CN201262377Y - White light LED with good color rendering and high illumination efficiency - Google Patents
White light LED with good color rendering and high illumination efficiency Download PDFInfo
- Publication number
- CN201262377Y CN201262377Y CNU2008200417611U CN200820041761U CN201262377Y CN 201262377 Y CN201262377 Y CN 201262377Y CN U2008200417611 U CNU2008200417611 U CN U2008200417611U CN 200820041761 U CN200820041761 U CN 200820041761U CN 201262377 Y CN201262377 Y CN 201262377Y
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- led
- white light
- light
- color rendering
- fluorescent powder
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Abstract
A white light LED with good color rendering property and high light-emitting efficiency belongs to the technical field of lighting fittings and the utility model aims at providing a white light LED which has simple structure, easy encapsulation, good color rendering and high light-emitting efficiency. The technical points of the white light LED lie in that: a high thermo conducting base plate (7) is provided with a trapezoid groove (3); the bottom of the groove is provided with a horizontal installing plane that is provided with positive and negative electric poles (4) and more than one LED chips (6); and the top of the trapezoid groove is provided with a transparent sheet (1) with high transmittance and the bottom of the sheet is evenly painted with yellow fluorescent powder (2). The outside of the LED chip is directly added with one transparent sheet evenly painted with fluorescent powder made of glass or other materials with high light transmission, and the painting of the fluorescent is separated from the chips, thus not only being convenient for precisely controlling the painted thickness and the shape of the fluorescent powder, improving the quantum efficiency of the fluorescent powder and effectively improving the color rendering and encapsulating efficiency of the LED, but also being beneficial for reducing the light decay of the LED chips and reducing the encapsulating thermoresistance.
Description
Technical field
The utility model relates to the white light LEDs that a kind of colour rendering is good, light extraction efficiency is high, belongs to field of illumination lamp technology.
Technical background
The LED Light-Emitting Diode have the life-span long, low in energy consumption, drive advantages such as simple, be widely used among people's the productive life.But because white light LEDs is to utilize blue chip to send blue light, exciting yellow fluorescent powder to mix to obtain white light, fluorescent material then is by with after casting glue mixes, and is coated on the chip.So the chip coated area is little, is difficult to the applied thickness and the shape of fluorescent material are accurately controlled, and causes the emergent light color inconsistent, inclined to one side blue light or inclined to one side gold-tinted appear, and colour rendering is poor, can not satisfy high-quality user demand; And along with temperature rises, the fluorescent material quantum efficiency reduces, and bright dipping reduces, and radiation wavelength also can change, thereby causes the variation of white light LEDs colour temperature, colourity, and higher temperature also can be quickened the aging of fluorescent material.Therefore, there are problems such as light scattering and light extraction efficiency are lower in this white light LEDs that directly applies fluorescent material at chip surface, can not satisfy the lighting requirement of most of occasions.Utilize great power LED to make lighting source, though have advantage such as efficient, energy-saving and environmental protection, the power as the LED lamp of illumination also has only 1W-5W at present, and its brightness also can't be satisfied the requirement of some occasions to illumination.
Summary of the invention
It is a kind of simple in structure that the purpose of this utility model is to provide, and is easy to encapsulation, the white light LEDs that colour rendering is good, light extraction efficiency is high.
Its technical scheme is: the white light LEDs that a kind of colour rendering is good, light extraction efficiency is high, comprise White-light LED chip, the transparent thin board of high thermal conductive substrate and high-transmission rate, it is characterized in that: offer a trapezoidal groove on the high thermal conductive substrate, bottom portion of groove has the installed surface of level, positive and negative electrode and more than one led chip are set on this installed surface, and the top of trapezoidal groove is equipped with the transparent thin board that the bottom surface evenly applies the high-transmission rate of yellow fluorescent powder.
Its technique effect is: owing to evenly apply the glass of fluorescent material or the transparent thin board that other high light transmittance material is made one of the outside directly interpolation of led chip, the coating of fluorescent material is separated with chip, thereby effectively having overcome conventional white light led chip fluorescent material applies inequality and earlier fluorescent material is coated in the problem that chip surface is installed lens again, both omitted the step that lens are installed, conveniently the coating thickness and the shape of fluorescent material are accurately controlled, improve the quantum efficiency of fluorescent material, effectively improve colour rendering and the packaging efficiency of LED, also help reducing the led chip light decay and reduce packaging thermal resistance, also be convenient to the polylith White-light LED chip is integrated on the heat sink or substrate of high thermal conductivity coefficient, realize the assembling of large power white light LED.
Description of drawings
Fig. 1 is the utility model structural representation;
Fig. 2 is the vertical view of Fig. 1.
The specific embodiment
As shown in Figure 1, 2, the white light LEDs that a kind of colour rendering is good, light extraction efficiency is high, by White-light LED chip, the transparent thin board of high thermal conductive substrate and high-transmission rate is formed.Offer a trapezoidal groove 3 on the high thermal conductive substrate 7, bottom portion of groove has the installed surface of level, positive and negative electrode 4 and more than one led chip 6 are by crystal glue or directly be welded on the installed surface of high thermal conductive substrate bottom portion of groove, are connected by lead 5 between positive and negative electrode and the led chip.The top of 6 trapezoidal grooves is equipped with the transparent thin board 1 that the bottom surface evenly applies the high-transmission rate of yellow fluorescent powder 2, with glue transparent thin board is sticked on the step place that the trapezoidal groove top is reserved, realization obtains the high white light of colour rendering to the sufficient mixed light of blue light that blue chip sends.
Transparent thin board 1 is made by glass or other high light transmittance material.
Claims (2)
1, the white light LEDs that a kind of colour rendering is good, light extraction efficiency is high, comprise White-light LED chip, the transparent thin board of high thermal conductive substrate and high-transmission rate, it is characterized in that: offer a trapezoidal groove (3) on the described high thermal conductive substrate (7), bottom portion of groove has the installed surface of level, positive and negative electrode (4) and more than one led chip (6) are set on this installed surface, and the top of trapezoidal groove is equipped with the transparent thin board (1) that the bottom surface evenly applies the high-transmission rate of yellow fluorescent powder (2).
2, the white light LEDs that a kind of colour rendering according to claim 1 is good, light extraction efficiency is high is characterized in that: described transparent thin board (1) is made by glass or other high light transmittance material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008200417611U CN201262377Y (en) | 2008-09-02 | 2008-09-02 | White light LED with good color rendering and high illumination efficiency |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008200417611U CN201262377Y (en) | 2008-09-02 | 2008-09-02 | White light LED with good color rendering and high illumination efficiency |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201262377Y true CN201262377Y (en) | 2009-06-24 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2008200417611U Expired - Fee Related CN201262377Y (en) | 2008-09-02 | 2008-09-02 | White light LED with good color rendering and high illumination efficiency |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201262377Y (en) |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011160592A1 (en) * | 2010-06-25 | 2011-12-29 | Wu Sau Mui | Mounting structure of packaged led and led illumination system |
| CN102679195A (en) * | 2011-03-14 | 2012-09-19 | 英特明光能股份有限公司 | Light emitting device |
| CN102891245A (en) * | 2012-09-17 | 2013-01-23 | 温州大学 | High-power white light emitting diode (LED) packaging structure employing fluorescence wafer and packaging method thereof |
| CN103162100A (en) * | 2011-12-08 | 2013-06-19 | 苏州市世纪晶源电力科技有限公司 | Method for integration packaging of alternating current or direct current light-emitting diode (LED) light source by formal structure LED chip |
| CN102194973B (en) * | 2010-02-02 | 2014-04-30 | 中山大学 | Wafer-grade packaging method of ultraviolet LED packaging structure |
| CN103811639A (en) * | 2012-11-05 | 2014-05-21 | 江苏稳润光电有限公司 | Encapsulation method of novel white light LED display module |
| CN103943618A (en) * | 2014-04-18 | 2014-07-23 | 江苏新广联绿色照明工程有限公司 | LED light source module with adjustable color temperature and adjustable color rendering index |
| CN103996789A (en) * | 2013-10-23 | 2014-08-20 | 西安重装渭南光电科技有限公司 | LED integrated packaging structure and integrated packaging method thereof |
| CN105322058A (en) * | 2014-07-25 | 2016-02-10 | 新世纪光电股份有限公司 | Manufacturing method of light emitting unit |
| CN107272317A (en) * | 2017-05-31 | 2017-10-20 | 深圳市光峰光电技术有限公司 | The preparation method and display system of Fluorescence chip and its Wavelength converter |
| US10573779B2 (en) | 2014-07-14 | 2020-02-25 | Genesis Photonics Inc. | Method for manufacturing light emitting unit |
| CN111240093A (en) * | 2020-03-04 | 2020-06-05 | 深圳创维－Rgb电子有限公司 | Light source module, lamp strip and TV set |
-
2008
- 2008-09-02 CN CNU2008200417611U patent/CN201262377Y/en not_active Expired - Fee Related
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102194973B (en) * | 2010-02-02 | 2014-04-30 | 中山大学 | Wafer-grade packaging method of ultraviolet LED packaging structure |
| WO2011160592A1 (en) * | 2010-06-25 | 2011-12-29 | Wu Sau Mui | Mounting structure of packaged led and led illumination system |
| CN104676324B (en) * | 2011-03-14 | 2017-12-05 | 晶元光电股份有限公司 | light emitting device |
| CN102679195A (en) * | 2011-03-14 | 2012-09-19 | 英特明光能股份有限公司 | Light emitting device |
| CN104676324A (en) * | 2011-03-14 | 2015-06-03 | 英特明光能股份有限公司 | Light emitting device |
| CN103162100A (en) * | 2011-12-08 | 2013-06-19 | 苏州市世纪晶源电力科技有限公司 | Method for integration packaging of alternating current or direct current light-emitting diode (LED) light source by formal structure LED chip |
| CN102891245A (en) * | 2012-09-17 | 2013-01-23 | 温州大学 | High-power white light emitting diode (LED) packaging structure employing fluorescence wafer and packaging method thereof |
| CN103811639A (en) * | 2012-11-05 | 2014-05-21 | 江苏稳润光电有限公司 | Encapsulation method of novel white light LED display module |
| CN103996789A (en) * | 2013-10-23 | 2014-08-20 | 西安重装渭南光电科技有限公司 | LED integrated packaging structure and integrated packaging method thereof |
| CN103943618A (en) * | 2014-04-18 | 2014-07-23 | 江苏新广联绿色照明工程有限公司 | LED light source module with adjustable color temperature and adjustable color rendering index |
| US10573779B2 (en) | 2014-07-14 | 2020-02-25 | Genesis Photonics Inc. | Method for manufacturing light emitting unit |
| CN105322058A (en) * | 2014-07-25 | 2016-02-10 | 新世纪光电股份有限公司 | Manufacturing method of light emitting unit |
| CN107272317A (en) * | 2017-05-31 | 2017-10-20 | 深圳市光峰光电技术有限公司 | The preparation method and display system of Fluorescence chip and its Wavelength converter |
| CN107272317B (en) * | 2017-05-31 | 2019-10-25 | 深圳光峰科技股份有限公司 | The preparation method and display system of Fluorescence chip and its Wavelength converter |
| CN111240093A (en) * | 2020-03-04 | 2020-06-05 | 深圳创维－Rgb电子有限公司 | Light source module, lamp strip and TV set |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: ANHUI QIANZHENG OPTOELECTRONIC CO., LTD. Free format text: FORMER OWNER: TONGLING YIYUAN ELECTRIC LIGHT SOURCE CO., LTD. Effective date: 20110708 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 244000 NO. 518, TONGDU AVENUE, TONGLING CITY, ANHUI PROVINCE TO: 242000 CHUANGYE ROAD, XUANCHENG ECONOMIC AND TECHNOLOGICAL DEVELOPMENT ZONE |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20110708 Address after: 242000 venture Road, Xuancheng economic and Technological Development Zone Patentee after: Anhui Qianzheng Photoelectric Co., Ltd. Address before: 244000 Anhui city of Tongling Province City Road No. 518 Patentee before: Tongling Yiyuan Electric Light Sources Co., Ltd. |
|
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090624 Termination date: 20120902 |