WO2009139453A1 - Led package, lead frame and method for producing the same - Google Patents

Led package, lead frame and method for producing the same Download PDF

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Publication number
WO2009139453A1
WO2009139453A1 PCT/JP2009/059034 JP2009059034W WO2009139453A1 WO 2009139453 A1 WO2009139453 A1 WO 2009139453A1 JP 2009059034 W JP2009059034 W JP 2009059034W WO 2009139453 A1 WO2009139453 A1 WO 2009139453A1
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WO
WIPO (PCT)
Prior art keywords
led
lead
cup
holding surface
lead frame
Prior art date
Application number
PCT/JP2009/059034
Other languages
French (fr)
Japanese (ja)
Inventor
達彦 坂井
省三郎 亀田
Original Assignee
株式会社明王化成
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2008130065A external-priority patent/JP2009278012A/en
Priority claimed from JP2008272150A external-priority patent/JP2010103243A/en
Application filed by 株式会社明王化成 filed Critical 株式会社明王化成
Priority to CN200980117720.3A priority Critical patent/CN102027607A/en
Publication of WO2009139453A1 publication Critical patent/WO2009139453A1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/642—Heat extraction or cooling elements characterized by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0075—Processes relating to semiconductor body packages relating to heat extraction or cooling elements

Definitions

  • the present invention relates to a method for manufacturing a package of an LED device that can improve heat dissipation and reflection efficiency and can be made thin.
  • the present invention relates to a lead frame, a lead frame manufacturing method, and a LED package manufacturing method for providing a low-cost LED device package focusing on applications of high-power LEDs and white LEDs.
  • a light emitting diode (hereinafter referred to as “LED”) device is a device that can be used for illumination by being used with other red and green light emitting diodes, etc., according to the invention of a blue light emitting diode.
  • LED light emitting diode
  • an LED In the case of an LED element, part of the input power is converted into light energy, and the rest is converted into heat. Therefore, for example, an LED has a feature that it generates less heat than an incandescent bulb. Since a large current flows in the (high brightness) type LED element, a non-negligible level of heat generation and temperature rise occurs. On the other hand, there is a high demand for miniaturization and thinning of devices, and the development of small and thin LED devices is progressing. As LED devices, competition for the development of small and thin packages with high heat dissipation effects Has been expanded.
  • the LED element emits light at a predetermined radiation angle in the upper surface direction of the element, but emits a non-negligible amount of light also in the lateral direction of the element.
  • a method of arranging a reflector next to the element has been conventionally employed.
  • the side surface on which the LED element is mounted is inclined and white plastic is adopted.
  • White plastics are relatively excellent in reflection characteristics, but have the following problems with high-power LEDs and white LEDs. That is,
  • Patent Document 2 there is a semiconductor light emitting device in which an LED element is mounted by providing a recess in one of a pair of lead materials (see Patent Document 2).
  • This proposal is similar to Patent Document 1 described above in that the back surface of the lead is exposed, but has the following problems. That is, (1) Because the lead soldering part and the LED element mounting part have different thicknesses, it is necessary to prepare deformed strips with partially different plate thicknesses in advance. The deformed strip has a cutting method, a rolling method, and the like, but in any case, it is an expensive material, resulting in an increase in cost. (2) The depth of the recess formed by coining etc.
  • the recess of the lead material is shallow, the reflection is carried by the resin recess around the recess, and as described above, the plastic itself has a high light absorption rate, and the reflection efficiency is higher than that of the metal reflector. Is low, and the absorptivity of blue and ultraviolet light with a short wavelength is extremely high. Therefore, the color changes to brownish brown in a short time, and this discoloration has the disadvantages of a decrease in reflectance and color shift of white light.
  • An object of the present invention is to obtain a thin LED package that improves heat dissipation and reflection efficiency without degrading the insulating resin even when a high-power ultraviolet LED or blue LED is used.
  • the purpose of this invention is to obtain an inexpensive lead frame with high productivity by high-speed pressing using a normal metal punching, bending and drawing press technique using a sheet metal strip such as a hoop material.
  • the gap between the cup-shaped LED element mounting portion and the lead portion can be narrowed to the limit by using the above-described ordinary press technology, and the LED device using this lead frame can be miniaturized. It becomes possible.
  • the back of the cup bottom is flat and flush with the resin part, and the area of the cup back is as large as possible to improve the heat dissipation effect, and the cup inner surface is the main reflective surface Therefore, it is necessary to improve the completeness of the package by making the mirror finish in the pressing process, making the cup depth as deep as possible, and also by the lead frame insert molding process.
  • An object of the present invention is to provide a highly reliable LED package that is robust and stable with respect to subsequent processes.
  • the LED device package according to claim 1 includes an LED holding surface including a holding region for LED elements, and a frame member surrounding the LED holding surface, and the LED holding surface and the frame member.
  • the LED device package according to the invention described in claim 2 is such that the surface height position on the LED holding surface of the lead portion of claim 1 is higher than the surface height position on the LED holding surface of the heat sink plate. It is characterized by being at the top.
  • the package for an LED device according to the invention described in claim 3 is a cup-shaped member in which the heat radiating plate portion according to claim 1 or 2 holds the LED element inside,
  • the cup-shaped member includes a bottom plate portion that comes into thermal contact with the LED element, and a reflective surface portion formed on a peripheral portion of the bottom plate portion,
  • the reflection surface portion is configured such that the emitted light of the LED element thermally contacted with the bottom plate portion inside the reflection surface portion is irradiated to the outside LED holding surface and the frame member via the reflection surface portion. It is characterized by being formed at a height to prevent.
  • the LED device package according to the third aspect of the present invention there is provided the LED device package according to the third aspect of the present invention.
  • a reflection layer having a high reflectance with respect to the entire wavelength region is formed.
  • the lead frame for an LED package according to the invention described in claim 5 includes an LED holding surface including a holding area for the LED element, a resin frame member surrounding the LED holding surface, and an LED holding surface of the resin frame member.
  • LED comprising: a lead portion electrically connected to the LED element exposed to wire by wire bonding; and a light transmissive resin that seals an element holding space formed by the LED holding surface and the frame member Of the LED package comprising the LED holding surface, the resin frame member and the lead portion constituting the device, a lead frame for constituting the LED holding surface and the lead portion, A cup-shaped member that holds an LED element inside as the LED holding surface, a sub-lead frame portion including one or more lead portions, and a connecting bar that connects the cup-shaped member and the sub-lead frame portion.
  • the connecting bar further includes a bending portion that reduces a gap between the cup-shaped member and the sub lead frame portion to a predetermined gap distance.
  • a lead frame for an LED package according to an invention described in claim 6 is characterized in that the pair of sub lead frame parts according to claim 5 are arranged to face each other with the cup-shaped member in between. It is what.
  • an LED package lead frame manufacturing method comprising: an LED holding surface including an LED element holding region; a resin frame member surrounding the LED holding surface; A lead portion electrically connected to the LED element exposed on the LED holding surface by wire bonding, and a light-transmitting resin that seals an element holding space constituted by the LED holding surface and the frame member Among the LED packages composed of the LED holding surface, the resin frame member and the lead portion constituting the LED device provided, a method of manufacturing a lead frame for constituting the LED holding surface and the lead portion, A cup-shaped member that holds the LED element on the inner side as the LED holding surface, a sub lead frame portion that includes one or more lead portions that are electrically connected to the LED element by wire bonding, and the cup-shaped member and sub A lead frame forming step of forming a lead frame composed of components of a connecting bar for connecting the lead frame portion to a metal thin plate by drawing and punching; and And a bending step of bending the connecting bar to reduce a gap distance
  • the manufacturing method of the LED package according to the invention described in claim 8 is a manufacturing method of the LED package using the lead frame obtained by claim 7,
  • the cup-shaped member is insert-molded such that the back surface of the cup bottom and the back surface of the resin frame member are flush with each other.
  • the present invention has an effect that it is possible to provide an LED device that can improve heat dissipation and can be made thin. Moreover, even if it uses blue LED or ultraviolet LED, there is no possibility of deteriorating the insulating resin, the heat dissipation can be improved, the light output of the LED device can be improved, and the LED can be made thin. There is an effect that a device package can be provided.
  • the present invention has the effect of using a sheet metal strip such as a hoop material to obtain a highly productive and inexpensive lead frame by a high-speed press using a normal punching, bending and drawing press technology. is there.
  • the gap between the cup-shaped LED element mounting portion and the lead portion can be narrowed to the limit by using the above-described ordinary press technology, and the LED device using this lead frame can be miniaturized. There is an effect that can be done.
  • the back of the cup bottom is flat and flush with the resin part, and the area of the cup back is as large as possible to improve the heat dissipation effect, and the cup inner surface is the main reflective surface Therefore, it is necessary to improve the completeness of the package by making the mirror finish in the pressing process, making the cup depth as deep as possible, and also by the lead frame insert molding process. In addition, there is an effect that it is possible to provide an LED package which is robust and stable with respect to the post-process and has high reliability.
  • FIG. 2 is a cross-sectional view taken along the line AA in FIG.
  • FIG. 3 is a cross-sectional view taken along the line BB in FIG.
  • FIG. 2 is a cross-sectional view taken along the line CC of FIG.
  • FIG. 2 is a DD sectional view of FIG. 1.
  • FIG. 2 is a cross-sectional view taken along line EE in FIG. 1.
  • FIG. 5 is a sectional view taken along line FF in FIG. 1.
  • FIG. 6 is a bottom view of FIG. 5.
  • FIG. 5 is a sectional view taken along line FF in FIG. 5.
  • FIG. 6 is a cross-sectional view taken along line AA in FIG. 5.
  • FIG. 6 is a sectional view taken along line BB in FIG. 5.
  • FIG. 6 is a cross-sectional view taken along the line CC of FIG.
  • FIG. 6 is a DD sectional view of FIG. 5.
  • FIG. 6 is a cross-sectional view taken along line EE in FIG. 5.
  • FIG. 6 is a sectional view taken along line FF in FIG. 5.
  • It is a perspective view of the LED device using the package for LED devices of FIG. It is explanatory drawing which shows the manufacturing process of the LED apparatus package of FIG. 5, and the LED apparatus using this package. It is a top view which shows the structure of another Example of the package for LED devices of this invention.
  • FIG. 12 is a bottom view of FIG. 11.
  • FIG. 17 is a bottom view of FIG. 16.
  • FIG. 17 is a front view of FIG. 16.
  • FIG. 21b is a front view of FIG. 21a.
  • FIG. 21b is a side view of FIG. 21a.
  • FIG. 21b is a front view of FIG. 21a.
  • FIG. 22 is a plan view after the lead frame of FIG. 21 is formed by punching and forming a portion that becomes a sub lead frame portion and a connecting bar outside the cup-shaped member.
  • FIG. 22b is a front view of FIG. 22a.
  • FIG. 22b is a side view of FIG. 22a.
  • FIG. 23 is a plan view after bending a predetermined portion of a sub lead frame portion and a connecting bar of the lead frame of FIG. 22;
  • FIG. 23b is a front view of FIG. 23a.
  • FIG. 23b is a side view of FIG. 23a. It is AA sectional drawing of FIG. 23a.
  • FIG. 23b is a sectional view taken along line BB of FIG. 23a.
  • FIG. 23b is a bottom view of FIG. 23a.
  • FIG. 24 is a plan view showing a state in which the lead frame of FIG. 23 is mounted on an insert molding die. It is AA sectional drawing of FIG. 24a.
  • FIG. 24b is a sectional view taken along line BB of FIG. 24a. It is CC sectional drawing of FIG. 24a. It is a top view of the package for LED after performing insert molding using the metal mold
  • FIG. 25b is a front view of FIG. 25a.
  • FIG. 25b is a side view of FIG. 25a.
  • FIG. 25b is a cross-sectional view taken along the line BB of FIG. 25a.
  • FIG. 25b is a bottom view of FIG. 25a.
  • FIG. 6 is a plan view after drawing and punching another example of an LED package lead frame of the present invention to form a cup-shaped member, a sub lead frame part, and a crosspiece part.
  • FIG. 26b is a front view of FIG. 26a.
  • FIG. 26b is a side view of FIG. 26a.
  • FIG. 27 is a plan view after bending a lead portion of a sub lead frame portion of the lead frame of FIG. 26.
  • FIG. 27B is a front view of FIG. 27A.
  • FIG. 27b is a side view of FIG. 27a. It is AA sectional drawing of FIG. 27a.
  • FIG. 27B is a sectional view taken along line BB in FIG. 27a.
  • FIG. 27b is a bottom view of FIG. 27a.
  • FIG. 28 is a plan view after a predetermined portion of the connecting bar of the lead frame of FIG. 27 is bent and bent.
  • FIG. 28b is a front view of FIG. 28a.
  • FIG. 28b is a side view of FIG. 28a. It is AA sectional drawing of FIG. 28a.
  • FIG. 28b is a cross-sectional view taken along the line BB of FIG. 28a.
  • FIG. 28b is a bottom view of FIG. 28a.
  • FIG. 28 is a bottom view showing a state where the lead frame of FIG. 27 is mounted on an insert molding die. It is AA sectional drawing of FIG. 29a.
  • FIG. 29B is a sectional view taken along line BB in FIG. 29a.
  • FIG. 30b is a side view of FIG. 30a.
  • FIG. 30B is a sectional view taken along line AA in FIG. 30a.
  • FIG. 30B is a cross-sectional view taken along the line BB of FIG. 30a.
  • FIG. 30b is a bottom view of FIG. 30a.
  • an LED holding surface including a holding region for LED elements and a frame member surrounding the LED holding surface are provided, and light is transmitted through an element holding space formed by the LED holding surface and the frame member.
  • a heat radiating plate part that contacts, and an insulating partition part that partitions the lead part and the heat radiating plate part with an insulating resin are exposed, and the back surface side of the LED holding surface is the back surface of the heat radiating plate part of the insulating partition part. Since it is exposed flush with the back surface, heat dissipation can be improved and a package for manufacturing an LED device that can be made thin can be obtained.
  • the back surface of the heat radiating plate portion that is in thermal conduction contact with the LED element on the surface is exposed flush with the back surface of the insulating partition portion made of insulating resin. Therefore, the heat generated in the LED element can be released from the back surface of the heat radiating plate portion to the substrate. Further, by reducing the thickness of the heat radiating plate portion, the thickness of the package or the LED device can be reduced.
  • the heat sink plate of the present invention has the same thickness as the lead portion, and when the lead portion is punched from the metal plate constituting the lead portion, the heat sink portion can be punched simultaneously with the lead portion. Accordingly, since the heat radiating plate portion and the lead portion can be manufactured at the same time, the number of components is small, and it can be easily and in large numbers. In general, since the thickness of the metal plate constituting the lead portion is about 0.3 mm, the heat radiating plate portion can also be constituted with the same thickness. As a result, the thickness of the LED device is 0.8 mm. It becomes possible to make the degree.
  • the back surface of the heat radiating plate portion is exposed flush with the back surface of the insulating partition portion, and if the external heat radiating member and the conductor portion of the printed circuit board are in close contact with the back surface of the heat radiating plate portion, The heat dissipation effect is improved.
  • the package and the LED device of the present invention that are electrically insulated from the LED, there is no problem even if a heat radiating member made of a conductive material such as a metal is brought into contact, and therefore, a good heat radiating effect can be easily realized.
  • the frame member is preferably applied so that a part of the frame member overlaps a part of all the heat radiating plate portions and the lead portions of the package.
  • This frame member is not only configured by simply partitioning the element holding space sealed with the light transmissive resin, but before the step of sealing the element holding space with the light transmissive resin, the frame member is insulated with an insulating resin. It has a role of holding the heat radiating plate part and the lead part together with the partition part.
  • the resin constituting the frame member and the insulating partition formed between the heat radiating plate and the lead may be made of a different resin, but preferably the same resin. This is because the same resin can be easily formed in one insert molding process.
  • the resin used is preferably a thermoplastic resin that can be used in insert molding.
  • the LED element is bonded to the heat dissipation plate part by die bonding so that the heat conduction is good, and the strength is secured in a process that can safely make electrical connection to the LED element by wire bonding or the like.
  • a resin with excellent rigidity and impact strength is selected. For example, nylon resin or liquid crystal polymer resin is used.
  • the heat sink part of the present invention is not electrically coupled, and is insulated from the lead part by an insulating partition part. This is because, when a heat dissipation means for promoting heat dissipation of the heat dissipation plate portion is provided on the substrate on which the LED device using this package is mounted, if the heat dissipation plate portion is electrically coupled, the heat dissipation means of the substrate is also electrically connected. This is because there is a general limitation. Therefore, the LED element electrode and the lead part, which are in thermal conduction contact with the surface of the heat sink, are electrically coupled by wire bonding or the like, but the structure is not electrically coupled with the heat sink. it can.
  • the lead part of the present invention includes two terminal parts on the anode side and the cathode side for one LED element arranged in contact with the surface of the heat sink part. Further, a plurality of LED elements may be arranged in one package. When LED elements are connected in series, it is standard to provide at least two heat radiating plate portions and lead portions adjacent thereto. It is standard that a relay portion for connecting the LED elements arranged in each of the heat dissipation plate portions as a lead portion is provided between two adjacent heat dissipation plate portions.
  • a plurality of rows of LED elements connected in series may be provided.
  • a backlight unit for a liquid crystal display or a light source for illumination that has a high luminous intensity and is extremely thin due to a plurality of lines connected in series can be manufactured.
  • the series connection is a red LED group, a green LED group, and a blue LED group, respectively, it is possible to blink in each color and adjust the light intensity, and a liquid crystal display that does not require a color filter, and the light intensity and color temperature can be varied.
  • An illumination light source can be realized. Furthermore, since the voltage applied to each color LED group becomes high by connecting in series, there is also an advantage that the efficiency of the power supply becomes high.
  • the LED element that is thermally conductively contacted with the heat radiating plate portion of the present invention may include only one or a plurality of single-color LED elements such as white LED, blue LED, red LED, green LED, and yellow LED.
  • white LED blue LED
  • red LED red LED
  • green LED green LED
  • yellow LED yellow LED
  • the mechanical strength of the package of the present invention is such that the LED element is brought into thermal contact with the heat sink by die bonding, and the LED element is electrically contacted by wire bonding or the like to seal the light-transmitting resin.
  • the strength of the process is necessary.
  • strength which does not cause a malfunction also in the work of reflow and soldering is required. For this reason, you may perform various devices which raise the intensity
  • the contact area of the member with the resin can be increased.
  • the height position of the lead portion of the present invention on the LED holding surface may be disposed higher than the height position of the heat sink plate on the LED holding surface. That is, if a part of the lead part punched from the same metal plate as the heat sink part is bent and the surface of the lead part is placed higher than the surface height position of the heat sink part, the back side of the lead part Thus, the insulating resin wraps around, and the strength of the package can be increased so that the LED element can withstand the process of thermally and electrically connecting the LED element by die bonding or wire bonding.
  • the height position of the surface of the lead portion does not exceed the frame member, and by making it equal to the height position of the electrode of the LED element, there is also an advantage that the wire bonding between the LED element and the lead portion can be favorably performed. . Furthermore, since the electrically connected lead part is not exposed near the back of the heat sink, it is possible to directly contact the back of the heat sink and the external heat dissipation structure. Can be realized.
  • the heat radiating plate portion is a cup-shaped member that holds the LED element inside
  • the cup-shaped member includes a bottom plate portion that comes into thermal contact with the LED element, and a reflective surface portion formed on a peripheral portion of the bottom plate portion
  • the reflection surface portion is configured such that the emitted light of the LED element thermally contacted with the bottom plate portion inside the reflection surface portion is irradiated to the outside LED holding surface and the frame member via the reflection surface portion. Since it is formed at the height to prevent, even if blue LED or ultraviolet LED is used, there is no risk of deteriorating the insulating resin, heat dissipation can be improved, and it is possible to make it thin A package for producing an LED device that can be obtained can be obtained.
  • the cup-shaped member that holds the LED element on the inner side includes a bottom plate portion that is in thermal contact with the LED element, and a reflective surface portion that is formed on the peripheral portion of the bottom plate portion. Since the reflective surface portion prevents the radiated light of the LED element from being applied to the frame member, even if a blue LED or ultraviolet LED is used, the light reflection characteristics of the insulating resin disposed outside the reflective surface portion are deteriorated. There is no fear. Further, the back surface of the bottom plate portion of the cup-shaped member that comes into thermal contact with the LED element on the surface is made to be flush with the back surface of the insulating partition portion made of insulating resin.
  • the heat generated in the LED element can be released from the back surface of the bottom plate portion of the cup-shaped member to the substrate.
  • the thickness of the package or the LED device can be reduced by reducing the rising height of the reflection surface portion of the cup-shaped member as much as possible.
  • the periphery of the cup-shaped member is bent by press working simultaneously with the punching process or after the punching process to form the bottom plate portion and the reflection surface portion.
  • the rising height of the reflecting surface portion is determined so that the emitted light of the LED element thermally contacted with the bottom plate portion on the inner side of the reflecting surface portion is the LED holding surface and the frame member on the outer side through the reflecting surface portion.
  • one formed in an annular shape on the entire periphery of the bottom plate portion is most desirable for preventing the radiated light from being applied to the frame member, but on the part around the bottom plate portion.
  • a plurality of formed cup-shaped members may be arranged side by side so as to surround the edges of the plurality of bottom plate portions with a plurality of reflection surface portions.
  • one or more LED elements are mounted on a heat radiating plate part or a cup-shaped member in thermal conductive contact by die bonding, and two electrodes of the LED element are connected to the lead part by wire bonding. Thereafter, an element holding space constituted by an LED holding surface holding the LED element and a frame member surrounding the LED holding surface is sealed with a light-transmitting resin to obtain an LED device.
  • the light transmissive resin As the light transmissive resin, the light emitted from the LED element is radiated to the outside without being attenuated, or the light emitted from the blue LED, the purple LED, or the ultraviolet LED is incorporated into the light transmissive resin by using these materials. It is also possible to change the color of the light source, for example, converting the light into visible light having a long wavelength and making the light emission of the entire LED device white. Furthermore, by appropriately devising the shape of the light-transmitting resin, it is possible to provide a lens effect that enhances the emitted light in a specific direction. Furthermore, there is also a role of protecting the sealed LED element from humidity and the like. As the light transmissive resin, for example, an acrylic resin, a silicon transparent resin, or the like is used.
  • the heat radiating plate portion or the inner surface of the cup-shaped member of the present invention is subjected to a treatment that increases the light reflectance.
  • a reflection layer having a high reflectance with respect to almost the entire wavelength range of light emitted from the LED element thermally contacted with the bottom plate portion is formed on the inner surface of the cup-shaped member. .
  • the package of the present invention includes an LED holding surface for mounting an LED element and a frame member surrounding the LED holding surface, and transmits light through an element holding space composed of the LED holding surface and the frame member.
  • a method of manufacturing a package for constituting an LED device sealed with a conductive resin, a lead part electrically connected to the LED element and constituting a part of the LED holding surface, and heat conduction on the surface of the LED element A step of extracting a lead frame plate material having a heat radiating plate portion that comes into contact with the same metal plate from the punched lead frame plate material, and insulation between the frame member and the lead portion and the heat radiating plate portion.
  • a hoop material can be used as the metal plate for punching the heat radiation plate portion and the lead portion of the present invention, and the hoop material is used to form the frame member and the lead portion and the heat radiation plate portion.
  • the insulating resin wraps around the back surface side of the lead portion, and the LED element is thermally conductive on the heat radiating plate portion.
  • the strength of the package can be increased during electrical connection to the LED element by wire bonding or the like.
  • the LED holding surface including the holding region of the LED element, a resin frame member surrounding the LED holding surface, and the LED element exposed on the LED holding surface of the resin frame member are electrically connected by wire bonding.
  • LED holding surface and resin frame member constituting an LED device comprising: a lead portion that is electrically connected; and a light transmissive resin that seals an element holding space composed of the LED holding surface and the frame member 2 is a lead frame for constituting the LED holding surface and the lead portion of the LED package comprising the lead portion and the lead portion.
  • the present invention relates to a lead frame.
  • This lead frame is used when an LED package comprising an LED holding surface, a resin frame member, and a lead portion is formed by, for example, insert molding.
  • the obtained LED package has an LED element mounted on the LED holding surface, and after wire bonding to the lead portion, the element holding space composed of the LED holding surface and the surrounding frame member is sealed with a light transmissive resin.
  • a light transmissive resin is obtained.
  • the lead frame of the present invention includes a cup-shaped member that holds an LED element on the inside as an LED holding surface, a sub lead frame portion having one or more lead portions, and a connection that connects the cup-shaped member and the sub lead frame portion. And a bending portion for reducing the gap between the cup-shaped member and the sub lead frame portion to a predetermined gap distance.
  • a thin lead metal strip such as a hoop material can be used to obtain an inexpensive lead frame with high productivity by high-speed pressing using a normal punching, bending, and drawing press technique.
  • the gap can be reduced by the bent portion, for example, the gap can be reduced to a gap distance shorter than the thickness of the thin metal plate, which is impossible by normal punching, and the LED package can be reduced in size.
  • Lead frame can be realized.
  • a metal thin plate capable of ordinary punching, bending, and drawing press forming is used. More preferably, by using a metal hoop material, continuous molding becomes possible.
  • the metal thin plate should just have electroconductivity at least in the lead part electrically connected to the LED element exposed on the LED holding surface by wire bonding.
  • one pair is disposed opposite to each other with the cup-shaped member in between, and the lead portion can be disposed on each of the long sides facing the cup-shaped member. Therefore, since a large number of LED elements can be arranged on the cup-shaped member, it is possible to obtain a small LED device with high light emission performance.
  • the inner surface is preferably mirror-finished so as to improve the reflection efficiency. Also in this case, the mirror surface of the reflecting surface can be obtained by the drawing action of the mold having a mirror finish by drawing.
  • FIG. 1 is a plan view showing a configuration of an embodiment of an LED device package according to the present invention
  • FIG. 2 is a bottom view of FIG. 1
  • FIG. 3 is a longitudinal sectional view of FIG. 1
  • FIG. 3b is a sectional view taken along the line BB
  • FIG. 3c is a sectional view taken along the line CC.
  • 4 is a transverse sectional view of FIG. 1,
  • FIG. 4a is a DD sectional view,
  • FIG. 3b is a EE sectional view, and
  • FIG. 3c is a FF sectional view.
  • the package 10 of this embodiment is an LED device that seals an element holding space 13 composed of an LED holding surface 11 for holding an LED element and a frame member 12 surrounding the LED holding surface 11 with a light-transmitting resin. It is used for.
  • the LED holding surface 11 includes a lead portion 14 that is electrically connected to an LED element (not shown) and a heat radiating plate portion 15 that makes the LED element come into thermal contact with the surface. It is expressed through the insulating partition part 16 by.
  • the lead portion 14 and the heat radiating plate portion 15 are formed by punching from a metal plate 17 having a plate thickness of 0.3 mm, as shown in FIG. There are four heat radiating plate portions 15 and twelve lead portions 14. Of the lead parts 14, four lead parts arranged at intermediate positions are relay parts 14b that connect the LED elements in series.
  • the back surface of the LED holding surface 11 is flush with the back surface of the lead portion 14 and the heat radiating plate portion 15 with the back surface of the insulating partition portion 16 made of insulating resin.
  • this package 10 two LED elements are mounted on one heat radiating plate portion 15, the electrodes of each LED element and the lead portion 14 are electrically connected by wire bonding, and the element holding space 13 is sealed with a light transmissive resin. After stopping or before it is cut off from the metal plate 17, it becomes an LED device.
  • the pair of holes formed above and below the metal plate 17 are positioning holes 18 used when processed as a hoop material.
  • the four small holes formed immediately below the frame member 12 of the lead part 14 and the heat radiating plate part 15 are the lead part 14 and the heat radiating plate part 15, the insulating partition part 16 and the frame member 12 of these insulating resins. This is a drilling hole 19 for improving the bonding strength with the resin.
  • FIG. 5 is a plan view showing the configuration of another embodiment of the LED device package of the present invention
  • FIG. 6 is a bottom view of FIG. 5
  • FIG. 7 is a longitudinal sectional view of FIG. 5, and FIG. A sectional view
  • FIG. 7b is a BB sectional view
  • FIG. 7c is a CC sectional view
  • 8 is a cross-sectional view of FIG. 5,
  • FIG. 8a is a DD cross-sectional view
  • FIG. 8b is a EE cross-sectional view
  • FIG. 8c is a FF cross-sectional view.
  • FIG. 9 is a perspective view of an LED device using the LED device package of FIG.
  • the package 50 transmits an element holding space 53 including an LED holding surface 51 that holds the LED element 61 and a frame member 52 that surrounds the LED holding surface 51. It is used for the LED device 60 sealed with the resin 63.
  • the LED holding surface 51 includes a lead portion 54 that is electrically connected to the LED element 61 by a wire 62 and a heat radiating plate portion 55 that is in thermal conductive contact with the LED element on the surface. It is exposed via the insulating partition 56.
  • the lead portion 54 and the heat radiating plate portion 55 are formed by being extracted from a metal plate 57 having a plate thickness of 0.3 mm, as shown in FIG. There are four heat radiating plate portions 55 and twelve lead portions 54. Of the lead portions 54, the four lead portions arranged at the intermediate positions are relay portions 54b that connect the LED elements in series.
  • the lead portion 54 (relay portion 54 b) is bent at a position below the frame member 52, and the surface height position of the LED holding surface 51 of the lead portion 54 is the surface of the heat radiating plate portion 55. It is higher than the height position. For this reason, as shown in FIG. 6, the back surface of the LED holding surface 51 is exposed only on the back surface of the heat radiating plate portion 55 and is flush with the back surface of the insulating partition portion 56 made of insulating resin.
  • the pair of holes formed above and below the metal plate 57 are positioning holes 58 that are used when the hoop material 65 is processed. Further, the four small holes formed immediately below the frame member 52 of the lead portion 54 and the heat radiating plate portion 55 are the lead portion 54 and the heat radiating plate portion 55, the insulating partition portion 56 and the frame member 52 made of these insulating resins. This is a perforation hole 59 for improving the bonding strength with the resin.
  • FIG. 10 is an explanatory view showing the LED device package of FIG. 5 and a manufacturing process of the LED device using the package.
  • the metal plate 57 is a hoop material 87 used in insert molding.
  • the hoop material 87 is punched and formed to extract the lead portion 54 and the heat radiating plate portion 55.
  • the lead portion 54 below the frame member 52 is bent.
  • the frame member 52 and the insulating resin 56 are produced by insert molding.
  • the heat sink 55 is exposed flush with the insulating resin 56 on the back surface on which the frame member 52 is formed.
  • the hoop material 87 is cut to obtain the package 50 in which the metal plate 57 remains around.
  • the package 50 is obtained by being cut from the metal plate 57.
  • the package 50 brings two LED elements 61 into thermal conduction contact with one heat radiating plate portion 55, and electrically connects the electrodes of each LED element 61 and the lead portions 54 with wires 62. Then, the element holding space 53 is sealed with the light-transmitting resin 63 to form the LED device 60. Note that the mounting of the LED element 61, the connection of the wire bonding 62, and the sealing of the light-transmitting resin 63 may be performed in the steps shown in FIGS. 10e and 10f.
  • FIG. 10 includes the step of bending the lead portion as shown in FIG. 10c. By omitting this step, the LED device package of FIG. 1 and the LED device using this package are manufactured. It is possible.
  • FIG. 11 is a plan view showing the configuration of still another embodiment of the LED device package of the present invention
  • FIG. 12 is a bottom view of FIG. 13 is a front view of FIG. 11, and
  • FIG. 14 is a right side view of FIG.
  • FIG. 15 is a perspective view of an LED device using the LED device package of FIG.
  • the package 110 of this embodiment is an LED device that seals an element holding space 113 composed of an LED holding surface 111 for holding an LED element and a frame member 112 surrounding the LED holding surface 111 with a light-transmitting resin. It is used for.
  • the LED holding surface 111 includes eight lead portions 114 that are electrically connected to the LED elements, and one cup-shaped member 115 having a substantially rectangular planar shape that makes the LED elements come into thermal contact with the surface. Are expressed through an insulating partition 117 made of insulating resin.
  • the package 110 transmits light in an element holding space 113 including an LED holding surface 111 that holds the LED element 121 and a frame member 112 that surrounds the LED holding surface 111.
  • the LED device 120 is sealed with a resin 123.
  • a pattern line indicating the insulating partition 117 made of insulating resin is omitted.
  • the substantially rectangular cup-shaped member 115 includes a bottom plate portion 115 a that is in thermal contact with the LED element 121, and a reflective surface portion 115 b that is formed at the edge of the bottom plate portion 115 a.
  • the reflective surface portion 115b is formed in an annular shape around the entire periphery of the bottom plate portion 115a.
  • the reflective surface portion 115b is configured to receive the radiated light of the LED element 121 thermally contacted with the bottom plate portion 115a inside the reflective surface portion 115b. It is formed to a height that prevents direct irradiation of the outer LED holding surface 111 and the frame member 112 via 115b.
  • the back surface of the LED holding surface 111 is flush with the back surface of the insulating partition portion 117 made of insulating resin.
  • the insulating partition portion 117 made of insulating resin.
  • four LED elements 121 are mounted on one cup-shaped member 115, the electrodes of each LED element 121 and lead portions 114 are electrically connected by wires 22, and the element holding space 113 is made of a light-transmitting resin.
  • the LED device 120 is formed by sealing with 123.
  • the inner surface of the cup-shaped member 115 needs to be processed so as to increase the reflectance of light, and is preferably further mirror-finished.
  • the cup-shaped member made of aluminum or the surface of silver can have a high reflectance with respect to almost the entire wavelength range of the light emitted from the LED element.
  • a cup-shaped member made of metal such as copper for example, by forming a reflective layer made of silver and mirroring the surface, similarly, it is high for almost all wavelength ranges of light emitted from the LED element. It can have reflectivity.
  • FIG. 16 is a plan view showing the configuration of another embodiment of the LED device package of the present invention. 17 is a bottom view of FIG. 16, FIG. 18 is a front view of FIG. 16, and FIG. 19 is a right side view of FIG. 20 is a perspective view of an LED device using the LED device package of FIG.
  • the package 160 of this embodiment includes an LED that seals an element holding space 163 that includes an LED holding surface 161 that holds an LED element and a frame member 162 that surrounds the LED holding surface 161 with a light transmissive resin 173. It is used for the device.
  • the LED holding surface 161 has two lead portions 164 that are electrically connected to the LED element by a wire, and one cup having a substantially circular planar shape in which the LED element is in thermal contact with the surface.
  • the member 165 is exposed through an insulating partition 167 made of an insulating resin.
  • the substantially circular cup-shaped member 165 transmits light through an element holding space 163 including an LED holding surface 161 that holds the LED element 171 and a frame member 162 that surrounds the LED holding surface 161. It is used for the LED device 170 sealed with the conductive resin 173.
  • a pattern line indicating the insulating partition 167 made of insulating resin is omitted.
  • the cup-shaped member 165 includes a bottom plate portion 165a that comes into thermal contact with the LED element 171 and a reflection surface portion 165b formed on an edge of the bottom plate portion 165a.
  • the reflection surface portion 165b is formed in an annular shape around the entire periphery of the bottom plate portion 165a, and the reflection surface portion 165b is formed by the reflection surface portion 165b. It is formed at a height that prevents direct irradiation of the outer LED holding surface 161 and the frame member 162 via the 165b.
  • the inner surface of the cup-shaped member 165 needs to be processed so as to increase the reflectance of light, and is preferably further mirror-finished.
  • the cup-shaped member made of aluminum or the surface of silver can have a high reflectance with respect to almost the entire wavelength range of the light emitted from the LED element.
  • a cup-shaped member made of metal such as copper for example, by forming a reflective layer made of silver and mirroring the surface, similarly, it is high for almost all wavelength ranges of light emitted from the LED element. It can have reflectivity.
  • FIG. 21 is an explanatory view after the punching process of an embodiment of the lead frame for LED package of the present invention
  • FIG. 21a is a plan view
  • FIG. 21b is a front view
  • FIG. 21c is a side view.
  • a cup-shaped member 212 is drawn at a substantially central portion of a section of the lead frame 211 that is a hoop-shaped thin metal plate
  • a cup peripheral slit 213 is formed at each of the upper and lower portions of the cup-shaped member 212. Has been punched.
  • a lead frame made of, for example, a copper alloy or iron-nickel alloy of about 0.15 mm is employed. Either the drawing process or the punching process may be performed first. However, by performing the punching process after the drawing process, a change in the outer shape of the cup-shaped member 212 is reduced. Both side portions of the cup-shaped member 212 serve as connection portions 214 connected to the lead frame 211.
  • FIG. 21 shows only one section of a hoop-like thin metal plate, which is continuous to the left and right of FIG. 21a.
  • the lead frame 211 is arranged in a horizontal row, but if a wide lead frame is used or a smaller package is created, two or more rows may be arranged.
  • FIG. 22 is an explanatory view after the lead frame shown in FIG. 21 is punched and formed to form the sub lead frame portion and the connecting bar outside the cup-shaped member.
  • FIG. 22a is a plan view and FIG. 22b is a front view.
  • Figures 22c are side views.
  • a U-shaped sub lead frame portion 216 is formed at an opposing position with the cup-shaped member 212 sandwiched outside the cup-shaped member 212.
  • each sub lead frame portion 216 two lead portions 217 are further extended in the direction of the cup-shaped member 212 by further removing the pair of cup peripheral slits 213 formed in FIG. 21.
  • a U-shaped sub lead frame portion outer slit 219 is formed on the outer side of the sub lead frame portion 216 so as to be connected to the cup connecting portion 214 to form a connecting bar 218.
  • the sub lead frame portion 216 is formed.
  • the lead portion 217 extending from the sub lead frame portion 216 is formed with a bent raised portion 220 that is bent in an L shape before the tip portion, and the height of the surface of the lead portion 217 is the lead frame 211. It is higher than the surface.
  • a pilot hole 215 of the sub lead frame portion 216 is formed at a position facing the cup-shaped member 212 of the sub lead frame portion 216.
  • FIG. 23 is an explanatory view after bending a predetermined portion of the sub lead frame portion and the connecting bar of the lead frame of FIG. 22,
  • FIG. 23a is a plan view
  • FIG. 23b is a front view
  • FIG. 23c is a side view
  • 23d is a sectional view taken on line AA
  • FIG. 23e is a sectional view taken on line BB
  • FIG. 23f is a bottom view.
  • a bent portion 222 is formed by bending each of the pair of connecting bars 218 connecting the sub lead frame portion 216 and the cup connecting portion 214 of FIG.
  • the bent portion 222 has the two rising portions not the same length, but the height of the rising portion far from the cup-shaped member 212 is increased, so that the height position of the back surface of the sub lead frame portion 216 is cup-shaped.
  • the depth is the same plane as the back surface of the member 212. Further, this causes the rising portion of the bending raising portion 220 in FIG. 22 so that the height position of the lead portion 217 connected to the sub lead frame portion 216 is the same height position as the edge height of the cup-shaped member 212. Is adjusted in advance.
  • the bending depth (bending magnitude) of the bending portion 222 for pulling the sub lead frame portion 216 toward the cup-shaped member 212 is the gap between the tip position of the lead portion 217 and the edge position of the cup-shaped member 212. What is necessary is just to design so that L may become a predetermined gap distance. Since the gap L can be reduced by the bending portion 222, for example, it is possible to reduce the gap distance to be shorter than the thickness of the metal thin plate, which is impossible by normal punching.
  • FIG. 24 is an explanatory view showing a state in which the lead frame of FIG. 23 is mounted on an insert molding die
  • FIG. 24a is a plan view
  • FIG. 24b is an AA sectional view
  • FIG. 24c is a BB sectional view
  • a sub lead frame portion 216 formed inside the lead frame 211 of FIG. 23 is sandwiched between upper and lower molds 223 and 224, and a set of sub portions including a cup-shaped member 212 and four lead portions 217.
  • the lead frame portion 216 is mounted inside the upper and lower molds 223 and 224.
  • a pin is provided in the lower mold 224, and the pilot hole 221 of the sub lead frame portion 216 is fitted therein, thereby positioning the lower mold 224 and the lead frame 211 in the horizontal direction.
  • the lead part 217 is fixed by the upper and lower molds 223 and 224 and at the same time the bottom surface of the cup-shaped member 212 is pressed by the upper mold 223 and the edge of the cup-shaped member 212 is supported by the lower mold 224.
  • the bottom surface of the cup-shaped member 212 is the upper surface.
  • the resin When the resin is injected from the resin injection gate 225 of the upper mold 223 in the state shown in FIG. 24, the resin is filled into the cavities (voids) 226 inside the upper and lower molds, and the package manufacturing process is completed.
  • the protruding member 227 that protrudes around the bottom back surface of the cup-shaped member 212 of the upper mold 223 is for preventing the resin from rotating around this portion, and the resin crawls up on the back surface of the cup-shaped member 212. This prevents the LED device from being lifted by inducing solder flux when the final user solders the LED device to the substrate or the like.
  • FIG. 25 is an explanatory view of the LED package after insert molding using the mold of FIG. 24, FIG. 25a is a plan view, FIG. 25b is a front view, FIG. 25c is a side view, and FIG. A sectional view, FIG. 25e is a BB sectional view, and FIG. 25f is a bottom view. As shown in FIG. 25, the package 230 is cut off from the lead frame 211.
  • the package 230 of this embodiment includes an LED holding surface 228 as an inner surface of the cup-shaped member 212, a resin frame member 229 surrounding the LED holding surface 228, and leads exposed on the inner surface of the resin frame member 229. Part 217.
  • an LED element is mounted on the LED holding surface 228, and after the mounted LED element and the lead portion are electrically connected by wire bonding, an element holding composed of the LED holding surface and the resin frame member is held.
  • An LED device is obtained by sealing the space with a light-transmitting resin.
  • the height position of the edge part of the cup-shaped member 212 and the lead part 217 is the same, it does not need to be the same height substantially.
  • the LED element is mounted on the bottom of the cup-shaped member 212 and the electrode on the upper surface of the element is connected to the lead part 217 with a bonding wire, the height of the lead part 217 may be set to an optimum height. Above, it is almost the same height.
  • the inclination of the surrounding cup slope with respect to the bottom surface of the cup-shaped member 212 is ideally 45 ° with respect to the radiation light in the horizontal direction, but the radiation angle from the LED element cannot be specified. It is selected in the range of 45 ° to 80 ° in consideration of the demand to reduce W.
  • the resin slope 231 provided around the cup-shaped member 212 of the resin frame member 229 re-reflects the leaked light when part of the light reflected by the bottom surface of the cup-shaped member 212 and the cup slope leaks. Therefore, since it becomes a sub-reflection plate, a resin of a color that is easily reflected such as white (for example, a nylon resin, a liquid crystal polymer resin, or the like) is used.
  • white for example, a nylon resin, a liquid crystal polymer resin, or the like
  • the gap gap L is desirably small from the request of reducing the vertical width of the package 230 and the request of shortening the bonding wire, but is preferably large from the viewpoint of reliably filling the gap between the gaps.
  • the gap gap L can be reduced to 0.1 mm.
  • the individual lead frames 211 are separated and processed, but may be separated when the processing steps shown in FIG. 24 or FIG. 25 are completed without being separated.
  • FIG. 26 is an explanatory view after the cup-shaped member, the sub lead frame portion, and the crosspiece portion are formed by drawing and punching another embodiment of the lead frame for LED package of the present invention
  • FIG. 26a is a plan view
  • 26b is a front view
  • FIG. 26c is a side view.
  • the present embodiment is an application example to a smaller package having a smaller number of leads than the above-described embodiment.
  • a cup-shaped member 262 is drawn at a substantially central portion of a section of the lead frame 261 that is a hoop-like thin metal plate, and a cup peripheral slit 263 is punched around the cup-shaped member 262. Yes.
  • the cup peripheral slit 263 includes one sub lead frame portion 266 that forms two lead portions 267, a connecting bar 268 that connects the sub lead frame portion 266 to the upper edge portion of the cup member 262, and the cup member 262.
  • a connecting portion 264 that is connected to the lead frame 261 from the lower edge portion thereof, and two lead portions 267 that are formed inside the lead frame portion 261 are configured.
  • the lead frame 261 of the present embodiment also employs a lead frame made of a copper alloy or iron-nickel alloy of about 0.15 mm. Either the drawing process or the punching process may be performed first. However, by performing the punching process after the drawing process, a change in the outer shape of the cup-shaped member 262 is reduced.
  • the cup bottom surface and the cup slant surface of the cup-shaped member 262 are reflective portions as in the above-described embodiment, the surface roughness was finished to a mirror surface with a surface roughness of 1 ⁇ m or less by a die and punch of a press mold.
  • the holes formed in the upper and lower edge portions of the lead frame 261 and the sub lead frame portion 266 are pilot holes 265.
  • FIG. 26 shows only one section of a hoop-like thin metal plate, which is continuous to the left and right of FIG. 26a.
  • the lead frame 261 is arranged in a horizontal row, but two or more rows may be arranged if a wide lead frame is used or a smaller package is created.
  • FIG. 27 is an explanatory view after bending the lead part of the sub lead frame part of the lead frame of FIG. 26,
  • FIG. 27a is a plan view
  • FIG. 27b is a front view
  • FIG. 27c is a side view
  • FIG. 27e is a BB sectional view
  • FIG. 27f is a bottom view.
  • a bent raised portion 270 is formed in which the front end portion of the lead portion 267 arranged around the cup-shaped member 262 is bent in an L shape, and the height of the surface of the lead portion 267 is formed. The position is higher than the surface of the lead frame 261.
  • FIG. 28 is an explanatory view after folding and bending predetermined portions of the connecting frame of the lead frame of FIG. 27,
  • FIG. 28a is a plan view
  • FIG. 28b is a front view
  • FIG. 28c is a side view
  • FIG. 28e is a BB sectional view
  • FIG. 28f is a bottom view.
  • a stepped bending portion 271 is formed at a position near the cup-shaped member 262 of the connecting portion 264 and the connecting bar 268, and a bent portion 272 bent in a convex shape is formed at a far position.
  • stepped bending portions 271 by applying step bending to the connecting portion 264 and the connecting bar 268, the lead frame 261 descends vertically downward, and at the same time, the lead portion 267 is also lowered by the same dimension.
  • the stepped bending dimension is such that the back surface of the lead frame 211 and the back surface of the cup-shaped member 262 are in the same plane.
  • the bent portion 272 is formed by applying an R-shaped or convex bent process to the connecting portion 264 and the connecting bar 268, thereby forming the lead portion 267 of the sub lead frame portion 261 and the inside of the lead frame 261.
  • the gap distance between the formed lead portion 267 and the cup-shaped member 262 is reduced. It should be noted that the order of formation of the stepped bending portion 271 and the R-shaped or convex bending portion 272 may be either.
  • the bending depth (bending magnitude) of the bending portion 272 formed in the connecting portion 264 and the connecting bar 268 for narrowing the space between the lead portion 267 and the cup-shaped member 262 is the tip position of the lead portion 267.
  • the gap gap L with respect to the edge position of the cup-shaped member 262 may be designed to be a predetermined gap distance. Since the gap gap L can be reduced by the bent portion 272, for example, it is possible to reduce the gap distance to be shorter than the thickness of the thin metal plate, which is impossible by normal punching.
  • FIG. 29 is an explanatory view showing a state where the lead frame of FIG. 28 is mounted on an insert molding die
  • FIG. 29a is a bottom view
  • FIG. 29b is an AA sectional view
  • FIG. 29c is a BB sectional view.
  • the lead frame 261 of FIG. 28 is cut off, and a cup-shaped member 262 and four lead portions 267 are mounted inside the upper and lower molds 273 and 274.
  • the resin When the resin is injected from the resin injection gate 275 of the upper mold 273 in the state shown in FIG. 29, the resin is filled into the cavities (voids) 276 inside the upper and lower molds, and the package manufacturing process is completed.
  • the protruding member 277 that protrudes from the bottom back surface of the cup-shaped member 262 of the upper mold 273 is for preventing the resin from rotating around this portion, and the resin crawls up to the back surface of the cup-shaped member 262. This prevents the LED device from being lifted by inducing solder flux when the final user solders the LED device to the substrate or the like.
  • the pilot hole 265 of the lead frame 261 is a reference hole when the lead frame 261 is fed by a progressive press.
  • the lead frame 261 is used as a reference hole for horizontal positioning by attaching the lead frame 261 to the upper and lower molds 273 and 274. .
  • FIG. 30 is an explanatory view of the LED package after insert molding using the mold of FIG. 29, FIG. 30a is a plan view, FIG. 30b is a front view, FIG. 30c is a side view, and FIG. A sectional view, FIG. 30e is a BB sectional view, and FIG. 30f is a bottom view. As shown in FIG. 30, the package 280 is cut off from the lead frame 261.
  • the inclination of the surrounding cup slope with respect to the bottom surface of the cup-shaped member 262 is selected in the range of 45 ° to 80 ° in consideration of the desire to reduce the vertical width W of the package 280, as in the previous embodiment.
  • the gap gap L is preferably small from the demand for reducing the vertical width of the package 280 and the demand for shortening the bonding wire. However, the gap gap L is larger from the viewpoint of reliably filling the resin between the gaps. desirable. In this molding technique, the gap gap L can be reduced to 0.1 mm.
  • the package 280 of this embodiment includes an LED holding surface 278 as an inner surface of the cup-shaped member 262, a resin frame member 279 surrounding the LED holding surface 278, and leads exposed on the inner surface of the resin frame member 279. Part 267.
  • an LED element is mounted on the LED holding surface 278, and after the mounted LED element and the lead portion are electrically connected by wire bonding, an element holding composed of the LED holding surface and the resin frame member is held.
  • An LED device is obtained by sealing the space with a light-transmitting resin.
  • cup-shaped member 115a, 165a ... bottom plate, 115b, 165b ... reflective surface portion, 117, 167... Insulating partition, 120 170 ... LED device, 121 171 ... LED element, 122 172 ... wire, 123, 173 ... light transmissive resin, 211, 261 ... lead frame member, 212, 262 ... Cup-shaped member, 213, 263 ... slits around the cup, 214 ... Cup connecting part, 264 ... connecting part, 215, 265 ... pilot holes, 216, 266... Sub lead frame part, 217, 267 ... lead part, 218, 268 ... connecting bars, 219 ... Sub lead frame part outer slit, 220, 270 ...

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

Disclosed is a package for configuring an LED device, which comprises: an LED holding surface in which a lead part electrically connected with an LED element by wire bonding, a heat dissipating plate part which is in heat conductive contact with the LED element in the surface and an insulating partition part for dividing the lead part from the heat dissipating plate part by an insulating resin are exposed; and a frame member surrounding the LED holding surface.  The element holding space configured of the LED holding surface and the frame member is sealed with a light-transmitting resin.  Since the back surface of the heat dissipating plate part and the back surface of the insulating partition part are exposed in the same plane in the back side of the LED holding surface, there can be obtained a thin LED package having improved heat dissipation performance and reflection efficiency.

Description

ＬＥＤパッケージ、リードフレーム及びその製造法LED package, lead frame and manufacturing method thereof
　本発明は、放熱性と反射効率とを向上させることができ、尚且つ薄い形状とすることのできるＬＥＤ装置のパッケージの製造法に関するものである。特に、高出力ＬＥＤや白色ＬＥＤの用途に主眼をおいたＬＥＤ装置用パッケージを低コストで提供するためのリードフレーム、リードフレームの製造法及びＬＥＤ用パッケージの製造法に関するものである。 The present invention relates to a method for manufacturing a package of an LED device that can improve heat dissipation and reflection efficiency and can be made thin. In particular, the present invention relates to a lead frame, a lead frame manufacturing method, and a LED package manufacturing method for providing a low-cost LED device package focusing on applications of high-power LEDs and white LEDs.
　発光ダイオード(Light Emitting Diode：「ＬＥＤ」と称する)装置は、青色発光ダイオードの発明により、他の赤色、緑色の発光ダイオード等と共に用いることにより、照明用として使用可能な装置である。このＬＥＤに投入できる電力としては自ずと限界がある。その限界は、素子の性能によるところが大であるが、パッケージの放熱性も関係している。そもそも、半導体素子の動作領域は温度で制限されていて、限界温度を超えると半導体素子は破壊されたり、著しく寿命が短くなったりする。 A light emitting diode (hereinafter referred to as “LED”) device is a device that can be used for illumination by being used with other red and green light emitting diodes, etc., according to the invention of a blue light emitting diode. There is a limit to the power that can be input to the LED. The limit is largely due to the performance of the device, but also relates to the heat dissipation of the package. In the first place, the operation region of the semiconductor element is limited by temperature, and if the temperature exceeds the limit temperature, the semiconductor element is destroyed or the lifetime is remarkably shortened.
　ＬＥＤ素子の場合、投入電力の一部が光エネルギーに変換され、残りは熱に変換されるため、ＬＥＤは、例えば、白熱電球に比べて、発熱の少ないことが特徴であるが、高出力（高輝度）タイプのＬＥＤ素子は大電流が流れるため、無視できないレベルの発熱・温度上昇が生じる。一方で、装置の小型化、薄型化の要求は高く、小型・薄形のＬＥＤ装置の開発が進んでおり、ＬＥＤ装置としては、小型・薄形で、かつ、放熱効果の大きいパッケージの開発競争が展開されている。 In the case of an LED element, part of the input power is converted into light energy, and the rest is converted into heat. Therefore, for example, an LED has a feature that it generates less heat than an incandescent bulb. Since a large current flows in the (high brightness) type LED element, a non-negligible level of heat generation and temperature rise occurs. On the other hand, there is a high demand for miniaturization and thinning of devices, and the development of small and thin LED devices is progressing. As LED devices, competition for the development of small and thin packages with high heat dissipation effects Has been expanded.
　もう一つの背景は、反射効率の高いパッケージの要求である。ＬＥＤ素子は素子上面方向に所定の放射角で光が放射されるが、素子の横方向にも無視できない量の光を放射する。横方向の光を無駄にすることなく、有効利用するために素子の横に反射板を配置する方法が従来から採用されてきた。 Another reason is the demand for packages with high reflection efficiency. The LED element emits light at a predetermined radiation angle in the upper surface direction of the element, but emits a non-negligible amount of light also in the lateral direction of the element. In order to effectively use the light in the lateral direction without wasting it, a method of arranging a reflector next to the element has been conventionally employed.
　最も単純な反射板としては、パッケージを構成するプラスチックの樹脂枠部材において、ＬＥＤ素子を搭載する側面に傾斜を持たせ、かつ、白色プラスチックを採用するものであった。白色プラスチックは比較的に反射特性に優れてはいるが、高出力ＬＥＤや白色ＬＥＤに対しては次のような問題を抱えていた。即ち、 As the simplest reflector, in the plastic resin frame member constituting the package, the side surface on which the LED element is mounted is inclined and white plastic is adopted. White plastics are relatively excellent in reflection characteristics, but have the following problems with high-power LEDs and white LEDs. That is,
(1) プラスチック自体の光吸収率が高く、金属反射板に比べて反射効率は低い。
(2) 短波長の青色、紫外光の吸収率は著しく高いため、短時間で茶褐色に変色し、この変色によって反射率の低下と白色光の色ズレが生じる。 (1) The light absorption rate of the plastic itself is high, and the reflection efficiency is low compared to the metal reflector.
(2) Absorbance of short wavelength blue and ultraviolet light is remarkably high, and the color changes to brownish brown in a short time. This discoloration causes a decrease in reflectance and a color shift of white light.
　以上の背景から、金属による下面からの放熱と反射板とを兼ねたリードフレームによる種々のパッケージが開発されてきた。例えば、リードフレームから一対のリード部材を互いに対向させ、一方のリード部の先端をカップ状に形成したＬＥＤ発光装置の提案がなされている（特許文献１参照）。この提案においては、カップ底部の裏面が露出して放熱すること、及び、カップ内面の反射が期待できるという利点があるが、次のような問題を抱えている。即ち、 From the above background, various packages have been developed with lead frames that serve both as heat radiation from the lower surface of metal and a reflector. For example, there has been proposed an LED light emitting device in which a pair of lead members are opposed to each other from a lead frame and the tip of one lead portion is formed in a cup shape (see Patent Document 1). This proposal has the advantages that the back surface of the cup bottom is exposed and dissipates heat, and that reflection from the inner surface of the cup can be expected, but has the following problems. That is,
(1) カップ形状の周りにスリットを形成した場合には、カップ絞り工程でそのスリットが広がるため、カップ形状にするために、プレスのブランク工程（材料取り）では、余裕を持たせる必要があり、リード部間の距離が大きくなってしまい、小型化が難しい。
(2) ＬＥＤ素子をカップ上に搭載してダイボンディング及びワイヤーボンディングした後に、封止樹脂を注入してＬＥＤ装置を形成するため、封止工程の際に、反射部の底面部が下型から浮くことがあるため（特許文献１段落番号００８３参照）、放熱効果を悪化させる。 (1) When slits are formed around the cup shape, the slits widen during the cup drawing process. Therefore, it is necessary to provide a margin in the press blanking process (material removal) in order to obtain a cup shape. , The distance between the lead portions becomes large, and it is difficult to reduce the size.
(2) After the LED element is mounted on the cup and die-bonding and wire-bonding, the sealing resin is injected to form the LED device. Since it may float (refer patent document 1 paragraph number 0083), the heat dissipation effect will be worsened.
(3) １回の封止工程でＬＥＤ素子及びリード材全体を封止してＬＥＤ発光装置を形成させるため、１種類の透明な樹脂を使用する必要がある。このため、樹脂部での光の屈折が起こらず反射はカップ形状の金属部分のみとならざるを得ず、反射効率は低くなる。
(4) また、光透過性の耐熱樹脂は材料が限定される。
(5) ボンディング工程では、各リード部材の裏面に支持部材を必要とし、特にカップにおいては、その裏面を支持する支持部材を装着させておいても不安定となり、ボンディング工程での失敗や不良品増加が想像される。 (3) In order to form the LED light emitting device by sealing the LED element and the entire lead material in a single sealing step, it is necessary to use one kind of transparent resin. For this reason, the light is not refracted at the resin portion, and the reflection is limited to the cup-shaped metal portion, and the reflection efficiency is lowered.
(4) The material of the light transmissive heat-resistant resin is limited.
(5) The bonding process requires a support member on the back side of each lead member. In particular, the cup becomes unstable even if a support member that supports the back side is mounted, resulting in failure or defective products in the bonding process. An increase is imagined.
　また、他の提案として、一対のリード材の一方に凹部を設けてＬＥＤ素子を搭載させた半導体発光装置がある（特許文献２参照）。この提案においては、リード裏面が露出している点では前述の特許文献１と類似しているが、次のような問題を抱えている。即ち、
(1) リードの半田付け部とＬＥＤ素子搭載部の厚さが異なる構造のため、予め板厚が部分的に異なる異形条を準備しなければならない。異形条は切削法や圧延法などがあるが、何れにしろ高価な材料であり、コスト高になる。
(2) リード材の板厚の厚い部分をコイニング等によって形成された凹部の深さには、リード材の圧延強さ（硬度）と、材料の横方向への逃げ・変形等によって、限界があり、プレス機械の回転数を上げることも困難で生産性が低い。
(3) このリード材の凹部の凹みが浅いため、反射は凹部の周囲の樹脂製の凹部が担っており、前述の通り、プラスチック自体の光吸収率が高く、金属反射板に比べて反射効率は低いこと、短波長の青色、紫外光の吸収率は著しく高いため、短時間で茶褐色に変色し、この変色によって反射率の低下と白色光の色ズレが生じることの弊害がある。 As another proposal, there is a semiconductor light emitting device in which an LED element is mounted by providing a recess in one of a pair of lead materials (see Patent Document 2). This proposal is similar to Patent Document 1 described above in that the back surface of the lead is exposed, but has the following problems. That is,
(1) Because the lead soldering part and the LED element mounting part have different thicknesses, it is necessary to prepare deformed strips with partially different plate thicknesses in advance. The deformed strip has a cutting method, a rolling method, and the like, but in any case, it is an expensive material, resulting in an increase in cost.
(2) The depth of the recess formed by coining etc. in the thick part of the lead material is limited due to the rolling strength (hardness) of the lead material and the lateral escape and deformation of the material. In addition, it is difficult to increase the number of rotations of the press machine, and productivity is low.
(3) Since the recess of the lead material is shallow, the reflection is carried by the resin recess around the recess, and as described above, the plastic itself has a high light absorption rate, and the reflection efficiency is higher than that of the metal reflector. Is low, and the absorptivity of blue and ultraviolet light with a short wavelength is extremely high. Therefore, the color changes to brownish brown in a short time, and this discoloration has the disadvantages of a decrease in reflectance and color shift of white light.
特許第４００９０９７号公報Japanese Patent No. 4009097 特開２００５－３５３９１４号公報JP 2005-353914 A
　本発明は、高出力の紫外線ＬＥＤや青色ＬＥＤを用いたとしても、絶縁樹脂を劣化させるおそれがなく、放熱性と反射効率とを向上させ尚且つ厚さが薄いＬＥＤパッケージを得ることを目的とし、フープ材のような薄板金属の条を用いて、通常の抜き、曲げ、絞りのプレス技術による高速プレスで生産性の高い、安価なリードフレームを得ることを目的とする。このリードフレームは、カップ形状のＬＥＤ素子搭載部とリード部との間隙を前述の通常のプレス技術を用いて、極限まで狭めることができ、このリードフレームを用いたＬＥＤ装置を小型化することが可能となる。 An object of the present invention is to obtain a thin LED package that improves heat dissipation and reflection efficiency without degrading the insulating resin even when a high-power ultraviolet LED or blue LED is used. The purpose of this invention is to obtain an inexpensive lead frame with high productivity by high-speed pressing using a normal metal punching, bending and drawing press technique using a sheet metal strip such as a hoop material. In this lead frame, the gap between the cup-shaped LED element mounting portion and the lead portion can be narrowed to the limit by using the above-described ordinary press technology, and the LED device using this lead frame can be miniaturized. It becomes possible.
　また、カップ底面の裏面は平坦で、かつ、樹脂部と同一面になること、更に、カップ裏面の面積は放熱効果を向上させるために可能な限り大きいこと、また、カップ内面は、主たる反射面となるため、プレス工程の中で鏡面仕上げになるようにすること、更に、カップの深さは可能な限り深くすること、また、リードフレームをインサート成形する工程までで、パッケージ完成度を高めて、後工程に対して堅牢で安定した寸法の信頼性の高いＬＥＤ用パッケージを提供することを目的とする。 Also, the back of the cup bottom is flat and flush with the resin part, and the area of the cup back is as large as possible to improve the heat dissipation effect, and the cup inner surface is the main reflective surface Therefore, it is necessary to improve the completeness of the package by making the mirror finish in the pressing process, making the cup depth as deep as possible, and also by the lead frame insert molding process. An object of the present invention is to provide a highly reliable LED package that is robust and stable with respect to subsequent processes.
　請求項１に記載された発明に係るＬＥＤ装置用パッケージは、ＬＥＤ素子の保持領域を含むＬＥＤ保持面と、該ＬＥＤ保持面の周囲を囲む枠部材とを備え、前記ＬＥＤ保持面と前記枠部材とで構成される素子保持空間を光透過性樹脂で封止したＬＥＤ装置を構成するためのパッケージであって、
　前記ＬＥＤ保持面には、
ＬＥＤ素子とワイヤボンディングにより電気的に接続されるリード部と、
ＬＥＤ素子に表面で熱伝導的に接触する放熱板部と、
　　前記リード部と放熱板部とを絶縁樹脂で仕切る絶縁区画部と
が表出され、
　前記ＬＥＤ保持面の裏面側は、
前記放熱板部の裏面が前記絶縁区画部の裏面と面一に表出されていることを特徴とするものである。 The LED device package according to claim 1 includes an LED holding surface including a holding region for LED elements, and a frame member surrounding the LED holding surface, and the LED holding surface and the frame member. A package for constituting an LED device in which an element holding space constituted by and is sealed with a light-transmitting resin,
On the LED holding surface,
A lead portion electrically connected to the LED element by wire bonding;
A heat radiating plate portion in thermal contact with the LED element on the surface;
An insulating partition portion that partitions the lead portion and the heat radiating plate portion with an insulating resin is exposed,
The back side of the LED holding surface is
The back surface of the heat radiating plate portion is exposed flush with the back surface of the insulating partition portion.
　請求項２に記載された発明に係るＬＥＤ装置用パッケージは、請求項１に記載のリード部のＬＥＤ保持面での表面高さ位置が放熱板部のＬＥＤ保持面での表面高さ位置よりも上位にあることを特徴とするものである。 The LED device package according to the invention described in claim 2 is such that the surface height position on the LED holding surface of the lead portion of claim 1 is higher than the surface height position on the LED holding surface of the heat sink plate. It is characterized by being at the top.
　請求項３に記載された発明に係るＬＥＤ装置用パッケージは、請求項１又は２に記載の放熱板部がＬＥＤ素子を内側に保持するカップ状部材であり、
　前記カップ状部材は、ＬＥＤ素子に熱伝導的に接触する底板部と、この底板部の周縁部に形成された反射面部とを備え、
　前記反射面部は、この反射面部の内側の底板部に熱伝導的に接触されたＬＥＤ素子の放射光が、この反射面部を介した外側の前記ＬＥＤ保持面と枠部材とに照射されることを阻止する高さに形成されていることを特徴とするものである。 The package for an LED device according to the invention described in claim 3 is a cup-shaped member in which the heat radiating plate portion according to claim 1 or 2 holds the LED element inside,
The cup-shaped member includes a bottom plate portion that comes into thermal contact with the LED element, and a reflective surface portion formed on a peripheral portion of the bottom plate portion,
The reflection surface portion is configured such that the emitted light of the LED element thermally contacted with the bottom plate portion inside the reflection surface portion is irradiated to the outside LED holding surface and the frame member via the reflection surface portion. It is characterized by being formed at a height to prevent.
　請求項４に記載された発明に係るＬＥＤ装置用パッケージは、請求項３に記載のカップ状部材の内側面には、底板部に熱伝導的に接触されたＬＥＤ素子から放射される光のほぼ全波長域に対して高い反射率を備える反射層が形成されたことを特徴とするものである。 According to a fourth aspect of the present invention, there is provided the LED device package according to the third aspect of the present invention. A reflection layer having a high reflectance with respect to the entire wavelength region is formed.
　請求項５に記載された発明に係るＬＥＤパッケージ用リードフレームは、ＬＥＤ素子の保持領域を含むＬＥＤ保持面と、このＬＥＤ保持面の周囲を囲む樹脂枠部材と、この樹脂枠部材のＬＥＤ保持面に表出されたＬＥＤ素子とワイヤボンディングにより電気的に接続されるリード部と、前記ＬＥＤ保持面と前記枠部材とで構成される素子保持空間を封止した光透過性樹脂とを備えたＬＥＤ装置を構成する前記ＬＥＤ保持面と樹脂枠部材とリード部とからなるＬＥＤ用パッケージのうち、前記ＬＥＤ保持面とリード部とを構成するためのリードフレームであって、
　前記ＬＥＤ保持面としてＬＥＤ素子を内側に保持するカップ状部材と、前記リード部を１つ以上備えたサブリードフレーム部と、前記カップ状部材とサブリードフレーム部とを連結する連結桟とを備え、
　前記連結桟に、前記カップ状部材とサブリードフレーム部との間隙を予め定められた間隙距離に縮める曲げ加工部を更に備えたことを特徴とするものである。 The lead frame for an LED package according to the invention described in claim 5 includes an LED holding surface including a holding area for the LED element, a resin frame member surrounding the LED holding surface, and an LED holding surface of the resin frame member. LED comprising: a lead portion electrically connected to the LED element exposed to wire by wire bonding; and a light transmissive resin that seals an element holding space formed by the LED holding surface and the frame member Of the LED package comprising the LED holding surface, the resin frame member and the lead portion constituting the device, a lead frame for constituting the LED holding surface and the lead portion,
A cup-shaped member that holds an LED element inside as the LED holding surface, a sub-lead frame portion including one or more lead portions, and a connecting bar that connects the cup-shaped member and the sub-lead frame portion. ,
The connecting bar further includes a bending portion that reduces a gap between the cup-shaped member and the sub lead frame portion to a predetermined gap distance.
　請求項６に記載された発明に係るＬＥＤパッケージ用リードフレームは、請求項５に記載の一組のサブリードフレーム部が、前記カップ状部材を間にして対向して配置されていることを特徴とするものである。 A lead frame for an LED package according to an invention described in claim 6 is characterized in that the pair of sub lead frame parts according to claim 5 are arranged to face each other with the cup-shaped member in between. It is what.
　請求項７に記載された発明に係るＬＥＤパッケージ用リードフレームの製造法は、ＬＥＤ素子の保持領域を含むＬＥＤ保持面と、このＬＥＤ保持面の周囲を囲む樹脂枠部材と、この樹脂枠部材のＬＥＤ保持面に表出されたＬＥＤ素子とワイヤボンディングにより電気的に接続されるリード部と、前記ＬＥＤ保持面と前記枠部材とで構成される素子保持空間を封止した光透過性樹脂とを備えたＬＥＤ装置を構成する前記ＬＥＤ保持面と樹脂枠部材とリード部とからなるＬＥＤ用パッケージのうち、前記ＬＥＤ保持面とリード部とを構成するためのリードフレームを製造する方法であって、
　前記ＬＥＤ保持面としてＬＥＤ素子を内側に保持するカップ状部材と、前記ＬＥＤ素子とワイヤボンディングにより電気的に接続されるリード部を１つ以上備えたサブリードフレーム部と、前記カップ状部材とサブリードフレーム部とを連結する連結桟との構成要素からなるリードフレームを、絞り加工及び抜き加工で金属薄板に形成するリードフレーム形成工程と、
　前記連結桟に曲げ加工を施して、前記カップ状部材とサブリードフレーム部との間隙距離を予め定められた距離に縮める曲げ加工工程とを備えたことを特徴とするものである。 According to a seventh aspect of the present invention, there is provided an LED package lead frame manufacturing method comprising: an LED holding surface including an LED element holding region; a resin frame member surrounding the LED holding surface; A lead portion electrically connected to the LED element exposed on the LED holding surface by wire bonding, and a light-transmitting resin that seals an element holding space constituted by the LED holding surface and the frame member Among the LED packages composed of the LED holding surface, the resin frame member and the lead portion constituting the LED device provided, a method of manufacturing a lead frame for constituting the LED holding surface and the lead portion,
A cup-shaped member that holds the LED element on the inner side as the LED holding surface, a sub lead frame portion that includes one or more lead portions that are electrically connected to the LED element by wire bonding, and the cup-shaped member and sub A lead frame forming step of forming a lead frame composed of components of a connecting bar for connecting the lead frame portion to a metal thin plate by drawing and punching; and
And a bending step of bending the connecting bar to reduce a gap distance between the cup-shaped member and the sub lead frame portion to a predetermined distance.
　請求項８に記載された発明に係るＬＥＤ用パッケージの製造法は、請求項７によって得られたリードフレームを用いたＬＥＤ用パッケージの製造法であって、
　前記カップ状部材のカップ底部裏面と、前記樹脂枠部材の裏面とが同一平面になるようにインサート成形することを特徴とするものである。 The manufacturing method of the LED package according to the invention described in claim 8 is a manufacturing method of the LED package using the lead frame obtained by claim 7,
The cup-shaped member is insert-molded such that the back surface of the cup bottom and the back surface of the resin frame member are flush with each other.
　本発明は、放熱性を向上させることができ、尚且つ薄い形状とすることのできるＬＥＤ装置を提供することができるという効果がある。また、青色ＬＥＤや紫外線ＬＥＤを用いたとしても、絶縁樹脂を劣化させるおそれがなく、放熱性を向上させることができ、ＬＥＤ装置の光出力を向上させ、尚且つ薄い形状とすることのできるＬＥＤ装置用パッケージを提供することができるという効果がある。 The present invention has an effect that it is possible to provide an LED device that can improve heat dissipation and can be made thin. Moreover, even if it uses blue LED or ultraviolet LED, there is no possibility of deteriorating the insulating resin, the heat dissipation can be improved, the light output of the LED device can be improved, and the LED can be made thin. There is an effect that a device package can be provided.
　更に、本発明は、フープ材のような薄板金属の条を用いて、通常の抜き、曲げ、絞りのプレス技術による高速プレスで生産性の高い、安価なリードフレームを得ることができるという効果がある。このリードフレームは、カップ形状のＬＥＤ素子搭載部とリード部との間隙を前述の通常のプレス技術を用いて、極限まで狭めることができ、このリードフレームを用いたＬＥＤ装置を小型化することができるという効果がある。 Furthermore, the present invention has the effect of using a sheet metal strip such as a hoop material to obtain a highly productive and inexpensive lead frame by a high-speed press using a normal punching, bending and drawing press technology. is there. In this lead frame, the gap between the cup-shaped LED element mounting portion and the lead portion can be narrowed to the limit by using the above-described ordinary press technology, and the LED device using this lead frame can be miniaturized. There is an effect that can be done.
　また、カップ底面の裏面は平坦で、かつ、樹脂部と同一面になること、更に、カップ裏面の面積は放熱効果を向上させるために可能な限り大きいこと、また、カップ内面は、主たる反射面となるため、プレス工程の中で鏡面仕上げになるようにすること、更に、カップの深さは可能な限り深くすること、また、リードフレームをインサート成形する工程までで、パッケージ完成度を高めて、後工程に対して堅牢で安定した寸法の信頼性の高いＬＥＤ用パッケージを提供することができるという効果がある。 Also, the back of the cup bottom is flat and flush with the resin part, and the area of the cup back is as large as possible to improve the heat dissipation effect, and the cup inner surface is the main reflective surface Therefore, it is necessary to improve the completeness of the package by making the mirror finish in the pressing process, making the cup depth as deep as possible, and also by the lead frame insert molding process. In addition, there is an effect that it is possible to provide an LED package which is robust and stable with respect to the post-process and has high reliability.
本発明のＬＥＤ装置用パッケージの一実施例の構成を示す平面図である。It is a top view which shows the structure of one Example of the package for LED apparatuses of this invention. 図１の底面図である。It is a bottom view of FIG. 図１のＡ－Ａ断面図である。FIG. 2 is a cross-sectional view taken along the line AA in FIG. 図１のＢ－Ｂ断面図である。FIG. 3 is a cross-sectional view taken along the line BB in FIG. 図１のＣ－Ｃ断面図である。FIG. 2 is a cross-sectional view taken along the line CC of FIG. 図１のＤ－Ｄ断面図である。FIG. 2 is a DD sectional view of FIG. 1. 図１のＥ－Ｅ断面図である。FIG. 2 is a cross-sectional view taken along line EE in FIG. 1. 図１のＦ－Ｆ断面図である。FIG. 5 is a sectional view taken along line FF in FIG. 1. 本発明のＬＥＤ装置用パッケージの別の実施例の構成を示す平面図である。It is a top view which shows the structure of another Example of the package for LED devices of this invention. 図５の底面図である。FIG. 6 is a bottom view of FIG. 5. 図５のＡ－Ａ断面図である。FIG. 6 is a cross-sectional view taken along line AA in FIG. 5. 図５のＢ－Ｂ断面図である。FIG. 6 is a sectional view taken along line BB in FIG. 5. 図５のＣ－Ｃ断面図である。FIG. 6 is a cross-sectional view taken along the line CC of FIG. 図５のＤ－Ｄ断面図である。FIG. 6 is a DD sectional view of FIG. 5. 図５のＥ－Ｅ断面図である。FIG. 6 is a cross-sectional view taken along line EE in FIG. 5. 図５のＦ－Ｆ断面図である。FIG. 6 is a sectional view taken along line FF in FIG. 5. 図５のＬＥＤ装置用パッケージを用いたＬＥＤ装置の斜視図である。It is a perspective view of the LED device using the package for LED devices of FIG. 図５のＬＥＤ装置用パッケージ及びこのパッケージを用いたＬＥＤ装置の作製工程を示す説明図である。It is explanatory drawing which shows the manufacturing process of the LED apparatus package of FIG. 5, and the LED apparatus using this package. 本発明のＬＥＤ装置用パッケージの別の実施例の構成を示す平面図である。It is a top view which shows the structure of another Example of the package for LED devices of this invention. 図１１の底面図である。FIG. 12 is a bottom view of FIG. 11. 図１１の正面図である。It is a front view of FIG. 図１１の右側面図である。It is a right view of FIG. 図１１のＬＥＤ装置用パッケージを用いたＬＥＤ装置の斜視図である。It is a perspective view of the LED device using the package for LED devices of FIG. 本発明のＬＥＤ装置用パッケージの更に別の実施例の構成を示す平面図である。It is a top view which shows the structure of another Example of the package for LED apparatuses of this invention. 図１６の底面図である。FIG. 17 is a bottom view of FIG. 16. 図１６の正面図である。FIG. 17 is a front view of FIG. 16. 図１６の右側面図である。It is a right view of FIG. 図１６のＬＥＤ装置用パッケージを用いたＬＥＤ装置の斜視図である。It is a perspective view of the LED device using the package for LED devices of FIG. 本発明のＬＥＤパッケージ用リードフレームの一実施例の絞り成型及び抜き成形してカップ状部材を形成した後の平面図である。It is a top view after forming the cup-shaped member by carrying out the drawing molding and the die-molding of one Example of the lead frame for LED packages of this invention. 図２１ａの正面図である。FIG. 21b is a front view of FIG. 21a. 図２１ａの側面図である。FIG. 21b is a side view of FIG. 21a. 図２１のリードフレームに抜き成型してカップ状部材の外方にサブリードフレーム部及び連結桟となる部分を形成した後の平面図である。FIG. 22 is a plan view after the lead frame of FIG. 21 is formed by punching and forming a portion that becomes a sub lead frame portion and a connecting bar outside the cup-shaped member. 図２２ａの正面図である。FIG. 22b is a front view of FIG. 22a. 図２２ａの側面図である。FIG. 22b is a side view of FIG. 22a. 図２２のリードフレームのサブリードフレーム部及び連結桟の予め定められた箇所を曲げ加工した後の平面図である。FIG. 23 is a plan view after bending a predetermined portion of a sub lead frame portion and a connecting bar of the lead frame of FIG. 22; 図２３ａの正面図である。FIG. 23b is a front view of FIG. 23a. 図２３ａの側面図である。FIG. 23b is a side view of FIG. 23a. 図２３ａのＡ－Ａ断面図である。It is AA sectional drawing of FIG. 23a. 図２３ａのＢ－Ｂ断面図である。FIG. 23b is a sectional view taken along line BB of FIG. 23a. 図２３ａの底面図である。FIG. 23b is a bottom view of FIG. 23a. 図２３のリードフレームをインサート成形金型に装着した状態を示す平面図である。FIG. 24 is a plan view showing a state in which the lead frame of FIG. 23 is mounted on an insert molding die. 図２４ａのＡ－Ａ断面図である。It is AA sectional drawing of FIG. 24a. 図２４ａのＢ－Ｂ断面図である。FIG. 24b is a sectional view taken along line BB of FIG. 24a. 図２４ａのＣ－Ｃ断面図である。It is CC sectional drawing of FIG. 24a. 図２４の金型を用いてインサート成形を行った後のＬＥＤ用パッケージの平面図である。It is a top view of the package for LED after performing insert molding using the metal mold | die of FIG. 図２５ａの正面図である。FIG. 25b is a front view of FIG. 25a. 図２５ａの側面図である。FIG. 25b is a side view of FIG. 25a. 図２５ａのＡ－Ａ断面図である。It is AA sectional drawing of FIG. 25a. 図２５ａのＢ－Ｂ断面図である。FIG. 25b is a cross-sectional view taken along the line BB of FIG. 25a. 図２５ａの底面図である。FIG. 25b is a bottom view of FIG. 25a. 本発明のＬＥＤパッケージ用リードフレームの別の実施例の絞り成型及び抜き成形してカップ状部材、サブリードフレーム部及び桟部を形成した後の平面図である。FIG. 6 is a plan view after drawing and punching another example of an LED package lead frame of the present invention to form a cup-shaped member, a sub lead frame part, and a crosspiece part. 図２６ａの正面図である。FIG. 26b is a front view of FIG. 26a. 図２６ａの側面図である。FIG. 26b is a side view of FIG. 26a. 図２６のリードフレームのサブリードフレーム部のリード部を曲げ加工した後の平面図である。FIG. 27 is a plan view after bending a lead portion of a sub lead frame portion of the lead frame of FIG. 26. 図２７ａの正面図である。FIG. 27B is a front view of FIG. 27A. 図２７ａの側面図である。FIG. 27b is a side view of FIG. 27a. 図２７ａのＡ－Ａ断面図である。It is AA sectional drawing of FIG. 27a. 図２７ａのＢ－Ｂ断面図である。FIG. 27B is a sectional view taken along line BB in FIG. 27a. 図２７ａの底面図である。FIG. 27b is a bottom view of FIG. 27a. 図２７のリードフレームの連結桟の所定箇所を折れ加工及び曲げ加工した後の平面図である。FIG. 28 is a plan view after a predetermined portion of the connecting bar of the lead frame of FIG. 27 is bent and bent. 図２８ａの正面図である。FIG. 28b is a front view of FIG. 28a. 図２８ａの側面図である。FIG. 28b is a side view of FIG. 28a. 図２８ａのＡ－Ａ断面図である。It is AA sectional drawing of FIG. 28a. 図２８ａのＢ－Ｂ断面図である。FIG. 28b is a cross-sectional view taken along the line BB of FIG. 28a. 図２８ａの底面図である。FIG. 28b is a bottom view of FIG. 28a. 図２７のリードフレームをインサート成形金型に装着した状態を示す底面図である。FIG. 28 is a bottom view showing a state where the lead frame of FIG. 27 is mounted on an insert molding die. 図２９ａのＡ－Ａ断面図である。It is AA sectional drawing of FIG. 29a. 図２９ａのＢ－Ｂ断面図である。FIG. 29B is a sectional view taken along line BB in FIG. 29a. 図２９の金型を用いてインサート成形を行った後のＬＥＤ用パッケージの平面図である。It is a top view of the package for LED after performing insert molding using the metal mold | die of FIG. 図３０ａの正面図である。It is a front view of FIG. 30a. 図３０ａの側面図である。FIG. 30b is a side view of FIG. 30a. 図３０ａのＡ－Ａ断面図である。FIG. 30B is a sectional view taken along line AA in FIG. 30a. 図３０ａのＢ－Ｂ断面図である。FIG. 30B is a cross-sectional view taken along the line BB of FIG. 30a. 図３０ａの底面図である。FIG. 30b is a bottom view of FIG. 30a.
　本発明においては、ＬＥＤ素子の保持領域を含むＬＥＤ保持面と、該ＬＥＤ保持面の周囲を囲む枠部材とを備え、前記ＬＥＤ保持面と前記枠部材とで構成される素子保持空間を光透過性樹脂で封止したＬＥＤ装置を構成するためのパッケージであって、前記ＬＥＤ保持面には、ＬＥＤ素子とワイヤボンディングにより電気的に接続されるリード部と、ＬＥＤ素子に表面で熱伝導的に接触する放熱板部と、前記リード部と放熱板部とを絶縁樹脂で仕切る絶縁区画部とが表出され、前記ＬＥＤ保持面の裏面側は、前記放熱板部の裏面が前記絶縁区画部の裏面と面一に表出されているため、放熱性を向上させることができ、尚且つ薄い形状とすることのできるＬＥＤ装置を作製するためのパッケージを得ることができる。 In the present invention, an LED holding surface including a holding region for LED elements and a frame member surrounding the LED holding surface are provided, and light is transmitted through an element holding space formed by the LED holding surface and the frame member. A package for constituting an LED device sealed with a conductive resin, wherein the LED holding surface is electrically connected to the LED element by wire bonding, and the LED element is thermally conductive on the surface. A heat radiating plate part that contacts, and an insulating partition part that partitions the lead part and the heat radiating plate part with an insulating resin are exposed, and the back surface side of the LED holding surface is the back surface of the heat radiating plate part of the insulating partition part. Since it is exposed flush with the back surface, heat dissipation can be improved and a package for manufacturing an LED device that can be made thin can be obtained.
　即ち、本発明のパッケージは、ＬＥＤ素子に表面で熱伝導的に接触する放熱板部の裏面が絶縁樹脂による絶縁区画部の裏面と面一に表出させたものである。従って、ＬＥＤ素子で発生する熱を放熱板部の裏面から基板へ放出することができる。また、放熱板部の厚さを薄くすることにより、パッケージやＬＥＤ装置の厚さを薄くすることができる。 That is, in the package of the present invention, the back surface of the heat radiating plate portion that is in thermal conduction contact with the LED element on the surface is exposed flush with the back surface of the insulating partition portion made of insulating resin. Therefore, the heat generated in the LED element can be released from the back surface of the heat radiating plate portion to the substrate. Further, by reducing the thickness of the heat radiating plate portion, the thickness of the package or the LED device can be reduced.
　本発明の放熱板部はリード部と同じ厚さとして、リード部を構成する金属板からリード部の打ち抜き加工の際に、放熱板部もリード部と同時に打ち抜き加工することができる。これにより、放熱板部とリード部とを同時に作製できるため、部品数も少なく、容易にしかも大量に作成可能となる。尚、一般的にリード部を構成する金属板の厚さが０．３ｍｍ程度であるため、放熱板部も同じ厚さで構成することができ、結果的にＬＥＤ装置の厚さを０．８ｍｍ程度にすることが可能となる。 The heat sink plate of the present invention has the same thickness as the lead portion, and when the lead portion is punched from the metal plate constituting the lead portion, the heat sink portion can be punched simultaneously with the lead portion. Accordingly, since the heat radiating plate portion and the lead portion can be manufactured at the same time, the number of components is small, and it can be easily and in large numbers. In general, since the thickness of the metal plate constituting the lead portion is about 0.3 mm, the heat radiating plate portion can also be constituted with the same thickness. As a result, the thickness of the LED device is 0.8 mm. It becomes possible to make the degree.
　本発明では、放熱板部の裏面が絶縁区画部の裏面と面一に表出されており、放熱板部の裏面に、外部放熱部材やプリント基板の導電体部をこれに密着させれば、放熱効果は良好になる。特に、ＬＥＤと電気的に絶縁された本発明のパッケージやＬＥＤ装置では、金属などの導電性材料の放熱部材を接触させても問題が無い為、良好な放熱効果が容易に実現できる。 In the present invention, the back surface of the heat radiating plate portion is exposed flush with the back surface of the insulating partition portion, and if the external heat radiating member and the conductor portion of the printed circuit board are in close contact with the back surface of the heat radiating plate portion, The heat dissipation effect is improved. In particular, in the package and the LED device of the present invention that are electrically insulated from the LED, there is no problem even if a heat radiating member made of a conductive material such as a metal is brought into contact, and therefore, a good heat radiating effect can be easily realized.
　従って、枠部材は好ましくはパッケージの全ての放熱板部とリード部との一部に、枠部材の一部が重なるように施される。この枠部材は、光透過性樹脂で封止される素子保持空間を単に区画して構成するだけでなく、素子保持空間を光透過性樹脂で封止する工程の前までは、絶縁樹脂による絶縁区画部と共に放熱板部とリード部とを保持する役目を有する。 Therefore, the frame member is preferably applied so that a part of the frame member overlaps a part of all the heat radiating plate portions and the lead portions of the package. This frame member is not only configured by simply partitioning the element holding space sealed with the light transmissive resin, but before the step of sealing the element holding space with the light transmissive resin, the frame member is insulated with an insulating resin. It has a role of holding the heat radiating plate part and the lead part together with the partition part.
　枠部材を構成する樹脂と放熱板部とリード部との間に形成された絶縁区画部とは別の樹脂で構成しても良いが、好ましくは同一の樹脂とする。これは、同一の樹脂であれば１つのインサート成形工程で容易に形成できるからである。用いる樹脂はインサート成形で使用できる熱可塑性樹脂が好ましい。また、ＬＥＤ素子を放熱板部上にダイボンディングにより熱伝導が良好なように接着させ、ＬＥＤ素子にワイヤーボンディング等で電気的な接続を安全に行えるだけの工程での強度が確保されるように剛性と耐衝撃強度に優れた樹脂が選択される。例えば、ナイロン系樹脂や液晶ポリマー系樹脂等が用いられる。 The resin constituting the frame member and the insulating partition formed between the heat radiating plate and the lead may be made of a different resin, but preferably the same resin. This is because the same resin can be easily formed in one insert molding process. The resin used is preferably a thermoplastic resin that can be used in insert molding. In addition, the LED element is bonded to the heat dissipation plate part by die bonding so that the heat conduction is good, and the strength is secured in a process that can safely make electrical connection to the LED element by wire bonding or the like. A resin with excellent rigidity and impact strength is selected. For example, nylon resin or liquid crystal polymer resin is used.
　本発明の放熱板部はリード部と相違して電気的な結合はされず、リード部とは絶縁区画部によって絶縁される。これは本パッケージを用いたＬＥＤ装置を搭載する基板上に放熱板部の放熱を促進させる放熱手段を講じた場合に、放熱板部に電気的な結合を施すと、基板の放熱手段についても電気的な制限が生じるためである。従って、放熱板部の表面上に熱伝導的に接触されるＬＥＤ素子の電極とリード部とはワイヤボンディング等によって電気的に結合されるが、放熱板部とは電気的に結合されない構造を実現できる。 Unlike the lead part, the heat sink part of the present invention is not electrically coupled, and is insulated from the lead part by an insulating partition part. This is because, when a heat dissipation means for promoting heat dissipation of the heat dissipation plate portion is provided on the substrate on which the LED device using this package is mounted, if the heat dissipation plate portion is electrically coupled, the heat dissipation means of the substrate is also electrically connected. This is because there is a general limitation. Therefore, the LED element electrode and the lead part, which are in thermal conduction contact with the surface of the heat sink, are electrically coupled by wire bonding or the like, but the structure is not electrically coupled with the heat sink. it can.
　本発明のリード部は放熱板部の表面に接触して配置されるＬＥＤ素子一つに対してアノード側及びカソード側の２つの端子部を備える。また、ＬＥＤ素子は１つのパッケージに複数個配置しても良く、ＬＥＤ素子を直列に接続する場合には、少なくとも２つの放熱板部とこれに隣接したリード部を備えるのが標準的である。隣接する２つの放熱板部の間には、リード部として各々の放熱板部に配置されたＬＥＤ素子同士を接続するための中継部を備えるのが標準的である。 The lead part of the present invention includes two terminal parts on the anode side and the cathode side for one LED element arranged in contact with the surface of the heat sink part. Further, a plurality of LED elements may be arranged in one package. When LED elements are connected in series, it is standard to provide at least two heat radiating plate portions and lead portions adjacent thereto. It is standard that a relay portion for connecting the LED elements arranged in each of the heat dissipation plate portions as a lead portion is provided between two adjacent heat dissipation plate portions.
　更に、直列に接続したＬＥＤ素子を複数行併設させても良い。これにより、複数行の直列接続により発光光度が高く小型で極薄い液晶ディスプレイー用のバックライトユニットや照明用光源が製造可能となる。また、直列接続を、各々、赤色ＬＥＤ群、緑色ＬＥＤ群、青色ＬＥＤ群とすれば、各色での点滅や光度調整が可能となり、カラーフィルター不要の液晶ディスプレーや、光度や色温度を可変可能な照明用光源が実現できる。更に、直列接続にすることにより、各色ＬＥＤ群に印加する電圧が高くなるため、電源の効率が高くなる利点もある。 Furthermore, a plurality of rows of LED elements connected in series may be provided. As a result, a backlight unit for a liquid crystal display or a light source for illumination that has a high luminous intensity and is extremely thin due to a plurality of lines connected in series can be manufactured. Also, if the series connection is a red LED group, a green LED group, and a blue LED group, respectively, it is possible to blink in each color and adjust the light intensity, and a liquid crystal display that does not require a color filter, and the light intensity and color temperature can be varied. An illumination light source can be realized. Furthermore, since the voltage applied to each color LED group becomes high by connecting in series, there is also an advantage that the efficiency of the power supply becomes high.
　本発明の放熱板部に熱伝導的に接触されるＬＥＤ素子は、白色ＬＥＤ、青色ＬＥＤ、赤色ＬＥＤ、緑色ＬＥＤ、黄色ＬＥＤ等の単色のＬＥＤ素子のみを単数又は複数搭載しても良い。また、バックライトとして用いるのであれば、複数行及び複数列を配置可能であるため、白色ＬＥＤだけでなく、青色ＬＥＤ、赤色ＬＥＤ、緑色ＬＥＤ、黄色ＬＥＤ等を組み合わせて、１つのＬＥＤ装置で白色を呈するようにしてもよい。 The LED element that is thermally conductively contacted with the heat radiating plate portion of the present invention may include only one or a plurality of single-color LED elements such as white LED, blue LED, red LED, green LED, and yellow LED. In addition, if it is used as a backlight, it is possible to arrange a plurality of rows and a plurality of columns. Therefore, not only a white LED but also a blue LED, a red LED, a green LED, a yellow LED, etc. are combined to produce a white color with a single LED device. May be presented.
　本発明のパッケージとしての機械的強度は、ＬＥＤ素子を放熱板部上にダイボンディングにより熱伝導的に接触させ、ＬＥＤ素子にワイヤボンディング等で電気的な接触を行い、光透過性樹脂を封止する工程の強度が必要である。また、プリント基板等に実装する為、リフローや半田付けの作業にも不具合をきたさない強度が必要である。このため、パッケージとしての強度を高める種々の工夫を行っても良い。例えば、リード部及び放熱板部と、これらの間に形成された絶縁区画部の樹脂及び枠部材の樹脂との接合強度を向上させるため、リード部又は放熱板部に表裏を貫通する穿設孔を設けてその穿設孔に樹脂を流し込むようにしたり、リード部又は放熱板部の周囲の一部に切欠や周囲を直線状ではなく例えばジグザグ状に形成して絶縁区画部の樹脂に及び枠部材の樹脂との接触面積を高めたりすることができる。 The mechanical strength of the package of the present invention is such that the LED element is brought into thermal contact with the heat sink by die bonding, and the LED element is electrically contacted by wire bonding or the like to seal the light-transmitting resin. The strength of the process is necessary. Moreover, since it mounts on a printed circuit board etc., the intensity | strength which does not cause a malfunction also in the work of reflow and soldering is required. For this reason, you may perform various devices which raise the intensity | strength as a package. For example, in order to improve the bonding strength between the lead part and the heat radiating plate part and the resin of the insulating partition part formed between them and the resin of the frame member, a perforation hole penetrating the front and back of the lead part or the heat radiating plate part So that the resin is poured into the perforation hole, or a notch or a periphery is formed in a part of the periphery of the lead portion or the heat radiating plate portion, for example, in a zigzag shape to cover the resin of the insulating partition portion and the frame The contact area of the member with the resin can be increased.
　更に、本発明のリード部のＬＥＤ保持面での高さ位置が放熱板部のＬＥＤ保持面での高さ位置よりも上位に配置しても良い。即ち、放熱板部と同一の金属板から打ち抜いたリード部の一部を曲折してリード部の表面は放熱板部の表面高さ位置よりも上位に配置した場合には、リード部の裏面側に絶縁樹脂が回り込むことになり、ＬＥＤ素子をダイボンディングやワイヤーボンディングで熱的・電気的な接続を行う工程に耐えられるようにパッケージの強度を増すことができる。尚、リード部の表面の高さ位置は枠部材を越えることがなく、ＬＥＤ素子の電極の高さ位置と同等とすることにより、ＬＥＤ素子とリード部とのワイヤボンディングが良好に行える利点もある。更に、放熱板部裏面の近傍には電気的に接続されたリード部が露出しない為、放熱板部裏面と外部放熱構造体を直接接触させる事が可能である為、容易に効果的な放熱構造を実現できる。 Furthermore, the height position of the lead portion of the present invention on the LED holding surface may be disposed higher than the height position of the heat sink plate on the LED holding surface. That is, if a part of the lead part punched from the same metal plate as the heat sink part is bent and the surface of the lead part is placed higher than the surface height position of the heat sink part, the back side of the lead part Thus, the insulating resin wraps around, and the strength of the package can be increased so that the LED element can withstand the process of thermally and electrically connecting the LED element by die bonding or wire bonding. It should be noted that the height position of the surface of the lead portion does not exceed the frame member, and by making it equal to the height position of the electrode of the LED element, there is also an advantage that the wire bonding between the LED element and the lead portion can be favorably performed. . Furthermore, since the electrically connected lead part is not exposed near the back of the heat sink, it is possible to directly contact the back of the heat sink and the external heat dissipation structure. Can be realized.
　本発明の好ましい態様としては、前記放熱板部がＬＥＤ素子を内側に保持するカップ状部材であり、
　前記カップ状部材は、ＬＥＤ素子に熱伝導的に接触する底板部と、この底板部の周縁部に形成された反射面部とを備え、
　前記反射面部は、この反射面部の内側の底板部に熱伝導的に接触されたＬＥＤ素子の放射光が、この反射面部を介した外側の前記ＬＥＤ保持面と枠部材とに照射されることを阻止する高さに形成されているているため、青色ＬＥＤや紫外線ＬＥＤを用いたとしても、絶縁樹脂を劣化させるおそれがなく、放熱性を向上させることができ、尚且つ薄い形状とすることのできるＬＥＤ装置を作製するためのパッケージを得ることができる。 As a preferable aspect of the present invention, the heat radiating plate portion is a cup-shaped member that holds the LED element inside,
The cup-shaped member includes a bottom plate portion that comes into thermal contact with the LED element, and a reflective surface portion formed on a peripheral portion of the bottom plate portion,
The reflection surface portion is configured such that the emitted light of the LED element thermally contacted with the bottom plate portion inside the reflection surface portion is irradiated to the outside LED holding surface and the frame member via the reflection surface portion. Since it is formed at the height to prevent, even if blue LED or ultraviolet LED is used, there is no risk of deteriorating the insulating resin, heat dissipation can be improved, and it is possible to make it thin A package for producing an LED device that can be obtained can be obtained.
　即ち、本発明のパッケージは、ＬＥＤ素子を内側に保持するカップ状部材が、ＬＥＤ素子に熱伝導的に接触する底板部と、この底板部の周縁部に形成された反射面部とを備えており、反射面部によってＬＥＤ素子の放射光が枠部材に照射されることが阻止されるため、青色ＬＥＤや紫外線ＬＥＤを用いたとしても、反射面部の外側に配された絶縁樹脂の光反射特性を劣化させるおそれがない。また、ＬＥＤ素子に表面で熱伝導的に接触するカップ状部材の底板部の裏面が絶縁樹脂による絶縁区画部の裏面と面一に表出させたものである。従って、ＬＥＤ素子で発生する熱をカップ状部材の底板部の裏面から基板へ放出することができる。また、カップ状部材の反射面部の立ち上がり高さを可能な限り薄くすることにより、パッケージやＬＥＤ装置の厚さを薄くすることもできる。 That is, in the package of the present invention, the cup-shaped member that holds the LED element on the inner side includes a bottom plate portion that is in thermal contact with the LED element, and a reflective surface portion that is formed on the peripheral portion of the bottom plate portion. Since the reflective surface portion prevents the radiated light of the LED element from being applied to the frame member, even if a blue LED or ultraviolet LED is used, the light reflection characteristics of the insulating resin disposed outside the reflective surface portion are deteriorated. There is no fear. Further, the back surface of the bottom plate portion of the cup-shaped member that comes into thermal contact with the LED element on the surface is made to be flush with the back surface of the insulating partition portion made of insulating resin. Therefore, the heat generated in the LED element can be released from the back surface of the bottom plate portion of the cup-shaped member to the substrate. Moreover, the thickness of the package or the LED device can be reduced by reducing the rising height of the reflection surface portion of the cup-shaped member as much as possible.
　例えば、打ち抜き加工と同時か打ち抜き加工工程の後にプレス加工によりカップ状部材の周囲を曲折して、底板部と反射面部とを形成する。この際に、反射面部の立ち上がり高さを、反射面部の内側の底板部に熱伝導的に接触されたＬＥＤ素子の放射光が、この反射面部を介した外側の前記ＬＥＤ保持面と枠部材とに照射されることを概ね阻止するか、それ以上の高さが必要である。 For example, the periphery of the cup-shaped member is bent by press working simultaneously with the punching process or after the punching process to form the bottom plate portion and the reflection surface portion. At this time, the rising height of the reflecting surface portion is determined so that the emitted light of the LED element thermally contacted with the bottom plate portion on the inner side of the reflecting surface portion is the LED holding surface and the frame member on the outer side through the reflecting surface portion. In general, it is necessary to prevent the radiation from being irradiated or to be higher than that.
　本発明の反射面部としては、底板部の全周縁に環状に形成されたものが、放射光が枠部材に照射されることを阻止する為には最も望ましいが、底板部の周囲の一部に形成された複数のカップ状部材を並設させて複数の反射面部で複数の底板部の縁を囲んで形成されたものとすることもできる。 As the reflection surface portion of the present invention, one formed in an annular shape on the entire periphery of the bottom plate portion is most desirable for preventing the radiated light from being applied to the frame member, but on the part around the bottom plate portion. A plurality of formed cup-shaped members may be arranged side by side so as to surround the edges of the plurality of bottom plate portions with a plurality of reflection surface portions.
　本発明のパッケージは、１つ以上のＬＥＤ素子を放熱板部又はカップ状部材にダイボンディングにより熱伝導的に接触させて搭載し、このＬＥＤ素子の２つの電極をリード部にワイヤボンディングで連結した後、ＬＥＤ素子を保持したＬＥＤ保持面とこのＬＥＤ保持面の周囲を囲む枠部材とで構成される素子保持空間を光透過性樹脂で封止してＬＥＤ装置を得る。 In the package of the present invention, one or more LED elements are mounted on a heat radiating plate part or a cup-shaped member in thermal conductive contact by die bonding, and two electrodes of the LED element are connected to the lead part by wire bonding. Thereafter, an element holding space constituted by an LED holding surface holding the LED element and a frame member surrounding the LED holding surface is sealed with a light-transmitting resin to obtain an LED device.
　光透過性樹脂としては、ＬＥＤ素子の発光を減衰させず外部に放射する、又は、蛍光材を光透過性樹脂に含有させる事により、青色ＬＥＤ、紫色ＬＥＤ或いは紫外線ＬＥＤからの発光を、これらより長い波長の可視光の光に変換し、ＬＥＤ装置全体としての発光を白色にするといった、光源色を変化させることも可能である。更に、光透過性樹脂の形状を適切に工夫することにより、特定の方向への放射光を強くする、レンズの効果を持たせることも出来る。更に、封止されているＬＥＤ素子を湿度等から守る役割もある。光透過性樹脂としては、例えば、アクリル系樹脂や、シリコン系透明樹脂等が使用されている。 As the light transmissive resin, the light emitted from the LED element is radiated to the outside without being attenuated, or the light emitted from the blue LED, the purple LED, or the ultraviolet LED is incorporated into the light transmissive resin by using these materials. It is also possible to change the color of the light source, for example, converting the light into visible light having a long wavelength and making the light emission of the entire LED device white. Furthermore, by appropriately devising the shape of the light-transmitting resin, it is possible to provide a lens effect that enhances the emitted light in a specific direction. Furthermore, there is also a role of protecting the sealed LED element from humidity and the like. As the light transmissive resin, for example, an acrylic resin, a silicon transparent resin, or the like is used.
　好ましくは、本発明の放熱板部又はカップ状部材の内側面は光の反射率が高くなるような処理を施す。具体的には、カップ状部材の内側面には、底板部に熱伝導的に接触されたＬＥＤ素子から放射される光のほぼ全波長域に対して高い反射率を備える反射層が形成される。金属面は平滑度が高い程光の反射率が高くなるので、鏡面加工されることにより、ＬＥＤ素子から放射される光に対して高い反射率を有することができる。 Preferably, the heat radiating plate portion or the inner surface of the cup-shaped member of the present invention is subjected to a treatment that increases the light reflectance. Specifically, a reflection layer having a high reflectance with respect to almost the entire wavelength range of light emitted from the LED element thermally contacted with the bottom plate portion is formed on the inner surface of the cup-shaped member. . The higher the smoothness of the metal surface, the higher the light reflectance. Therefore, the metal surface can have a high reflectance with respect to the light emitted from the LED element by being mirror-finished.
　本発明のパッケージは、ＬＥＤ素子を搭載するためのＬＥＤ保持面と該ＬＥＤ保持面の周囲を囲む枠部材とを備え、前記ＬＥＤ保持面と前記枠部材とで構成される素子保持空間を光透過性樹脂で封止したＬＥＤ装置を構成するためのパッケージの製造法において、前記ＬＥＤ素子と電気的に接続され、前記ＬＥＤ保持面の一部を構成するリード部と、ＬＥＤ素子に表面で熱伝導的に接触する放熱板部とを有するリードフレーム板材を同一の金属板から抜出す工程と、前記打ち抜かれたリードフレーム板材に、前記枠部材と、前記リード部と放熱板部との間の絶縁区画部を形成する絶縁樹脂とをインサート成形するインサート成形工程とを備え、前記インサート成形工程では、枠部材が形成される裏面側に、前記放熱板部の裏面が前記絶縁樹脂による絶縁区画部の裏面と面一に表出される。これにより、放熱性を向上させ尚且つ厚さが薄いＬＥＤ装置を容易に大量にしかも安価に得ることができる。 The package of the present invention includes an LED holding surface for mounting an LED element and a frame member surrounding the LED holding surface, and transmits light through an element holding space composed of the LED holding surface and the frame member. In a method of manufacturing a package for constituting an LED device sealed with a conductive resin, a lead part electrically connected to the LED element and constituting a part of the LED holding surface, and heat conduction on the surface of the LED element A step of extracting a lead frame plate material having a heat radiating plate portion that comes into contact with the same metal plate from the punched lead frame plate material, and insulation between the frame member and the lead portion and the heat radiating plate portion. An insert molding step of insert-molding an insulating resin that forms the partition portion, and in the insert molding step, the back surface of the heat radiating plate portion is disposed on the back surface side on which the frame member is formed. It is exposed on the rear surface flush with the insulating partition portion due. Thereby, it is possible to easily obtain a large number of LED devices with improved heat dissipation and a small thickness at a low cost.
　本発明の放熱板部とリード部とを打ち抜き加工される金属板としてはフープ材を用いることができ、このフープ材を用いて枠部材と、前記リード部と放熱板部との間に形成される絶縁区画部とをインサート成形することにより、容易に大量にしかも安価に製造することが可能となる。 A hoop material can be used as the metal plate for punching the heat radiation plate portion and the lead portion of the present invention, and the hoop material is used to form the frame member and the lead portion and the heat radiation plate portion. By insert-molding the insulating partition part, it is possible to easily manufacture a large quantity and at a low cost.
　好ましくは、本発明のインサート成形工程の前にリード部を曲折する曲折工程を更に備えることにより、リード部の裏面側に絶縁樹脂が回り込むことになり、ＬＥＤ素子を放熱板部上に熱伝導的に接触させ、ＬＥＤ素子にワイヤボンディング等で電気的な接続を行う間のパッケージの強度を増すことができる。 Preferably, by further including a bending step of bending the lead portion before the insert molding step of the present invention, the insulating resin wraps around the back surface side of the lead portion, and the LED element is thermally conductive on the heat radiating plate portion. The strength of the package can be increased during electrical connection to the LED element by wire bonding or the like.
　本発明においては、ＬＥＤ素子の保持領域を含むＬＥＤ保持面と、このＬＥＤ保持面の周囲を囲む樹脂枠部材と、この樹脂枠部材のＬＥＤ保持面に表出されたＬＥＤ素子とワイヤボンディングにより電気的に接続されるリード部と、前記ＬＥＤ保持面と前記枠部材とで構成される素子保持空間を封止した光透過性樹脂とを備えたＬＥＤ装置を構成する前記ＬＥＤ保持面と樹脂枠部材とリード部とからなるＬＥＤ用パッケージのうち、前記ＬＥＤ保持面とリード部とを構成するためのリードフレームである。 In the present invention, the LED holding surface including the holding region of the LED element, a resin frame member surrounding the LED holding surface, and the LED element exposed on the LED holding surface of the resin frame member are electrically connected by wire bonding. LED holding surface and resin frame member constituting an LED device comprising: a lead portion that is electrically connected; and a light transmissive resin that seals an element holding space composed of the LED holding surface and the frame member 2 is a lead frame for constituting the LED holding surface and the lead portion of the LED package comprising the lead portion and the lead portion.
　即ち、本発明はリードフレームに関するものである。このリードフレームはＬＥＤ保持面と樹脂枠部材とリード部とからなるＬＥＤ用パッケージを例えばインサート成形で形成する際に用いられる。得られたＬＥＤ用パッケージはＬＥＤ保持面にＬＥＤ素子が搭載され、リード部とワイヤボンディングした後に、ＬＥＤ保持面とその周囲の枠部材とで構成される素子保持空間を光透過性樹脂で封止してＬＥＤ装置を得る。 That is, the present invention relates to a lead frame. This lead frame is used when an LED package comprising an LED holding surface, a resin frame member, and a lead portion is formed by, for example, insert molding. The obtained LED package has an LED element mounted on the LED holding surface, and after wire bonding to the lead portion, the element holding space composed of the LED holding surface and the surrounding frame member is sealed with a light transmissive resin. Thus, an LED device is obtained.
　本発明のリードフレームは、ＬＥＤ保持面としてＬＥＤ素子を内側に保持するカップ状部材と、リード部を１つ以上備えたサブリードフレーム部と、カップ状部材とサブリードフレーム部とを連結する連結桟とを備え、連結桟に前記カップ状部材とサブリードフレーム部との間隙を予め定められた間隙距離に縮める曲げ加工部を更に備える。これにより、フープ材のような薄板金属の条を用いて、通常の抜き、曲げ、絞りのプレス技術による高速プレスで生産性の高い、安価なリードフレームを得ることができる。 The lead frame of the present invention includes a cup-shaped member that holds an LED element on the inside as an LED holding surface, a sub lead frame portion having one or more lead portions, and a connection that connects the cup-shaped member and the sub lead frame portion. And a bending portion for reducing the gap between the cup-shaped member and the sub lead frame portion to a predetermined gap distance. Thus, a thin lead metal strip such as a hoop material can be used to obtain an inexpensive lead frame with high productivity by high-speed pressing using a normal punching, bending, and drawing press technique.
　本発明では、曲げ加工部により、間隙を縮めることが可能なるため、例えば、通常の抜き加工では不可能とされた金属薄板の厚さよりも短い間隙距離に縮めることも可能となりＬＥＤ用パッケージを小型化できるリードフレームを実現できる。 In the present invention, since the gap can be reduced by the bent portion, for example, the gap can be reduced to a gap distance shorter than the thickness of the thin metal plate, which is impossible by normal punching, and the LED package can be reduced in size. Lead frame can be realized.
　本発明のリードフレームとしては、通常の抜き、曲げ、絞りのプレス成形の可能な金属薄板が用いられる。より好ましくは金属フープ材を用いることにより、連続して成型が可能となる。金属薄板は少なくともＬＥＤ保持面に表出されたＬＥＤ素子とワイヤボンディングにより電気的に接続されるリード部に電導通性を有するものであればよい。 As the lead frame of the present invention, a metal thin plate capable of ordinary punching, bending, and drawing press forming is used. More preferably, by using a metal hoop material, continuous molding becomes possible. The metal thin plate should just have electroconductivity at least in the lead part electrically connected to the LED element exposed on the LED holding surface by wire bonding.
　本発明のサブリードフレーム部が、好ましくは、カップ状部材を間にして１組が対向して配置されるものでは、カップ状部材に対して向かい合う長辺に対して各々にリード部が配置可能となるため、多数のＬＥＤ素子をカップ状部材に配置可能となるため、小型で発光性能が高いＬＥＤ装置を得ることができる。 In the sub lead frame portion of the present invention, preferably, one pair is disposed opposite to each other with the cup-shaped member in between, and the lead portion can be disposed on each of the long sides facing the cup-shaped member. Therefore, since a large number of LED elements can be arranged on the cup-shaped member, it is possible to obtain a small LED device with high light emission performance.
　本発明のカップ状部材は、カップ状内部がＬＥＤ保持面となり、カップの底面及び側面部が主たる反射部となるため、好ましくは、反射効率を向上させるように内面を鏡面仕上げする。この場合にも、絞り成形により、鏡面仕上げした金型の転写作用により、反射面の鏡面を得ることができる。 In the cup-shaped member of the present invention, since the cup-shaped interior serves as the LED holding surface, and the bottom and side surfaces of the cup serve as the main reflecting portions, the inner surface is preferably mirror-finished so as to improve the reflection efficiency. Also in this case, the mirror surface of the reflecting surface can be obtained by the drawing action of the mold having a mirror finish by drawing.
　図１は本発明のＬＥＤ装置用パッケージの一実施例の構成を示す平面図であり、図２は図１の底面図、図３は図１の縦断面図であり、図３ａはＡ－Ａ断面図、図３ｂはＢ－Ｂ断面図、図３ｃはＣ－Ｃ断面図である。図４は図１の横断面図であり、図４ａはＤ－Ｄ断面図、図３ｂはＥ－Ｅ断面図、図３ｃはＦ－Ｆ断面図である。 1 is a plan view showing a configuration of an embodiment of an LED device package according to the present invention, FIG. 2 is a bottom view of FIG. 1, FIG. 3 is a longitudinal sectional view of FIG. 1, and FIG. FIG. 3b is a sectional view taken along the line BB, and FIG. 3c is a sectional view taken along the line CC. 4 is a transverse sectional view of FIG. 1, FIG. 4a is a DD sectional view, FIG. 3b is a EE sectional view, and FIG. 3c is a FF sectional view.
　本実施例のパッケージ１０は、ＬＥＤ素子を保持するＬＥＤ保持面１１と、ＬＥＤ保持面１１の周囲を囲む枠部材１２とで構成される素子保持空間１３を光透過性樹脂で封止するＬＥＤ装置に用いるものである。具体的には、ＬＥＤ保持面１１は、ＬＥＤ素子（図示せず）と電気的に接続されるリード部１４と、ＬＥＤ素子を表面に熱伝導的に接触させる放熱板部１５とが、絶縁樹脂による絶縁区画部１６を介して表出されている。 The package 10 of this embodiment is an LED device that seals an element holding space 13 composed of an LED holding surface 11 for holding an LED element and a frame member 12 surrounding the LED holding surface 11 with a light-transmitting resin. It is used for. Specifically, the LED holding surface 11 includes a lead portion 14 that is electrically connected to an LED element (not shown) and a heat radiating plate portion 15 that makes the LED element come into thermal contact with the surface. It is expressed through the insulating partition part 16 by.
　リード部１４と放熱板部１５とは、図１に示す通り、板厚が０．３ｍｍの金属板１７から打ち抜き形成されている。放熱板部１５は４枚、リード部１４は１２枚である。リード部１４のうち、中間位置に配された４枚のリード部はＬＥＤ素子を直列に連結する中継部１４ｂである。 The lead portion 14 and the heat radiating plate portion 15 are formed by punching from a metal plate 17 having a plate thickness of 0.3 mm, as shown in FIG. There are four heat radiating plate portions 15 and twelve lead portions 14. Of the lead parts 14, four lead parts arranged at intermediate positions are relay parts 14b that connect the LED elements in series.
　図２、図３及び図４に示す通り、ＬＥＤ保持面１１の裏面は、リード部１４と放熱板部１５との裏面が絶縁樹脂による絶縁区画部１６の裏面と面一に表出されている。このパッケージ１０は１つの放熱板部１５に２つのＬＥＤ素子を搭載し、各ＬＥＤ素子の電極とリード部１４とをワイヤボンディングで電気的に接続し、素子保持空間１３を光透過性樹脂で封止した後又はその前に金属板１７から切り離されて、ＬＥＤ装置となる。 As shown in FIGS. 2, 3, and 4, the back surface of the LED holding surface 11 is flush with the back surface of the lead portion 14 and the heat radiating plate portion 15 with the back surface of the insulating partition portion 16 made of insulating resin. . In this package 10, two LED elements are mounted on one heat radiating plate portion 15, the electrodes of each LED element and the lead portion 14 are electrically connected by wire bonding, and the element holding space 13 is sealed with a light transmissive resin. After stopping or before it is cut off from the metal plate 17, it becomes an LED device.
　尚、金属板１７の上下に形成された一対の孔は、フープ材として加工される場合等に用いる位置決め孔１８である。また、リード部１４及び放熱板部１５の枠部材１２の直下に形成された４つの小孔は、リード部１４及び放熱板部１５と、これらの絶縁樹脂による絶縁区画部１６及び枠部材１２の樹脂との接合強度を向上させるための穿設孔１９である。 Note that the pair of holes formed above and below the metal plate 17 are positioning holes 18 used when processed as a hoop material. Further, the four small holes formed immediately below the frame member 12 of the lead part 14 and the heat radiating plate part 15 are the lead part 14 and the heat radiating plate part 15, the insulating partition part 16 and the frame member 12 of these insulating resins. This is a drilling hole 19 for improving the bonding strength with the resin.
　図５は本発明のＬＥＤ装置用パッケージの別の実施例の構成を示す平面図であり、図６は図５の底面図、図７は図５の縦断面図であり、図７ａはＡ－Ａ断面図、図７ｂはＢ－Ｂ断面図、図７ｃはＣ－Ｃ断面図である。図８は図５の横断面図であり、図８ａはＤ－Ｄ断面図、図８ｂはＥ－Ｅ断面図、図８ｃはＦ－Ｆ断面図である。図９は図５のＬＥＤ装置用パッケージを用いたＬＥＤ装置の斜視図である。 5 is a plan view showing the configuration of another embodiment of the LED device package of the present invention, FIG. 6 is a bottom view of FIG. 5, FIG. 7 is a longitudinal sectional view of FIG. 5, and FIG. A sectional view, FIG. 7b is a BB sectional view, and FIG. 7c is a CC sectional view. 8 is a cross-sectional view of FIG. 5, FIG. 8a is a DD cross-sectional view, FIG. 8b is a EE cross-sectional view, and FIG. 8c is a FF cross-sectional view. FIG. 9 is a perspective view of an LED device using the LED device package of FIG.
　本実施例のパッケージ５０は、図９に示す通り、ＬＥＤ素子６１を保持するＬＥＤ保持面５１と、ＬＥＤ保持面５１の周囲を囲む枠部材５２とで構成される素子保持空間５３を光透過性樹脂６３で封止するＬＥＤ装置６０に用いるものである。具体的には、ＬＥＤ保持面５１には、ＬＥＤ素子６１とワイヤ６２で電気的に接続されるリード部５４と、ＬＥＤ素子を表面で熱伝導的に接触する放熱板部５５とが絶縁樹脂による絶縁区画部５６を介して表出されている。 As shown in FIG. 9, the package 50 according to the present embodiment transmits an element holding space 53 including an LED holding surface 51 that holds the LED element 61 and a frame member 52 that surrounds the LED holding surface 51. It is used for the LED device 60 sealed with the resin 63. Specifically, the LED holding surface 51 includes a lead portion 54 that is electrically connected to the LED element 61 by a wire 62 and a heat radiating plate portion 55 that is in thermal conductive contact with the LED element on the surface. It is exposed via the insulating partition 56.
　リード部５４と放熱板部５５とは、図５に示す通り、板厚が０．３ｍｍの金属板５７から抜出されて形成されている。放熱板部５５は４枚、リード部５４は１２枚である。リード部５４のうち、中間位置に配された４枚のリード部はＬＥＤ素子を直列に連結する中継部５４ｂである。 The lead portion 54 and the heat radiating plate portion 55 are formed by being extracted from a metal plate 57 having a plate thickness of 0.3 mm, as shown in FIG. There are four heat radiating plate portions 55 and twelve lead portions 54. Of the lead portions 54, the four lead portions arranged at the intermediate positions are relay portions 54b that connect the LED elements in series.
　図７及び図８に示す通り、リード部５４（中継部５４ｂ）は枠部材５２の下方位置で曲折されており、リード部５４のＬＥＤ保持面５１の表面高さ位置が放熱板部５５の表面高さ位置よりも上位となっている。このため、図６に示す通り、ＬＥＤ保持面５１の裏面は、放熱板部５５の裏面のみが表出され、絶縁樹脂による絶縁区画部５６の裏面と面一に表出されている。 As shown in FIGS. 7 and 8, the lead portion 54 (relay portion 54 b) is bent at a position below the frame member 52, and the surface height position of the LED holding surface 51 of the lead portion 54 is the surface of the heat radiating plate portion 55. It is higher than the height position. For this reason, as shown in FIG. 6, the back surface of the LED holding surface 51 is exposed only on the back surface of the heat radiating plate portion 55 and is flush with the back surface of the insulating partition portion 56 made of insulating resin.
　尚、金属板５７の上下に形成された一対の孔は、フープ材６５として加工される場合等に用いる位置決め孔５８である。また、リード部５４及び放熱板部５５の枠部材５２の直下に形成された４つの小孔は、リード部５４及び放熱板部５５と、これらの絶縁樹脂による絶縁区画部５６及び枠部材５２の樹脂との接合強度を向上させるための穿設孔５９である。 The pair of holes formed above and below the metal plate 57 are positioning holes 58 that are used when the hoop material 65 is processed. Further, the four small holes formed immediately below the frame member 52 of the lead portion 54 and the heat radiating plate portion 55 are the lead portion 54 and the heat radiating plate portion 55, the insulating partition portion 56 and the frame member 52 made of these insulating resins. This is a perforation hole 59 for improving the bonding strength with the resin.
　図１０は図５のＬＥＤ装置用パッケージ及びこのパッケージを用いたＬＥＤ装置の作製工程を示す説明図である。図１０ａに示す通り、金属板５７はインサート成形で使用されるフープ材８７が用いられる。図１０ｂに示す通り、フープ材８７を打ち抜き成形してリード部５４と放熱板部５５とを抜出す。 FIG. 10 is an explanatory view showing the LED device package of FIG. 5 and a manufacturing process of the LED device using the package. As shown in FIG. 10a, the metal plate 57 is a hoop material 87 used in insert molding. As shown in FIG. 10 b, the hoop material 87 is punched and formed to extract the lead portion 54 and the heat radiating plate portion 55.
　次に、図１０ｃに示す通り、枠部材５２の下方位置のリード部５４を曲折する。図１０ｄに示す通り、枠部材５２と絶縁樹脂５６とをインサート成形により作製する。この際に、枠部材５２が形成された裏面は放熱板部５５が絶縁樹脂５６と面一に表出される。図１０ｅに示す通り、フープ材８７を切断して、周囲に金属板５７が残ったパッケージ５０を得る。図１０ｆに示す通り、金属板５７から切り離されてパッケージ５０を得る。 Next, as shown in FIG. 10c, the lead portion 54 below the frame member 52 is bent. As shown in FIG. 10d, the frame member 52 and the insulating resin 56 are produced by insert molding. At this time, the heat sink 55 is exposed flush with the insulating resin 56 on the back surface on which the frame member 52 is formed. As shown in FIG. 10e, the hoop material 87 is cut to obtain the package 50 in which the metal plate 57 remains around. As shown in FIG. 10 f, the package 50 is obtained by being cut from the metal plate 57.
　その後、図９に示す通り、パッケージ５０は１つの放熱板部５５に２つのＬＥＤ素子６１を熱伝導的に接触させ、各ＬＥＤ素子６１の電極とリード部５４とをワイヤ６２で電気的に接続し、素子保持空間５３を光透過性樹脂６３で封止して、ＬＥＤ装置６０となる。尚、ＬＥＤ素子６１の搭載、ワイヤボンディング６２の接続、光透過性樹脂６３の封止は図１０ｅや図１０ｆに示す工程で行っても良い。 After that, as shown in FIG. 9, the package 50 brings two LED elements 61 into thermal conduction contact with one heat radiating plate portion 55, and electrically connects the electrodes of each LED element 61 and the lead portions 54 with wires 62. Then, the element holding space 53 is sealed with the light-transmitting resin 63 to form the LED device 60. Note that the mounting of the LED element 61, the connection of the wire bonding 62, and the sealing of the light-transmitting resin 63 may be performed in the steps shown in FIGS. 10e and 10f.
　尚、図１０の製造工程では図１０ｃに示した通り、リード部を曲折する工程を含むが、この工程を省略することにより図１のＬＥＤ装置用パッケージ及びこのパッケージを用いたＬＥＤ装置を製造することが可能である。 10 includes the step of bending the lead portion as shown in FIG. 10c. By omitting this step, the LED device package of FIG. 1 and the LED device using this package are manufactured. It is possible.
　図１１は本発明のＬＥＤ装置用パッケージの更に別の実施例の構成を示す平面図であり、図１２は図１１の底面図である。図１３は図１１の正面図であり、図１４は図１１の右側面図である。図１５は図１１のＬＥＤ装置用パッケージを用いたＬＥＤ装置の斜視図である。 FIG. 11 is a plan view showing the configuration of still another embodiment of the LED device package of the present invention, and FIG. 12 is a bottom view of FIG. 13 is a front view of FIG. 11, and FIG. 14 is a right side view of FIG. FIG. 15 is a perspective view of an LED device using the LED device package of FIG.
　本実施例のパッケージ１１０は、ＬＥＤ素子を保持するＬＥＤ保持面１１１と、ＬＥＤ保持面１１１の周囲を囲む枠部材１１２とで構成される素子保持空間１１３を光透過性樹脂で封止するＬＥＤ装置に用いるものである。具体的には、ＬＥＤ保持面１１１は、ＬＥＤ素子と電気的に接続される８つのリード部１１４と、ＬＥＤ素子を表面に熱伝導的に接触させる平面形状が略矩形の１つのカップ状部材１１５とが、絶縁樹脂による絶縁区画部１１７を介して表出されている。 The package 110 of this embodiment is an LED device that seals an element holding space 113 composed of an LED holding surface 111 for holding an LED element and a frame member 112 surrounding the LED holding surface 111 with a light-transmitting resin. It is used for. Specifically, the LED holding surface 111 includes eight lead portions 114 that are electrically connected to the LED elements, and one cup-shaped member 115 having a substantially rectangular planar shape that makes the LED elements come into thermal contact with the surface. Are expressed through an insulating partition 117 made of insulating resin.
　本実施例のパッケージ１１０は、図１５に示す通り、ＬＥＤ素子１２１を保持するＬＥＤ保持面１１１と、ＬＥＤ保持面１１１の周囲を囲む枠部材１１２とで構成される素子保持空間１１３を光透過性樹脂１２３で封止するＬＥＤ装置１２０に用いるものである。尚、図１５において絶縁樹脂による絶縁区画部１１７を示すパターン線は省略している。図１５に示す通り、略矩形のカップ状部材１１５は、ＬＥＤ素子１２１に熱伝導的に接触する底板部１１５ａと、この底板部１１５ａの縁に形成された反射面部１１５ｂとを備える。反射面部１１５ｂは底板部１１５ａの全周縁に環状に形成され、反射面部１１５ｂは、この反射面部１１５ｂの内側の底板部１１５ａに熱伝導的に接触されたＬＥＤ素子１２１の放射光が、この反射面部１１５ｂを介した外側のＬＥＤ保持面１１１と枠部材１１２とに直接照射されることを阻止する程度の高さに形成されている。 As shown in FIG. 15, the package 110 according to the present embodiment transmits light in an element holding space 113 including an LED holding surface 111 that holds the LED element 121 and a frame member 112 that surrounds the LED holding surface 111. The LED device 120 is sealed with a resin 123. In FIG. 15, a pattern line indicating the insulating partition 117 made of insulating resin is omitted. As shown in FIG. 15, the substantially rectangular cup-shaped member 115 includes a bottom plate portion 115 a that is in thermal contact with the LED element 121, and a reflective surface portion 115 b that is formed at the edge of the bottom plate portion 115 a. The reflective surface portion 115b is formed in an annular shape around the entire periphery of the bottom plate portion 115a. The reflective surface portion 115b is configured to receive the radiated light of the LED element 121 thermally contacted with the bottom plate portion 115a inside the reflective surface portion 115b. It is formed to a height that prevents direct irradiation of the outer LED holding surface 111 and the frame member 112 via 115b.
　また、図１２、図１３、図１４及び図１５に示す通り、ＬＥＤ保持面１１１の裏面は、カップ状部材１１５の底板部１１５ａの裏面が絶縁樹脂による絶縁区画部１１７の裏面と面一に表出されている。このパッケージ１１０は１つのカップ状部材１１５に４つのＬＥＤ素子１２１を搭載し、各ＬＥＤ素子１２１の電極とリード部１１４とをワイヤ２２で電気的に接続し、素子保持空間１１３を光透過性樹脂１２３で封止して、ＬＥＤ装置１２０となる。 In addition, as shown in FIGS. 12, 13, 14 and 15, the back surface of the LED holding surface 111 is flush with the back surface of the insulating partition portion 117 made of insulating resin. Has been issued. In this package 110, four LED elements 121 are mounted on one cup-shaped member 115, the electrodes of each LED element 121 and lead portions 114 are electrically connected by wires 22, and the element holding space 113 is made of a light-transmitting resin. The LED device 120 is formed by sealing with 123.
　尚、カップ状部材１１５の内側面は、前述のごとく、光の反射率が高くなる様な処理が必要である、更に鏡面加工するのが望ましい。これにより、アルミ製や表面が銀製のカップ状部材では、ＬＥＤ素子から放射される光のほぼ全波長域に対して高い反射率を有することができる。また、銅製等の金属製のカップ状部材においては、例えば銀製の反射層を形成して表面を鏡面加工することにより、同様に、ＬＥＤ素子から放射される光のほぼ全波長域に対して高い反射率を有することができる。 In addition, as described above, the inner surface of the cup-shaped member 115 needs to be processed so as to increase the reflectance of light, and is preferably further mirror-finished. Thereby, the cup-shaped member made of aluminum or the surface of silver can have a high reflectance with respect to almost the entire wavelength range of the light emitted from the LED element. Moreover, in a cup-shaped member made of metal such as copper, for example, by forming a reflective layer made of silver and mirroring the surface, similarly, it is high for almost all wavelength ranges of light emitted from the LED element. It can have reflectivity.
　図１６は本発明のＬＥＤ装置用パッケージの別の実施例の構成を示す平面図である。図１７は図１６の底面図、図１８は図１６の正面図であり、図１９は図１６の右側面図である。図２０は図１６のＬＥＤ装置用パッケージを用いたＬＥＤ装置の斜視図である。 FIG. 16 is a plan view showing the configuration of another embodiment of the LED device package of the present invention. 17 is a bottom view of FIG. 16, FIG. 18 is a front view of FIG. 16, and FIG. 19 is a right side view of FIG. 20 is a perspective view of an LED device using the LED device package of FIG.
　本実施例のパッケージ１６０は、ＬＥＤ素子を保持するＬＥＤ保持面１６１と、ＬＥＤ保持面１６１の周囲を囲む枠部材１６２とで構成される素子保持空間１６３を光透過性樹脂１７３で封止するＬＥＤ装置に用いるものである。具体的には、ＬＥＤ保持面１６１には、ＬＥＤ素子をワイヤで電気的に接続される２つのリード部１６４と、ＬＥＤ素子を表面で熱伝導的に接触する平面形状が略円形の１つのカップ状部材１６５とが絶縁樹脂による絶縁区画部１６７を介して表出されている。 The package 160 of this embodiment includes an LED that seals an element holding space 163 that includes an LED holding surface 161 that holds an LED element and a frame member 162 that surrounds the LED holding surface 161 with a light transmissive resin 173. It is used for the device. Specifically, the LED holding surface 161 has two lead portions 164 that are electrically connected to the LED element by a wire, and one cup having a substantially circular planar shape in which the LED element is in thermal contact with the surface. The member 165 is exposed through an insulating partition 167 made of an insulating resin.
　略円形のカップ状部材１６５は、図２０に示す通り、ＬＥＤ素子１７１を保持するＬＥＤ保持面１６１と、ＬＥＤ保持面１６１の周囲を囲む枠部材１６２とで構成される素子保持空間１６３を光透過性樹脂１７３で封止するＬＥＤ装置１７０に用いるものである。尚、図２０において絶縁樹脂による絶縁区画部１６７を示すパターン線は省略している。図２０に示す通り、カップ状部材１６５は、ＬＥＤ素子１７１に熱伝導的に接触する底板部１６５ａと、この底板部１６５ａの縁に形成された反射面部１６５ｂとを備える。反射面部１６５ｂは底板部１６５ａの全周縁に環状に形成され、反射面部１６５ｂは、この反射面部１６５ｂの内側の底板部１６５ａに熱伝導的に接触されたＬＥＤ素子１７１の放射光が、この反射面部１６５ｂを介した外側のＬＥＤ保持面１６１と枠部材１６２とに直接照射されることを阻止する高さに形成されている。 As shown in FIG. 20, the substantially circular cup-shaped member 165 transmits light through an element holding space 163 including an LED holding surface 161 that holds the LED element 171 and a frame member 162 that surrounds the LED holding surface 161. It is used for the LED device 170 sealed with the conductive resin 173. In FIG. 20, a pattern line indicating the insulating partition 167 made of insulating resin is omitted. As shown in FIG. 20, the cup-shaped member 165 includes a bottom plate portion 165a that comes into thermal contact with the LED element 171 and a reflection surface portion 165b formed on an edge of the bottom plate portion 165a. The reflection surface portion 165b is formed in an annular shape around the entire periphery of the bottom plate portion 165a, and the reflection surface portion 165b is formed by the reflection surface portion 165b. It is formed at a height that prevents direct irradiation of the outer LED holding surface 161 and the frame member 162 via the 165b.
　また、図１７、図１８、図１９及び図２０に示す通り、ＬＥＤ保持面１６１の裏面は、カップ状部材１６５の裏面のみが表出され、絶縁樹脂による絶縁区画部１６７の裏面と面一に表出されている。このパッケージ１６０は１つのカップ状部材１６５に１つのＬＥＤ素子１７１を搭載し、ＬＥＤ素子１７１の電極とリード部１６４とをワイヤ１７２で電気的に接続し、素子保持空間１６３を光透過性樹脂１７３で封止して、ＬＥＤ装置１７０となる。 In addition, as shown in FIGS. 17, 18, 19, and 20, only the back surface of the cup-shaped member 165 is exposed on the back surface of the LED holding surface 161, and is flush with the back surface of the insulating partition portion 167 made of insulating resin. It is expressed. In this package 160, one LED element 171 is mounted on one cup-shaped member 165, the electrode of the LED element 171 and the lead part 164 are electrically connected by a wire 172, and the element holding space 163 is connected to the light transmitting resin 173. To be an LED device 170.
　尚、カップ状部材１６５の内側面は、前述のごとく、光の反射率が高くなる様な処理が必要である、更に鏡面加工するのが望ましい。これにより、アルミ製や表面が銀製のカップ状部材では、ＬＥＤ素子から放射される光のほぼ全波長域に対して高い反射率を有することができる。また、銅製等の金属製のカップ状部材においては、例えば銀製の反射層を形成して表面を鏡面加工することにより、同様に、ＬＥＤ素子から放射される光のほぼ全波長域に対して高い反射率を有することができる。 In addition, as described above, the inner surface of the cup-shaped member 165 needs to be processed so as to increase the reflectance of light, and is preferably further mirror-finished. Thereby, the cup-shaped member made of aluminum or the surface of silver can have a high reflectance with respect to almost the entire wavelength range of the light emitted from the LED element. Moreover, in a cup-shaped member made of metal such as copper, for example, by forming a reflective layer made of silver and mirroring the surface, similarly, it is high for almost all wavelength ranges of light emitted from the LED element. It can have reflectivity.
　図２１は本発明のＬＥＤパッケージ用リードフレームの一実施例の打ち抜き成形工程後の説明図であり、図２１ａは平面図、図２１ｂは正面図、図２１ｃは側面図である。図２１に示す通り、フープ状の金属薄板であるリードフレーム２１１の一区画の略中央部にカップ状部材２１２が絞り加工されており、そのカップ状部材２１２の上下部の各々にカップ周辺スリット２１３が抜き加工されている。 FIG. 21 is an explanatory view after the punching process of an embodiment of the lead frame for LED package of the present invention, FIG. 21a is a plan view, FIG. 21b is a front view, and FIG. 21c is a side view. As shown in FIG. 21, a cup-shaped member 212 is drawn at a substantially central portion of a section of the lead frame 211 that is a hoop-shaped thin metal plate, and a cup peripheral slit 213 is formed at each of the upper and lower portions of the cup-shaped member 212. Has been punched.
　本実施例のリードフレーム２１１は、例えば０．１５ｍｍ程度の銅合金や鉄－ニッケル合金からなるリードフレームが採用されている。絞り加工と抜き加工とは何れを先に行ってもよいが、絞り加工の後に抜き加工を行うことにより、カップ状部材２１２の外形の変化が少なくなる。カップ状部材２１２の両側部はリードフレーム２１１に連結される連結部２１４となる。 As the lead frame 211 of this embodiment, a lead frame made of, for example, a copper alloy or iron-nickel alloy of about 0.15 mm is employed. Either the drawing process or the punching process may be performed first. However, by performing the punching process after the drawing process, a change in the outer shape of the cup-shaped member 212 is reduced. Both side portions of the cup-shaped member 212 serve as connection portions 214 connected to the lead frame 211.
　カップ状部材２１２のカップ底面とカップ斜面は反射部になるため、プレス金型のダイ及びパンチにより面粗度として１μｍ以下の鏡面に仕上げた。また、リードフレーム２１１の上下縁部に穿設された孔はパイロット孔２１５である。尚、図２１はフープ状の金属薄板の一区画のみを記載しており、図２１ａの左右に連続している。また、図２１ではリードフレーム２１１に対して横一列に配しているが、幅広のリードフレームを用いたり、より小型のパッケージを作成するのであれば、二列以上配してもよい。 Since the cup bottom surface and the cup slope of the cup-shaped member 212 are reflecting portions, the surface roughness was finished to a mirror surface of 1 μm or less with a die and punch of a press mold. The holes drilled in the upper and lower edges of the lead frame 211 are pilot holes 215. FIG. 21 shows only one section of a hoop-like thin metal plate, which is continuous to the left and right of FIG. 21a. In FIG. 21, the lead frame 211 is arranged in a horizontal row, but if a wide lead frame is used or a smaller package is created, two or more rows may be arranged.
　図２２は図２１のリードフレームに抜き成型してカップ状部材の外方にサブリードフレーム部及び連結桟となる部分を形成した後の説明図であり、図２２ａは平面図、図２２ｂは正面図、図２２ｃは側面図である。図２２に示す通り、カップ状部材２１２の外方にカップ状部材２１２を挟んだ対向位置にコ字状のサブリードフレーム部２１６が形成されている。 FIG. 22 is an explanatory view after the lead frame shown in FIG. 21 is punched and formed to form the sub lead frame portion and the connecting bar outside the cup-shaped member. FIG. 22a is a plan view and FIG. 22b is a front view. Figures 22c are side views. As shown in FIG. 22, a U-shaped sub lead frame portion 216 is formed at an opposing position with the cup-shaped member 212 sandwiched outside the cup-shaped member 212.
　各々のサブリードフレーム部２１６の内側は、図２１で形成した一組のカップ周辺スリット２１３を更に抜き加工された２つのリード部２１７がカップ状部材２１２の方向に延設されている。また、サブリードフレーム部２１６の外方には、コ字状のサブリードフレーム部外方スリット２１９を抜き加工することにより、カップ連結部２１４に連結して連結桟２１８が形成されたコ字状のサブリードフレーム部２１６が形成される。 Inside each sub lead frame portion 216, two lead portions 217 are further extended in the direction of the cup-shaped member 212 by further removing the pair of cup peripheral slits 213 formed in FIG. 21. In addition, a U-shaped sub lead frame portion outer slit 219 is formed on the outer side of the sub lead frame portion 216 so as to be connected to the cup connecting portion 214 to form a connecting bar 218. The sub lead frame portion 216 is formed.
　尚、サブリードフレーム部２１６から延設されたリード部２１７は先端部手前でＬ字状に曲げ起こされた曲げ起こし部２２０が形成されて、リード部２１７の面の高さ位置がリードフレーム２１１の面よりも高くなっている。サブリードフレーム部２１６のカップ状部材２１２を挟んだ対向位置にはサブリードフレーム部２１６のパイロット孔２１５が穿設されている。 The lead portion 217 extending from the sub lead frame portion 216 is formed with a bent raised portion 220 that is bent in an L shape before the tip portion, and the height of the surface of the lead portion 217 is the lead frame 211. It is higher than the surface. A pilot hole 215 of the sub lead frame portion 216 is formed at a position facing the cup-shaped member 212 of the sub lead frame portion 216.
　図２３は図２２のリードフレームのサブリードフレーム部及び連結桟の予め定められた箇所を曲げ加工した後の説明図であり、図２３ａは平面図、図２３ｂは正面図、図２３ｃは側面図、図２３ｄはＡ－Ａ断面図、図２３ｅはＢ－Ｂ断面図、図２３ｆは底面図である。図２３に示す通り、図２２のサブリードフレーム部２１６とカップ連結部２１４とを連結する一組の連結桟２１８の各々を凸状に曲げた曲げ加工部２２２が形成されている。 FIG. 23 is an explanatory view after bending a predetermined portion of the sub lead frame portion and the connecting bar of the lead frame of FIG. 22, FIG. 23a is a plan view, FIG. 23b is a front view, and FIG. 23c is a side view. 23d is a sectional view taken on line AA, FIG. 23e is a sectional view taken on line BB, and FIG. 23f is a bottom view. As shown in FIG. 23, a bent portion 222 is formed by bending each of the pair of connecting bars 218 connecting the sub lead frame portion 216 and the cup connecting portion 214 of FIG.
　即ち、図２２に示した４本の連結桟２１８の各々に凸状の曲げ加工部２２２を形成することにより、リード部２１７と連絡されているサブリードフレーム部２１６をカップ状部材２１２方向に引き寄せたものである。 That is, by forming a convex bent portion 222 on each of the four connecting bars 218 shown in FIG. 22, the sub lead frame portion 216 connected to the lead portion 217 is drawn toward the cup-shaped member 212. It is a thing.
　曲げ加工部２２２は、２つの立ち上がり部が同じ長さではなく、カップ状部材２１２から遠い方の立ち上がり部の長さを大きくすることにより、サブリードフレーム部２１６の裏面の高さ位置をカップ状部材２１２の裏面と同一平面になる深さとしている。更に、これにより、サブリードフレーム部２１６に連結されているリード部２１７の高さ位置がカップ状部材２１２の縁高さと同じ高さ位置となるように、図２２における曲げ起こし部２２０の立ち上がり部の高さを予め調整しておく。 The bent portion 222 has the two rising portions not the same length, but the height of the rising portion far from the cup-shaped member 212 is increased, so that the height position of the back surface of the sub lead frame portion 216 is cup-shaped. The depth is the same plane as the back surface of the member 212. Further, this causes the rising portion of the bending raising portion 220 in FIG. 22 so that the height position of the lead portion 217 connected to the sub lead frame portion 216 is the same height position as the edge height of the cup-shaped member 212. Is adjusted in advance.
　サブリードフレーム部２１６をカップ状部材２１２方向に引き寄せるための曲げ加工部２２２の曲げ深さ（曲げの大きさ）は、リード部２１７の先端位置と、カップ状部材２１２の端縁位置とのギャップＬが予め定められた間隙距離となるように設計すればよい。この曲げ加工部２２２により、ギャップＬを縮めることが可能なるため、例えば、通常の抜き加工では不可能とされた金属薄板の厚さよりも短い間隙距離に縮めることも可能となる。 The bending depth (bending magnitude) of the bending portion 222 for pulling the sub lead frame portion 216 toward the cup-shaped member 212 is the gap between the tip position of the lead portion 217 and the edge position of the cup-shaped member 212. What is necessary is just to design so that L may become a predetermined gap distance. Since the gap L can be reduced by the bending portion 222, for example, it is possible to reduce the gap distance to be shorter than the thickness of the metal thin plate, which is impossible by normal punching.
　尚、曲げ加工部２２２は凸状に曲げ加工した実施例を示したが、Ｒ状に曲げ加工しても同様の効果を奏する。 In addition, although the bending-processed part 222 showed the Example bent to convex shape, even if it bends to R shape, there exists the same effect.
　図２４は図２３のリードフレームをインサート成形金型に装着した状態を示す説明図であり、図２４ａは平面図、図２４ｂはＡ－Ａ断面図、図２４ｃはＢ－Ｂ断面図、図２４ｄはＣ－Ｃ断面図である。図２４に示す通り、図２３のリードフレーム２１１の内側に形成されたサブリードフレーム部２１６を上下金型２２３，２２４で挟持し、カップ状部材２１２と４つのリード部２１７を含む一組のサブリードフレーム部２１６とを上下金型２２３，２２４の内部に装着する。 24 is an explanatory view showing a state in which the lead frame of FIG. 23 is mounted on an insert molding die, FIG. 24a is a plan view, FIG. 24b is an AA sectional view, FIG. 24c is a BB sectional view, and FIG. Is a cross-sectional view taken along the line CC. As shown in FIG. 24, a sub lead frame portion 216 formed inside the lead frame 211 of FIG. 23 is sandwiched between upper and lower molds 223 and 224, and a set of sub portions including a cup-shaped member 212 and four lead portions 217. The lead frame portion 216 is mounted inside the upper and lower molds 223 and 224.
　尚、図示していないが、下金型２２４にピンを設け、そこにサブリードフレーム部２１６のパイロット孔２２１を嵌合して、下金型２２４とリードフレーム２１１の水平方向の位置決めを行う。垂直方向の位置決めはリード部２１７を上下金型２２３，２２４で固定すると同時にカップ状部材２１２の底部の裏面を上金型２２３で押さえ、カップ状部材２１２の縁部を下金型２２４で支えることで位置決めされる。尚、図においては、カップ状部材２１２の底部の裏面を上面としている。 Although not shown, a pin is provided in the lower mold 224, and the pilot hole 221 of the sub lead frame portion 216 is fitted therein, thereby positioning the lower mold 224 and the lead frame 211 in the horizontal direction. In the vertical positioning, the lead part 217 is fixed by the upper and lower molds 223 and 224 and at the same time the bottom surface of the cup-shaped member 212 is pressed by the upper mold 223 and the edge of the cup-shaped member 212 is supported by the lower mold 224. Positioned with. In the figure, the bottom surface of the cup-shaped member 212 is the upper surface.
　図２４に示す状態で上金型２２３の樹脂注入ゲート２２５から樹脂を注入すると、上下金型内部のキャビティー（空隙）２２６に樹脂が充填されパッケージ製作工程が完了する。尚、上金型２２３のカップ状部材２１２の底部裏面側を取り巻いて突設された突起部材２２７はこの部分に樹脂が回らないためのもので、カップ状部材２１２の裏面に樹脂が這い上がることを防止して裏面の露出を確実にすると共に、ＬＥＤ装置を最終ユーザが基盤等に半田付けする際に、半田フラックスを誘導してＬＥＤ装置が浮き上がることも防止するためのものである。 When the resin is injected from the resin injection gate 225 of the upper mold 223 in the state shown in FIG. 24, the resin is filled into the cavities (voids) 226 inside the upper and lower molds, and the package manufacturing process is completed. The protruding member 227 that protrudes around the bottom back surface of the cup-shaped member 212 of the upper mold 223 is for preventing the resin from rotating around this portion, and the resin crawls up on the back surface of the cup-shaped member 212. This prevents the LED device from being lifted by inducing solder flux when the final user solders the LED device to the substrate or the like.
　図２５は図２４の金型を用いてインサート成形を行った後のＬＥＤ用パッケージの説明図であり、図２５ａは平面図、図２５ｂは正面図、図２５ｃは側面図、図２５ｄはＡ－Ａ断面図、図２５ｅはＢ－Ｂ断面図、図２５ｆは底面図である。図２５に示す通り、リードフレーム２１１からパッケージ２３０を切り落とした図である。 FIG. 25 is an explanatory view of the LED package after insert molding using the mold of FIG. 24, FIG. 25a is a plan view, FIG. 25b is a front view, FIG. 25c is a side view, and FIG. A sectional view, FIG. 25e is a BB sectional view, and FIG. 25f is a bottom view. As shown in FIG. 25, the package 230 is cut off from the lead frame 211.
　本実施例のパッケージ２３０は、カップ状部材２１２の内側面としてのＬＥＤ保持面２２８と、このＬＥＤ保持面２２８の周囲を囲む樹脂枠部材２２９と、樹脂枠部材２２９の内側面に表出したリード部２１７とからなる。このパッケージ２３０は、ＬＥＤ保持面２２８にＬＥＤ素子を搭載し、搭載されたＬＥＤ素子とリード部とをワイヤボンディングによって電気的に接続した後、ＬＥＤ保持面と樹脂枠部材とで構成される素子保持空間を光透過性樹脂で封止することにより、ＬＥＤ装置を得る。 The package 230 of this embodiment includes an LED holding surface 228 as an inner surface of the cup-shaped member 212, a resin frame member 229 surrounding the LED holding surface 228, and leads exposed on the inner surface of the resin frame member 229. Part 217. In this package 230, an LED element is mounted on the LED holding surface 228, and after the mounted LED element and the lead portion are electrically connected by wire bonding, an element holding composed of the LED holding surface and the resin frame member is held. An LED device is obtained by sealing the space with a light-transmitting resin.
　尚、図２５において、カップ状部材２１２の縁部とリード部２１７の高さ位置は同一になっているが、実質上は同一高さである必要はない。カップ状部材２１２の底部にＬＥＤ素子を搭載し、素子上面の電極とリード部２１７とをボンディングワイヤーで接続する際に、最適な高さにリード部２１７の高さを設定すればよいが、実用上、概ね同一高さになる。 In addition, in FIG. 25, although the height position of the edge part of the cup-shaped member 212 and the lead part 217 is the same, it does not need to be the same height substantially. When the LED element is mounted on the bottom of the cup-shaped member 212 and the electrode on the upper surface of the element is connected to the lead part 217 with a bonding wire, the height of the lead part 217 may be set to an optimum height. Above, it is almost the same height.
　また、カップ状部材２１２の底面に対する周囲のカップ斜面の傾きは水平方向の放射光に対しては４５°が理想的であるが、ＬＥＤ素子からの放射角度は特定できないため、パッケージ２３０の縦幅Ｗを小さくしたいという要求との兼ね合いから４５°～８０°の範囲で選択される。 Further, the inclination of the surrounding cup slope with respect to the bottom surface of the cup-shaped member 212 is ideally 45 ° with respect to the radiation light in the horizontal direction, but the radiation angle from the LED element cannot be specified. It is selected in the range of 45 ° to 80 ° in consideration of the demand to reduce W.
　樹脂枠部材２２９のカップ状部材２１２の周囲に設けられた樹脂斜面２３１は、カップ状部材２１２の底面及びカップ斜面で反射された光の一部が漏れた場合に、漏れた光を再反射するために副反射板となるため、白色のような反射しやすい色の樹脂（例えば、ナイロン系樹脂や液晶ポリマー系樹脂等）が用いられる。 The resin slope 231 provided around the cup-shaped member 212 of the resin frame member 229 re-reflects the leaked light when part of the light reflected by the bottom surface of the cup-shaped member 212 and the cup slope leaks. Therefore, since it becomes a sub-reflection plate, a resin of a color that is easily reflected such as white (for example, a nylon resin, a liquid crystal polymer resin, or the like) is used.
　ギャップ間隙Ｌは、パッケージ２３０の縦幅を小さくしたいという要求やボンディングワイヤを短くしたいという要求からは小さいことが望ましいが、ギャップ間に確実に樹脂を充填したいということからは大きい方が望ましい。尚、本成形技術ではギャップ間隙Ｌが０．１ｍｍまで狭めることが可能となっている。 The gap gap L is desirably small from the request of reducing the vertical width of the package 230 and the request of shortening the bonding wire, but is preferably large from the viewpoint of reliably filling the gap between the gaps. In this molding technique, the gap gap L can be reduced to 0.1 mm.
　図２４及び図２５に示したように、個々のリードフレーム２１１は切り離して加工したが、切り離さずに図２４又は図２５に示した加工工程が終了した時点で切り離してもよい。 As shown in FIGS. 24 and 25, the individual lead frames 211 are separated and processed, but may be separated when the processing steps shown in FIG. 24 or FIG. 25 are completed without being separated.
　図２６は本発明のＬＥＤパッケージ用リードフレームの別の実施例の絞り成型及び抜き成形してカップ状部材、サブリードフレーム部及び桟部を形成した後の説明図であり、図２６ａは平面図、図２６ｂは正面図、図２６ｃは側面図である。図２６に示す通り、本実施例は前述の実施例に比べ、リードの数が少ないより小型のパッケージへの応用例である。 FIG. 26 is an explanatory view after the cup-shaped member, the sub lead frame portion, and the crosspiece portion are formed by drawing and punching another embodiment of the lead frame for LED package of the present invention, and FIG. 26a is a plan view. 26b is a front view, and FIG. 26c is a side view. As shown in FIG. 26, the present embodiment is an application example to a smaller package having a smaller number of leads than the above-described embodiment.
　図の通り、フープ状の金属薄板であるリードフレーム２６１の一区画の略中央部にカップ状部材２６２が絞り加工されており、そのカップ状部材２６２の周囲にカップ周辺スリット２６３が抜き加工されている。 As shown in the figure, a cup-shaped member 262 is drawn at a substantially central portion of a section of the lead frame 261 that is a hoop-like thin metal plate, and a cup peripheral slit 263 is punched around the cup-shaped member 262. Yes.
　カップ周辺スリット２６３は、２つのリード部２６７を形成する１つのサブリードフレーム部２６６と、このサブリードフレーム部２６６をカップ状部材２６２の上縁部に連結する連結桟２６８と、カップ状部材２６２の下縁部からリードフレーム２６１に連結する連結部２６４と、リードフレーム部２６１の内側に形成された２つのリード部２６７とを構成している。 The cup peripheral slit 263 includes one sub lead frame portion 266 that forms two lead portions 267, a connecting bar 268 that connects the sub lead frame portion 266 to the upper edge portion of the cup member 262, and the cup member 262. A connecting portion 264 that is connected to the lead frame 261 from the lower edge portion thereof, and two lead portions 267 that are formed inside the lead frame portion 261 are configured.
　本実施例のリードフレーム２６１も、０．１５ｍｍ程度の銅合金や鉄－ニッケル合金からなるリードフレームが採用されている。絞り加工と抜き加工とは何れを先に行ってもよいが、絞り加工の後に抜き加工を行うことにより、カップ状部材２６２の外形の変化が少なくなる。 The lead frame 261 of the present embodiment also employs a lead frame made of a copper alloy or iron-nickel alloy of about 0.15 mm. Either the drawing process or the punching process may be performed first. However, by performing the punching process after the drawing process, a change in the outer shape of the cup-shaped member 262 is reduced.
　尚、前述の実施例と同様に、カップ状部材２６２のカップ底面とカップ斜面は反射部になるため、プレス金型のダイ及びパンチにより面粗度として１μｍ以下の鏡面に仕上げた。また、リードフレーム２６１の上下縁部及びサブリードフレーム部２６６に穿設された孔はパイロット孔２６５である。また、図２６はフープ状の金属薄板の一区画のみを記載しており、図２６ａの左右に連続している。更に、図２６ではリードフレーム２６１に対して横一列に配しているが、幅広のリードフレームを用いたり、より小型のパッケージを作成するのであれば、二列以上配してもよい。 In addition, since the cup bottom surface and the cup slant surface of the cup-shaped member 262 are reflective portions as in the above-described embodiment, the surface roughness was finished to a mirror surface with a surface roughness of 1 μm or less by a die and punch of a press mold. The holes formed in the upper and lower edge portions of the lead frame 261 and the sub lead frame portion 266 are pilot holes 265. FIG. 26 shows only one section of a hoop-like thin metal plate, which is continuous to the left and right of FIG. 26a. Furthermore, in FIG. 26, the lead frame 261 is arranged in a horizontal row, but two or more rows may be arranged if a wide lead frame is used or a smaller package is created.
　図２７は図２６のリードフレームのサブリードフレーム部のリード部を曲げ加工した後の説明図であり、図２７ａは平面図、図２７ｂは正面図、図２７ｃは側面図、図２７ｄはＡ－Ａ断面図、図２７ｅはＢ－Ｂ断面図、図２７ｆは底面図である。図２７に示す通り、カップ状部材２６２の周囲に配されていたリード部２６７の先端部手前をＬ字状に曲げ起こされた曲げ起こし部２７０が形成されて、リード部２６７の面の高さ位置がリードフレーム２６１の面よりも高くなっている。 27 is an explanatory view after bending the lead part of the sub lead frame part of the lead frame of FIG. 26, FIG. 27a is a plan view, FIG. 27b is a front view, FIG. 27c is a side view, and FIG. A sectional view, FIG. 27e is a BB sectional view, and FIG. 27f is a bottom view. As shown in FIG. 27, a bent raised portion 270 is formed in which the front end portion of the lead portion 267 arranged around the cup-shaped member 262 is bent in an L shape, and the height of the surface of the lead portion 267 is formed. The position is higher than the surface of the lead frame 261.
　即ち、図２７において、リードフレーム２６１に対してカップ状部材２６２の縁部が同一面になり、カップ状部材２６２全体が沈んだ状態、または、リード部２６７が浮き上がった状態になっている。 That is, in FIG. 27, the edge of the cup-shaped member 262 is flush with the lead frame 261, and the entire cup-shaped member 262 is sinked or the lead portion 267 is lifted.
　図２８は図２７のリードフレームの連結桟の所定箇所を折れ加工及び曲げ加工した後の説明図であり、図２８ａは平面図、図２８ｂは正面図、図２８ｃは側面図、図２８ｄはＡ－Ａ断面図、図２８ｅはＢ－Ｂ断面図、図２８ｆは底面図である。図に示す通り、連結部２６４と連結桟２６８とのカップ状部材２６２に近い位置で段付け曲げ加工部２７１が形成され、遠い位置で凸状に曲げた曲げ加工部２７２が形成されている。 FIG. 28 is an explanatory view after folding and bending predetermined portions of the connecting frame of the lead frame of FIG. 27, FIG. 28a is a plan view, FIG. 28b is a front view, FIG. 28c is a side view, and FIG. -A sectional view, FIG. 28e is a BB sectional view, and FIG. 28f is a bottom view. As shown in the drawing, a stepped bending portion 271 is formed at a position near the cup-shaped member 262 of the connecting portion 264 and the connecting bar 268, and a bent portion 272 bent in a convex shape is formed at a far position.
　即ち、連結部２６４と連結桟２６８とに段付け曲げを加えて段付け曲げ加工部２７１を形成することによって、リードフレーム２６１が垂直下方向に下り、同時にリード部２６７も同じ寸法だけ下がる。段付け曲げ寸法は、リードフレーム２１１の裏面と、カップ状部材２６２の裏面とが同一平面になるような寸法とする。 That is, by forming stepped bending portions 271 by applying step bending to the connecting portion 264 and the connecting bar 268, the lead frame 261 descends vertically downward, and at the same time, the lead portion 267 is also lowered by the same dimension. The stepped bending dimension is such that the back surface of the lead frame 211 and the back surface of the cup-shaped member 262 are in the same plane.
　更に、連結部２６４と連結桟２６８とにＲ状又は凸状の曲げ加工を加えて、曲げ加工部２７２を形成することにより、サブリードフレーム部２６１のリード部２６７及びリードフレーム２６１の内側に形成されたリード部２６７と、カップ状部材２６２との間隙距離が狭まることになる。尚、段付け曲げ加工部２７１とＲ状又は凸状の曲げ加工部２７２との形成の順番はどちらが先でもよい。 Further, the bent portion 272 is formed by applying an R-shaped or convex bent process to the connecting portion 264 and the connecting bar 268, thereby forming the lead portion 267 of the sub lead frame portion 261 and the inside of the lead frame 261. The gap distance between the formed lead portion 267 and the cup-shaped member 262 is reduced. It should be noted that the order of formation of the stepped bending portion 271 and the R-shaped or convex bending portion 272 may be either.
　リード部２６７と、カップ状部材２６２との間を狭めるための連結部２６４と連結桟２６８とに形成される曲げ加工部２７２の曲げ深さ（曲げの大きさ）は、リード部２６７の先端位置と、カップ状部材２６２の端縁位置とのギャップ間隙Ｌが予め定められた間隙距離となるように設計すればよい。この曲げ加工部２７２により、ギャップ間隙Ｌを縮めることが可能なるため、例えば、通常の抜き加工では不可能とされた金属薄板の厚さよりも短い間隙距離に縮めることも可能となる。 The bending depth (bending magnitude) of the bending portion 272 formed in the connecting portion 264 and the connecting bar 268 for narrowing the space between the lead portion 267 and the cup-shaped member 262 is the tip position of the lead portion 267. And the gap gap L with respect to the edge position of the cup-shaped member 262 may be designed to be a predetermined gap distance. Since the gap gap L can be reduced by the bent portion 272, for example, it is possible to reduce the gap distance to be shorter than the thickness of the thin metal plate, which is impossible by normal punching.
　図２９は図２８のリードフレームをインサート成形金型に装着した状態を示す説明図であり、図２９ａは底面図、図２９ｂはＡ－Ａ断面図、図２９ｃはＢ－Ｂ断面図である。図２９に示す通り、図２８のリードフレーム２６１を切り離し、上下金型２７３，２７４にカップ状部材２６２と４つのリード部２６７とを内部に装着する。 29 is an explanatory view showing a state where the lead frame of FIG. 28 is mounted on an insert molding die, FIG. 29a is a bottom view, FIG. 29b is an AA sectional view, and FIG. 29c is a BB sectional view. As shown in FIG. 29, the lead frame 261 of FIG. 28 is cut off, and a cup-shaped member 262 and four lead portions 267 are mounted inside the upper and lower molds 273 and 274.
　図２９に示す状態で上金型２７３の樹脂注入ゲート２７５から樹脂を注入すると、上下金型内部のキャビティー（空隙）２７６に樹脂が充填されパッケージ製作工程が完了する。尚、上金型２７３のカップ状部材２６２の底部裏面側を取り巻いて突設された突起部材２７７はこの部分に樹脂が回らないためのもので、カップ状部材２６２の裏面に樹脂が這い上がることを防止して裏面の露出を確実にすると共に、ＬＥＤ装置を最終ユーザが基盤等に半田付けする際に、半田フラックスを誘導してＬＥＤ装置が浮き上がることも防止するためのものである。 When the resin is injected from the resin injection gate 275 of the upper mold 273 in the state shown in FIG. 29, the resin is filled into the cavities (voids) 276 inside the upper and lower molds, and the package manufacturing process is completed. The protruding member 277 that protrudes from the bottom back surface of the cup-shaped member 262 of the upper mold 273 is for preventing the resin from rotating around this portion, and the resin crawls up to the back surface of the cup-shaped member 262. This prevents the LED device from being lifted by inducing solder flux when the final user solders the LED device to the substrate or the like.
　尚、リードフレーム２６１のパイロット孔２６５はリードフレーム２６１を順送りプレスで送るときの基準孔であるが、リードフレーム２６１を上下金型２７３，２７４に装着して水平方向の位置決めの基準孔としても使う。 The pilot hole 265 of the lead frame 261 is a reference hole when the lead frame 261 is fed by a progressive press. The lead frame 261 is used as a reference hole for horizontal positioning by attaching the lead frame 261 to the upper and lower molds 273 and 274. .
　図３０は図２９の金型を用いてインサート成形を行った後のＬＥＤ用パッケージの説明図であり、図３０ａは平面図、図３０ｂは正面図、図３０ｃは側面図、図３０ｄはＡ－Ａ断面図、図３０ｅはＢ－Ｂ断面図、図３０ｆは底面図である。図３０に示す通り、リードフレーム２６１からパッケージ２８０を切り落とした図である。 FIG. 30 is an explanatory view of the LED package after insert molding using the mold of FIG. 29, FIG. 30a is a plan view, FIG. 30b is a front view, FIG. 30c is a side view, and FIG. A sectional view, FIG. 30e is a BB sectional view, and FIG. 30f is a bottom view. As shown in FIG. 30, the package 280 is cut off from the lead frame 261.
　また、カップ状部材２６２の底面に対する周囲のカップ斜面の傾きについては、前述の実施例と同様に、パッケージ２８０の縦幅Ｗを小さくしたいという要求との兼ね合いから４５°～８０°の範囲で選択され、ギャップ間隙Ｌについても、パッケージ２８０の縦幅を小さくしたいという要求やボンディングワイヤを短くしたいという要求からは小さいことが望ましいが、ギャップ間に確実に樹脂を充填したいということからは大きい方が望ましい。尚、本成形技術ではギャップ間隙Ｌが０．１ｍｍまで狭めることが可能となっている。 In addition, the inclination of the surrounding cup slope with respect to the bottom surface of the cup-shaped member 262 is selected in the range of 45 ° to 80 ° in consideration of the desire to reduce the vertical width W of the package 280, as in the previous embodiment. The gap gap L is preferably small from the demand for reducing the vertical width of the package 280 and the demand for shortening the bonding wire. However, the gap gap L is larger from the viewpoint of reliably filling the resin between the gaps. desirable. In this molding technique, the gap gap L can be reduced to 0.1 mm.
　本実施例のパッケージ２８０は、カップ状部材２６２の内側面としてのＬＥＤ保持面２７８と、このＬＥＤ保持面２７８の周囲を囲む樹脂枠部材２７９と、樹脂枠部材２７９の内側面に表出したリード部２６７とからなる。このパッケージ２８０は、ＬＥＤ保持面２７８にＬＥＤ素子を搭載し、搭載されたＬＥＤ素子とリード部とをワイヤボンディングによって電気的に接続した後、ＬＥＤ保持面と樹脂枠部材とで構成される素子保持空間を光透過性樹脂で封止することにより、ＬＥＤ装置を得る。 The package 280 of this embodiment includes an LED holding surface 278 as an inner surface of the cup-shaped member 262, a resin frame member 279 surrounding the LED holding surface 278, and leads exposed on the inner surface of the resin frame member 279. Part 267. In this package 280, an LED element is mounted on the LED holding surface 278, and after the mounted LED element and the lead portion are electrically connected by wire bonding, an element holding composed of the LED holding surface and the resin frame member is held. An LED device is obtained by sealing the space with a light-transmitting resin.
　１０　、　５０　…パッケージ、
　１１　、　５１　…ＬＥＤ保持面、
　１２　、　５２　…枠部材、
　１３　、　５３　…素子保持空間、
　１４　、　５４　…リード部、
　１４ｂ、　５４ｂ…中継部、
　１５　、　５５　…放熱板部、
　１６　、　５６　…絶縁樹脂、
　１７　、　５７　…金属板、
　１８　、　５８　…位置決め孔、
　１９　、　５９　…穿設孔、
　　　　　　６０　…ＬＥＤ装置、
　　　　　　６１　…ＬＥＤ素子、
　　　　　　６２　…ワイヤ、
　　　　　　６３　…光透過性樹脂、
　　　　　　６５　…フープ材、
１１０　、１６０　…パッケージ、
１１１　、１６１　…ＬＥＤ保持面、
１１２　、１６２　…枠部材、
１１３　、１６３　…素子保持空間、
１１４　、１６４　…リード部、
１１５　、１６５　…カップ状部材、
１１５ａ、１６５ａ…底板部、
１１５ｂ、１６５ｂ…反射面部、
１１７　、１６７　…絶縁区画部、
１２０　　１７０　…ＬＥＤ装置、
１２１　　１７１　…ＬＥＤ素子、
１２２　　１７２　…ワイヤ、
１２３　、１７３　…光透過性樹脂、
２１１　、２６１　…リードフレーム部材、
２１２　、２６２　…カップ状部材、
２１３　、２６３　…カップ周辺スリット、
２１４　　　　　　…カップ連結部、
　　　２６４　…連結部、
２１５　、２６５　…パイロット孔、
２１６　、２６６　…サブリードフレーム部、
２１７　、２６７　…リード部、
２１８　、２６８　…連結桟、
２１９　　　　　　…サブリードフレーム部外方スリット、
２２０　、２７０　…曲げ起こし部、
２２１　 　…パイロット孔、
　　　　　２７１　…段付け曲げ加工部、
２２２　 　…連結桟の曲げ加工部、
　　　　　２７２　…曲げ加工部、
　Ｌ　　　　　　　…カップ縁部とリード部とのキャップ間隙、
２２３　、２７３　…上金型、
２２４　、２７４　…下金型、
２２５　、２７５　…樹脂注入ゲート、
２２６　、２７６　…キャビティー（上下金型の内部空隙）、
２２７　、２７７　…突起部材、
２２８　、２７８　…ＬＥＤ保持面、
２２９　、２７９　…樹脂枠部材、
２３０　、２８０　…パッケージ、
２３１　　　　　　…樹脂斜面、
　Ｗ　　　　　　　…縦幅、 10, 50 ... package,
11, 51 ... LED holding surface,
12, 52 ... frame member,
13, 53 ... element holding space,
14, 54 ... lead part,
14b, 54b ... relay part,
15, 55 ... radiator plate part,
16, 56 ... insulating resin,
17, 57 ... metal plate,
18, 58 ... positioning holes,
19, 59 ... drill holes,
60 ... LED device,
61 ... LED element,
62 ... wire,
63 ... light transmissive resin,
65 ... hoop material,
110, 160 ... package,
111, 161 ... LED holding surface,
112, 162 ... frame members,
113, 163 ... element holding space,
114, 164 ... lead part,
115, 165 ... cup-shaped member,
115a, 165a ... bottom plate,
115b, 165b ... reflective surface portion,
117, 167... Insulating partition,
120 170 ... LED device,
121 171 ... LED element,
122 172 ... wire,
123, 173 ... light transmissive resin,
211, 261 ... lead frame member,
212, 262 ... Cup-shaped member,
213, 263 ... slits around the cup,
214 ... Cup connecting part,
264 ... connecting part,
215, 265 ... pilot holes,
216, 266... Sub lead frame part,
217, 267 ... lead part,
218, 268 ... connecting bars,
219 ... Sub lead frame part outer slit,
220, 270 ... bending raising part,
221 ... pilot hole,
271 ... Stepped bending part,
222 ... bending portion of the connecting beam,
272 ... bending part,
L: Cap gap between the cup edge and the lead,
223, 273 ... upper mold,
224, 274 ... lower mold,
225, 275 ... resin injection gate,
226, 276 ... cavity (internal gap of upper and lower molds),
227, 277 ... projecting member,
228, 278 ... LED holding surface,
229, 279 ... Resin frame member,
230, 280 ... package,
231 ... resin slope,
W… Vertical width,

Claims (8)

  1. 　ＬＥＤ素子の保持領域を含むＬＥＤ保持面と、該ＬＥＤ保持面の周囲を囲む枠部材とを備え、前記ＬＥＤ保持面と前記枠部材とで構成される素子保持空間を光透過性樹脂で封止したＬＥＤ装置を構成するためのパッケージであって、
    　前記ＬＥＤ保持面には、ＬＥＤ素子とワイヤボンディングにより電気的に接続されるリード部と、ＬＥＤ素子に表面で熱伝導的に接触する放熱板部と、前記リード部と放熱板部とを絶縁樹脂で仕切る絶縁区画部とが表出され、
    　前記ＬＥＤ保持面の裏面側は、前記放熱板部の裏面が前記絶縁区画部の裏面と面一に表出されていることを特徴とするＬＥＤ装置用パッケージ。     An LED holding surface including an LED element holding region and a frame member surrounding the LED holding surface are provided, and an element holding space constituted by the LED holding surface and the frame member is sealed with a light-transmitting resin. A package for configuring the LED device,
    The LED holding surface has a lead portion electrically connected to the LED element by wire bonding, a heat radiating plate portion in thermal contact with the LED element on the surface, and the lead portion and the heat radiating plate portion made of an insulating resin. Insulating partition section partitioned by
    The LED device package according to claim 1, wherein the back surface side of the LED holding surface is such that the back surface of the heat radiating plate portion is flush with the back surface of the insulating partition portion.
  2. 　前記請求項１に記載のリード部のＬＥＤ保持面での表面高さ位置が放熱板部のＬＥＤ保持面での表面高さ位置よりも上位にあることを特徴とする請求項１に記載のＬＥＤ装置用パッケージ。 2. The LED according to claim 1, wherein the surface height position on the LED holding surface of the lead portion according to claim 1 is higher than the surface height position on the LED holding surface of the heat radiating plate portion. Equipment package.
  3. 　前記放熱板部がＬＥＤ素子を内側に保持するカップ状部材であり、
    　前記カップ状部材は、ＬＥＤ素子に熱伝導的に接触する底板部と、この底板部の周縁部に形成された反射面部とを備え、
    　前記反射面部は、この反射面部の内側の底板部に熱伝導的に接触されたＬＥＤ素子の放射光が、この反射面部を介した外側の前記ＬＥＤ保持面と枠部材とに照射されることを阻止する高さに形成されていることを特徴とする請求項１又は２に記載のＬＥＤ装置用パッケージ。     The heat radiating plate portion is a cup-shaped member that holds the LED element inside,
    The cup-shaped member includes a bottom plate portion that comes into thermal contact with the LED element, and a reflective surface portion formed on a peripheral portion of the bottom plate portion,
    The reflection surface portion is configured such that the emitted light of the LED element thermally contacted with the bottom plate portion inside the reflection surface portion is irradiated to the outside LED holding surface and the frame member via the reflection surface portion. The LED device package according to claim 1, wherein the LED device package is formed at a height to prevent.
  4. 　前記カップ状部材の内側面には、底板部に熱伝導的に接触されたＬＥＤ素子から放射される光のほぼ全波長域に対して高い反射率を備える反射層が形成されたことを特徴とする請求項１～３の何れか１項に記載のＬＥＤ装置用パッケージ。 The inner surface of the cup-shaped member is formed with a reflective layer having a high reflectivity with respect to almost the entire wavelength range of light emitted from the LED element thermally conductively in contact with the bottom plate portion. The LED device package according to any one of claims 1 to 3.
  5. 　ＬＥＤ素子の保持領域を含むＬＥＤ保持面と、このＬＥＤ保持面の周囲を囲む樹脂枠部材と、この樹脂枠部材のＬＥＤ保持面に表出されたＬＥＤ素子とワイヤボンディングにより電気的に接続されるリード部と、前記ＬＥＤ保持面と前記枠部材とで構成される素子保持空間を封止した光透過性樹脂とを備えたＬＥＤ装置を構成する前記ＬＥＤ保持面と樹脂枠部材とリード部とからなるＬＥＤ用パッケージのうち、前記ＬＥＤ保持面とリード部とを構成するためのリードフレームであって、
    　前記ＬＥＤ保持面としてＬＥＤ素子を内側に保持するカップ状部材と、前記リード部を１つ以上備えたサブリードフレーム部と、前記カップ状部材とサブリードフレーム部とを連結する連結桟とを備え、
    　前記連結桟に、前記カップ状部材とサブリードフレーム部との間隙を予め定められた間隙距離に縮める曲げ加工部を更に備えたことを特徴とするＬＥＤパッケージ用リードフレーム。     The LED holding surface including the LED element holding area, the resin frame member surrounding the LED holding surface, and the LED element exposed on the LED holding surface of the resin frame member are electrically connected by wire bonding. From the LED holding surface, the resin frame member, and the lead portion that constitute the LED device including a lead portion, and a light-transmitting resin that seals an element holding space constituted by the LED holding surface and the frame member. A lead frame for configuring the LED holding surface and the lead portion of the LED package,
    A cup-shaped member that holds an LED element inside as the LED holding surface, a sub-lead frame portion including one or more lead portions, and a connecting bar that connects the cup-shaped member and the sub-lead frame portion. ,
    The lead frame for an LED package, further comprising a bending portion that reduces a gap between the cup-shaped member and the sub lead frame portion to a predetermined gap distance in the connecting bar.
  6. 　一組の前記サブリードフレーム部が、前記カップ状部材を間にして対向して配置されていることを特徴とする請求項５に記載のＬＥＤパッケージ用リードフレーム。 6. The lead frame for an LED package according to claim 5, wherein the pair of sub lead frame portions are arranged to face each other with the cup-shaped member therebetween.
  7. 　ＬＥＤ素子の保持領域を含むＬＥＤ保持面と、このＬＥＤ保持面の周囲を囲む樹脂枠部材と、この樹脂枠部材のＬＥＤ保持面に表出されたＬＥＤ素子とワイヤボンディングにより電気的に接続されるリード部と、前記ＬＥＤ保持面と前記枠部材とで構成される素子保持空間を封止した光透過性樹脂とを備えたＬＥＤ装置を構成する前記ＬＥＤ保持面と樹脂枠部材とリード部とからなるＬＥＤ用パッケージのうち、前記ＬＥＤ保持面とリード部とを構成するためのリードフレームを製造する方法であって、
    　前記ＬＥＤ保持面としてＬＥＤ素子を内側に保持するカップ状部材と、前記ＬＥＤ素子とワイヤボンディングにより電気的に接続されるリード部を１つ以上備えたサブリードフレーム部と、前記カップ状部材とサブリードフレーム部とを連結する連結桟との構成要素からなるリードフレームを、絞り加工及び抜き加工で金属薄板に形成するリードフレーム形成工程と、
    　前記連結桟に曲げ加工を施して、前記カップ状部材とサブリードフレーム部との間隙距離を予め定められた距離に縮める曲げ加工工程とを備えたことを特徴とするＬＥＤパッケージ用リードフレームの製造法。     The LED holding surface including the LED element holding area, the resin frame member surrounding the LED holding surface, and the LED element exposed on the LED holding surface of the resin frame member are electrically connected by wire bonding. From the LED holding surface, the resin frame member, and the lead portion that constitute the LED device including a lead portion, and a light-transmitting resin that seals an element holding space constituted by the LED holding surface and the frame member. Among the LED packages, a method for manufacturing a lead frame for configuring the LED holding surface and the lead portion,
    A cup-shaped member that holds the LED element on the inner side as the LED holding surface, a sub lead frame portion that includes one or more lead portions that are electrically connected to the LED element by wire bonding, and the cup-shaped member and sub A lead frame forming step of forming a lead frame composed of components of a connecting bar for connecting the lead frame portion to a metal thin plate by drawing and punching; and
    A lead frame for an LED package, comprising: a bending step of bending the connecting bar to reduce a gap distance between the cup-shaped member and the sub lead frame portion to a predetermined distance. Law.
  8. 　請求項７によって得られたリードフレームを用いたＬＥＤ用パッケージの製造法であって、
    　前記カップ状部材のカップ底部裏面と、前記樹脂枠部材の裏面とが同一平面になるようにインサート成形することを特徴とするＬＥＤ用パッケージの製造法。     A method for manufacturing an LED package using a lead frame obtained by claim 7, comprising:
    A method for manufacturing an LED package, wherein insert molding is performed such that a cup bottom surface of the cup-shaped member and a back surface of the resin frame member are flush with each other.
PCT/JP2009/059034 2008-05-16 2009-05-15 Led package, lead frame and method for producing the same WO2009139453A1 (en)

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