TW201007988A - LED package, lead frame and method for producing the same - Google Patents

LED package, lead frame and method for producing the same Download PDF

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Publication number
TW201007988A
TW201007988A TW98116005A TW98116005A TW201007988A TW 201007988 A TW201007988 A TW 201007988A TW 98116005 A TW98116005 A TW 98116005A TW 98116005 A TW98116005 A TW 98116005A TW 201007988 A TW201007988 A TW 201007988A
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TW
Taiwan
Prior art keywords
led
lead
cup
package
holding surface
Prior art date
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TW98116005A
Other languages
Chinese (zh)
Inventor
Tatuhiko Sakai
Shozaburo Kameda
Original Assignee
Meioh Plastics Molding Co Ltd
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Publication date
Priority claimed from JP2008130065A external-priority patent/JP2009278012A/en
Priority claimed from JP2008272150A external-priority patent/JP2010103243A/en
Application filed by Meioh Plastics Molding Co Ltd filed Critical Meioh Plastics Molding Co Ltd
Publication of TW201007988A publication Critical patent/TW201007988A/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/642—Heat extraction or cooling elements characterized by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0075—Processes relating to semiconductor body packages relating to heat extraction or cooling elements

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

Disclosed is a package for configuring an LED device, which comprises: an LED holding surface in which a lead part electrically connected with an LED element by wire bonding, a heat dissipating plate part which is in heat conductive contact with the LED element in the surface and an insulating partition part for dividing the lead part from the heat dissipating plate part by an insulating resin are exposed; and a frame member surrounding the LED holding surface. The element holding space configured of the LED holding surface and the frame member is sealed with a light-transmitting resin. Since the back surface of the heat dissipating plate part and the back surface of the insulating partition part are exposed in the same plane in the back side of the LED holding surface, there can be obtained a thin LED package having improved heat dissipation performance and reflection efficiency.

Description

201007988 六、發明說明： 【發明所屬之技術領域】 本發明是有關於可提高散熱性與反射效率，而且可作 成薄形狀的發光二極體（LED )裝置的封裝的製造方法者 。尤其是，有關於用以以低成本提供高輸出LED或白色 LED的用途上作爲焦點的LED裝置用封裝的導線架，導線 架的製造方法及LED用封裝的製造方法。 【先前技術】 發光二極體（Light Emitting Diode:簡稱爲「LED」 )裝置，是藉由藍色發光二極體的發明，而藉由與其他的 紅色、綠色的發光二極體等一起使用，可使用作爲照明用 的裝置。作爲可接通於該LED的電力上本身也有限度。其 限度是依元件的性能處較大，惟封裝的散熱性也有關係。 到底，半導體元件的動作領域是在溫度被限制，當超過限 度溫度，則半導體元件是被破壞、或是壽命顯著縮短。 LED元件的情形，接通電力的一部分變換成光能量， 剩餘是被變換成熱之故，因而LED是例如與白熾燈相比較 ，有發熱較少作爲特徵，惟高輸出（高亮度）型式的led 元件是流著大電流之故，因而產生不可忽視的位準的發熱 •溫度上昇。一方面，裝置的小型化、薄型化的要求很高 ，且小型又薄形的LED裝置的開發有所進展，作爲LED裝 置，小型又薄形，且散熱效果大的封裝的開發競爭被展 開。 -5- 201007988 另一背景是要求反射效率高的封裝。LED元件是在元 件上面方向以所定放射角度光被放射，惟在元件的橫方向 也放射不可忽視的量的光。不浪費橫方向的光，爲了有效 利用而在元件的橫側配置反射板的方法爲傳統上就被採用 作爲最單純的反射板，在構成封裝的塑膠的樹脂框構 件中，在裝載LED元件的側面具有傾斜，且採用白色塑膠 者。白色塑膠是反射特性較優異，惟對於高輸出LED或白 @ 色LED具有如下的問題。亦即， (1) 塑膠本體的光吸收率較高，而反射效率比金屬 反射板還要低。 (2) 因短波長的藍色、紫外光的吸收率是極高，因 此在短時間內變色成茶褐色，而藉由該變色產降低反射率 與白色光的色偏差。 由以上背景’開發了依金屬的來自下面的散熱與依兼 具反射板的導線架的各種封裝。例如提案一種從導線架互 春 相相對一對導線構件’而將一方的導線部的前端形成杯狀 的LED發光裝置（參照專利文獻1 )。在該提案中，具有 杯底部的背面會露出以便散熱，及可期待杯內面的反射優 點，惟有如下的問題。亦即， (1)在杯形狀的周圍形成閉鏈時，則在杯拉深工程 使得其開縫擴展之故，因而爲了作成杯形狀，在壓機的毛 坯工程（採取材料）’須具有餘裕’使得導線部間的距離 變大，而很難小型化。 -6 - 201007988 (2)將LED元件裝載於杯上而施以小晶片黏合及引 線接合法之後，植入密封樹脂而形成LED裝置之故’因而 在密封工程之際’因反射部的底面部從下模具浮起[參照 專利文獻1段落（0083)]’因此會惡化散熱效果。 (3 )以1次密封工程來密封LED元件及導線材料全體 ，以形成LED發光裝置之故’因而必須使用1種類的透明 樹脂。所以，不會發生樹脂部的光折射’而反射是不得不 ❶ 依賴杯形狀的金屬部分，而反射效率是變低。 (4 )又，光透射性的耐熱樹脂是材料被限定。 (5)在接合工程中，在各導線構件的背面需要支撐 構件，尤其是在杯，裝設支撐其背面的支撐構件也成爲不 穩，而可想像接合工程的失敗或不良品會增加。 又，作爲其他提案，有將凹部設於一對導線材料的一 方而裝載LED元件的半導體發光裝置（參照專利文獻2 ) 。在該提案中，在導線背面露出之處與上述的專利文獻1 • 類似，惟具有如下的問題。亦即， (1 )因導線的焊接部與LED元件裝載部的厚度不相 的構造，必須準備板厚度局部地不相同的異形條。異形條 是有切削法或輥軋法，惟不管如何都是高成本材料，而成 爲成本高。 (2)在將導線材的板厚度較厚部分藉由壓印加工等 所形成的凹部深度，藉由導線材料的輥軋強度（硬度）， 及材料對於橫方向的游隙•變形等，有限度，而也很難提 昇壓機機械的旋轉數，又生產性低。 201007988 (3)因該導線材的凹部的凹程度較淺，因此，反射 是由凹部周圍的樹脂製凹部所負擔，如上所述地，而有塑 膠本體的光吸收率較高，而反射效率比金屬反射板還要低 ，因短波長的藍色、紫外光的吸收率是極高，因此在短時 間內變色成茶褐色，而藉由該變色產生降低反射率與白色 光的色偏差的害處。 專利文獻1 :日本專利利4009097號公報 專利文獻2 :日本特開2005-3539 14號公報 ❹ 【發明內容】 本發明是即使使用高輸出的紫外線LED或藍色LED， 也不會有劣化絕緣樹脂之虞，可得到提高散熱性與反射效 率而且厚度薄的LED封裝作爲目的，使用如圈材料的薄板 金屬的條狀，以利用一般的沖裁、彎曲、拉深的壓機技術 的高速壓機而可得到生產性高，低成本的導線架作爲目的 。該導線架是可將板形狀的LED元件裝載部，與導線部之 〇 間隙，使用上述的一般壓機技術，可變窄至極限，而可將 使用該導線架的LED裝置作成小型化。 又，杯底面的背面是平坦，且與樹脂部成爲同一平面 ，又’杯背面的面積是爲了提高散熱效率儘可能較大，又 ’杯內面是成爲主要反射面之故，因而在壓機工程中成爲 鏡面精修，又，杯的深度是儘可能加深，又，直到插入成 形導線架的工程，提高封裝完成度，而對於後續工程提供 堅固又穩定的尺寸的高可靠性的LED用封裝作爲目的。 -8 - 201007988 申請專利範圍第1項所述的發明的一種發光二極體（ led )裝置用封裝，屬於具備：包含LED元件的保持領域 的LED保持面，及包圍該LED保持面的周圍的框構件，構 成以光透射性樹脂密封上述LED保持面與上述框構件所構 成的元件保持空間的LED裝置所用的封裝，其特徵爲：在 上述LED保持面，表露出藉由打線接合與LED元件電性地 連接的導線部，及以表面熱傳導地接觸於LED元件的散熱 • 板部，及以絕緣樹脂隔開上述導線部與散熱板部的絕緣區 劃部， 上述LED保持面的背面側是上述散熱板部的背面與上 述絕緣區劃部之背面表露出成同一平面。 申請專利範圍第2項所述的本發明的發光二極體（ LED )裝置用封裝，是申請專利範圍第丨項所述的導線部 的LED保持面的表面高度位置比散熱板部的LED保持面的 表面高度位置還位於上述，爲其特徵者。 β 申請專利範圍第3項所述的發光二極體（LED )裝置 用封裝’是申請專利範圍第1項或第2項所述的散熱板部爲 將LED元件保持於內側的杯狀構件， 上述杯狀構件是具備：熱傳導地接觸於LED元件的底 板部，及形成於該底板部的周緣部的反射面部， 上述反射面部是形成於阻止熱傳導性地接觸於該反射 面部的內側底板部的LED元件的放射光照射在經由該反射 面部的外側的上述LED保持面與框構件的高度，爲其特徵 者。 -9- 201007988 申請專利範圍第4項所述的發光二極體（LED )裝置 用封裝’是在申請專利範圍第3項所述的杯狀構件的內側 面’對於由熱傳導性地接觸於底板部的LED元件所放射的 光的大約全波長域形成有具備高反射率的反射層，爲其特 徵者。 申請專利範圍第5項所述的發明的一種發光二極體（ LED )封裝用導線架，屬於構成具備包含LED元件的保持 領域的LED保持面，及包圍該LED保持面的周圍的樹脂框 ❹ 構件，及藉由打線接合與表露出於該樹脂框構件的LED保 持面的LED元件電性地連接的導線部，及密封以上述LED 保持面與上述框構件所構成的元件保持空間的光透射性樹 脂的LED裝置的上述LED保持面與樹脂框構件及導線部所 成的LED用封裝中，構成上述LED保持面與導線部所用的 導線架，其特徵爲： 具備：作爲上述LED保持面，將LED元件保持於內側 的杯狀構件，及具備上述導線部1個以上的副導線架部， 〇 及連結上述杯狀構件與副導線架部的連結橫帶， 在上述連結橫帶，又具備將上述杯狀構件與副導線架 部之間隙縮小成事先決定的間隙距離的彎曲加工部。 申請專利範圍第6項所述的發明的發光二極體（LED )封裝用導線架，是申請專利範圍第5項所述的一組的副 導線架部爲以上述杯狀構件作爲中間相對地配置，爲其特 徵者。 申請專利範圍第7項所述的一種發光二極體（LED ) -10- 201007988 封裝用導線架的製造方法，屬於構成具備包含LED元件的 保持領域的LED保持面’及包圍該LED保持面的周圍的樹 脂框構件’及藉由打線接合與表露出於該樹脂框構件的 LED保持面的LED元件電性地連接的導線部，及密封以上 述LED保持面與上述框構件所構成的元件保持空間的光透 射性樹脂的LED裝置的上述LED保持面與樹脂框構件及導 線部所成的LED用封裝中，製造構成上述LED保持面與導 Ο 線部所用的導線架的方法，其特徵爲： 具備：作爲上述LED保持面，將LED元件保持於內側 的杯狀構件，及具備藉由引線接合法與上述LED元件電性 地連接的導線部1個以上的副導線架部，及將連結上述杯 狀構件與副導線架部的連結橫帶的構成要素所成的導線架 ’以拉深加工及衝裁加工形成於金屬薄板的導線架形成工 程，及 在上述連結橫帶施加彎曲加工，俾將上述杯狀構件及 β 副導線架部之間隙距離縮小成事先所決定的距離的彎曲加 工工程。 申請專利範圍第8項所述的發明的一種發光二極體（ LED )用封裝的製造方法，屬於使用藉由申請專利範圍第 7項所得到的導線架的發光二極體（LED )用封裝的製造 方法，其特徵爲： 上述杯狀構件的杯底部背面，及上述樹脂框構件的背 面成爲同一平面的方式進行插入成形。 本發明是可提高散熱性，還具有可提供可作成薄形狀 -11 - 201007988 的LED裝置的效果。又即使使用藍色LED或紫外線LED， 也不會有劣化絕緣樹脂之虞，可提高散熱性，提昇LED裝 置的光輸出，還可提供作成薄形狀的LED裝置用封裝的效 果。 又，本發明是使用如圈材料的薄板金屬的條狀，以利 用一般的沖裁、彎曲、拉深的壓機技術的高連壓機而可得 到生產性高，低成本導線架的效果。該導線架是可將杯形 狀的LED元件裝載部與導線部之間隙，使用上述的一般壓 機技術，可變窄至極限，具有可將使用該導線架的LED裝 置作成小型化的效果。 又，杯底面的背面是平坦，且與樹脂部成爲同一平面 ，又，杯背面的面積是爲了提高散熱效果儘可能較大，又 ，杯內面是成爲主要反射面之故，因而在壓機工程中成爲 鏡面精修，又，杯的深度是儘可能加深，又，直到插入成 形導線架的工程，提高封裝完成度，而對於後續工程提供 堅固又穩定的尺寸的高可靠性的LED用封裝的效果。 【實施方式】 在本發明中，一種發光二極體（LED )裝置用封裝， 屬於具備：包含LED元件的保持領域的LED保持面，及包 圍該LED保持面的周圍的框構件，構成以光透射性樹脂密 封上述LED保持面與上述框構件所構成的元件保持空間的 LED裝置所用的封裝，其特徵爲：在上述LED保持面，表 露出藉由打線接合與LED元件電性地連接的導線部，及以 201007988 表面熱傳導地接觸於LED元件的散熱板部，及以絕緣樹脂 隔開上述導線部與散熱板部的絕緣區劃部，上述LED保持 面的背面側是上述散熱板部的背面與上述絕緣區劃部之背 面表露出成同一平面之故，因而可提高散熱性，還可得到 製作可作成薄形狀的LED裝置所用的封裝。 亦即，本發明的封裝是以表面熱傳導地接觸於LED元 件的散熱板部的背面爲與依絕緣樹脂的絕緣區劃部的背面 〇 表露出成同一平面者。因此，可將在LED元件所發生的熱 從散熱板部的背面散出至基板。又，藉由將散熱板部的厚 度變薄，就可將封裝或LED裝置的厚度作成較薄。 本發明的散熱板部是作成與導線部相同厚度，從構成 導線部的金屬板進行傳導線部的沖壓加工之際，散熱板部 也與導線部同時可進行沖壓加工。藉此，同時地可製作散 熱板部與導線部之故，因而零件數也少，容易而且成爲可 大量地製作。又，一般構成導線部的金屬板厚度爲大約 ® 0.3mm之故，因而以相同厚度也可構成散熱板部，結果成 爲可將LED裝置的厚度作成大約0.8 mm。 在本發明中，散熱板部的背面與絕緣區劃部的背面表 露出同一平面，若將外部散熱構件或印刷基板的導電體部 密接於該散熱板部的背面，則散熱效果是成爲良好。尤其 是，在與LED電性地絕緣的本發明的封裝或LED裝置中， 即使接觸金屬等的電性材料的散熱構件也沒有問題之故， 因而容易地可實現。 因此，框構件是在封裝的全部散熱板部與導線部的一 -13- 201007988 部分，施加成重疊著框構件的一部分。該框構件是不僅區 劃以光透射性樹脂密封的元件保持空間所構成，而且在以 光透射性樹脂密封元件保持空間的工程之前，還具有與依 絕緣樹脂的絕緣區劃部一起保持散熱板部與導線部的作用 〇 構成框構件的樹脂與形成於散熱板部與導線部之間的 絕緣區劃部是以其他樹脂所構成也可以，惟較佳爲作成同 一樹脂。此爲若是同一樹脂，則以一個插入成形工程容易 地可形成。所使用的樹脂是在插入成形上可使用的熱可塑 性樹脂較佳。又，將LED元件藉由小晶片黏合接著於散熱 板部上成爲熱傳導良好，而能確保以打線接合等安全地可 進行電性連接於LED元件的工程的強度的方式來選擇剛性 與耐衝擊強度上優異的樹脂。例如，使用尼龍系樹脂或液 晶聚合物系樹脂等。 本發明的散熱板部是與導線部不相同而未做電性地結 合，與導線部藉由絕緣區劃部被絕緣。此爲在裝載使用正 常封裝的LED裝置的基板上裝設促進散熱板部的散熱的散 熱手段時，當在散熱板部施以電性地結合，則針對基板的 散熱手段也能產生電性的限制。因此，在散熱板部的表面 上藉由打線接合等電性地結合熱傳導地接觸的LED元件的 電極與導線部，惟可實現與散熱板部未電性地結合的構造 〇 本發明的導線部是對於散熱板部所配置的一個LED元 件具備陽極及陰極側的兩個端子部。又，LED元件是配置 201007988 複數個於1個封裝也可以，而在串聯地連接LED元件時， 具備至少具備兩個散熱板部與鄰接於此的導線部作爲標準 。在鄰接的兩個散熱板部之間，作爲導線部具備連接配置 於各該散熱板部的LED元件彼此間所用的中繼部作爲標準 〇 又，倂設串聯地連接的複數行LED元件也可以。藉此 ，藉由複數行串聯連接成爲可製造發光光度高、小型又極 〇 薄的液晶顯示用背面光單元或照明用光源。又，若將串聯 連接分別作爲紅色LED群、綠色LED群、藍色LED群，成 爲可做各地的點滅或光度調整，而可實現不需要濾色片的 液晶顯示器，或可將光度或色溫度作成可變的照明用光源 。又，藉由作成串聯連接，施加於各色LED群的電壓變高 之故，因而也有電源的效率變高的優點。 熱傳導地接觸於本發明的散熱板部的LED元件，是僅 裝載白色LED、藍色LED、紅色LED、綠色LED、黃色LED ® 等的單數或複數的單色LED元件也可以。又，若使用作爲 背面光，則可配置複數行及複數列之故，因而不僅是白色 LED，組合藍色LED、紅色LED、綠色LED、黃色LED等， 而以1個LED裝置作成白色也可以。 作爲本發明的封裝的機械性強度，是將LED元件藉由 小晶片黏合熱傳導地接觸於散熱板部上，而進行以打線接 合等電性地接觸於LED元件，需要密封光透射性樹脂的工 程的強度。又，爲了安裝印刷基板等，在流平或焊接的作 業也需要不會有不方便的強度。所以，也可進行提高作爲 -15- 201007988 封裝的強度的各種辦法。例如，爲了提高導線部及散熱板 部，及形成於此些之間的絕緣區劃部的樹脂及框構件的樹 脂之接合強度之故，因而在導線部或散熱板部設置貫通表 背的穿設孔而可將樹脂流入其穿設孔，或是在導線部或散 熱板部的周圍的一部分並不是直線狀例如鋸齒狀地形成缺 口或周圍可提高絕緣區劃部的樹脂及框構件的樹脂之接觸 面積。 又，本發明的導線部的LED保持面的高度位置比散熱 @ 板部的LED保持面的高度位置還配置於上位也可以。亦即 ，折彎由與散熱板部同一金屬板沖壓的導線部的一部分而 導線部的表面是比散熱板部的表面高度位置還配置於上位 時，則成爲絕緣樹脂倒入至導線部的背面側，對於以小晶 片黏合或打線接合進行熱性•電性地連接LED元件的工程 的方式可增加封裝強度。又，導線部的表面的高度位置不 會超過框構件，作成與LED元件的電極的高度位置同時， 藉此，也有良好地進行LED元件與導線部的打線接合的優 @ 點。又，在散熱板部背面近旁不會露出電性地連接的導線 部，又可直接接觸散熱板部背面與外部散熱構造體之故， 因而容易地可實現有效果的散熱構造。 作爲本發明的較佳態樣，上述散熱板部爲將LED元件 保持於內側的杯狀構件， 上述杯狀構件是具備：熱傳導地接觸於LED元件的底 板部，及形成於該底板部的周緣部的反射面部， 上述反射面部是形成於阻止熱傳導性地接觸於該反射 -16- 201007988 面部的內側底板部的LED元件的放射光照射在經由該反射 面部的外側的上述LED保持面與框構件的高度之故，因而 即使使用藍色LED或紫外線LED，也不會有劣化絕緣樹脂 之虞，可提高散熱性，還可得到製作可作成薄形狀的LED 裝置所用的封裝。 亦即，本發明的封裝是將LED元件保持於內側的杯狀 構件具備熱傳導性地接觸於LED元件的底板部，及形成於 〇 該底板部的周緣部的反射面部，阻止藉由反射面部使得 LED元件的放射光照射於框構件之故，因而即使使用藍色 LED或紫外線LED，也不會劣化配置於反射面部外側的絕 緣樹脂的光反射特性之虞。又，以表面熱傳導地接觸於 LED元件的杯狀構件的底板部背面表露出於與依絕緣樹脂 的絕緣區劃部的背面同一平面者。因此，可將在LED元件 所發生的熱從杯狀構件的底板部背面放出至基板。又，儘 可能將杯狀構件的反射面部的上昇高度作成變薄，藉此也 • 可將封裝或LED裝置的厚度作成較薄。 例如，與沖壓加工同時或在沖壓加工工程之後，藉由 壓機加工進行折彎杯狀構件的周圍，而形成底板部與反射 面。這時候，將反射面部的上昇高度大槪阻止熱傳導地接 觸於反射面部內側的底板部的LED元件的放射光照射於經 由該反射面的外側的上述LED保持面與框構件’或是需要 其以上的高度。 作爲本發明的反射面部，在底板部的全周緣形成環狀 者，爲了阻止放射光照射於框構件上最期盼’惟排設形成 -17- 201007988 於底板部的周圍一部分的複數杯狀構件而在複數反射面部 包圍複數底板部的緣所形成者也可以。 本發明的封裝，是將1個以上的LED元件藉由小晶片 接合法熱傳導地接觸於散熱板部或杯狀構件並予以裝載， 將該LED元件的兩個電極以打線接合連結於導線部之後， 以光透射性樹脂密封保持LED元件的LED保持面與包圍該 LED保持面的周圍的框構件所構成的元件保持空間而得到 LED裝置。 作爲光透射性樹脂，藉由不會衰減LED元件的發光而 放射至外部，或是將螢光材料含有於光透射性樹脂，俾將 從藍色LED、紫色LED或紫外線LED的發光，變換成比此 些還要長的波長的可視光的光，也可將作爲LED裝置全體 的發光變化成白色的光源色。又，藉由適當地設計光透射 性樹脂的形狀，也可具有對於特定方向增強放射光的透鏡 效果。又，也具有從濕度等保護被密封的LED元件的作用 。作爲光透射性樹脂，例如使用丙烯系樹脂、或矽系透明 樹脂等。 較佳爲本發明的散熱板部或杯狀構件的內側面是施加 光的反射率變高的處理。在杯狀構件的內側面，對於由熱 傳導性地接觸於底板部的LED元件所放射的光的大約全波 長域形成有具備高反射率的反射層。金屬面是平滑度愈高 則光的反射率會愈高之故，因而藉由施以鏡面加工，對於 由LED元件所放射的光可具有高反射率。 本發明的封裝是具備裝載LED元件所用的LED保持面 201007988 及包圍該LED保持面的周圍的框構件’構成以光透射性樹 脂密封以上述LED保持面與上述框構件所構成的元件保持 空間的LED裝置所用的封裝的製造方法，其特徵爲：具備 :由同一金屬板抽出具有與上述LED元件電性地連接，且 構成上述LED保持面的一部分的導線部，及以表面熱傳導 地接觸LED元件的散熱板部的導線架板材料抽出的工程， 及在上述沖壓的導線架板材料，插入成形形成上述框構件 • ，及上述導線部與散熱板部之間的絕緣區劃部的絕緣樹脂 的插入成形工程’在上述插入成形工程中，在形成有框構 件的背面側，上述散熱板部的背面與依上述絕緣樹脂的絕 緣區劃部的背面表露出同一平面。藉此，可提昇散熱性， 還可容易地大量且低成本地得到厚度薄的LED裝置。 作爲衝裁加工，本發明的散熱板部與導線部的金屬板 部可使用圈材料，使用該圈材料藉由插入成形形成框構件 與上述導線部及散熱板部之間的絕緣區劃部，成爲可容易 • 地大量又低成本地製造。 較佳是，在本發明的插入成形工程之前又具備折彎導 線部的折彎工程，成爲絕緣樹脂繞進導線部的背面側，將 LED元件熱傳導性地接觸散熱板部上，而可增加在LED元 件以打線接合等進行電性地連接之期間的封裝強度。 在本發明中，一種發光二極體（LED )封裝用導線架 ，屬於構成具備包含LED元件的保持領域的LED保持面， 及包圍該LED保持面的周圍的樹脂框構件，及藉由引線接 合法與表露出於該樹脂框構件的LED保持面的LED元件電 -19- 201007988 性地連接的導線部，及密封以上述LED保持面與上述框構 件所構成的元件保持空間的光透射性樹脂的LED裝置的上 述LED保持面與樹脂框構件及導線部所成的LED用封裝中 ，構成上述LED保持面與導線部所用的導線架。 亦即，本發明是關於導線架者。該導線架是例如以插 入成形形成LED保持面與樹脂框構件及導線部所成的LED 用封裝之際所使用。所得到的LED封裝是LED元件裝載於 LED保持面’而與導線部進行打線接合之後，以光透射性 ❹ 樹脂密封LED保持面與其周圍的框構件所構成的元件保持 空間而得到LED裝置。 本發明的導線架，是具備：作爲LED保持面，將LED 元件保持於內側的杯狀構件，及具備導線部1個以上的副 導線架部，及連結杯狀構件與副導線架部的連結橫帶，在 連結橫帶，又具備將杯狀構件與副導線架部之間隙縮小成 事先決定的間隙距離的彎曲加工部。藉此，使用如圈材料 的薄板金屬的條狀，而以一般的沖裁、彎曲、拉深的壓機 © 技術的高速壓機就可得到高生產性，又，低成本的散熱板 部。 在本發明中，藉由彎曲加工部，成爲可縮小間隙之故 ’因而成爲例如也可縮小成比通常的衝裁加工認爲不可能 的金屬薄板的厚度還要短的間隙距離而可實現可小型化 LED用封裝的導線架。 作爲本發明的導線架，使用通常的沖裁、彎曲、拉深 的可沖壓成形的金屬薄板。較佳是使用金屬圈材料，藉此 -20- 201007988 ，成爲可連續地可進行成形。金屬薄板是至少在表露出於 LED保持面LED元件與藉由打線接合被電性地連接的導線 部具有電導通性者就可以。 本發明的副導線架部，較佳者爲以杯狀構件作爲中間 相對地配置一組者，由於對於杯狀構件成爲分別可配置導 線部於相對向的長邊，因此成爲可將多數LED元件配置於 杯狀構件，而可得到小型又高發光性能的LED裝置。 • 本發明的杯狀構件是杯狀內部成爲LED保持面，使得 杯的底面及側面部成爲主要反射部之故，因而較佳爲鏡面 精修加工內面成爲提升反射效率。在此時，利用拉深成形 ，並藉由經鏡面精修加工的金屬模的轉印作用，也可得到 反射面的鏡面。 [實施例] 第1圖是表示本發明的發光二極體（LED )裝置用封 裝的一實施例的構成的俯視圖，第2圖是第1圖的仰視圖， 第3圖是第1圖的縱斷面圖，a圖是A-A斷面圖，b圖是B-B 斷面圖’ c圖是C-C斷面圖。第4圖是第1圖的橫斷面圖，a 圖是D-D斷面圖，b圖是E-E斷面圖，c圖是F-F斷面圖。 本實施例的封裝10是使用於以光透射性樹脂密封保持 LED元件的LED保持面11，及包圍LED保持面11的周圍的 框構件12所構成的元件保持空間13的LED裝置者。具體上 ’ led保持面11是經由依絕緣樹脂所致的絕緣區劃部16表 露出與LED元件（未圖示）電性地連接的導線部14，及將 -21 - 201007988 LED元件熱傳導地接觸於表面的散熱板部15。 如第1圖所不地，導線部14與散熱板部15是由0.3mm 厚的金屬板17經沖裁所形成。散熱板部15是4枚，而導線 部14是12枚。導線部14中，配於中間位置的4枚導線部是 串聯地連結一組LED元件的中繼部14b。 如第2圖、第3圖及第4圖所示地，LED保持面11的背 面是導線部14與散熱板部15的背面爲與依絕緣樹脂所致的 絕緣區劃部16的背面表露出於同一平面。該封裝1〇是在一 @ 個散熱板部15裝載兩個LED元件，而以打線接合電性地連 接合各LED元件的電極與導線部14，並以光透射性樹脂密 封元件保持空間13之後或是其前由金屬板17分開，而成爲 LED裝置。 又，形成於金屬板17的上下的一對孔，是使用於作爲 圈材料被加工時等的定位孔18。又，形成於導線部14及散 熱板部15的框構件12的正下方的4個小孔，是提昇導線部 14及散熱板部15，以及依此些絕緣樹脂所致的絕緣區劃部 @ 16及框構件12的接合強度所用的穿設孔19。 第5圖是表示本發明的發光二極體（LED )裝置用封 裝的另一實施例的構成的俯視圖，第6圖是第5圖的仰視圖 ，第7圖是第5圖的縱斷面圖，a圖是A-A斷面圖，b圖是B-B斷面圖，c圖是C-C斷面圖。第8圖是第5圖的橫斷面圖， a圖D-D斷面圖，b圖是E-E斷面圖，c圖是F-F斷面圖。第9 圖是表示第5圖的發光二極體（LED)裝置用封裝的LED裝 置的立體圖。 -22- 201007988 如第9圖所示地，本實施例的封裝50是使用於以光透 射性樹脂63的密封保持LED元件61的LED保持面5 1，及包 圍LED保持面51的周圍的框構件52所構成的元件保持空間 53的LED裝置60著。具體上，LED保持面51是經由依絕緣 樹脂所致的絕緣區劃部5 6表露出與LED元件6 1與線62電性 地連接的導線部54，及將LED元件熱傳導地接觸於表面的 散熱板部55。 Φ 如第5圖所示地，導線部54與散熱板部55是由0.3mm 厚的金屬板57經沖裁所形成。散熱板部55是4枚，而導線 部54是12枚。導線部54中，配於中間位置的4枚導線部是 串聯地連結一組LED元件的中繼部5 4b。 如第7圖及第8圖所示地，導線部54 (中繼部54b )是 在框構件52的下方位置被折彎，而導線部54的LED保持面 51的表面高度位置成爲比散熱板部55的表面高度位置還要 上位。所以，如第6圖所示地，LED保持面51的背面是僅 • 表露出散熱板部55的背面，而與依絕緣樹脂的絕緣樹脂所 致的絕緣區劃部56的背面表露出於同一平面。 又，形成於金屬板57的上下的一對孔，是使用於作爲 圈材料65被加工時等的定位孔58。又，形成於導線部54及 散熱板部55的框構件52的正下方的4個小孔，是提昇導線 部5 4及散熱板部55，以及依此些絕緣樹脂所致的絕緣區劃 部56及框構件52的接合強度所用的穿設孔59。 第1〇圖是表示第5圖的發光二極體（LED )裝置用封 裝及使用該封裝的LED裝置的製作工程的說明圖。如a圖 -23- 201007988 所示地，金屬板57是使用在插入成形所使用的圈材料87。 如b圖所示地，沖裁成形圈材料87而抽出導線部54與散熱 板部55。[Technical Field] The present invention relates to a method of manufacturing a package of a light-emitting diode (LED) device which can improve heat dissipation and reflection efficiency and which can be formed into a thin shape. In particular, there is a lead frame for a package for an LED device which is used as a focus for high-output LEDs or white LEDs at low cost, a method for manufacturing a lead frame, and a method for manufacturing an LED package. [Prior Art] A light emitting diode (Light Emitting Diode: "LED") device is used together with other red and green light emitting diodes by the invention of a blue light emitting diode. It can be used as a device for illumination. There is also a limit to the amount of power that can be connected to the LED. The limit is based on the performance of the component, but the heat dissipation of the package is also related. In the end, the field of operation of semiconductor elements is limited in temperature, and when the temperature is exceeded, the semiconductor elements are destroyed or the lifetime is significantly shortened. In the case of an LED element, a part of the on-power is converted into light energy, and the remainder is converted into heat. Therefore, the LED is characterized by, for example, a lower heat generation than a incandescent lamp, but a high output (high brightness) type. The led component is a large current flowing, resulting in a non-negligible level of heat generation and temperature rise. On the one hand, there is a demand for miniaturization and thinning of the device, and development of a small and thin LED device has progressed. As a LED device, competition for development of a small and thin package with a large heat dissipation effect has been exhibited. -5- 201007988 Another background is a package that requires high reflection efficiency. The LED element is radiated at a predetermined radiation angle in the direction above the element, but emits light in a non-negligible amount in the lateral direction of the element. The method of arranging the reflecting plate on the lateral side of the element for effective use is conventionally employed as the simplest reflecting plate, and in the resin frame member constituting the packaged plastic, the LED element is loaded. The side has a slope and is made of white plastic. White plastic has excellent reflection characteristics, but has the following problems for high output LEDs or white @ color LEDs. That is, (1) the plastic body has a higher light absorption rate and a lower reflection efficiency than the metal reflector. (2) Since the absorption ratio of blue and ultraviolet light of a short wavelength is extremely high, it is discolored into a brownish brown color in a short time, and the color shift of the reflectance and white light is reduced by the color change. From the above background, various packages of metal-based heat sinks and the lead frame based on the reflector are developed. For example, an LED light-emitting device in which a tip end of one lead portion is formed in a cup shape from a lead frame relative to a pair of lead members ′ is formed (see Patent Document 1). In this proposal, the back surface with the bottom of the cup is exposed to dissipate heat, and the reflection of the inner surface of the cup can be expected, with the following problems. That is, (1) when a closed chain is formed around the shape of the cup, the deep drawing of the cup causes the slit to expand, and therefore, in order to make a cup shape, the blank work (take material) of the press must have a margin. 'The distance between the wire portions is made larger, and it is difficult to miniaturize. -6 - 201007988 (2) After the LED element is mounted on the cup and subjected to small wafer bonding and wire bonding, the sealing resin is implanted to form the LED device. Thus, at the time of the sealing process, the bottom portion of the reflecting portion It floats from the lower mold [refer to paragraph (0083) of Patent Document 1], and thus the heat dissipation effect is deteriorated. (3) The LED element and the entire wire material are sealed by a single sealing process to form an LED light-emitting device. Therefore, one type of transparent resin must be used. Therefore, the light refraction of the resin portion does not occur, and the reflection is a metal portion which has to be dependent on the cup shape, and the reflection efficiency is lowered. (4) Further, a light-transmitting heat-resistant resin is a material to be defined. (5) In the joining process, the supporting member is required on the back surface of each of the wire members, and particularly in the cup, the supporting member for supporting the back surface thereof is also unstable, and it is conceivable that the failure of the joining work or the defective product may increase. Further, as another proposal, there is a semiconductor light-emitting device in which a recessed portion is provided on one of a pair of lead materials and an LED element is mounted (see Patent Document 2). In this proposal, the position where the back surface of the wire is exposed is similar to the above-mentioned Patent Document 1 and has the following problems. That is, (1) because the welded portion of the wire does not have a structure in which the thickness of the LED element mounting portion does not match, it is necessary to prepare a profiled strip whose plate thickness is partially different. Shaped strips are either cut or rolled, but are costly in any case, and are costly. (2) The depth of the recess formed by the embossing or the like in the thick portion of the wire material, the rolling strength (hardness) of the wire material, and the play/deformation of the material in the lateral direction, etc. Limits, but it is also difficult to increase the number of rotations of the press machine, and low productivity. 201007988 (3) Since the concave portion of the wire material is shallow, the reflection is carried by the resin concave portion around the concave portion. As described above, the light absorption rate of the plastic body is higher, and the reflection efficiency ratio is higher. The metal reflector is also low, because the absorption of blue and ultraviolet light of a short wavelength is extremely high, so that it changes to a brownish brown color in a short time, and the color shift causes a decrease in the color shift of the reflectance and the white light. Patent Document 1: Japanese Patent No. 4009097 Patent Document 2: JP-A-2005-3539 No. 14 ❹ SUMMARY OF THE INVENTION [Invention] The present invention is capable of deteriorating an insulating resin even when a high-output ultraviolet LED or blue LED is used. After that, it is possible to obtain a thin-walled LED package with improved heat dissipation and reflection efficiency, and a high-speed press using a strip of metal such as a ring material to utilize a general punching, bending, and drawing press technology. A high-productivity, low-cost lead frame can be obtained for the purpose. The lead frame is a gap between the plate-shaped LED element mounting portion and the lead portion, and can be narrowed to the limit by the above-described general press technology, and the LED device using the lead frame can be miniaturized. Moreover, the back surface of the bottom surface of the cup is flat and has the same plane as the resin portion, and the area of the back surface of the cup is to increase the heat dissipation efficiency as much as possible, and the inner surface of the cup is the main reflection surface, so that the press is performed. In the project, it is mirror-finished, and the depth of the cup is deepened as much as possible, and the high-reliability LED package is provided for the subsequent project to provide a firm and stable size for the insertion of the formed lead frame. For the purpose. -8 - 201007988 A package for a light-emitting diode (LED) device according to the invention of claim 1, comprising: an LED holding surface including a holding region of the LED element; and a periphery surrounding the LED holding surface The frame member is a package for an LED device in which a component holding space formed by the LED holding surface and the frame member is sealed with a light-transmitting resin, and the LED holding surface is exposed by wire bonding and LED elements. a conductively connected lead portion, and a heat dissipation plate portion that thermally contacts the LED element on the surface, and an insulating partition portion that partitions the lead portion and the heat dissipation plate portion with an insulating resin, wherein the back side of the LED holding surface is the above The back surface of the heat dissipation plate portion is exposed to the same plane as the back surface of the insulating portion. The package for a light-emitting diode (LED) device of the present invention according to the second aspect of the invention is the surface height position of the LED holding surface of the lead portion according to the second aspect of the invention, which is higher than the LED of the heat dissipation plate portion. The surface height position of the face is also located above, which is characteristic of it. The package for a light-emitting diode (LED) device according to claim 3, wherein the heat-dissipating plate portion according to the first or second aspect of the invention is a cup-shaped member that holds the LED element inside. The cup-shaped member includes a bottom plate portion that thermally contacts the LED element, and a reflective surface portion that is formed on a peripheral portion of the bottom plate portion, and the reflective surface portion is formed on an inner bottom plate portion that is in contact with the reflective surface portion to prevent thermal conduction. The emitted light of the LED element is characterized by the height of the LED holding surface and the frame member passing through the outside of the reflecting surface portion. -9-201007988 The package for a light-emitting diode (LED) device according to claim 4 is the inner side of the cup-shaped member described in claim 3, for thermally conductively contacting the bottom plate A reflector having a high reflectance is formed in approximately the entire wavelength range of the light emitted from the LED elements of the portion. A lead frame for a light-emitting diode (LED) package according to the invention of the fifth aspect of the invention is directed to an LED holding surface including a holding area including an LED element, and a resin frame surrounding the LED holding surface. a member, and a lead portion electrically connected to the LED element exposed to the LED holding surface of the resin frame member by wire bonding, and a light transmission for sealing the element holding space formed by the LED holding surface and the frame member In the LED package in which the LED holding surface of the resin device and the resin frame member and the lead portion are formed, the lead frame for the LED holding surface and the lead portion is formed, and the LED holding surface is provided as the LED holding surface. a cup-shaped member that holds the LED element inside, and a sub-lead frame portion that includes one or more of the lead portions, and a connecting cross-belt that connects the cup member and the sub-lead frame portion, and the connecting cross-belt The bent portion of the gap between the cup member and the sub-lead frame portion is reduced to a predetermined gap distance. The lead frame for a light-emitting diode (LED) package according to the invention of claim 6 is the set of lead frame portions of the fifth aspect of the patent application, wherein the cup-shaped member is intermediately opposed Configuration, its characteristics. A light-emitting diode (LED) according to the seventh aspect of the invention is a method of manufacturing a lead frame for packaging, which is an LED holding surface constituting a holding field including an LED element and surrounding the LED holding surface. a surrounding resin frame member ′ and a lead portion electrically connected to the LED element exposed to the LED holding surface of the resin frame member by wire bonding, and a sealing member formed by the LED holding surface and the frame member A method for manufacturing a lead frame for constituting the LED holding surface and the lead wire portion in the LED package formed by the LED holding surface of the LED device of the light transmissive resin and the resin frame member and the lead portion is characterized in that A cup-shaped member that holds the LED element inside as the LED holding surface, and a sub-lead portion that has one or more lead portions that are electrically connected to the LED element by wire bonding, and that are connected The lead frame formed by the constituent elements of the connecting cross-belt of the cup-shaped member and the sub-lead frame portion is formed by drawing and punching a lead frame formed on the thin metal plate. In the cross-coupling with and applying bending, serve to frame the gap portion of the cup-shaped member and the secondary guide wire to reduce the distance β to bend machining works of pre-determined distance. A method for manufacturing a package for a light-emitting diode (LED) according to the invention of claim 8 is directed to a package for a light-emitting diode (LED) using a lead frame obtained in claim 7 of the patent application. In the manufacturing method, the cup bottom back surface of the cup member and the back surface of the resin frame member are inserted into the same plane. The present invention is capable of improving heat dissipation and has an effect of providing an LED device which can be made into a thin shape -11 - 201007988. Further, even if a blue LED or an ultraviolet LED is used, there is no possibility that the insulating resin is deteriorated, heat dissipation can be improved, the light output of the LED device can be improved, and the effect of forming a package for a thin LED device can be provided. Further, the present invention is a high-compression press which uses a strip of sheet metal such as a ring material to obtain a high productivity and low cost lead frame by using a high-pressure press which is generally used for punching, bending, and drawing. The lead frame is a gap between the cup-shaped LED element mounting portion and the lead portion, and can be narrowed to the limit using the above-described general press technology, and has an effect of miniaturizing the LED device using the lead frame. Moreover, the back surface of the bottom surface of the cup is flat and has the same plane as the resin portion, and the area of the back surface of the cup is designed to increase the heat dissipation effect as much as possible, and the inner surface of the cup is the main reflection surface, so that the press is performed. In the project, it is mirror-finished, and the depth of the cup is deepened as much as possible, and the high-reliability LED package is provided for the subsequent project to provide a firm and stable size for the insertion of the formed lead frame. Effect. [Embodiment] In the present invention, a package for a light-emitting diode (LED) device includes an LED holding surface including a holding region of an LED element, and a frame member surrounding the LED holding surface, and is configured to be light. A package for an LED device in which a transmissive resin seals an element holding space between the LED holding surface and the frame member, wherein a lead wire that is electrically connected to the LED element by wire bonding is exposed on the LED holding surface And a heat dissipation plate portion that thermally contacts the LED element with a surface of 201007988, and an insulating partition portion that partitions the lead portion and the heat dissipation plate portion with an insulating resin, and a back surface side of the LED holding surface is a back surface of the heat dissipation plate portion Since the back surface of the insulating partition portion is exposed to the same plane, heat dissipation can be improved, and a package for fabricating a thin LED device can be obtained. That is, the package of the present invention is such that the back surface of the heat dissipation plate portion which is in thermal contact with the surface of the LED element is exposed to the same plane as the back surface of the insulating portion of the insulating resin. Therefore, heat generated in the LED element can be radiated from the back surface of the heat dissipation plate portion to the substrate. Further, by making the thickness of the heat radiating plate portion thin, the thickness of the package or the LED device can be made thin. In the heat radiating plate portion of the present invention, the thickness of the heat radiating plate portion is the same as that of the lead wire portion, and the heat radiating plate portion can be press-processed simultaneously with the wire portion when the conductive wire portion is subjected to press working from the metal plate constituting the lead portion. As a result, the heat dissipating plate portion and the lead portion can be simultaneously produced, so that the number of parts is small, and it is easy to manufacture and can be produced in a large amount. Further, since the thickness of the metal plate constituting the lead portion is generally about 0.3 mm, the heat radiating plate portion can be formed with the same thickness, and as a result, the thickness of the LED device can be made approximately 0.8 mm. In the present invention, the rear surface of the heat dissipation plate portion and the rear surface of the insulating portion are exposed in the same plane. When the external heat dissipation member or the conductor portion of the printed circuit board is in close contact with the back surface of the heat dissipation plate portion, the heat dissipation effect is good. In particular, in the package or LED device of the present invention which is electrically insulated from the LED, there is no problem even if it is in contact with a heat dissipating member of an electric material such as metal, and thus it can be easily realized. Therefore, the frame member is applied to overlap a portion of the frame member at a portion of the heat dissipating plate portion and the lead portion of the package from -13 to 201007988. The frame member is formed not only by the element holding space in which the light-transmissive resin is sealed, but also has a heat-dissipating plate portion together with the insulating portion of the insulating resin before the work of holding the space by the light-transmitting resin sealing member. The function of the lead portion, the resin constituting the frame member, and the insulating portion formed between the heat dissipating plate portion and the lead portion may be formed of other resins, but it is preferable to form the same resin. If it is the same resin, it can be easily formed by one insertion molding process. The resin to be used is preferably a thermoplastic resin which can be used for insert molding. Further, by bonding the LED element to the small heat sink and then providing good heat conduction to the heat sink portion, it is possible to select rigidity and impact strength in such a manner that the strength of the process of electrically connecting the LED element can be safely connected by wire bonding or the like. Excellent resin. For example, a nylon resin or a liquid crystal polymer resin or the like is used. The heat dissipating plate portion of the present invention is not electrically connected to the lead portion, and is electrically insulated from the lead portion by the insulating portion. When the heat dissipation means for promoting the heat dissipation of the heat dissipation plate portion is mounted on the substrate on which the LED device of the normal package is mounted, when the heat dissipation plate portion is electrically coupled, the heat dissipation means for the substrate can also be electrically generated. limit. Therefore, the electrode and the lead portion of the LED element that is thermally conductively contacted are electrically connected to the surface of the heat dissipating plate portion by wire bonding or the like, but a structure that is electrically connected to the heat dissipating plate portion is not realized. One LED element disposed on the heat sink portion has two terminal portions on the anode and cathode sides. Further, the LED elements are arranged. 201007988 It is also possible to use a plurality of packages in one package. When the LED elements are connected in series, it is preferable to have at least two heat radiating plate portions and a lead portion adjacent thereto. Between the two adjacent heat radiating plate portions, as the lead portion, a relay portion for connecting the LED elements disposed between the heat dissipating plate portions is provided as a standard, and a plurality of rows of LED elements connected in series may be provided. . Thereby, by connecting a plurality of rows in series, it is possible to manufacture a backlight unit for liquid crystal display or a light source for illumination which is high in luminosity and small in size and extremely thin. In addition, if the series connection is used as a red LED group, a green LED group, or a blue LED group, it is possible to perform dot-off or illuminance adjustment, thereby realizing a liquid crystal display that does not require a color filter, or can be used for luminosity or color. The temperature is made into a variable illumination source. Further, since the voltage applied to the LED groups of the respective colors is increased by the series connection, there is an advantage that the efficiency of the power source is increased. The LED element that is in thermal contact with the heat sink portion of the present invention may be a single or plural single-color LED element in which only a white LED, a blue LED, a red LED, a green LED, a yellow LED ® or the like is mounted. Further, when the backlight is used, a plurality of rows and a plurality of columns can be arranged. Therefore, not only white LEDs but also blue LEDs, red LEDs, green LEDs, yellow LEDs, and the like can be arranged, and white LEDs can be used for one LED device. . The mechanical strength of the package of the present invention is such that the LED element is thermally contacted to the heat dissipating plate portion by small wafer bonding, and is electrically connected to the LED element by wire bonding or the like, and it is necessary to seal the light transmissive resin. Strength of. Further, in order to mount a printed circuit board or the like, it is necessary to have an inconvenient strength in the work of leveling or soldering. Therefore, various methods for improving the strength of the package as -15-201007988 can also be performed. For example, in order to increase the bonding strength between the lead portion and the heat dissipating portion and the resin of the insulating portion between the insulating portion and the frame member, the lead portion or the heat dissipating portion is provided with a through-seam. The hole may flow the resin into the through hole, or a part of the periphery of the lead portion or the heat dissipating plate portion may not be formed in a straight line shape, for example, in a zigzag shape, or the resin may be in contact with the resin and the contact of the frame member in the surrounding portion. area. Further, the height position of the LED holding surface of the lead portion of the present invention may be higher than the height position of the LED holding surface of the heat dissipation plate portion. In other words, when a part of the lead portion pressed by the same metal plate as the heat sink portion is bent and the surface of the lead portion is placed at a higher position than the surface height of the heat dissipating plate portion, the insulating resin is poured into the back surface of the lead portion. On the side, the package strength can be increased in a manner of thermally/electrically connecting the LED elements by small wafer bonding or wire bonding. Further, the height position of the surface of the lead portion does not exceed the frame member, and the height position of the electrode of the LED element is formed at the same time, whereby the wire bonding of the LED element and the lead portion is favorably performed. Further, the electrically conductive connecting portion is not exposed in the vicinity of the back surface of the heat dissipating plate portion, and the back surface of the heat dissipating plate portion and the external heat dissipating structure can be directly contacted, so that an effective heat dissipating structure can be easily realized. According to a preferred aspect of the present invention, the heat dissipating plate portion is a cup-shaped member that holds the LED element inside, and the cup-shaped member includes a bottom plate portion that thermally contacts the LED element, and a peripheral edge formed on the bottom plate portion a reflecting surface portion of the portion, wherein the reflecting surface portion is formed by the LED light holding surface and the frame member formed on the outer side of the reflective surface portion by radiation light that is formed on the inner bottom plate portion that prevents thermal conductivity from contacting the inner surface portion of the reflective surface of the reflection -200607988 Since the height is high, even if a blue LED or an ultraviolet LED is used, there is no deterioration of the insulating resin, heat dissipation can be improved, and a package for fabricating a thin LED device can be obtained. In other words, the package of the present invention is such that the cup-shaped member holding the LED element inside is provided with a bottom plate portion that thermally contacts the LED element, and a reflective surface formed on the peripheral portion of the bottom plate portion, preventing the surface from being reflected by the reflection surface. Since the emitted light of the LED element is irradiated to the frame member, even if a blue LED or an ultraviolet LED is used, the light reflection characteristics of the insulating resin disposed outside the reflective surface portion are not deteriorated. Further, the back surface of the bottom plate portion of the cup-shaped member which is in thermal contact with the surface of the LED element is exposed to the same plane as the back surface of the insulating portion of the insulating resin. Therefore, the heat generated in the LED element can be discharged from the back surface of the bottom plate portion of the cup member to the substrate. Further, it is possible to make the rising height of the reflecting surface portion of the cup member thin as much as possible, thereby making it possible to make the thickness of the package or the LED device thin. For example, at the same time as the press working or after the press working, the periphery of the cup-shaped member is bent by press working to form the bottom plate portion and the reflecting surface. At this time, the rising height of the reflecting surface is large, and the emitted light of the LED element that is in contact with the bottom plate portion inside the reflecting surface that is thermally conductive is prevented from being irradiated onto the LED holding surface and the frame member 'through the outside of the reflecting surface or more is required. the height of. As the reflecting surface portion of the present invention, a ring-shaped member is formed on the entire circumference of the bottom plate portion, and a plurality of cup members which are formed on the frame member in order to prevent the radiation light from being irradiated onto the frame member are formed to form a portion of the bottom portion of the bottom plate portion -17-201007988. However, it is also possible to form a plurality of reflective surfaces that surround the edge of the plurality of bottom plates. In the package of the present invention, one or more LED elements are thermally contacted to the heat dissipation plate portion or the cup member by a small wafer bonding method, and the two electrodes of the LED element are bonded to the lead portion by wire bonding. The LED device is obtained by sealing and holding the element holding space formed by the LED holding surface of the LED element and the frame member surrounding the LED holding surface with a light-transmitting resin. As the light-transmitting resin, the light-emitting resin is radiated to the outside without attenuating the light emission of the LED element, or the fluorescent material is contained in the light-transmitting resin, and the light emission of the blue LED, the violet LED, or the ultraviolet LED is converted into The light of the visible light having a wavelength longer than this may be changed to a white light source color as the entire LED device. Further, by appropriately designing the shape of the light-transmitting resin, it is also possible to have a lens effect of enhancing the emitted light in a specific direction. Further, it also has the function of protecting the sealed LED element from humidity or the like. As the light-transmitting resin, for example, a propylene-based resin or a fluorene-based transparent resin or the like is used. It is preferable that the heat radiating plate portion or the inner side surface of the cup member of the present invention is a process in which the reflectance of applied light is increased. On the inner side surface of the cup member, a reflection layer having a high reflectance is formed on a substantially full wavelength region of light radiated from the LED element thermally and in contact with the bottom plate portion. The higher the smoothness of the metal surface, the higher the reflectance of the light. Therefore, by mirror processing, the light emitted by the LED element can have a high reflectance. The package of the present invention includes an LED holding surface 201007988 for mounting an LED element, and a frame member ′ surrounding the LED holding surface. The frame member constituting the LED holding surface and the frame holding member is sealed by a light transmissive resin. A method of manufacturing a package for an LED device, comprising: extracting a lead portion electrically connected to the LED element and electrically forming a part of the LED holding surface, and thermally contacting the LED element with a surface by the same metal plate The drawing of the lead frame material of the heat dissipating plate portion, and the insertion of the lead frame material in the stamping, forming the frame member, and the insertion of the insulating resin between the lead portion and the heat dissipating portion In the above-described insert molding process, on the back surface side where the frame member is formed, the back surface of the heat dissipation plate portion and the back surface of the insulating portion of the insulating resin are exposed to the same plane. Thereby, heat dissipation can be improved, and a thin LED device can be easily obtained in a large amount and at low cost. In the punching process, the heat dissipating plate portion of the present invention and the metal plate portion of the lead portion can be formed of a ring material, and the insulating material portion between the frame member and the lead portion and the heat dissipating plate portion can be formed by insert molding. It can be easily and cost-effectively manufactured. Preferably, before the insert molding process of the present invention, the bending process of the bent lead portion is provided, and the insulating resin is wound around the back side of the lead portion, and the LED element is thermally conductively contacted with the heat radiating plate portion, thereby being increased in The package strength during the period in which the LED elements are electrically connected by wire bonding or the like. In the present invention, a lead frame for a light-emitting diode (LED) package belongs to an LED holding surface constituting a holding field including an LED element, and a resin frame member surrounding the periphery of the LED holding surface, and by wire bonding a light-transmitting resin that is legally connected to an LED element that is exposed to the LED holding surface of the resin frame member, and that is electrically connected to the element holding space of the LED holding surface and the frame member. In the LED package in which the LED holding surface of the LED device and the resin frame member and the lead portion are formed, the lead frame for the LED holding surface and the lead portion is formed. That is, the present invention relates to a lead frame. This lead frame is used, for example, in the case of an LED package formed by insert molding to form an LED holding surface, a resin frame member, and a lead portion. In the obtained LED package, after the LED element was mounted on the LED holding surface and wire-bonded to the lead portion, the LED device was obtained by sealing the element holding space between the LED holding surface and the frame member around the light-shielding resin. The lead frame of the present invention includes a cup-shaped member that holds the LED element inside as an LED holding surface, and a sub-lead frame portion including one or more lead portions, and a connection between the cup-shaped member and the sub-lead portion The cross belt has a bending portion that reduces the gap between the cup member and the sub-lead frame portion to a predetermined gap distance when the cross belt is connected. In this way, a strip of thin metal such as a ring material can be used, and a general press, a bending, and a deep press can be used to obtain a high-productivity and low-cost heat sink. In the present invention, by bending the processed portion, the gap can be reduced. Therefore, for example, it can be reduced to a gap distance shorter than the thickness of the thin metal sheet which is considered to be impossible in normal punching processing. A lead frame for miniaturized LED packages. As the lead frame of the present invention, a press-formable metal sheet which is usually punched, bent, or drawn is used. It is preferable to use a metal ring material, whereby -20-201007988 can be continuously formed. The thin metal plate may be electrically conductive at least on the lead portion exposed to the LED holding surface and electrically connected to the lead portion electrically connected by wire bonding. In the sub-lead frame portion of the present invention, it is preferable that one of the cup-shaped members is disposed to face each other in the middle, and since the lead-shaped members can be disposed on the opposite long sides of the cup-shaped member, the plurality of LED elements can be formed. It is disposed on the cup member to obtain a small and high luminous performance LED device. • The cup-shaped member of the present invention has a cup-shaped inner portion which serves as an LED holding surface, so that the bottom surface and the side surface portion of the cup serve as main reflection portions. Therefore, it is preferable that the mirror-finished inner surface serves to enhance reflection efficiency. At this time, the mirror surface of the reflecting surface can also be obtained by drawing by drawing and by the transfer action of the mirror-finished metal mold. [Embodiment] FIG. 1 is a plan view showing a configuration of an embodiment of a package for a light-emitting diode (LED) device according to the present invention. FIG. 2 is a bottom view of FIG. 1, and FIG. 3 is a first view of FIG. In the longitudinal section view, a is a cross-sectional view of AA, and b is a cross-sectional view of BB. The c-figure is a cross-sectional view of CC. Fig. 4 is a cross-sectional view of Fig. 1, a diagram is a D-D sectional view, b is an E-E sectional view, and c is a F-F sectional view. The package 10 of the present embodiment is an LED device used for sealing and holding the LED holding surface 11 of the LED element with a light-transmitting resin, and the element holding space 13 formed by the frame member 12 surrounding the LED holding surface 11. Specifically, the 'lever holding surface 11 is a lead portion 14 electrically connected to an LED element (not shown) via an insulating partition portion 16 made of an insulating resin, and the conductive element of the -21,079,079,88 LED element is thermally conductively contacted. The heat sink portion 15 of the surface. As shown in Fig. 1, the lead portion 14 and the heat radiating plate portion 15 are formed by punching a metal plate 17 having a thickness of 0.3 mm. The heat radiating plate portion 15 is four, and the wire portion 14 is twelve. In the lead portion 14, the four lead portions provided at the intermediate position are the relay portions 14b that connect the set of LED elements in series. As shown in FIG. 2, FIG. 3, and FIG. 4, the back surface of the LED holding surface 11 is such that the back surface of the lead portion 14 and the heat radiating plate portion 15 is exposed to the back surface of the insulating partition portion 16 by the insulating resin. same plane. In the package 1A, two LED elements are mounted on one @ heat sink portion 15, and the electrodes and lead portions 14 of the LED elements are electrically connected by wire bonding, and the space 13 is held by the light transmissive resin sealing member. Or it is separated by a metal plate 17 before it becomes an LED device. Further, the pair of holes formed in the upper and lower sides of the metal plate 17 are used for the positioning holes 18 when being processed as a ring material. Further, the four small holes formed directly under the frame member 12 of the lead portion 14 and the heat radiating plate portion 15 are the lead wire portion 14 and the heat radiating plate portion 15, and the insulating partition portion by the insulating resin. And a through hole 19 for the joint strength of the frame member 12. Fig. 5 is a plan view showing a configuration of another embodiment of the package for a light-emitting diode (LED) device of the present invention, wherein Fig. 6 is a bottom view of Fig. 5, and Fig. 7 is a longitudinal section of Fig. 5. Figure, a is a cross-sectional view of AA, b is a cross-sectional view of BB, and c is a cross-sectional view of CC. Figure 8 is a cross-sectional view of Figure 5, a-D-D cross-sectional view, b---E-E cross-sectional view, and c-figure F-F cross-sectional view. Fig. 9 is a perspective view showing the LED device of the package for a light-emitting diode (LED) device of Fig. 5. -22-201007988 As shown in Fig. 9, the package 50 of the present embodiment is a frame for holding the LED holding surface 513 of the LED element 61 with the light-transmitting resin 63 and surrounding the periphery of the LED holding surface 51. The LED device 60 of the component holding space 53 of the member 52 is formed. Specifically, the LED holding surface 51 exposes the lead portion 54 electrically connected to the LED element 61 and the line 62 via the insulating partition portion 56, and the heat dissipation of the LED element to the surface. Plate portion 55. Φ As shown in Fig. 5, the lead portion 54 and the heat radiating plate portion 55 are formed by punching a 0.3 mm thick metal plate 57. The heat radiating plate portion 55 is four, and the wire portion 54 is twelve. In the lead portion 54, the four lead portions provided at the intermediate position are the relay portions 54b that connect the set of LED elements in series. As shown in FIGS. 7 and 8, the lead portion 54 (the relay portion 54b) is bent at a position below the frame member 52, and the surface height position of the LED holding surface 51 of the lead portion 54 becomes a heat radiating plate. The surface height position of the portion 55 is also upper. Therefore, as shown in Fig. 6, the back surface of the LED holding surface 51 only covers the back surface of the heat radiating plate portion 55, and the back surface of the insulating partition portion 56 due to the insulating resin of the insulating resin is exposed on the same plane. . Further, the pair of holes formed in the upper and lower sides of the metal plate 57 are used for the positioning holes 58 when the ring material 65 is processed. Further, the four small holes formed directly under the frame member 52 of the lead portion 54 and the heat radiating plate portion 55 are the lift lead portion 54 and the heat radiating plate portion 55, and the insulating partition portion 56 by the insulating resin. And a through hole 59 for the joint strength of the frame member 52. Fig. 1 is an explanatory view showing a manufacturing process of a package for a light-emitting diode (LED) device of Fig. 5 and an LED device using the package. As shown in Fig. -23-201007988, the metal plate 57 is a ring material 87 used for insert molding. As shown in Fig. 2, the forming ring material 87 is punched out to extract the lead portion 54 and the heat radiating plate portion 55.

之後，如c圖所示地，折彎框構件5 2的下方位置的導 線部54。如d圖所示地，藉由插入成形進行製作框構件52 與絕緣樹脂56。這時候，框構件52所形成的背面是散熱板 部55爲與絕緣樹脂56表露出同一平面。如e圖所示地，切 斷圈材料87，得到金屬板57留在周圍的封裝50。如f圖所 Q 示地，從金屬板57分開而得到封裝50。 然後，如第9圖所示地，封裝50是在一個散熱板部55 熱傳導性地接觸兩個LED元件61，而以線62電性地連接各 LED元件61的電極與導線部54，又以光透射性樹脂63密封 元件保持空間33，成爲LED裝置60。又，裝載LED元件61 ，連接打線接合62，密封光透射性樹脂63是進行表示於第 10圖的e圖或f圖的工程也可以。 又，如c圖所示地，在第1〇圖的製程中，包括折彎導 ❹ 線部的工程，惟省略該工程，藉此可製造第1圖的發光二 極體（LED )裝置用封裝及使用該封裝的LED裝置。 第11圖是表示本發明的發光二極體（LED )裝置用封 裝的又一實施例的構成的俯視圖，第12圖是第11圖的仰視 圖。第13圖是第11圖的前視圖，第14圖是第11圖的右側視 圖。第15圖是表示使用第11圖的發光二極體（LED)裝置 用封裝的LED的立體圖。 本實施例的封裝1 1 〇是使用於以光透射性樹脂密封以 -24- 201007988 保持LED元件的LED保持面111，及包圍LED保持面111的 周圍的框構件1 12所構成的元件保持空間1 13的LED裝置者 。具體上LED保持面1 1 1是與LED元件電性地連接的8個導 線部1 14，及將LED元件熱傳導地接觸於表面的平面形狀 呈大約矩形的一個杯狀構件115，經由依絕緣樹脂所致的 絕緣區劃部11 7被表露出。 如第15圖所示地，本實施例的封裝1〇是使用於以光透 〇 射性樹脂123進行密封保持LED元件121的LED保持面1 U， 及包圍LED保持面111的周圍的框構件112所構成的元件保 持空間113的LED裝置120者。又，在第15圖中省略了表示 依絕緣樹脂所致的絕緣區劃部117的圖案線。如第15圖所 示地，大約矩形的杯狀構件115是具備：熱傳導地接觸於 LED元件121的底板部115a，及形成於該底板部115a的緣 部的反射面部1 15b。反射面部115b是環狀地形成於底板部 1 15a的全周緣。反射面部1 15b是被形成於阻止熱傳導地接 β 觸於該反射面部115b內側的底板部115a的LED元件121的 放射光直接照射在經由該反射面部115b的外側的LED保持 面111與框構件112的程度的高度。 又，如第12圖、第13圖、第14圖及第15圖所示地， LED保持面111的背面，是與杯狀構件115的底板部115a的 背面爲與依絕緣區劃部11 7的背面表露出於同一平面》該 封裝110是在1個杯狀構件115裝載4個LED元件121，以線 22電性地連接各LED元件121的電極與導線部114，並以光 透射性樹脂123密封元件保持空間1 13，成爲LED裝置120 -25- 201007988 又，如上述地，杯狀構件115的內側面是需要進行如 光反射率高的處理的再進行鏡面加工較佳。藉此，在鋁製 或表面爲銀製杯狀構件，對於從LED元件所放射的光的大 約全波長域可具有高反射率。又，在銅製等的金屬製杯狀 構件，形成例如銀製反射層並進行鏡面加工表面，藉此， 同樣地對於從LED元件所放射的光的大約全波長域可具有 高反射率。 第16圖是表示本發明的發光二極體（LED )裝置用封 裝的另一實施例的構成的俯視圖。第17圖是第16圖的仰視 圖，第18圖是第16圖的前視圖，第19圖是第16圖的右側視 圖。第20圖是使用第16圖的發光二極體（LED )裝置用封 裝的LED裝置的立體圖。 本實施例的封裝160是使用於以光透射性樹脂173進行 密封保持LED元件的LED保持面1 6 1，及包圍LED保持面 161的周圍的框構件162所構成的元件保持空間163的LED 裝置者。具體上，在LED保持面161是以線電性地連接的 LED元件的兩個導線部164，及以表面熱傳導地接觸LED元 件的平面形狀大約圓形的一個杯狀構件165經由絕緣區劃 部167被表露出。 如第20圖所示地，大約圓形的板狀構件165，是使用 於以光透射性樹脂173進行密封保持LED元件171的LED保 持面161，及包圍LED保持面161的周圍的框構件162所構 成的元件保持空間163的LED裝置1 70者。又，在第20圖中 201007988 ，省略了表示依絕緣樹脂所致的絕緣區劃部167的圖案線 。如第20圖所示地，杯狀構件165是具備熱傳導地接觸於 LED元件171的底板部165a，及形成於該底板部165a的緣 部的反射面部165b。反射面部165b是環狀地形成於底板部 165 a的全周緣，反射面部165 b是被形成於阻止熱傳導地接 觸於該反射面部165b內側的底板部165a的LED元件171的 放射光直接照射在經由該反射面部165b的外側的LED保持 . 面161與框構件162的高度。 又，如第17圖、第18圖、第19圖及第20圖所示地， LED保持面161的背面，是僅杯狀構件165的背面，而與依 絕緣樹脂所致的絕緣區劃部167的背面表露出於同一平面 。該封裝160是在1個杯狀構件165裝載1個LED元件171， 以線172電性地連接LED元件171的電極與導線部164，並 以光透射性樹脂173密封元件保持空間163，成爲LED裝置 120 ° β 又，如上述地，杯狀構件1 65的內側面是需要進行如 光反射率高的處理的再進行鏡面加工較佳。藉此，在鋁製 或表面爲銀製杯狀構件，對於從LED元件所放射的光的大 約全波長域可具有高反射率。又，在銅製等的金屬製杯狀 構件，形成例如銀製反射層並進行鏡面加工表面，藉此， 同樣地對於從LED元件所放射的光的大約全波長域可具有 高反射率。 第21圖是表示本發明的LED封裝用導線架的一實施例 的沖裁成形工程後的說明圖，a是俯視圖，b是前視圖，c -27- 201007988 是側視圖。如第21圖所示地’在圈狀金屬薄板的導線架 211的一區劃的大約中央部拉深加工有杯狀構件212，而在 其杯狀構件212的上下部分別衝裁加工有杯周邊開縫213。 本實施例的導線架211是採用例如0.1 5mm左右的銅合 金或鐵-鎳合金所成導線架。拉深加工與衝裁加工任一加 工都可先加工’惟在拉深加工之後才進行衝裁加工之’則 杯狀構件212的外形變化會變少。杯狀構件212的兩側部是 成爲被連結於導線架211的連結部214。 參 杯狀構件212的杯底面與杯斜面是成爲反射部之故， 因而利用壓機金屬模的模及衝頭’作爲面粗度精修加工成 lym以下的鏡面。又，穿設於導線架11的上下緣部的孔 是導孔215。又，第21圖是僅記載圈狀金屬薄板的一區劃 ，連續於第21圖的a圖的左右。又’在第21圖中對於導線 架211配置橫一列，惟使用寬廣的導線架，或製作成更小 型的封裝，也可配置兩列以上。 第22圖是表示沖裁成形成第21圖的導線架而在杯狀構 @ 件外方形成作爲副導線架部及連結橫帶的部分之後的說明 圖，a圖是俯視圖，b圖是前視圖，c圖是側視圖。如第2 2 圖所示地，在杯狀構件2 1 2的外方形成有=/形狀副導線架 部216於隔著杯狀構件212的相對位置。 各該副導線架部2 1 6的內側，是再以衝裁加工在第2 1 圖所形成的一組杯周邊開縫21 3的兩個導線部21 7朝杯狀構 件2 12的方向延設。又，在副導線架部216的外方，利用衝 裁加工3形狀的副導線架部外方開縫21 9形成有連結於杯 -28- 201007988 連結部214而連結橫帶218所形成的3形狀副導線架部216 〇 又，從副導線架部216所延設的導線部217,是形成有 在前端部正前方L形狀地彎起的曲起部220，而導線部217 的面的高度位置比導線架2 1 1的面還要高。在隔著副導線 架部2 1 6的杯狀構件2 1 2的相對位置穿設有副導線架部2 1 6 的導孔2 1 5。 〇 第23圖是表示彎曲加工第22圖的導線架的副導線架部 及連結橫帶的事先決定的部位之後的說明圖，a圖是俯視 圖，b圖是前視圖，c圖是側視圖，d圖是A-A斷面圖，e圖 是B-B斷面圖，f圖是仰視圖。如第23圖所示地，形成有凸 狀地彎曲連結第22圖的副導線架部216與杯連結部214的一 組連結橫帶218各個的彎曲加工部222。 亦即，在表示於第22圖的4支連結橫帶21 8的各個形成 凸狀的彎曲加工部22 2，藉此，朝杯狀構件21 2方向拉近與 ® 導線部21 7連絡的副導線架部21 6者。 彎曲加工部222並不是兩個昇起部成爲相同長度，藉 由自杯狀構件21 2較遠的昇起部的長度作成較大，而將副 導線架部216的背面高度位置作成與杯狀構件212的背面成 爲同一平面的深度。又，藉此，被連結於副導線架部216 的導線部21 7的高度位置成爲與杯狀構件21 2的緣高度相同 高度位置的方式，事先調整在第22圖的彎起部220的昇起 部高度。 朝杯狀構件21 2方向拉近副導線架部21 6所用的彎曲加 -29- 201007988 工部222的彎曲深度（彎曲大小）’是設計成爲導線部217 的前端位置’及杯狀構件2 12的端緣位置之間隙L可成爲事 先決定的間隙距離就可以。藉由該彎曲加工部222 ’成爲 可縮小間隙L之故，因而例如在一般衝裁加工被認爲不可 能的縮小成比金屬薄板的厚度還要短的間隙距離也成爲可 能。 又，彎曲加工部222是表示凸狀地彎曲加工的實施例 ，惟作成R形狀彎曲加工也可發揮同樣的效果。 @ 第24圖是表示將第23圖的導線架裝設於插入成形金屬 模的狀態的說明圖，a圖是俯視圖，b圖是A-A斷面圖，c圖 是B-B斷面圖，d圖是C-C斷面圖。如第24圖所示地，以上 下金屬模223、22 4夾持形成於第23圖的導線架211的內側 的副導線架部216，而將杯狀構件21 2與包含4個導線部217 的一組副導線架部216裝設於上下金屬模223、224的內部 〇Thereafter, as shown in Fig. c, the wire portion 54 at a position below the frame member 52 is bent. As shown in the figure d, the frame member 52 and the insulating resin 56 are produced by insert molding. At this time, the rear surface formed by the frame member 52 is such that the heat radiating plate portion 55 is exposed to the same plane as the insulating resin 56. As shown in the figure e, the ring material 87 is cut to obtain a package 50 in which the metal plate 57 is left. As shown in Fig. Q, the package 50 is obtained by separating from the metal plate 57. Then, as shown in FIG. 9, the package 50 thermally conductively contacts the two LED elements 61 in one heat dissipation plate portion 55, and electrically connects the electrodes and the lead portions 54 of the respective LED elements 61 with the wires 62. The light-transmitting resin 63 seals the element holding space 33 and becomes the LED device 60. Further, the LED element 61 is mounted, the wire bonding 62 is connected, and the light transmissive resin 63 is sealed. The process shown in Fig. 10 or Fig. f may be performed. Further, as shown in the figure c, in the process of the first drawing, the project of bending the guide wire portion is included, but the project is omitted, whereby the light-emitting diode (LED) device of Fig. 1 can be manufactured. Encapsulating and using the LED device of the package. Fig. 11 is a plan view showing a configuration of still another embodiment of the package for a light-emitting diode (LED) device of the present invention, and Fig. 12 is a bottom view of Fig. 11. Fig. 13 is a front view of Fig. 11, and Fig. 14 is a right side view of Fig. 11. Fig. 15 is a perspective view showing an LED packaged using the light-emitting diode (LED) device of Fig. 11. The package 1 1 本 of the present embodiment is used for sealing the LED holding surface 111 of the LED element with a light transmissive resin to seal the LED element from -24 to 201007988, and the element holding space constituted by the frame member 12 surrounding the periphery of the LED holding surface 111. 1 13 LED device. Specifically, the LED holding surface 11 1 is 8 lead portions 1 14 electrically connected to the LED elements, and a cup-shaped member 115 having a rectangular shape in which the LED elements are thermally conductively contacted to the surface, via an insulating resin. The resulting insulating partition portion 117 is exposed. As shown in Fig. 15, the package 1A of the present embodiment is used for the LED holding surface 1 U for sealing and holding the LED element 121 with the light-transmitting resin 123, and the frame member surrounding the periphery of the LED holding surface 111. The LED device 120 of the component holding space 113 is constituted by 112. Further, in Fig. 15, the pattern line indicating the insulating partition portion 117 by the insulating resin is omitted. As shown in Fig. 15, the approximately rectangular cup-shaped member 115 is provided with a bottom plate portion 115a that thermally contacts the LED element 121, and a reflecting surface portion 15bb formed at the edge of the bottom plate portion 115a. The reflecting surface portion 115b is formed annularly on the entire circumference of the bottom plate portion 15a. The reflected surface portion 15b is directly irradiated with the emitted light of the LED element 121 formed on the bottom plate portion 115a which is in contact with the inside of the reflective surface portion 115b, and the LED holding surface 111 and the frame member 112 passing through the outside of the reflective surface portion 115b. The height of the degree. Further, as shown in Fig. 12, Fig. 13, Fig. 14, and Fig. 15, the back surface of the LED holding surface 111 is the back surface of the bottom plate portion 115a of the cup member 115 and the insulating portion 11a. The back surface is exposed on the same plane. The package 110 is provided with four LED elements 121 in one cup member 115, and the electrodes and the lead portions 114 of the LED elements 121 are electrically connected by a line 22, and the light transmissive resin 123 is used. The sealing member holding space 1 13 is an LED device 120 - 25 - 201007988 Further, as described above, it is preferable that the inner side surface of the cup member 115 is subjected to mirror processing such as a process having a high light reflectance. Thereby, a cup member made of aluminum or having a silver surface can have a high reflectance for substantially the entire wavelength range of light emitted from the LED element. Further, in a metal cup-shaped member such as copper, for example, a silver reflective layer is formed and a mirror-finished surface is formed, whereby a high reflectance can be obtained in about the entire wavelength range of light emitted from the LED element. Fig. 16 is a plan view showing the configuration of another embodiment of the package for a light-emitting diode (LED) device of the present invention. Fig. 17 is a bottom view of Fig. 16, Fig. 18 is a front view of Fig. 16, and Fig. 19 is a right side view of Fig. 16. Figure 20 is a perspective view of an LED device packaged using the light-emitting diode (LED) device of Figure 16. The package 160 of the present embodiment is an LED device used for the LED holding surface 161 for sealing and holding the LED element with the light-transmitting resin 173 and the element holding space 163 constituted by the frame member 162 surrounding the periphery of the LED holding surface 161. By. Specifically, the LED holding surface 161 is a two-conductor portion 164 of the LED element electrically connected in a line, and a cup-shaped member 165 having a circular shape in which the surface of the LED element is thermally conductively contacted with the surface is electrically connected via the insulating partition portion 167. Was exposed. As shown in Fig. 20, the approximately circular plate-shaped member 165 is used for the LED holding surface 161 for sealing and holding the LED element 171 with the light-transmitting resin 173, and the frame member 162 surrounding the periphery of the LED holding surface 161. The component is held by the LED device 1 of the space 163. Further, in Fig. 20, 201007988, the pattern line indicating the insulating partition portion 167 by the insulating resin is omitted. As shown in Fig. 20, the cup member 165 is provided with a bottom plate portion 165a that is in thermal contact with the LED element 171, and a reflecting surface portion 165b formed at the edge of the bottom plate portion 165a. The reflecting surface portion 165b is formed in an annular shape on the entire circumference of the bottom plate portion 165a, and the reflecting surface portion 165b is directly irradiated with the emitted light of the LED element 171 formed on the bottom plate portion 165a which is thermally in contact with the inside of the reflecting surface portion 165b. The LED on the outer side of the reflective surface portion 165b holds the height of the surface 161 and the frame member 162. Further, as shown in Figs. 17, 18, 19, and 20, the back surface of the LED holding surface 161 is only the back surface of the cup member 165, and the insulating portion 167 is formed by the insulating resin. The back side of the table is exposed on the same plane. In the package 160, one LED element 171 is mounted on one cup member 165, the electrode of the LED element 171 and the lead portion 164 are electrically connected by a line 172, and the element holding space 163 is sealed by the light transmissive resin 173 to become an LED. Device 120 ° β Further, as described above, the inner side surface of the cup member 165 is preferably mirror-finished to be subjected to a treatment having a high light reflectance. Thereby, a cup member made of aluminum or having a silver surface can have a high reflectance for substantially the entire wavelength range of light emitted from the LED element. Further, in a metal cup-shaped member such as copper, for example, a silver reflective layer is formed and a mirror-finished surface is formed, whereby a high reflectance can be obtained in about the entire wavelength range of light emitted from the LED element. Fig. 21 is an explanatory view showing a punching and forming process of an embodiment of the lead frame for LED package of the present invention, wherein a is a plan view, b is a front view, and c-27-201007988 is a side view. As shown in Fig. 21, the cup-shaped member 212 is drawn deep at a central portion of a portion of the lead frame 211 of the coiled metal sheet, and the cup-shaped member is separately punched and formed at the upper and lower portions of the cup-shaped member 212. Sew 213. The lead frame 211 of the present embodiment is a lead frame formed of a copper alloy or an iron-nickel alloy of, for example, about 0.15 mm. Any of the drawing and punching processes can be processed first, but the punching process is performed after the drawing process, and the shape change of the cup member 212 is reduced. Both side portions of the cup member 212 are connection portions 214 that are coupled to the lead frame 211. Since the cup bottom surface and the cup slope of the cup-shaped member 212 are the reflecting portions, the mold and the punch ' of the press die are finished as a mirror surface of lym or less as the surface roughness. Further, the hole penetrating the upper and lower edges of the lead frame 11 is a guide hole 215. Further, Fig. 21 is a view showing only one division of the circular metal thin plate, which is continuous to the left and right of the a diagram of Fig. 21. Further, in Fig. 21, the lead frame 211 is arranged in a horizontal row, but a wide lead frame or a smaller package can be used, and two or more columns can be arranged. Fig. 22 is an explanatory view showing a portion which is formed into a lead frame of Fig. 21 and which is formed as a sub-lead frame portion and a connecting cross-belt outside the cup-shaped structure, and Fig. 22 is a plan view, and b is a front view View, c picture is a side view. As shown in Fig. 2, the =/ shape sub-lead frame portion 216 is formed at a position opposite to the cup-shaped member 212 outside the cup-shaped member 2 1 2 . The inner side of each of the sub-lead frame portions 2 16 is further extended by the punching process of the two lead portions 21 7 of the set of cup peripheral slits 21 3 formed in the second drawing toward the cup-shaped member 2 12 . Assume. Further, outside the sub-lead frame portion 216, the outer lead slit 21 9 of the three-shaped sub-lead frame portion is formed by punching, and the connecting portion 214 is connected to the cup -28-201007988 to form the connecting portion 214. The lead wire portion 216 of the shape is further provided with a curved portion 220 that is bent from the front lead portion in the shape of an L, and the height of the surface of the lead portion 217 is formed. The position is higher than the face of the lead frame 2 1 1 . The guide hole 2 15 of the sub-lead portion 2 1 6 is bored at a position opposite to the cup-shaped member 2 1 2 of the sub-lead portion 2 16 . FIG. 23 is an explanatory view showing a sub-lead frame portion of the lead frame of the lead frame of FIG. 22 and a predetermined portion of the connecting cross-belt, wherein a is a plan view, b is a front view, and c is a side view. d is a cross-sectional view of AA, e is a cross-sectional view of BB, and f is a bottom view. As shown in Fig. 23, a bent portion 222 in which a pair of connecting cross members 216 of the sub-lead frame portion 216 and the cup connecting portion 214 of Fig. 22 are bent and connected in a convex shape is formed. In other words, each of the four connecting cross-belts 21 8 shown in Fig. 22 forms a convex curved portion 22 2, whereby the pair of the contact portion with the y-wire portion 21 7 is drawn toward the cup-shaped member 21 2 . The lead frame portion 21 is 6 . The curved processed portion 222 does not have the same length of the two raised portions, and the length of the raised portion that is far from the cup member 21 2 is made larger, and the height of the back surface of the sub-lead portion 216 is made to be cup-shaped. The back surface of the member 212 has a depth of the same plane. In addition, the height position of the lead wire portion 217 connected to the sub-lead frame portion 216 is equal to the height of the edge of the cup-shaped member 21 2, and the lift of the bent portion 220 in Fig. 22 is adjusted in advance. Starting height. The bending depth -29-201007988 of the working portion 222 toward the cup-shaped member 21 2 is increased. The bending depth (bending size) of the working portion 222 is designed to be the front end position of the wire portion 217 and the cup member 2 12 The gap L at the edge position of the edge can be determined as a gap distance determined in advance. Since the curved portion 222' can reduce the gap L, it is also possible to reduce the gap distance which is smaller than the thickness of the thin metal sheet, for example, in general punching. Further, the curved processed portion 222 is an embodiment showing a convex bending process, and the same effect can be obtained by performing the R-shaped bending process. @ Fig. 24 is an explanatory view showing a state in which the lead frame of Fig. 23 is attached to the insert molding die, wherein a is a plan view, a b is a cross-sectional view taken along line AA, and c is a BB sectional view, and d is CC section view. As shown in Fig. 24, the upper and lower metal molds 223, 22 4 sandwich the sub lead frame portion 216 formed on the inner side of the lead frame 211 of Fig. 23, and the cup member 21 2 and the four lead portions 217 are included. A set of sub-lead frame portions 216 are mounted inside the upper and lower metal molds 223, 224.

又，雖未圖示，惟在下金屬模224設置銷，而在該銷 G 嵌合副導線架部216的導孔221，進行下金屬模224與導線 架211的水平方向的定位。垂直方向的定位是以上下金屬 模223、2 24來固定導線部217，同時以上金屬模223推壓杯 狀構件212的底部背面，而以下金屬模224支撐杯狀構件 212的緣部進行定位。又，在圖中，將杯狀構件212的底部 背面作爲上面。 在表示於第24圖的狀態，當自上金屬模223的樹脂注 入澆口 225注入樹脂，則樹脂被塡充於上下金屬模內部的 -30- 201007988 鑄孔（空隙）226，就完成封裝製作工程。又，圍繞上金 屬模2 23的杯狀構件212的底部背面側所突設的突起構件 22 7是樹脂不會繞到該部分者’並防止樹脂爬上杯狀構件 212的背面而確實地露出背面，而且最終使用者將LED裝 置焊接於基盤等之際，誘導熔接劑也防止LED裝置浮起所 用者。 第25圖是表示使用第24圖的金屬模進行插入成形之後 φ 的LED用封裝的說明圖，a圖是俯視圖，b圖是前視圖，c 圖是側視圖，d圖是A-A斷面圖，e圖是B-B斷面圖，f圖是 仰視圖。如第25圖所示地，自導線架2 11切掉封裝23 0的圖 〇 本實施例的封裝230是由：作爲杯狀構件212的內側面 的LED保持面228，及圍繞該LED保持面228的周圍的樹脂 框構件229，及表露出於樹脂框構件229內側面的導線部17 所構成。該封裝230是在LED保持面228裝載LED元件，並 • 藉由打線接合電性地連接所裝載的LED元件與導線部之後 ，以光透射性樹脂密封以LED保持面與樹脂框構件所構成 的元件保持空間，藉此得到LED裝置。 又，在第25圖中，杯狀構件212的緣部與導線部21 7的 高度位置是成爲相同，惟實質上並不一定相同高度。在杯 狀構件21 2的底部裝載LED元件，以搭接線端連接元件上 面的電極與導線部217之際，在最適當高度設定導線部217 的高度就可以，實用上，大致成爲相同高度。 又，對於杯狀構件2 1 2的底面的周圍的杯斜面的傾斜 -31 - 201007988 是對水平方向的放射光以45°較理想，惟來自LED元件的 放射角度未能持定之故，因而兼具縮小封裝230的縱寬W 的要求，而在45°〜80°之範圍被選擇。 設於樹脂框構件229的杯狀構件212的周圍的樹脂斜面 231，是在杯狀構件212的底面及杯斜面所反射的光一部分 有洩漏時，爲了再反射洩漏的光而成爲副反射板之故，因 而使用如白色的容易反射的顏色的樹脂（例如尼龍系樹脂 或液晶聚合物系樹脂等）。 間距間隙L是由縮小封裝230的縱寬度的要求或是縮短 搭接線端的要求較佳，惟將樹脂確實地塡充於間距間，則 以較大較佳。又，在本成形技術中，成爲可變窄間距間隙 L 至 0.1 mm e 如第24圖及第25圖所示地，各個導線架211是被分開 經加工，惟未分開而在表示於第24圖及第25圖的加工工程 結束之時刻才分開也可以。 第26圖是表示本發明的LED封裝用導線架的另一實施 例的拉深成形及沖裁成形而形成杯狀構件，副導線架部及 橫帶部之後的說明圖，a圖是俯視圖，b圖是前視圖，c圖 是側視圖。如第2 6圖所示地，本實施例是與上述實施例相 比較，對導線數少又更小型的封裝的應用例。 如圖所示地，在圈狀金靥薄板的導線架261的一區劃 的大約中央部，被拉深加工有杯狀構件262,而在其杯狀 構件262的周圍被衝裁加工有杯周邊開縫263。 杯周邊開縫263是由：形成兩個導線部267由一個副導 201007988 線架部266 ’及將該副導線架部266連結於杯狀構件262的 上緣部的連結橫帶268 ’及從杯狀構件262下緣部連結於導 線架261的連結部264，及形成於導線架261的內側的兩個 導線部267所構成。 本實施例的導線架261也採用0.1 5mm左右的銅合金或 鐵-鎳合金所成的導線架。拉深加工或衝裁加工任一加工 都可先加工，惟在拉深加工之後才進行衝裁加工，則杯狀 構件262的外形變化會變少。 又，與上述的實施例同樣地，杯狀構件2 62的杯底面 與杯斜面是成爲反射部之故，因而利用壓機金屬模的模及 衝頭，作爲面粗度精修成1 /z m以下的鏡面。又，導線架 261的上下緣部及副導線架部266的孔是導孔265。又，第 26圖是僅記載圈狀金屬薄板的一區劃，連續於第26圖的a 圖的左右。又，在第26圖中對於導線架261配置橫一列， 惟使用寬廣的導線架，或製作成更小型的封裝’也可配置 ® 兩列以上。 第27圖是表示彎曲加工第26圖的導線架的副導線架部 的導線部之後的說明圖，a圖是俯視圖’ b圖是前視圖’ c 圖是側視圖，d圖是A-A斷面圖’ e圖是B-B斷面圖，f圖是 仰視圖。如第27圖所示地，將配置於杯狀構件262的周圍 的導線部26 7的前端部正前方形成有L形狀地彎起的彎起部 270，使得導線部267的面高度位置成爲比導線架261的面 還要筒。 亦即，在第27圖中，杯狀構件262的緣部對於導線架 -33- 201007988 26 1成爲相同平面’成爲杯狀構件262全體沈下的狀態、或 是成爲導線部267浮起的狀態。 第28圖是表示折斷加工及彎曲加工第27圖的導線架的 連結橫帶的所定部位之後的說明圖° a圖是俯視圖’ b圖是 前視圖，c圖是側視圖’ d圖是A-A斷面圖，e圖是B-B斷面 圖，f圖是仰視圖。如圖所示地’在接近於連結部264與連 結橫帶268的杯狀構件262的位置形成有具段差的彎曲加工 部271，而在較遠位置形成有凸狀地彎曲的彎曲加工部272 〇 亦即，藉由在連結部264與連結橫帶268施加具段差彎 曲而形成具段差加工部271，使得導線架261朝垂直下方向 下降，同時地導線部2 67也下降相同尺寸。具段差彎曲尺 寸是作成導線架211的背面，與杯狀構件262的背面成爲相 同平面的尺寸。 又，在連結部264與連結橫帶268施加R狀或凸狀的彎 曲加工，形成彎曲加工部272，藉此副導線架部261的導線 部2 67及形成於導線架261內側的導線部267、及杯狀構件 2 62之間隙距離變成窄小。又，形成具段差的彎曲加工部 271與R狀或凸狀的彎曲加工部2 72的順序是那一方先形成 都可以。 形成於用以將導線部267與杯狀構件262之間變窄小的 連結部264與連結橫帶268的彎曲加工部272的彎曲深度（ 彎曲大小），是設計成爲導線部267的前端位置、及杯狀 構件262的端緣位置的間距間隙L作爲事先決定的間隙距離 201007988 就可以。藉由該彎曲加工部272，可縮小間距間隙L之故’ 因而成爲也可縮小例如在通常衝裁加工認爲不可能的金屬 薄板厚度還要短的間隙距離。 第29圖是表示將第28圖的導線架裝設於插入成形金屬 模的狀態的說明圖，a圖是仰視圖，b圖是A-A斷面圖，c圖 是B-B斷面圖。如第29圖所示地，分開第28圖的導線架261 ，而在上下金屬模273、2 74，將杯狀構件262與4個導線部 • 267裝設於內部。 在表示於第29圖的狀態，當自上金屬模273的樹脂注 入澆口 275注入樹脂，則樹脂被塡充於上下金屬模內部的 鑄孔（空隙）276，就完成封裝製作工程。又，圍繞上金 屬模273的杯狀構件262的底部背面側所突設的突起構件 2 77是樹脂不會繞到該部分者，並防止樹脂爬上杯狀構件 2 62的背面而確實地露出背面，而且最終使用者將LED裝 置焊接於基盤等之際，誘導熔接劑也防止LED裝置浮起所 _ 用者。 又，導線架261的導孔26 5是以依次移送壓機移送導線 架261時的基準孔，惟將導線架261裝設於上下金屬模273 、2 74而也可使用作爲水平方向的定位的基準孔。 第30圖是表示使用第29圖的金屬模而進行插入成形之 後的LED用封裝的說明圖，a圖是俯視圖，b圖是前視圖， c圖是側視圖，d圖是A-A斷面圖’ e圖是B-B斷面圖，f圖是 仰視圖。如第30圖所示地，自導線架261分開封裝280的圖 式。 -35- 201007988 又，對於杯狀構件262的底面的周圍的杯斜面的傾斜 '與上述的實施例同樣地，兼具縮小封裝230的縱寬度W 的要求而在45°〜80°之範圍被選擇，針對於間距間隙L是 由縮小封裝280的縱寬度的要求或是縮小搭接線端的要求 較佳，惟將樹脂確實地塡充於間距間，則以較大較佳。又 ，在本成形技術中，成爲可變窄間距間隙L到0.1mm。 本實施例的封裝280是由：作爲杯狀構件262的內側面 的LED保持面278、及圍繞該LED保持面278的周圍的樹脂 框樹脂構件279、及表露出於樹脂框構件279的內側面的導 線部267所構成。該封裝2 8 0是在LED保持面278裝載LED元 件，並藉由打線接合電性地連接所裝載的LED元件與導線 部之後，以光透射性樹脂密封以LED保持面與樹脂框構件 所構成的元件保持空間，藉此得到LED裝置。 【圖式簡單說明】 第1圖是表示本發明的發光二極體（LED )裝置用封 ⑬ 裝的一實施例的構成的俯視圖。 第2圖是第1圖的仰視圖。 第3圖是第1圖的縱斷面圖，a圖是A-A斷面圖，b圖是 B-B斷面圖，c圖是C-C斷面圖。 第4圖是第1圖的橫斷面圖，a圖是D-D斷面圖，b圖是 E-E斷面圖，c圖是F-F斷面圖。 第5圖是表示本發明的發光二極體（LED )裝置用封 裝的其他實施例的構成的俯視圖。 -36- 201007988 第6圖是第5圖的仰視圖。 第7圖是第5圖的縱斷面圖，a圖是A-A斷面圖，b圖是 B-B斷面圖，c圖是C-C斷面圖。 第8圖是第5圖的橫斷面圖，a圖是D-D斷面圖，b圖是 E-E斷面圖，c圖是F-F斷面圖。 第9圖是使用第5圖的發光二極體（LED )裝置用封裝 的LED裝置的立體圖。 ❿ 第10圖是表示第5圖的發光二極體（LED)裝置用封 裝及使用該封裝的LED裝置的製作工程的說明圖。 第11圖是表示本發明的發光二極體（LED )裝置用封 裝的其他實施例的構成的俯視圖。 第12圖是第11圖的仰視圖。 第13圖是第11圖的前視圖。 第1 4圖是第1 1圖的右側視圖。 第15圖是使用第11圖的發光二極體（LED)裝置用封 _ 裝的LED裝置的立體圖。 第16圖是表示本發明的發光二極體（LED )裝置用封 裝的又一實施例的構成的俯視圖。 第17圖是第16圖的仰視圖。 第18圖是第16圖的前視圖。 第19圖是第16圖的右側視圖。 第20圖是使用第16圖的發光二極體（LED)裝置用封 裝的LED裝置的立體圖。 第21圖是本發明的發光二極體（Led )裝置用封裝的 -37- 201007988 一實施例的拉深成形及沖裁成形，而形成杯狀構件之後的 說明圖，a圖是俯視圖，b圖是前視圖，c圖是側視圖。 第22圖是沖裁成形於第21圖的導線架而在杯狀構件的 外方形成成爲副導線架部及連結橫帶的部分之後的說明圖 ，a圖是俯視圖，b圖是前視圖，c圖是側視圖。 第23圖是彎曲加工第22圖的導線架的副導線架部及連 結橫帶的事先決定的部位之後的說明圖，a圖是俯視圖，b 圖是前視圖，c圖是側視圖，d圖是A-A斷面圖，e圖是B-B ❹ 斷面圖，f圖是仰視圖。 第24圖是表示將第23圖的導線架裝設於插入成形金屬 模的狀態的說明圖，a圖是俯視圖，b圖是前視圖，c圖是 側視圖，d圖是A-A斷面圖，e圖是B-B斷面圖，f圖是仰視 圖。 第25圖是使用第24圖的金屬模而進行插入成形之後的 LED用封裝的說明圖，a圖是俯視圖，b圖是前視圖，c圖 是側視圖，d圖是A-A斷面圖，e圖是B-B斷面圖，f圖是仰 Θ 視圖。 第26圖是本發明的LED封裝用導線架的其他實施例的 拉深成形及沖裁成形’而形成杯狀構件、副導線架部及橫 帶部之後的說明圖，a圖是俯視圖，b圖是前視圖，c圖是 側視圖 第27圖是彎曲加工第26圖的導線架的副導線架部的導 線部之後的說明圖’ a圖是俯視圖，b圖是前視圖，c圖是 側視圖，d圖是A-A斷面圖，e圖是B-B斷面圖，f圖是仰視 -38- 201007988 圖。 第28圖是折斷加工及彎曲加工第27圖的導線架的連結 橫帶的所定部位之後的說明圖’ a圖是俯視圖’ b圖是前視 圖，c圖是側視圖，d圖是A-A斷面圖，e圖是B-B斷面圖’ f 圖是仰視圖。 第29圖是表示第27圖的導線架裝設於插入成形金屬模 的狀態的說明圖，a圖是仰視圖’ b圖是A-A斷面圖’ c圖是 B - B斷面圖。 第30圖是使用第29圖的金屬模而進行插入成形之後的 LED用封裝的說明圖，a圖是俯視圖’ b圖是前視圖，c圖 是側視圖，d圖是A-A斷面圖，e圖是B-B斷面圖，f圖是仰 視圖。 【主要元件符號說明】 10，50 :封裝 Ο 1 1，51 : LED 保持面 12，52 :框構件 13 ’ 53 :元件保持空間 14，54 :導線部 14b，5 4b :中繼部 15 ’ 55 :散熱板部 1 6，5 6 :絕緣樹脂 17，57 :金屬板 18，58 :定位孔 -39- 201007988 1 9，5 9 :穿設孔 60 ： LED裝置 6 1 : L E D元件 62 :線 63 :光透射性樹脂 65 :圈材料 110 ， 160 :封裝 1 1 1，161 : LED 保持面 1 1 2，1 6 2 :框構件 1 1 3，1 6 3 :元件保持空間 114 ， 164 :導線部 1 1 5，1 6 5 :杯狀構件 115a，165a:底板部 115b，165b:反射面部 117，167:絕緣區劃部 120，170 ： LED 裝置 121，171 ： LED 元件 122 ， 172 ：線 1 2 3，1 7 3 :光透射性樹脂 2 1 1，2 6 1 :導線架構件 212，262 :杯狀構件 2 1 3，2 6 3 :杯周邊開縫 214 :杯連結部 264 :連結部 201007988Further, although not shown, a pin is provided in the lower mold 224, and the guide hole 221 of the sub-lead frame portion 216 is fitted to the pin G to position the lower mold 224 and the lead frame 211 in the horizontal direction. The positioning in the vertical direction is the upper and lower metal molds 223, 2 24 to fix the wire portion 217, while the upper metal mold 223 pushes the bottom back surface of the cup member 212, and the lower metal mold 224 supports the edge portion of the cup member 212 for positioning. Further, in the figure, the bottom back surface of the cup member 212 is referred to as an upper surface. In the state shown in Fig. 24, when the resin is injected from the resin injection gate 225 of the upper metal mold 223, the resin is filled in the -30-201007988 casting hole (void) 226 inside the upper and lower molds, and the packaging is completed. engineering. Further, the protruding member 227 protruding from the bottom back side of the cup member 212 surrounding the upper metal mold 23 is such that the resin does not wrap around the portion and prevents the resin from climbing up the back surface of the cup member 212 to be surely exposed. On the back side, and when the end user solders the LED device to the base plate or the like, the inducing flux also prevents the LED device from floating. Fig. 25 is an explanatory view showing a package for LEDs of φ after insert molding using the mold of Fig. 24, wherein a is a plan view, a view of a front view, a view of a side view, and a view of a cross-sectional view of the AA. The e diagram is a BB sectional view, and the f diagram is a bottom view. As shown in Fig. 25, the package 230 of the present embodiment is cut away from the lead frame 211. The package 230 of the present embodiment is composed of an LED holding surface 228 as an inner side surface of the cup member 212, and a holding surface surrounding the LED. The resin frame member 229 around the 228 and the lead portion 17 exposed on the inner side surface of the resin frame member 229 are formed. The package 230 is provided with an LED element mounted on the LED holding surface 228, and electrically connected to the mounted LED element and the lead portion by wire bonding, and then sealed with a light-transmitting resin to form an LED holding surface and a resin frame member. The component holds space, thereby obtaining an LED device. Further, in Fig. 25, the edge portion of the cup member 212 and the height position of the lead portion 21 7 are the same, but they are not substantially the same height. When the LED element is mounted on the bottom of the cup member 21 2 and the electrode on the upper surface of the terminal is connected to the lead portion 217, the height of the lead portion 217 can be set at the optimum height, and practically, the height is substantially the same. Further, the inclination of the cup slope around the bottom surface of the cup-shaped member 2 1 2 -31 - 201007988 is preferably 45° for the horizontal direction of the radiation, but the radiation angle from the LED element is not fixed, and thus There is a requirement to reduce the width W of the package 230, and is selected in the range of 45° to 80°. The resin bevel 231 provided around the cup-shaped member 212 of the resin frame member 229 is a sub-reflecting plate for re-reflecting the leaked light when a part of the light reflected by the bottom surface of the cup-shaped member 212 and the beveled surface of the cup is leaked. Therefore, a resin such as a white color, which is easily reflected, such as a nylon resin or a liquid crystal polymer resin, is used. The pitch L is preferably required to reduce the vertical width of the package 230 or to shorten the requirements of the terminal. However, it is preferable to replenish the resin between the pitches. Further, in the present molding technique, the variable narrow pitch L is adjusted to 0.1 mm. As shown in Figs. 24 and 25, the respective lead frames 211 are separately processed, but are not separated but are shown in the 24th. It is also possible to separate the drawings and the processing at the end of Fig. 25 at the end of the processing. FIG. 26 is an explanatory view showing a cup-shaped member, a sub-lead frame portion, and a cross-belt portion after deep drawing and punch forming of another embodiment of the lead frame for LED package according to the present invention, and FIG. Figure b is a front view and Figure c is a side view. As shown in Fig. 26, this embodiment is an application example of a package having a small number of wires and a smaller size than the above-described embodiment. As shown, a cup member 262 is drawn deep at a central portion of a portion of the lead frame 261 of the ring-shaped sheet metal sheet, and is punched around the cup member 262 to have a cup periphery open. Sew 263. The cup peripheral slit 263 is formed by forming a pair of lead portions 267 by a sub-guide 201007988 bobbin portion 266' and connecting the sub-lead frame portion 266 to the connecting cross-belt 268' of the upper edge portion of the cup-shaped member 262 and The lower edge portion of the cup member 262 is connected to the connecting portion 264 of the lead frame 261 and the two lead portions 267 formed inside the lead frame 261. The lead frame 261 of this embodiment also employs a lead frame made of a copper alloy or an iron-nickel alloy of about 0.15 mm. Any processing such as drawing or punching can be processed first, but the punching is performed after the drawing process, and the shape change of the cup member 262 is reduced. Further, in the same manner as in the above-described embodiment, the cup bottom surface and the cup slope of the cup member 262 are the reflecting portions. Therefore, the mold and the punch of the press die are used as the surface roughness to be 1 / zm or less. The mirror. Further, the upper and lower edges of the lead frame 261 and the holes of the sub-lead portion 266 are the guide holes 265. Further, Fig. 26 is a view showing only one division of the ring-shaped metal thin plate, which is continuous to the left and right of the a diagram of Fig. 26. Further, in Fig. 26, the lead frame 261 is arranged in a horizontal row, but a wide lead frame or a smaller package can be used. Fig. 27 is an explanatory view showing the lead portion of the sub-lead frame portion of the lead frame of the lead frame of the bending process, and Fig. 27 is a plan view of the front view 'b' is a side view, and d is a cross-sectional view of the AA 'e is a BB sectional view, and f is a bottom view. As shown in Fig. 27, a curved portion 270 that is bent in an L shape is formed directly in front of the front end portion of the lead portion 267 disposed around the cup member 262, so that the surface height position of the lead portion 267 becomes a ratio The face of the lead frame 261 is also a cylinder. That is, in Fig. 27, the edge portion of the cup-shaped member 262 is in the same plane with respect to the lead frame - 33 - 201007988 26 1 , and the cup member 262 is completely sunk or the wire portion 267 is floated. Fig. 28 is an explanatory view showing a predetermined portion of the connecting cross-belt of the lead frame of Fig. 27 in the breaking process and the bending process. Fig. a is a plan view, and b is a front view, and c is a side view. In the face view, the e picture is a BB sectional view, and the f picture is a bottom view. As shown in the figure, a curved portion 271 having a step is formed at a position close to the cup portion 262 of the joint portion 264 and the joint belt 268, and a curved portion 272 that is convexly curved is formed at a far position. That is, the stepped portion 271 is formed by applying the stepped bending to the joint portion 264 and the joint belt 268 so that the lead frame 261 is lowered in the vertical downward direction, and the lead portion 2 67 is also lowered by the same size. The stepped bending dimension is the back surface of the lead frame 211, and is the same plane as the back surface of the cup member 262. Further, an R-shaped or convex-shaped bending process is applied to the connecting portion 264 and the connecting cross-belt 268 to form the bent portion 272, whereby the lead portion 267 of the sub-lead portion 261 and the lead portion 267 formed inside the lead frame 261 are formed. The gap distance between the cup member 2 and the cup member 2 62 becomes narrow. Further, the order in which the curved portion 271 having a step and the curved portion 2 72 having an R shape or a convex shape are formed may be formed first. The bending depth (bending size) formed between the connecting portion 264 for narrowing the gap between the lead portion 267 and the cup member 262 and the bent portion 272 connecting the lateral strip 268 is designed to be the leading end position of the lead portion 267. The pitch L of the edge position of the cup member 262 may be a predetermined gap distance 201007988. By the curved portion 272, the pitch L can be narrowed. Therefore, it is possible to reduce the gap distance which is, for example, shorter than the thickness of the thin metal sheet which is considered to be impossible in normal punching. Fig. 29 is an explanatory view showing a state in which the lead frame of Fig. 28 is attached to the insert molding die, wherein a is a bottom view, a b is a cross-sectional view taken along line A-A, and c is a cross-sectional view taken along line B-B. As shown in Fig. 29, the lead frame 261 of Fig. 28 is separated, and the cup member 262 and the four lead portions 267 are mounted inside the upper and lower molds 273, 2 74. In the state shown in Fig. 29, when resin is injected from the resin injection gate 275 of the upper metal mold 273, the resin is filled in the casting hole (void) 276 inside the upper and lower molds, and the package manufacturing process is completed. Further, the projecting member 2 77 projecting from the bottom back side of the cup member 262 surrounding the upper metal mold 273 is such that the resin does not wrap around the portion, and prevents the resin from climbing up the back surface of the cup member 262 to be surely exposed. On the back side, and when the end user solders the LED device to the base or the like, the inducing flux also prevents the LED device from floating. Moreover, the guide holes 26 5 of the lead frame 261 are reference holes which are sequentially transferred to the transfer frame 261 of the press, but the lead frame 261 is attached to the upper and lower metal molds 273 and 2 74 and can also be used as a horizontal positioning. Reference hole. Fig. 30 is an explanatory view showing an LED package after insert molding using the metal mold of Fig. 29, wherein a is a plan view, b is a front view, c is a side view, and d is a cross-sectional view of AA' The e diagram is a BB sectional view, and the f diagram is a bottom view. As shown in Fig. 30, the pattern of the package 280 is separated from the lead frame 261. Further, in the same manner as in the above-described embodiment, the inclination of the cup slope of the cup member 262 is reduced in the range of 45° to 80° in the range of 45° to 80°. Alternatively, it is preferable that the pitch L is reduced by the requirement of reducing the vertical width of the package 280 or narrowing the terminal. However, it is preferable to replenish the resin between the pitches. Further, in the present molding technique, the variable narrow pitch L is 0.1 to 0.1 mm. The package 280 of the present embodiment is composed of an LED holding surface 278 as an inner side surface of the cup member 262, a resin frame resin member 279 surrounding the periphery of the LED holding surface 278, and an inner side surface exposed to the resin frame member 279. The wire portion 267 is formed. The package 280 is provided with an LED element mounted on the LED holding surface 278, and electrically connected to the mounted LED element and the lead portion by wire bonding, and then sealed with a light-transmitting resin to form an LED holding surface and a resin frame member. The components hold space, thereby obtaining an LED device. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a plan view showing a configuration of an embodiment of a package for a light-emitting diode (LED) device according to the present invention. Fig. 2 is a bottom view of Fig. 1. Fig. 3 is a longitudinal sectional view of Fig. 1, wherein Fig. a is a cross-sectional view taken along line A-A, b is a cross-sectional view taken along line B-B, and c is a cross-sectional view taken along line C-C. Fig. 4 is a cross-sectional view of Fig. 1, wherein Fig. a is a D-D sectional view, Fig. b is an E-E sectional view, and c is a F-F sectional view. Fig. 5 is a plan view showing the configuration of another embodiment of the package for a light-emitting diode (LED) device of the present invention. -36- 201007988 Figure 6 is a bottom view of Figure 5. Fig. 7 is a longitudinal sectional view of Fig. 5, a diagram of A-A, a diagram of B-B, and a section C of C-C. Fig. 8 is a cross-sectional view of Fig. 5, a diagram is a D-D sectional view, b is an E-E sectional view, and c is a F-F sectional view. Fig. 9 is a perspective view of an LED device packaged using the light-emitting diode (LED) device of Fig. 5. Fig. 10 is an explanatory view showing a manufacturing process of a package for a light-emitting diode (LED) device of Fig. 5 and an LED device using the package. Fig. 11 is a plan view showing the configuration of another embodiment of the package for a light-emitting diode (LED) device of the present invention. Fig. 12 is a bottom view of Fig. 11. Figure 13 is a front view of Figure 11. Figure 14 is a right side view of Figure 11. Fig. 15 is a perspective view showing an LED device mounted on a light-emitting diode (LED) device of Fig. 11. Figure 16 is a plan view showing a configuration of still another embodiment of the package for a light-emitting diode (LED) device of the present invention. Figure 17 is a bottom view of Figure 16. Figure 18 is a front view of Figure 16. Figure 19 is a right side view of Figure 16. Figure 20 is a perspective view of an LED device sealed using the light-emitting diode (LED) device of Figure 16. Fig. 21 is an explanatory view showing a cup-shaped member after deep drawing and punch forming of the embodiment of the package for a light-emitting diode (Led) device of the present invention, and a plan view, b The figure is a front view and the c picture is a side view. Fig. 22 is an explanatory view after punching the lead frame formed in Fig. 21 and forming a portion which becomes a sub-lead frame portion and a connecting cross-belt outside the cup member, wherein a is a plan view and a b is a front view. Figure c is a side view. Figure 23 is an explanatory view after bending the sub-lead frame portion of the lead frame of Fig. 22 and the predetermined portion of the connecting cross-belt, wherein a is a plan view, b is a front view, and c is a side view, d-picture It is a cross-sectional view of AA, e is a cross-sectional view of BB ,, and f is a bottom view. Fig. 24 is an explanatory view showing a state in which the lead frame of Fig. 23 is attached to the insert molding die, wherein a is a plan view, a b is a front view, c is a side view, and d is a cross-sectional view taken along line AA. The e diagram is a BB sectional view, and the f diagram is a bottom view. Fig. 25 is an explanatory view of the LED package after insert molding using the metal mold of Fig. 24, wherein a is a plan view, b is a front view, c is a side view, and d is a cross-sectional view of AA, The figure is a BB sectional view, and the f picture is a back view. Fig. 26 is an explanatory view showing a cup-shaped member, a sub-lead frame portion, and a cross-belt portion after deep drawing and punching forming of another embodiment of the lead frame for LED package according to the present invention, wherein a is a plan view, b Fig. 27 is a front view, and Fig. 27 is a side view. Fig. 27 is an explanatory view after the lead portion of the lead frame portion of the lead frame of the lead frame of Fig. 26 is bent. Fig. a is a plan view, b is a front view, and c is a side view View, d picture is AA sectional view, e picture is BB sectional view, f picture is upward view -38- 201007988 picture. Figure 28 is an explanatory view after the predetermined portion of the connecting cross-belt of the lead frame of Fig. 27 is broken and bent. 'a is a top view' b is a front view, c is a side view, and d is a AA cross section Figure, e is a BB cross-section 'f Figure is a bottom view. Fig. 29 is an explanatory view showing a state in which the lead frame of Fig. 27 is attached to the insert molding die, and Fig. 5 is a bottom view </b> is a cross-sectional view taken along line A-A and Fig. c is a B-B sectional view. Fig. 30 is an explanatory view of the LED package after insert molding using the metal mold of Fig. 29, and Fig. a is a plan view, Fig. 4 is a front view, c is a side view, and d is a cross-sectional view of the AA, e The figure is a BB sectional view, and the f picture is a bottom view. [Description of main component symbols] 10,50 : Package Ο 1 1,51 : LED holding surface 12, 52 : Frame member 13 ' 53 : Component holding space 14, 54 : Wire portion 14b, 5 4b : Relay portion 15 ' 55 : heat dissipation plate portion 1, 6, 5 6 : insulating resin 17, 57 : metal plate 18, 58 : positioning hole - 39 - 201007988 1 9, 5 9 : through hole 60 : LED device 6 1 : LED element 62 : line 63 : light transmissive resin 65 : ring material 110 , 160 : package 1 1 1,161 : LED holding surface 1 1 2,1 6 2 : frame member 1 1 3,1 6 3 : element holding space 114, 164 : lead portion 1 1 5, 1 6 5 : cup-shaped members 115a, 165a: bottom plate portion 115b, 165b: reflective surface portion 117, 167: insulating partition portion 120, 170: LED device 121, 171: LED element 122, 172: line 1 2 3 , 1 7 3 : light transmissive resin 2 1 1, 2 6 1 : wire frame member 212, 262 : cup member 2 1 3, 2 6 3 : cup peripheral slit 214 : cup joint portion 264 : joint portion 201007988

215， 265 ：導孑L 2 1 6 : 266 :副導線架部 217， 267:導線部 218，268 :連結橫帶 2 1 9 :副導線架部外方開縫 220 &gt; 270 :彎起部 221 ，導孔 Φ 271 :具段差的折彎加工部 222 :彎曲加工部 L :杯緣部與導線架之間距間隙 223，2 73 :上金屬模 224，274 :下金屬模 225，275 :樹脂注入澆口 226，276 :鑄孔（上下金屬模的內部空隙） 227，2 77 :突起構件 參 22 8,278: LED保持面 229，279 :樹脂框構件 23 0，280 ：封裝 231 :樹脂斜面 W :縱寬度 -41 -215, 265: guide L 2 1 6 : 266 : sub lead frame portion 217, 267: lead portion 218, 268: connecting cross strap 2 1 9 : outer lead bobbin portion outer slit 220 &gt; 270 : bent portion 221, guide hole Φ 271: bending portion 222 having a step: bending portion L: gap between the edge portion of the cup and the lead frame 223, 2 73: upper metal mold 224, 274: lower metal mold 225, 275: resin Injection gates 226, 276: cast holes (internal spaces of upper and lower metal molds) 227, 2 77: projecting members 222,278: LED holding faces 229, 279: resin frame members 23 0, 280: package 231: resin bevel W: Vertical width -41 -

Claims (1)

201007988 七、申請專利範圍： 1·—種發光二極體（led )裝置用封裝，屬於具備 :包含LED元件的保持領域的LED保持面，及包圍該 LED保持面的周圍的框構件，構成以光透射性樹脂密封上 述LED保持面與上述框構件所構成的元件保持空間的 LED裝置所用的封裝，其特徵爲： 在上述LED保持面，表露出藉由打線接合與LED元 件電性地連接的導線部，及以表面熱傳導地接觸於LED 元件的散熱板部’及以絕緣樹脂隔開上述導線部與散熱板 部的絕緣區劃部， 上述LED保持面的背面側是上述散熱板部的背面與 上述絕緣區劃部之背面表露出成同一平面。 2. 如申請專利範圍第1項所述的發光二極體（LED )裝置用封裝，其中， 上述導線部的LED保持面的表面高度位置比散熱板 部的LED保持面的表面高度位置還位於上位。 3. 如申請專利範圍第1項或第2項所述的發光二極 體（LED)裝置用封裝，其中， 上述散熱板部爲將LED元件保持於內側的杯狀構件 上述杯狀構件是具備：熱傳導地接觸於LED元件的 底板部，及形成於該底板部的周緣部的反射面部， 上述反射面部是形成於阻止熱傳導性地接觸於該反射 面部的內側底板部的LED元件的放射光照射在經由該反 201007988 射面部的外側的上述LED保持面與框構件的高度。 4. 如申請專利範圍第1項至第3項中任一項所述的 發光二極體（LED )裝置用封裝，其中， 在上述杯狀構件的內側面，對於由熱傳導性地接觸於 底板部的LED元件所放射的光的大約全波長域形成有具 備高反射率的反射層。 5. —種發光二極體（LED)封裝用導線架，屬於構 # 成具備包含LED元件的保持領域的LED保持面，及包圍 該LED保持面的周圍的樹脂框構件，及藉由打線接合與 表露出於該樹脂框構件的LED保持面的LED元件電性地 連接的導線部，及密封以上述LED保持面與上述框構件 所構成的元件保持空間的光透射性樹脂的LED裝置的上 述LED保持面與樹脂框構件及導線部所成的LED用封裝 中，構成上述LED保持面與導線部所用的導線架，其特 徵爲： 具備：作爲上述LED保持面，將LED元件保持於內 側的杯狀構件，及具備上述導線部1個以上的副導線架部 ’及連結上述杯狀構件與副導線架部的連結橫帶， 在上述連結橫帶，又具備將上述杯狀構件與副導線架 部之間隙縮小成事先決定的間隙距離的彎曲加工部。 6·如申請專利範圍第5項所述的發光二極體（LED )封裝用導線架，其中， 一組的上述副導線架部爲以上述杯狀構件作爲中間相 對地配置。 -43- 201007988 7. —種發光二極體（LED )封裝用導線架的製造方 法’屬於構成具備包含LED元件的保持領域的LED保持 面，及包圍該LED保持面的周圍的樹脂框構件，及藉由 打線接合與表露出於該樹脂框構件的LED保持面的LED 元件電性地連接的導線部，及密封以上述LED保持面與 上述框構件所構成的元件保持空間的光透射性樹脂的LED 裝置的上述LED保持面與樹脂框構件及導線部所成的 LED用封裝中’製造構成上述LED保持面與導線部所用 參 的導線架的方法，其特徵爲： 具備：作爲上述LED保持面，將LED元件保持於內 側的杯狀構件，及具備藉由打線接合與上述LED元件電 性地連接的導線部1個以上的副導線架部，及將連結上述 杯狀構件與副導線架部的連結橫帶的構成要素所成的導線 架，以拉深加工及衝裁加工形成於金屬薄板的導線架形成 工程，及 在上述連結橫帶施加彎曲加工，俾將上述杯狀構件及 ❹ 副導線架部之間隙距離縮小成事先所決定的距離的彎曲加 工工程。 8. 一種發光二極體（LED )用封裝的製造方法，屬 於使用藉由申請專利範圍第7項所得到的導線架的發光二 極體（LED)用封裝的製造方法，其特徵爲： 上述杯狀構件的杯底部背面，及上述樹脂框構件的背 面成爲同一平面的方式進行插入成形。 -44-201007988 VII. Patent application scope: 1. A package for a light-emitting diode (LED) device, comprising: an LED holding surface including a holding area of an LED element, and a frame member surrounding the LED holding surface, and A package for an LED device in which a light-transmitting resin seals an element holding space between the LED holding surface and the frame member, wherein the LED holding surface is electrically connected to the LED element by wire bonding. a lead portion, and a heat dissipating portion portion that thermally contacts the LED element with a surface, and an insulating portion portion that partitions the lead portion and the heat dissipating plate portion with an insulating resin, and a back surface side of the LED holding surface is a back surface of the heat dissipating plate portion The back surface of the insulating partition portion is exposed to the same plane. 2. The package for a light-emitting diode (LED) device according to claim 1, wherein a surface height position of the LED holding surface of the lead portion is located at a position higher than a surface height of the LED holding surface of the heat dissipation plate portion. Upper position. 3. The package for a light-emitting diode (LED) device according to the first aspect of the invention, wherein the heat sink portion is a cup-shaped member that holds the LED element inside; a bottom surface portion of the LED element that is thermally conductively contacted, and a reflective surface portion formed on a peripheral portion of the bottom plate portion, wherein the reflective surface portion is formed by radiation of an LED element that is formed to prevent thermal conductive contact with an inner bottom plate portion of the reflective surface portion The height of the LED holding surface and the frame member on the outer side of the face portion passing through the reverse 201007988. 4. The package for a light-emitting diode (LED) device according to any one of claims 1 to 3, wherein the inner side surface of the cup member is in thermal conductive contact with the bottom plate A reflection layer having a high reflectance is formed in approximately the entire wavelength range of the light emitted from the LED elements of the portion. 5. A lead frame for a light-emitting diode (LED) package, which is an LED holding surface having a holding area including an LED element, and a resin frame member surrounding the periphery of the LED holding surface, and bonded by wire bonding The lead wire portion electrically connected to the LED element exposed on the LED holding surface of the resin frame member, and the LED device of the light transmissive resin that seals the element holding space between the LED holding surface and the frame member In the LED package in which the LED holding surface, the resin frame member, and the lead portion are formed, the lead frame for the LED holding surface and the lead portion is formed, and the LED holding surface is held inside the LED holding surface. a cup-shaped member, and a sub-lead frame portion having one or more of the lead portions and a connecting cross-belt connecting the cup member and the sub-lead portion, and the cup-shaped member and the sub-wire are further provided in the connecting cross-belt The gap between the frame portions is reduced to a bending portion having a predetermined gap distance. The lead frame for a light-emitting diode (LED) package according to claim 5, wherein the set of the lead frame portions is disposed such that the cup-shaped members are opposed to each other. -43-201007988 7. A method of manufacturing a lead frame for a light-emitting diode (LED) package is a resin frame member that includes an LED holding surface including a holding region of an LED element, and a periphery surrounding the LED holding surface. And a lead portion electrically connected to the LED element exposed to the LED holding surface of the resin frame member by wire bonding, and a light transmissive resin sealing the space between the LED holding surface and the frame member. In the LED package in which the LED holding surface of the LED device and the resin frame member and the lead portion are formed, a method of manufacturing a lead frame constituting the LED holding surface and the lead portion used in the lead portion is characterized in that it is provided as: a cup-shaped member holding the LED element inside, and a sub-lead frame portion having one or more lead portions electrically connected to the LED element by wire bonding, and connecting the cup member and the sub-lead frame a lead frame formed by the constituent elements of the connecting cross-belt, a lead frame forming process formed by drawing and punching on the thin metal plate, and the above-mentioned connecting cross-belt Plus bending, serve a gap between the cup member and the sub-portion of the lead frame is bent to reduce the distance ❹ machining works of pre-determined distance. A method of manufacturing a package for a light-emitting diode (LED), which is a method for manufacturing a package for a light-emitting diode (LED) using a lead frame obtained in claim 7 of the patent application, characterized in that: Insertion molding is performed so that the back surface of the cup bottom of the cup member and the back surface of the resin frame member have the same plane. -44-
TW98116005A 2008-05-16 2009-05-14 LED package, lead frame and method for producing the same TW201007988A (en)

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JP2008130065A JP2009278012A (en) 2008-05-16 2008-05-16 Package for led device
JP2008272150A JP2010103243A (en) 2008-10-22 2008-10-22 Lead frame for led package, and method for producing the same

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