JP2010080723A - Light emitting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a light emitting device provided with a reflecting frame body having an excellent heat dissipation property. <P>SOLUTION: A surface mount LED (light emitting device) 101 includes a circuit board 120, a light emitting element 104 mounted on the circuit board 120, and a reflecting frame body 150 which is bonded to the circuit board 120 and surrounds the light emitting element 104 and reflects light from the light emitting element 104. The reflecting frame body 150 is made of a heat dissipating material, and recessed portions 170 for heat dissipation having opening ends in the outer surface of the reflecting frame body 150 are formed. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a light emitting device, and more particularly to a light emitting device including a reflective frame that reflects light from a light emitting element and has excellent heat dissipation.

  In general, in a light-emitting device in which an LED (Light Emitting Diode) element is mounted, the light-emitting efficiency of the LED element is reduced due to heat generated by driving. Therefore, it is necessary to provide a certain heat dissipation mechanism in the light-emitting device.

  FIG. 7 is an overall perspective view showing an example of a light-emitting device including a reflective frame body made of a metal material as a heat radiating member. As shown in FIG. 7, the light emitting device 301 includes a circuit board 320, a nonpolar electrode layer 303 formed on the circuit board 320, and an LED element (light emitting device) mounted on a predetermined region of the nonpolar electrode layer 303. Element) 304 and a reflection frame 350 provided on the nonpolar electrode layer 303 so as to surround the LED element 304.

  Here, an opening 350 a penetrating from the upper surface to the lower surface is formed at the center of the reflection frame 350. The opening 350 a is configured such that the inner side surface 350 b functions as a reflection surface that reflects light emitted from the LED element 304. Further, the opening 350a is formed in a circular shape when the inner side surface 350b is seen in plan view in order to uniformly collect the light emitted from the LED elements 304.

  Further, as shown in FIG. 7, the reflection frame 350 is formed by the resin adhesive 340 applied on the outer peripheral portion of the substrate 320 where the nonpolar electrode layer 303 is not formed. Is bonded onto the circuit board 320 so that at least a part of the electrode is in direct contact with the upper surface of the nonpolar electrode layer 303. That is, the reflective frame 350 is bonded (fixed) so as to be in thermal contact with the nonpolar electrode layer 303.

  In the light emitting device 301 configured as described above, the heat generated by the light emission of the LED element 304 is radiated by the nonpolar electrode layer 303 formed on the upper surface of the circuit board 320 and directly with the nonpolar electrode layer 303. Heat is also radiated from the reflective frame 350 that is in contact. As described above, the conventional light emitting device 301 is configured to be able to effectively dissipate the heat generated in the LED element 304, so that the light emission efficiency (light emission characteristics) due to the temperature rise of the LED element 304 is improved. While the decrease is suppressed, high luminance proportional to the amount of current is obtained, and the effects of improving the functionality and life of the light emitting device 301 are obtained.

  However, in recent years, there is an increasing tendency for higher output in surface mount components such as electronic components and light emitting devices, and accordingly, the amount of heat generated by driving the surface mount components is also increasing. For example, a light emitting device equipped with an LED element has come to be used for general illumination, a backlight for a large screen liquid crystal, an automobile lamp, and the like. When using a light emitting device for such an application, it is necessary to pass a large current through the LED element because high light output is required. For this reason, the calorific value from a light-emitting device also becomes large compared with the past, and it is necessary to efficiently dissipate heat generated by light emission of further LED elements. And if this subject is not solved, it was difficult to fully suppress the fall of the luminescent property resulting from the temperature rise of an LED element.

  Therefore, the present invention has been made to solve the above-described problems, and an object of the present invention is to provide a light-emitting device including a reflective frame having a good heat dissipation effect.

  In order to achieve the above object, a light emitting device according to a first aspect of the present invention includes a circuit board, a light emitting element mounted on the circuit board, and an adhesive bonded on the circuit board, surrounding the light emitting element, and from the light emitting element. The reflective frame body is made of a heat radiating material and has a heat radiating recess having an open end on the outer surface of the reflective frame body.

  In the light emitting device according to the first aspect, as described above, the heat sink recess having the open end is formed on the outer surface of the reflector frame made of the heat dissipation material. Increases surface area. Therefore, since the contact area with the outside air increases in the entire reflection frame, the heat dissipation effect of the entire reflection frame is enhanced. Thereby, the heat transmitted to the reflecting frame body out of the heat generated with the light emission of the light emitting element can be efficiently radiated from the reflecting frame body. For this reason, even if the light emitting element generates heat due to light emission, the temperature rise of the light emitting element can be effectively suppressed, and the element temperature of the light emitting element can be kept low. Thereby, since the fall of the light emission characteristic resulting from the raise of element temperature can be suppressed, a favorable light emission characteristic can be acquired. In addition, since the heat-dissipating recess having the open end on the outer surface of the reflection frame can be formed without increasing the volume of the entire reflection frame, the light emitting device does not increase in size. Further, by making the shape of the recesses complicated, the heat radiation area of the reflection frame can be made as large as possible in a limited space.

  In the light emitting device according to the first aspect, the recess is preferably formed in a groove shape extending in a predetermined direction. If comprised in this way, the surface area of a reflective frame can be increased by forming the groove-shaped recessed part extended in a predetermined direction on the outer surface of a reflective frame at predetermined intervals. Thereby, the heat dissipation effect of the reflective frame can be further enhanced. For this reason, even if the light emitting element generates heat due to light emission, the temperature rise of the light emitting element can be effectively suppressed, and the element temperature of the light emitting element can be kept low. Thereby, since the fall of the light emission characteristic resulting from the raise of element temperature can be suppressed, a favorable light emission characteristic can be acquired. The plurality of groove-like recesses can be formed by, for example, cutting, and the heat dissipation effect of the reflective frame can be further enhanced by arranging a plurality of groove-like recesses at a narrow pitch. In addition, the shape and number of the concave portions provided in accordance with the size and shape of the reflection frame can be designed as appropriate, so that the degree of freedom in designing and mounting the light emitting device can be increased. Can respond.

  In the light emitting device according to the first aspect, preferably, the recess is formed so as to penetrate from the outer surface of the reflecting frame toward the opposite outer surface. If comprised in this way, the surface area of the whole reflective frame will increase by the recessed part which penetrates a reflective frame. Therefore, since the contact area with the outside air increases in the entire reflection frame, the heat dissipation effect of the entire reflection frame is enhanced. Further, the heat transferred from the light emitting element to the reflection frame can be efficiently radiated from the inside of the reflection frame to the outside through the recessed portion penetrating. For this reason, even if the light emitting element generates heat due to light emission, the temperature rise of the light emitting element can be effectively suppressed, and the element temperature of the light emitting element can be kept low. Thereby, since the fall of the light emission characteristic resulting from the raise of element temperature can be suppressed, a favorable light emission characteristic can be acquired. Note that the temperature of the heating element can be efficiently lowered by providing a large number or a plurality of recesses penetrating the reflective frame close to the light emitting element as the heating element.

  In the light emitting device according to the first aspect, preferably, a plurality of convex portions that protrude from the outer surface of the reflecting frame are formed. If comprised in this way, the surface area of the whole reflective frame body will increase by the protruding convex part. Therefore, since the contact area with the outside air increases in the entire reflection frame, the heat dissipation effect of the entire reflection frame is enhanced. Thereby, the heat transmitted to the reflecting frame body out of the heat generated with the light emission of the light emitting element can be efficiently radiated from the reflecting frame body. For this reason, even if the light emitting element generates heat due to light emission, the temperature rise of the light emitting element can be effectively suppressed, so that the element temperature of the light emitting element can be kept low. Thereby, since the fall of the light emission characteristic resulting from the raise of element temperature can be suppressed, a favorable light emission characteristic can be acquired. In addition, when the convex part which protrudes from the outer surface of a reflective frame body is formed, the volume of the whole reflective frame body will be increased, but a convex part should be designed suitably to such an extent that the light radiate | emitted from a light emitting element is not blocked. Can do. Moreover, by making the shape of the convex part protruding from the outer surface complicated, the heat radiation area of the reflection frame can be made as large as possible in a limited space. Further, the convex portion can be formed by joining to the outer surface of the reflective frame body using a member different from the members constituting the reflective frame body, and the shape and number of convex portions provided in accordance with the size and shape of the reflective frame body. Can be designed as appropriate, and can be applied to extremely small light emitting devices.

  In the light emitting device according to the first aspect, the plurality of convex portions are preferably formed in a bowl shape extending in a predetermined direction. If comprised in this way, the surface area of a reflective frame body can be made to increase more by forming the convex part extended in a predetermined direction on the outer surface of a reflective frame body at predetermined intervals. Thereby, the heat dissipation effect of the reflective frame can be further enhanced. For this reason, even if the light emitting element generates heat due to light emission, the temperature rise of the light emitting element can be effectively suppressed, and the element temperature of the light emitting element can be kept low. Thereby, since the fall of the light emission characteristic resulting from the raise of element temperature can be suppressed, a favorable light emission characteristic can be acquired. In addition, the heat dissipation effect of the reflective frame can be further enhanced by arranging a plurality of ridge-shaped convex portions at a narrow pitch.

  As described above, according to the present invention, it is possible to easily obtain a light emitting device including a reflective frame body having good heat dissipation characteristics.

DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments embodying the present invention will be described in detail with reference to the drawings. In the first to third embodiments, a case where the present invention is applied to a surface-mounted LED that is an example of a light-emitting device will be described.
(First embodiment)
FIG. 1 is an overall perspective view of a surface-mounted LED according to a first embodiment of the present invention, and FIG. 2 is a cross-sectional view of the surface-mounted LED BB ′ according to the first embodiment of the present invention shown in FIG. FIG. First, the structure of the surface-mounted LED 101 according to the first embodiment of the present invention will be described with reference to FIGS.

  As shown in FIGS. 1 and 2, the surface-mount LED 101 according to the first embodiment includes a substrate 120, a light emitting diode element (LED element) 104 mounted on the substrate 120, and an LED element 104 on the substrate 120. The reflective frame 150 is fixed (adhered) so as to surround, and the translucent member 110 filled inside the reflective frame 150 is provided. The substrate 120 is an example of the “circuit board” in the present invention, and the LED element 104 is an example of the “light emitting element” in the present invention.

  Further, as shown in FIG. 2, the substrate 120 is formed with a plurality of electrode layers on the upper surface and the lower surface of the insulating base material 121 made of glass epoxy, liquid crystal polymer (Liquid Crystal Polymer: LCP), or the like. It is comprised from the double-sided board made.

  As shown in FIG. 2, the plurality of electrode layers formed on the upper surface of the insulating base 121 have a plurality of (three) polar electrode layers 123 having a positive polarity and a negative polarity. A plurality (three) of polar electrode layers 124, a nonpolar (neutral) electrode layer 126 having no electrical polarity, electrically separated through polar electrode layers 123 and 124 and an insulating groove 125; It is divided into. As shown in FIGS. 1 and 2, the polar electrode layers 123 and 124 are formed on the upper surface of the insulating base 121 and in regions located inside the opening 151 of the reflective frame 150. ing. The nonpolar electrode layer 126 is formed on the upper surface of the insulating base 121 and in a region other than the region where the polar electrode layers 123 and 124 are formed. Specifically, as shown in FIG. 2, the nonpolar electrode layer 126 includes the polar electrode layers 123 and 124, the insulating grooves 125 around the polar electrode layers 123 and 124, and the outer peripheral portion of the upper surface of the substrate 120. It is formed in a region other than this region.

  Further, as shown in FIG. 2, the electrode layer formed on the lower surface of the insulating base 121 is mainly composed of electrode layers 127 and 128 used for wiring, and an electrode layer 129 used mainly for heat dissipation. It is configured. Further, a plurality of electrode layers 127 and 128 used for wiring are formed so as to correspond to the plurality of polar electrode layers 123 and 124, respectively, and through the through holes 121a formed in the insulating base 121. Are electrically connected to the polar electrode layers 123 and 124, respectively.

  The electrode layer 129 used for heat dissipation is in direct contact with the nonpolar electrode layer 126 through the plurality of through holes 121b of the insulating base 121. That is, the electrode layer 129 is thermally connected to the nonpolar electrode layer 126 through the plurality of through holes 121b of the insulating base 121. The polar electrode layers 123 and 124, the nonpolar electrode layer 126, and the electrode layers 127 to 129 are made of a conductive material having excellent thermal conductivity such as copper. As described above, the surface-mounted LED 101 according to this embodiment is a type in which the positive polar electrode layer 123 and the negative polar electrode layer 124 are provided on the upper surface side, and therefore has no relation to the current path on the lower surface side. An electrode layer 129 used for heat dissipation can be provided and directly connected to the nonpolar electrode layer 126 on the upper surface side. For this reason, the heat generated by the LED element 104 can be satisfactorily transmitted to the reflective frame 150 (heat radiating member) and the electrode layer 129 used for heat dissipation through the nonpolar electrode layer 126, and the heat dissipation of the surface-mounted LED 101 is sufficiently ensured. Can do.

  As shown in FIGS. 1 and 2, the three LED elements 104 are provided on the upper surface of the nonpolar electrode layer 126 and on the region located inside the opening 151 of the reflection frame 150. It is fixed by an adhesive 160 (see FIG. 2) or the like. The LED elements 104 are arranged between the positive polar electrode layer 123 and the negative polar electrode layer 124 at a predetermined interval. The three LED elements 104 have a function of emitting red, green, and blue light, respectively. In addition, by providing three LED elements 104 of red, green, and blue on one surface-mount LED 101, various colors can be produced by combining the light emitted from each of them. However, the present invention is not limited to the case where two LED elements 104 are provided, and two LED elements 104 may be provided, or one LED element 104 may be provided on one surface-mounted LED 101 to emit monochromatic light. is there. Further, four or more LED elements 104 may be provided.

  As shown in FIGS. 1 and 2, the upper surface of the positive polar electrode layer 123 and the electrode portion of the LED element 104 are electrically connected through bonding wires 122, respectively. The upper surface of the negative polar electrode layer 124 and the electrode portion of the LED element 104 are electrically connected via bonding wires 122, respectively. As a result, by applying a voltage between the electrode terminal of the electrode layer 127 formed on the lower surface of the insulating base 121 and the electrode terminal of the electrode layer 128, a current is supplied to the LED element 104 via the bonding wire 122. Each LED element 104 emits light at a unique wavelength. When these LED elements 104 emit light simultaneously, the colors are mixed and emitted. The bonding wire 122 is made of a fine metal wire such as Au or Al. In this case, only the LED element 104 that emits blue light is mounted, and the phosphor is dispersed in the translucent member 110 so that the light emitted from the surface-mounted LED 101 becomes white light. It may be configured.

  In addition, the reflection frame 150 is made of a metal material mainly composed of aluminum having excellent heat dissipation characteristics, and is formed in a planar shape substantially the same size as the substrate 120 as shown in FIGS. 1 and 2. Has been. Specifically, the reflection frame 150 is formed in a square shape having a length of about 3.5 mm × about 3.5 mm in a plan view, and has a thickness of about 0.6 mm.

  Further, as shown in FIGS. 1 and 2, an opening 151 penetrating from the upper surface to the lower surface is formed in the central portion of the reflection frame 150. The opening 151 is configured such that the inner side surface 151 a functions as a reflection surface that reflects the light emitted from the LED element 104. Further, the surface of the inner side surface 151a of the opening 151 is subjected to a silver plating process or an alumite process in order to increase the reflectance. Further, as shown in FIG. 1, the opening 151 is formed in a circular shape when the inner side surface 151a is seen in plan view in order to uniformly collect the light emitted from the LED element 104. Further, as shown in FIG. 2, the opening 151 is formed so as to expand in a taper shape above the opening 151. Thus, the inner surface 151a of the opening 151 is configured to be able to efficiently reflect the light emitted from the LED element 104 upward.

  In addition, as shown in FIG. 1 and FIG. 2, the reflective frame 150 has a plurality of heat radiation recesses 170 each having an open end on the outer surface of the reflective frame 150. The reflection frame 150 is formed so as to go around the outer surface. By forming the heat radiation recess 170 on the outer surface of the reflection frame 150, the surface area of the entire reflection frame 150 increases. Accordingly, since the contact area with the outside air increases in the entire reflection frame 150, the heat dissipation effect of the entire reflection frame 150 is enhanced. Thereby, the heat transmitted to the reflective frame 150 among the heat generated with the light emission of the LED element 104 can be efficiently radiated from the reflective frame 150. For this reason, even if the LED element 104 generates heat due to light emission, the temperature rise of the LED element 104 can be effectively suppressed, and the element temperature of the LED element 104 can be kept low. In addition, this makes it possible to suppress a decrease in light emission characteristics due to an increase in element temperature, so that good light emission characteristics can be obtained. In addition, the groove-shaped recessed part 170 can be formed by cutting. In addition to the four outer surfaces as described above, the outer surface of the reflective frame 150 forming the recesses 170 may be formed on any three or less outer surfaces. When forming the recessed part 170 by the extrusion molding excellent in mass-productivity, it is preferable to form in two opposing outer surfaces.

  Further, as shown in FIG. 2, the reflection frame 150 is bonded (fixed) on the substrate 121 by a resin adhesive 140 made of epoxy resin, acrylic resin, or the like. Specifically, the reflective frame 150 is at least a part of the bottom surface of the reflective frame 150 by the resin adhesive 140 applied on the outer peripheral region on the substrate 121 where the nonpolar electrode layer 126 is not formed. Is adhered on the substrate 121 so as to be in direct contact with the upper surface of the nonpolar electrode layer 126. That is, the reflection frame 150 is bonded (fixed) on the substrate 121 so as to be in thermal contact with the nonpolar electrode layer 126.

  Further, as shown in FIG. 2, a corner portion constituted by the bottom surface of the reflection frame 150 and one end surface of the reflection frame 150, and a corner portion constituted by the bottom surface of the reflection frame 150 and the other end surface of the reflection frame 150. Each corner is formed with a notch 159 having a circular cross section. The notch 159 is covered with an insulating member 155. When the surface-mounted LED 101 is surface-mounted by solder, the notch 159 and the insulating member 155 cause the reflecting frame 150 to be electrically short-circuited due to the solder sucking up from the end face of the reflecting frame 150. It has a function to suppress the occurrence of inconvenience.

  The translucent member 110 is made of a resin material such as epoxy resin or silicon resin. As shown in FIG. 2, the LED element 104 and the bonding wire 122 are placed in the opening 150 a of the reflective frame 150. It is provided to seal. The translucent member 110 has a function of preventing the LED element 104 and the bonding wire 122 from coming into contact with air or moisture by sealing the LED element 104 and the bonding wire 122.

  As described above, the heat generated by the light emission of the LED element 104 is thermally conducted from the translucent member 110 to the reflective frame 150 and is thermally conducted from the nonpolar electrode layer 126 to the reflective frame 150 to be radiated. Further, the nonpolar electrode layer 126 formed on the upper surface of the insulating base 121 and the heat dissipation electrode layer 129 thermally connected to the nonpolar electrode layer 126 through the through-hole 121b of the insulating base 121. Heat is also dissipated.

  Further, when the electrode layer 129 is in thermal contact with a heat sink (not shown) of a circuit board (not shown), the heat dissipation effect is further promoted. As described above, the surface-mounted LED 101 according to the first embodiment is configured to be able to effectively dissipate the heat generated in the LED element 104, so that the light emission efficiency due to the temperature rise of the LED element 104 ( The light emission characteristics) are suppressed from being lowered, and high luminance proportional to the amount of current is obtained, and the effects of improving the functionality and life of the surface-mounted LED 101 are obtained.

  In the first embodiment, as described above, the reflective frame 150 is made of a metal material mainly composed of aluminum, and the reflective frame 150 is formed of the nonpolar electrode layer 126 on which the LED element 104 is mounted. By using the resin adhesive 140 to adhere to the heat, the heat generated by the light emission of the LED element 104 can be efficiently transmitted to the reflective frame 150 through the nonpolar electrode layer 126 and transmitted. Heat can be efficiently radiated from the reflective frame 150. For this reason, even if the LED element 104 generates heat due to light emission, the temperature rise of the LED element 104 can be effectively suppressed, so that the element temperature of the LED element 104 can be kept low. Thereby, since the fall of the light emission characteristic resulting from the raise of element temperature can be suppressed, a favorable light emission characteristic can be acquired.

  In the configuration of the first embodiment described above, since the nonpolar electrode layer 126 and the polar electrode layers 123 and 124 are electrically separated from each other, the reflective frame 150 is not considered without considering an electrical short circuit. Can be fixed on the substrate 121.

FIG. 3 is a modification of the reflective frame 150 of the first embodiment. As shown in FIG. 3, a groove-like recess 170 is formed on the side surface of the reflective frame 150 from above to below the reflective frame 150. May be. FIG. 4 is a modification of the reflection frame 150 of the first embodiment. As shown in FIG. 4, a hook-shaped convex portion 171 that protrudes from the outer surface of the reflection frame is formed on the upper surface of the reflection frame 150. May be. The surface area of the entire reflective frame 150 is increased by the raised ridge-shaped convex portion 171, and the contact area with the outside air is increased in the entire reflective frame 150, so that the heat dissipation effect of the entire reflective frame 150 is enhanced.
(Second Embodiment)
FIG. 5 is an overall perspective view of the surface-mounted LED 201 according to the second embodiment of the present invention. The structure of the surface-mounted LED 201 according to the second embodiment of the present invention will be described with reference to FIG. The surface-mounted LED 201 according to the second embodiment includes the surface-mounted LED 101 according to the first embodiment, and the configuration other than the reflective frame 250 is the same. Hereinafter, the same components as those of the surface-mounted LED 101 according to the first embodiment are denoted by the same reference numerals, and description thereof is omitted.

  The reflection frame 250 according to the second embodiment is made of a metal material mainly composed of aluminum, which has excellent heat dissipation characteristics, like the reflection frame 150 according to the first embodiment, and as shown in FIG. The planar shape is almost the same size as the substrate 120. Specifically, the reflection frame 250 is formed in a square shape having a length of about 3.5 mm × about 3.5 mm when viewed in a plan view, and has a thickness of about 0.6 mm.

  In addition, as shown in FIG. 5, the reflective frame body 250 according to the second embodiment has a plurality of through recesses 180 penetrating from the upper surface of the reflective frame body 250 toward the opposite lower surface on the opposite side. In this way, the surface area of the entire reflection frame 250 is increased by forming a plurality of through recesses 180 in the reflection frame 250 that are recesses penetrating from the outer surface of the reflection frame toward the opposite outer surface. To do. Accordingly, since the contact area with the outside air increases in the entire reflection frame 250, the heat dissipation effect of the entire reflection frame 250 is enhanced. Thereby, the heat transmitted to the reflection frame 250 out of the heat generated with the light emission of the LED element 104 can be efficiently radiated from the reflection frame 250. For this reason, even if the LED element 104 generates heat due to light emission, the temperature rise of the LED element 104 can be effectively suppressed, and the element temperature of the LED element 104 can be kept low. In addition, since a decrease in light emission characteristics due to an increase in element temperature can be suppressed, good light emission characteristics can be obtained. The through recess 180 can be formed by cutting.

  FIG. 6 is a modified example of the reflection frame body 250 of the second embodiment. As shown in FIG. 6, the through recess 180 is formed to penetrate from the side surface of the reflection frame body 250 toward the opposite side surface. Also good. Further, the through recess 180 may be formed by combining the through recesses 180 shown in FIGS. 5 and 6 to form a plurality of through recesses 180 whose side surfaces and upper surface are open. Moreover, even if the penetration recessed part 180 does not penetrate to the surface which opposes, the same effect can be exhibited. It is also possible to promote heat dissipation by filling the inside of the through recess 180 with a coolant. Further, even if the groove-like concave portion 170 or the hook-like convex portion 171 provided in the reflective frame 150 of the first embodiment is formed in the reflective frame 250 of the second embodiment, the heat dissipation effect of the entire reflective frame 250 is obtained. Can be increased.

1 is an overall perspective view of a surface-mounted LED according to a first embodiment of the present invention. It is sectional drawing along the B-B 'line of FIG. It is a whole perspective view which shows the modification of the surface mount type LED by 1st Embodiment of this invention. It is a whole perspective view which shows the modification of the surface mount type LED by 1st Embodiment of this invention. It is a whole perspective view of the surface mount type LED by 2nd Embodiment of this invention. It is a whole perspective view which shows the modification of the surface mount type LED by 2nd Embodiment of this invention. It is a whole perspective view of the conventional surface mount type LED.

Explanation of symbols

101, 301 Surface-mount LED
104, 304 Light-emitting diode element (LED element)
DESCRIPTION OF SYMBOLS 110 Translucent member 120, 320 Board | substrate 121 Insulating base material 121a, 121b Through-hole 122 Bonding wire 123, 124 Polarized electrode layer 125 Insulating groove 126 Nonpolar electrode layer 127, 128 Wiring electrode layer 129 Thermal radiation electrode layer 140, 340 Resin adhesive 150, 250, 350 Reflective frame 150a, 350a Reflective frame opening 150b, 350b Reflective frame inner surface 151 Opening 155 Insulating member 159 Notch 160 Adhesive 170 Concave 171 Convex 180 Penetrating concavity

Claims (5)

A circuit board;
A light emitting device mounted on the circuit board;
A reflective frame that is bonded onto the circuit board, surrounds the light emitting element, and reflects light from the light emitting element;
The reflection frame is made of a heat dissipation material, and a heat dissipation recess having an open end is formed on the outer surface of the reflection frame.   2. The light emitting device according to claim 1, wherein the concave portion is formed in a groove shape extending in a predetermined direction.   The light-emitting device according to claim 1, wherein the recess penetrates from an outer surface of the reflective frame toward an opposite outer surface.   The light-emitting device according to claim 1, wherein a convex portion that protrudes from an outer surface of the reflection frame is formed.   The light emitting device according to claim 4, wherein the convex portion is formed in a bowl shape extending in a predetermined direction.

Images