JP2009021303A - Light-emitting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a light-emitting device having satisfactory luminous characteristics. <P>SOLUTION: The surface mount LED (light-emitting device) 100 includes: a substrate 1, where a nonpolar electrode layer 6 is formed on an upper surface; an LED element 20 mounted on a prescribed region of the nonpolar electrode layer 6; a plurality of polar electrode layers 3, 4 that are formed on the upper surface of the substrate 1 and supply power to the LED element 20; and a reflecting frame body 30 that is made of a metal material with aluminum as a main constituent, where an inner surface 31a is set to be a reflecting surface for reflecting light from the LED element 20. The reflecting frame body 30 is bonded to the nonpolar electrode layer 6 by a conductive adhesive 10 composed of a silver paste so that the LED element 20 is surrounded. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a light emitting device, and more particularly to a light emitting device including a reflective frame that reflects light from a light emitting element.

  2. Description of the Related Art Conventionally, a light emitting device including a reflection frame that reflects light from a light emitting element is known (see, for example, Patent Document 1).

  In Patent Document 1, two lead frames that are electrically insulated from each other are formed on the upper and lower sides of a glass epoxy substrate, and an LED element (light emitting element) is mounted on one of the two lead frames. In addition, a light emitting device is described in which a reflective frame is provided on each lead frame so as to surround the LED element. The reflection frame is made of plastic (resin), and its inner peripheral surface is configured to function as a reflection surface that reflects light from the LED element. Also, one lead frame of the two lead frames is electrically connected to one electrode terminal of the LED element via a bonding wire, and the other lead frame of the two lead frames is connected via a bonding wire. The other electrode terminal of the LED element is electrically connected. In other words, the light emitting device described in Patent Document 1 is configured such that power is supplied to the LED element via two lead frames.

  In the conventional light emitting device configured as described above, since the reflection frame body is made of plastic (resin), even if the reflection frame body is provided on the two lead frames, the two lead frames are electrically connected. While short-circuiting is suppressed, there is a disadvantage that heat generated by light emission of the LED element is difficult to dissipate to the outside.

Therefore, conventionally, a light emitting device is known in which a reflection frame is made of a metal material in order to easily dissipate heat generated by light emission of the LED element to the outside. FIG. 17 is a cross-sectional view showing an example of a conventional light emitting device including a reflective frame body made of a metal material. Referring to FIG. 17, the light emitting device 600 includes a substrate 601 made of glass epoxy, an electrode layer 602 formed on the substrate 601, and an LED element (light emission) mounted on a predetermined region of the electrode layer 602. Element) 603 and a reflective frame 604 provided on the electrode layer 602 so as to surround the LED element 603. Further, the inner peripheral surface 604a of the reflection frame 604 is configured to function as a reflection surface that reflects light from the LED element 603. The reflective frame 604 is formed on the electrode layer 602 of the substrate 601 with an adhesive 605 made of a resin material (insulating material) such as an epoxy resin or an acrylic resin in order to suppress an electrical short circuit of the electrode layer 602. It is glued. In addition, a translucent member 606 that covers the LED element 603 is filled in a region inside the reflective frame 604.
Japanese Patent Laid-Open No. 2004-127988

  However, in the configuration of the conventional light emitting device 600 shown in FIG. 17, a resin adhesive layer (adhesive 605) having a relatively low thermal conductivity is interposed between the substrate 601 and the reflective frame 604. Therefore, there is an inconvenience that it is difficult to efficiently transfer heat from the LED element 603 to the reflecting frame 604. For this reason, it is difficult to efficiently dissipate the heat generated by the light emission of the LED element 603 from the reflection frame 604, and thus it is difficult to sufficiently suppress the deterioration of the light emission characteristics due to the temperature rise of the LED element 603. There is a problem that it is.

  The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a light-emitting device having good light-emitting characteristics.

  To achieve the above object, a light emitting device according to a first aspect of the present invention includes a substrate having a conductor layer formed on a main surface, a light emitting element mounted on a predetermined region of the conductor layer, and a substrate. A plurality of electrode layers for supplying power to the light emitting element and a heat dissipation material, and an inner peripheral surface is a first reflecting surface that reflects light from the light emitting element. And a reflective frame. The plurality of electrode layers include a cathode electrode and an anode electrode, the conductor layer is electrically separated from at least one of the cathode electrode and the anode electrode, and the first reflective frame includes the light emitting element. The first conductive adhesive is adhered to the conductor layer so as to surround.

  In the light emitting device according to the first aspect, as described above, the first reflection frame made of the heat dissipation material is bonded to the conductor layer on which the light emitting element is mounted using the first conductive adhesive. Thus, the heat generated by the light emission of the light emitting element can be efficiently transmitted to the first reflecting frame body through the conductor layer, and the transmitted heat can be efficiently radiated from the first reflecting frame body. be able to. For this reason, even if the light emitting element generates heat due to light emission, the temperature rise of the light emitting element can be effectively suppressed, so that the element temperature of the light emitting element can be kept low. Thereby, since the fall of the light emission characteristic resulting from the raise of element temperature can be suppressed, a favorable light emission characteristic can be acquired.

  Further, in the first aspect, as described above, the first reflective frame is adhered to the conductor layer with the first conductive adhesive, so that the resin adhesive composed of an epoxy resin, an acrylic resin, or the like is used. Unlike the case where the first reflection frame is bonded to the conductor layer, the bonding process of the first reflection frame can be simplified. That is, when the reflective frame is bonded to the substrate with a resin adhesive composed of an epoxy resin or an acrylic resin, the reflective frame must be pressed against the substrate at a high pressure. There is an inconvenience that a large-scale high-pressure press is required in the bonding process. In addition, bubbles easily enter the resin adhesive, and when bubbles are present inside the resin adhesive, a region that is not bonded by the resin adhesive is formed in the bonding region between the reflective frame and the substrate. For this reason, when the reflective frame is bonded to the substrate with the resin adhesive, there is also a disadvantage that a defoaming (evacuation) process using a vacuum apparatus is required simultaneously with the high-pressure pressing step. On the other hand, when the first reflective frame is bonded to the conductive layer using the first conductive adhesive, it is possible to suppress the occurrence of the inconvenience described above. Can be simplified.

  In the above configuration, since the conductor layer is electrically separated from at least one of the cathode electrode and the anode electrode, the first reflection frame is fixed on the substrate without considering an electrical short circuit. can do. For this reason, a 1st reflective frame body can be adhere | attached on a conductor layer using the 1st conductive adhesive whose heat conductivity is high compared with a resin adhesive.

  In the light emitting device according to the first aspect, preferably, a first step portion is formed at a bottom portion of the first reflection frame, and the first conductive adhesive is formed in the first reflection frame. It has the 1st side wall part which suppresses flowing out to the area | region inside a body. According to this structure, the first conductive adhesive flows out to the inner region of the first reflective frame, and thus the first conductive adhesive is irradiated with light from the light emitting element. It can be suppressed from occurring. For this reason, since the discoloration and deterioration of the 1st conductive adhesive resulting from light irradiation can be suppressed, the light emission characteristic and reliability fall due to the discoloration and deterioration of the 1st conductive adhesive. It is possible to suppress the occurrence of the inconvenience. Thereby, even if the first reflective frame is bonded to the conductor layer with the first conductive adhesive, a light emitting device having good light emission characteristics can be obtained.

  In the light emitting device according to the first aspect, preferably, the first conductive adhesive is made of a silver paste. If comprised in this way, since the heat from a light emitting element can be efficiently transmitted to a 1st reflective frame, it can be thermally radiated from a 1st reflective frame efficiently. For this reason, since the heat dissipation characteristic of a light-emitting device can be improved easily, the light emission characteristic of a light-emitting device can be improved easily.

  In the light emitting device according to the first aspect, preferably, the heat dissipating material constituting the first reflecting frame is a metal material. If comprised in this way, since the heat | fever from the light emitting element heat-transferred via the conductor layer can be thermally radiated more efficiently from a 1st reflective frame body, the heat dissipation characteristic of a light-emitting device can be made more easily. Can be improved.

  In the light emitting device according to the first aspect, the conductor layer may be configured to have no electrical polarity by being electrically separated from the electrode layer.

  In the light emitting device according to the first aspect, preferably, the light emitting device further includes a second reflection frame body that is made of a heat dissipation material and has an inner peripheral surface that is a second reflection surface that reflects light from the light emitting element, and the second reflection frame. The frame is bonded to the upper surface of the first reflective frame with a second conductive adhesive. If comprised in this way, the heat | fever from the light emitting element transmitted to the 1st reflective frame body can be efficiently transmitted to the 2nd reflective frame body, and can also be thermally radiated from the 2nd reflective frame body. Thereby, the heat dissipation characteristics of the light emitting device can be improved more easily.

  In this case, preferably, a second step portion is formed at the bottom of the second reflection frame, and the second step causes the second conductive adhesive to flow inside the second reflection frame. The second side wall portion for suppressing the above is provided. If comprised in this way, it originates in the 2nd conductive adhesive flowing out to the area | region inside a 2nd reflective frame, and there exists a problem that the light from a light emitting element is irradiated to a 2nd conductive adhesive. It can be suppressed from occurring. Thereby, discoloration and deterioration of the second conductive adhesive caused by light irradiation can be suppressed.

  In the configuration including the second reflective frame, the second conductive adhesive is preferably made of a silver paste. If comprised in this way, since the heat from the light emitting element transmitted to the 1st reflective frame body can be efficiently transmitted to the 2nd reflective frame body, the heat from a light emitting element is 2nd reflective frame body Heat can be efficiently dissipated.

  In the configuration including the second reflection frame, preferably, the heat dissipation material forming the second reflection frame is a metal material. If comprised in this way, the heat | fever from the light emitting element transmitted via the conductor layer and the 1st reflective frame body can be easily thermally radiated from the 2nd reflective frame body easily.

  A light emitting device according to a second aspect of the present invention is formed on a main surface of a substrate, a light emitting element mounted on a predetermined region of the conductor layer, a substrate having a conductor layer formed on the main surface, A plurality of electrode layers for supplying power to the light emitting element are adhered to the substrate by an insulating adhesive, and are configured to be in direct contact with the conductor layer or indirectly through a conductive member. And the 1st reflective frame made into the 1st reflective surface in which an inner peripheral surface reflects the light from a light emitting element, and the upper surface of the 1st reflective frame are pasted up with a conductive adhesive, and an inner peripheral surface emits light A second reflecting frame that is a second reflecting surface that reflects light from the element. The first reflection frame body and the second reflection frame body are each made of a heat dissipation material, the plurality of electrode layers include a cathode electrode and an anode electrode, and the conductor layer includes at least the cathode electrode. And electrically separated from one of the anode electrodes.

  In the light emitting device according to the second aspect, as described above, the first reflecting frame made of the heat dissipation material is in direct contact with the conductor layer on which the light emitting element is mounted or indirectly through the conductive member. The light emitting device emits light by adhering the second reflective frame made of a heat dissipation material to the upper surface of the first reflective frame using a conductive adhesive. The accompanying heat can be efficiently transmitted to the first reflection frame through the conductor layer, and can also be efficiently transmitted to the second reflection frame through the first reflection frame. For this reason, the heat from the light emitting element can be efficiently dissipated from both the first reflecting frame body and the second reflecting frame body. Therefore, even if the light emitting element generates heat by light emission, the temperature rise of the light emitting element is effective. Can be suppressed. Thereby, since the element temperature of the light emitting element can be kept low, it is possible to suppress a decrease in light emission characteristics due to an increase in the element temperature. As a result, good light emission characteristics can be obtained.

  In the above configuration, since the conductor layer is electrically separated from at least one of the cathode electrode and the anode electrode, the first reflection frame is fixed on the substrate without considering an electrical short circuit. In addition, the second reflection frame can be fixed to the upper surface of the first reflection frame. For this reason, a 2nd reflective frame can be adhere | attached on the upper surface of a 1st reflective frame using the conductive adhesive whose heat conductivity is higher than a resin adhesive.

  In the light emitting device according to the second aspect, preferably, a stepped portion is formed at a bottom portion of the second reflecting frame, and the stepped portion is formed in a region inside the second reflecting frame. It has a side wall part which suppresses flowing out. If comprised in this way, it will suppress that the problem that the conductive adhesive flows into the area | region inside a 2nd reflective frame body, and the light from a light emitting element is irradiated to a conductive adhesive will arise. Therefore, discoloration and deterioration of the conductive adhesive due to light irradiation can be suppressed. For this reason, since it is possible to suppress the disadvantage that the light emission characteristics and reliability are lowered due to discoloration or deterioration of the conductive adhesive, it is possible to suppress the second reflective frame body by the conductive adhesive. Even when bonded to the upper surface of the reflective frame, a light emitting device having good light emission characteristics can be obtained.

  In the light emitting device according to the second aspect, preferably, the conductive adhesive is made of a silver paste. If comprised in this way, since the heat from the light emitting element transmitted to the 1st reflective frame body can be efficiently transmitted to the 2nd reflective frame body, the heat from a light emitting element is 2nd reflective frame body Heat can be efficiently dissipated. For this reason, since the heat dissipation characteristic of a light-emitting device can be improved easily, the light emission characteristic of a light-emitting device can be improved easily.

  In the light emitting device according to the second aspect, preferably, the heat dissipating materials constituting the first reflecting frame and the second reflecting frame are each a metal material. If comprised in this way, the heat | fever from the light emitting element heat-transmitted via the conductor layer can be efficiently radiated from each of the 1st reflective frame and the 2nd reflective frame. Thereby, the heat dissipation characteristics of the light emitting device can be improved more easily.

  In the light emitting device according to the second aspect, the conductor layer may be configured to have no electrical polarity by being electrically separated from the electrode layer.

  In the light emitting device according to the first and second aspects, the light emitting element can be a light emitting diode element.

  In the light emitting device according to the first and second aspects, the conductor layer may be configured not to have an electrical polarity, or configured to be grounded to a ground (earth). It may be.

  As described above, according to the present invention, a light emitting device having good light emission characteristics can be easily obtained.

DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments embodying the present invention will be described in detail with reference to the drawings. In the first to third embodiments, a case where the present invention is applied to a surface-mounted LED that is an example of a light-emitting device will be described.
(First embodiment)
FIG. 1 is an overall perspective view of a surface-mounted LED according to a first embodiment of the present invention. FIG. 2 is a plan view of the surface-mounted LED according to the first embodiment of the present invention shown in FIG. FIG. FIG. 3 is a cross-sectional view taken along the line 400-400 in FIG. 4 to 9 are views for explaining the structure of the surface-mounted LED according to the first embodiment of the present invention shown in FIG. First, the structure of the surface-mounted LED 100 according to the first embodiment of the present invention will be described with reference to FIGS.

  As shown in FIGS. 1 and 2, the surface-mounted LED 100 according to the first embodiment includes a substrate 1 (see FIG. 1), a light-emitting diode element (LED element) 20 mounted on the substrate 1, and a substrate 1. The reflective frame 30 is fixed (adhered) so as to surround the LED element 20, and the translucent member 40 is filled inside the reflective frame 30. The LED element 20 is an example of the “light emitting element” in the present invention, and the reflective frame 30 is an example of the “first reflective frame” in the present invention.

  In addition, as shown in FIG. 3, the substrate 1 is formed with a plurality of electrode layers on the upper surface and the lower surface of the insulating base material 2 made of glass epoxy, liquid crystal polymer (Liquid Crystal Polymer: LCP), or the like. It is comprised from the double-sided board made. As shown in FIGS. 5 and 6, the substrate 1 has a length of about 3.5 mm in the X direction when viewed in a plan view, and about 3. mm in the Y direction orthogonal to the X direction. It is formed in a square shape having a length of 5 mm. The substrate 1 has a thickness of about 0.2 mm.

  The plurality of electrode layers formed on the upper surface of the insulating base 2 are, as shown in FIGS. 2 and 5, a plurality (three) of polar electrode layers (cathode electrodes) 3 having a positive polarity, And a plurality (three) of polar electrode layers (anode electrodes) 4 having a negative polarity, and the polarities electrically separated through the polar electrode layers 3 and 4 and the insulating groove 5 There is no nonpolar (neutral) electrode layer 6. The polar electrode layers 3 and 4 are respectively formed on the upper surface of the insulating base 2 and in the region located inside the opening 31 of the reflection frame 30 as shown in FIGS. ing. The nonpolar electrode layer 6 is formed on a region other than the region where the polar electrode layers 3 and 4 are formed, on the upper surface of the insulating base 2. Specifically, as shown in FIG. 5, the nonpolar electrode layer 6 includes the polar electrode layers 3 and 4, the insulating grooves 5 around the polar electrode layers 3 and 4, and the outer peripheral portion of the upper surface of the substrate 1. It is formed in a region other than this region. The polar electrode layers 3 and 4 are examples of the “electrode layer” in the present invention, and the nonpolar electrode layer 6 is an example of the “conductor layer” in the present invention.

  Further, as shown in FIG. 6, the electrode layer formed on the lower surface of the insulating base 2 is mainly composed of electrode layers 7 and 8 used for wiring and an electrode layer 9 mainly used for heat dissipation. It is configured. Also, a plurality of electrode layers 7 and 8 used for wiring are formed so as to correspond to the plurality of polar electrode layers 3 and 4 described above, respectively. As shown in FIGS. The polar electrode layers 3 and 4 are electrically connected to each other through two through holes 2a. Further, electrode terminals 7a and 8a formed on one end side (X1 direction side) and the other end side (X2 direction side) of the substrate 1 are integrally connected to the electrode layers 7 and 8 used for wiring. Has been.

  The electrode layer 9 used for heat dissipation is in direct contact with the nonpolar electrode layer 6 through the plurality of through holes 2 b of the insulating base 2. That is, the electrode layer 9 is thermally connected to the nonpolar electrode layer 6 through the plurality of through holes 2 b of the insulating base 2. The polar electrode layers 3 and 4, the nonpolar electrode layer 6, the electrode layers 7 to 9, and the electrode terminals 7a and 8a are made of a conductive material having excellent thermal conductivity such as copper.

  As shown in FIGS. 1 and 2, the three LED elements 20 are on the upper surface of the nonpolar electrode layer 6 and on the region located inside the opening 31 of the reflection frame 30. It is fixed by an adhesive 21 (see FIG. 3). The LED elements 20 are arranged between the positive polar electrode layer 3 and the negative polar electrode layer 4 at a predetermined interval. The three LED elements 20 have a function of emitting red, green, and blue light, respectively.

  In addition, as shown in FIGS. 1 to 3, the upper surface of the positive polar electrode layer 3 and the electrode portion of the LED element 20 are electrically connected via a bonding wire 22 and are negatively connected. The polar electrode layer 3 is electrically connected to the electrode portion of the LED element 20 via a bonding wire 23. Thus, by applying a voltage between the electrode terminal 7a of the electrode layer 7 and the electrode terminal 8a of the electrode layer 8, a current flows to the LED element 20 via the bonding wires 22 and 23, and each LED element 20 Emits light at a specific wavelength. When these LED elements 20 emit light simultaneously, the colors are mixed and emitted. In this case, only the LED element 20 that emits blue light is mounted, and the phosphor is dispersed in the translucent member 40 so that the light emitted from the surface-mounted LED 100 becomes white light. It may be configured. The bonding wires 22 and 23 are made of fine metal wires such as Au and Al.

  In addition, the reflection frame 30 is made of a metal material mainly composed of aluminum having excellent heat dissipation characteristics, and is formed in a planar shape substantially the same size as the substrate 1 as shown in FIGS. Has been. Specifically, as shown in FIG. 8, the reflection frame 30 has a length of about 3.5 mm in the X direction and a length of about 3.5 mm in the Y direction as seen in a plan view. It is formed in the square shape which has thickness. The reflective frame 30 has a thickness of about 0.6 mm.

  Moreover, as shown in FIGS. 1-3 and FIGS. 7-9, the opening part 31 penetrated from an upper surface to a lower surface is formed in the center part of the reflective frame 30. FIG. The opening 31 is configured such that the inner side surface 31a functions as a reflection surface that reflects the light emitted from the LED element 20. Further, the surface of the inner side surface 31a of the opening 31 is subjected to silver plating treatment, anodizing treatment or the like in order to increase the reflectance. As shown in FIGS. 2 and 8, the opening 31 is formed in a circular shape when the inner side surface 31 a is seen in plan view in order to uniformly collect the light emitted from the LED element 20. Furthermore, as shown in FIGS. 1, 3, and 9, the opening 31 is formed so as to expand in a taper shape above the opening 31. As shown in FIG. As described above, the inner side surface 31a of the opening 31 is configured to be able to efficiently reflect the light emitted from the LED element 20 upward. The inner side surface 31a is an example of the “first reflecting surface” in the present invention.

  Here, in the first embodiment, as shown in FIGS. 7 and 9, a stepped portion 33 is formed on the bottom surface 32 of the reflection frame 30. The step portion 33 is composed of a bottom surface portion 33a and a side wall portion 33b, and a region of the bottom surface 32 (a predetermined region on the outer peripheral side of the bottom surface 32) spaced a predetermined distance from the lower opening end 31b of the opening 31. Further, it is formed so as to surround the lower opening end 31b when viewed in plan. That is, the step portion 33 is formed so as to surround the lower opening end 31b with the side wall portion 33b. Further, the step portion 33 is formed integrally with the reflection frame 30 by press working or the like. The step portion 33 and the side wall portion 33b are examples of the “first step portion” and the “first side wall portion” in the present invention, respectively. In addition, a cutout portion 35 having an arcuate cross section is formed in each of the four corner portions formed by the bottom surface portion 33a of the stepped portion 33 and the side surface 34 of the reflection frame 30.

  Moreover, in 1st Embodiment, as shown in FIG.3 and FIG.4, the reflective frame 30 is a thermosetting type silver paste (Ag content rate (after hardening): 94%, thermal conductivity: 85W / m *). It is bonded to the nonpolar electrode layer 6 by the conductive adhesive 10 composed of K). Specifically, after the conductive adhesive 10 is applied on a predetermined region of the nonpolar electrode layer 6 (region corresponding to the bottom surface portion 33a of the stepped portion 33) by screen printing, the reflective frame 30 is formed on the substrate. 1 on the nonpolar electrode layer 6. And the conductive adhesive 10 comprised from Ag paste is hardened | cured by heat processing at predetermined temperature, and the reflective frame 30 is adhere | attached on the nonpolar electrode layer 6. FIG. Thereby, the reflection frame 30 is fixed on the board | substrate 1 so that the LED element 20 may be surrounded by the inner surface 31a of the opening part 31. FIG. Here, since the curing condition of the silver paste constituting the conductive adhesive 10 is 175 ° C./60 minutes to 200 ° C./30 minutes, the temperature of the heat treatment is about 200 ° C. at the maximum. For this reason, since the process by low temperature is possible, it becomes possible to simplify the adhesion process of the reflective frame 30. FIG. The conductive adhesive 10 is an example of the “first conductive adhesive” in the present invention.

  In the first embodiment, the conductive adhesive 10 does not flow out to the inner region of the reflection frame 30 by the side wall 33 b of the step portion 33 formed on the bottom surface 32 of the reflection frame 30. Since it is comprised, it is suppressed that the light of the LED element 20 is irradiated to the conductive adhesive 10. FIG. Thereby, since the discoloration of the conductive adhesive 10 is suppressed, the inconvenience that the light from the LED element 20 is absorbed by the conductive adhesive 10 due to the discoloration of the conductive adhesive 10 occurs. Can be suppressed.

  In the first embodiment, as shown in FIGS. 4 and 5, the notch 35 formed at the bottom of the reflective frame 30 is filled with the insulating member 11 so as to cover the conductive adhesive 10. Yes. Thereby, since it becomes possible to suppress that the conductive adhesive 10 comprised from a silver paste contacts air or moisture, discoloration and deterioration of the conductive adhesive 10 are also suppressed.

  The heat generated by the light emission of the LED element 20 is radiated by the nonpolar electrode layer 6 formed on the upper surface of the insulating base 2 as shown in FIGS. Heat is dissipated also in the heat-dissipating electrode layer 9 thermally connected to the nonpolar electrode layer 6 through the through-hole 2b of the material 2. The heat generated by the light emission of the LED element 20 is also radiated from the reflective frame 30 bonded to the nonpolar electrode layer 6 by the conductive adhesive 10. Furthermore, when the electrode layer 9 is in thermal contact with a heat sink (not shown) of a circuit board (not shown), the heat dissipation effect is further promoted. As described above, the surface-mounted LED 100 according to the first embodiment is configured to be able to effectively dissipate the heat generated in the LED element 20, so that the luminous efficiency due to the temperature rise of the LED element 20 ( The light emission characteristics) are suppressed from being reduced, and high luminance proportional to the amount of current is obtained, and the effects of improving the functionality and life of the surface-mounted LED 100 are obtained.

  Moreover, the translucent member 40 is comprised from resin materials, such as an epoxy resin and a silicone resin, as shown in FIG.1, FIG.2, and FIG.4, In the opening part 31 of the reflective frame 30, The LED element 20 and the bonding wires 22 and 23 are provided to be sealed. The translucent member 40 has a function of suppressing the LED element 20 and the bonding wires 22 and 23 from coming into contact with air or moisture by sealing the LED element 20 and the bonding wires 22 and 23. Yes.

  In the first embodiment, as described above, the reflection frame 30 is made of a metal material mainly composed of aluminum, and the reflection frame 30 is formed of the nonpolar electrode layer 6 on which the LED element 20 is mounted. By adhering with the conductive adhesive 10, the heat generated by the light emission of the LED element 20 can be efficiently transmitted to the reflective frame 30 through the nonpolar electrode layer 6 and transmitted. Heat can be efficiently dissipated from the reflection frame 30. For this reason, even if the LED element 20 generates heat due to light emission, the temperature rise of the LED element 20 can be effectively suppressed, so that the element temperature of the LED element 20 can be kept low. Thereby, since the fall of the light emission characteristic resulting from the raise of element temperature can be suppressed, a favorable light emission characteristic can be acquired.

  In the first embodiment, as described above, the reflective frame 30 is bonded to the nonpolar electrode layer 6 with the conductive adhesive 10, thereby using a resin adhesive made of epoxy resin, acrylic resin, or the like. Unlike the case where the reflecting frame 30 is bonded to the nonpolar electrode layer 6, the bonding process of the reflecting frame 30 can be simplified. That is, when the reflective frame 30 is bonded to the substrate 1 with a resin adhesive composed of an epoxy resin, an acrylic resin, or the like, the reflective frame 30 must be pressed against the substrate 1 at a high pressure. There is an inconvenience that a large high-pressure press or the like is required in the bonding process between the body 30 and the substrate 1. In addition, bubbles easily enter the resin adhesive, and when there are bubbles inside the resin adhesive, the resin adhesive is used in the bonding region between the reflective frame 30 and the substrate 1 (nonpolar electrode layer 6). An unbonded area is formed. For this reason, when the reflecting frame 30 is bonded to the substrate 1 with a resin adhesive, there is also a disadvantage that a defoaming (evacuation) process using a vacuum apparatus is required simultaneously with the high-pressure pressing step. On the other hand, in the configuration of the first embodiment in which the reflective frame 30 is bonded to the nonpolar electrode layer 6 using the conductive adhesive 10, it is possible to suppress the occurrence of the inconveniences described above. The bonding process can be simplified.

  In the configuration of the first embodiment described above, since the nonpolar electrode layer 6 and the polar electrode layers 3 and 4 are electrically separated from each other, the reflection frame 30 is not considered without considering an electrical short circuit. Can be fixed on the substrate 1. For this reason, the reflective frame 30 can be bonded to the nonpolar electrode layer 6 using the conductive adhesive 10 made of a silver paste having a higher thermal conductivity than the resin adhesive.

In the first embodiment, as described above, the stepped portion 33 including the side wall portion 33b is formed on the bottom surface 32 of the reflection frame body 30, so that the conductive adhesive 10 is reflected by the side wall portion 33b. Since it can suppress flowing out to the area | region inside the body 30, it originates in the conductive adhesive 10 flowing out into the area | region inside the reflective frame 30, and the conductive adhesive 10 from LED element 20 to the inside. It is possible to suppress the inconvenience of being irradiated with light. For this reason, since the discoloration and deterioration of the conductive adhesive 10 resulting from light irradiation can be suppressed, the light emission characteristics and reliability are reduced due to the discoloration and deterioration of the conductive adhesive 10. Can be suppressed.
(Second Embodiment)
FIG. 10 is an overall perspective view of the surface-mounted LED according to the second embodiment of the present invention. FIG. 11 is a cross-sectional perspective view of the surface-mounted LED according to the second embodiment of the present invention shown in FIG. 12 to 14 are views for explaining the structure of the surface-mounted LED according to the second embodiment of the present invention shown in FIG. Next, the structure of the surface-mounted LED 200 according to the second embodiment of the present invention will be described with reference to FIGS.

  As shown in FIGS. 10 and 11, the surface-mounted LED 200 according to the second embodiment includes the surface-mounted LED 100 according to the first embodiment, and further includes a reflective frame body on the upper surface of the reflective frame body 30. 130 has a bonded structure. The reflection frame 130 is an example of the “second reflection frame” in the present invention.

  In addition, the reflective frame 130 is made of a metal material mainly composed of aluminum having excellent heat dissipation characteristics, and is formed in a planar shape having substantially the same size as the reflective frame 30. Specifically, as shown in FIG. 13, the reflection frame 130 has a length of about 3.5 mm in the X direction and a length of about 3.5 mm in the Y direction as seen in a plan view. It is formed in the square shape which has thickness. Moreover, the reflective frame 130 has a thickness of about 1 mm to about 5 mm.

  In addition, an opening 131 that penetrates from the upper surface to the lower surface is formed at the center of the reflective frame 130. The opening 131 is configured such that the inner side surface 131a functions as a reflection surface that reflects the light emitted from the LED element 20. Further, the surface of the inner side surface 131a of the opening 131 is subjected to a silver plating process or an alumite process in order to increase the reflectance. As shown in FIG. 13, the opening 131 is formed in a circular shape when the inner surface 131 a is seen in plan view in order to uniformly collect the light emitted from the LED element 20. Furthermore, as shown in FIGS. 11 and 14, the opening 131 is formed so as to expand in a taper shape above the opening 131. Further, as shown in FIG. 11, the opening 131 of the reflection frame 130 has a lower opening end 131 b that is larger in diameter than the upper opening 31 c of the opening 31 of the reflection frame 30. It is configured. The inner surface 131a is an example of the “second reflecting surface” in the present invention.

  Here, in the second embodiment, as shown in FIGS. 12 and 14, a stepped portion 133 is formed on the bottom surface 132 of the reflective frame 130. The step portion 133 includes a bottom surface portion 133a and a side wall portion 133b, and is a region of the bottom surface 132 (a predetermined region on the outer peripheral side of the bottom surface 132) that is spaced a predetermined distance from the lower opening end 131b of the opening 131. Further, it is formed so as to surround the lower opening end 131b when seen in a plan view. That is, the step part 133 is formed so as to surround the lower opening end 131b with the side wall part 133b. Further, the stepped portion 133 is formed integrally with the reflective frame body 130 by pressing or the like. The step portion 133 and the side wall portion 133b are examples of the “second step portion” and the “second side wall portion” in the present invention, respectively. In addition, a cutout portion 135 having an arcuate cross section is formed in each of the four corner portions formed by the bottom surface portion 133a of the stepped portion 133 and the side surface 134 of the reflection frame body 130.

  Moreover, in 2nd Embodiment, as shown in FIG. 11, the electroconductive adhesion comprised from a thermosetting type silver paste (Ag content rate (after hardening): 94%, thermal conductivity: 85W / m * K). The reflective frame 130 is bonded to the upper surface of the reflective frame 30 by the agent 110. Specifically, after the conductive adhesive 110 is applied on a predetermined region on the upper surface of the reflective frame 30 (region corresponding to the bottom surface portion 133a of the stepped portion 133 of the reflective frame 130) by screen printing, The reflection frame body 130 is placed on the reflection frame body 30. The conductive adhesive 110 made of Ag paste is cured by heat treatment at a predetermined temperature, and the reflective frame 130 is bonded to the upper surface of the reflective frame 30. The conductive adhesive 110 is an example of the “second conductive adhesive” in the present invention.

  In the second embodiment, the conductive adhesive 110 does not flow out to the region inside the reflection frame 130 by the side wall portion 133b of the stepped portion 133 formed on the bottom surface 132 of the reflection frame 130 described above. Since it is comprised, it is suppressed that the light of the LED element 20 is irradiated to the conductive adhesive 110. FIG. Thereby, since the discoloration of the conductive adhesive 110 is suppressed, the inconvenience that the light from the LED element 20 is absorbed by the conductive adhesive 110 due to the discoloration of the conductive adhesive 110 occurs. Can be suppressed.

  In the second embodiment, as shown in FIGS. 10 and 11, the notch 135 formed in the bottom of the reflective frame 130 is filled with the insulating member 111 so as to cover the conductive adhesive 110. Yes. For this reason, since it becomes possible to suppress that the conductive adhesive 110 comprised from a silver paste contacts air or moisture, discoloration and deterioration of the conductive adhesive 110 are also suppressed by this.

  Since the inside of the reflective frame 130 is not filled with the translucent member 40, the inner side surface 131 a of the reflective frame 130 is exposed without being covered with the translucent member 40. Yes. For this reason, in the reflective frame 130, the area (heat radiation area) which contacts air is large. Therefore, in the surface-mounted LED 200 of the second embodiment, the heat transferred to the reflection frame 30 can be efficiently radiated from the reflection frame 130. In the above-described configuration, the inner surface 131a of the reflective frame 130 is exposed, and thus the scattered light emitted from the top surface of the translucent member 40 is efficiently diffused to the inner surface of the reflective frame 130. Since it can be reflected by 131a, a desired narrow directivity can be obtained.

  In the second embodiment, as described above, the reflective frame 130 is made of a metal material mainly composed of aluminum, and the reflective frame 130 is formed on the upper surface of the reflective frame 30 using the conductive adhesive 110. By adhering to each other, the heat from the LED element 20 transmitted to the reflective frame 30 can be further efficiently transmitted to the reflective frame 130 and radiated from the reflective frame 130. Thereby, since the heat dissipation characteristic of the surface-mounted LED 200 can be improved more easily, it is possible to easily suppress a decrease in the light emission characteristic due to an increase in element temperature. Thereby, good light emission characteristics can be easily obtained.

  In the second embodiment, as described above, the stepped portion 133 including the side wall portion 133b is formed on the bottom surface 132 of the reflective frame body 130, so that the conductive adhesive 110 is made to be reflected by the side wall portion 133b. Since it can suppress flowing out to the area | region inside the body 130, it originates in the conductive adhesive 110 flowing out into the area | region inside the reflective frame 130, and the conductive adhesive 110 from LED element 20 is carried out. It is possible to suppress the inconvenience of being irradiated with light. For this reason, since the discoloration and deterioration of the conductive adhesive 110 caused by light irradiation can be suppressed, the light emission characteristics and reliability are lowered due to the discoloration and deterioration of the conductive adhesive 110. Can be suppressed.

The remaining effects of the second embodiment are similar to those of the aforementioned first embodiment.
(Third embodiment)
FIG. 15 is an overall perspective view of the surface-mounted LED according to the third embodiment of the present invention. FIG. 16 is a cross-sectional perspective view of the surface-mounted LED according to the third embodiment of the present invention shown in FIG. Subsequently, the structure of the surface-mounted LED 300 according to the third embodiment of the present invention will be described with reference to FIGS. 15 and 16.

  In the surface-mounted LED 300 according to the third embodiment, as shown in FIGS. 15 and 16, the reflective frame body 130 is further bonded to the upper surface of the reflective frame body 230 by the conductive adhesive 110. On the other hand, in the surface mounted LED 300 according to the third embodiment, unlike the first and second embodiments, the reflective frame 230 is formed on the substrate 1 by the resin adhesive 210 made of epoxy resin, acrylic resin, or the like. Bonded (fixed). Specifically, the reflection frame 230 is formed such that at least a part of the bottom surface 232 is a nonpolar electrode by the resin adhesive 210 applied on the outer peripheral region where the nonpolar electrode layer 6 is not formed on the substrate 1. It is adhered on the substrate 1 so as to be in direct contact with the upper surface of the layer 6. That is, the reflection frame 230 is bonded (fixed) on the substrate 1 so as to be in thermal contact with the nonpolar electrode layer 6. The reflective frame body 230 is an example of the “first reflective frame body” in the present invention, and the reflective frame body 130 is an example of the “second reflective frame body” in the present invention.

  Other configurations of the third embodiment are the same as those of the first and second embodiments.

  In the third embodiment, as described above, the reflective frame 230 made of a metal material mainly composed of aluminum is directly in contact with the nonpolar electrode layer 6 on which the LED element 20 is mounted. The LED element is formed by adhering (fixing) the reflective frame 130 to the upper surface of the reflective frame 230 and bonding the reflective frame 130 made of a metal material mainly composed of aluminum using the conductive adhesive 110. The heat generated by the light emission of 20 can be efficiently transmitted to the reflective frame body 230 via the nonpolar electrode layer 6 and also efficiently transmitted to the reflective frame body 130 via the reflective frame body 230. Can do. For this reason, since the heat from the LED element 20 can be efficiently dissipated from both the reflection frame body 230 and the reflection frame body 130, even if the LED element 20 generates heat due to light emission, the temperature rise of the LED element 20 is increased. It can be effectively suppressed. Thereby, since the element temperature of LED element 20 can be kept low, the fall of the light emission characteristic resulting from the raise of element temperature can be suppressed. As a result, good light emission characteristics can be obtained.

  Other effects of the third embodiment are the same as those of the first and second embodiments.

  The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is shown not by the above description of the embodiments but by the scope of claims for patent, and further includes all modifications within the meaning and scope equivalent to the scope of claims for patent.

  For example, in the first to third embodiments, the example in which the present invention is applied to the surface-mounted LED is shown. However, the present invention is not limited to this, and the present invention is applied to light emitting devices other than the surface-mounted LED. May be.

  Moreover, in the said 1st-3rd embodiment, although the example using the conductive adhesive comprised from a silver paste was shown, this invention is not restricted to this, It uses conductive adhesives other than a silver paste. Also good. Examples of the conductive adhesive other than the silver paste include silver wax and silver tin solder.

  Moreover, in the said 1st-3rd embodiment, while providing the notch part in the reflective frame body, and the example which filled the notch part with the insulating member was shown, this invention is not limited to this, Insulating member in the notch part You may make it the structure which is not filled. Moreover, you may make it the structure which does not provide a notch part in a reflective frame.

  Moreover, in the said 1st-3rd embodiment, although the example which formed the reflective film for improving the reflective efficiency of the light from an LED element on the surface of the reflective frame body was shown, this invention is not limited to this. Further, a configuration may be adopted in which a reflective coating is not formed on the surface of the reflective frame.

  Moreover, in the said 1st-3rd embodiment, although the example which comprised the reflective frame body from the metal material which has aluminum as a main component was shown, this invention is not limited to this, pure aluminum, You may comprise from magnesium and another metal material. Moreover, you may comprise a reflective frame body from ceramic materials other than a metal material. Further, the reflection frame may be made of a material in which a metal is dispersed in a resin.

  Moreover, in the said 1st-3rd embodiment, although the example which mounted three LED elements of red, green, and blue was shown, this invention is not limited to this, 1, 2, or Four or more LED elements may be mounted.

  Moreover, in the said 1st-3rd embodiment, although the example which fixed the LED element on the nonpolar electrode layer via the adhesive agent was shown, this adhesive agent has a conductive adhesive with high thermal conductivity, etc. Is also included.

  Moreover, in the said 1st-3rd embodiment, although the example which provided the LED element which is an example of a light emitting element in the light-emitting device was shown, this invention is not restricted to this, Light-emitting elements other than an LED element are used for a light-emitting device. You may make it provide.

  Moreover, in the said 1st-3rd embodiment, although the example which mounted the LED element on the electrode layer (nonpolar electrode layer) which does not have electrical polarity was shown, this invention is not restricted to this, Ground You may comprise so that an LED element may be mounted on the electrode layer grounded. In addition, the electrode layer on which the LED element is mounted may be in a state of being electrically connected to one of a polar electrode layer having a positive polarity and a polar electrode layer having a negative polarity.

  In the second and third embodiments, the translucent member is not filled inside the reflection frame (second reflection frame) bonded to the upper surface of the reflection frame (first reflection frame). However, the present invention is not limited to this, and a translucent member is provided inside the reflective frame (second reflective frame) bonded to the upper surface of the reflective frame (first reflective frame). You may make it the structure filled with. When configured in this way, in a surface-mounted LED configured such that the emitted light becomes white light by dispersing the phosphor in the translucent member, the filling amount of the translucent member may be increased. Therefore, the phosphor can be uniformly dispersed. This makes it possible to reduce chromaticity variation.

  Moreover, in the said 3rd Embodiment, although the example comprised so that a reflective frame and a nonpolar electrode layer might contact directly was shown, this invention is not restricted to this, A reflective frame and a nonpolar electrode layer are Alternatively, it may be configured to contact indirectly through a conductive member such as a conductive paste.

1 is an overall perspective view of a surface-mounted LED according to a first embodiment of the present invention. It is the top view which looked at the surface mount type LED by 1st Embodiment of this invention shown in FIG. 1 from the upper side. FIG. 4 is a cross-sectional view taken along line 400-400 in FIG. 2. It is sectional drawing which expanded and showed a part of surface mount type LED by 1st Embodiment of this invention shown in FIG. It is the top view which looked at the board | substrate of the surface mount type LED by 1st Embodiment of this invention shown in FIG. 1 from the upper side. It is the top view which looked at the surface mount type LED by 1st Embodiment of this invention shown in FIG. 1 from the lower side. FIG. 2 is a perspective view of a reflection frame body of the surface-mounted LED according to the first embodiment of the present invention shown in FIG. 1. It is a top view of the reflective frame of surface mount type LED by 1st Embodiment of this invention shown in FIG. It is sectional drawing along the 450-450 line | wire of FIG. It is a whole perspective view of the surface mount type LED by 2nd Embodiment of this invention. FIG. 11 is a cross-sectional perspective view of the surface-mounted LED according to the second embodiment of the present invention shown in FIG. 10. It is a whole perspective view of the reflection frame body of the upper part side of surface mount type LED by 2nd Embodiment of this invention shown in FIG. It is a top view of the reflective frame body of the upper side of surface mount type LED by 2nd Embodiment of this invention shown in FIG. It is sectional drawing along the 500-500 line | wire of FIG. It is the whole surface mount type LED perspective view by 3rd Embodiment of this invention. FIG. 16 is a cross-sectional perspective view of a surface-mounted LED according to the third embodiment of the present invention shown in FIG. 15. It is sectional drawing which showed an example of the conventional light-emitting device provided with the reflective frame body comprised from the metal material.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Board | substrate 2 Insulation base material 3 Polarized electrode layer (electrode layer, cathode electrode)
4 Polar electrode layer (electrode layer, anode electrode)
5 Insulating groove 6 Nonpolar electrode layer (conductor layer)
10 Conductive adhesive (first conductive adhesive)
11, 111 Insulating member 20 LED element (light emitting element)
22, 23 Bonding wire 30, 230 Reflective frame (first reflective frame)
31, 131 Opening 31a Inner side surface (first reflection surface)
32, 132, 232 Bottom 33 Step part (first step part)
33a Bottom part 33b Side wall part (first side wall part)
40 translucent member 110 conductive adhesive (second conductive adhesive)
130 Reflective frame (second reflective frame)
131a inner side surface (second reflecting surface)
133 Step part (second step part)
133a Bottom face part 133b Side wall part (second side wall part)
100, 200, 300 Surface mount type LED (light emitting device)

Claims (15)

A substrate having a conductor layer formed on a main surface;
A light emitting device mounted on a predetermined region of the conductor layer;
A plurality of electrode layers formed on the main surface of the substrate for supplying power to the light emitting element;
A first reflective frame that is made of a heat dissipating material and whose inner peripheral surface is a first reflective surface that reflects light from the light emitting element;
The plurality of electrode layers include a cathode electrode and an anode electrode,
The conductor layer is electrically separated from at least one of the cathode electrode and the anode electrode;
The light emitting device, wherein the first reflective frame is adhered to the conductor layer with a first conductive adhesive so as to surround the light emitting element. A first step portion is formed at the bottom of the first reflection frame,
The said 1st level | step-difference part has a 1st side wall part which suppresses that the said 1st conductive adhesive flows out to the area | region inside the said 1st reflective frame, The said 1st step part is characterized by the above-mentioned. The light-emitting device of description.   The light emitting device according to claim 1, wherein the first conductive adhesive is made of a silver paste.   The light emitting device according to any one of claims 1 to 3, wherein the heat dissipating material constituting the first reflecting frame is a metal material.   The said conductor layer is comprised so that it may not have an electrical polarity by electrically isolate | separating from the said electrode layer mutually, The any one of Claims 1-4 characterized by the above-mentioned. The light emitting device according to 1. A second reflective frame that is made of a heat dissipating material and has an inner peripheral surface that serves as a second reflective surface that reflects light from the light emitting element;
The light emitting device according to claim 1, wherein the second reflective frame is bonded to the upper surface of the first reflective frame with a second conductive adhesive. A second step portion is formed at the bottom of the second reflecting frame,
The said 2nd level | step-difference part has a 2nd side wall part which suppresses that the said 2nd conductive adhesive flows out inside a said 2nd reflective frame, The said 6th aspect is characterized by the above-mentioned. Light emitting device.   The light emitting device according to claim 6 or 7, wherein the second conductive adhesive is made of a silver paste.   The light emitting device according to any one of claims 6 to 8, wherein the heat dissipating material constituting the second reflecting frame is a metal material. A substrate having a conductor layer formed on a main surface;
A light emitting device mounted on a predetermined region of the conductor layer;
A plurality of electrode layers formed on the main surface of the substrate for supplying power to the light emitting element;
The substrate is adhered to the substrate with an insulating adhesive, and is configured to be in direct contact with the conductor layer or indirectly through a conductive member, and an inner peripheral surface is light from the light emitting element. A first reflecting frame that is a first reflecting surface that reflects
A second reflective frame that is bonded to the upper surface of the first reflective frame by a conductive adhesive and has an inner peripheral surface serving as a second reflective surface that reflects light from the light emitting element;
The first reflection frame body and the second reflection frame body are each composed of a heat dissipation material, and the plurality of electrode layers include a cathode electrode and an anode electrode,
The light emitting device, wherein the conductor layer is electrically separated from at least one of the cathode electrode and the anode electrode. A step portion is formed at the bottom of the second reflection frame,
11. The light emitting device according to claim 10, wherein the stepped portion has a side wall portion that suppresses the conductive adhesive from flowing out to a region inside the second reflection frame.   The light emitting device according to claim 10 or 11, wherein the conductive adhesive is made of a silver paste.   13. The light-emitting device according to claim 10, wherein each of the heat dissipating materials constituting the first reflecting frame and the second reflecting frame is a metal material.   The said conductor layer is comprised so that it may not have electrical polarity by electrically isolate | separating from the said electrode layer mutually, The any one of Claims 10-13 characterized by the above-mentioned. The light emitting device according to 1.   The light emitting device according to claim 1, wherein the light emitting element is a light emitting diode element.

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