of said base plate; And
At least one light-emitting diode (LED) module, it comprises:
One substrate, said substrate have a first surface and an opposing second surface, said substrate with said second surface towards the welding of said base plate or welding inner surface at said base plate; And
At least one light emitting diode, said light emitting diode are arranged on the said first surface of said substrate.
2. light supply apparatus as claimed in claim 1 is characterized in that:
Wherein, said light-emitting diode (LED) module also comprises:
One circuit layer, said circuit layer are arranged on the said first surface of said substrate and electrically connect with said light emitting diode.
3. light supply apparatus as claimed in claim 1 is characterized in that:
Wherein, the material of said substrate is a metal.
4. light supply apparatus as claimed in claim 1 is characterized in that:
Wherein, said backboard has a groove, and said light-emitting diode (LED) module is arranged on said groove.
5. light supply apparatus as claimed in claim 1 is characterized in that:
Wherein, said backboard is formed in one or is combined by a plurality of workpiece.
6. light supply apparatus as claimed in claim 1 is characterized in that:
Wherein, said substrate and said backboard are to weld together with a welding material.
7. light supply apparatus as claimed in claim 1 is characterized in that:
Wherein, said substrate and said backboard are to weld together with spot welding or continuous pass.
8. light supply apparatus as claimed in claim 1 is characterized in that:
Also comprise: a leaded light component and a diffusion sheet are arranged on a bright dipping side of said light-emitting diode (LED) module.
9. LCD is characterized in that:
Comprise: a light supply apparatus, it is used to provide a backlight, and said light supply apparatus comprises:
One backboard, said backboard comprise a base plate and a plurality of side plate, and said side plate is connected the edge of said base plate; And
At least one light-emitting diode (LED) module, it comprises:
One substrate, said substrate have a first surface and an opposing second surface, said substrate with said second surface towards the welding of said base plate or welding inner surface at said base plate; And
At least one light emitting diode, said light emitting diode are arranged on the said first surface of said substrate;
One front baffle, itself and said backboard are formed a framework, and said framework has an accommodation space; And
One panel module, said panel module are arranged on a bright dipping side of said accommodation space and said light-emitting diode (LED) module.
10. LCD as claimed in claim 9 is characterized in that:
Wherein, said front baffle and said backboard are formed in one or are combined by a plurality of workpiece.
11. LCD as claimed in claim 9 is characterized in that:
Wherein, said substrate and said backboard are to weld together with a welding material.
12. LCD as claimed in claim 9 is characterized in that:
Wherein, said substrate and said backboard are to weld together with spot welding or continuous pass.
CN2011203380733U 2011-09-09 2011-09-09 Light source device and LCD Expired - Fee Related CN202195374U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2011203380733U CN202195374U (en) 2011-09-09 2011-09-09 Light source device and LCD

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2011203380733U CN202195374U (en) 2011-09-09 2011-09-09 Light source device and LCD

Publications (1)

Publication Number Publication Date
CN202195374U true CN202195374U (en) 2012-04-18

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Application Number Title Priority Date Filing Date
CN2011203380733U Expired - Fee Related CN202195374U (en) 2011-09-09 2011-09-09 Light source device and LCD

Country Status (1)

Country Link
CN (1) CN202195374U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013185427A1 (en) * 2012-06-11 2013-12-19 深圳市华星光电技术有限公司 Printed circuit board structure of backlight module, backlight module and liquid crystal display thereof
CN105652522A (en) * 2016-04-12 2016-06-08 京东方科技集团股份有限公司 Backlight module and manufacturing method thereof, back board and display device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013185427A1 (en) * 2012-06-11 2013-12-19 深圳市华星光电技术有限公司 Printed circuit board structure of backlight module, backlight module and liquid crystal display thereof
CN105652522A (en) * 2016-04-12 2016-06-08 京东方科技集团股份有限公司 Backlight module and manufacturing method thereof, back board and display device
US10036920B2 (en) 2016-04-12 2018-07-31 Boe Technology Group Co., Ltd. Backlight module and a manufacturing method thereof, back plate and display device
CN105652522B (en) * 2016-04-12 2018-12-21 京东方科技集团股份有限公司 Backlight module and preparation method thereof, backboard and display device

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C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20120418

Termination date: 20180909