CN116632145A - LED light source, LED light source manufacturing process and display screen manufacturing process - Google Patents
LED light source, LED light source manufacturing process and display screen manufacturing process Download PDFInfo
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- CN116632145A CN116632145A CN202310787684.3A CN202310787684A CN116632145A CN 116632145 A CN116632145 A CN 116632145A CN 202310787684 A CN202310787684 A CN 202310787684A CN 116632145 A CN116632145 A CN 116632145A
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- H—ELECTRICITY
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- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/855—Optical field-shaping means, e.g. lenses
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- H—ELECTRICITY
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- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
- H10H20/018—Bonding of wafers
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- H—ELECTRICITY
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- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
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- H—ELECTRICITY
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- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/852—Encapsulations
- H10H20/853—Encapsulations characterised by their shape
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
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- H—ELECTRICITY
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- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/036—Manufacture or treatment of packages
- H10H20/0362—Manufacture or treatment of packages of encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/036—Manufacture or treatment of packages
- H10H20/0363—Manufacture or treatment of packages of optical field-shaping means
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Abstract
本发明揭示一种LED光源制备工艺,包括获得支架;将单色光源芯片装固于支架的容纳腔;对单色光源芯片进行晶固;支架于模具的塑封腔进行塑封,塑封后,支架的容纳腔上形成透镜,透镜覆盖单色光源芯片;塑封腔对透镜的形状进行塑形,使得单色光源芯片经过塑形后的透镜后会以单色光源芯片的中心轴线呈不对称分布;获得LED光源;本发明揭示了一种LED光源以及LED显示屏制备工艺。本申请通过塑封腔使得覆盖单色光源芯片的透镜塑封成型,从而更好的对透镜进行塑形,以使得单色光源芯片经过塑形后的透镜后会以单色光源芯片的中心轴线呈不对称分布。
The invention discloses a LED light source preparation process, which includes obtaining a bracket; installing and fixing the monochromatic light source chip in the accommodation cavity of the bracket; crystal-fixing the monochromatic light source chip; plastic sealing the bracket in the plastic sealing cavity of the mold, and after plastic sealing, the bracket A lens is formed on the accommodation cavity, and the lens covers the monochromatic light source chip; the plastic sealing cavity shapes the shape of the lens, so that the monochromatic light source chip will be distributed asymmetrically with the central axis of the monochromatic light source chip after the shaped lens; LED light source; the present invention discloses an LED light source and a preparation process for an LED display screen. In this application, the lens covering the monochromatic light source chip is plastic-molded through the plastic cavity, so as to better shape the lens, so that the monochromatic light source chip will be in the same shape as the central axis of the monochromatic light source chip after the lens is molded. Symmetrical distribution.
Description
技术领域technical field
本发明涉及LED显示光源技术领域,具体地,涉及一种LED光源、LED光源制备工艺及显示屏制备工艺。The invention relates to the technical field of LED display light sources, in particular to an LED light source, an LED light source manufacturing process and a display screen manufacturing process.
背景技术Background technique
LED显示屏是由多个LED面板组成,每个LED面板中包含多个LED光源。目前,LED显示屏被大量应用于室外显示领域,LED显示屏一般在安装时通常是垂直于地面安装,而且室外LED显示屏的安装高度会高于观看人员的视觉高度,例如商场的室外显示屏、智能交通屏等,因此观看人员在观看时往往需要进行仰视观看。为了使得观看人员的仰视观看的效果更好,避免光的浪费,在生产LED光源时,会对LED光源的透镜塑形,使得经过透镜的光线能够成型倾斜角,从而达到LED显示屏光线向下倾斜的目的,以便处于低处的人员进行仰视观看,然而现有技术中对LED光源的透镜一般是通过点胶实现,其塑形效果差,无法满足透镜的塑形需求。The LED display is composed of multiple LED panels, and each LED panel contains multiple LED light sources. At present, LED display screens are widely used in the field of outdoor display. LED display screens are generally installed vertically to the ground, and the installation height of outdoor LED display screens will be higher than the visual height of viewers, such as outdoor display screens in shopping malls. , intelligent traffic screen, etc., so viewers often need to look up when watching. In order to make the viewing effect of the viewers better and avoid the waste of light, when producing the LED light source, the lens of the LED light source will be shaped, so that the light passing through the lens can be shaped into an inclination angle, so as to achieve the downward direction of the LED display light. The purpose of tilting is to allow people at low places to look up. However, in the prior art, the lens of the LED light source is generally realized by dispensing glue, which has a poor shaping effect and cannot meet the shaping requirements of the lens.
发明内容Contents of the invention
针对现有技术的不足,本发明提供一种LED光源、LED光源制备工艺及显示屏制备工艺。Aiming at the deficiencies of the prior art, the present invention provides an LED light source, an LED light source manufacturing process and a display screen manufacturing process.
本发明公开的一种ED光源制备工艺,包括:A preparation process of an ED light source disclosed in the present invention includes:
获得支架;支架具有容纳腔;Obtain a stent; the stent has an accommodating cavity;
将单色光源芯片装固于支架的容纳腔;Fixing the monochromatic light source chip in the accommodation cavity of the bracket;
对单色光源芯片进行晶固;Crystal solidify the monochromatic light source chip;
支架于模具的塑封腔进行塑封,塑封后,支架的容纳腔上形成透镜,透镜覆盖单色光源芯片;塑封腔对透镜的形状进行塑形,使得单色光源芯片经过塑形后的透镜后会以单色光源芯片的中心轴线呈不对称分布;The bracket is plastic-sealed in the plastic sealing cavity of the mold. After plastic sealing, a lens is formed on the housing cavity of the bracket, and the lens covers the monochromatic light source chip; the plastic sealing cavity shapes the shape of the lens, so that the monochromatic light source chip will be The central axis of the monochromatic light source chip is asymmetrically distributed;
获得LED光源。Get an LED light source.
根据本发明一实施方式,支架于模具的塑封腔进行塑封,包括以下子步骤:According to one embodiment of the present invention, the plastic sealing of the bracket in the plastic sealing cavity of the mold includes the following sub-steps:
模具开模;Mold opening;
将支架放入模具的塑封腔;Put the bracket into the plastic cavity of the mold;
模具合模;Mold clamping;
对塑封腔注胶;注入的胶于支架的容纳腔上形成透镜,透镜覆盖单色光源芯片;Inject glue into the plastic cavity; the injected glue forms a lens on the accommodation cavity of the bracket, and the lens covers the monochromatic light source chip;
模具开模;Mold opening;
取出塑封后的支架。Take out the plastic packaged bracket.
根据本发明一实施方式,注入的胶于支架的容纳腔上形成透镜的同时,注入的胶还包覆于支架的上端,使得透镜与支架之间形成一体成型的密封结构。According to one embodiment of the present invention, while the injected glue forms a lens on the receiving cavity of the bracket, the injected glue also covers the upper end of the bracket, so that an integrally formed sealing structure is formed between the lens and the bracket.
根据本发明一实施方式,模具开模,之前还包括:According to one embodiment of the present invention, the mold opening also includes:
对支架的容纳腔进行点胶,点入的胶于容纳腔内,且覆盖单色光源芯片。Glue is dispensed on the accommodation chamber of the bracket, and the dotted glue is placed in the accommodation chamber and covers the monochromatic light source chip.
根据本发明一实施方式,获得支架,包括以下步骤:According to one embodiment of the present invention, obtaining a stent includes the following steps:
采用导电原料成型导电基片;导电基片为引脚;Use conductive raw materials to form a conductive substrate; the conductive substrate is a pin;
将导电基片封装成型位支架;容纳腔形成于支架的上端。The conductive substrate is packaged into a bracket; the accommodating cavity is formed on the upper end of the bracket.
根据本发明一实施方式,支架上容纳腔的数量为多个,三个容纳腔成线型或“品”字型排列;多个单色光源芯片分别设于多个容纳腔。According to an embodiment of the present invention, there are multiple accommodation cavities on the bracket, and the three accommodation cavities are arranged in a line or "pin" shape; multiple monochromatic light source chips are respectively arranged in the plurality of accommodation cavities.
根据本发明一实施方式,支架的下端还形成有控制腔,支架上端的侧壁还形成有台阶。According to an embodiment of the present invention, the lower end of the bracket is further formed with a control cavity, and the side wall of the upper end of the bracket is further formed with steps.
根据本发明一实施方式,将单色光源芯片装固于支架的容纳腔,包括:According to an embodiment of the present invention, fixing the monochromatic light source chip in the housing chamber of the bracket includes:
将单色光源芯片正装于支架的容纳腔,并通过导线实现单色光源芯片和支架的电连接;或者将单色光源芯片倒装于支架的容纳腔。The monochromatic light source chip is installed in the receiving cavity of the bracket, and the electrical connection between the monochromatic light source chip and the bracket is realized through wires; or the monochromatic light source chip is flipped into the receiving cavity of the bracket.
一种LED光源,采用上述LED光源制备工艺进行制备。An LED light source is prepared by adopting the above LED light source preparation process.
一种显示屏制备工艺,包括以下步骤:A display manufacturing process, comprising the following steps:
采用权利上述的LED光源制备工艺制备出LED光源;The LED light source is prepared by adopting the above-mentioned LED light source preparation process;
采用所述LED光源制备出LED面板;Using the LED light source to prepare an LED panel;
采用所述LED面板制备出所述显示屏。The display screen is prepared by using the LED panel.
本发明的有益效果在于,通过塑封腔使得覆盖单色光源芯片的透镜塑封成型,从而更好的对透镜进行塑形,以使得单色光源芯片经过塑形后的透镜后会以单色光源芯片的中心轴线呈不对称分布。制备出的LED光源形成LED显示屏,在LED显示屏垂直于地面设置后,塑形后的透镜能够使得单色光源芯片发射的光线进行下倾,更适配低处仰视观看的人员,使得观看人员的仰视观看的显示图像更为清晰,效果更好。The beneficial effect of the present invention is that the lens covering the monochromatic light source chip is plastic-molded through the plastic sealing cavity, so that the lens is better shaped, so that the monochromatic light source chip will be shaped like a monochromatic light source chip after the lens is molded. The central axis is asymmetrically distributed. The prepared LED light source forms an LED display screen. After the LED display screen is set perpendicular to the ground, the shaped lens can make the light emitted by the monochromatic light source chip tilt down, which is more suitable for people who look up at a low place, making viewing The displayed image is clearer and the effect is better when the personnel look up and watch.
附图说明Description of drawings
此处所说明的附图用来提供对本申请的进一步理解,构成本申请的一部分,本申请的示意性实施例及其说明用于解释本申请,并不构成对本申请的不当限定。在附图中:The drawings described here are used to provide a further understanding of the application and constitute a part of the application. The schematic embodiments and descriptions of the application are used to explain the application and do not constitute an improper limitation to the application. In the attached picture:
图1为实施例中LED光源制备工艺的流程图;Fig. 1 is the flow chart of LED light source preparation process in the embodiment;
图2为实施例中LED光源的结构示意图;Fig. 2 is the structural representation of LED light source in the embodiment;
图3为实施例中图2的剖视图;Fig. 3 is the sectional view of Fig. 2 in the embodiment;
图4为实施例中LED光源的爆炸示图;Fig. 4 is the explosion diagram of LED light source in the embodiment;
图5为实施例中支架于模具的塑封腔内进行塑封过程的示意图;Fig. 5 is a schematic diagram of the plastic sealing process of the bracket in the plastic sealing cavity of the mold in the embodiment;
图6为实施例中制备支架的过程的示意图;Fig. 6 is the schematic diagram of the process of preparing support in the embodiment;
图7为实施例中LED光源的另一结构示意图;Fig. 7 is another structural schematic diagram of the LED light source in the embodiment;
图8为实施例中LED光源内部结构示意图;Figure 8 is a schematic diagram of the internal structure of the LED light source in the embodiment;
图9为实施例中品字形LED光源示意图;Fig. 9 is a schematic diagram of a Chinese-style LED light source in an embodiment;
图10为实施例中图7的剖视图;Fig. 10 is the sectional view of Fig. 7 in the embodiment;
图11为实施例中LED光源垂直地面安装时光线下倾示意图。Fig. 11 is a schematic diagram of the downward inclination of light when the LED light source is installed vertically on the ground in the embodiment.
具体实施方式Detailed ways
以下将以图式揭露本发明的多个实施方式,为明确说明起见,许多实务上的细节将在以下叙述中一并说明。然而,应了解到,这些实务上的细节不应用以限制本发明。也就是说,在本发明的部分实施方式中,这些实务上的细节是非必要的。此外,为简化图式起见,一些习知惯用的结构与组件在图式中将以简单的示意的方式绘示之。A number of embodiments of the present invention will be disclosed in the following figures. For the sake of clarity, many practical details will be described together in the following description. It should be understood, however, that these practical details should not be used to limit the invention. That is, in some embodiments of the invention, these practical details are not necessary. In addition, for the sake of simplifying the drawings, some well-known and commonly used structures and components will be shown in a simple schematic manner in the drawings.
另外,在本发明中如涉及“第一”、“第二”等的描述仅用于描述目的,并非特别指称次序或顺位的意思,亦非用以限定本发明,其仅仅是为了区别以相同技术用语描述的组件或操作而已,而不能理解为指示或暗示其相对重要性或者隐含指明所指示的技术特征的数量。由此,限定有“第一”、“第二”的特征可以明示或者隐含地包括至少一个该特征。另外,各个实施例之间的技术方案可以相互结合,但是必须是以本领域普通技术人员能够实现为基础,当技术方案的结合出现相互矛盾或无法实现时应当认为这种技术方案的结合不存在,也不在本发明要求的保护范围之内。In addition, in the present invention, descriptions such as "first", "second" and so on are used for description purposes only, and do not refer to the meaning of order or sequence, nor are they used to limit the present invention, but are only for the purpose of distinguishing the following The components or operations described by the same technical terms are only used, but should not be understood as indicating or implying their relative importance or implying the number of indicated technical features. Thus, the features defined as "first" and "second" may explicitly or implicitly include at least one of these features. In addition, the technical solutions of the various embodiments can be combined with each other, but it must be based on the realization of those skilled in the art. When the combination of technical solutions is contradictory or cannot be realized, it should be considered that the combination of technical solutions does not exist , nor within the scope of protection required by the present invention.
参照图1,图1为实施例中LED光源制备工艺的流程图。本实施例中的LED光源制备工艺包括以下步骤:Referring to Fig. 1, Fig. 1 is a flowchart of the manufacturing process of the LED light source in the embodiment. The LED light source manufacturing process in this embodiment includes the following steps:
S1,获得支架1;支架1具有容纳腔11;S1, obtaining a stent 1; the stent 1 has a receiving cavity 11;
S2,将单色光源芯片2装固于支架1的容纳腔11;S2, fixing the monochromatic light source chip 2 in the accommodation cavity 11 of the bracket 1;
S3,对单色光源芯片2进行晶固;S3, performing crystal solidification on the monochromatic light source chip 2;
S4,支架1于模具3的塑封腔31进行塑封,塑封后,支架1的容纳腔11上形成透镜4,透镜4覆盖单色光源芯片2;塑封腔31对透镜4的形状进行塑形,使得单色光源芯片2经过塑形后的透镜4后会以单色光源芯片2的中心轴线呈不对称分布;S4, the bracket 1 is plastic-sealed in the plastic-seal cavity 31 of the mold 3. After plastic-seal, a lens 4 is formed on the accommodation cavity 11 of the bracket 1, and the lens 4 covers the monochromatic light source chip 2; the plastic-seal cavity 31 shapes the shape of the lens 4, so that The monochromatic light source chip 2 will be asymmetrically distributed around the central axis of the monochromatic light source chip 2 after the lens 4 has been shaped;
S5,获得LED光源。S5, obtaining an LED light source.
通过塑封腔31使得覆盖单色光源芯片2的透镜4塑封成型,从而更好的对透镜4进行塑形,以使得单色光源芯片2经过塑形后的透镜4后会以单色光源芯片2的中心轴线呈不对称分布。制备出的LED光源形成LED显示屏,在LED显示屏垂直于地面设置后,塑形后的透镜4能够使得单色光源芯片2发射的光线进行下倾,更适配低处仰视观看的人员,使得观看人员的仰视观看的显示图像更为清晰,效果更好。The lens 4 covering the monochromatic light source chip 2 is plastic-molded through the plastic sealing cavity 31, so that the lens 4 is better shaped, so that the monochromatic light source chip 2 will be shaped like the monochromatic light source chip 2 after the lens 4 is molded. The central axis is asymmetrically distributed. The prepared LED light source forms an LED display screen. After the LED display screen is installed perpendicular to the ground, the shaped lens 4 can make the light emitted by the monochromatic light source chip 2 tilt downward, which is more suitable for people who look up at a low place. This makes the displayed image clearer and the effect better when the viewer looks up.
再一并参照图2至图4,图2为实施例中LED光源的结构示意图,图3为实施例中图2的剖视图,图4为实施例中LED光源的爆炸示图。在步骤S1中,支架1上容纳腔11的数量为多个,多个容纳腔11成线型排列,当支架1上容纳腔11的数量为三个时,三个容纳腔11成“品”字型排列;多个单色光源芯片2分别设于多个容纳腔11。多个容纳腔11内分别单独对单色光源芯片2进行盛放,能够避免了不同颜色光源之间的干涉,在应用于显示屏时,可以使得显示图像更为清晰。优选的,支架1上端的侧壁还形成有台阶13,通过台阶13的设置,以便于对容纳腔11内塑封形成透镜4时,同步形成密封结构43。2 to 4 together, FIG. 2 is a schematic structural diagram of the LED light source in the embodiment, FIG. 3 is a cross-sectional view of FIG. 2 in the embodiment, and FIG. 4 is an exploded view of the LED light source in the embodiment. In step S1, the number of accommodating cavities 11 on the bracket 1 is multiple, and the multiple accommodating cavities 11 are arranged in a line. When the number of accommodating cavities 11 on the bracket 1 is three, the three accommodating cavities 11 form a "product" Font arrangement; a plurality of monochromatic light source chips 2 are respectively arranged in a plurality of accommodating cavities 11 . The single-color light source chips 2 are separately accommodated in the plurality of accommodating cavities 11 , which can avoid interference between light sources of different colors, and can make the displayed image clearer when applied to a display screen. Preferably, a step 13 is formed on the side wall of the upper end of the bracket 1 , and the setting of the step 13 facilitates the synchronous formation of the sealing structure 43 when the lens 4 is molded into the accommodating cavity 11 .
在步骤S2中,将单色光源芯片2装固于支架1的容纳腔11,可以采用两种方式,一种是将单色光源芯片2正装于支架1的容纳腔11,并通过导线实现单色光源芯片2和支架1的电连接;另一种是将单色光源芯片2倒装于支架1的容纳腔11。上述正转和倒装可采用现有工艺,此处不再赘述。In step S2, the monochromatic light source chip 2 is fixed in the housing cavity 11 of the bracket 1, and two methods can be adopted. One is to install the monochromatic light source chip 2 in the housing cavity 11 of the bracket 1, and realize the monochromatic light source chip 2 through wires. The electrical connection between the color light source chip 2 and the bracket 1 ; The above-mentioned forward rotation and inversion can adopt the existing technology, which will not be repeated here.
在步骤S3中,对单色光源芯片2进行晶固也可以采用现有的晶固工艺,此处不再赘述。In step S3, the crystal-bonding process for the monochromatic light source chip 2 may also use an existing crystal-bonding process, which will not be repeated here.
再一并参照图5,图5为实施例中支架于模具的塑封腔内进行塑封过程的示意图。在S4步骤中,支架1于模具3的塑封腔31进行塑封,包括以下子步骤:Referring again to FIG. 5 , FIG. 5 is a schematic diagram of the plastic sealing process of the bracket in the plastic sealing cavity of the mold in the embodiment. In step S4, the bracket 1 is plastic-sealed in the plastic-seal cavity 31 of the mold 3, including the following sub-steps:
S41,模具3开模;S41, the mold 3 is opened;
S42,将支架1放入模具的塑封腔31;S42, putting the bracket 1 into the plastic cavity 31 of the mould;
S43,模具3合模;S43, the mold 3 is clamped;
S44,对塑封腔31注胶;注入的胶于支架1的容纳腔11上形成透镜4,透镜4覆盖单色光源芯片2;S44, inject glue into the plastic sealing cavity 31; the injected glue forms a lens 4 on the accommodation cavity 11 of the bracket 1, and the lens 4 covers the monochromatic light source chip 2;
S45,模具3开模;S45, the mold 3 is opened;
S46,取出塑封后的支架1。S46, taking out the plastic-encapsulated bracket 1 .
在步骤S41中,模具3分为上模32和下模33,其中,下模33的下模腔331的形状与支架1下端的形状相适配,使得支架1的下端可以对应放置于下模33的下模腔331,上模32的上模腔321与待塑形的透镜4相适配,使得透镜4以上模腔321的形状进行塑形,塑形后的透镜4能够使得单色光源芯片2经过塑形后的透镜4后会以单色光源芯片2的中心轴线呈不对称分布,本实施例中具体是在垂直单色光源2中心轴线的横截面内,透镜4的截面形状呈非对称结构。本实施例中,透镜4的截面形状是中心点不对称结构,上述中心点为单色光源芯片2中心轴线与透镜4横截面的交接点,且沿着单色光源芯片2中心轴线方向,透镜4处于容纳腔11表面之上部分的截面面积逐渐变小。如此,以单色光源芯片2中心轴线作为对称线,透镜4在单色光源芯片2的中心轴线相对侧就会形成了形状不同、表面曲率不同的的曲面,单色光源芯片2发出的光线经过不同的曲面后具有不同的发射角度,最终形成了以单色光源芯片2的中心轴线呈不对称分布的光线,使得单色光源芯片2的光线更加集中于中心轴线的其中一侧,在将LED光源垂直地面设置时,进而可使得LED光源的光线向下倾斜,当此类LED光源装配形成显示屏后,更适合处于低处观看人员的仰视观看。本实施例中单色光源芯片2的中心轴线,也是容纳腔11的中心轴线,其是处于单色光源芯片2中心点且垂直于单色光源芯片2的线。In step S41, the mold 3 is divided into an upper mold 32 and a lower mold 33, wherein the shape of the lower mold cavity 331 of the lower mold 33 is adapted to the shape of the lower end of the bracket 1, so that the lower end of the bracket 1 can be placed on the lower mold correspondingly. 33 of the lower mold cavity 331, the upper mold cavity 321 of the upper mold 32 is adapted to the lens 4 to be shaped, so that the shape of the upper mold cavity 321 of the lens 4 is shaped, and the shaped lens 4 can make the monochromatic light source After the chip 2 has been shaped, the lens 4 will be distributed asymmetrically with the central axis of the monochromatic light source chip 2. In this embodiment, in the cross section perpendicular to the central axis of the monochromatic light source 2, the cross-sectional shape of the lens 4 is Asymmetric structure. In this embodiment, the cross-sectional shape of the lens 4 is an asymmetric structure at the center point, the above-mentioned center point is the intersection point between the central axis of the monochromatic light source chip 2 and the cross section of the lens 4, and along the direction of the central axis of the monochromatic light source chip 2, the lens 4. The cross-sectional area of the part above the surface of the receiving chamber 11 becomes gradually smaller. In this way, taking the central axis of the monochromatic light source chip 2 as the line of symmetry, the lens 4 forms curved surfaces with different shapes and different surface curvatures on the opposite side of the central axis of the monochromatic light source chip 2, and the light emitted by the monochromatic light source chip 2 passes through Different curved surfaces have different emission angles, and finally form the light that is distributed asymmetrically with the central axis of the monochromatic light source chip 2, so that the light of the monochromatic light source chip 2 is more concentrated on one side of the central axis. When the light source is installed vertically on the ground, the light of the LED light source can be inclined downward. When this type of LED light source is assembled to form a display screen, it is more suitable for people who are at a low place to look up. The central axis of the monochromatic light source chip 2 in this embodiment is also the central axis of the housing cavity 11 , which is a line at the center point of the monochromatic light source chip 2 and perpendicular to the monochromatic light source chip 2 .
在步骤S42中,将支架1的下端放入下模33的下模腔331内,支架1的上端漏出,此时,容纳腔11处于下模33的上方。在步骤S43中,上模32和下模33进行合模,上模腔321与下模腔331配合形成了塑封腔31。在步骤S44中,对注塑腔31注胶具体是注入树脂材料,其凝固后能够作为透镜使用,本实施例中可以采用环氧树脂。注入的胶于支架1的容纳腔11上,也就是上模腔321内形成透镜4,透镜4覆盖单色光源芯片2,且透镜4的形状受到上模腔321的形状限制,最终塑形出所需要的不对称结构的透镜4。在步骤S45中,透镜4塑形成功后,打开上模32和下模33。而后在步骤S46脱模取出塑形透镜4后的支架1。上述步骤S41至S46中的开模、合模、注胶、脱模等动作可参考现有工艺,此处不做赘述。In step S42 , the lower end of the bracket 1 is put into the lower mold cavity 331 of the lower mold 33 , and the upper end of the bracket 1 leaks out. At this time, the accommodating cavity 11 is above the lower mold 33 . In step S43 , the upper mold 32 and the lower mold 33 are mold-closed, and the upper mold cavity 321 cooperates with the lower mold cavity 331 to form a plastic sealing cavity 31 . In step S44, injecting glue into the injection cavity 31 is specifically injecting resin material, which can be used as a lens after solidification, and epoxy resin can be used in this embodiment. The injected glue is placed on the housing cavity 11 of the bracket 1, that is, the lens 4 is formed in the upper mold cavity 321. The lens 4 covers the monochromatic light source chip 2, and the shape of the lens 4 is limited by the shape of the upper mold cavity 321, and finally the shape of the Lens 4 of the desired asymmetric structure. In step S45, after the lens 4 is shaped successfully, the upper mold 32 and the lower mold 33 are opened. Then in step S46, the bracket 1 after the molded lens 4 is removed from the mold. Actions such as mold opening, mold closing, glue injection, and mold demoulding in the above steps S41 to S46 can refer to existing processes, and will not be repeated here.
优选的,在步骤S44中,注入的胶于支架1的容纳腔11上形成透镜4的同时,注入的胶还包覆于支架1的上端,使得透镜4与支架1之间形成一体成型的密封结构43。具体的,支架1上端的侧壁还形成有台阶13,在注胶时会同步填充于台阶空间内,当透镜4成形时,此处就会成形了透镜4与支架1之间的密封结构。通过密封结构43的设计以增强LED光源的保护,增加LED光源的耐候性和室外使用寿命。Preferably, in step S44, while the injected glue forms the lens 4 on the housing chamber 11 of the bracket 1, the injected glue also covers the upper end of the bracket 1, so that an integrally formed seal is formed between the lens 4 and the bracket 1 structure43. Specifically, a step 13 is formed on the side wall of the upper end of the bracket 1 , which will be filled in the stepped space synchronously during glue injection. When the lens 4 is formed, a sealing structure between the lens 4 and the bracket 1 will be formed here. Through the design of the sealing structure 43, the protection of the LED light source is enhanced, and the weather resistance and outdoor service life of the LED light source are increased.
优选的,在步骤S41,模具3开模,之前还包括:S40,对支架1的容纳腔11进行点胶,点入的胶于容纳腔11内,且覆盖单色光源芯片2。也就是在执行步骤S44前,先通过点胶的方式与支架1的容纳腔11内点胶,先对单色光源芯片2进行容纳腔11内覆盖,如此在执行步骤S44时,能够先对单色光源芯片2形成保护,避免在执行步骤S44时,在容纳腔11内部产生气泡。Preferably, in step S41 , the mold 3 is opened, and before that, it also includes: S40 , dispensing glue on the accommodation cavity 11 of the bracket 1 , and the injected glue is in the accommodation cavity 11 and covers the monochromatic light source chip 2 . That is, before step S44 is executed, glue is dispensed into the chamber 11 of the bracket 1 by dispensing glue, and the monochromatic light source chip 2 is covered in the chamber 11, so that when step S44 is executed, the monochromatic light source chip 2 can be firstly covered. The color light source chip 2 forms a protection to prevent air bubbles from being generated inside the accommodating cavity 11 when step S44 is performed.
在步骤S5中,获得LED光源。对塑封透镜4的支架1装入控制芯片实现电连通检测合格即可。In step S5, an LED light source is obtained. The bracket 1 of the plastic-encapsulated lens 4 is loaded with a control chip to realize that the electrical connection test is qualified.
实施例二Embodiment two
继续参照图1和图6,图6为实施例中制备支架的过程的示意图。本实施例中LED光源制备工艺与实施例一中的不同之处在于:在步骤S1中,获得支架1,包括以下步骤:Continuing to refer to FIG. 1 and FIG. 6 , FIG. 6 is a schematic diagram of the process of preparing the scaffold in the embodiment. The difference between the preparation process of the LED light source in this embodiment and that in Embodiment 1 is that in step S1, obtaining the bracket 1 includes the following steps:
S11,采用导电原料成型导电基片;导电基片为引脚5;S11, using conductive materials to form a conductive substrate; the conductive substrate is pin 5;
S12,将导电基片封装成型位支架1;容纳腔11形成于支架1的上端。S12 , packaging the conductive substrate into the bracket 1 ; the accommodating cavity 11 is formed on the upper end of the bracket 1 .
通过铜材制成的导电基片作为引脚5,且与支架1一体成型,以便于色光源芯片2和控制芯片与引脚5的电连接。本实施例中支架1的下端还形成有控制腔12。支架1的容纳腔11和控制腔12相背设置,其中,引脚5将容纳腔11和控制腔12隔开,如此,单色光源芯片2设置在容纳腔11,而控制芯片设置于控制腔12,更易于与引脚5电连接。本实施例中导电原料可采铜材或铁材,导电基片可为铜基片或铁基片。The conductive substrate made of copper is used as the pin 5 and integrally formed with the bracket 1 to facilitate the electrical connection between the color light source chip 2 and the control chip and the pin 5 . In this embodiment, a control cavity 12 is also formed at the lower end of the bracket 1 . The accommodating chamber 11 and the control chamber 12 of the bracket 1 are arranged opposite to each other, wherein the pin 5 separates the accommodating chamber 11 and the control chamber 12, so that the monochromatic light source chip 2 is arranged in the accommodating chamber 11, and the control chip is arranged in the control chamber 12, easier to electrically connect with pin 5. In this embodiment, the conductive material can be copper or iron, and the conductive substrate can be copper or iron.
实施例三Embodiment three
参照图7至图11,图7为实施例中LED光源的另一结构示意图;图8为实施例中LED光源内部结构示意图;图9为实施例中品字形LED光源示意图;Referring to Fig. 7 to Fig. 11, Fig. 7 is a schematic diagram of another structure of the LED light source in the embodiment; Fig. 8 is a schematic diagram of the internal structure of the LED light source in the embodiment; Fig. 9 is a schematic diagram of the LED light source in the form of Chinese characters in the embodiment;
图10为实施例中图7的剖视图;图11为实施例中LED光源垂直地面安装时光线下倾示意图。本实施例中的LED光源包括支架1、多个单色光源芯片2以及多个透镜4。支架1具有多个容纳腔11,多个单色光源芯片2分别一一对应设于多个容纳腔11内;多个透镜4分别覆盖于多个容纳腔11,并分别与支架1连接;一透镜4对应罩于一单色光源芯片2,且单色光源芯片2的光线经过透镜4后会以单色光源芯片2的中心轴线呈不对称分布。单色光源芯片2的光线经过透镜4后会以单色光源芯片2的中心轴线呈不对称分布,在LED光源垂直于地面设置后,能够使得单色光源芯片2发射的光线进行下倾,更适配低处仰视观看的人员,且通过多个单色光源芯片2分别设置在单独的容纳腔11内,避免了不同颜色光源之间的干涉,使得观看人员的仰视观看的显示图像更为清晰,效果更好,且安装施工方便,也保证了长久使用的安全性。Fig. 10 is a cross-sectional view of Fig. 7 in the embodiment; Fig. 11 is a schematic diagram of the downward inclination of light when the LED light source is installed vertically on the ground in the embodiment. The LED light source in this embodiment includes a bracket 1 , multiple monochromatic light source chips 2 and multiple lenses 4 . The bracket 1 has a plurality of accommodation cavities 11, and a plurality of monochromatic light source chips 2 are arranged in the plurality of accommodation cavities 11 in one-to-one correspondence; a plurality of lenses 4 are respectively covered in the plurality of accommodation cavities 11, and are respectively connected to the bracket 1; The lens 4 is correspondingly covered with a monochromatic light source chip 2 , and the light from the monochromatic light source chip 2 is distributed asymmetrically along the central axis of the monochromatic light source chip 2 after passing through the lens 4 . After the light from the monochrome light source chip 2 passes through the lens 4, it will be distributed asymmetrically along the central axis of the monochrome light source chip 2. After the LED light source is installed perpendicular to the ground, the light emitted by the monochrome light source chip 2 can be tilted downward, making it more It is suitable for people looking up from a low place, and multiple monochrome light source chips 2 are respectively arranged in separate accommodation chambers 11 to avoid interference between light sources of different colors, making the displayed image clearer for viewers looking up , the effect is better, and the installation and construction are convenient, and the safety of long-term use is also guaranteed.
优选的,在垂直单色光源芯片2中心轴线的横截面内,透镜4的截面形状呈非对称结构。本实施例中,透镜4的截面形状是中心点不对称结构,上述中心点为单色光源芯片2中心轴线与透镜4横截面的交接点,且沿着单色光源芯片2中心轴线方向,透镜4处于支架1表面之上部分的截面面积逐渐变小。如此,以单色光源芯片2中心轴线作为对称线,透镜4在单色光源芯片2的中心轴线相对侧就会形成了形状不同、表面曲率不同的的曲面,单色光源芯片2发出的光线经过不同的曲面后具有不同的发射角度,最终形成了以单色光源芯片2的中心轴线呈不对称分布的光线,使得单色光源芯片2的光线更加集中于中心轴线的其中一侧,在将LED光源垂直地面设置时,进而可使得LED光源的光线向下倾斜,当此类LED光源装配形成显示屏后,更适合处于低处观看人员的仰视观看。本实施例中图中的虚线为单色光源芯片2的中心轴线。Preferably, in a cross section perpendicular to the central axis of the monochromatic light source chip 2, the cross-sectional shape of the lens 4 is asymmetrical. In this embodiment, the cross-sectional shape of the lens 4 is an asymmetric structure at the center point, the above-mentioned center point is the intersection point between the central axis of the monochromatic light source chip 2 and the cross section of the lens 4, and along the direction of the central axis of the monochromatic light source chip 2, the lens 4. The cross-sectional area of the part above the surface of the bracket 1 gradually decreases. In this way, taking the central axis of the monochromatic light source chip 2 as the line of symmetry, the lens 4 forms curved surfaces with different shapes and different surface curvatures on the opposite side of the central axis of the monochromatic light source chip 2, and the light emitted by the monochromatic light source chip 2 passes through Different curved surfaces have different emission angles, and finally form the light that is distributed asymmetrically with the central axis of the monochromatic light source chip 2, so that the light of the monochromatic light source chip 2 is more concentrated on one side of the central axis. When the light source is installed vertically on the ground, the light of the LED light source can be inclined downward. When this type of LED light source is assembled to form a display screen, it is more suitable for people who are at a low place to look up. The dotted line in the figure in this embodiment is the central axis of the monochromatic light source chip 2 .
具体的,多个容纳腔11开设于支架1的上表面,容纳腔11呈碗杯槽状,其槽口形状可为圆形、椭圆形或矩形。多个容纳腔11可以呈线性排列,例如,沿着支架1的长度方向依次间隔排列,三个单色光源芯片2分别设于三个容纳腔11后,也呈现线性排列方式。容纳腔11也可以呈其他排列方式,例如本实施例中容纳腔11和单色光源芯片2的数量均为3个,三个第一容纳腔3可呈“品”字型排列。当三个单色光源芯片2分别设于三个容纳腔11后可呈“品”字型排列。Specifically, a plurality of accommodating cavities 11 are opened on the upper surface of the bracket 1 , and the accommodating cavities 11 are in the shape of bowls and cups, and the shape of the slots can be circular, oval or rectangular. Multiple accommodation cavities 11 can be arranged linearly, for example, arranged at intervals along the length direction of the bracket 1 , and three monochromatic light source chips 2 are respectively arranged behind the three accommodation cavities 11 , also in a linear arrangement. The accommodating cavities 11 can also be arranged in other ways. For example, in this embodiment, the number of accommodating cavities 11 and monochromatic light source chips 2 is three, and the three first accommodating cavities 3 can be arranged in a "pin" shape. When the three monochromatic light source chips 2 are arranged in the three receiving cavities 11 respectively, they can be arranged in the shape of "pin".
单色光源芯片2可以为三色光源,即红光源(R光源)、绿光源(G光源)、蓝光源(B光源),在具体应用时,可用RGB、BBR、RRG、BBG、RRB等多种形式进行线性排列或“品”字排列,“品”字排列时,处于中间的单色光源单独设置。当然,单色光源芯片2还可以为黄色光源(Y光源),白色光源(Y光源)等,在排列时也可以采用RGY、GBW等排列方式,此处不做限定。在具体应用时,透镜4的颜色与其罩设覆盖的单色光源芯片2的发出的光线颜色相同,以提升光效,例如,罩设覆盖于R光源的透镜4可以为红色透镜,依次类推。The monochrome light source chip 2 can be a three-color light source, i.e. a red light source (R light source), a green light source (G light source), and a blue light source (B light source). In specific applications, RGB, BBR, RRG, BBG, RRB, etc. The two forms are arranged in a linear or "pin" arrangement. When the "pin" is arranged, the monochromatic light source in the middle is set separately. Of course, the monochromatic light source chip 2 can also be a yellow light source (Y light source), a white light source (Y light source), etc., and can also be arranged in RGY, GBW and other arrangements, which are not limited here. In a specific application, the color of the lens 4 is the same as the color of light emitted by the monochromatic light source chip 2 covered by it to improve light efficiency. For example, the lens 4 covered by the R light source can be a red lens, and so on.
在具体实施的时候,透镜4的下部分可嵌设于容纳腔11内,其上部分漏于容纳腔11外,本实施例中,透镜4的下部分是容纳于容纳腔11内,也即是处于支架1表面之下的部分,上部分是漏于容纳腔11,也即是处于支架1表面之上的部分,透镜4具有凸透镜的作用,本实施例中的透镜4可以采用树脂制成。During specific implementation, the lower part of the lens 4 can be embedded in the housing cavity 11, and its upper part leaks out of the housing cavity 11. In this embodiment, the lower part of the lens 4 is accommodated in the housing cavity 11, that is, It is the part below the surface of the bracket 1, and the upper part is the part leaking out of the accommodating cavity 11, that is, the part above the surface of the bracket 1. The lens 4 has the function of a convex lens. The lens 4 in this embodiment can be made of resin .
优选的,透镜4与支架1的连接处有密封结构(图中未显示)。通过密封结构的设计以增强LED光源的耐候性和室外使用寿命。具体的,本实施例中是通过环氧树脂环设密封于透镜4与支架1的连接处,在具体应用时可采用热塑的方式于透镜4一体成型于支架1上。Preferably, there is a sealing structure (not shown in the figure) at the joint between the lens 4 and the bracket 1 . The weather resistance and outdoor service life of the LED light source are enhanced through the design of the sealed structure. Specifically, in this embodiment, an epoxy resin ring is used to seal the connection between the lens 4 and the bracket 1 , and in specific applications, the lens 4 can be integrally formed on the bracket 1 in a thermoplastic manner.
优选的,本实施例中LED光源还包括控制芯片6,支架1还包括控制腔12,控制芯片6设于控制腔12内。控制芯片6的数量为一个,其分别与多个单色光源芯片2电连接。本实施中控制腔12背向容纳腔11设置,控制腔12处于支架1的内部,当控制芯片6设于控制腔12后,能够节省支架1的外表面的安装控制芯片空间,从而能够减小LED光源整体的体积。Preferably, in this embodiment, the LED light source further includes a control chip 6 , the bracket 1 further includes a control chamber 12 , and the control chip 6 is disposed in the control chamber 12 . There is one control chip 6 , which is electrically connected to multiple monochromatic light source chips 2 respectively. In this implementation, the control chamber 12 is arranged facing away from the housing chamber 11, and the control chamber 12 is inside the bracket 1. When the control chip 6 is arranged in the control chamber 12, the space for installing the control chip on the outer surface of the bracket 1 can be saved, thereby reducing The overall volume of the LED light source.
优选的,LED光源还包括引脚5,引脚5设于支架1,引脚5分别与单色光源芯片2以及控制芯片6电连接。通过引脚5的设置,以便于传导电流,在具体应用时,引脚5分别与单色光源芯片2以及控制芯片6电连接可通过导电铜线或采用集成的方式,此处不再赘述。Preferably, the LED light source further includes a pin 5 , which is provided on the bracket 1 , and the pin 5 is electrically connected to the monochromatic light source chip 2 and the control chip 6 respectively. The setting of the pin 5 facilitates current conduction. In specific applications, the electrical connection between the pin 5 and the monochromatic light source chip 2 and the control chip 6 can be through conductive copper wires or in an integrated manner, which will not be repeated here.
实施例四Embodiment Four
复参照图2至图4,本实施例中的LED光源与实施例三中的不同之处在于:透镜4包括第一透镜41以及第二透镜42,其中,第一透镜41容纳于容纳腔11内,且第一透镜41的表面与容纳腔11开口齐平,第二透镜42对应设于第一透镜41上。如此将透镜4分为第一透镜41以及第二透镜42,在生产时可以先将第一透镜41于容纳腔11内成形,先对单色光源芯片2形成保护,而后再第二透镜42成型于第一透镜41上,再对第二透镜42进行不对称成形作业时,例如第二透镜42通过压模成方式成不对称形状,这样因为第一透镜41的保护不会直接造成单色光源芯片2的损害,且避免了容纳腔11内部产生气泡。Referring again to FIGS. 2 to 4 , the difference between the LED light source in this embodiment and the third embodiment is that the lens 4 includes a first lens 41 and a second lens 42 , wherein the first lens 41 is housed in the housing cavity 11 and the surface of the first lens 41 is flush with the opening of the accommodating cavity 11 , and the second lens 42 is correspondingly arranged on the first lens 41 . In this way, the lens 4 is divided into the first lens 41 and the second lens 42. During production, the first lens 41 can be first formed in the housing cavity 11 to protect the monochromatic light source chip 2 first, and then the second lens 42 can be formed. On the first lens 41, when the second lens 42 is asymmetrically formed, for example, the second lens 42 is molded into an asymmetric shape, so that the protection of the first lens 41 will not directly cause a monochromatic light source. damage to the chip 2 and avoid the generation of air bubbles inside the cavity 11 .
优选的,密封结构33与第二透镜42一体成型。优选的,支架1的上端外壁凹陷出台阶13,与第二透镜42一体成型的密封结构33包覆于支架1上端外壁的台阶13上,如此形成全包覆密封结构,进一步增强密封效果。Preferably, the sealing structure 33 is integrally formed with the second lens 42 . Preferably, the outer wall of the upper end of the bracket 1 is recessed with a step 13, and the sealing structure 33 integrally formed with the second lens 42 covers the step 13 of the upper outer wall of the bracket 1, thus forming a fully covered sealing structure and further enhancing the sealing effect.
实施例五Embodiment five
本实施例提供了一种显示模组,其包括上述实施例三或实施例四中的LED光源以及安装板,多个LED光源以矩阵形式安装于安装板上。本发明还提供了一种显示屏,其包括上述显示模组及箱体,多个显示模组分别设于箱体上。在安装应用时,将箱体垂直地面安装,即可使得LED光源垂直地面安装。This embodiment provides a display module, which includes the LED light source and the mounting board in the third or fourth embodiment above, and a plurality of LED light sources are mounted on the mounting board in a matrix. The present invention also provides a display screen, which includes the above-mentioned display module and a box body, and a plurality of display modules are respectively arranged on the box body. When installing and applying, install the cabinet vertically on the ground, so that the LED light source can be installed vertically on the ground.
实施例六Embodiment six
本实施例中揭示了一种显示屏制备工艺,包括以下步骤:This embodiment discloses a display manufacturing process, including the following steps:
采用实施例一或二的LED光源制备工艺制备出LED光源;The LED light source is prepared by using the LED light source preparation process of Embodiment 1 or 2;
采用LED光源制备出LED面板;Using LED light sources to prepare LED panels;
采用LED面板制备出所述显示屏。The display screen is prepared by using an LED panel.
综上所述,申请的LED光源制备工艺通过塑封腔使得覆盖单色光源芯片的透镜塑封成型,从而更好的对透镜进行塑形,以使得单色光源芯片经过塑形后的透镜后会以单色光源芯片的中心轴线呈不对称分布,制备出的LED光源作为户外显示屏应用时,能够使得发射的光线向下倾斜,且避免了不同颜色光源之间的干涉,使得观看人员的仰视观看的显示图像更为清晰,效果更好,安装使用方便安全。To sum up, the applied LED light source manufacturing process makes the lens covering the monochromatic light source chip plastic-encapsulated and molded through the plastic cavity, so as to better shape the lens, so that the monochromatic light source chip will be shaped like a lens after being molded. The central axis of the monochromatic light source chip is asymmetrically distributed. When the prepared LED light source is used as an outdoor display screen, the emitted light can be inclined downward, and interference between different color light sources can be avoided, so that the viewer can look up and watch The display image is clearer, the effect is better, and the installation and use are convenient and safe.
以上所述仅为本发明的实施方式而已,并不用于限制本发明。对于本领域技术人员来说,本发明可以有各种更改和变化。凡在本发明的精神和原理内所作的任何修改、等同替换、改进等,均应包括在本发明的权利要求范围之内。The above descriptions are only embodiments of the present invention, and are not intended to limit the present invention. Various modifications and variations of the present invention will occur to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included within the scope of the claims of the present invention.
Claims (10)
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