CN212934608U - CSP LED light source - Google Patents

Abstract

The utility model discloses a CSP LED light source relates to CSP LED technical field. The CSP LED light source comprises a PCB and a chip packaging structure, wherein the chip packaging structure is electrically connected with the PCB. The chip packaging structure comprises a plurality of chips, the chips are of an integrated structure, the chips are arranged in a set group mode, and a white glue layer structure is arranged on the periphery of each chip. The utility model provides a CSP LED light source has formed single polycrystal CSP LED light source through encapsulating a plurality of chips structure as an organic whole, can realize that the single face is luminous. The white glue layer structure around the chip reflects the light on the side better, so that the CSP LED light source has strong light-gathering property and high central illumination. A plurality of chips of a body structure are efficient, more convenient, have improved production efficiency, the cost is reduced.

Description

CSP LED light source

Technical Field

The utility model relates to a CSP LED technical field especially relates to a CSP LED light source.

Background

Csp (Chip Scale package) is a form of packaging based on Flip Chip (Flip Chip) applications. CSP LED packages are gradually replacing the traditional LED package products in emerging fields, such as the market for flash lamps, tv backlights, and car light modules.

At present, the CSP LED mostly exists in a compression molding five-surface luminous packaging body form and is a single crystal CSP LED product structure, the structure has no substrate carrier, and except the bottom of the chip, other surfaces of the chip are wrapped by silica gel and are five-surface luminous. The single crystal five-surface light-emitting CSP LED light source has the defects of low yield due to poor color temperature consistency, low light-emitting center illumination caused by five-surface light emission and the like. In the prior art, the CSP LED is applied to the field of automobile lamps, a plurality of single-crystal single-side luminous CSP LEDs are printed on a PCB (printed Circuit Board) at equal intervals by SMT (surface mount technology), and electrodes of a flip chip are welded with the PCB by solder paste to form a series-parallel circuit structure. In the application of an integrated light source, the assembly technology of the CSP LED with a plurality of single crystals is high in cost, and the integrated chip mounting cannot be carried out.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a CSP LED light source, this CSP LED light source's equipment simple process, production efficiency is high.

To achieve the purpose, the utility model adopts the following technical proposal:

the utility model provides a CSP LED light source, includes PCB board and chip packaging structure, chip packaging structure with PCB board electricity is connected, wherein, chip packaging structure includes a plurality of chips, and is a plurality of the chip is structure as an organic whole, and is a plurality of the chip is arranged according to the form of setting for in groups, every all be provided with white glue layer structure around the chip.

Optionally, each chip is provided with a ceramic fluorescent sheet, and the ceramic fluorescent sheet is connected with the chip in an adhesive manner.

Optionally, the length and width of the ceramic phosphor sheet are the same as the length and width of the chip.

Optionally, the thickness of the ceramic fluorescent sheet is 0.03mm to 0.15 mm.

Optionally, the total thickness of the ceramic fluorescent sheet and the chip is the same as the thickness of the white glue layer structure.

Optionally, the width of the white glue layer structure is 0.08mm to 0.12 mm.

Optionally, the white glue layer structure is connected with the chip adjacent to the white glue layer structure in a seamless mode.

Optionally, the set grouping form is that a plurality of the chips are arranged in a matrix.

Optionally, the chip includes a front surface and a back surface, and the front surface and the back surface are oppositely disposed; the ceramic fluorescent sheet is arranged on the front surface of the chip, the back surface of the chip is provided with an electrode, and the electrode is electrically connected with the PCB.

The utility model has the advantages that:

the utility model provides a CSP LED light source sets up a plurality of chips in the chip packaging structure into a body structure, and a plurality of chips are arranged according to the mode in groups of setting for, and all are provided with the white glue layer structure around the chip. The utility model provides a CSP LED light source has formed single polycrystal CSP LED light source through encapsulating a plurality of chips structure as an organic whole, can realize that the single face is luminous. The white glue layer structure around the chip reflects the light on the side better, so that the CSP LED light source has strong light-gathering property and high central illumination. A plurality of chips of a body structure are efficient, more convenient, have improved production efficiency, the cost is reduced.

Drawings

Fig. 1 is a schematic front view of a chip package structure according to an embodiment of the present invention;

fig. 2 is a schematic back view of a chip package structure according to an embodiment of the present invention.

The labels in the figure are:

1. a ceramic fluorescent sheet; 2. an electrode; 3. and a white glue layer structure.

Detailed Description

In order to make the technical problem solved by the present invention, the technical solution adopted by the present invention and the technical effect achieved by the present invention clearer, the technical solution of the present invention will be further explained by combining the drawings and by means of the specific implementation manner.

In the description of the present invention, unless expressly stated or limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, e.g., as meaning permanently connected, detachably connected, or integral to one another; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

In the description of the present embodiment, the terms "upper", "lower", "right", and the like are used in the orientation or positional relationship shown in the drawings only for convenience of description and simplicity of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used only for descriptive purposes and are not intended to have a special meaning.

As shown in fig. 1, the present embodiment provides a CSP LED light source, which includes a PCB board and a chip package structure electrically connected to the PCB board. The chip packaging structure comprises a plurality of chips, the chips are of an integrated structure, the chips are arranged in a set group mode, and a white glue layer structure 3 is arranged on the periphery of each chip.

The CSP LED light source that this embodiment provided sets up a plurality of chips in the chip package structure as an organic whole structure, and a plurality of chips are arranged according to the mode of establishing in groups, and all are provided with white glue layer structure 3 around the chip. The CSP LED light source provided by this embodiment forms a single polycrystalline CSP LED light source by packaging a plurality of chips into an integrated structure, and can realize single-sided light emission. The white glue layer structure 3 around the chip reflects the light on the side better, so that the CSP LED light source has strong light-gathering property and high central illumination. A plurality of chips of a body structure are efficient, more convenient, have improved production efficiency, the cost is reduced.

Optionally, the chip comprises a front side and a back side, the front side and the back side being oppositely arranged. Specifically, as shown in fig. 2, the ceramic fluorescent sheet 1 is disposed on the front surface of the chip, the electrode 2 is disposed on the back surface of the chip, and the electrode 2 is electrically connected to the PCB. The ceramic fluorescent sheet 1 is arranged on the front surface of the chip to improve the light-color consistency of the CSP LED light source, and the positive and negative electrodes 2 on the back surface are used for conducting a circuit.

Optionally, each chip is provided with a ceramic fluorescent sheet 1, and the ceramic fluorescent sheet 1 is connected with the chip by gluing. The ceramic fluorescent sheet 1 can improve the problem of poor color temperature shift concentration of the CSP LED light source, and meanwhile, the light color consistency of the CSP LED light source is improved. According to the specification requirements of different color temperatures (cold color, warm color, white color and golden color) of the CSP LED light source, the ceramic fluorescent sheet 1 presents different appearance colors.

Alternatively, the ceramic fluorescent sheet 1 has the same length and width as the chip. Cutting the ceramic fluorescent sheet 1 according to the size (length and width) of the chip 1:1, then dispensing adhesive on the chip by a dispensing process, then pasting the ceramic fluorescent sheet 1 on the chip, baking for one hour at the temperature of 150 ℃, curing the adhesive, and bonding the ceramic fluorescent sheet 1 and the chip together by the cured adhesive.

Preferably, the thickness of the ceramic fluorescent sheet 1 is 0.03mm to 0.15 mm. The ceramic fluorescent sheet 1 provided by the embodiment is thinner than the ceramic fluorescent sheet 1 in the prior art, so that the chip packaging structure has a small volume and the cost is reduced.

Optionally, the total thickness of the ceramic fluorescent sheet 1 and the chip is the same as the thickness of the white glue layer structure 3. In the embodiment, the white glue layer structure 3 is arranged around the chip, and the upper surface of the chip on which the ceramic fluorescent sheet 1 is attached and the upper surface of the white glue layer structure 3 are on the same plane, so as to form a single-side light emitting CSP LED light source.

Optionally, the width of the white glue layer structure 3 is 0.08mm to 0.12 mm. The white glue layer structure 3 is connected with the adjacent chip in a seamless mode. In this embodiment, the white glue is filled in the gap between the chip and the chip, the white glue is cured to form the white glue layer structure 3, the white glue layer structure 3 is seamlessly connected with the chip, blue light leakage of the chip is prevented, and the width of the white glue layer structure 3 is the gap between the chip and the chip. In the prior art, a chip is cut into single chips and applied to a CSP LED light source, a circuit structure is set according to the power of the CSP LED light source, the single chips are attached according to the circuit structure, and the minimum gap between the chips is 0.5 mm. The chip packaging structure that this embodiment provided directly encapsulates a plurality of chips into an organic whole structure according to circuit structure, the equipment of the power of not only being convenient for has reduced the clearance between chip and the chip moreover for CSP LED light source's spotlight nature is stronger, and central illuminance is higher.

Alternatively, a set pattern is such that a plurality of chips are arranged in a matrix. In this embodiment, the series-parallel structure of the plurality of chips is set according to the power of the CSP LED light source, for example, the series-parallel structure of the chips set according to the power of the CSP LED light source is three series-parallel, the chip packaging structure provided by this embodiment includes six chips, the six chips are packaged into an integrated structure in a matrix arrangement, and then are soldered on the PCB board through the solder paste, the PCB board is designed with a circuit, and then the CSP LED light source can be turned on and turned on by driving the power supply.

The manufacturing process of the chip packaging structure of the CSP LED light source provided by this embodiment is as follows:

(1) pasting a double-sided film on a carrier plate, expanding the crystal of a flip chip by a full-automatic crystal fixing machine, carrying out PR debugging and then sequentially arranging the flip chip on the carrier plate, wherein a gap exists between the chip and the chip; the flip chip means that the chip electrode 2 faces downward.

(2) And (3) dispensing an adhesive on the flip chip by a dispensing process, then pasting the cut ceramic fluorescent sheet 1 on the flip chip, baking and curing for one hour at 150 ℃, and bonding the ceramic fluorescent sheet 1 and the flip chip together by the cured adhesive.

(3) Preparing white glue according to a certain proportion, filling the white glue in a gap between the chips through a mould pressing process, curing for 300s at the temperature of 150 ℃, and baking for three hours at the temperature of 150 ℃ to form a white glue layer structure 3 which is seamlessly adhered with the chips.

(4) The other side of the carrier plate is pasted with the UV film, the carrier plate fully covered with the chips is cut through a precise cutting blade according to the cutting path and the size of the CSP LED light source, the single CSP LED light source with a polycrystal single-side structure is cut (the polycrystal is not limited to two chips, three chips, four chips and the like), and the CSP LED light source can be matched according to the application requirements of the automobile series-parallel circuit.

(5) Separating the chip from the carrier plate through mould reversing and glue releasing, and placing the chip on a blue film through electric sorting;

(6) arranging the BIN material on a blue film by adopting a porous special-shaped suction nozzle, installing the blue film in a carrier tape, carrying out heat sealing on the carrier tape, and then coiling and packaging.

The above description is only for the preferred embodiment of the present invention, and for those skilled in the art, there are variations on the detailed description and the application scope according to the idea of the present invention, and the content of the description should not be construed as a limitation to the present invention.

Claims (9)

1. The utility model provides a CSP LED light source, includes PCB board and chip packaging structure, chip packaging structure with PCB board electricity is connected, its characterized in that, chip packaging structure includes a plurality of chips, and is a plurality of the chip is structure as an organic whole, and is a plurality of the chip is arranged according to the form of setting for in groups, every all be provided with white glue layer structure (3) around the chip.

2. CSP LED light source as claimed in claim 1, characterized in that each chip is provided with a ceramic phosphor sheet (1), the ceramic phosphor sheet (1) being glued to the chip.

3. CSP LED light source as claimed in claim 2, characterized in that the length and width of said ceramic fluorescent sheet (1) are the same as the length and width of said chip.

4. CSP LED light source as claimed in claim 2, characterized in that said ceramic fluorescent sheet (1) has a thickness comprised between 0.03mm and 0.15 mm.

5. CSP LED light source as claimed in claim 2, characterized in that the total thickness of said ceramic fluorescent sheet (1) and said chip is the same as the thickness of said white glue layer structure (3).

6. CSP LED light source as claimed in any of the claims 1 to 5, characterized in that the width of the white glue layer structure (3) is between 0.08mm and 0.12 mm.

7. CSP LED light source according to any of claims 1 to 5, characterized in that the white glue layer structure (3) is seamlessly connected to the chip adjacent to it.

8. The CSP LED light source as claimed in any of claims 1 to 5, wherein the set grouping is a plurality of the chips arranged in a matrix.

9. The CSP LED light source of claim 2 wherein said chip comprises a front side and a back side, said front side and said back side being oppositely disposed; the ceramic fluorescent sheet (1) is arranged on the front surface of the chip, the back surface of the chip is provided with an electrode (2), and the electrode (2) is electrically connected with the PCB.

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