CN112635639A - White light LED device with uniform space character temperature distribution - Google Patents
White light LED device with uniform space character temperature distribution Download PDFInfo
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- CN112635639A CN112635639A CN202011428823.6A CN202011428823A CN112635639A CN 112635639 A CN112635639 A CN 112635639A CN 202011428823 A CN202011428823 A CN 202011428823A CN 112635639 A CN112635639 A CN 112635639A
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- 238000009826 distribution Methods 0.000 title claims abstract description 39
- 239000000843 powder Substances 0.000 claims abstract description 45
- 239000000758 substrate Substances 0.000 claims abstract description 9
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 27
- 239000002245 particle Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 description 16
- 239000011248 coating agent Substances 0.000 description 11
- 238000000034 method Methods 0.000 description 10
- 238000004806 packaging method and process Methods 0.000 description 9
- 238000010586 diagram Methods 0.000 description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 239000000741 silica gel Substances 0.000 description 4
- 229910002027 silica gel Inorganic materials 0.000 description 4
- JNDMLEXHDPKVFC-UHFFFAOYSA-N aluminum;oxygen(2-);yttrium(3+) Chemical compound [O-2].[O-2].[O-2].[Al+3].[Y+3] JNDMLEXHDPKVFC-UHFFFAOYSA-N 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 3
- 230000001105 regulatory effect Effects 0.000 description 3
- 229910019901 yttrium aluminum garnet Inorganic materials 0.000 description 3
- 239000011324 bead Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000000295 emission spectrum Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000009827 uniform distribution Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000004512 die casting Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/508—Wavelength conversion elements having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer, wavelength conversion layer with a concentration gradient of the wavelength conversion material
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses a white light LED device with uniform spatial angle color temperature distribution, which comprises: the white light LED device comprises a substrate, wherein a fluorescent powder layer structure and a blue light LED chip are arranged on the substrate, the LED blue light chip is a flip chip, the fluorescent powder layer structure is encapsulated on the LED blue light chip and integrally formed, the fluorescent powder layer structure comprises a bottom layer, a first raised part is arranged on the upper surface of the bottom layer, the first raised part is in a semicircular ring shape, the central point of the semicircular ring shape is superposed with the central point of the upper surface of the bottom layer, and the color temperature distribution range of the white light LED device in the angle range of-40 degrees is 5900-6300K. The invention is applied to the field of white light LED devices, so that the temperature distribution of the white light LED space character is uniform and more uniform.
Description
Technical Field
The invention relates to the technical field of white light LED devices, in particular to a white light LED device with uniform space character temperature distribution.
Background
The current white light LED preparation methods comprise three methods: the first is that according to the color superposition principle, LEDs with three colors of red, green and blue form a white light-emitting module; secondly, YAG (Yttrium aluminum garnet) fluorescent powder is coated on a blue LED chip, and the blue light emitted by the chip can generate yellow green light of 500-560 nm after being excited by the fluorescent powder and then is mixed with the blue light to form white light; and the third is to excite the blue, green and red fluorescent powder contained in the transparent optical adhesive by using an ultraviolet LED, and the white light formed by mixing three wavelengths can be obtained after excitation.
In practical production, a second method, i.e. coating a yellow YAG phosphor on a blue LED chip, is often used to prepare a white LED product. At present, methods for coating phosphor powder in LED packaging include: free dispensing, conformal coating, and remote coating.
In order to change the uneven distribution of the spatial color temperature of the white light LED and the low light extraction efficiency thereof, the conformal coating method is becoming a research hotspot for the fluorescent powder coating process, such as the following documents:
the invention discloses a Chinese patent with the name of ' a free-form surface lens and a method for realizing shape-preserving coating ' and ' is characterized in that the Chinese patent is granted with the number of CN102569615B, and the granted date of 2015 is 5-20. The patent discloses a method for realizing shape-preserving coating and light beam control of a fluorescent powder layer in LED packaging, and provides a free-form surface lens aiming at the defects of spatial color nonuniformity, complex shape-preserving coating technology and environmental protection problem caused by fluorescent powder point coating.
The invention discloses a Chinese patent application publication No. CN108682732A, which is published on 2018, 10 and 19, and is named as an LED packaging structure and an LED chip packaging method. This application discloses a set up LED packaging method of light efficiency regulating layer on encapsulation glue film, there is reflection of light phenomenon and be unfavorable for promoting the problem of contrast to the LED module of traditional technology encapsulation, at encapsulation glue film shaping light efficiency regulating layer, light efficiency regulating layer die-casting shaping has a plurality of beads, mutual interval forms the recess between a plurality of beads, the LED module of having alleviated COB packaging mode is because the interval is too little, lead to the contrast to reduce, and the smooth reflection of light phenomenon that leads to of surface.
The invention discloses a white light LED device with uniform light emitting color temperature in a spatial solid angle and a packaging method thereof, wherein the name of the invention patent is ' Chinese patent No. CN105140379B, publication No. 2017, 12, 15, and the name of the invention patent ' relates to a white light LED device with uniform light emitting color temperature in a spatial solid angle and a packaging method thereof '. The patent discloses a packaging method adopting a double-lens structure, aiming at the defect that the color temperature uniformity of the light emitting angle of a white light LED is poor due to the uneven distribution of fluorescent powder, a layer of high-refractive-index silica gel layer without the fluorescent powder is coated above a chip, a plane concave lens structure is formed by forward placement or inversion, the low-refractive-index silica gel or the same-refractive-index silica gel layer with the fluorescent powder is mixed after injection on the upper layer of the concave surface structure, an inverted plane convex lens structure fluorescent powder layer with a horizontal upper surface and a convex lower surface is formed after solidification, and the extraction rate of an LED device to emitted light is improved.
The shape-preserving coating method can realize that the fluorescent powder is coated on the surface of the LED chip in uniform thickness, can control the geometric shape, thickness and other parameters of the fluorescent powder, and improves the light color consistency and the space color temperature uniformity of the white light LED. But still not comparable to the color temperature uniformity of conventional light sources. At present, the fluorescent powder layer is coated by using a shape-preserving coating method, and the defect of uneven spatial color temperature of the prepared LED still exists, so that the optimal fluorescent powder layer structure is urgently needed to be realized by optimizing the shape of the fluorescent powder layer, the fluorescent powder shape-preserving coating method is further optimized, and the spatial color temperature uniformity and other optical properties of the white light LED are greatly improved.
Disclosure of Invention
The invention provides a white light LED device with uniform temperature distribution of space characters, which is used for solving one or more technical problems in the prior art and at least providing a beneficial selection or creation condition.
In a first aspect, an embodiment of the present invention provides a white LED device with uniform spatial angular color temperature distribution, including: the white light LED device comprises a substrate, wherein a fluorescent powder layer structure and a blue light LED chip are arranged on the substrate, the LED blue light chip is a flip chip, the fluorescent powder layer structure is encapsulated on the LED blue light chip and integrally formed, the fluorescent powder layer structure comprises a bottom layer, a first raised part is arranged on the upper surface of the bottom layer, the first raised part is in a semicircular ring shape, the central point of the semicircular ring shape is superposed with the central point of the upper surface of the bottom layer, and the color temperature distribution range of the white light LED device in the angle range of-40 degrees is 5900-6300K.
Further, the lower surface edge of bottom passes through the cambered surface with its upper surface edge that corresponds and is connected, the cambered surface is stretched by the camber line that radius of curvature is 0.73mm and forms.
Further, the upper surface of bottom is equipped with the second uplift, the second uplift includes: 1/4 sphere structures respectively arranged at four corners of the upper surface of the bottom layer, wherein the white light LED device has a color temperature distribution range of 6300-6600K in an angle range of-90 DEG to 90 deg.
Further, the semi-torus has a long radius of 0.29mm and a short radius of 0.19 mm.
Further, the 1/4 sphere structure corresponds to a sphere radius of 0.17 mm.
Further, the refractive index of the fluorescent powder is 1.75-1.85.
Furthermore, the particle size of the fluorescent powder is 5-15 μm.
Further, the concentration of the fluorescent powder is 30000mol/L-40000 mol/L.
Further, the blue LED chip is set to 1mm × 1mm × 0.1 mm.
Further, the light-emitting waveband of the blue light LED chip is 450 nm.
The white light LED device with uniform spatial angle color temperature distribution provided by the embodiment of the invention at least has the following beneficial effects: the shape of the fluorescent powder layer structure is designed, the middle of the upper surface of the fluorescent powder layer structure is of a semicircular ring structure, the color temperature distribution range is 5900-152K in the angle range of-40 degrees to 40 degrees, in addition, the edge of the lower surface of the bottom layer is connected with the edge of the corresponding upper surface through an arc surface, the four corners of the upper surface of the fluorescent powder layer are designed to be 1/4 spherical structures, and the color temperature distribution range is 6300-6600K in the angle range of-90 degrees to 90 degrees. The temperature distribution of the white light LED space character is uniform and more uniform.
Drawings
The accompanying drawings are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the example serve to explain the principles of the invention and not to limit the invention.
Fig. 1 is a cross-sectional view of a prior art white LED device.
Fig. 2 is a color temperature distribution diagram of a white LED device in the prior art.
Fig. 3 is a schematic diagram of a structure of a phosphor layer according to an embodiment of the present invention.
Fig. 4 is a color temperature distribution diagram of a white LED device with uniform spatial angular color temperature distribution according to an embodiment of the present invention.
Fig. 5 is a schematic diagram of another phosphor layer structure according to an embodiment of the invention.
Fig. 6 is a structural diagram of another white LED device with uniform spatial angular color temperature distribution according to an embodiment of the present invention.
Fig. 7 is a color temperature distribution diagram of another white LED device with uniform spatial angular color temperature distribution according to an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
It should be noted that although functional block divisions are provided in the system drawings and logical orders are shown in the flowcharts, in some cases, the steps shown and described may be performed in different orders than the block divisions in the systems or in the flowcharts. The terms first, second and the like in the description and in the claims, and the drawings described above, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order.
Fig. 1 is a cross-sectional view of a structure of a white light LED device in the prior art, which includes a substrate 1, a blue light LED chip 2 and a phosphor layer 3, wherein the phosphor layer 3 is coated on the blue light LED chip 2 by using a mixture of phosphor and silica gel.
In the conformal coating, the concentration of the fluorescent powder is uniform in the same fluorescent powder layer, so that the light path of blue light determines the color temperature, and the conformal coating cannot necessarily ensure the spatial angular consistency of light emission.
With the white LED device structure of fig. 1, the color temperature distribution at the spatial angle between-90 ° and +90 ° is observed to be uneven from different angles, as shown in fig. 2.
The invention designs some special curved surface structures on the fluorescent powder layer, and designs the free-form surface structure by changing the shape of the fluorescent powder layer, thereby improving the uniform distribution of space character temperature.
The embodiment of the invention provides an LED device with uniform spatial angle color temperature distribution, which comprises: the LED blue light chip comprises a substrate 1, wherein a fluorescent powder layer structure and a blue light LED chip 2 are arranged on the substrate, the LED blue light chip 2 is a flip chip, and the fluorescent powder layer structure is encapsulated on the LED blue light chip 2. The embodiment of the invention provides two phosphor layer structures, one is a phosphor layer structure 4 as shown in fig. 3, and the other is a phosphor layer structure 5 as shown in fig. 3 and 5.
Fig. 3 provides a schematic diagram of an improved phosphor layer structure, as shown in fig. 3, the phosphor layer structure 4 is integrally formed, the phosphor layer structure 4 includes a bottom layer 41, a first raised portion 42 is disposed on an upper surface of the bottom layer, the first raised portion 42 is in a semicircular ring shape, and a central point of the semicircular ring shape coincides with a central point of the upper surface of the bottom layer.
The semicircular ring-shaped first bump 42 has a long radius of 0.29mm and a short radius of 0.19mm, and compared with the shape-preserving coating, the semicircular ring structure is designed, the total reflection between the phosphor interface and the chip can be reduced by the structure with a concave middle part, the temperature uniformity of the space character can be improved, the setting parameters comprise that the blue LED chip is set to be 1mm multiplied by 0.1mm, the chip is a flip chip, the lower surface of the chip emits light, the radiation power is 1W, Lambert distribution is presented, the wave band of the light emission spectrum of the blue LED chip is 450nm, the refractive index of the phosphor is 1.75-1.85, the particle size of the phosphor is 5um-15um, and the concentration of the phosphor is 30000mol/L-40000 mol/L.
The white light LED device adopts the fluorescent powder layer structure of FIG. 3, so that the spatial character temperature is uniformly distributed between 6000 and 6300K between-40 and +40 degrees, as shown in FIG. 4, wherein the abscissa represents the angle and the ordinate represents the color temperature, and the curve fluctuation is smaller compared with that of FIG. 2.
As can be seen from fig. 4, the spatial character temperature distribution fluctuates greatly between-40 ° to-80 ° and +40 ° to +80 °. In order to make the spatial angular chromaticity distribution more uniform, the structure of the phosphor layer of the LED device is further improved on the basis of fig. 3, as shown in fig. 5.
Fig. 5 provides a schematic diagram of another improved phosphor layer structure, and fig. 6 is a cross-sectional view of a white LED device employing the phosphor layer structure of fig. 5, at a position on a central axis. Phosphor layer structure 5 integrated into one piece, phosphor layer structure 5 includes bottom 51, the lower surface edge of bottom 51 passes through the cambered surface connection rather than the upper surface edge that corresponds, the cambered surface is tensile by curvature radius for 0.73 mm's pitch arc and forms, the upper surface of bottom 51 is equipped with first uplift portion 52, first uplift portion 52 is the semicircle ring form, the central point of semicircle ring form coincides with the central point of bottom upper surface, the upper surface of bottom 51 is equipped with second uplift portion 53, second uplift portion 53 includes: 1/4 spherical structures respectively arranged at four corners of the upper surface of the bottom layer. Wherein the structure of the first bump 52 is the same as the structure of the first bump 42 in fig. 4.
Wherein 1/4 sphere structure corresponds to a sphere radius of 0.17 mm. 1/4 spheres are respectively arranged at four corners of the upper surface of the bottom layer, compared with the structure shown in figure 3, the total emission between the fluorescent powder and the chip and in the air can be reduced, and the uniformity of the character temperature is improved. The setting parameters comprise that the blue light LED chip is set to be 1mmx1mmx0.1mm, the chip is a flip chip, the lower surface of the chip emits light, the radiation power is 1W, Lambert distribution is presented, the wave band of the light emission spectrum of the blue light LED chip is 450nm, the refractive index of fluorescent powder is 1.75-1.80, the particle size of the fluorescent powder is 5-15 mu m, and the concentration of the fluorescent powder is 30000-40000 mol/L.
The white LED device in fig. 6 employs the phosphor layer structure of fig. 5, the spatial character temperature is uniformly distributed between 6300-6600K between-90 ° and +90 °, and the spatial angle color temperature distribution is shown in fig. 7, wherein the abscissa represents the angle and the ordinate represents the color temperature, and the curve fluctuation is smaller compared to fig. 4.
According to the invention, some special curved surface structures are designed on the fluorescent powder layer, and the uniform distribution of the space role temperature is stably fluctuated at about 6500K through optimizing the structure from-90 degrees to +90 degrees on the fluorescent powder layer, so that the color temperature difference is about 200K, and the temperature uniformity of the shape-preserving coated space role is effectively improved.
While the preferred embodiments of the present invention have been described in detail, it will be understood by those skilled in the art that the foregoing and various other changes, omissions and deviations in the form and detail thereof may be made without departing from the scope of this invention.
Claims (10)
1. A white light LED device with uniform spatial character temperature distribution is characterized by comprising: the white light LED device comprises a substrate, wherein a fluorescent powder layer structure and a blue light LED chip are arranged on the substrate, the LED blue light chip is a flip chip, the fluorescent powder layer structure is encapsulated on the LED blue light chip and integrally formed, the fluorescent powder layer structure comprises a bottom layer, a first raised part is arranged on the upper surface of the bottom layer, the first raised part is in a semicircular ring shape, the central point of the semicircular ring shape is superposed with the central point of the upper surface of the bottom layer, and the color temperature distribution range of the white light LED device in the angle range of-40 degrees is 5900-6300K.
2. The white LED device of claim 1, wherein the bottom surface edge of the bottom layer is connected to the corresponding top surface edge by an arc, and the arc is formed by stretching an arc with a radius of curvature of 0.73 mm.
3. The white LED device with uniform spatial character temperature distribution according to claim 2, wherein the bottom layer is provided with a second raised portion on the upper surface, and the second raised portion comprises: 1/4 sphere structures respectively arranged at four corners of the upper surface of the bottom layer, wherein the white light LED device has a color temperature distribution range of 6300-6600K in an angle range of-90 DEG to 90 deg.
4. The white light LED device with uniform spatial character temperature distribution as claimed in any one of claims 1-3, wherein the semi-torus has a long radius in the range of 0.29mm and a short radius in the range of 0.19 mm.
5. The white light LED device with uniform spatial character temperature distribution as claimed in claim 3, wherein the 1/4 sphere structure corresponds to a sphere radius of 0.17 mm.
6. The white LED device of claim 1, wherein the phosphor has a refractive index of 1.75-1.85.
7. The white LED device with uniform spatial angular color temperature distribution according to claim 1, wherein the phosphor has a particle size of 5 μm to 15 μm.
8. The white LED device with uniform spatial angular color temperature distribution according to claim 1, wherein the phosphor concentration of the phosphor is 30000mol/L-40000 mol/L.
9. The white LED device with uniform spatial angular color temperature distribution of claim 1, wherein the blue LED chip is set to 1mm x0.1 mm.
10. The white LED device with uniform spatial angular color temperature distribution according to claim 1, wherein the light emitting band of the blue LED chip is 450 nm.
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| CN202011428823.6A CN112635639B (en) | 2020-12-09 | 2020-12-09 | White light LED device with uniform space character temperature distribution |
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| CN202011428823.6A CN112635639B (en) | 2020-12-09 | 2020-12-09 | White light LED device with uniform space character temperature distribution |
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| JP2013161851A (en) * | 2012-02-02 | 2013-08-19 | Nichia Chem Ind Ltd | Semiconductor light-emitting element |
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| CN208142215U (en) * | 2018-04-24 | 2018-11-23 | 深圳市联胜和照明股份有限公司 | A kind of high-power long-distance fluorescent powder type White-light LED package structure |
| JP2018205548A (en) * | 2017-06-05 | 2018-12-27 | スタンレー電気株式会社 | Wavelength conversion body |
| US20200041836A1 (en) * | 2018-08-03 | 2020-02-06 | Nichia Corporation | Light emitting module and method of manufacturing the same |
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2020
- 2020-12-09 CN CN202011428823.6A patent/CN112635639B/en active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201062757Y (en) * | 2007-06-05 | 2008-05-21 | 诸建平 | Illuminating device of white light surface light source |
| CN201527991U (en) * | 2009-10-28 | 2010-07-14 | 厦门华联电子有限公司 | LED with toroidal lens |
| CN102347432A (en) * | 2010-07-30 | 2012-02-08 | 海洋王照明科技股份有限公司 | Light-emitting device |
| JP2013161851A (en) * | 2012-02-02 | 2013-08-19 | Nichia Chem Ind Ltd | Semiconductor light-emitting element |
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| CN207097867U (en) * | 2017-06-02 | 2018-03-13 | 南昌大学 | A kind of yellowish-white light LED road lamp of unstressed configuration powder type |
| JP2018205548A (en) * | 2017-06-05 | 2018-12-27 | スタンレー電気株式会社 | Wavelength conversion body |
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| US20200041836A1 (en) * | 2018-08-03 | 2020-02-06 | Nichia Corporation | Light emitting module and method of manufacturing the same |
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| CN112635639B (en) | 2022-03-22 |
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