JP2007059677A - Light-emitting diode device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a light-emitting diode device capable of easily, surely, and rapidly fixing a recess forming member, having a reflecting surface on a substrate. <P>SOLUTION: The light-emitting diode device comprises the substrate 2, having a front and a rear surface 2d where steps 2e, 2f are formed; the recess formation member 9, where a recess having a light projection opening formed at the surface side of the substrate and fitting sections 11a2, 11b2 fitted to the steps are formed; a circuit pattern 5 arranged on the substrate that opposes the light projection opening; and a light-emitting diode chip, connected electrically to a conductive layer while being arranged in the recess. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a light emitting diode device.

  Conventionally, as an example of this type of light-emitting diode device, a reflecting plate partitioned by a plurality of partition plates is placed on a printed circuit board on which a light-emitting diode chip is mounted, and a plurality of fixings provided at the lower end of the reflecting plate. There is known a technique in which a reflection plate is fixed on a printed board by soldering a lead wire to the printed board (for example, see Patent Document 1).

According to this light emitting diode device, since the reflecting plate is positioned on the printed board in consideration of the position of the light emitting diode chip, it is possible to improve the reflection efficiency of the reflecting plate that reflects the light emitted from the light emitting diode chip. .
JP 11-161198 A

  However, in such a conventional light emitting diode device, a plurality of fixing lead wires are soldered on the printed circuit board in order to fix the entire reflecting plate partitioned by the plurality of partitioning boards on the printed circuit board. That is, after positioning a position for fixing the reflector on the printed board, a plurality of fixing leads having a small diameter must be soldered to the printed board one by one. For this reason, the positioning operation of the reflector is complicated, and a complicated operation of soldering a plurality of small-diameter fixing leads to the printed circuit board one by one is necessary. Not good.

  Further, since the reflector plate and the partition plate, which are larger and heavier than this, are fixed on the printed circuit board by the fixing lead wire having a small diameter, the fixing force is small and the fixing position of the reflector plate is easily shifted. For this reason, there is a problem that the optical performance is likely to fluctuate.

  The present invention has been made in view of such circumstances, and an object of the present invention is to provide a light-emitting diode device capable of easily and quickly fixing a recess forming member having a reflecting surface to a substrate.

  The invention according to claim 1 includes: a substrate having a front surface and a back surface on which a step portion is formed; a recess having a light projection opening formed on the surface side of the substrate; and a fitting portion that fits into the step portion. A concave portion forming member; a conductive layer disposed on the substrate facing the projection opening; and a light emitting diode chip disposed in the concave portion and electrically connected to the conductive layer. The light emitting diode device characterized by the above.

  The invention according to claim 2 is the light-emitting diode device according to claim 1, wherein the stepped portion is formed such that the step has a depth within 10% of the thickness of the substrate.

  The invention according to claim 3 is characterized in that the substrate has notches formed at both ends in the width direction, and the side surface portion of the recess forming member has an engaging convex portion that engages with the notch of the substrate. A light emitting diode device according to any one of claims 1 to 3.

  According to the first aspect of the present invention, a pair of side surfaces sandwiching both ends in the width direction of the substrate are integrally connected to the recess forming member disposed on one surface of the substrate, and the back surface of the substrate is connected to the pair of side surfaces. Since the fitting portion to be fitted to the step portion is provided, the substrate in the thickness direction is further formed by the concave portion forming member and the pair of side portions while the both ends in the width direction of the substrate are sandwiched by the pair of side portions. You can hold it. For this reason, the recess forming member can be reliably fixed on the substrate.

  In addition, since the substrate is held in the thickness direction by the concave portion forming member and the pair of side surface portions, the removal in the thickness direction of the substrate can be prevented or reduced.

  According to the invention of claim 2, since the step depth of the step portion is within 10% of the thickness of the substrate and is not deep, a pair of side portions can be easily fitted into this step. .

  According to the invention of claim 3, since the engaging convex portions of the pair of side surface portions engage with the notches formed at both ends in the width direction of the substrate, the pair of side surface portions are shifted in the longitudinal direction with respect to the substrate. Can be prevented or reduced.

  For this reason, it is possible to prevent or reduce the optical characteristics from changing due to the reflection surface of the inner surface of the concave portion of the concave portion forming member integrally connected to the pair of side surface portions being shifted from the light emitting diode chip disposed on the substrate. Can do.

  Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. In addition, the same code | symbol is attached | subjected to the same or an equivalent part in these several accompanying drawings.

  1 is a cross-sectional view taken along a line II in FIG. 3, FIG. 2 is a cross-sectional view taken along a line II-II in FIG. 3, and FIG. 3 is a partially cutaway plan view of a light-emitting diode module 1 according to an embodiment of the present invention. 3 is a sectional view taken along line IV-IV in FIG. 3, FIG. 5 is a partially cutaway plan view of the substrate shown in FIG. 1 and the like, FIG. 6 is an enlarged view of a portion VI in FIG. .

  As shown in FIG. 3 and FIG. 4, the light emitting diode module 1 has a plurality of light emitting diode devices 3, 3,... It is made.

  The substrate 2 is a flat plate made of aluminum (Al), nickel (Ni), glass epoxy or the like having heat dissipation and rigidity, and a pair of square notches 2b and 2c are notched at both ends in the width direction as shown in FIG. A plurality of pairs of these notches 2b and 2c are formed at a predetermined pitch in the longitudinal direction. As shown in FIGS. 1 and 2, the substrate 2 has a pair of left and right of a required shape at both ends in the width direction of the substrate 2 on the back side opposite to the one surface (upper surface in the drawing) on which the recess forming member 9 is formed. Steps 2e and 2f are formed. The pair of steps 2 e and 2 f are continuously formed over the entire length of the intermediate portion in the longitudinal direction of the substrate 2.

  The substrate 2 is an integrated substrate in which the substrates of the plurality of light emitting diode devices 3, 3,... Are integrally formed. On the substrate 2, an example of a conductive layer is provided via an electrical insulating layer 4. A circuit pattern 5 is provided.

  As shown in FIG. 4 and FIG. 6, the circuit pattern 5 is composed of a circuit pattern (wiring) on the cathode side and the anode side for each light emitting diode device 3 by using an alloy of copper (Cu) and nickel (Ni), gold (Au), or the like. Patterns) 5a and 5b are formed. For example, blue light emitting diode chips 6 are mounted on the circuit pattern 5 for each light emitting diode device 3. Each light emitting diode chip 6 is made of, for example, a gallium nitride (GaN) -based semiconductor that emits blue light. Each light emitting diode chip 6 has its bottom electrode placed on one of the circuit patterns 5a and 5b and electrically connected thereto by die bonding or the like, while its top electrode is connected to the other of the circuit patterns 5a and 5b by a bonding wire 7. Connected. In FIG. 3, reference numeral 5c is a gap for electrically insulating the pair of circuit patterns 5a and 5b.

  And on the board | substrate 2, the circumference | surroundings of each light emitting diode chip | tip 6 are surrounded at a required space | interval, and the shape of the inverted truncated cone which expands gradually toward the other side (upper in FIG. 4, FIG. 6) of the board | substrate 2 is carried out. A concave portion forming member 9 in which the concave portions 8 are formed concentrically is formed for each light emitting diode device 3, and these are integrally formed. The recess forming member 9 has a resin layer formed of a synthetic resin such as PBT (polybutylene terephthalate), PPA (polyphthalamide), or PC (polycarbonate). The resin layer is formed in a U-shaped cross-section by integrally connecting a pair of side surface portions 11 a and 11 b that sandwich the outer surfaces of both ends of the substrate 2 in the width direction in the width direction. Each recess 8 forms a reflection surface 8a on the inner surface of the recess, and has a projection opening 8b that opens to the outside and a projection opening end 8c that is the upper end surface of the projection opening 8b.

  In addition, each recess 8 is filled with a thermosetting transparent resin such as a translucent silicone resin or epoxy resin so as to be substantially flush with the light projecting opening end 8c, and sealed. Each is formed as a resin 10. Further, for example, a phosphor emitting yellow light is mixed in the sealing resin 10.

  As shown in FIGS. 1 to 5, as the outer surface of the connecting portion 9 a that integrally connects the recess forming members 9, 9,... Adjacent to each other in the longitudinal direction of the substrate 2, the upper surface in FIGS. In addition, a slit 11 that opens to the same end side as each light projecting opening end 8c, that is, upward in FIGS. 4 and 6, is formed over the entire width.

  As shown in FIGS. 2 and 6, each slit 11 is formed at a depth at which the bottom surface thereof exposes the upper surface 2 a of FIGS. 2 and 6 of the substrate 2 to the outside. Further, a pair of side surface portions 11a and 11b are disposed on the upper end portion and the lower end portion of the slit 11 in FIGS. As shown in FIGS. 1 and 2, the pair of side surface portions 11a and 11b are disposed so as to sandwich the substrate 2 in the width direction, and are integrated with both width direction end portions of the respective recess forming members 9, 9,. The cross-sectional shape is formed on the substantially U-shaped substrate 2.

  As shown in FIGS. 1 and 2, the pair of side surface portions 11a and 11b respectively cover the outer surfaces of both end portions in the width direction of the substrate 2 with a required thickness so as to be sandwiched in the width direction, and as shown in FIG. Are continuously coupled over the entire length of the intermediate portion in the longitudinal direction. Further, the pair of side surface portions 11a and 11b form prismatic engagement convex portions 11a1 and 11b1 respectively engaged with the notches 2b and 2c of each pair of the substrate 2 shown in FIG. These engaging convex portions 11a1, 11b1 are formed at the same positions as the slits 11 formed between the adjacent concave portion forming members 9, 9,. As shown in FIG. 6, the upper end in the thickness direction (the upper end in FIG. 6) of each of the engaging convex portions 11a1 and 11b1 is formed substantially flush with the upper end surface 2a of the substrate 2 in the drawing.

  As shown in FIG. 1, the pair of side surface portions 11a and 11b have their lower end portions bent in the direction substantially perpendicular to the substrate 2 side in FIG. Fitting portions 11a2 and 11b2 that are respectively fitted to the steps 2e and 2f are integrally formed. An opening 11c having a required width is formed between the inner ends of the pair of fitting portions 11a2 and 11b2.

  Next, the operation of the light emitting diode module 1 will be described.

  First, when a direct current voltage is applied to each light emitting diode chip 6 through the pair of circuit patterns 5a and 5b, the light emitting diode chips 6 emit blue light. This light emission excites the yellow light-emitting phosphor in the transparent sealing resin 10 to emit yellow light, and is mixed with the blue light of the light-emitting diode chip 6 to become white light, which is reflected by the reflecting surface 8a. Then, the light is emitted from the projection opening 8b to the outside.

  These light-emitting diode chips 6 generate heat when energized and are transmitted to the entire light-emitting diode module 1, but part of the heat transmitted to the substrate 2 is from a part of the substrate upper surface 2 a that is the externally exposed bottom surface of each slit 11. Since it is discharged to the outside, the temperature rise can be suppressed.

  Further, since the recess forming members 9, 9,... Are made of resin and have a higher coefficient of thermal expansion than the metal substrate 2, deformation such as warpage is likely to occur due to the difference in thermal expansion. Is absorbed by the deformation of the slit 11, so that the deformation of the recess forming member 9 can be prevented or reduced.

  Therefore, due to the deformation of the reflecting surfaces 8a, 8a,... Of the plurality of recess forming members 9, 9,... And the sealing resin 10, the light projecting directions of the light projecting opening ends 8b, 8b,. And uneven brightness (uneven brightness) can be prevented or reduced.

  Moreover, since each slit 11 is provided with a pair of left and right side surface portions 11a and 11b for connecting adjacent concave portion forming members 9 and 9 on both left and right side surfaces thereof, these concave portion forming portions 9 are formed by injection molding. In this case, the resin is injected into the recess forming portion 9 on one end side in the arrangement direction of the mold for injection molding, so that the resin passes through the pair of side surface portions 11a and 11b of each slit 11 in the other end side in the column direction. Can be spread to every corner of the concave portion 9.

  Therefore, the plurality of recess forming members 9, 9,... Can be formed almost simultaneously by injection molding, and the moldability can be improved.

  And as shown in FIG. 1, while a pair of side part 11a, 11b integrally connected with the recessed part formation member 9 clamps the width direction both ends of the board | substrate 2 in the width direction, these pair of side part 11a, When the pair of fitting portions 11a2 and 11b2 of 11b are fitted to the pair of steps 2e and 2f on the substrate back surface 2b side, the substrate 2 is moved in the thickness direction by the respective concave portion forming members 9 and the pair of side surface portions 11a and 11b. I have it. That is, since the substrate 2 is sandwiched between the front and back directions and the width direction by the respective concave portion forming members 9 and the pair of side surface portions 11a and 11b, and is locked in the longitudinal direction of the substrate 2, each concave portion forming member. 9 can be firmly fixed at a predetermined position on the substrate 2.

  Moreover, since each recessed part formation member 9 and a pair of side part 11a, 11b are formed with the resin which has elasticity, the lower surface opening 11c end of a pair of side part 11a, 11b is mounted on the circuit pattern 5 of the board | substrate 2. Then, by pressing each recess forming member 9 toward the substrate 2, a resin layer in which each recess forming member 9 and the pair of side surface portions 11 a and 11 b are integrally connected can be easily and quickly attached to the substrate 2. it can.

  That is, when the recess forming member 9 side is pushed into the substrate 2 side, the opening lower end contact surfaces of the pair of side surface portions 11a and 11b slide outwardly in the width direction on the upper surface of the circuit pattern 5, and the lower surface opening 11c gradually increases. When the resin layer is elastically deformed so as to expand and the resin layer is continuously pushed toward the substrate 2 side, the end of the lower surface opening 11c expands and swallows to the outer surfaces of the left and right sides of the substrate 2, and eventually proceeds to the substrate back surface 2b. When reaching the substrate back surface 2b, the fitting portions 11a2 and 11b2 of the pair of side surface portions 11a and 11b are fitted into the step portions 2e and 2f of the substrate back surface 2b.

  Thereby, the concave portion forming member 9 can be simply and quickly fixed to the substrate 2 simply by pushing the concave portion forming member 9 side into the substrate 2 side.

  Further, since the pair of side surface portions 11a and 11b have their engaging projections 11a1 and 11b1 engaged with the notches 2b, 2c,... Of the substrate 2, they are integrated with the side surface portions 11a and 11b. Can be prevented from displacing in the longitudinal direction of the substrate 2.

  For this reason, it is possible to prevent the reflecting surface 8a of the recess forming members 9, 9,... From being displaced in the longitudinal direction of the substrate 2 with respect to the light emitting diode chip 6, and this is caused by the displacement of the reflecting surface 8a. Variations in optical performance can be prevented.

  In the above embodiment, the light emitting diode module in which a plurality of light emitting diode devices 3 are arranged in a row has been described. However, the present invention is not limited to this. A plurality of the light emitting diode devices 3 may be formed in a matrix, and a single light emitting diode device 3 may be provided. In addition, a plurality of light emitting diode modules 1, 1,... May be arranged on one plane and connected together to form a required lighting device or the like.

FIG. 4 is a cross-sectional view taken along the line II in FIG. 3. II-II sectional view taken on the line of FIG. 1 is a partially cutaway plan view of a light emitting diode module according to an embodiment of the present invention. IV-IV sectional view taken on the line of FIG. The partial notch top view of the board | substrate shown in FIGS. 1-3. The VI section enlarged view of FIG. FIG. 4 is a partially enlarged view of FIG. 3.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Light emitting diode module, 2 ... Board | substrate, 2b, 2c ... Notch, 2e, 2f ... Level difference, 3 ... Light emitting diode apparatus, 4 ... Insulating layer, 5 ... Circuit pattern, 6 ... Light emitting diode chip, 8 ... Recessed part, 8a ... Reflecting surface, 8b ... light projecting opening, 8c ... light projecting opening end, 9 ... concave forming member, 10 ... sealing resin, 11 ... slit, 11a, 11b ... a pair of side surface connecting portions, 11a1, 11b1 ... engaging convex , 11a2, 11b2 ... fitting portions.

Claims (3)

A substrate having a front surface and a back surface on which a step portion is formed;
A recess forming member formed by forming a recess having a light projection opening formed on the surface side of the substrate and a fitting portion that fits into the stepped portion;
A conductive layer disposed on the substrate facing the projection aperture;
A light emitting diode chip disposed in the recess and electrically connected to the conductive layer;
A light-emitting diode device comprising: 2. The light emitting diode device according to claim 1, wherein the stepped portion is formed so that the depth is within 10% of the thickness of the substrate. The substrate has notches formed at both ends in the width direction,
The light emitting diode device according to any one of claims 1 to 3, wherein the side surface portion of the recess forming member has an engaging protrusion that engages with a notch of the substrate.

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