CN101996985B - Light-emitting diode (LED) encapsulation structure capable of positioning heat-conducting adhesive material and manufacturing method thereof - Google Patents
Light-emitting diode (LED) encapsulation structure capable of positioning heat-conducting adhesive material and manufacturing method thereof Download PDFInfo
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- CN101996985B CN101996985B CN2009101636992A CN200910163699A CN101996985B CN 101996985 B CN101996985 B CN 101996985B CN 2009101636992 A CN2009101636992 A CN 2009101636992A CN 200910163699 A CN200910163699 A CN 200910163699A CN 101996985 B CN101996985 B CN 101996985B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
- H01L2224/92—Specific sequence of method steps
- H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
- H01L2224/9222—Sequential connecting processes
- H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
- H01L2224/92247—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a wire connector
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Abstract
The invention discloses an LED encapsulation structure capable of positioning a heat-conducting adhesive material, which comprises a substrate unit, a heat-conducting adhesive unit, a light-emitting unit, a conductive unit and an encapsulation unit, wherein the substrate unit has a substrate main body and at least one depressed space formed on the upper surface of the substrate main body; the heat-conductive adhesive unit has at least one heat-conducting adhesive layer positioned in the depressed space of the substrate unit; the light emitting unit has a plurality of LED crystal particles which are arranged on the heat-conducting adhesive layer and accommodated in the at least one depressed space; the conductive unit has a plurality of leads to electrically connect the LED crystal particles and the substrate unit respectively; and the encapsulation unit has light-transmitting encapsulation colloid which is formed on the upper surface of the substrate main body to cover the LED crystal particles and the leads. The LED encapsulation structure ensures that the LED crystal particles can be positioned well and that a better radiation effect can be achieved.
Description
Technical field
The present invention relates to a kind of package structure for LED and preparation method thereof, refer to a kind of package structure for LED of locating the heat conduction sticky material and preparation method thereof especially.
Background technology
The invention of electric light can be described as the life style that has changed the whole mankind up hill and dale, if our life does not have electric light, when night or weather conditions are not good, the work of all will be stopped; If be subject to illumination, building construction mode or human life style are thoroughly changed, therefore the whole mankind will can't improve, the age that stays on and fall behind.
So, today employed on the market lighting apparatus, for example: fluorescent lamp, tungsten lamp even the more popular till now Electricity-saving lamp bulb of being accepted are widely used in the middle of the daily life all.Yet this type of electric light has fast, the high power consumption of optical attenuation mostly, be easy to generate high heat, the life-span is short, frangible or shortcoming such as difficult recovery.Moreover the color rendering of traditional fluorescent lamp is relatively poor, so produce pale light and be out of favour; In addition because principle of luminosity is the flowing of second of fluorescent tube two utmost point electronics 120 times fast, just to open and electric current causes flicker when unstable easily, this phenomenon is considered to cause the arch-criminal of domestic high rate of myopia usually; But this problem can solve by means of the fluorescent tube of repacking with " high-frequency electrical minor stabilizer "; Its high-frequency electrical minor stabilizer not only can fall 20% to the power consumption of traditional fluorescent lamp again, and when lighting a lamp because of high frequency moment again, the light wave of output is highly stable; Therefore almost flicker free takes place; And when power supply voltage variation or fluorescent tube are in low temperature, be not easy to produce flicker, this helps the protection of eyesight.Yet the stabilizer of general Electricity-saving lamp bulb and power-saving lighting tube all is fixed, if eliminate the words of trade-in; Must connect stabilizer abandons together; Moreover no matter fluorescent tube how power saving again,, still inevitably environment is caused serious pollution after discarded because of it contains the coating of mercury.Therefore, in order to solve the above problems, light emitting diode bulb or light-emitting diode lamp tube in response to and give birth to.
Summary of the invention
Technical problem to be solved by this invention is to provide a kind of package structure for LED of locating the heat conduction sticky material and preparation method thereof.See through the use of sinking space, so that LED crystal particle of the present invention not only can obtain the preferred positioning effect, and see through the use of heat conduction adhesion coating, so that LED crystal particle of the present invention can reach preferable radiating effect.
In order to solve the problems of the technologies described above; According to wherein a kind of scheme of the present invention; A kind of package structure for LED of locating the heat conduction sticky material is provided, and it comprises: a base board unit, heat conduction adhesion unit, a luminescence unit, a conductive unit and an encapsulation unit.Wherein, This base board unit has a substrate body, at least one sinking space that forms in this substrate body upper surface, a plurality of anodal conductive welding pad that is exposed to this substrate body upper surface, and a plurality of negative pole conductive welding pad that are exposed to this substrate body upper surface, and wherein this substrate body has heat dissipating layer, and the reflective insulating barrier that is arranged at this circuit substrate upper surface and is used to expose those anodal conductive welding pad and those negative pole conductive welding pad that a circuit substrate, is arranged at this circuit substrate bottom.This heat conduction adhesion unit has at least one sinking space that is positioned this base board unit and is arranged at the heat conduction adhesion coating on this circuit substrate, and wherein said at least one heat conduction adhesion coating and this heat dissipating layer are separated from one another.This luminescence unit has many and is arranged on this heat conduction adhesion coating and is placed in the LED crystal particle in above-mentioned at least one sinking space, and wherein each LED crystal particle has a positive terminal and a negative pole end.This conductive unit has many leads, and wherein per two leads are electrically connected between positive terminal and each the anodal conductive welding pad of each LED crystal particle respectively and are electrically connected between the negative pole end and each negative pole conductive welding pad of each LED crystal particle.This encapsulation unit has one and forms in this substrate body upper surface to cover the printing opacity packing colloid of those LED crystal particles and those leads.
In order to solve the problems of the technologies described above; According to wherein a kind of scheme of the present invention; A kind of package structure for LED of locating the heat conduction sticky material is provided, and it comprises: a base board unit, heat conduction adhesion unit, a luminescence unit, a conductive unit and an encapsulation unit.Wherein, This base board unit has a substrate body, a plurality of sinking space that forms in this substrate body upper surface, a plurality of anodal conductive welding pad that is exposed to this substrate body upper surface, and a plurality of negative pole conductive welding pad that are exposed to this substrate body upper surface, and wherein this substrate body has heat dissipating layer, and the reflective insulating barrier that is arranged at this circuit substrate upper surface and is used to expose those anodal conductive welding pad and those negative pole conductive welding pad that a circuit substrate, is arranged at this circuit substrate bottom.This heat conduction adhesion unit has in a plurality of those sinking space that are positioned this base board unit respectively and is arranged at the heat conduction adhesion coating on this circuit substrate, and wherein a plurality of said heat conduction adhesion coatings and this heat dissipating layer are separated from one another.This luminescence unit has many LED crystal particles that are arranged on this heat conduction adhesion coating respectively and are placed in those sinking space respectively, and wherein each LED crystal particle has a positive terminal and a negative pole end.This conductive unit has many leads, and wherein per two leads are electrically connected between positive terminal and each the anodal conductive welding pad of each LED crystal particle respectively and are electrically connected between the negative pole end and each negative pole conductive welding pad of each LED crystal particle.This encapsulation unit has one and forms in this substrate body upper surface to cover the printing opacity packing colloid of those LED crystal particles and those leads.
In order to solve the problems of the technologies described above; According to wherein a kind of scheme of the present invention; A kind of manufacture method of locating the package structure for LED of heat conduction sticky material is provided; It comprises the following steps: at first; One base board unit is provided; It has a substrate body, at least one sinking space that forms in this substrate body upper surface, a plurality of anodal conductive welding pad that is exposed to this substrate body upper surface, and a plurality of negative pole conductive welding pad that are exposed to this substrate body upper surface, and wherein this substrate body has heat dissipating layer, and the reflective insulating barrier that is arranged at this circuit substrate upper surface and is used to expose those anodal conductive welding pad and those negative pole conductive welding pad that a circuit substrate, is arranged at this circuit substrate bottom; Next, a plurality of heat conduction adhesion balls are put into this sinking space and are arranged on this circuit substrate, wherein a plurality of said heat conduction adhesion balls and this heat dissipating layer are separated from one another; Then, many LED crystal particles are arranged at respectively on those heat conduction adhesion balls, wherein each LED crystal particle has a positive terminal and a negative pole end; And then, cross tin stove (reflow), those LED crystal particles are positioned the heat conduction adhesion coating in the sinking space of this base board unit so that those heat conduction adhesion balls form one; Next; See through many leads; Each LED crystal particle being electrically connected between each anodal conductive welding pad and each the negative pole conductive welding pad, wherein per two leads are electrically connected between positive terminal and each the anodal conductive welding pad of each LED crystal particle respectively and are electrically connected between the negative pole end and each negative pole conductive welding pad of each LED crystal particle; At last, the printing opacity packing colloid that is shaped is in this substrate body upper surface, to cover those LED crystal particles and those leads.
Therefore; Beneficial effect of the present invention is: the present invention sees through one or more sinking space of design on substrate body, with ccontaining a plurality of heat conduction adhesion coatings (for example tin ball or tin cream) and ccontaining a plurality of LED crystal particle that is positioned over respectively on those heat conduction adhesion coatings.Therefore, see through the use of sinking space, so that those LED crystal particles not only can obtain the preferred positioning effect, and see through the use of those heat conduction adhesion coatings, so that those LED crystal particles can reach preferable radiating effect.
Reach technology, means and the effect that predetermined purpose is taked in order further to understand the present invention; See also following about detailed description of the present invention and accompanying drawing; Believe the object of the invention, characteristic and characteristics; Go deep into and concrete understanding when getting one thus, yet accompanying drawing only provides reference and explanation usefulness, is not to be used for the present invention is limited.
Description of drawings
Fig. 1 is the flow chart of first embodiment of manufacture method of the present invention;
Figure 1A to Fig. 1 J is respectively the part of first embodiment of package structure for LED of the present invention and makes schematic flow sheet;
Fig. 1 K is the generalized section of first embodiment of package structure for LED of the present invention;
Fig. 2 is the generalized section of second embodiment of package structure for LED of the present invention;
Fig. 3 is the generalized section of the 3rd embodiment of package structure for LED of the present invention;
Fig. 4 is the flow chart of the 4th embodiment of the manufacture method of package structure for LED of the present invention;
Fig. 4 A to Fig. 4 J is respectively the part of the 4th embodiment of package structure for LED of the present invention and makes schematic flow sheet; And
Fig. 4 K is the top sketch map of the 4th embodiment of package structure for LED of the present invention.
[main element description of reference numerals]
Heat dissipating layer 101
Reflective insulating barrier 102
Anodal conductive welding pad 11a
Negative pole conductive welding pad 11b
Crystal area 11
Luminescence unit 2 LED crystal particles 20
Positive terminal P
Negative pole end N
The reflective colloid 30 of reflecting unit 3 circulating types
The spacing space 300 of colloid
Encapsulation unit 4 printing opacity packing colloids 40
Conductive unit W lead Wa
Heat conduction adhesion ball B heat conduction adhesion coating H
Nickel/palladium/gold layer M
Circular arc tangential line T
Angle θ
Height h
White light beam L
Embodiment
See also shown in Figure 1; First embodiment of the invention provides a kind of manufacture method of locating the package structure for LED of heat conduction sticky material; It comprises: at first; One base board unit is provided, and it has a substrate body, at least one sinking space that forms in this substrate body upper surface, a plurality of anodal conductive welding pad that is exposed to this substrate body upper surface, and a plurality of negative pole conductive welding pad that are exposed to this substrate body upper surface; Then, a plurality of heat conduction adhesion balls (or heat conduction adhesion cream) are put into this sinking space; Then, many LED crystal particles are arranged at respectively on those heat conduction adhesion balls, wherein each LED crystal particle has a positive terminal and a negative pole end; Next, cross tin stove (reflow), those LED crystal particles are positioned the heat conduction adhesion coating in the sinking space of this base board unit so that those heat conduction adhesion balls form one; And then; See through many leads; Each LED crystal particle being electrically connected between each anodal conductive welding pad and each the negative pole conductive welding pad, wherein per two leads are electrically connected between positive terminal and each the anodal conductive welding pad of each LED crystal particle respectively and are electrically connected between the negative pole end and each negative pole conductive welding pad of each LED crystal particle; At last, the printing opacity packing colloid that is shaped is in this substrate body upper surface, to cover those LED crystal particles and those leads.
Please cooperate Fig. 1 and consult shown in Figure 1A to Fig. 1 K, below with " can locate the manufacture method of the package structure for LED of heat conduction sticky material " that first embodiment of the invention disclosed, carry out the description of thin portion:
Please cooperate shown in Fig. 1, Figure 1A and Figure 1B (Figure 1B is the side-looking generalized section of Figure 1A); At first; One base board unit 1 is provided, and it has a substrate body 10, at least one sinking space 10a that forms in these substrate body 10 upper surfaces, a plurality of anodal conductive welding pad 11a that is exposed to these substrate body 10 upper surfaces, and a plurality of negative pole conductive welding pad 11b (step S100) that are exposed to these substrate body 10 upper surfaces.Wherein, above-mentioned at least one sinking space 10a is a trapezoidal shape groove, and this base board unit 1 have one be arranged at these substrate body 10 upper surfaces crystal area 11.
In addition, this substrate body 10 have a circuit substrate 100, be arranged at these circuit substrate 100 bottoms heat dissipating layer 101, and one be arranged at these circuit substrate 100 upper surfaces and be used to expose those anodal conductive welding pad 11a, this negative pole conductive welding pad 11b and a part is positioned at the reflective insulating barrier 102 of the bottom surface 100a of this sinking space 10a.Therefore; This heat dissipating layer 101 can be used for increasing the heat dissipation of this circuit substrate 100, and those reflective insulating barriers 102 are a kind of welding resisting layer that can be used for only letting those anodal conductive welding pad 11a and those negative pole conductive welding pad 11b expose out and reach the limitation welding region.Yet above-mentioned is not that the substrate of any pattern is all the applicable category of the present invention in order to qualification the present invention for defining of substrate body 10.For example: this substrate body 10 can be a printed circuit board (PCB), a soft base plate, an aluminium base, a ceramic substrate or a copper base.
Please cooperate shown in Fig. 1, Fig. 1 C and Fig. 1 D (Fig. 1 D is the side-looking generalized section of Fig. 1 C), a plurality of heat conduction adhesion ball (or heat conduction adhesion cream) B are put into this sinking space 10a (step S102).That is B is held in place on the bottom surface 100a in this sinking space 10a with those heat conduction adhesion balls, and each heat conduction adhesion ball B can be tin ball or tin cream.
Please cooperate shown in Fig. 1, Fig. 1 E and Fig. 1 F (Fig. 1 F is the side-looking generalized section of Fig. 1 E); Many LED crystal particles 20 are arranged at respectively on those heat conduction adhesion balls B, and wherein each LED crystal particle 20 has a positive terminal P and a negative pole end N (step S104).Wherein, those LED crystal particles 20 are arranged on the crystal area 11 of this base board unit 1 electrically, and the bottom of each LED crystal particle 20 has one nickel/palladium/gold (Ni/Pd/Au) layer M.
Please cooperate shown in Fig. 1, Fig. 1 G and Fig. 1 H (Fig. 1 H is the side-looking generalized section of Fig. 1 G); Cross tin stove (reflow), those LED crystal particles 20 are positioned the heat conduction adhesion coating H (step S106) in the sinking space 10a of this base board unit 1 so that those heat conduction adhesion ball B forms one.Because the bottom of each LED crystal particle 20 has one nickel/palladium/gold (Ni/Pd/Au) layer M, so this each nickel/palladium/gold layer M forms between this heat conduction adhesion coating H and each LED crystal particle 20.By means of the use of this nickel/palladium/gold layer M, forming one, and then guarantee the luminous mass of those LED crystal particles 20 as the overcoat between those LED crystal particles 20 and this heat conduction adhesion coating H.
Please cooperate shown in Fig. 1, Fig. 1 I and Fig. 1 J (Fig. 1 J is the side-looking generalized section of Fig. 1 I); See through many lead Wa; Each LED crystal particle 20 being electrically connected between each anodal conductive welding pad 11a and each the negative pole conductive welding pad 11b, wherein per two lead Wa are electrically connected between positive terminal P and each the anodal conductive welding pad 11a of each LED crystal particle 20 respectively and are electrically connected between negative pole end N and each the negative pole conductive welding pad 11b of each LED crystal particle 20 (step S108).
Please cooperate shown in Fig. 1 and Fig. 1 K, the printing opacity packing colloid 40 that is shaped is in these substrate body 10 upper surfaces, to cover those LED crystal particles 20 and those leads Wa (step S110).
The example of being takeed with first embodiment of the invention; Each LED crystal particle 20 can be a blue LED crystal grain; And this printing opacity packing colloid 40 can be a fluorescent colloid; Therefore the blue light beam (figure does not show) that cast out of those LED crystal particles 20 (those blue LED crystal grain) can directly pass this printing opacity packing colloid 40 (this fluorescent colloid) or through throwing away from this printing opacity packing colloid 40 after those reflective insulating barriers 102 reflections, to produce the white light beam L in similar fluorescent lamp source again.
Therefore; Please consult shown in Fig. 1 K once more; First embodiment of the invention provides a kind of package structure for LED of locating the heat conduction sticky material, and it comprises: a base board unit 1, heat conduction adhesion unit, a luminescence unit 2, a conductive unit W and an encapsulation unit 4.
Wherein, this base board unit 1 has a substrate body 10, at least one sinking space 10a that forms in these substrate body 10 upper surfaces, a plurality of anodal conductive welding pad 11a that is exposed to these substrate body 10 upper surfaces, and a plurality of negative pole conductive welding pad 11b that are exposed to these substrate body 10 upper surfaces.In addition; This heat conduction adhesion unit has the heat conduction adhesion coating H at least one sinking space 10a that is positioned this base board unit 1, and serve as reasons many tin balls or tin cream of this heat conduction adhesion coating H crossed formed heat conduction adhesion coating layer (for example shown in Fig. 1 F and Fig. 1 H) behind the tin stove.This luminescence unit 2 has many and is arranged at this heat conduction adhesion coating H and goes up and be placed in the LED crystal particle 20 in above-mentioned at least one sinking space 10a, and wherein each LED crystal particle 20 has a positive terminal P and a negative pole end N.
Moreover; This conductive unit W has many lead Wa, and wherein per two lead Wa are electrically connected between positive terminal P and each the anodal conductive welding pad 11a of each LED crystal particle 20 respectively and are electrically connected between the negative pole end N and each negative pole conductive welding pad 11b of each LED crystal particle 20.In other words, the positive terminal P of each LED crystal particle 20 and negative pole end N see through per two lead Wa and are electrically connected at each anodal conductive welding pad 11a and each negative pole conductive welding pad 11b respectively.In addition, this encapsulation unit 4 has one and forms in these substrate body 10 upper surfaces to cover the printing opacity packing colloid 40 of those LED crystal particles 20 and those leads Wa.
In addition; First embodiment of the invention further comprises: a plurality of nickel/palladium/gold (Ni/Pd/Au) layer M that are arranged at those LED crystal particle 20 bottoms respectively, wherein each nickel/palladium/gold layer M forms between this heat conduction adhesion coating H and each LED crystal particle 20.
See also shown in Figure 2; The maximum difference of the second embodiment of the invention and first embodiment is: in a second embodiment; Reflective insulating barrier 102 is not tangible in sinking space 10a, so this heat conduction adhesion coating H and those LED crystal particles 20 just are positioned at the bottom of this sinking space 10a.
See also shown in Figure 3; Third embodiment of the invention and the maximum difference of above-mentioned other embodiment are: in the 3rd embodiment; Can be in being shaped a printing opacity packing colloid 40 before the step of these substrate body 10 upper surfaces, the reflective colloid 30 of a circulating type (reflecting unit 3) that is shaped earlier is in these substrate body 10 upper surfaces.
For example: in the upper surface of the substrate body 10 of each base board unit 1 around the ground reflective colloid 30 of a circulating type that is shaped; Wherein the reflective colloid 30 of each circulating type centers on the LED crystal particle 20 on those crystal areas (as the crystal area shown in Figure 1A 11) that are arranged at each base board unit 1, to form a plurality of spacing spaces 300 of colloid that lay respectively at those substrate body 10 tops.In addition; In the step of the reflective colloid 30 of those circulating types of above-mentioned shaping; Further comprise: the upper surface in the substrate body 10 of each base board unit 1 is coated with liquid glue material (figure does not show) around ground; This liquid state glue material can optionally be surrounded into a predetermined shape (for example circular, square, rectangle or the like), then curing should liquid state glue material to form the reflective colloid 30 of those circulating types, wherein the reflective colloid 30 of this circulating type can be one be mixed with inorganic additive the white hot reflective colloid that hardens.
Wherein, The thixotropic index of this liquid state glue material (thixotropic index) is between 4-6; Be coated with this liquid state glue material in the pressure of these substrate body 10 upper surfaces between 350-450kpa; Be coated with this liquid state glue material in the speed of these substrate body 10 upper surfaces between 5-15mm/s, be identical position in the starting point of these substrate body 10 upper surfaces with terminating point around ground this liquid state glue material of coating, this liquid state glue material sees through the mode of toasting and hardens; The temperature of baking is between the 120-140 degree, and the time of baking is between 20-40 minute.
Moreover; Can know by Fig. 3; The upper surface of the reflective colloid 30 of this circulating type can be a circular arc; The reflective colloid 30 of this circulating type with respect to the angle θ of the circular arc tangential line T of these substrate body 10 upper surfaces between 40～50 degree; Between 0.3～0.7mm, the width of the reflective colloid of this circulating type 30 bottoms is between 1.5～3mm, and the thixotropic index of the reflective colloid 30 of this circulating type (thixotropic index) is between 4-6 with respect to the height h of these substrate body 10 upper surfaces for the end face of the reflective colloid 30 of this circulating type.
See also shown in Figure 4; Fourth embodiment of the invention provides a kind of manufacture method of locating the package structure for LED of heat conduction sticky material; It comprises: at first; One base board unit is provided, and it has a substrate body, a plurality of sinking space that forms in this substrate body upper surface, a plurality of anodal conductive welding pad that is exposed to this substrate body upper surface, and a plurality of negative pole conductive welding pad that are exposed to this substrate body upper surface; Then, a plurality of heat conduction adhesion balls (or heat conduction adhesion cream) are put into those sinking space respectively; Then, many LED crystal particles are arranged at respectively on those heat conduction adhesion balls, wherein each LED crystal particle has a positive terminal and a negative pole end; Next, cross tin stove (reflow), so that those heat conduction adhesion balls form the heat conduction adhesion coating in a plurality of those sinking space that those LED crystal particles are positioned this base board unit respectively respectively; And then; See through many leads; Each LED crystal particle being electrically connected between each anodal conductive welding pad and each the negative pole conductive welding pad, wherein per two leads are electrically connected between positive terminal and each the anodal conductive welding pad of each LED crystal particle respectively and are electrically connected between the negative pole end and each negative pole conductive welding pad of each LED crystal particle; At last, the printing opacity packing colloid that is shaped is in this substrate body upper surface, to cover those LED crystal particles and those leads.
Please cooperate Fig. 4 and consult shown in Fig. 4 A to Fig. 4 K, below with " can locate the manufacture method of the package structure for LED of heat conduction sticky material " that fourth embodiment of the invention disclosed, carry out the description of thin portion:
Please cooperate shown in Fig. 4, Fig. 4 A and Fig. 4 B (Fig. 4 B is the side-looking generalized section of Fig. 4 A); At first; One base board unit 1 is provided, and it has a substrate body 10, a plurality of sinking space 10a that forms in these substrate body 10 upper surfaces, a plurality of anodal conductive welding pad 11a that is exposed to these substrate body 10 upper surfaces, and a plurality of negative pole conductive welding pad 11b (step S200) that are exposed to these substrate body 10 upper surfaces.Wherein, each sinking space 10a is a cup-shaped groove, and this base board unit 1 have one be arranged at these substrate body 10 upper surfaces crystal area 11.
In addition, this substrate body 10 have a circuit substrate 100, be arranged at these circuit substrate 100 bottoms heat dissipating layer 101, and one be arranged at these circuit substrate 100 upper surfaces and be used to expose those anodal conductive welding pad 11a, this negative pole conductive welding pad 11b and a part is positioned at the reflective insulating barrier 102 of the bottom surface 100a of this sinking space 10a.
Please cooperate shown in Fig. 4, Fig. 4 C and Fig. 4 D (Fig. 4 D is the side-looking generalized section of Fig. 4 C), a plurality of heat conduction adhesion ball (or heat conduction adhesion cream) B are put into those sinking space 10a (step S202) respectively.That is, each heat conduction adhesion ball B is held in place on the bottom surface 100a in each sinking space 10a, and each heat conduction adhesion ball B can be tin ball or tin cream.
Please cooperate shown in Fig. 4, Fig. 4 E and Fig. 4 F (Fig. 4 F is the side-looking generalized section of Fig. 4 E); Many LED crystal particles 20 are arranged at respectively on those heat conduction adhesion balls B, and wherein each LED crystal particle 20 has a positive terminal P and a negative pole end N (step S204).Wherein, those LED crystal particles 20 are arranged on the crystal area 11 of this base board unit 1 electrically, and the bottom of each LED crystal particle 20 has one nickel/palladium/gold (Ni/Pd/Au) layer M.
Please cooperate shown in Fig. 4, Fig. 4 G and Fig. 4 H (Fig. 4 H is the side-looking generalized section of Fig. 4 G); Cross tin stove (reflow), so that those heat conduction adhesion ball B forms the heat conduction adhesion coating H (step S206) in a plurality of those sinking space 10a that those LED crystal particles 20 are positioned this base board unit 1 respectively respectively.Because the bottom of each LED crystal particle 20 has one nickel/palladium/gold (Ni/Pd/Au) layer M, so this each nickel/palladium/gold layer M forms between each heat conduction adhesion coating H and each LED crystal particle 20.By means of the use of this nickel/palladium/gold layer M, forming one, and then guarantee the luminous mass of those LED crystal particles 20 as the overcoat between each LED crystal particle 20 and each the heat conduction adhesion coating H.
Please cooperate shown in Fig. 4, Fig. 4 I and Fig. 4 J (Fig. 4 J is the side-looking generalized section of Fig. 4 I); See through many lead Wa; Each LED crystal particle 20 being electrically connected between each anodal conductive welding pad 11a and each the negative pole conductive welding pad 11b, wherein per two lead Wa are electrically connected between positive terminal P and each the anodal conductive welding pad 11a of each LED crystal particle 20 respectively and are electrically connected between negative pole end N and each the negative pole conductive welding pad 11b of each LED crystal particle 20 (step S208).
Please cooperate shown in Fig. 4 and Fig. 4 K, the printing opacity packing colloid 40 that is shaped is in these substrate body 10 upper surfaces, to cover those LED crystal particles 20 and those leads Wa (step S210).
The example of being takeed with fourth embodiment of the invention; Each LED crystal particle 20 can be a blue LED crystal grain; And this printing opacity packing colloid 40 can be a fluorescent colloid; Therefore the blue light beam (figure does not show) that cast out of those LED crystal particles 20 (those blue LED crystal grain) can directly pass this printing opacity packing colloid 40 (this fluorescent colloid) or through throwing away from this printing opacity packing colloid 40 after those reflective insulating barriers 102 reflections, to produce the white light beam L in similar fluorescent lamp source again.
Therefore; Please consult shown in Fig. 4 K once more; Fourth embodiment of the invention provides a kind of package structure for LED of locating the heat conduction sticky material, and it comprises: a base board unit 1, heat conduction adhesion unit, a luminescence unit 2, a conductive unit W and an encapsulation unit 4.
Wherein, this base board unit 1 has a substrate body 10, a plurality of sinking space 10a that forms in these substrate body 10 upper surfaces, a plurality of anodal conductive welding pad 11a that is exposed to these substrate body 10 upper surfaces, and a plurality of negative pole conductive welding pad 11b that are exposed to these substrate body 10 upper surfaces.In addition; This heat conduction adhesion unit has the heat conduction adhesion coating H in a plurality of those sinking space 10a that are positioned this base board unit 1 respectively, and serve as reasons many tin balls or tin cream of each heat conduction adhesion coating H crossed formed heat conduction adhesion coating layer (for example shown in Fig. 4 C and Fig. 4 D) behind the tin stove.This luminescence unit 2 has many and is arranged at this heat conduction adhesion coating H respectively and goes up and be placed in respectively the LED crystal particle 20 in those sinking space 10a, and wherein each LED crystal particle 20 has a positive terminal P and a negative pole end N.
Moreover; This conductive unit W has many lead Wa, and wherein per two lead Wa are electrically connected between positive terminal P and each the anodal conductive welding pad 11a of each LED crystal particle 20 respectively and are electrically connected between the negative pole end N and each negative pole conductive welding pad 11b of each LED crystal particle 20.In other words, the positive terminal P of each LED crystal particle 20 and negative pole end N see through per two lead Wa and are electrically connected at each anodal conductive welding pad 11a and each negative pole conductive welding pad 11b respectively.In addition, this encapsulation unit 4 has one and forms in these substrate body 10 upper surfaces to cover the printing opacity packing colloid 40 of those LED crystal particles 20 and those leads Wa.
In addition; Fourth embodiment of the invention further comprises: a plurality of nickel/palladium/gold (Ni/Pd/Au) layer M that are arranged at those LED crystal particle 20 bottoms respectively, wherein each nickel/palladium/gold layer M forms between each heat conduction adhesion coating H and each LED crystal particle 20.
In sum, the present invention sees through one or more sinking space of design on substrate body, with ccontaining a plurality of heat conduction adhesion coatings (for example tin ball or tin cream) and ccontaining a plurality of LED crystal particle that is positioned over respectively on those heat conduction adhesion coatings.Therefore, see through the use of sinking space, so that those LED crystal particles not only can obtain the preferred positioning effect, and see through the use of those heat conduction adhesion coatings, so that those LED crystal particles can reach preferable radiating effect.
But; All scopes of the present invention should be as the criterion with described claim; All closing in the embodiment of the spirit variation similar of claim of the present invention with it; All should be contained in the category of the present invention, any those of ordinary skill in the field of the invention, can think easily and variation or revise all can be encompassed in the claim protection range of this case.
Claims (10)
1. the package structure for LED that can locate the heat conduction sticky material is characterized in that, comprising:
One base board unit; It has a substrate body, at least one sinking space that forms in this substrate body upper surface, a plurality of anodal conductive welding pad that is exposed to this substrate body upper surface, and a plurality of negative pole conductive welding pad that are exposed to this substrate body upper surface, and wherein this substrate body has heat dissipating layer, and the reflective insulating barrier that is arranged at this circuit substrate upper surface and is used to expose those anodal conductive welding pad and those negative pole conductive welding pad that a circuit substrate, is arranged at this circuit substrate bottom;
One heat conduction adhesion unit, it has at least one sinking space that is positioned this base board unit and is arranged at the heat conduction adhesion coating on this circuit substrate, and wherein said at least one heat conduction adhesion coating and this heat dissipating layer are separated from one another;
One luminescence unit, it has many and is arranged on this heat conduction adhesion coating and is placed in the LED crystal particle in above-mentioned at least one sinking space, and wherein each LED crystal particle has a positive terminal and a negative pole end;
One conductive unit; It has many leads, and wherein per two leads are electrically connected between positive terminal and each the anodal conductive welding pad of each LED crystal particle respectively and are electrically connected between the negative pole end and each negative pole conductive welding pad of each LED crystal particle; And
One encapsulation unit, it has one and forms in this substrate body upper surface to cover the printing opacity packing colloid of those LED crystal particles and those leads.
2. package structure for LED of locating the heat conduction sticky material as claimed in claim 1; It is characterized in that; Further comprise: a reflecting unit; It has one and sees through the mode of coating and form in the reflective colloid of circulating type of this substrate body upper surface around ground, and the reflective colloid of this circulating type extends to a terminating point from a starting point, and this starting point is identical with the position of this terminating point; Wherein the reflective colloid of this circulating type is around those LED crystal particles; With form one be positioned at this substrate body top the spacing space of colloid, and this printing opacity packing colloid is limited in the spacing space of this colloid, and above-mentioned at least one sinking space is a trapezoidal shape groove.
3. package structure for LED of locating the heat conduction sticky material as claimed in claim 2; It is characterized in that: the upper surface of the reflective colloid of this circulating type is a circular arc; The reflective gel phase of this circulating type for the angle of the circular arc tangential line of this substrate body upper surface between 40～50 degree; The end face of the reflective colloid of this circulating type with respect to the height of this substrate body upper surface between 0.3～0.7mm; The width of the reflective colloid of this circulating type bottom between 1.5～3mm, the thixotropic index of the reflective colloid of this circulating type between 4-6, and the reflective colloid of this circulating type be one be mixed with inorganic additive the white hot reflective colloid that hardens.
4. package structure for LED of locating the heat conduction sticky material as claimed in claim 1; It is characterized in that; Further comprise: a plurality of nickel/palladium/gold layers that are arranged at those LED crystal particle bottoms respectively; Wherein each nickel/palladium/gold layer forms between this heat conduction adhesion coating and each LED crystal particle, and serve as reasons many tin balls or tin cream of this heat conduction adhesion coating crossed formed heat conduction adhesion coating layer behind the tin stove.
5. the package structure for LED that can locate the heat conduction sticky material is characterized in that, comprising:
One base board unit; It has a substrate body, a plurality of sinking space that forms in this substrate body upper surface, a plurality of anodal conductive welding pad that is exposed to this substrate body upper surface, and a plurality of negative pole conductive welding pad that are exposed to this substrate body upper surface, and wherein this substrate body has heat dissipating layer, and the reflective insulating barrier that is arranged at this circuit substrate upper surface and is used to expose those anodal conductive welding pad and those negative pole conductive welding pad that a circuit substrate, is arranged at this circuit substrate bottom;
One heat conduction adhesion unit, it has in a plurality of those sinking space that are positioned this base board unit respectively and is arranged at the heat conduction adhesion coating on this circuit substrate, and wherein a plurality of said heat conduction adhesion coatings and this heat dissipating layer are separated from one another;
One luminescence unit, it has many LED crystal particles that are arranged on this heat conduction adhesion coating respectively and are placed in those sinking space respectively, and wherein each LED crystal particle has a positive terminal and a negative pole end;
One conductive unit; It has many leads, and wherein per two leads are electrically connected between positive terminal and each the anodal conductive welding pad of each LED crystal particle respectively and are electrically connected between the negative pole end and each negative pole conductive welding pad of each LED crystal particle; And
One encapsulation unit, it has one and forms in this substrate body upper surface to cover the printing opacity packing colloid of those LED crystal particles and those leads.
6. package structure for LED of locating the heat conduction sticky material as claimed in claim 5; It is characterized in that, further comprise: a reflecting unit, it has one and sees through the mode of coating and form in the reflective colloid of circulating type of this substrate body upper surface around ground; The reflective colloid of this circulating type extends to a terminating point from a starting point; And this starting point is identical with the position of this terminating point, and wherein the reflective colloid of this circulating type is around those LED crystal particles, with form one be positioned at this substrate body top the spacing space of colloid; And this printing opacity packing colloid is limited in the spacing space of this colloid, and each sinking space is a cup-shaped groove.
7. package structure for LED of locating the heat conduction sticky material as claimed in claim 5; It is characterized in that; Further comprise: a plurality of nickel/palladium/gold layers that are arranged at those LED crystal particle bottoms respectively; Wherein each nickel/palladium/gold layer forms between each heat conduction adhesion coating and each LED crystal particle, and serve as reasons many tin balls or tin cream of each heat conduction adhesion coating crossed formed heat conduction adhesion coating layer behind the tin stove.
8. the manufacture method that can locate the package structure for LED of heat conduction sticky material is characterized in that, comprises the following steps:
One base board unit is provided; It has a substrate body, at least one sinking space that forms in this substrate body upper surface, a plurality of anodal conductive welding pad that is exposed to this substrate body upper surface, and a plurality of negative pole conductive welding pad that are exposed to this substrate body upper surface, and wherein this substrate body has heat dissipating layer, and the reflective insulating barrier that is arranged at this circuit substrate upper surface and is used to expose those anodal conductive welding pad and those negative pole conductive welding pad that a circuit substrate, is arranged at this circuit substrate bottom;
A plurality of heat conduction adhesion balls are put into this sinking space and are arranged on this circuit substrate, and wherein a plurality of said heat conduction adhesion balls and this heat dissipating layer are separated from one another;
Many LED crystal particles are arranged at respectively on those heat conduction adhesion balls, and wherein each LED crystal particle has a positive terminal and a negative pole end;
Cross the tin stove, those LED crystal particles are positioned the heat conduction adhesion coating in the sinking space of this base board unit so that those heat conduction adhesion balls form one;
See through many leads; Each LED crystal particle being electrically connected between each anodal conductive welding pad and each the negative pole conductive welding pad, wherein per two leads are electrically connected between positive terminal and each the anodal conductive welding pad of each LED crystal particle respectively and are electrically connected between the negative pole end and each negative pole conductive welding pad of each LED crystal particle; And
Be shaped a printing opacity packing colloid in this substrate body upper surface, to cover those LED crystal particles and those leads.
9. manufacture method of locating the package structure for LED of heat conduction sticky material as claimed in claim 8; It is characterized in that: this printing opacity packing colloid of above-mentioned shaping more advances one and comprises before the step of this substrate body upper surface: the mode with coating is coated with liquid glue material in the upper surface of the substrate body of this base board unit around ground; Solidify then should liquid state glue material to form the reflective colloid of a circulating type; The reflective colloid of this circulating type extends to a terminating point from a starting point; And this starting point is identical with the position of this terminating point; Wherein the reflective colloid of this circulating type is around those LED crystal particles, with form one be positioned at this substrate body top the spacing space of colloid, and this printing opacity packing colloid is limited in the spacing space of this colloid.
10. manufacture method of locating the package structure for LED of heat conduction sticky material as claimed in claim 8; It is characterized in that: each heat conduction adhesion ball is tin ball or tin cream; And the bottom of each LED crystal particle has one nickel/palladium/gold layer; Therefore this each nickel/palladium/the gold layer forms between this heat conduction adhesion coating and each LED crystal particle, and above-mentioned at least one sinking space is formed by a trapezoidal shape groove or by a plurality of cup-shaped grooves.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101636992A CN101996985B (en) | 2009-08-13 | 2009-08-13 | Light-emitting diode (LED) encapsulation structure capable of positioning heat-conducting adhesive material and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101636992A CN101996985B (en) | 2009-08-13 | 2009-08-13 | Light-emitting diode (LED) encapsulation structure capable of positioning heat-conducting adhesive material and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101996985A CN101996985A (en) | 2011-03-30 |
| CN101996985B true CN101996985B (en) | 2012-07-18 |
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| CN2009101636992A Expired - Fee Related CN101996985B (en) | 2009-08-13 | 2009-08-13 | Light-emitting diode (LED) encapsulation structure capable of positioning heat-conducting adhesive material and manufacturing method thereof |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2692845Y (en) * | 2004-04-02 | 2005-04-13 | 相互股份有限公司 | High-heat radiating LED |
| CN2736936Y (en) * | 2004-10-07 | 2005-10-26 | 葛世潮 | Power type LED |
| CN101093828A (en) * | 2006-06-20 | 2007-12-26 | 常州东村电子有限公司 | Structure for packaging compact type large power light emitting diode |
| CN101445644A (en) * | 2007-11-30 | 2009-06-03 | 太阳油墨制造株式会社 | White hardening resin composition |
-
2009
- 2009-08-13 CN CN2009101636992A patent/CN101996985B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2692845Y (en) * | 2004-04-02 | 2005-04-13 | 相互股份有限公司 | High-heat radiating LED |
| CN2736936Y (en) * | 2004-10-07 | 2005-10-26 | 葛世潮 | Power type LED |
| CN101093828A (en) * | 2006-06-20 | 2007-12-26 | 常州东村电子有限公司 | Structure for packaging compact type large power light emitting diode |
| CN101445644A (en) * | 2007-11-30 | 2009-06-03 | 太阳油墨制造株式会社 | White hardening resin composition |
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| Publication number | Publication date |
|---|---|
| CN101996985A (en) | 2011-03-30 |
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